TWI349305B - - Google Patents

Info

Publication number
TWI349305B
TWI349305B TW097101099A TW97101099A TWI349305B TW I349305 B TWI349305 B TW I349305B TW 097101099 A TW097101099 A TW 097101099A TW 97101099 A TW97101099 A TW 97101099A TW I349305 B TWI349305 B TW I349305B
Authority
TW
Taiwan
Application number
TW097101099A
Other languages
Chinese (zh)
Other versions
TW200931510A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW97101099A priority Critical patent/TW200931510A/zh
Publication of TW200931510A publication Critical patent/TW200931510A/zh
Application granted granted Critical
Publication of TWI349305B publication Critical patent/TWI349305B/zh

Links

TW97101099A 2008-01-11 2008-01-11 Wafer cleaver with high-precision cutting TW200931510A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97101099A TW200931510A (en) 2008-01-11 2008-01-11 Wafer cleaver with high-precision cutting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97101099A TW200931510A (en) 2008-01-11 2008-01-11 Wafer cleaver with high-precision cutting

Publications (2)

Publication Number Publication Date
TW200931510A TW200931510A (en) 2009-07-16
TWI349305B true TWI349305B (enExample) 2011-09-21

Family

ID=44865329

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97101099A TW200931510A (en) 2008-01-11 2008-01-11 Wafer cleaver with high-precision cutting

Country Status (1)

Country Link
TW (1) TW200931510A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI447829B (enExample) * 2011-10-12 2014-08-01

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385745B (zh) * 2009-09-11 2013-02-11 Horng Terng Automation Co Ltd Wafer splitting device
TW201241903A (en) * 2011-04-15 2012-10-16 Lextar Electronics Corp Die breaking process
CN109346438A (zh) * 2018-09-20 2019-02-15 业成科技（成都）有限公司 自动推挤晶圆之治具
TWI727860B (zh) * 2020-07-22 2021-05-11 環球晶圓股份有限公司 晶圓橫向撞擊測試裝置及晶圓強度測試方法
CN111834263B (zh) * 2020-08-14 2025-01-24 昆山康达斯机械设备有限公司 晶粒自动裂片机

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI447829B (enExample) * 2011-10-12 2014-08-01

Also Published As

Publication number Publication date
TW200931510A (en) 2009-07-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees