TW201305740A - Exposure method and apparatus thereof - Google Patents

Abstract

The exposure optical mechanism of the exposure apparatus disclosed in this invention includes: a light integrator for converting exposure light beams emitted from a light source into a plurality of point light sources; a collimator lens for converting the exposure light beams that passes through the light integrator into parallel light; a reflector unit using a plane mirror to reflect the exposure light beams which are converted into parallel light by the collimator to irradiate the same onto a photo-mask; and actuators of the reflector unit for pushing the plane mirror, where the actuators are arranged in a two-dimensional manner on the surface opposite to the exposure light reflection surface. The control mechanism calculates the driving amounts for each of the actuators of the reflector unit, based on the related point light source information of the light integrator obtained from exposure light beams irradiated at the position on the substrate disposed on the carrier unit, for controlling each of the actuators respectively.

Description

Exposure method and device thereof

The present invention relates to an exposure technique for forming a pattern on a glass substrate in a manufacturing step of a flat panel display, and more particularly to an exposure suitable for uniform exposure on a large-area glass substrate in an exposure step of a color filter manufacturing step of a liquid crystal display. Method and apparatus therefor.

An example of the manufacturing steps of the current liquid crystal display manufacturing is shown in FIG. First, in the glass substrate steps 921 and 922, the glass substrate is cut, and then divided into a front panel and a back panel. For the back sheet, in the array step 923, the film forming step and the photolithography step are repeated on the glass substrate to form a thin film transistor. Further, in the front panel, in the color filter step 924, red, green, and blue color filters are formed on the substrate, and a transparent electrode (ITO) is formed on the upper portion. Thereafter, the two substrates completed by the above two steps are combined in the next unit step 925, and a liquid crystal substance is placed therebetween. Furthermore, in the module step 926, the backlight and the driving power source and the like are assembled to complete the liquid crystal display.

Here, the details of the color filter step are described in FIG. At present, the mainstream is a photolithography method in which a pigment-based color resist is applied to a glass and exposed or developed. First, the surface of the glass substrate is washed in the cleaning step 1031, and the color resist is entirely applied to the glass substrate in the coating step 1032 (color resist coating step). Thereafter, pattern exposure is performed through the photomask in the exposure step 1033 and UV hardening to make it difficult to melt. Thereafter, the undesired portion of the color resist is removed using the developer in the developing step 1034. Thereafter, the developed surface is washed again by a washing step 1035 to be baked to be hardened (developed, baked). Then, the color resist coating, exposure, development, and baking steps were repeated three times. Thereafter, after the coating step 1036, the cleaning step 1037, and the inspection step 1038, an ITO (transparent dielectric) film is formed by a plating method using an ITO film forming step 1039, and a final inspection step 1040 is performed to proceed to the next unit combination step. Construction.

A structural example of a color filter is shown in FIG. On the glass substrate 1141, a black matrix 1142, RGB three primary color patterns 1143, 1144, and 1145 are formed, and an ITO film 1146, which is a color filter, is formed.

Further, as an exposure apparatus used in the exposure step of the color filter step, there is a projection method in which a pattern of the mask is projected onto the substrate by using a lens or a mirror, and a minute interval is provided between the mask and the substrate (close to the gap) ), a proximity mode in which the pattern of the photomask is transferred to the substrate. The proximity mode is inferior to the projection method in comparison with the projection method, but the illumination optical system has a simple configuration and is suitable for mass production with high processing capability.

In the proximity exposure, a glass substrate coated with a sensitizer is provided on the surface of the exposure surface, and the exposure light is irradiated while maintaining the gap between the reticle and the glass substrate held by the reticle stage by a distance of several hundred μm. The sensitizer applied to the glass substrate is exposed by the light of the cover.

The liquid crystal display can be made into one glass substrate to several to several tens of panels (the number of dicing sheets), and by increasing the number of dicing sheets, productivity and yield can be expected to be improved, thereby promoting the enlargement of the glass substrate and the reticle. .

An exposure apparatus for a glass substrate for a liquid crystal display, for example, as disclosed in Patent Document 1, is configured to emit light emitted from a light source along a light combined with a mirror In the configuration in which the film is projected on the substrate and the exposure pattern is projected on the substrate, a fly-eye lens is provided in the middle of the optical path in which the mirror is combined, and the light intensity is made uniform. However, due to the progress of the enlargement, the glass substrate or the photomask is easily deformed by the telescopic jig due to the heat of treatment, and if the deformation is ignored and the exposure is performed, there is a possibility that the formed pattern is deviated.

Japanese Patent Laid-Open Publication No. 2005-129785 (Patent Document 2) discloses a configuration in which a side portion of a collimating mirror disposed directly in front of a reticle is opposed to a surface with a central portion as a fulcrum. The direction of the intersection is displaced, so that the exposure magnification of the light irradiated on the reticle can be adjusted very easily, and the pattern to be formed on the substrate to be exposed can be adjusted according to the expansion and contraction state of the reticle during exposure and the expansion and contraction state of the substrate to be exposed. size.

On the other hand, Japanese Laid-Open Patent Publication No. WO2007-145038 (Patent Document 3) discloses a method of detecting a plane deviation amount between a photomask and a substrate, and setting a reflection by a collimator mirror according to the detected plane deviation amount. The irradiation angle of the exposure light can reduce the illuminance unevenness and variation on the exposure surface, and perform more uniform magnification correction to correct the pattern formation accuracy.

Japanese Laid-Open Patent Publication No. 2010-256428 (Patent Document 4) discloses a configuration in which an illumination source is formed by a plurality of semiconductor light-emitting elements, and the number of light-emitting semiconductor light-emitting elements is changed to adjust the illuminance of the exposure light.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-177548

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2005-129785

[Patent Document 3] Japanese Re-Patent Patent WO2007-145038

[Patent Document 4] Japanese Patent Laid-Open Publication No. 2010-256428

In order to correspond to the high definition and 3D display of the liquid crystal display, it is important to form a fine and highly precise pixel pattern on the large-area glass substrate in the lithography step. Therefore, for an exposure apparatus for exposing a pattern on a large-area glass substrate in the lithography step, it is required to uniformly expose the pattern on a large area on the glass substrate.

Patent Document 1 discloses a configuration in which a fly-eye lens is disposed in a light path of an exposure light to uniformize light intensity. However, if the area of the exposed glass substrate is large, the area of the mask is also increased. Only fly-eye lenses are not able to achieve sufficient uniformity of exposure light.

On the other hand, in the method described in Patent Document 2, it is possible to easily correct the case where the size of the substrate to be exposed or the size of the mask varies with each exposure, and high-accuracy exposure can always be performed. However, there are four adjustment mechanisms that contribute to the deformation of the mirror, but in the case where the mirror is locally deformed, since the range of deformation is large, the correction of the whole becomes rough, so the area of the mask is In the case of becoming large, it is difficult to reproduce the desired exposure pattern with high precision.

Further, in the method described in Patent Document 3, since the initial shape at the time of setting the mirror to be deformed by the exposure device is not grasped, if the initial shape of the mirror is bent beyond the expected state, the shape is corrected when the shape is corrected. Exceeding the allowable stress of the mirror, it is possible to break the mirror. Also, in the case where the initial shape cannot be grasped, the actual shape cannot be obtained The difference between the ideal shape (the shape of the target center ray angle and the illuminance distribution) is quantified, so that the correct feedback of the adjustment mechanism cannot be performed, which may result in adjustment time consuming.

Further, in the method described in Patent Document 4, the illuminance of the exposure light can be adjusted by changing the number of lightings of the plurality of semiconductor light-emitting elements constituting the illumination light source, but light integration such as a fly-eye lens is disposed in the optical path. In the configuration of the element or the plurality of mirrors, it is difficult to finely adjust the distribution of the light that is irradiated to the reticle on the side of the light source farthest from the reticle.

The present invention provides a method for performing high-precision pattern exposure by strictly controlling a central ray angle and an illuminance distribution on an exposure surface without exceeding an allowable stress in a plane mirror disposed directly in front of a reticle in an exposure optical system.

Further, the present invention provides a method for accurately adjusting the optical system for controlling the central ray angle and illuminance distribution on the exposure surface in a short time.

In the present invention, the center mirror angle measuring mechanism and the optical simulator are used to grasp the current shape of the plane mirror, and the plane mirror is deformed within the allowable stress amount of the plane mirror.

Further, in the present invention, a mechanism such as a center ray angle measuring means and an optical simulator is used to compare the current shape of the plane mirror with the ideal shape, and the calculated correction amount is fed back to the plane mirror.

Specifically, the center ray angle of the light on the exposure surface is first measured using a pinhole camera. Calculate the actual plane from the measured values using an optical simulator The shape of the mirror, in addition, the deformation condition of the plane mirror that satisfies the central ray angle and the illuminance distribution of the light on the exposure surface to satisfy the target value, and calculates the shape difference between the best shape of the plane mirror obtained above and the current state of the plane mirror, and The actuator on the back of the actual mirror is automatically fed back.

That is, in order to solve the above problems, the exposure apparatus of the present invention includes: an exposure optical mechanism including a light source that emits exposure light; a mask holder mechanism that holds the mask; and a stage mechanism that mounts the substrate and is movable in a plane; The exposure optical mechanism and the stage mechanism sequentially expose the control mechanism mounted on the substrate of the stage mechanism, wherein the exposure optical mechanism includes: an optical integrator that converts the exposure light emitted from the light source into a plurality of point light sources; a straight mirror that converts exposure light that penetrates the light integrator into parallel light; and a mirror unit that converts the exposure light converted into parallel light by the collimating mirror to a plane mirror, and the pair is held by the mask holder Illuminating the reticle; the mirror unit is equipped with an actuator arranged in a two-dimensional manner to push the plane mirror opposite to the surface of the reflected exposure light; the control mechanism is based on the use of the pair to be placed on the stage mechanism The information about the point source of the optical integrator obtained by the exposure of the light on the surface of the substrate, and the amount of the actuators arranged in the two-dimensional shape of the mirror unit Controlling the actuator.

In order to solve the above problems, the exposure method of the present invention repeats the exposure light emitted from the light source through the optical system to the reticle formed with the pattern of penetrating light, and will illuminate the reticle. Exposure light penetrating the pattern in the exposure light is projected onto the resist applied to the first region of the substrate disposed in close proximity to the mask to expose the resist, thereby forming the front surface of the substrate exposed by the pattern of the mask Method, where will be The exposure light is irradiated to the reticle: the exposure light emitted from the light source is transmitted through the optical integrator to be converted into a plurality of point light sources, and the exposure light that is transmitted through the optical integrator and converted into a plurality of light sources is converted into a collimating mirror Parallel light, the exposure light converted into the parallel light is reflected by the plane mirror of the actuator arranged in a two-dimensional shape on the back surface and irradiated to the reticle; based on the exposure using the position irradiated on the surface corresponding to the exposed substrate The driving amount of each actuator calculated from the information about the point source of the light integrator obtained by the light is controlled by an actuator arranged in a two-dimensional shape on the back surface of the plane mirror.

Thereby, even in the case where the manufacturing of the liquid crystal display requires a large size of the mask and more strict pattern control, the plane mirror can be precisely controlled, the manufacturing yield can be improved, and the industrial waste can be reduced.

Hereinafter, each embodiment of the present invention will be described in detail with reference to the drawings.

[Example 1]

This embodiment is a method of using a proximity exposure method in the manufacture of a liquid crystal display.

An example of a device for implementing the present invention is shown in FIGS. 1 and 8 for optimizing the shape of a plane mirror of a proximity exposure optical system, and calculating an optimum condition of a plane mirror satisfying a target central ray angle and an illuminance distribution, and The method of feeding back to the actual optical system will be described.

Fig. 1 is a view showing an outline of a general configuration of an embodiment of an exposure apparatus 100 according to the present invention. The exposure device 100 includes an exposure optical system unit 110, a stage unit 130, and a control/drive unit 150. To maintain positive In a normal environment, the exposure optical system unit 110 and the stage unit 130 are covered by a housing 101 for blocking airflow from the outside. An exhaust port 102 for exhausting the internal gas to the outside is provided in the casing 101.

The exposure optical system unit 110 includes a light source 113 including a lamp 111 and an elliptical mirror 112 that emit ultraviolet light, such as a mercury lamp, and a first mirror 114 for converting an optical path of the exposure light emitted from the light source 113; the shutter 115; And arranged on the optical path of the exposure light converted by the first mirror 114 to switch the interception and passing of the exposure light (on and off); the optical integrator 116 is configured to make the intensity distribution of the exposure light passing through the shutter 115 Uniform, and combined with a first fly's eye lens 1161 and a second fly's eye lens 1162; a second mirror 117 that converts the light path of the exposure light that is uniformized by the light integrator 116; collimation The mirror 118 reflects the exposure light converted by the second mirror 117 to form parallel light, and the mirror unit 120 reflects the parallel light formed by the collimator 118 in the direction of the mask 140. Further, the shutter 115 switches the interception and passage of the exposure light by a shutter drive mechanism (not shown).

The stage unit 130 includes an X stage 131 moving in the X direction, a Y stage 132 moving in the Y direction perpendicular to the paper surface, a Z stage 133 moving in the Z direction, and a θ stage 134 rotating around the Z axis; The substrate holder 135 of the sample (substrate) 1 is sandwiched.

The photomask 140 is held by the mask holder 141 in a state of maintaining a slight gap with the sample 1. A drive mechanism (not shown) for moving the mask up and down in the Z direction is built in the mask holder 141.

The control/drive unit 150 is provided to control each stage of the stage unit 130 a moving stage control unit 151; a substrate holder control unit 152 that controls the operation of the substrate holder 135 of the stage unit 130; a mask holder driving unit 153 that controls the holding of the mask 140 of the mask holder 141; and the control light source 113 The lamp power supply control unit 154 for turning on, off or light of the lamp 111; the shutter switching control unit 155 for controlling the switching of the exposure light by the shutter 115; the mirror unit control unit 156 for controlling the mirror unit 120 and the control unit The overall control unit 157.

As shown in FIG. 2A, the mirror unit 120 includes a plane mirror 121, a plurality of actuators 122, and an actuator driving unit 123. 2B is a diagram showing the configuration of a plurality of actuators 122 with respect to the plane mirror 121. As the plurality of actuators 122, a piezoelectric element is used. The actuator drive unit 123 receives signals from the outside, individually controls a plurality of actuators 122 arranged in two dimensions, and presses the back surface of the plane mirror 121 to adjust the amount of fine unevenness of the plane mirror 121.

Further, the control/drive unit 150 controls the mirror unit 120 by the mirror unit control unit 156, and calculates the information based on the point light source of the optical integrator obtained by irradiating the exposure light corresponding to the surface position of the substrate to be described later. The driving amount of each of the actuators 122 is driven by a plurality of actuators 122 arranged in a two-dimensional shape on the back surface of the plane mirror 121.

Next, the operation using the above configuration will be described. First, the stage unit 130 receives the substrate 1 conveyed by a substrate manipulation device (not shown) away from the mask holder 141, and holds and holds the substrate 1 by the substrate holder 135 controlled by the substrate holder control unit 152. In this state, the substrate 1 is moved so as to be positioned below the mask holder 141. At this time, the shutter 115 is controlled by the shutter switching control unit 155 to block the exposure light. Moreover, the mask holder 141 is The substrate 1 that is prevented from moving interferes with the mask 140, and is retracted in the Z direction by a driving mechanism (not shown).

When the movement of the substrate 1 under the mask holder 141 is completed, the mask 140 is driven and lowered by a driving mechanism (not shown) to form a specific gap with the substrate 1.

Next, in a state where the lamp 111 of the light source 113 is turned on under the control of the lamp power source control unit 154, the shutter switching control unit 155 controls the shutter 115 to pass the exposure light. The exposure light passing through the shutter 115 is sequentially reflected by the second mirror 117, the collimator lens 118, and the plane mirror 121 of the mirror unit 120, and is irradiated to the mask 140 held by the mask holder 141. The surface of the substrate 1 which is sandwiched by the substrate holder 135 is formed by the exposure light of the light-shielding pattern formed in the mask 140 by the exposure light irradiated to the mask 140. The coated resist is exposed to a resist that is directly under the mask 140.

After exposing the resist for a specific time, the shutter switching control unit 155 controls the shutter 115 to shield the exposure light. In a state where the exposure light is blocked by the shutter 115, the photomask 140 is driven to rise by a drive mechanism (not shown). Next, the stage control unit 151 drives and controls the X stage 131 (or the Y stage 132) to move the substrate 1 such that the lower exposure region on the substrate 1 is positioned directly below the mask 140. In a state where the next exposure region is located directly under the reticle 140, the reticle 140 is driven and lowered by a driving mechanism (not shown) to form a specific gap with an exposure region below the substrate 1.

Thus, in a state where the new exposure region of the substrate 1 is located directly under the reticle 140, the shutter switching control portion 155 controls the shutter 115 again to expose the exposure light. Through, the penetrating exposure light is irradiated onto the reticle 140, and the resist applied on the surface of the substrate 1 directly under the reticle 140 is exposed.

In this manner, by repeating the shading and the penetration (opening and closing) of the exposure light by the shutter 115 and the movement of each stage by the stage control unit 151, the entire substrate 1 is exposed.

In the exposure apparatus which performs the full exposure of the substrate 1 as described above, in order to achieve high-precision pattern exposure uniformly over the substrate 1, it is necessary to make the central ray angle of the exposure light on the exposure surface of the substrate 1 substantially vertical and The illuminance distribution is uniform. The following is a description of the method of controlling the central ray angle and illuminance distribution of the exposure light and its method.

Here, for simplification of explanation, the light path of the light source portion 113 of the exposure optical system 110 shown in FIG. 1 to the substrate 1 is simplified as shown in FIG. In the configuration shown in FIG. 3, the shape of the plane mirror 121 of the mirror unit 120 is optimized, and the optimum conditions of the plane mirrors 121 satisfying the target central ray angle and the illuminance distribution are calculated, and the method of feeding back to the actual optical system is performed. Description.

In the configuration shown in Fig. 3, a 300-series pinhole camera and a 310-series PC equipped with a simulator. The pinhole camera 300 adjusts the height and position by the stage unit 130 such that the upper surface thereof coincides with the position 11 of the exposure surface of the substrate 1 during exposure.

As shown in FIG. 4, the pinhole camera 300 is mounted with a pinhole plate 303 having a pinhole 302 provided on the upper surface of the frame 301. A visual scale guide 304 is mounted inside the frame 301 and directly below the pinhole 302, and the projection image of the light penetrating the visual scale guide 304 and the pinhole 302 projected on the visual scale guide 304 is captured by the CCD camera 305. .

Next, the order of the central ray angle and the illuminance distribution on the exposure surface of the substrate 1 using the image taken by the pinhole camera 300 will be described with reference to FIG.

First, in order to make the pinhole 302 of the pinhole camera 300 shown in FIG. 4 coincide with the position 11 of the exposure surface of the substrate 1 during exposure as shown in FIG. 3, the height and position are adjusted via the stage unit 130. In the state, the pinhole camera 300 is used to measure the center ray angle of the light reaching the exposure surface (S501). In the pinhole camera 300, the distance from the pinhole 302 to the visual scale guide 304 is arranged at L1, and the distance from the visual scale guide 304 to the camera 305 is arranged at L2. As shown in FIG. 3, the exposure light emitted from the light source 113 reaches the exposure surface position 11, a portion of which passes through the pinhole 302, and the light passing through the pinhole 302 is projected at a position disposed at a distance L1 directly below the pinhole 302. The visual guide rod 304 is visually viewed. At the same time, the CCD camera 305 captures the projection image of the exposure light passing through the pinhole and the visual scale guide 304 to obtain an image (S501).

The acquired image 60 shown in Fig. 6 includes a plurality of dot-like images 62 and an image 61 of a visual scale guide. The plurality of dot-like images 62 are composed of converging points corresponding to the number of lenses constituting the first fly's eye lens 1611 (10 × 10 lines in the case of Fig. 6).

From the acquired image 60, the deviation amount D2 between the center position 53 of the image 61 of the visual scale guide and the X direction of the center position 54 of the plurality of dot images 62 is calculated by tan ^-1 ( D2/D1) determines the center ray angle.

Using the method described above, the stage 300 on which the pinhole camera 300 is mounted is moved by a certain pitch each time (for example, corresponding to the simulator shown in FIG. 2B) The distance between the plurality of actuators 122 on the back surface of the plane mirror 121 of 120 is repeatedly photographed by the pinhole camera 300 at each position, and the exposure surface corresponding to the use of the photomask 140 using one exposure is measured in a matrix. The central ray illuminance in the region (exposure region) is made from the result as a central ray angle distribution as shown in FIG.

Next, using the actual measured value of the central ray angle measured in a matrix in the above-described exposure region, the shape of the plane mirror 121 is calculated using the simulator mounted on the PC 310 (S502).

The plane mirror shape calculation method takes the value of each measurement position of the central ray angle on the exposure surface as an input value, and applies, for example, an XY polynomial plane coefficient (X, Y, X ²⁾ when the plane mirror model of the optical system on the simulator is established. XY, Y ² , X ³ , X ² Y, XY ² , and Y ³ ) are used as the variable values, and the plane mirror is optimized by simulation so as to correspond to the shape of the input value. The shape of the plane mirror 121 is calculated based on the coefficient obtained from the result.

The optimization method is to obtain a target value, and obtain a central ray angle (for example, 0°) set as an initial condition, and a change in a central ray angle in a case where the XY polynomial variable is changed to slightly change the initial value. Rate, from which the best solution is obtained by the least squares method or the damped least squares method. The following (number 1) shows the details of the XY polynomial.

Here, z: plane mirror bending amount, c: plane mirror curvature, k: quadratic constant, c _j : xy coefficient, r: (x ² + y ² ) ^1/2 , n _t : polynomial term

After calculating the actual shape of the plane mirror 121, in order to make the center ray angle reach the target value of 0.25°, the plane mirror is optimized by the simulation so that the incident angle of the light on the exposure surface approaches 0° (S503). For example, suppose the measured central ray angle has a distribution in the range of 0°~0.6° (region 71 of Figure 7 (center ray angle 0°~0.2°), area 72 (center ray angle 0.2°~0.4°), area 73 ( The center light angle is 0.4°~0.6°)). This value is used as an input value to be mounted on the simulator of PC310, and the target value of the center ray angle of the ray is set to 0°, which is applied to the coefficient of the XY polynomial of the plane mirror (X, Y, X ² , XY, Y ² , X ³ , X ² Y, XY ² , and Y ³ ) are used as variables, and the plane mirror is optimized by simulation in such a manner that the central ray angle falls within the above target value.

Then, based on the above-described optimization result, the plane mirror 121 is deformed, and a model in which the illuminance distribution also satisfies the target value or reflects the optimization result of the plane mirror is established, and the illuminance distribution on the exposure surface is calculated by using the model (S504), and then It is confirmed whether the obtained illuminance distribution satisfies the target value ± 2.5% (S505).

If it is determined in step S505 that the illuminance distribution obtained by the simulation does not reach the target value (NO), the illuminance distribution is made uniform, and the central ray angle of the ray is changed within a tolerance range in which the central ray angle does not deviate from the target value. (S506), the process returns to S504, and the illuminance distribution on the exposure surface is calculated by simulation, and the process proceeds to S506 again, and it is repeatedly confirmed whether or not the obtained illuminance distribution satisfies the target value of ±2.5% or less.

As a method of correcting the shape of the plane mirror for making the illuminance distribution satisfy the target value, specifically, in the illuminance distribution diagram shown in FIG. 8, when the illuminance distribution is ±3%, that is, exceeding the target value (±2.5%) The situation of area 80 so that The direction of the ray polynomial of the plane mirror is recalculated in such a way that the direction of the light reaching the part is random.

When it is confirmed in S505 that the illuminance distribution satisfies the target value (YES), in order to reproduce the optimized shape of the obtained plane mirror, the shape of the plane mirror calculated by the above recalculation and the actual plane mirror shape is obtained by the above recalculation. The difference of the shape of 121, the correction amount (maximum 3 mm) of each position of the actuator provided on the back surface of the plane mirror is determined by the difference (S507), and the correction amount information of the determined actuator is controlled/driven The mirror unit control unit 156 of the unit 150 transmits an actuator 122 that is an adjustment mechanism of the plane mirror 121 of the mirror unit 120 based on the information of the correction amount of the actuator received by the mirror unit control unit 156, thereby feeding back Adjustment (S508).

Thereafter, the center ray angle of the exposure area of the exposure surface 11 is actually measured using the pinhole camera 300 (S509), and it is confirmed whether or not the center ray angle of the light of the exposure surface reaches the target value (S510), and if the target value is reached, the feedback ends. If the target value is not reached, the process returns to S503, and the result of the measured central ray angle of the plane mirror is reflected in the simulation model, and is again performed by simulation S504 to S509, until the measured value satisfies the target value, and the measured value satisfies the target value. The time is over.

By the above-described order, the correction of the pattern shape of exposing the resist applied to the surface of the substrate 1 is performed.

Further, information on the correction amount of the actuator 122 transmitted to the mirror unit control unit 156 of the control/drive unit 150 is stored and held in the mirror unit control unit 156. Thereby, even if the power of the exposure apparatus 100 is once turned off and the power is again connected, the mirror unit control unit 156 can use the memory. The information of the amount of correction of the actuator is controlled to control the actuators 122 of the mirror unit 120, and the plane mirror 121 is reproduced in a state before the power is turned off.

By using the exposure optical system whose center light angle and illumination distribution are adjusted, the pattern formed on the surface of the substrate 1 is exposed to the resist 140, whereby uniform pattern exposure can be achieved over the entire substrate with high precision.

The adjustment of the central ray angle and the illuminance distribution of the exposure light using the pinhole camera described above is performed before the exposure is started on the actual substrate by the exposure device, but the exposure device may be exposed to a predetermined number of substrates at a time. It can be carried out or adjusted after the optical system is adjusted and parts exchanged.

The invention is not limited to the foregoing embodiments, and various modifications can be made without departing from the spirit and scope of the invention. That is, the replacement of one of the components (steps) described in the above embodiments with the steps or mechanisms having the equivalent functions, or the omission of one of the substantially non-functional portions is also included in the present invention.

1‧‧‧ samples (substrate)

11‧‧‧ position

53‧‧‧ central location

54‧‧‧central location

60‧‧‧ images

61‧‧‧like

62‧‧‧ like

70‧‧‧Center light angle distribution

71‧‧‧Area

72‧‧‧ Area

73‧‧‧Area

80‧‧‧ area

100‧‧‧Exposure device

101‧‧‧ frame

102‧‧‧Exhaust port

110‧‧‧Exposure optical system unit

111‧‧‧ lights

112‧‧‧Elliptical mirror

113‧‧‧Light source

114‧‧‧1st mirror

115‧‧ ‧Shutter

116‧‧‧Light integrator

117‧‧‧2nd mirror

118‧‧‧ collimation mirror

120‧‧‧Mirror unit

121‧‧‧Flat mirror

122‧‧‧Actuator

123‧‧‧Acoustic drive unit

130‧‧‧stage unit

131‧‧‧X stage

132‧‧‧Y stage

133‧‧‧Z stage

134‧‧‧θ stage

135‧‧‧ fixture

140‧‧‧Photomask

141‧‧‧Photomask holder

150‧‧‧ Control Drive unit

151‧‧‧Station Control Department

152‧‧‧Substrate Fixture Control Department

153‧‧‧Photomask holder drive unit

154‧‧‧Light Power Control Department

155‧‧ ‧Shutter Switch Control Department

156‧‧‧Mirror unit control unit

157‧‧‧All Control Department

161‧‧‧Flying eye lens

300‧‧‧ pinhole camera

301‧‧‧ frame

302‧‧‧ pinhole

303‧‧‧ pinhole plate

304‧‧‧Visual scale guide

305‧‧‧CCD camera

310‧‧‧PC

1141‧‧‧ glass substrate

1142‧‧‧Black matrix

1143‧‧‧ three primary color patterns

1144‧‧‧ three primary color patterns

1145‧‧‧ three primary color patterns

1146‧‧‧ITO film

1161‧‧‧1st fly eye lens

1162‧‧‧2nd fly eye lens

1611‧‧‧1st fly eye lens

1612‧‧‧2nd fly eye lens

Deviation in the direction of D1‧‧‧X

Deviation in the direction of D2‧‧‧Y

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a block diagram showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention.

2A is a side view of the mirror unit 120.

2B is a cross-sectional view of the C-C' section of the mirror unit 120.

Fig. 3 is a view showing a simplified display of the configuration of the central ray angle of the optical system for measuring the proximity mode.

Figure 4 shows the use of the center ray angle of the light on the exposure surface. A schematic cross-sectional view of the outline of a pinhole camera.

Figure 5 is a flow chart showing the process flow for measuring and adjusting the center ray angle of the optical system in the proximity mode for obtaining a uniform illuminance distribution.

Fig. 6 is a view showing an image taken by a pinhole camera for calculating a central ray angle of an optical system of a proximity mode from a pinhole camera obtained by imaging a light image of a pinhole projected on a visual scale guide.

Fig. 7 is a graph showing the distribution of the incident angle distribution of the light on the exposure surface actually measured by the pinhole camera.

Fig. 8 is a graph showing the distribution of the illuminance distribution on the exposure surface calculated by the simulation.

Fig. 9 is a view showing an example of a flow of a manufacturing process of a liquid crystal display.

Fig. 10 is a view showing an example of a flow of a color filter manufacturing step of a liquid crystal display.

Fig. 11 is a view showing an example of the structure of a color filter of a liquid crystal display.

11‧‧‧ position

113‧‧‧Light source

118‧‧‧ collimation mirror

120‧‧‧Mirror unit

121‧‧‧Flat mirror

122‧‧‧Actuator

123‧‧‧Acoustic drive unit

130‧‧‧stage unit

156‧‧‧Mirror unit control unit

161‧‧‧Flying eye lens

300‧‧‧ pinhole camera

310‧‧‧PC

1611‧‧‧1st fly eye lens

1612‧‧‧2nd fly eye lens

Claims (12)

An exposure apparatus comprising: an exposure optical mechanism including a light source that emits exposure light; a mask holder mechanism that holds the mask; a stage mechanism that mounts the substrate and is movable in a plane; and controls the exposure optical mechanism and The stage mechanism sequentially exposes a control mechanism mounted on the substrate of the stage mechanism, and the exposure optical mechanism includes: an optical integrator that converts the exposure light emitted from the light source into a plurality of point light sources; a straight mirror that converts exposure light that penetrates the optical integrator into parallel light; and a mirror unit that converts the exposure light converted into parallel light by the collimating mirror to a plane mirror, while remaining in the reticle Irradiating the reticle; the mirror unit is equipped with an actuator arranged in a two-dimensional shape to push the surface of the plane mirror opposite to the surface reflecting the exposure light; the control mechanism is based on the equivalent of the pair The information about the point light source of the optical integrator obtained by irradiating the exposure light to the position of the substrate surface of the stage mechanism is controlled to be arranged in two dimensions. The actuators. The exposure device of claim 1, wherein the optical integrator is composed of a plurality of fly-eye lenses, and the information about the point source of the optical integrator obtained from the exposure light is obtained by the plurality of fly-eye lenses. Information about the point source formed by the fly's eye lens of the aforementioned light source. The exposure apparatus of claim 1, wherein the control means calculates the mirror unit based on information related to a point light source using the optical integrator The actuator is controlled by information on the driving amount of each actuator arranged in two dimensions. The exposure apparatus according to any one of claims 1 to 3, wherein the information about the point light source of the optical integrator obtained from the exposure light is incident from the light of the point source to the position corresponding to the surface of the substrate The information of the angle and the information of the illumination distribution of the aforementioned point source. The exposure apparatus according to any one of claims 1 to 3, wherein the information about the point source of the optical integrator obtained from the exposure light is obtained by the surface of the substrate placed on the stage mechanism The position is obtained by processing the image of the exposure light taken by the pinhole camera of the pinhole. The exposure device of claim 5, wherein the information about the point source of the optical integrator obtained from the exposure light is obtained by sequentially moving the pinhole camera in an area irradiated by the exposure light. The image obtained by processing the image of the exposure light. An exposure method for uniformly exposing exposure light emitted from a light source to a reticle formed with a pattern of penetrating light through an optical system throughout the substrate, and penetrating the exposure light irradiated to the reticle The exposure light of the pattern is projected onto the resist applied to the first region of the substrate disposed adjacent to the mask to expose the resist, thereby exposing the front surface of the substrate by forming a pattern of the mask The method, and irradiating the exposure light to the reticle in such a manner that the exposure light emitted from the light source is transmitted through the optical integrator to be converted into a plurality of point light sources, which are transmitted through the optical integrator and converted into a plurality of The exposure light of the point source is converted into parallel light by a collimating mirror, and converted into the parallel light. The exposure light is reflected by the plane mirror of the actuator arranged in a two-dimensional shape on the back surface and irradiated to the reticle; and the optical integrator is obtained based on the exposure light irradiated from a position corresponding to the surface of the exposed substrate The information about the point source is controlled by an actuator arranged in a two-dimensional shape on the back surface of the plane mirror. The exposure method of claim 7, wherein the optical integrator is composed of a plurality of fly-eye lenses, and the information about the point source of the optical integrator obtained from the exposure light is obtained by the plurality of fly-eye lenses. Information about the point source formed by the fly's eye lens of the aforementioned light source. The exposure method of claim 7, wherein the actuators arranged in a two-dimensional shape are controlled based on the driving amount of each of the actuators calculated using information on the point light source of the optical integrator. The exposure method according to any one of claims 7 to 9, wherein the information about the point source of the optical integrator obtained from the exposure light is that light from the point source is incident on a surface of the substrate corresponding to the exposure. Information on the incident angle of the position and information on the illuminance distribution of the point source. The exposure method according to any one of claims 7 to 9, wherein the information about the point source of the optical integrator obtained from the exposure light is provided by providing a needle at a position corresponding to the surface of the exposed substrate The information obtained by processing the image of the aforementioned exposure light taken by the pinhole camera of the hole. The exposure method of claim 11, wherein the information about the point source of the optical integrator obtained from the exposure light is obtained by sequentially moving the pinhole camera in an area irradiated by the exposure light. The image obtained by processing the image of the exposure light.