JP7060848B2 - Exposure device - Google Patents

Description

The present invention relates to an exposure technique for exposing a substrate via a projection optical system and a device manufacturing technique using this exposure technique.

In order to expose an image of a mask pattern to a panel-shaped photosensitive substrate such as a glass plate during the manufacturing process of display devices such as liquid crystal displays, organic EL (Electro-Luminescence) displays, and plasma displays, masks and substrates An exposure device (hereinafter referred to as a panel exposure device) is used in which the above is moved synchronously with respect to the projection optical system to scan and expose the substrate. The conventional panel exposure device is equipped with a multi-lens type projection optical system composed of a plurality of partial projection optical systems in order to suppress the enlargement of the projection optical system and efficiently expose a pattern of a large area. In order to connect the patterns exposed in the exposed areas of the plurality of partial projection optics on the substrate with high accuracy, double exposure is performed at the ends of the two exposed areas having a shape inclined with respect to the scanning direction. A section is provided (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2001-330964

In panel exposure equipment, slight exposure unevenness may occur at the joints on the surface of the substrate, but such exposure amount unevenness does not matter with the number of layers required in the current display equipment. It is about. However, when the number of layers required on the substrate increases in the future, if the plurality of layers are exposed by the same exposure device, the effect of slight exposure amount unevenness at the joint portion (for example, the joint). (The line width of the transparent circuit pattern in the section is slightly different from the line width of the pattern in other areas, etc.) is gradually integrated, and there is a risk that slight unevenness in brightness will appear on the screen of the display device that is finally manufactured. There is.

In view of such circumstances, it is an object of the present invention to reduce unevenness in the exposure amount of the joint portion when the substrate is subjected to scanning exposure using a plurality of exposure regions.

According to the first aspect of the present invention, in an exposure apparatus that exposes a mask having a pattern onto a substrate via a projection optical system, an illumination optical system that illuminates the mask with illumination light and the mask are supported. It comprises a mask stage and a mask stage drive unit that moves the mask stage relative to the illumination light in the first direction, and the mask stage drive unit has a second direction that intersects the first direction. The mask stage supporting the mask is relatively moved in the first direction so that the illumination light is applied to the second region that partially overlaps the first region with respect to the mask illuminated by one region. , The illumination optical system sets the illuminance of the illumination light in a part of the overlapping illumination area of the first region and the second region to the other region other than the partial region in the overlapping illumination region. An exposure apparatus is provided that includes an adjusting member that is adjusted with respect to illuminance, has a transmission rate distribution in its first direction, and includes a filter unit that transmits a part of the illumination light .
According to the second aspect, while the substrate is exposed through the mask pattern and the projection optical system with the exposure light from the illumination optical system, the mask and the substrate are scanned synchronously with respect to the projection optical system. In the exposure apparatus, the projection optical system exposes a plurality of different exposure regions on the substrate, and the plurality of exposure regions are two adjacent exposure regions when the substrate is scanned in the scanning direction. A pattern of the mask is arranged so that a seam is formed on the substrate by double exposure of the non-scanning end intersecting the scanning direction of the light, and the exposure of the seam is controlled. An exposure device is provided that is installed between the surface and the pupil surface of the illumination optical system and includes at least one adjusting member for adjusting the light intensity distribution at the end of the exposure region.

According to the third aspect, while the substrate is exposed through the mask pattern and the projection optical system with the exposure light from the illumination optical system, the mask and the substrate are scanned synchronously with respect to the projection optical system. In the exposure method, while exposing a plurality of different exposure regions on the substrate, the substrate is scanned in the scanning direction, and the end portions of the two adjacent exposure regions in the non-scanning direction intersect in the scanning direction. Coordination installed between the pattern surface of the mask and the pupil surface of the illumination optical system to form a joint on the substrate by double exposure and to control the exposure of the joint. An exposure method is provided in which a member is used to adjust the light intensity distribution at the end of at least one exposure region.

According to the fourth aspect, the pattern of the photosensitive layer is formed on the substrate by using the exposure apparatus or the exposure method of the aspect of the present invention, and the substrate on which the pattern is formed is processed. A device manufacturing method is provided.

According to the aspect of the present invention, when scanning exposure of a substrate is performed using a plurality of exposure regions, uneven exposure amount of the joint portion can be reduced.

It is a perspective view which shows the schematic structure of the exposure apparatus which concerns on an example of Embodiment. It is a block diagram which shows the control system of the exposure apparatus of FIG. It is a side view which showed the part which shows the two partial illumination system and two partial projection optical systems in FIG. 1 in the cross section. (A), (B), and (C) are plan views showing adjustment portions of the first, second, and third transmittance distributions, respectively. (A) is a plan view showing an example of arrangement of a plurality of illumination areas, and (B) is a plan view showing an example of arrangement of a plurality of exposure areas. (A) and (B) are diagrams showing an example and another example of a main part of a partial lighting system and an illuminance distribution, respectively. It is a flowchart which shows an example of an exposure method. (A) is a diagram showing an example of the integrated exposure amount distribution before correction, (B) is a diagram showing an example of the arrangement of the transmittance distribution adjusting portion, and (C) is an example of the corrected amount of the integrated exposure amount distribution. FIG. 6D is a diagram showing a corrected integrated exposure amount distribution, and FIG. EE is a diagram showing a deviation and a correction amount of the integrated exposure amount distribution before correction. (A) is a diagram showing another example of the integrated exposure amount distribution before correction, (B) is a diagram showing another example of the arrangement of the transmittance distribution adjusting portion, and (C) is a diagram showing the corrected amount of the integrated exposure amount distribution. The figure which shows the other example, (D) is the figure which shows the integrated exposure amount distribution after correction, (E) is the figure which shows the deviation and the correction amount of the integrated exposure amount distribution before correction. It is a top view which shows the adjustment part of the transmittance distribution of a modification. (A) is a diagram showing the integrated exposure amount distribution before correction of the modified example, (B) is a diagram showing the arrangement of the adjusting portion of the transmittance distribution, and (C) is a diagram showing the corrected amount of the integrated exposure amount distribution. D) is a diagram showing the integrated exposure amount distribution after correction, and (E) is a diagram showing the deviation and the correction amount of the integrated exposure amount distribution before correction. (A), (B), (C), (D), (E), and (F) are diagrams showing modified examples of control members, respectively. It is a flowchart which shows an example of the manufacturing process of an electronic device.

An example of the embodiment of the present invention will be described with reference to FIGS. 1 to 9. FIG. 1 shows a schematic configuration of an exposure apparatus EX according to the present embodiment. The exposure apparatus EX is a scan exposure type panel exposure apparatus that exposes an image of a mask M pattern on a plate P (photosensitive substrate) made of rectangular flat glass coated with a photoresist (photosensitive material). The plate P exposed by the exposure apparatus EX is used, for example, for manufacturing a panel which is a display unit of a display apparatus such as a liquid crystal display or an organic EL display. The exposure apparatus EX is a plurality of partial projection optical systems PLA, PLB, PLC, PLD, PLE, PLF, PLG (seven as an example in this embodiment) that project an image of the pattern of the mask M onto the surface of the plate P. It is equipped with a multi-lens type projection system PS (projection optical system) having (see FIG. 5A). Hereinafter, the Z-axis is taken perpendicular to the surface of the plate P when it is in focus with respect to the projection system PS, and the mask M and the mask M at the time of scanning exposure are taken in a plane parallel to the surface (almost a horizontal plane in this embodiment). The X-axis along the scanning direction of the plate P and the Y-axis along the direction orthogonal to the X-axis (non-scanning direction) will be described.

In FIG. 1, the exposure apparatus EX includes a light source 10 including, for example, an ultra-high pressure mercury lamp that generates an illumination light (exposure light) EL for exposure, and a partial projection optical system PLA to PLG of a pattern surface of a mask M using the illumination light EL. Illumination system IS that illuminates the same number of illumination areas IRA, IRB, IRC, IRD, IRE, IRF, and IRG (see FIG. 5A) with a uniform illuminance distribution, and a mask holder (not shown) for the mask M. It includes a mask stage 21 that holds and moves in parallel to the XY plane via the plate P, and a plate stage 22 that holds and moves the plate P. As an example, the illumination regions IRA to IRC in the first row are arranged at regular intervals in the Y direction, and the illumination regions IRD to IRG in the second row are predetermined in the −X direction with respect to the illumination regions IRA to IRC in the first row. When viewed in the X direction at a distance, they are arranged so as to sandwich the illumination regions IRA to IRC in the first row (see FIG. 5A).

Further, the exposure apparatus EX measures the position information of the mask stage 21 by irradiating the X-axis moving mirror 23MX and the Y-axis moving mirror 23MY provided at the end of the mask stage 21 with laser light for measurement. The position information of the plate stage 22 is obtained by irradiating the multi-axis laser interferometer 23A and the X-axis moving mirror 23PX and the Y-axis moving mirror 23PY provided at the ends of the plate stage 22 with laser light for measurement. It is equipped with a multi-axis laser interferometer 23B for measurement. Further, the exposure apparatus EX includes a mask stage drive system 25 and a plate stage drive system 26 (see FIG. 2) including linear motors and the like for driving the mask stage 21 and the plate stage 22 based on the measurement results of the laser interferometers 23A and 23B, respectively. ) And a main control device 20 (see FIG. 2) including a computer that comprehensively controls the operation of the entire device.

The mask stage drive system 25 controls the position and speed of the mask stage 21 in the scanning direction (X direction) during scanning exposure, and around the axis parallel to the Z axis of the mask stage 21 (hereinafter, θz direction) as necessary. The rotation angle of) can be adjusted within a predetermined range. Further, the plate stage drive system 26 controls the position and speed of the plate stage 22 in the X direction in synchronization with the mask stage 21 during scanning exposure, and X of the plate stage 22 during scanning exposure (during step movement). Controls the position in the direction and / or the Y direction. As an example, the mask M is a rectangular flat plate having a width of about 1 to 2 m in the X direction and a width of about 1 to 1.5 m in the Y direction, and the plate P has a width of 2 to 2 in the X direction. It is a rectangular flat plate having a width of about 5.5 m and a width in the Y direction of about 2 to 3 m, and the mask stage 21 and the plate stage 22 are set to a size capable of holding the mask M and the plate P, respectively. Further, the image of the pattern of the mask M is exposed on each of the plurality of pattern forming regions (not shown) of the plate P.

Next, the lighting system IS and the projection system PS will be described. First, the illumination light EL emitted from the light source 10 is incident on the condensing optical system 11 via an elliptical mirror, a mirror, a shutter (not shown), and a wavelength selection filter (not shown). The illumination light EL that has passed through the condensing optical system 11 is incident on the incident end 12 of the branched optical system 13 and is emitted from the ejection ends 14A to 14G of the same number of branched optical systems 13 as the partial projection optical systems PLA to PLG. The illumination light EL illuminates the trapezoidal illumination regions IRA to IRG via the corresponding partial illumination systems ILA to ILG, respectively. In the present embodiment, the field of view of the partial projection optical systems PLA to PLG on the object surface side is defined by the field diaphragm 35 (see FIG. 3) in the partial projection optical systems PLA to PLG. Therefore, the illumination regions IRA to IRG mean regions that are optically coupled to the opening 35a of the field diaphragm 35, and the partial illumination systems ILA to ILG include the illumination regions IRA to IRG, respectively, and the illumination regions IRA to IRA. Illuminates a slightly wider area than the IRG. The partial illumination systems ILA to ILG having substantially the same configuration as each other have a collimating lens, a fly-eye integrator (optical integrator), a condenser lens system, and the like, respectively. The illumination system IS includes optical members from the condensing optical system 11 to the partial illumination systems ILA to ILG.

FIG. 3 shows the configuration from the fly-eye integrator 15 of the two partial illumination systems ILA and ILD to the pattern surface Ma (irradiated surface) of the mask M, and the partial projection optical systems PLA and PLD corresponding to the partial illumination systems ILA and ILD. The configuration of is shown. In FIG. 3, the illumination light EL emitted from the flyeye integrator 15 of the partial illumination system ILA is a first condenser lens 16a, a disk-shaped control member 17A for controlling or adjusting the transmittance distribution, and a second condenser. The illumination region IRA (actually, a region wider than this) of the pattern surface Ma is illuminated via the lens 16b. The condenser lens system 16 is composed of the condenser lenses 16a and 16b.

Further, the ejection surface of the fly-eye integrator 15 (or the rear focal surface of each lens element constituting the fly-eye integrator 15) is the pupil surface PPA (optical Fourier transform surface with respect to the pattern surface Ma) of this partial illumination system ILA. Is.
Further, it is also possible to provide an aperture diaphragm in a part of the partial illumination system ILA and use the installation surface of the aperture diaphragm as the pupil surface PPA. Further, the pupil surface PPA is not limited to one place, and may be provided at a plurality of places in a conjugate relationship with each other.

The control member 17A is held by the holding mechanism 18 on the installation surface SPA located between the first condenser lens 16a and the second condenser lens 16b (in the present embodiment, substantially the center between the pupil surface PPA and the pattern surface Ma). Has been done. The control member 17A can be installed at an arbitrary position between the pupil surface PPA (or a surface optically conjugate with the pupil surface PPA) and the pattern surface Ma.
Further, when a plurality of pupil surface PPA are provided in the partial illumination system ILA, at least one control member 17A can be installed at an arbitrary position between each pupil surface PPA and the pattern surface Ma.

The holding mechanism 18 presses the peripheral portion of the control member 17A against the ring-shaped rotating portion 44 on which the peripheral portion of the control member 17A (frame portion 17Ac in FIG. 4A) is placed and the rotating portion 44. A slide in which a ring-shaped fixing portion 43 and a rotating portion 44 are rotatably mounted around an axis parallel to the optical axis AXA of the partial illumination system ILA and an opening through which the illumination light EL is passed is formed. It has a portion 45 and a support portion 46 on which the slide portion 45 is placed and an opening through which the illumination light EL is passed is formed. The fixing portion 43 is fixed to the rotating portion 44 by a bolt 47, and the slide portion 45 is fixed to the support portion 46 by the bolt 47 through a slit 45a provided in the slide portion 45 parallel to the X direction. A pin-shaped lever (not shown) for rotating the rotating portion 44 is provided on the side surface of the rotating portion 44. The holding mechanism 18 can adjust the rotation angle of the control member 17A to an arbitrary angle, and can also adjust the position of the control member 17A in the X direction. The configuration of the holding mechanism 18 is arbitrary. For example, the mechanism for moving the control member 17A from the holding mechanism 18 in the X direction may be omitted.

As shown in FIG. 4A, the control member 17A is a mesh-type filter formed by arranging a large number of randomly shaped meshes in a substantially semicircular region in a ring-shaped frame portion 17Ac. The portion 17Aa is retained, and the other region is the opening 17Ab (transmittance 100%). The mesh type filter unit 17Aa can also be called a random walk type filter unit. The frame portion 17Ac of the control member 17A is held by the holding mechanism 18, and normally, the control member 17A is positioned so that the center of the frame portion 17Ac substantially coincides with the optical axis AXA, and is inside the frame portion 17Ac and the filter portion. The illumination light EL passes through a region including a part of 17Aa and a part of the opening 17Ab. The linear edge portion of the filter portion 17Aa is parallel to the Y axis and is offset by a predetermined offset δx1 in the + X direction with respect to the straight line passing through the center of the frame portion 17Ac and parallel to the Y axis. As an example, the average transmittance of the filter unit 17Aa is 90%, and the offset δx1 is about 5% of the inner diameter of the member 17Ac. However, when the holding mechanism 18 includes a mechanism for adjusting the position of the control member 17A in the X direction, the holding mechanism 18 can also adjust the position of the control member 17A in the X direction.

The control member 17A can be relatively easily created, for example, by removing the meshes in a substantially semicircular shape from a large number of meshes having a random shape arranged in a substantially circular region. Therefore, as an example, the adjusting member 17A is attached to the partial illumination system ILA via the holding mechanism 18, and the two integrated exposure amounts (or averages) after being exposed in the joint portion of the two exposure regions and the other regions. Even if the illuminance is adjusted to be as equal as possible, it is assumed that the difference between the two integrated exposure amounts is not within the permissible range. Even in such a case, by removing a part of the mesh type filter portion 17Aa of the adjusting member 17A using a cutting tool such as scissors, the exposure device can be easily and quickly installed on the spot. Then, readjustment can be performed so that the integrated exposure amount (or average illuminance) after exposure in the joint portion and other regions is as equal as possible.

In addition to the control member 17A, a plurality of control members (not shown) in which the offset δx1 is set to 0 or several times the offset δx1 in FIG. 4A are prepared, and the control member 17A is one of them. It can be replaced with a control member. Further, in FIG. 3, the filter portion 17Aa of the control member 17A is arranged on the + X direction side, and the rotation angle of the control member 17A at this time is set to 0 degree. It is also possible to rotate the control member 17A by 180 degrees by the holding mechanism 18 to arrange the filter unit 17Aa on the −X direction side (or in any direction with respect to the optical axis AXA). Further, instead of the control member 17A, the control member 17B of FIG. 4B, the control member 17C of FIG. 4C, or any other control member having an arbitrary configuration can be used. The control member 17B holds a semicircular mesh type filter portion 17Ba having a transmittance of about 95% in the frame portion 17Bc, and the other region is an opening portion 17Bb. The control member 17C holds a semicircular mesh type filter portion 17Ca having a transmittance of about 97.5% and an offset of δx2 (about the same as δx1) in the frame portion 17Cc, and other than that. The region is the opening 17Cb. Instead of the mesh type filter portions 17Aa, 17Ba, 17Ca and the like, an ND filter (neutral density filter) having the same (or uniform) transmittance can also be used.

In FIG. 3, a control member 17A (or another) is also provided on the installation surface SPD between the injection surface (pupil surface PPD) of the fly-eye integrator 15 of the partial illumination system ILD and the pattern surface Ma by the holding mechanism 18 (not shown). The control member 17B, etc.) is held. In FIG. 3, as an example, the rotation angle of the control member 17A in the partial lighting system ILD around the axis parallel to the optical axis AXD is 180 degrees different from that of the control member 17A in the partial lighting system ILA. .. Similarly, control members 17A, 17B and the like are also installed in the partial lighting system that illuminates the other lighting areas IRB, IRC, IRE to IRG (see FIG. 5A). However, when the control member 17A is installed in the partial lighting system ILA, another control member 17B or the like is installed in the other partial lighting system ILD or the like. , 17B, etc. may be installed. Further, when the control members 17A (or 17B, etc.) are installed in one partial lighting system (for example, the partial lighting system ILA), the control members 17A, 17B, etc. may not be installed in the other partial lighting system. ..

Next, the operation of the control member 17A and the like will be described with reference to FIGS. 6A and 6B which are explanatory views of the partial lighting system ILA. First, in FIG. 6A, the illuminance distribution in the X direction of the illumination light EL on the pattern surface Ma when the control member 17A is not installed is constant (value a2) as shown by the dotted straight line. And. On the other hand, the transmittance distribution is such that the filter portion 17Aa is on the −X direction side in the partial illumination system ILA, and the edge portion of the control member 17Aa passes through the optical axis AXA and matches a straight line parallel to the Y axis. It is assumed that the control member 17A of the above is installed. At this time, of the illumination light EL emitted from the flyeye integrator 15 of FIG. 3 and passing through the condenser lens 16a, most of the luminous flux EL1 having the maximum inclination in the −X direction side shown by the dotted line passes through the filter portion 17Aa. Then, in a state where the illuminance is lowered, the light is incident on the pattern surface Ma at the position farthest from the optical axis AXA in the −X direction via the condenser lens 16b. Further, since almost half of the luminous flux EL2 parallel to the optical axis AXA shown by the solid line passes through the filter portion 17Aa, the amount of decrease in illuminance is almost half that of the luminous flux EL1 on the optical axis AXA of the pattern surface Ma. Most of the luminous flux EL3 that is incident and is inclined to the maximum in the + X direction shown by the broken line is incident at the position farthest in the + X direction from the optical axis AXA of the pattern surface Ma in a state where the illuminance does not decrease as compared with the luminous flux EL2. do.

As a result, the illuminance of the luminous flux EL1 on the pattern surface Ma is the minimum value a1 (the illuminance when there is a filter unit having the same transmittance as the filter unit 17Aa on the entire surface of the optical path of the illumination light EL), and the illuminance of the luminous flux EL3 is the maximum value a2. The illuminance of the luminous flux EL2 is an intermediate value between the minimum value a1 and the maximum value a2. Further, when the tilt angle of the light flux passing through the condenser lens 16a gradually changes from the tilt angle of the light flux EL1 to the tilt angle of the light beam EL2, the proportion of the portion of the light flux that passes through the filter portion 17Aa gradually decreases. The illuminance on the pattern surface Ma of the luminous flux gradually increases from the minimum value a1 to the maximum value a2 as shown by the straight line A1 showing the illuminance ICE in FIG. 6 (A). Since the illumination region IRA of the present embodiment is the central portion of the region where the illumination light EL is incident on the pattern surface Ma, the illuminance distribution in the X direction of the illumination region IRA is from the minimum value (value larger than the value a1) to the maximum value. It is inclined so as to gradually increase to a3 (a value smaller than the value a2). In other words, by installing the control member 17A between the pupil surface and the pattern surface in the partial illumination system ILA, the illuminance distribution of the illumination region IRA can be tilted in the X direction (scanning direction).

Further, by rotating the control member 17A so that the filter unit 17Aa is on the + X direction side with respect to the optical axis AXA, the sign of the inclination angle of the illuminance distribution in the illumination region IRA can be inverted. Further, by installing the control members 17B and 17C having the filter portions 17Ba and 17Ca having different average transmittances instead of the control member 17A, the value of the minimum value a1 of the illuminance distribution changes, so that the illuminance distribution The tilt angle can be controlled.

Further, as shown in FIG. 6B, when an offset δxa with respect to the −X direction is given to the position of the edge portion of the filter portion 17Aa of the control member 17A, the luminous flux EL2 parallel to the optical axis AXA passes through the filter portion 17Aa. The ratio of light flux decreases, and the illuminance on the pattern surface Ma increases. Similarly, with other light fluxes, the ratio of passing through the filter portion 17Aa decreases and the illuminance on the pattern surface Ma increases. Therefore, the illuminance distribution on the pattern surface Ma is as shown by the polygonal line A2 in FIG. 6 (B). It rises as a whole, but saturates when the maximum value a2 is reached. Therefore, the maximum value a4 of the illuminance distribution in the illumination region IRA becomes a value close to the maximum value a2, and the average value of the illuminance in the illumination region IRA is increased so that the illumination light EL can be effectively used.

In the partial illumination system ILA of FIG. 3, when the installation surface SPA of the control member 17A is in the vicinity of the pupil surface PPA (or in the vicinity of the surface conjugate with the pupil surface PPA), the luminous flux passing through the filter portion 17Aa of the control member 17A. Is incident on the region of the pattern surface Ma in the X direction substantially evenly, so that the illuminance distribution in the X direction on the pattern surface Ma only decreases uniformly and does not incline. On the other hand, if the installation surface SPA of the control member 17A is in the vicinity of the pattern surface Ma (or in the vicinity of the surface conjugate with the pattern surface Ma), the illuminance of only the portion of the pattern surface Ma facing the filter portion 17Aa is reduced. , The illuminance distribution in the X direction on the pattern surface Ma changes stepwise. On the other hand, since the installation surface SPA of the control member 17A of the present embodiment is located at a position substantially intermediate between the pupil surface PPA and the pattern surface Ma, the filter portion 17Aa of the control member 17A causes the pattern surface Ma to be formed. The illuminance distribution in the X direction of the illuminated region IRA can be tilted at the desired tilt angle and offset. By inclining the illuminance distribution in this way, the distribution of the integrated exposure amount on the plate P can be controlled with high accuracy (details will be described later). Further, the installation accuracy of the control member 17A may be low, and the positioning accuracy when the control member 17A is replaced with another control member 17B or the like may be low, so that the control members 17A, 17B or the like can be easily installed or replaced. be.

Next, in FIG. 1, the illumination light from the illumination regions IRA to IRG of the mask M is from a plurality of partial projection optical systems PLA to PLG arranged in two rows along the Y direction so as to correspond to each illumination region. It is incident on the projection system PS. The partial projection optical systems PLA to PLG form the image of the pattern in the illumination regions IRA to IRG in the corresponding trapezoidal exposure regions PRA, PRB, PRC, PRD, PRE, PRF, and PRG (see FIG. 3C). .. The partial projection optical systems PLA to PLG are telecentric and high-resolution imaging optical systems on almost both sides having a two-stage catadioptric system having the same configuration and arranged in the Z direction as an example. Further, the partial projection optical systems PLA to PLG each perform an intermediate image formation as an example, and form an erect image of the same magnification as the mask pattern on the plate P.

As an example, the partial projection optical system PLA includes an image shifter 31A that shifts the light from the mask M, a first reflection system 33A and a concave mirror 34A that form a first reflection refraction system that forms a primary image of the pattern of the mask M. The first right angle prism 32A that directs the light from the mask M toward the first reflection / refraction system and the light from the first reflection / refraction system in the −Z direction, and the field diaphragm 35 arranged in the vicinity of the primary image thereof. And the second refraction system 33B and the concave mirror 34B constituting the second reflection refraction system that forms the second image of the primary image on the plate P, and the light from the primary image is directed toward the second reflection refraction system. It includes a second right angle prism 32B that directs the light from the second reflection / refraction system toward the plate P, and an image shifter 31B that shifts the light incident on the plate P (see FIG. 3). The image shifters 31A and 31B are made of, for example, a plurality of parallel flat plates. Further, the partial projection optical system PLD is configured symmetrically with respect to the partial projection optical system PLA in the X direction. An example of a detailed configuration of the multi-lens type projection system is disclosed in, for example, Japanese Patent Application Laid-Open No. 2001-330964.

Further, the number of partial projection optical systems PLA to PLG constituting the projection system PS increases as the exposed mask M increases, and the projection system PS has, for example, 11 partial projection optical systems (5 in the first row and 5). The second row may be provided with 6 pieces). As described above, the number of the partial projection optical system PLA and the like is arbitrary, and the configuration of the partial projection optical system PLA and the like is arbitrary.
As shown in FIG. 5A, the partial projection optical systems PLA to PLG are arranged so as to face the three partial projection optical systems PLA, PLB, and PLC in the first row arranged in the Y direction. It is divided into four partial projection optical systems PLD, PLE, PLF, and PLG in the second row, which are arranged in the X direction and are arranged half a cycle in the Y direction, and are supported by an optical system frame (not shown). Has been done. Further, the exposure region PRA is provided by the trapezoidal opening 35a having the edges parallel to the Y direction as the upper side and the bottom side provided in the field diaphragm 35 arranged near the intermediate image planes of the partial projection optical systems PLA to PLG. -The basic shape of PRG is defined.

As shown in FIG. 5B, the exposure regions PRD to PRG of the partial projection optical systems PLD to PLG in the second row have a trapezoidal shape with the −X direction side as the base, and the partial projection optical systems in the first row. The exposure regions PRA to PRC of PLA to PLC are located between the exposure regions PRD and PRG in the Y direction, and the exposure regions PRA to PRC have a trapezoidal shape with the + X direction side as the base. Further, for example, when looking at all the exposed areas PRA to PRG toward the + X direction, two edge portions (hereinafter referred to as inclined portions) inclined with respect to the scanning direction (X direction) of the exposed areas PRA to PRC in the first row. ) Overlap the corresponding inclined portions of the exposure regions PRD to PRG in the second row, respectively. In FIG. 5B, the outer edge portions of the two exposed regions PRD and PRG outside the second row are, for example, a light-shielding band surrounding the pattern region PA of the mask M (see FIG. 5A). The outer edges of the exposed areas PRD and PRG are parallel to the X-axis because they are shielded from light by (shown).

Further, since the partial projection optical systems PLA to PLG form an erect image of the same magnification as the mask pattern on the plate P as an example, the shapes and arrangements of the illumination regions IRA to IRG are the shapes of the exposure regions PRA to PRG. And the same as the sequence. Therefore, for example, when viewed in the + X direction, the exposed areas PRA to PRG (illuminated areas IRA to IRG) are arranged without gaps in the Y direction. Therefore, while the plate P is exposed with the image of the pattern of the illumination regions IRA to IRG by the projection system PS, the mask M is moved (scanned) in the + X direction (or −X direction) with respect to the illumination regions IRA to IRG by the mask stage 21. ) And moving (scanning) the plate P in the + X direction (or −X direction) with respect to the exposed areas PRA to PRG by the plate stage 22 in synchronization with the pattern on the entire surface of the mask M. Can be exposed to one pattern forming region 53A of the plate P without a gap by one scanning exposure.

Further, in the pattern forming region 53A, one inclined portion of the exposed regions PRA to PRC and the inclined portion of the corresponding exposed regions PRD to PRG (an inclined portion having a shape symmetrical to the inclined portion of the exposed regions PRA to PRC in the Y direction). In the joints 54A, 54B, 54C, 54D, 54E, 54F that are double exposed by, the design exposure amount after the double exposure is substantially the same as the design exposure amount in the other regions. The patterns exposed in the exposure areas PRA to PRG are connected with high accuracy in the Y direction. Assuming that the width of the inclined portion of the exposed regions PRA to PRG in the Y direction is d, the width of the joint portions 54A to 54F in the Y direction is also d.

First, in FIG. 1, four mask-side blinds 41A, 41B, 41C, and 41D, each of which is formed of a flat plate-shaped light-shielding member elongated in the Y direction, are close to each other in the vicinity of the illumination regions IRA to IRG of the mask M. They are arranged so as not to overlap each other and to be movable in the X direction independently of each other. The end portions of the blinds 41A to 41D in the −Y direction are connected to a drive unit 42A that individually controls the position and speed of the blinds 41A to 41D in the X direction by, for example, a linear motor system, and the blinds 41A to 41D are connected in the + Y direction. The end of the is connected to the guide portion 42B. As an example, the drive unit 42A and the guide unit 42B are supported by a frame (not shown) that holds the illumination system IS. By opening and closing the illumination regions IRA to IRG by the blinds 41A to 41D at the start and end of each scan exposure, it is possible to prevent unnecessary patterns from being exposed on the plate P.

Further, the exposure apparatus EX is provided on the plate stage 22 to measure the illuminance distribution in the Y direction of the exposure regions PRA to PRG, and is provided on the plate stage 22, for example, an alignment mark of a mask M (not shown). ), The spatial image measurement unit 28 (see FIG. 2) that measures the position information of the image, the alignment system AL (see FIG. 2) that measures the position information of the alignment mark (not shown) of the plate P, and various data. It includes a storage unit 29 for storing. Further, the exposure device EX has an interface unit (not shown) for exchanging various information between the main control device 20 and a host computer (not shown), and an input for the operator to input various control information and the like to the main control device 20. A device (not shown) and a display device (not shown) in which the main control device 20 displays measurement results and the like are provided. As an example, the light quantity measuring unit 24 has a plurality of minute light receiving elements arranged in the Y direction, and the illuminance (per unit area, unit time) detected by the light quantity measuring unit 24 when the plate P is scanned in the X direction. By integrating the energy per hit), the distribution of the integrated exposure amount with respect to the plate P in the Y direction can be measured. Further, the mask M and the plate P can be aligned based on the measurement results of the spatial image measuring unit and the alignment system AL, respectively.

Next, an example of the exposure method using the exposure apparatus EX of the present embodiment will be described with reference to the flowchart of FIG. 7. This exposure method is controlled by the main control device 20. First, it is assumed that the mask M and the plate P are not loaded on the mask stage 21 and the plate stage 22 of the exposure apparatus EX, respectively, and the control member 17A or the like is not installed in the partial lighting systems ILA to ILG. Then, in step 102 of FIG. 7, the operator inputs control information to the main control device 20 so as to measure the integrated exposure amount distribution. In response to this, the illumination light EL is irradiated from the light source 10, and the plate stage 22 is stepped in the Y direction with the illumination light EL illuminating the exposure areas PRA to PRG via the illumination areas IRA to IRG. After that, the operation of moving in the X direction by a predetermined distance is repeated, and the light amount measuring unit 24 sequentially scans the exposed areas PRA to PRG in the X direction. Then, in the main control device 20, a plurality of illuminances detected by the light amount measuring unit 24 are integrated in the X direction, and the integrated exposure amount distribution in the Y direction on the plate P when exposed in the exposure regions PRA to PRG is obtained. ..

After that, in step 104, in the main control device 20, the average value of the exposure amounts measured at the joint portions 54A to 54F in FIG. 5B is the target value (here, the joint portion) in the obtained integrated exposure amount distribution. It is determined whether or not it is within the allowable range for the average value of the exposure amount in the areas other than the above. The measurement result of the integrated exposure amount distribution and the information of the deviation of the exposure amount of the joints 54A to 54F from the target value are displayed on the display device (not shown). In the following, for convenience of explanation, the two joints 54A and 54B by the exposure areas PRD, PRA and PRE are shown in FIGS. 8B and 9B, respectively, and the exposure amounts of the two joints 54A and 54B are shown below. The case of adjusting is described. In FIG. 8B and the like, for convenience of explanation, the edge portion in the −Y direction of the exposed region PRD at the end portion in the −Y direction is also represented as an inclined portion. The exposure amount of the other joints 54C to 54F is adjusted in the same manner.

Further, as an example, in the distribution of the integrated exposure amount ΣE in the Y direction first measured in step 102, as shown in FIG. 8A, the average value of the exposure amounts of the joint portions 54A and 54B is in another region. It is assumed that the exposure amount is smaller than the allowable range for the average value (target value). In this case, the operation shifts from step 104 to step 106, and the transmittance distribution control member 17A and the like are placed on the above-mentioned installation surfaces SPA, SPD and the like of the partial lighting systems ILA, ILD, and ILE corresponding to the joint portions 54A and 54B. Check if it is installed. Then, when the control member 17A or the like is not installed, the process proceeds to step 108, and the main control device 20 determines the exposure amount of the joint portions 54A and 54B from the measured value of the integrated exposure amount distribution measured in step 102. The control member 17A and the like (here, the control member 17A) to be installed so as to be as close as possible to the target value, and the target values of the rotation angle and the position of the control member 17A in the X direction (scanning direction) are obtained (these targets). The method of calculating the value will be described later), and the information of the obtained result is recorded in a file in the storage unit 29 and provided to the operator via the display device. In response to this, the operator installed the control member 17A on the installation surface SPA, SPD, etc. via the holding mechanism 18, and replaced the control member 17A, etc. on the main control device 20 (initial value is 0). ) Is added to the parameter indicating the control information.

Then, in step 110, the main control device 20 determines whether or not the control member 17A or the like has been installed or replaced a predetermined number of times (a plurality of times, for example, three times, etc.). The predetermined number of times is less than or equal to the type of control member 17A or the like that can be installed. Here, since the installation or replacement is performed once, the operation shifts to step 112, and it is determined whether or not the control member 17A or the like is replaced. The control member 17A or the like is replaced when the rotation angle or the like of the control member 17A currently installed on the installation surface SPA, SPD or the like has been adjusted. Here, since the rotation angle and the like of the control member 17A have not been adjusted, the operation shifts to step 114, and the main control device 20 is installed on the installation surface SPA, SPD, etc. by the operator via the display device. An instruction is given to set the rotation angle or the like of the control member 17A to a target value. Here, the target value of the rotation angle of the control member 17A in the partial illumination system ILA corresponding to the exposure region PRA is 180 degrees, the target value of the position offset is 0, and the partial illumination system IRD corresponding to the exposure region PRD and PRE, It is assumed that the target value of the rotation angle of the control member 17A in the IRE is 0 degrees and the target value of the position offset is 0. Correspondingly, as shown in FIG. 8B, the operator sets the filter portion 17Aa of the control member 17A for the exposure region PRA in the −X direction via the corresponding holding mechanism 18, and the exposure region PRD, The filter unit 17Aa of the control member 17A for PRE is set in the + X direction.

In the present embodiment, since the partial projection optical systems PLA to PLG each form an upright image of the same magnification, the positional relationship between the trapezoidal exposure regions PRA to PRG and the control member 17A is controlled with the illumination regions IRA to IRG. It is the same as the positional relationship with the member 17A. As a result, as described with reference to FIG. 6A, the illuminance distribution in the X direction of the illumination light EL in the exposure region PRA is inclined so that the illuminance in the + X direction becomes high, and in the exposure regions PRD and PRE. The illuminance distribution in the X direction of the illumination light EL is inclined so that the illuminance in the + X direction becomes low. Further, since the exposure region PRA has a trapezoidal shape with a long side in the + X direction and the exposure region PRD, PRE has a trapezoidal shape with a long side in the −X direction, the average value of the illuminance of the exposure region PRA, PRD, PRE is. Compared to the amount of reduction in the portion forming the joints 54A and 54B (inclined portion of the trapezoidal region), the portion other than the joints 54A and 54B (the portion sandwiched between two parallel sides of the trapezoidal region). ) Will increase.

Therefore, as shown in FIG. 8C, the amount of change (correction amount) En (n = 1 to 7) in the illuminance of the exposed areas PRA, PRD, and PRE due to the installation of the control member 17A is the joint portion 54A. , 54B becomes smaller at the part corresponding to. The distribution in the Y direction of the correction amount (amount corresponding to the integrated exposure amount) of the entire illuminance to which the correction amount En is added is as shown by the dotted line curve 56B in FIG. 8 (E). Further, since the integrated exposure amount before installing the control member 17A is the curve 56A of the dotted line in FIG. 8 (E), the distribution of the integrated exposure amount ΣE after installing the control member 17A in the Y direction is shown in FIG. As shown in (D), it becomes flat, and the exposure amount of the joint portions 54A and 54B becomes the same as the target value. Therefore, as shown in FIG. 8A, when the exposure amount of the joint portions 54A and 54B before installing the control member 17A is lower than the target value, the rotation angle of the control member 17A for the exposure region PRA It can be seen that the angle of rotation of the control member 17A for the exposed areas PRD and PRE should be set to 180 degrees and 0 degrees.

Further, when the deviation between the exposure amount of the joints 54A and 54B before installing the control member 17A and the target value is small, the inclination angle of the illuminance in the exposed areas PRA to PRG may be small, so that the control member 17A Instead of, a control member 17B or 17C having a higher average transmittance may be used. In this way, it is recorded in advance in the file of the storage unit 29 which control members 17A to 17C should be used according to the deviation between the exposure amount of the joint portions 54A and 54B and the target value, and the main control device 20 Selects the control member 17A or the like to be used according to the deviation. Further, when it is desired to further improve the utilization efficiency of the illumination light EL, as described with reference to FIG. 6B, the control member 17A or the like (control member 17Aa or the like) within a range in which the illuminance can be controlled with high accuracy. ) May be set for the offset of the position in the X direction.

On the contrary, as shown in FIG. 9A, when the exposure amount of the joint portions 54A and 54B is higher than the target value with respect to the distribution of the integrated exposure amount ΣE in the Y direction before installing the control member 17A and the like. As shown in FIG. 9B, the filter unit 17Aa of the control member 17A for the exposure region PRA is set in the + X direction, and the filter unit 17Aa of the control member 17A for the exposure region PRD and PRE is set in the −X direction. do it. As a result, as described with reference to FIG. 6A, the illuminance distribution in the X direction of the illumination light EL in the exposure region PRA is inclined so that the illuminance in the −X direction becomes high, and the exposure regions PRD, PRE The illuminance distribution of the illumination light EL in the X direction is inclined so that the illuminance in the −X direction becomes low. Therefore, the average value of the illuminance of the exposed areas PRA, PRD, and PRE is such that the amount of decrease in the portion forming the joint portions 54A and 54B (the inclined portion of the trapezoidal region) is the portion other than the joint portions 54A and 54B (the portion other than the joint portions 54A and 54B). It is larger than the amount of decrease (the portion sandwiched between two parallel sides of the trapezoidal region).

Therefore, as shown in FIG. 9C, the amount of change (correction amount) En of the illuminance in the exposed areas PRA, PRD, and PRE due to the installation of the control member 17A is the portion corresponding to the joint portions 54A and 54B. growing. The distribution in the Y direction of the correction amount (amount corresponding to the integrated exposure amount) of the entire illuminance to which the correction amount En is added is as shown by the dotted line curve 57B in FIG. 9 (E). Further, since the integrated exposure amount before installing the control member 17A is the curve 57A of the dotted line in FIG. 9E, the distribution of the integrated exposure amount ΣE after installing the control member 17A in the Y direction is shown in FIG. As shown in (D), it becomes flat, and the exposure amount of the joint portions 54A and 54B becomes the same as the target value. Therefore, when the exposure amount of the joints 54A and 54B before installing the control member 17A is lower than the target value, the rotation angle of the control member 17A for the exposure area PRA is set to 0 degrees, and the exposure area PRD and PRE are used. It can be seen that the rotation angle of the control member 17A of the above should be set to 180 degrees.

After that, when the operator inputs control information indicating that the rotation angle of the control member 17A has been adjusted to the main control device 20, the operation returns to step 102, and the exposure area PRA to PRG is again used by the light amount measuring unit 24. The integrated exposure amount distribution after the exposure is measured, and in step 104, it is determined whether or not the exposure amount of the joint is within the allowable range with respect to the target value. When the exposure amount of the joint is within the allowable range with respect to the target value, the main control device 20 provides the operator with information indicating that the adjustment of the lighting system IS is completed, and the adjustment of the lighting system IS is completed. do. After that, the operation shifts to step 120, the mask M is loaded on the mask stage 21, the plate P is further loaded on the plate stage 22 (step 122), and the scanning exposure of the mask M pattern on the plate P is performed. Will be done.

On the other hand, in step 104, when the exposure amount of the joint is not within the allowable range with respect to the target value, in step 106, the transmittance distribution is controlled on the installation surface SPA, SPD, etc. of the partial illumination system ILA, ILD, ILE. Check if the member 17A or the like is installed. Since the control member 17A is installed this time, the operation shifts to step 110, and the main control device 20 determines whether or not the control member 17A or the like has been installed or replaced a predetermined number of times. When the number of installations or replacements reaches the predetermined number, the operation shifts to step 118, and the main control device 20 adjusts the illumination system IS to the operator to distribute the light intensity in the illumination regions IRA to IRG. Issue a command to make adjustments, etc.

Further, in step 110, if the number of installations or replacements has not reached the predetermined number of times, the process proceeds to step 112 to determine whether or not to replace the control member 17A or the like. Here, since the control member 17A is installed on the installation surface SPA, SPD, etc., the operation shifts to step 116, and the main control device 20 is replaced by the operator via the display device (control member). 17B), and information on target values such as the rotation angle of the control member 17B is supplied. In response to this, the operator replaces the control member 17A such as the installation surface SPA and SPD with the control member 17B, and adds 1 to the parameter indicating the number of times the control member 17A and the like have been replaced to the main control device 20. Enter the control information.

After that, the operation shifts to step 114, and the main control device 20 causes the operator to set the rotation angle and the like of the control member 17B installed on the installation surface SPA, SPD, etc. as the target value via the display device. Give instructions. In this way, the control member 17A and the like are installed on the installation surfaces of the illumination regions IRA to IRG so that the exposure amount corresponding to the joint portion 54A and the like in the integrated exposure amount distribution approaches the target value.

According to this exposure method, the exposure amount of the joints 54A to 54F approaches the target value, and the distribution of the integrated exposure amount after the scanning exposure in the Y direction is uniform, so that the exposure amount unevenness with respect to the plate P is reduced. It is possible to perform exposure with high accuracy.
Further, the operations of steps 102 to 114 may be executed at the time of maintenance of the exposure apparatus EX or the like. As a result, even if the illuminance distribution in the illumination areas IRA to IRG gradually changes due to changes over time and the integrated exposure amount distribution changes, the exposure amount unevenness can be easily achieved simply by replacing the control member 17A or the like. Can be reduced.

As described above, the exposure method and the exposure apparatus EX of the present embodiment are the illumination light EL (exposure light) for exposure from the illumination system IS (illumination optical system) and the pattern of the mask M and the projection system PS (projection optical system). ), While exposing the plate P (substrate), the exposure method and apparatus for scanning the mask M and the plate P synchronously with respect to the projection system PS. Then, in the exposure apparatus EX, the projection system PS exposes a plurality of different exposure regions PRA to PRG on the plate P, and the exposure regions PRA to PRG scan the plate P in the X direction (scanning direction). The joints 54A to 54F are arranged on the plate P by double exposure at the ends of the two adjacent exposure regions in the Y direction (non-scanning direction) orthogonal to the X direction. Further, the exposure apparatus EX is installed between the pattern surface Ma of the mask M and the pupil surfaces PPA, PPD, etc. of the illumination system IS in order to control the exposure amount of the joint portions 54A to 54F, and at least one exposure is provided. A control member 17A or the like (adjustment member) for adjusting the light intensity distribution at the ends of the regions PRA to PRG is provided.

Further, in the exposure method using the exposure apparatus EX, while exposing a plurality of exposure regions PRA to PRG on the plate P, the plate P is scanned in the X direction, and the end portions of the two adjacent exposure regions in the non-scanning direction are scanned. In order to control the exposure amount of the joint portions 54A to 54F between the step 124 of forming the joint portions 54A to 54F on the plate P by the double exposure of the above, between the pattern surface Ma and the pupil surface of the illumination system IS. It has a step 108 for installing the installed control member 17A and the like.

According to the exposure apparatus EX or the exposure method of the present embodiment, the exposure amount of the joint portions 54A to 54F can be set with high accuracy with respect to the target value by installing the control member 17A or the like, so that a plurality of exposure areas PRA to PRG When the plate P is subjected to scanning exposure using the above, it is possible to reduce the exposure amount unevenness of the joint portions 54A to 54F and perform the exposure with high accuracy.
Further, since the control member 17A and the like are installed between the pattern surface Ma of the mask M and the pupil surfaces PPA, PPD and the like of the illumination system IS, even if the installation accuracy of the control member 17A and the like is set low, the joints are joined. The exposure amount of the portions 54A to 54F can be controlled with high accuracy, and the control member 17A and the like can be easily installed and replaced.

In the above-described embodiment, as shown in FIGS. 4A to 4C, a control member 17A or the like having a semicircular filter portion 17Aa or the like is used, but as shown in FIG. A transmittance distribution control member 17D having a ring-shaped mesh-shaped filter portion 17Da arranged so as to surround the opening 17Db may be used. The average transmittance of the filter portion 17Da is, for example, about 70% to 90%, and the inner diameter of the filter portion 17Da is about the diameter near the center of the inclined portion of the trapezoidal exposed region PRA to PRG. The control member 17D can be installed on the installation surface SPA, SPD or the like of the partial lighting system ILA, ILD or the like via the holding mechanism 18 instead of the control member 17A or the like.

For example, as shown in FIG. 11A, when the exposure amount of the joint portions 54A and 54B is higher than the target value with respect to the distribution of the integrated exposure amount ΣE in the Y direction before installing the control member 17A or the like, As shown in FIG. 10B, control members 17D are installed in the partial illumination systems ILA, ILD, and ILE for the exposure regions PRA, PRD, and PRE, respectively. In this case, the ring-shaped filter portion 17Da of the control member 17D reduces the illuminance of the illumination light EL at the Y-direction ends (tips of the inclined portions) of the exposed areas PRA, PRD, and PRE.

Therefore, as shown in FIG. 10C, the amount of change (correction amount) En of the illuminance in the exposed areas PRA, PRD, and PRE due to the installation of the control member 17D is the portion corresponding to the joint portions 54A and 54B. growing. The distribution in the Y direction of the correction amount (amount corresponding to the integrated exposure amount) of the entire illuminance to which the correction amount En is added is as shown by the dotted line curve 58B in FIG. 10 (E). Further, since the integrated exposure amount before installing the control member 17D is the curve 58A of the dotted line in FIG. 10 (E), the distribution of the integrated exposure amount ΣE after installing the control member 17D in the Y direction is shown in FIG. As shown in (D), it becomes flat, and the exposure amount of the joint portions 54A and 54B becomes the same as the target value.

Even if the control member 17D having the ring-shaped filter portion 17Da is installed between the pattern surface Ma of the mask M and the pupil surfaces PPA, PPD, etc. of the illumination system IS in this way, the exposure amount unevenness in the joint portions 54A to 54F is uneven. Can be reduced.
Further, as an alternative to the control member 17A having a mesh type (or ND filter type) filter unit, FIGS. 12 (A), (B), (C), (D), (E), and (F) are shown. As shown, control members 17F, 17G, 17H, 17I, 17J, 17K each having a filter portion in which linear members are arranged in a predetermined shape can also be used. A plurality of openings 17Fh are formed in the ring-shaped frame portion 17F of the control member 17F so that they can be fixed with bolts, for example. This also applies to the other control members 17G to 17K.

Further, the filter portions 17Fa, 17Ga, 17Ha of the control members 17F, 17G, 17H are linear members in the region on the half surface side in the scanning direction (X direction), respectively, and have a grid pattern parallel to the X direction and the Y direction. A grid pattern inclined so as to intersect at approximately 45 degrees in the X direction, and a large number of regular hexagonal patterns are formed.
Further, the filter portions 17Ia, 17Ja, and 17Ka of the control members 17I, 17J, and 17K of FIGS. 12 (D), (E), and (F) are two straight lines parallel to the longitudinal direction of the trapezoidal field aperture, respectively. It is formed of a shaped member, one linear member parallel to the longitudinal direction of the trapezoidal field diaphragm, and one linear member inclined with respect to the longitudinal direction of the trapezoidal field diaphragm. When the control members 17I, 17J, 17K are used, since the linear member parallel to the Y direction is not used, the integrated exposure amount in the Y direction (non-scanning direction) after the scanning exposure is uneven (or in the Y direction). Illuminance unevenness) can be reduced.

Further, in the above-mentioned control members 17A to 17D and control members 17F to 17K, the transmittance distribution is adjusted by adjusting the thickness of the linear member constituting the filter portion entirely or partially. You can also do it.
Further, in the above-described embodiment, the multi-lens type projection system PS having the same magnification is used, but when a single projection optical system is used as the projection system PS and the substrate is exposed by, for example, a stitching method. The present invention can also be applied to. Further, the present invention can be applied even when the projection magnification of the projection optical system is enlarged or reduced.

Further, by forming a predetermined pattern (TFT pattern or the like) on the substrate by using the exposure apparatus EX or the exposure method of each of the above embodiments, a panel (liquid crystal display) for a liquid crystal display as an electronic device (microdevice) is formed. You can also get a display panel). Hereinafter, an example of this manufacturing method will be described with reference to the flowchart of FIG.
In step S401 (pattern forming step) of FIG. 13, first, a photoresist is applied on the substrate to be exposed to prepare a photosensitive substrate (plate P), and a mask for a panel using the above-mentioned exposure apparatus (a mask for a panel (plate P). An exposure step of exposing a pattern of (including, for example, a mask M) to a plurality of pattern forming regions on the photosensitive substrate and a developing step of developing the photosensitive substrate are executed. A predetermined resist pattern is formed on the substrate by the lithography process including the coating process, the exposure process, and the developing process. Following this lithography step, a predetermined pattern is formed on the substrate through an etching step using the resist pattern as a mask, a resist peeling step, and the like. The lithography process or the like is executed a plurality of times according to the number of layers on the substrate.

In the next step S402 (color filter forming step), a large number of sets of three fine filters corresponding to red R, green G, and blue B are arranged in a matrix, or red R, green G, and blue B are arranged. A color filter is formed by arranging a set of three striped filters in the horizontal scanning line direction. In the next step S403 (cell assembly step), for example, a liquid crystal cell is manufactured by injecting liquid crystal between the substrate having the predetermined pattern obtained in step S401 and the color filter obtained in step S402. ..

In the subsequent step S404 (module assembly step), the liquid crystal cell assembled in this way is attached with an electric circuit for performing a display operation and parts such as a backlight to complete the liquid crystal display panel.
According to the method for manufacturing an electronic device described above, a step of transferring a mask pattern to a substrate (a part of step S401) using the exposure apparatus or the exposure method of the above embodiment, and a step of transferring the pattern by this step. It includes a step (other part of step S401) of processing (developing, etching, etc.) the substrate based on the pattern.

According to this manufacturing method, the mask pattern can be efficiently exposed to the substrate with high accuracy by reducing the influence of the exposure amount unevenness, so that the liquid crystal display panel can be manufactured efficiently and with high accuracy.
The above-mentioned method for manufacturing an electronic device can also be applied to the case of manufacturing a panel for another display such as an organic EL (Electro-Luminescence) display or a plasma display.

The present invention is not limited to the above-described embodiment, and various configurations can be adopted without departing from the gist of the present invention.

EX ... exposure device, PS ... projection system, PLA to PLG ... partial projection optical system, M ... mask, P ... plate, PRA to PRG ... exposure area, 17A to 17D ... control member, 18 ... holding mechanism, 21 ... mask stage , 22 ... Plate stage, 35 ... Field diaphragm, 53A ... Pattern formation area, 54A to 54F ... Joint

Claims (12)

In an exposure apparatus that exposes a mask having a pattern onto a substrate via a projection optical system.
An illumination optical system that illuminates the mask with illumination light,
A mask stage that supports the mask and
A mask stage drive unit that moves the mask stage relative to the illumination light in the first direction is provided.
The mask stage drive unit illuminates a second region that partially overlaps the first region with respect to the mask whose first region is illuminated with respect to the second direction intersecting the first direction. As described above, the mask stage supporting the mask is relatively moved in the first direction.
In the illumination optical system, the illuminance of the illumination light in a part of the overlapping illumination region of the first region and the second region is the illuminance of the other region other than the partial region in the overlap illumination region. An exposure apparatus comprising an adjusting member having a transmission rate distribution in the first direction and a filter portion for transmitting a part of the illumination light . The adjusting member has an illuminance of a first non-overlapping illumination region other than the overlapping illumination region in the first region, or an illuminance of a second non-overlapping illumination region other than the overlapping illumination region in the second region. The exposure apparatus according to claim 1, wherein the illuminance of the illumination light in the overlapping illumination region is adjusted. The exposure apparatus according to claim 1 or 2, wherein the adjusting member is provided between the mask and the pupil surface of the illumination optical system. The illumination optical system has an optical integrator and has an optical integrator.
The exposure apparatus according to any one of claims 1 to 3, wherein the adjusting member is provided between the mask and the optical integrator. The illumination optical system has a lens that collects the illumination light on the pattern surface of the mask.
The exposure apparatus according to any one of claims 1 to 4 , wherein the adjusting member moves in the first direction with respect to the lens. The exposure apparatus according to any one of claims 1 to 5 , wherein the adjusting member adjusts the illuminance distribution of the illumination light that illuminates the mask so as to be non-uniform with respect to the first direction. The adjusting member has an illuminance in the first non-overlapping lighting region so that the intensity of the illuminance in the overlapping lighting region is different from the illuminance in the first non-overlapping lighting region or the illuminance in the second non-overlapping lighting region. Alternatively, the exposure apparatus according to claim 2, wherein the illuminance of the overlapping illumination region is adjusted with respect to the illuminance of the second non-overlapping illumination region. The projection optical system projects a projected image of a pattern illuminated in the overlapped illumination area onto the overlapped projection area on the substrate.
The exposure apparatus according to any one of claims 1 to 7 , wherein the adjusting member adjusts the light intensity distribution in the second direction of the overlapping projection region so as to be non-uniform. The projection optical system displays a projected image of a pattern illuminated in the first non-overlapping illumination region, the second non-overlapping illumination region, and the overlapping illumination region in the first non-overlapping projection region and the second on the substrate, respectively. Project to non-overlapping projection areas and overlapping areas,
The adjusting member adjusts the illuminance of the overlapping region so that the intensity of the illuminance of the overlapping region is different from the illuminance of the first non-overlapping projection region or the illuminance of the second non-overlapping projection region. 2. The exposure apparatus according to 2. The filter unit is a mesh having an edge portion parallel to the second direction that divides a region through which the illumination light passes into a transmission region that transmits the illumination light and a light-shielding region that shields a part of the illumination light. The exposure apparatus according to any one of claims 1 to 9 , further comprising a type filter. The filter unit has a hollow mesh type filter, and is arranged so as to shield at least a part of the illumination light of the overlapped illumination area from the other part of the overlapped illumination area. Item 6. The exposure apparatus according to any one of Items 1 to 9 . A plurality of the illumination optical systems are provided so as to correspond to the plurality of projection optical systems.
The exposure apparatus according to any one of claims 1 to 11 , wherein the adjusting member is provided in each of a plurality of the illumination optical systems.

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