TWI480705B - Illumination optical system, exposure apparatus, and device manufacturing method - Google Patents

Description

Illumination optical system, exposure device, and component manufacturing method

The present invention relates to an illumination optical system, an exposure apparatus, and a component manufacturing method. More specifically, the present invention relates to an illumination optical system which is suitable for an exposure apparatus for manufacturing an element such as a semiconductor element, an image pickup element, a liquid crystal display element, a thin film magnetic head or the like by a lithography step.

In such a typical exposure apparatus, light emitted from a light source is formed as a secondary light source as a substantially surface light source formed of a plurality of light sources via a fly eye lens as an optical integrator. (usually the specified light intensity distribution in the illumination pupil). Hereinafter, the light intensity distribution in the illumination pupil is referred to as "the pupil intensity distribution". Moreover, the illumination pupil is defined as an illuminated surface by the action of an illumination system between the illumination pupil and the illuminated surface (a mask or a wafer in the case of an exposure device). Become the position of the Fourier transform surface of the illumination pupil.

The light from the secondary light source is condensed by a condenser lens, and then the reticle forming a predetermined pattern is superimposed and illuminated. The light that has passed through the reticle is imaged on the wafer via the projection optical system, thereby projecting (transferring) the reticle pattern onto the wafer. After the pattern formed on the reticle is highly integrated, in order to accurately transfer the fine pattern onto the wafer, it is indispensable to obtain a uniform illuminance distribution on the wafer.

In order to accurately transfer the fine pattern of the photomask onto the wafer, a technique is proposed in which, for example, a ring-shaped or multi-pole (dipole, quadrupole, etc.) pupil intensity distribution is formed to make projection optics. The focus depth and resolution of the system are improved (see Patent Document 1).

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1]

US Patent Publication No. 2006/0055834

Regardless of the shape of the pupil intensity distribution formed in the illumination pupil, if the pupil intensity distribution associated with each point on the wafer as the final illuminated surface is held in the predetermined direction If the difference in light intensity between a pair of regions leaving a space is too large, the pattern may be exposed from the desired position.

It is an object of the present invention to provide an illumination optical system capable of illuminating a pair of regions spaced apart from each other in a predetermined direction in a pupil intensity distribution associated with each point on an illuminated surface. Make adjustments. Moreover, it is an object of the present invention to provide an exposure apparatus that can perform good exposure under appropriate illumination conditions using an illumination optical system that can correlate the pupil intensity associated with points on the illuminated surface. The difference in light intensity between a pair of regions that are spaced apart in a predetermined direction while sandwiching the optical axis is adjusted.

In order to solve the above problems, a first aspect of the present invention provides an illumination optical system that illuminates an illuminated surface with light from a light source, and includes: a distribution forming optical system including an optical integrator, and The integrator further forms a pupil intensity distribution in the illumination pupil on the rear side; and the dimming member is disposed at a position directly in front of or behind the illumination pupil, and reduces light at one point toward the illuminated surface. The light-reducing member is disposed in a posture in which the dimming member is opposite to a dimming ratio of light of one point on the periphery of the light-receiving member facing the predetermined surface in the predetermined direction The light dimming rate toward the 1 point on the other periphery is large.

A second aspect of the present invention provides an illumination optical system that illuminates an illuminated surface with light from a light source, and includes: a distribution forming optical system including an optical integrator, and a rear side of the optical integrator a pupil intensity distribution is formed in the illumination pupil; and the light-reducing member is disposed at a position directly in front of or behind the illumination pupil, and has a direction transverse to the optical axis of the illumination optical system a first dimension in the first direction and a second dimension that is larger than the first dimension and along a dimension in the second direction orthogonal to the first direction, and the second direction and the optical axis of the illumination optical system intersect.

A third aspect of the present invention provides an illumination optical system that illuminates an illuminated surface with light from a light source, and includes: a distribution forming optical system including an optical integrator, and a rear side of the optical integrator a pupil intensity distribution is formed in the illumination pupil; and the light-reducing member is disposed at a position directly in front of or behind the illumination pupil, and dimmes light at one point toward the illumination target; the dimming The member is configured to be switchable between a first posture and a second posture, and the first posture is a dimming of light at a point on the periphery of the light-reducing member that faces the irradiation target surface in a predetermined direction. The dimming member has a large dimming rate of light toward one point on the other periphery, and the second posture is a subtraction of light from the dimming member toward the one point on the periphery. The dimming member has a smaller dimming rate of the light toward the one point on the other periphery than the light transmittance.

According to a fourth aspect of the present invention, there is provided an illumination optical system for illuminating an illuminated surface with light from a light source, characterized by comprising: a distribution forming optical system including an optical integrator, and being further rearward than the optical integrator a pupil intensity distribution is formed in the illumination pupil; and the light-reducing member is disposed at a position directly in front of or behind the illumination pupil, and has a direction transverse to the optical axis of the illumination optical system. a first dimension in one direction and a second dimension that is larger than the first dimension and in a second direction orthogonal to the first direction, and the dimming member surrounds the first direction and the first The 2 directions are orthogonal to the axis and rotate.

A fifth aspect of the present invention provides an illumination optical system that illuminates an illuminated surface with light from a light source, and includes: a distribution forming optical system including an optical integrator, and a rear side of the optical integrator a pupil intensity distribution is formed in the illumination pupil; and the variable portion is changeable and obtainable with respect to the first pupil intensity distribution associated with the light beam reaching the first point on the illuminated surface The second pupil intensity distribution is different from the beam at the second point of the first point.

According to a sixth aspect of the invention, there is provided an exposure apparatus comprising: an illumination optical system of a first aspect, a second aspect, a third aspect, a fourth aspect, or a fifth aspect for illuminating a predetermined pattern; And the pattern specified above is exposed to the photosensitive substrate.

According to a seventh aspect of the invention, there is provided a method of manufacturing a device, comprising: exposing, exposing the predetermined pattern to the photosensitive substrate using an exposure apparatus according to a sixth aspect; and developing a step of transferring the predetermined The photosensitive substrate of the pattern is developed, a mask layer having a shape corresponding to the predetermined pattern is formed on a surface of the photosensitive substrate, and a processing step is performed to process a surface of the photosensitive substrate via the mask layer .

[Effects of the Invention]

An illumination optical system according to an aspect of the present invention includes a light-reducing member disposed at a position directly in front of or behind the illumination pupil on a rear side of the optical integrator, and facing the illuminated surface The light of the point is dimmed. The light-reducing member is configured to change a posture between the first posture and the second posture, and the first posture is light at a point on a periphery of the light-reducing member facing the irradiation surface along a predetermined direction. The dimming rate is larger than the dimming rate of the dimming member toward the light passing through one point on the other periphery, and the second posture is the subtraction of the light from the dimming member toward the one point on the periphery. The dimming member has a smaller dimming rate for the light of the above-mentioned one point toward the other periphery than the light ratio.

In this case, the dimming member realizes a plurality of dimming rate characteristics in which the dimming rate changes in accordance with various aspects along a predetermined direction of the illuminated surface in the following manner. Therefore, in the illumination optical system according to the above aspect, under the plurality of light reduction effects of the light-reducing member, the optical axis intensity distribution associated with each point on the illuminated surface can be clamped in the optical axis in the predetermined direction. The difference in light intensity between a pair of open spaces is adjusted. Further, in the exposure apparatus of the present invention, it is possible to perform good exposure under appropriate illumination conditions using an illumination optical system, and it is possible to manufacture a good element, wherein the illumination optical system has light associated with each point on the illuminated surface. In the 瞳 intensity distribution, the light intensity difference of a pair of regions spaced apart in a predetermined direction by the optical axis is adjusted.

The above described features and advantages of the present invention will be more apparent from the following description.

Embodiments of the present invention will be described based on the drawings. Fig. 1 is a view schematically showing the configuration of an exposure apparatus according to an embodiment of the present invention. In FIG. 1, the Z axis is set along the normal direction of the exposure surface (transfer surface) of the wafer W, which is a photosensitive substrate, and is set in the direction parallel to the paper surface of FIG. 1 in the exposure surface of the wafer W. The X-axis is set in the Y-axis along the direction perpendicular to the paper surface of FIG. 1 in the exposure surface of the wafer W.

Referring to Fig. 1, in the exposure apparatus of the present embodiment, an exposure light beam (illumination light) is supplied from the light source 1. As the light source 1, for example, an ArF excimer laser light source that supplies light of a wavelength of 193 nm or a KrF excimer laser light source that supplies light of a wavelength of 248 nm can be used. The light beam emitted from the light source 1 is converted into a desired cross-sectional shape by the shaping optical system 2, and then incident on the afocal lens 4 via the diffractive optical element 3 for the ring illumination, for example.

The afocal lens 4 is an afocal system in which the front focus position is substantially coincident with the position of the diffractive optical element 3, and the rear focus position substantially coincides with the position of the predetermined surface 5 indicated by a broken line in the figure (there is no focus) Optical system). The diffractive optical element 3 is constructed in accordance with a step difference in the pitch of the wavelength of the exposure light beam (illumination light) formed on the substrate, and has a function of diffracting the incident light beam at a desired angle. Specifically, the diffractive optical element 3 for the ring-band illumination has a function of being in a far field (or a Fraunhofer diffraction area) when a parallel beam having a rectangular cross section is incident. ) forming an annular band-shaped light intensity distribution.

Therefore, the substantially parallel light beams incident on the diffractive optical element 3 form an endless belt light intensity distribution on the pupil plane of the afocal lens 4, and then are emitted from the afocal lens 4 in an angular distribution of the endless belt. The light passing through the afocal lens 4 passes through a zoom lens 7 which can be used to change the σ value (σ value = reticle side numerical aperture of the illumination optical system / reticle side numerical aperture of the projection optical system) It is incident on a micro fly's eye lens (or fly eye lens) 8 as an optical integrator. The micro fly-eye lens 8 is composed of, for example, a plurality of optical lenses having a plurality of positive refractive powers arranged vertically and horizontally, and is formed by a parallel plane plate etching process to form a minute lens group.

Each of the minute lenses constituting the micro fly's eye lens is smaller than each of the lens elements constituting the fly eye lens. Further, unlike the fly-eye lens composed of lens elements separated from each other, the micro fly-eye lens is formed such that a plurality of minute lenses (micro-refractive surfaces) are not isolated from each other. However, the micro fly's eye lens is the same as the fly-eye lens, and is a division of wavefront type optical integrator in terms of the longitudinal and lateral arrangement of the lens element having positive refractive power. The configuration and action of such a micro fly's eye lens 8 are disclosed, for example, in U.S. Patent No. 674,1394. Further, as the micro fly's eye lens 8, for example, a cylindrical micro fly's eye lens can be used. The constitution and action of the columnar micro fly's eye lens are disclosed, for example, in U.S. Patent No. 6,913,373. Here, the teachings of U.S. Patent No. 674,1394 and No. 6,913,373 are incorporated by reference.

The position of the predetermined surface 5 is disposed in the vicinity of the front focus position of the variable focal length lens 7 or the front focus position, and the incident surface of the micro fly-eye lens 8 is disposed at the rear focus position of the variable focal length lens 7 or the rear side. Near the focus position. In other words, the variable focal length lens 7 substantially arranges the incident surface 5 and the incident surface of the micro fly-eye lens 8 in a Fourier transform relationship, that is, the pupil plane of the afocal lens 4 and the incident surface of the micro fly's eye lens 8 are arranged as It is optically substantially conjugated.

Therefore, similarly to the pupil plane of the afocal lens 4, an annular band-shaped field of view centering on the optical axis AX is formed on the incident surface of the micro fly's eye lens 8. The overall shape of the belt-shaped field is similarly changed depending on the focal length of the variable focal length lens 7. The incident surface of each microlens of the micro fly-eye lens 8 (that is, the unit wavefront discrimination surface) is, for example, a rectangular shape having a long side along the Z direction and a short side along the X direction, and is formed on the mask M. The shape of the illumination area (and thus the shape of the exposed area on the wafer W) is similarly rectangular.

The light beam incident on the micro fly's eye lens 8 is two-dimensionally divided, and is formed on the rear focus surface of the micro fly-eye lens 8 or the position near the rear focus surface (and thus the position of the illumination pupil). A secondary light source having a light intensity distribution having substantially the same illumination field formed on the incident surface of the micro fly-eye lens 8, that is, a secondary light source formed by a substantially planar surface light source having an annular band centered on the optical axis AX ( Optical intensity distribution). The light shielding unit 9 is disposed in the vicinity of the rear focal plane or the rear focal plane of the micro fly-eye lens 8. The configuration and action of the shading unit 9 will be described below.

Further, an illumination aperture stop (not shown) is disposed in the vicinity of the rear focal plane or the rear focal plane of the micro fly-eye lens 8, as needed, and the illumination aperture stop has an annular band shape The secondary light source corresponds to an annular band-shaped aperture portion (light transmitting portion). The illumination aperture stop is configured to be detachable from the illumination optical path, and is configured to be switchable between a plurality of aperture stops having apertures different in size and shape. As a switching method of the aperture stop, for example, a well-known turret method, a slide method, or the like can be used. The illumination aperture stop is disposed at a position that is optically substantially conjugate with the entrance pupil plane of the projection optical system PL to be described later, and defines a range that contributes to illumination of the secondary light source.

The light passing through the micro fly's eye lens 8 and the light shielding unit 9 is superimposed and illuminated by the concentrating optical system 10 on the mask blind 11 (mask blind). As a result, a rectangular field corresponding to the shape and focal length of the microlens of the micro fly's eye lens 8 is formed on the mask mask 11 as the illumination field stop. The light passing through the rectangular aperture portion (transmission portion) of the mask mask 11 passes through the imaging optical system 12 including the front lens group 12a and the rear lens group 12b, and the mask M having a predetermined pattern is formed. Perform overlapping lighting. That is, the imaging optical system 12 forms an image of the rectangular aperture portion of the mask mask 11 on the mask M.

A pattern to be transferred is formed on the mask M held on the mask stage MS, and has a rectangular shape (slit shape) having a long side in the Y direction and a short side in the X direction in the entire pattern area. The pattern area is illuminated. The light having passed through the pattern region of the mask M passes through the projection optical system PL, and an image of the mask pattern is formed on the wafer (photosensitive substrate) W held on the wafer platform WS. That is, a rectangular static exposure region having a long side along the Y direction and a short side along the X direction on the wafer W is also optically associated with the rectangular illumination region on the mask M ( A pattern image is formed in the effective exposure area).

Thus, in accordance with the so-called step and scan method, the mask platform MS and the crystal are made along the X direction (scanning direction) in a plane (XY plane) orthogonal to the optical axis AX of the projection optical system PL. The circular platform WS also moves (scans) in synchronization with the wafer W, whereby the wafer W has a width equal to the size of the Y-direction of the still exposure region, and has a scan with the wafer W. The exposure (shot area) of the length corresponding to the amount (movement amount) is scanned for the exposure mask pattern.

In the present embodiment, as described above, the secondary light source formed by the micro fly's eye lens 8 is used as a light source to perform Kohler illumination on the mask M disposed on the illuminated surface of the illumination optical system (2 to 12) ( Kohler illumination). Therefore, the position at which the secondary light source is formed is optically conjugate with the position of the aperture stop AS of the projection optical system PL, so that the formation surface of the secondary light source can be referred to as an illumination diaphragm of the illumination optical system (2 to 12). surface. Typically, the surface to be irradiated (the surface on which the wafer W is disposed when the surface of the mask M is disposed or the projection optical system PL is included as the illumination optical system) is included with respect to the illumination pupil plane. It becomes an optical Fourier transform surface.

In addition, the pupil intensity distribution means an illumination pupil plane of the illumination optical system (2 to 12) or a light intensity distribution (luminance distribution) on a plane optically conjugate with the illumination pupil plane. When the wavefront region fraction of the micro fly-eye lens 8 is relatively large, the overall light intensity distribution formed on the incident surface of the micro fly-eye lens 8 and the overall light intensity distribution (the pupil intensity distribution) of the entire secondary light source are high. Correlation. Therefore, the light intensity distribution of the incident surface of the micro fly-eye lens 8 and the surface optically conjugate with the incident surface may also be referred to as a pupil intensity distribution. In the configuration of Fig. 1, the diffractive optical element 3, the afocal lens 4, the variable focal length lens 7, and the micro fly's eye lens 8 constitute a distribution forming optical system which forms illumination of the optical system on the rear side of the micro fly's eye lens 8. A pupil intensity distribution is formed in the pupil.

Instead of the diffractive optical element 3 for ring-band illumination, a diffractive optical element (not shown) for multi-pole illumination (dipole illumination, quadrupole illumination, octopolar illumination, etc.) can be set in the illumination optical path. For multi-pole lighting. A diffractive optical element for multi-pole illumination has a function of forming a multipole (dipole, quadrupole, octapole, etc.) light intensity in a far field when a parallel beam having a rectangular cross section is incident. distributed. Therefore, the light beam passing through the diffractive optical element for multipolar illumination forms a plurality of predetermined shapes (arc shape, circular shape, etc.) centered on the optical axis AX on the incident surface of the micro fly's eye lens 8, for example. A multi-polar field formed by the wilderness. As a result, a multipolar secondary light source similar to the field formed on the incident surface is formed in the vicinity of the rear focal plane or the rear focal plane of the micro fly-eye lens 8.

Further, instead of the diffractive optical element 3 for the endless belt illumination, a diffractive optical element (not shown) for circular illumination can be set in the illumination optical path, thereby performing normal circular illumination. The diffractive optical element for circular illumination has a function of forming a circular light intensity distribution on the far field when a parallel beam having a rectangular cross section is incident. Therefore, the light beam passing through the diffractive optical element for circular illumination forms a circular field of illumination centering on the optical axis AX on the incident surface of the micro fly's eye lens 8. As a result, a circular secondary light source having the same shape as the field formed on the incident surface is formed in the vicinity of the rear focal plane or the rear focal plane of the micro fly-eye lens 8. Further, instead of the diffractive optical element 3 for the endless belt illumination, a diffractive optical element (not shown) having appropriate characteristics can be set in the illumination optical path, thereby performing various forms of anamorphic illumination. As the switching mode of the diffractive optical element 3, for example, a well-known turret method, a sliding method, or the like can be used. Further, such a diffractive optical element is disclosed in, for example, U.S. Patent No. 5,850,300 and U.S. Patent Publication No. 2008/0074746. Here, the teachings of U.S. Patent No. 5,850,300 and U.S. Patent Publication No. 2008/0074746 are incorporated by reference.

In the following description, in order to facilitate understanding of the operational effects of the present embodiment, the illumination pupil set in the vicinity of the rear focal plane or the rear focal plane of the micro fly-eye lens 8 is formed in a quadrupole as shown in FIG. The pupil intensity distribution (secondary light source) 20. Further, the pair of light blocking members 91 and 92 are disposed as the light shielding unit 9 directly behind the formation surface of the quadrupole pupil intensity distribution 20. In the following description, the term "illumination pupil" is used to mean the illumination pupil of the rear focus surface of the micro fly-eye lens 8 or the vicinity of the rear focus surface.

Referring to Fig. 2, a quadrupole pupil intensity distribution 20 formed on an illumination pupil has a pair of arc-shaped substantially planar light sources that are spaced apart in the X direction by clamping the optical axis AX (hereinafter referred to as only A "surface light source" 20a, 20b, and a pair of arc-shaped substantially surface light sources 20c, 20d which are spaced apart in the Z direction by the optical axis AX. Further, the X direction in the illumination pupil is the short side direction of the rectangular microlens of the micro fly's eye lens 8, and corresponds to the scanning direction of the wafer W. Further, the Z direction in the illumination pupil is the longitudinal direction of the rectangular microlens of the micro fly-eye lens 8, and corresponds to the scanning orthogonal direction orthogonal to the scanning direction of the wafer W (Y direction on the wafer W) ).

As shown in FIG. 3, a rectangular still exposure region ER having a long side in the Y direction and a short side in the X direction is formed on the wafer W, and is in a manner corresponding to the still exposure region ER. A rectangular illumination region (not shown) is formed on the cover M. Here, the four-pole pupil intensity distribution formed by the light incident at one point in the stationary exposure region ER in the illumination pupil has substantially the same shape regardless of the position of the incident point. However, the light intensity of each of the surface light sources constituting the quadrupole pupil intensity distribution may differ depending on the position of the incident point.

As a relatively simple example, it is considered that the light incident on the peripheral points P2 and P3 in the still exposure region ER forms the quadrupole light schematically shown in FIGS. 4 and 5 in the illumination pupil.瞳 intensity distribution. In other words, in the quadrupole pupil intensity distribution 22 formed by the light at the point P2 around the center point P1 in the +Y direction from the center point P1 in the still exposure region ER, as shown in FIG. The light intensities of the light sources 22a, 22b, and 22d are substantially equal to each other, and the light intensity of the surface light source 22c is greater than the light intensity of the other surface light sources.

Further, in the quadrupole pupil intensity distribution 23 formed by the light passing through the center point P1 in the still exposure region ER and spaced apart at the point P3 in the -Y direction, as shown in FIG. The light intensities of the light sources 23a, 23b, and 23c are substantially equal to each other, and the light intensity of the surface light source 23d is greater than the light intensity of the other surface light sources. As described above, in the pupil intensity distribution associated with each point on the wafer W, the optical axis AX is sandwiched and in the Z direction (the direction corresponding to the scanning orthogonal direction (the Y direction on the wafer W)) When the difference in light intensity between the pair of regions spaced apart from each other is too large, the exposure region (the position corresponding to the peripheral points P2 and P3 in the case of the example shown in FIGS. 4 and 5) is exposed. The pattern may deviate from the desired position.

In the present embodiment, the light shielding unit 9 is provided as an adjustment mechanism for sandwiching the optical axis AX in the pupil intensity distributions 22 and 23 associated with the peripheral points P2 and P3, and a pair of surface light sources are spaced apart in the Z direction. The difference in light intensity between 22c and 22d and between the pair of surface light sources 23c and 23d is adjusted. As shown in FIG. 6, the light shielding unit 9 includes an annular holding member 90, a pair of light blocking members 91 and 92, and a rotating shaft 93 attached to both ends of each of the light shielding members 91 and 92 and extending in the X direction; A drive unit 94 that rotates the shaft 93; a support portion 95 that rotatably supports the rotary shaft 93; and a rotation control system 96 that controls rotation of the rotary shaft 93 of the drive unit 94.

Further, the driving portion 94 and the supporting portion 95 are attached to the holding member 90. Further, the light shielding members 91 and 92 have the same plate shape as each other, and are disposed so as to sandwich the optical axis AX and are spaced apart from each other in the Z direction. More specifically, the light shielding members 91 and 92 are parallel flat plates having a rectangular outer shape elongated in the X direction, as shown in FIG. 2, which are in the Z direction from the clamping optical axis AX. The position of the light of the pair of surface light sources 20c and 20d which are spaced apart from each other is determined to function. In other words, the light shielding unit 9 does not function with the pair of surface light sources 20a and 20b which are spaced apart in the X direction by the optical axis AX among the quadrupole pupil intensity distributions 20 formed on the illumination pupil.

The light shielding unit 9 rotates the rotary shaft 93 by the action of the drive unit 94 in accordance with an instruction from the rotation control system 96, and the postures of the light shielding members 91 and 92 are changed, respectively. In other words, each of the light shielding members 91 and 92 is configured to be rotatable about a rotation shaft 93 that extends in the short side direction (X direction) of the rectangular unit wave front discrimination surface of the micro fly's eye lens 8. Further, each of the light shielding members 91 and 92 has a rectangular cross section along the YZ plane, and extends in parallel with the X direction which is the short side direction of the unit wavefront discrimination surface.

7 and 8 are views for explaining the basic operation of each light shielding member. In FIGS. 7 and 8, in order to facilitate understanding of the action of the light shielding unit 9, a single light shielding member 97 having the same configuration as that of the light shielding members 91 and 92 and performing the same operation will be described, and the light reduction effect in each characteristic posture will be described. . In FIG. 7, the posture is set such that the center line of the longitudinal direction (X direction) of the light shielding member 97 passes through the optical axis AX, and the long side of the rectangular cross section (the section along the YZ plane) of the light shielding member 97 is long. The direction extends in a direction parallel to the optical axis AX (Y direction) (hereinafter referred to as "parallel posture").

In this case, as shown in FIG. 7, the light reaching the center point P1 in the static exposure region ER on the wafer W, that is, the light reaching the center point P1' of the aperture portion of the mask mask 11, for the light shielding member 97 The XZ plane on the end face of the illumination pupil side is incident at the incident angle 0, and therefore the amount of light blocked by the light shielding member 97 is small. On the other hand, the light reaching the peripheral points P2 and P3 in the static exposure region ER on the wafer W, that is, the light reaching the peripheral points P2', P3' of the aperture portion of the mask mask 11, with respect to the light shielding member 97 The XZ plane on the end face of the illumination pupil side is incident at a relatively large incident angle θ, and therefore the amount of light blocked by the light shielding member 97 is relatively large.

Hereinafter, in order to simplify the description, the peripheral point P2' corresponding to the peripheral point P2 in the still exposure region ER is located on the +Z direction side of the aperture portion of the mask mask 11, and the peripheral point in the static exposure region ER is made. The peripheral point P3' corresponding to P3 is located on the -Z direction side. In FIG. 7, only the light reaching the center point P1' and the peripheral point P2' is shielded by the light shielding member 97, but it is clear that the light reaching the peripheral point P3' is also the same as the light reaching the peripheral point P2'. It is shielded by the light shielding member 97.

In FIG. 8 , the light shielding member 97 is set to a posture in which only +θ is rotated around the X axis from the parallel posture (hereinafter referred to as “rotation posture of +θ”). In this case, as shown in FIG. 8, the light reaching the center point P1 in the static exposure region ER on the wafer W, that is, the light reaching the center point P1' of the aperture portion of the mask mask 11 is shielded by the light shielding member 97. The part is relatively more. The light reaching the peripheral point P2 in the still exposure region ER, that is, the portion of the light reaching the peripheral point P2' of the aperture portion of the mask mask 11 is blocked by the light shielding member 97.

The light reaching the peripheral point P3 in the still exposure area ER, that is, the portion of the light reaching the peripheral point P3' of the aperture portion of the mask mask 11 is blocked by the light shielding member 97. In addition, when the light shielding member 97 is set to a posture in which only the -θ is rotated about the X axis from the parallel posture, that is, the rotation posture of -θ, the center point P1 of the aperture portion of the mask mask 11 is reached. The portion of the light that is blocked by the light shielding member 97 is relatively large. Further, the portion of the light reaching the peripheral point P2' is shielded by the light shielding member 97, and the portion of the light reaching the peripheral point P3' is blocked by the light shielding member 97.

Fig. 9 is a view for explaining a dimming action of a light shielding unit composed of a pair of light blocking members. Fig. 10 is a view schematically showing the magnitude of the dimming action of the light shielding unit of Fig. 9 on a pair of surface light sources. As an example in FIG. 9 , the first light blocking member 91 is set in a parallel posture, and the second light blocking member 92 is set to a rotation posture of +θ. In this case, as shown in the center of FIG. 10, in the quadrupole pupil intensity distribution associated with the center point P1, the first light blocking member 91 has a very small dimming effect on the surface light source 21c on the +Z direction side, and The second light blocking member 92 has a relatively large dimming effect on the surface light source 21d on the -Z direction side. As described above, in FIG. 10 and the associated FIGS. 11 and 12, the magnitude of the dimming action of the light shielding unit 9 is schematically represented by the width dimension in the Z direction of the hatched region extending in the X direction.

Further, as shown in the left side of FIG. 10, in the quadrupole pupil intensity distribution associated with the peripheral point P2, the light-reducing action of the first light-shielding member 91 on the surface light source 22c is relatively large, and the second light-shielding member 92 is opposite to the surface light source 22d. The dimming effect is very small. Further, as shown in the right side of FIG. 10, in the quadrupole pupil intensity distribution associated with the peripheral point P3, the light-reducing action of the first light-shielding member 91 on the surface light source 23c is relatively large, and the second light-shielding member 92 is opposed to the surface light source 23d. The light reduction effect is the largest.

In Fig. 9, reference numeral B3 denotes a point along the outermost edge of the surface light source 20c (21c to 23c) along the Z direction (see Fig. 2), and reference symbol B4 denotes the edge of the surface light source 20d (21d to 23d). The point at the outermost edge of the Z direction (see Fig. 2). Further, the point of the outermost edge along the X direction of the surface light sources 20a (21a to 23a) is indicated by reference numeral B1, and the outermost edge of the surface light sources 20b (21b to 23b) along the X direction is indicated by reference numeral B2. point. As described above, the light from the surface light sources 20a (21a to 23a) and the surface light sources 20b (21b to 23b) is not affected by the light reduction effect of the light shielding unit 9.

Further, as shown in FIG. 11 , when the first light blocking member 91 is set to the rotational posture of −θ and the second light blocking member 92 is set to the rotational posture of +θ, the quadrupole-shaped pupil associated with the center point P1 is formed. In the intensity distribution, the light-reducing action of the first light-shielding member 91 on the surface light source 21c and the light-reducing action of the second light-shielding member 92 on the surface light source 21d are relatively large. In the quadrupole pupil intensity distribution related to the peripheral point P2, the first light blocking member 91 has the largest dimming effect on the surface light source 22c, and the second light blocking member 92 has a very small dimming effect on the surface light source 22d. In the quadrupole pupil intensity distribution associated with the peripheral point P3, the dimming action of the first light-shielding member 91 on the surface light source 23c is extremely small, and the second light-blocking member 92 has the largest dimming effect on the surface light source 23d.

Further, as shown in FIG. 12, when the first light blocking member 91 is set to a rotation posture of +θ and the second light blocking member 92 is set to a rotational posture of -θ, a quadrupole diaphragm associated with the center point P1 is formed. In the intensity distribution, the light-reducing action of the first light-shielding member 91 on the surface light source 21c and the light-reducing action of the second light-shielding member 92 on the surface light source 21d are relatively large. In the quadrupole pupil intensity distribution associated with the peripheral point P2, the dimming action of the first light-shielding member 91 on the surface light source 22c is extremely small, and the second light-shielding member 92 has the largest dimming effect on the surface light source 22d. In the quadrupole pupil intensity distribution related to the peripheral point P3, the first light blocking member 91 has the largest dimming effect on the surface light source 23c, and the second light blocking member 92 has a very small dimming effect on the surface light source 23d.

In this manner, for example, the first light blocking member 91 is set to a rotation posture of an appropriate -θ' between the rotation posture and the parallel posture of -θ, and the second light blocking member 92 is set to a rotation posture and a parallel posture of +θ. Between the pair of surface light sources 22c and 22d spaced apart in the Z direction from the clamping optical axis AX and between the pair of surface light sources 23c and 23d, the appropriate +θ' rotation posture therebetween 4 and the light intensity difference shown in FIG. 5 is adjusted.

Specifically, when the first light blocking member 91 of the light shielding unit 9 is in the rotational posture of -θ′ and the second light blocking member 92 is in the rotational posture of +θ′, as shown in FIG. 13 , the light associated with the peripheral point P2 In the pupil intensity distribution 22, the light from the surface light sources 22a and 22b is not affected by the light reduction effect of the light shielding unit 9, and thus the light intensity thereof does not change. The light from the surface light source 22c is affected by the dimming action of the light shielding unit 9, and the light intensity thereof is relatively largely lowered. The light from the surface light source 22d is affected by the light reduction effect of the light shielding unit 9, but its light intensity is only slightly lowered. As a result, in the pupil intensity distribution 22' related to the peripheral point P2 adjusted by the light shielding 9, the light intensity of the surface light source 22c' spaced apart in the Z direction is substantially the same as the light intensity of the surface light source 22d'. equal. Alternatively, the difference between the light intensity of the surface light source 22c' and the light intensity of the surface light source 22d' is adjusted to a desired light intensity difference.

Further, as shown in Fig. 14, in the pupil intensity distribution 23 associated with the peripheral point P3, the light from the surface light sources 23a and 23b is not affected by the dimming action of the light shielding unit 9, and therefore the light intensity is not changed. The light from the surface light source 23c is affected by the dimming action of the light shielding unit 9, but its light intensity is only slightly lowered. The light from the surface light source 23d is affected by the dimming action of the light shielding unit 9, and the light intensity thereof is relatively largely lowered. As a result, in the pupil intensity distribution 23' related to the peripheral point P3 adjusted by the light shielding unit 9, the light intensity of the surface light source 23c' which is spaced apart in the Z direction and the light intensity of the surface light source 23d' Almost equal. Alternatively, the difference between the light intensity of the surface light source 23c' and the light intensity of the surface light source 23d' is adjusted to a desired light intensity difference.

Further, the difference between the light intensity of the surface light source 22c' and the light intensity of the surface light source 22d', and the difference between the light intensity of the surface light source 23c' and the light intensity of the surface light source 23d' are adjusted to a desired light intensity difference. The light intensity distribution measuring device performs light on the pupil plane of the projection optical system PL based on, for example, light passing through the projection optical system PL, based on the measurement result of the pupil intensity distribution measuring device (not shown). The 瞳 intensity distribution is measured. The pupil intensity distribution measuring device comprises a charge-coupled device (CCD) imaging unit, and a pupil intensity distribution associated with each point on the image plane of the projection optical system PL (light incident to each point is projected) The pupil intensity distribution formed on the pupil plane of the optical system PL is monitored, and the CCD imaging unit has, for example, an imaging surface disposed at a position optically conjugate with the pupil position of the projection optical system PL. For details of the configuration and function of the pupil intensity distribution measuring device, reference is made to US Patent Publication No. 2008/0030707 and the like.

Specifically, the measurement result of the pupil intensity distribution measuring device is supplied to a control unit (not shown). The control unit outputs a command to the rotation control system 96 of the light shielding unit 9 based on the measurement result of the pupil intensity distribution measuring device so that the pupil intensity distribution on the pupil plane of the projection optical system PL becomes a desired distribution. The rotation control system 96 controls the postures of the light shielding members 91 and 92 in accordance with an instruction from the control unit, and the difference between the light intensity of the surface light source 22c' and the light intensity of the surface light source 22d', and the light intensity of the surface light source 23c' and the surface light source. The difference in light intensity of 23d' is adjusted to the desired difference in light intensity.

In the present embodiment, each of the light shielding members 91 and 92 constituting the light shielding unit 9 has a function of shielding light at one point in the static exposure region ER on the wafer W which is the final illuminated surface. Further, each of the light shielding members 91 and 92 is configured to continuously change the posture between the rotation posture (first posture) of +θ and the rotation posture (second posture) of -θ, and the rotation posture of the +θ ( The first posture is a dimming rate of the light of the light shielding member toward the other peripheral point P3 as compared with the dimming rate of the light of the light shielding member toward the point P2 around the Y direction in the still exposure region ER. The rotation posture (second posture) of the above -θ is larger than the dimming rate of the light that is directed toward the peripheral point P2 by the light shielding member, and the light reduction ratio of the light shielding member toward the peripheral point P3 is small.

Specifically, when the light shielding members 91 and 92 are set to the rotation posture of +θ, the dimming rate of the light shielding member monotonously increases from the peripheral point P2 toward the peripheral point P3. On the other hand, when the light shielding members 91 and 92 are set to the rotation posture of −θ, the dimming rate of the light shielding member monotonously decreases from the peripheral point P2 toward the peripheral point P3. Further, in the light shielding unit 9, the postures of the pair of light blocking members 91 and 92 are controlled independently of each other between the rotational posture of +θ and the rotational posture of -θ. Therefore, as can be seen from FIGS. 10 to 12, the light shielding unit 9 realizes a plurality of dimming rate characteristics in which the dimming rate changes in accordance with various aspects along the Y direction in the still exposure region ER. Furthermore, the light shielding unit 9 can be regarded as a variable portion that can be changed to reach the illuminated position with respect to the first pupil intensity distribution associated with the light beam reaching the first point (for example, the peripheral point P2) on the illuminated surface. The second pupil intensity distribution associated with the light beam at the second point (for example, the peripheral point P3) different from the first point on the surface.

As described above, the illumination optical system (2 to 12) of the present embodiment includes the light shielding unit 9 that realizes various dimming rate characteristics, that is, the Y direction in the static exposure region ER of the wafer W, and the dimming rate according to various aspects And it has changed. Therefore, in the illumination optical system (2 to 12) of the present embodiment, the light intensity distribution associated with each point in the still exposure region ER can be clamped by the plurality of light reduction effects of the light shielding unit 9 The difference in light intensity between the pair of regions spaced apart by the axis AX in the Y direction (between the pair of surface light sources 22c and 22d in the example of FIGS. 4 and 5 and between the pair of surface light sources 23c and 23d) Make adjustments.

Further, in the exposure apparatus (2 to WS) of the present embodiment, the illumination optical system (2 to 12) can be used to perform good exposure under appropriate illumination conditions corresponding to the fine pattern of the mask M, and the mask can be further provided. The fine pattern of M spreads over the entire exposed area and faithfully transfers to a desired position on the wafer W at a desired line width, wherein the illumination optical system (2-12) is stationary on the wafer W. The difference in light intensity between the pair of regions in which the optical axis AX is sandwiched and the Y-direction is spaced apart in the pupil intensity distribution associated with each point in the exposure region ER is adjusted.

In the present embodiment, it is considered that the light amount distribution on the wafer (irradiated surface) W is affected by, for example, the dimming action (adjustment action) of the light shielding unit 9. In this case, the illuminance distribution in the still exposure region ER or the shape of the still exposure region (illumination region) ER can be changed by the action of the light amount distribution adjustment unit having a well-known configuration as needed. Specifically, as the light quantity distribution adjusting unit that changes the illuminance distribution, Japanese Patent Laid-Open No. 2001-313250 and Japanese Patent Laid-Open No. 2002-100561 (and the corresponding US Patent Nos. 6771350 and 6927836) can be used. The composition and method disclosed in ). Further, as a light amount distribution adjusting unit that changes the shape of the illumination region, the configuration and method disclosed in the specification of the International Patent Publication No. WO 2005/048326 (and the corresponding US Patent Publication No. 2007/0014112) can be used. Here, the teachings of U.S. Patent Nos. 6,771,350 and 6,927,836, and U.S. Patent Publication No. 2007/0014112 are incorporated by reference.

Further, in the above embodiment, the pair of light blocking members 91 and 92 of the light shielding unit 9 are each configured to continuously change the posture between the rotational posture of +θ and the rotational posture of -θ. However, the present invention is not limited thereto, and the pair of light blocking members 91 and 92 may be configured, for example, between a first rotation posture between a rotation posture and a parallel posture of +θ, and a rotation posture and a parallel posture between -θ. The posture is continuously changed between the second rotation postures.

Further, the pair of light blocking members 91 and 92 may be configured to be switchable between a rotational posture of +θ and a rotational posture of -θ, or may be configured to be between a rotational posture of +θ and a rotational posture of -θ. Switch between multiple poses.

Further, the light shielding unit 9 may be constituted by a single light shielding member. In this case, the single light shielding member may be configured to continuously change the posture between the rotational posture of +θ and the rotational posture of -θ, or may be configured such that the single light shielding member is configured, for example, between the rotational posture and the parallel posture of +θ. The posture is continuously changed between the first rotation posture and the second rotation posture between the rotation posture of -θ and the parallel posture. Alternatively, the single light shielding member may be configured to be switchable between a rotational posture of +θ and a rotational posture of -θ, or a single light shielding member may be configured to be between a rotational posture of +θ and a rotational posture of -θ. Switch between multiple poses.

In other words, in the present invention, it is important that the dimming member that dims the light toward one point on the surface to be illuminated is configured to be in the first posture (for example, in the above embodiment, the rotation posture of +θ or - The rotation posture of θ is switched between the second posture (for example, the rotation posture of -θ or the rotation posture of +θ in the above embodiment), and the first posture is the edge of the pair of dimming members facing the illuminated surface. The light-reducing member has a light-reducing rate of one point on the periphery (in the above-described embodiment, the Y direction is P2 or P3 in the above-described embodiment), and the light-reducing member pair faces the other periphery. The dimming rate of the light at one point (P3 or P2 in the above embodiment) is large, and the second posture is higher than the dimming ratio of the dimming member toward the light of the one point on the periphery. The dimming member has a small dimming rate for the light of the above-mentioned one point toward the other periphery. In this case, the light-reducing member has a first dimension and a first direction which is a direction transverse to the optical axis AX of the illumination optical system (in the above embodiment, the short side of the rectangular cross section of the light-shielding member) And the second dimension is a dimension larger than the first dimension and along a second direction orthogonal to the first direction (the longitudinal direction of the rectangular cross section of the light shielding member in the above embodiment) The dimming member is rotatable about an axis orthogonal to the first direction and the second direction (an axis around the X direction in the above embodiment).

Further, in the above-described embodiment, the pair of light shielding members 91 and 92, which can be regarded as the light-reducing member, are used as a light-shielding member that completely shields light, that is, a light-shielding member having a transmittance of 0, but may be used. A light shielding member having a predetermined transmittance which is greater than 0 and less than 100%.

Further, in the above embodiment, the postures of the pair of light blocking members 91 and 92 of the light shielding unit 9 are changed. However, the present invention is not limited thereto, and the light blocking members 91 and 92 may be fixedly set to a rotation posture of +θ (or -θ) and a rotation posture of -θ (or +θ), respectively, or may be fixedly set to + The first rotation posture between the rotation posture of θ (or -θ) and the parallel posture, and the second rotation posture between the rotation posture of -θ (or +θ) and the parallel posture. Moreover, the light shielding unit 9 may be constituted by a single light shielding member, and the single light shielding member may be fixedly set to an appropriate rotation posture between a rotation posture of +θ and a rotation posture of -θ.

In other words, in the present invention, it is important that the arrangement posture of the light-reducing member that dims the light toward one point on the surface to be irradiated (the rotation posture in the above-described embodiment) is a regulation along the surface to be illuminated. The dimming rate of light at one point (P2 or P3 in the above embodiment) on one of the directions (in the Y direction in the above embodiment) is one point closer to the other periphery than the pair of dimming members ( In the above embodiment, the light of P3 or P2) has a small dimming rate. In this case, the light-reducing member has a first dimension and a first direction which is a direction transverse to the optical axis AX of the illumination optical system (in the above embodiment, the short side of the rectangular cross section of the light-shielding member) And the second dimension is a dimension larger than the first dimension and along a second direction orthogonal to the first direction (the longitudinal direction of the rectangular cross section of the light shielding member in the above embodiment) .

Further, in the above-described embodiment, the light shielding unit 9 including the pair of light blocking members 91 and 92 is disposed immediately behind the formation surface of the quadrupole pupil intensity distribution 20. However, the present invention is not limited thereto, and the light shielding unit 9 composed of a required number of light shielding members may be disposed as needed. Further, in the above-described embodiment, the longitudinal direction of the light shielding members 91 and 92 constituting the light shielding unit 9 is arranged along the short side direction (X direction) of the rectangular unit wave front discrimination surface of the micro fly's eye lens 8. However, the present invention is not limited thereto, and the longitudinal direction of the light shielding member may be slightly inclined with respect to the short side direction of the unit wavefront discrimination surface. Further, in the above-described embodiment, the light shielding unit 9 is configured by the light shielding members 91 and 92 having a rectangular outer shape and having a parallel flat plate. However, the present invention is not limited thereto, and the specific configuration of the light shielding member may be in various forms. That is, the outer shape, the number, the arrangement, and the like of the light shielding members constituting the light shielding unit 9 may be in various forms.

Further, in the above description, the effect of the present invention has been described by taking the illuminating pupil in which the quadrupole-shaped pupil intensity distribution is formed, that is, the four-pole illumination as an example. However, it is not limited to the quadrupole illumination, for example, a ring-shaped illumination in which a ring-shaped pupil intensity distribution is formed, a multi-pole illumination in which a multipole shape of a pupil other than a quadrupole shape is formed, and the like can also be applied. The same effect is obtained by the invention.

Further, in the above description, the light shielding member of the light shielding unit 9 is disposed directly behind the illumination pupil of the rear focus surface of the micro fly-eye lens 8 or the vicinity of the rear focus surface. However, the light shielding member may be disposed directly in front of the illumination pupil of the rear focus surface of the micro fly-eye lens 8 or the vicinity of the rear focus surface. Further, it is also possible to positively or directly behind the other illumination pupils on the rear side of the micro fly-eye lens 8, for example, the illumination pupil between the front lens group 12a and the rear lens group 12b of the imaging optical system 12 A light blocking member is disposed in front or rear. Further, when the light shielding member is disposed at the position of the illumination pupil, since the light shielding member has a width dimension along the optical axis direction, the light shielding member can be disposed immediately before and immediately behind the illumination pupil.

The exposure apparatus of the above-described embodiment is manufactured by assembling various subsystems including the respective constituent elements listed in the scope of the patent application, and ensuring predetermined mechanical precision, electrical precision, and optical precision. In order to ensure these various precisions, various optical systems are used to adjust the optical precision before and after the assembly, and various mechanical systems are used to achieve mechanical precision adjustment, and various electrical systems are used to achieve electrical precision. Adjustment. The assembly step of assembling the exposure apparatus by various subsystems includes mechanical connection of various subsystems, wiring connection of circuits, piping connection of a pneumatic circuit, and the like. Prior to assembling the assembly steps of the exposure apparatus by such various subsystems, it is of course possible to have the respective assembly steps of the various subsystems. After the assembly steps of assembling the various exposure systems into various subsystems, comprehensive adjustments are made to ensure various precisions as the entire exposure apparatus. Further, it is preferable to manufacture an exposure apparatus in a clean room that is managed such as temperature and cleanliness.

Next, a method of manufacturing an element using the exposure apparatus of the above embodiment will be described. Fig. 15 is a flow chart showing a manufacturing procedure of a semiconductor element. As shown in FIG. 15, in the manufacturing process of the semiconductor device, a metal film is deposited on the wafer W which is the substrate of the semiconductor element (step S40), and a photoresist which is a photosensitive material is applied onto the vapor deposited metal film. Photoresist (step S42). Next, using the exposure apparatus of the above-described embodiment, the pattern formed on the mask (retic reticle) M is transferred to each exposure irradiation region on the wafer W (step S44: exposure step), and After the transfer is completed, the development of the wafer W is performed, that is, the development of the photoresist to which the pattern is transferred (step S46: development step). Thereafter, a resist pattern generated on the surface of the wafer W in step S46 is used as a mask, and the surface of the wafer W is etched or the like (step S48: processing step).

Here, the photoresist pattern is a photoresist layer that generates irregularities in a shape corresponding to the pattern transferred by the exposure device of the above-described embodiment, and the concave portion penetrates the photoresist layer. In step S48, the surface of the wafer W is processed through the photoresist pattern. In the processing performed in step S48, for example, at least one of etching of the surface of the wafer W or film formation of a metal film or the like is included. In the step S44, the exposure apparatus of the above-described embodiment transfers the pattern by using the wafer W coated with the photoresist as the photosensitive substrate, that is, the sheet P.

FIG. 16 is a flowchart showing a manufacturing procedure of a liquid crystal element such as a liquid crystal display element. As shown in FIG. 16, in the manufacturing process of the liquid crystal element, a pattern forming step (step S50), a color filter forming step (step S52), a cell assembly step (step S54), and the like are sequentially performed. Module assembly step (step S56).

In the pattern forming step of step S50, a predetermined pattern such as a circuit pattern and an electrode pattern is formed on the glass substrate coated with the photoresist as the sheet P by using the exposure apparatus of the above embodiment. The pattern forming step includes: an exposing step of transferring the pattern to the photoresist layer using the exposure apparatus of the above embodiment; and a developing step of developing the sheet P on which the pattern is transferred, that is, performing light on the glass substrate The resist layer is developed to form a photoresist layer having a shape corresponding to the pattern; and a processing step of processing the surface of the glass substrate via the developed photoresist layer.

In the color filter forming step of step S52, a color filter is formed in which a plurality of R (Red, Red), G (Green, Green), and B (Blue) are arranged in a matrix. , blue) a group of three dots corresponding to each other, or a group of three stripe filters of R, G, and B arranged in the horizontal scanning direction.

In the cell assembly step of step S54, the liquid crystal panel (liquid crystal cell) is assembled using the glass substrate in which the predetermined pattern is formed in step S50 and the color filter formed in step S52. Specifically, for example, a liquid crystal panel is formed by injecting a liquid crystal between a glass substrate and a color filter. In the module assembly step of step S56, various components such as a circuit for causing display operation of the liquid crystal panel and a backlight are mounted on the liquid crystal panel assembled in step S54.

Further, the present invention is not limited to application to an exposure apparatus for manufacturing a semiconductor element, and can be widely applied to, for example, a liquid crystal display element formed on a square glass plate or a display device such as a plasma display. An exposure apparatus and an exposure apparatus for manufacturing various elements such as an imaging element (CCD or the like), a micromachine, a thin film magnetic head, and a deoxyribonucleic acid (DNA) wafer. Further, the present invention is also applicable to an exposure step (exposure device) in the case of manufacturing a photomask (a photomask, a main mask, etc.) in which a mask pattern of various elements is formed by using a photolithography step.

Further, in the above embodiment, ArF excimer laser light (wavelength: 193 nm) or KrF excimer laser light (wavelength: 248 nm) is used as the exposure light beam, but the invention is not limited thereto, and other appropriate lasers may be used. The present invention is applied to a light source, for example, an F ₂ laser light source that supplies laser light having a wavelength of 157 nm.

Further, in the above embodiment, the present invention is applied to an exposure apparatus of a step-and-scan type in which a pattern of the exposure mask M is scanned in an exposure irradiation region of the wafer W. However, the present invention is not limited thereto, and the present invention may be applied to an exposure apparatus of a step-and-repeat method in which exposure is repeated for each exposure region of the wafer W ( One-shot exposure) The action of the pattern of the mask M.

Further, in the above embodiment, the present invention is applied to an illumination optical system that illuminates a mask (or a wafer) in an exposure apparatus. However, the present invention is not limited thereto, and a mask (or wafer) may be applied to the exposure apparatus. The present invention is applied to a general illumination optical system in which an illuminated surface other than the illumination surface is illuminated.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

1. . . light source

2. . . Plastic optical system

3. . . Diffractive optical element

4. . . Afocal lens

5. . . Prescribed surface

7. . . Zoom lens

8. . . Micro fly-eye lens (optical integrator)

9. . . Shading unit

10. . . Concentrating optical system

11. . . Mask mask

12. . . Imaging optical system

12a. . . Front lens group

12b. . . Rear lens group

20, 22, 22', 23, 23'. . . Optical intensity distribution (secondary light source)

20a-20d, 21a-21d, 22a-22d, 22c', 22d', 23a-23d, 23c', 23d'. . . Surface light source

91, 92. . . Shading member

93. . . Rotary axis

94. . . Drive department

95. . . Support

96. . . Rotary control system

97. . . Shading member

AS. . . Aperture stop

AX. . . Optical axis

B1. . . The point of the outermost edge of the surface light source 20a (21a to 23a) along the X direction

B2. . . The point of the outermost edge of the surface light source 20b (21b to 23b) along the X direction

B3. . . The point of the outermost edge of the surface light source 20c (21c to 23c) along the Z direction

B4. . . The point of the outermost edge of the surface light source 20d (21d to 23d) along the Z direction

ER. . . Still exposure area

M. . . Mask

MS. . . Mask platform

P1, P1'. . . Center point

P2, P3, P2', P3'. . . Peripheral point

PL. . . Projection optical system

W. . . Wafer

WS. . . Wafer platform

θ. . . Angle of incidence

X, Y, Z. . . axis

S40～S48, S50～S56. . . step

Fig. 1 is a view schematically showing the configuration of an exposure apparatus according to an embodiment of the present invention.

Fig. 2 is a view showing a quadrupole secondary light source formed in an illumination pupil.

3 is a view showing a rectangular still exposure region formed on a wafer.

4 is a view for explaining properties of a quadrupole pupil intensity distribution formed by light incident on a peripheral point P2 in a still exposure region.

FIG. 5 is a view for explaining a property of a quadrupole pupil intensity distribution formed by light incident on a peripheral point P3 in a still exposure region.

Fig. 6 is a view schematically showing a configuration of a light shielding unit.

Fig. 7 is a first view for explaining the basic operation of each light shielding member.

Fig. 8 is a second view for explaining the basic function of each light shielding member.

FIG. 9 is a view showing a dimming action of the light shielding unit when the first light blocking member is set to the parallel posture and the second light blocking member is set to the rotation posture of +θ.

Fig. 10 is a view schematically showing the magnitude of the dimming action of the light shielding unit of Fig. 9 on a pair of surface light sources.

FIG. 11 is a view schematically showing the magnitude of the dimming action of the light shielding unit on the pair of surface light sources when the first light blocking member is set to the rotation posture of −θ and the second light blocking member is set to the rotation posture of +θ.

FIG. 12 is a view schematically showing the magnitude of the dimming action of the light shielding unit on the pair of surface light sources when the first light blocking member is set to the rotation posture of +θ and the second light blocking member is set to the rotation posture of −θ.

FIG. 13 is a view schematically showing a state in which the pupil intensity distribution associated with the peripheral point P2 is adjusted by the light shielding unit.

FIG. 14 is a view schematically showing a state in which the pupil intensity distribution associated with the peripheral point P3 is adjusted by the light shielding unit.

Fig. 15 is a flow chart showing a manufacturing procedure of a semiconductor element.

FIG. 16 is a flowchart showing a manufacturing procedure of a liquid crystal element such as a liquid crystal display element.

1. . . light source

2. . . Plastic optical system

3. . . Diffractive optical element

4. . . Afocal lens

5. . . Prescribed surface

7. . . Zoom lens

8. . . Micro fly-eye lens (optical integrator)

9. . . Shading unit

10. . . Concentrating optical system

11. . . Mask mask

12. . . Imaging optical system

12a. . . Front lens group

12b. . . Rear lens group

91, 92. . . Shading member

AS. . . Aperture stop

AX. . . Optical axis

M. . . Mask

MS. . . Mask platform

PL. . . Projection optical system

W. . . Wafer

WS. . . Wafer platform

X, Y, Z. . . axis

Claims (26)

An illumination optical system that illuminates an illuminated surface with light from a light source, comprising: a distribution forming optical system, including an optical integrator, and utilizing light passing through the optical integrator to form a pupil in the illumination pupil And an intensity portion; and the variable portion is configured to obtain a first pupil intensity distribution associated with the light beam reaching the first point on the illuminated surface to achieve a difference from the first point The second pupil intensity distribution associated with the light beam at the second point is variable, and the variable portion is disposed between the distribution forming optical system and the illuminated surface. The illumination optical system according to claim 1, wherein the variable portion includes a light-reducing member disposed at a position directly in front of or behind the illumination pupil, and facing the illuminated surface The light at 1 point on the upper side is dimmed. The illumination optical system according to claim 2, wherein the light-reducing member is configured to be changeable between a first posture and a second posture, and the first posture is opposite to the light-reducing member pair The dimming rate of the light of one point on the periphery of the irradiation surface along a predetermined direction is larger than the dimming rate of the light of one point toward the other periphery, and the second posture is The dimming member has a smaller dimming rate of the light toward the one point on the other periphery than the dimming member has a dimming rate toward the one point of the light on the periphery. An illumination optical system as described in claim 2, wherein The light-reducing member is disposed in a posture in which the light-reducing member faces the light-reducing rate of the light at one point on the periphery of the light-receiving surface that faces the predetermined surface in the predetermined direction. The dimming rate of light at one point on one periphery is large. The illumination optical system according to Item 4, wherein the light-reducing member has a plate shape, and monotonically increases from a peripheral portion toward the other periphery by a dimming rate of the light-reducing member. The posture is configured. The illumination optical system according to claim 5, wherein the optical integrator has an elongated rectangular unit wavefront discrimination surface along the predetermined direction, and the light reduction member is along the illumination optical system The optical axis and the plane parallel to the axis extending in the predetermined direction have a rectangular cross section and extend substantially parallel to the short side direction of the unit wavefront discrimination surface. The illumination optical system according to claim 1, wherein the variable portion includes a light-reducing member disposed at a position directly in front of or behind the illumination pupil, and has: along the illumination a direction in which the optical axis of the optical system is transversely cut, that is, a first dimension in the first direction, and a dimension larger than the first dimension and in the second direction orthogonal to the first direction, that is, the second dimension, and the subtraction The optical member is rotatable about an axis orthogonal to the first direction and the second direction. An illumination optical system that illuminates an illuminated surface with light from a light source, characterized by comprising: a distribution forming optical system, including an optical integrator, and a light pupil intensity distribution is formed in the illumination pupil on the rear side of the integrator; and the light reduction member is disposed at a position directly in front of or behind the illumination pupil, and has an optical axis along the illumination optical system The transverse direction is the first dimension in the first direction, and the dimension larger than the first dimension along the second direction orthogonal to the first direction, that is, the second dimension, and the second direction and the illumination optics The above optical axes of the system intersect. The illumination optical system according to claim 8, wherein the light-reducing member is disposed at a position of one point on a periphery of the light-reducing member facing the irradiation target in a predetermined direction. The dimming rate of the dimming member is larger toward the light of one point on the other periphery than the dimming rate of the light. An illumination optical system that illuminates an illuminated surface with light from a light source, comprising: a distribution forming optical system, including an optical integrator, and forming light in an illumination pupil that is further behind the optical integrator a dimming intensity distribution; and a light-reducing member disposed at a position directly in front of or behind the illumination pupil, and dimming light at one point toward the illuminated surface; and the dimming member is configured to be first The posture is changed between the posture and the second posture, and the first posture is a dimming ratio of light of one point on the periphery of the light-reducing member facing the predetermined surface in the predetermined direction. The member has a large dimming rate of light toward one point on the other periphery, and the second posture is smaller than a dimming rate of the light of the dimming member toward the one point on the periphery. Light member pair facing up The dimming rate of the light at the above one point on the other periphery is small. The illumination optical system according to claim 10, wherein the light-reducing member is configured to continuously change a posture between the first posture and the second posture. The illumination optical system according to claim 11, wherein the light-reducing member has a plate shape, and in the first posture, a dimming rate of the light-reducing member is from the periphery to the other periphery Further, in the second posture, the dimming rate of the light-reducing member monotonously decreases from the periphery to the other periphery. The illumination optical system according to claim 12, wherein the optical integrator has an elongated rectangular unit wavefront discrimination surface along the predetermined direction, and the light reduction member is along the light with the illumination optical system The axis has a rectangular cross section perpendicular to a plane parallel to the axis extending in the predetermined direction, and extends substantially in parallel with the short side direction of the unit wavefront discrimination surface. The illumination optical system according to claim 13, wherein the light-reducing member is configured to be rotatable about an axis extending in a short-side direction of the unit wavefront discrimination surface. An illumination optical system that irradiates an illuminated surface with light from a light source Illuminating, characterized by comprising: a distribution forming optical system comprising an optical integrator, and forming a pupil intensity distribution in an illumination pupil on a rear side of the optical integrator; and a dimming member disposed in the illumination pupil The front side or the rear side of the position has a first dimension in the first direction along a direction transverse to the optical axis of the illumination optical system, and is larger than the first dimension and along the first direction The dimension of the second direction intersected, that is, the second dimension, and the dimming member is rotatable about an axis orthogonal to the first direction and the second direction. The illumination optical system according to claim 15, wherein the light-reducing member is configured to be switchable between a first posture and a second posture, and the first posture is to be irradiated toward the light-receiving member The dimming member has a larger dimming rate of light toward one point on the other periphery than the light dimming rate of one point on the periphery of the surface in a predetermined direction, and the second posture is The light-reducing member has a light-reducing ratio of the light passing toward the one point on the other periphery of the light-reducing member toward the light-reducing rate of the light passing through the one point on the periphery. The illumination optical system according to any one of claims 1 to 16, wherein the illumination optical system comprises a plurality of the above-mentioned light-reducing members. The illumination optical system according to any one of claims 1 to 16, wherein the light-reducing member is positioned in such a manner as to be from the illumination light Light in a pair of regions spaced apart from each other in the predetermined direction is formed by sandwiching the optical axis of the illumination optical system. The illumination optical system according to any one of claims 1 to 16, further comprising a light amount distribution adjustment unit that changes an illuminance distribution on the illuminated surface or the illuminated surface The shape of the illuminated area formed. The illumination optical system according to claim 19, wherein the light amount distribution adjusting unit corrects an influence of the light-reducing member on a light amount distribution on the illuminated surface. The illumination optical system according to any one of claims 1 to 16, wherein the illumination aperture is optically conjugate with the aperture stop of the projection optical system, and the A projection optical system in which an irradiation surface forms a conjugated surface optically is used in combination. The illumination optical system according to any one of claims 2 to 16, wherein the light-reducing member is a light-shielding member. An illuminating optical system according to any one of claims 1 to 22, wherein the predetermined pattern is exposed to photosensitivity. On the substrate. The exposure apparatus according to claim 23, comprising a projection optical system in which an image of the predetermined pattern is formed on the photosensitive substrate, and the predetermined pattern and the predetermined pattern are provided with respect to the projection optical system The photosensitive substrate is relatively moved in the scanning direction to project and expose the predetermined pattern onto the photosensitive substrate. The exposure apparatus according to claim 24, wherein the scanning direction corresponds to a direction orthogonal to the predetermined direction. A method of manufacturing a device, comprising: an exposing step of exposing the prescribed pattern onto the photosensitive substrate using an exposure apparatus according to any one of claims 23 to 25; Developing the photosensitive substrate on which the predetermined pattern is transferred, and forming a mask layer having a shape corresponding to the predetermined pattern on a surface of the photosensitive substrate; and processing steps of the photomask layer The surface of the photosensitive substrate is processed.