TW200931510A - Wafer cleaver with high-precision cutting - Google Patents
Wafer cleaver with high-precision cutting Download PDFInfo
- Publication number
- TW200931510A TW200931510A TW97101099A TW97101099A TW200931510A TW 200931510 A TW200931510 A TW 200931510A TW 97101099 A TW97101099 A TW 97101099A TW 97101099 A TW97101099 A TW 97101099A TW 200931510 A TW200931510 A TW 200931510A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- impact
- component
- seat
- wafer carrier
- Prior art date
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 19
- 235000014820 Galium aparine Nutrition 0.000 title abstract 3
- 240000005702 Galium aparine Species 0.000 title abstract 3
- 238000003776 cleavage reaction Methods 0.000 claims description 4
- 230000007017 scission Effects 0.000 claims description 4
- 238000005336 cracking Methods 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- 230000005012 migration Effects 0.000 claims 1
- 238000013508 migration Methods 0.000 claims 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 1
- 239000013078 crystal Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 230000033001 locomotion Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97101099A TW200931510A (en) | 2008-01-11 | 2008-01-11 | Wafer cleaver with high-precision cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97101099A TW200931510A (en) | 2008-01-11 | 2008-01-11 | Wafer cleaver with high-precision cutting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200931510A true TW200931510A (en) | 2009-07-16 |
| TWI349305B TWI349305B (enExample) | 2011-09-21 |
Family
ID=44865329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97101099A TW200931510A (en) | 2008-01-11 | 2008-01-11 | Wafer cleaver with high-precision cutting |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200931510A (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102729340A (zh) * | 2011-04-15 | 2012-10-17 | 隆达电子股份有限公司 | 晶粒劈裂工艺 |
| TWI385745B (zh) * | 2009-09-11 | 2013-02-11 | Horng Terng Automation Co Ltd | Wafer splitting device |
| CN109346438A (zh) * | 2018-09-20 | 2019-02-15 | 业成科技（成都）有限公司 | 自动推挤晶圆之治具 |
| CN111834263A (zh) * | 2020-08-14 | 2020-10-27 | 昆山康达斯机械设备有限公司 | 晶粒自动裂片机 |
| TWI727860B (zh) * | 2020-07-22 | 2021-05-11 | 環球晶圓股份有限公司 | 晶圓橫向撞擊測試裝置及晶圓強度測試方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201316425A (zh) * | 2011-10-12 | 2013-04-16 | Horng Terng Automation Co Ltd | 晶圓劈裂檢知方法 |
-
2008
- 2008-01-11 TW TW97101099A patent/TW200931510A/zh not_active IP Right Cessation
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI385745B (zh) * | 2009-09-11 | 2013-02-11 | Horng Terng Automation Co Ltd | Wafer splitting device |
| CN102729340A (zh) * | 2011-04-15 | 2012-10-17 | 隆达电子股份有限公司 | 晶粒劈裂工艺 |
| CN109346438A (zh) * | 2018-09-20 | 2019-02-15 | 业成科技（成都）有限公司 | 自动推挤晶圆之治具 |
| TWI727860B (zh) * | 2020-07-22 | 2021-05-11 | 環球晶圓股份有限公司 | 晶圓橫向撞擊測試裝置及晶圓強度測試方法 |
| CN111834263A (zh) * | 2020-08-14 | 2020-10-27 | 昆山康达斯机械设备有限公司 | 晶粒自动裂片机 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI349305B (enExample) | 2011-09-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |