JP5387893B2 - Illumination optical system, exposure apparatus, and device manufacturing method - Google Patents

Description

  The present invention relates to an illumination optical system, an exposure apparatus, and a device manufacturing method. More specifically, the present invention relates to an illumination optical system suitable for an exposure apparatus for manufacturing a device such as a semiconductor element, an imaging element, a liquid crystal display element, and a thin film magnetic head in a lithography process.

  In a typical exposure apparatus of this type, a secondary light source (generally an illumination pupil), which is a substantial surface light source composed of a number of light sources, passes through a fly-eye lens as an optical integrator. A predetermined light intensity distribution). Hereinafter, the light intensity distribution in the illumination pupil is referred to as “pupil intensity distribution”. The illumination pupil is a position where the illumination surface becomes the Fourier transform plane of the illumination pupil by the action of the optical system between the illumination pupil and the illumination surface (a mask or a wafer in the case of an exposure apparatus). Defined.

  The light from the secondary light source is condensed by the condenser lens and then illuminates the mask on which a predetermined pattern is formed in a superimposed manner. The light transmitted through the mask forms an image on the wafer via the projection optical system, and the mask pattern is projected and exposed (transferred) onto the wafer. The pattern formed on the mask is highly integrated, and it is indispensable to obtain a uniform illumination distribution on the wafer in order to accurately transfer the fine pattern onto the wafer.

  In order to accurately transfer the fine pattern of the mask onto the wafer, for example, an annular or multipolar (bipolar, quadrupolar, etc.) pupil intensity distribution is formed to improve the depth of focus and resolution of the projection optical system. The technique to make it is proposed (refer patent document 1).

US Patent Publication No. 2006/0055834

  In order to faithfully transfer the fine pattern of the mask onto the wafer, not only the pupil intensity distribution is adjusted to the desired shape, but also the pupil intensity distribution for each point on the wafer as the final irradiated surface is almost uniform. It is necessary to adjust to. If there is a variation in the uniformity of the pupil intensity distribution at each point on the wafer, the line width of the pattern varies from position to position on the wafer, and the fine pattern of the mask has the desired line width over the entire exposure area. It cannot be faithfully transferred onto the wafer.

  An object of the present invention is to provide an illumination optical system capable of adjusting the pupil intensity distribution at each point on the irradiated surface almost uniformly. The present invention also provides an exposure apparatus that can perform good exposure under appropriate illumination conditions using an illumination optical system that adjusts the pupil intensity distribution at each point on the irradiated surface substantially uniformly. The purpose is to provide.

In order to solve the above problems, in the first embodiment of the present invention, in the illumination optical system that illuminates the illuminated surface with light from a light source,
A distribution forming optical system having an optical integrator and forming a pupil intensity distribution in an illumination pupil on the rear side of the optical integrator;
A light shielding member disposed at a position immediately before or immediately after the illumination pupil,
The illumination optical system characterized in that the light shielding member is configured such that a light reduction rate of the light directed to one point on the illuminated surface by the light shielding member increases from the center to the periphery of the illuminated surface. I will provide a.

In the second embodiment of the present invention, in the illumination optical system that illuminates the illuminated surface with light from the light source,
A distribution forming optical system having an optical integrator and forming a pupil intensity distribution in an illumination pupil on the rear side of the optical integrator;
A light shielding member having a plate-like shape disposed at a position immediately before or after the illumination pupil,
The illumination optical system is characterized in that a thickness direction of the light shielding member is substantially parallel to a plane of the illumination pupil and a width direction of the light shielding member is substantially parallel to an optical axis direction of the illumination optical system. .

  According to a third aspect of the present invention, there is provided an exposure apparatus comprising the illumination optical system of the first or second aspect for illuminating a predetermined pattern, and exposing the predetermined pattern onto a photosensitive substrate. To do.

In the fourth embodiment of the present invention, using the exposure apparatus of the third embodiment, an exposure step of exposing the predetermined pattern to the photosensitive substrate;
Developing the photosensitive substrate to which the predetermined pattern is transferred, and forming a mask layer having a shape corresponding to the predetermined pattern on the surface of the photosensitive substrate;
And a processing step of processing the surface of the photosensitive substrate through the mask layer.

  In the illumination optical system of the present invention, the light shielding member is disposed immediately before or immediately after the illumination pupil behind the optical integrator, and the light reduction rate of the light directed to one point on the irradiated surface is reduced by the light shielding member. It is comprised so that it may increase from the center of a surface to a periphery. Accordingly, the pupil intensity distribution for each point on the illuminated surface is independently adjusted by the dimming action of the light shielding member having a required dimming rate characteristic that changes according to the incident position of light on the illuminated surface. Thus, it is possible to adjust the pupil intensity distribution for each point to distributions having substantially the same properties.

  As a result, in the illumination optical system of the present invention, for example, a correction filter that uniformly adjusts the pupil intensity distribution at each point on the irradiated surface and a light shielding member that independently adjusts the pupil intensity distribution for each point. Due to the cooperative action, the pupil intensity distribution at each point on the irradiated surface can be adjusted substantially uniformly. Thus, the exposure apparatus of the present invention can perform good exposure under appropriate illumination conditions using the illumination optical system that adjusts the pupil intensity distribution at each point on the irradiated surface almost uniformly. And by extension, a good device can be manufactured.

It is a figure which shows schematically the structure of the exposure apparatus concerning embodiment of this invention. It is a figure which shows the quadrupole secondary light source formed in an illumination pupil. It is a figure which shows the rectangular-shaped static exposure area | region formed on a wafer. It is a figure explaining the property of the quadrupole pupil intensity distribution which the light which injects into the center point P1 in a still exposure area | region forms. It is a figure explaining the property of the quadrupole pupil intensity distribution which the light which injects into the peripheral points P2 and P3 in a still exposure area | region forms. (A) is a light intensity distribution along the Z direction of the pupil intensity distribution with respect to the center point P1, and (b) is a diagram schematically showing the light intensity distribution along the Z direction of the pupil intensity distribution with respect to the peripheral points P2 and P3. It is. It is a 1st figure explaining the effect | action of the fin member of this embodiment. It is a 2nd figure explaining the effect | action of the fin member of this embodiment. It is a figure which shows the light attenuation rate characteristic of the fin member of this embodiment. It is a figure which shows typically a mode that the pupil intensity distribution regarding the center point P1 is adjusted with a fin member. It is a figure which shows typically a mode that the pupil intensity distribution regarding the peripheral points P2 and P3 is adjusted with a fin member. (A) shows a state in which a plurality of fin members are arranged for a quadrupole pupil intensity distribution with a large outer diameter, and (b) shows a plurality of fin members for a quadrupole pupil intensity distribution with a small outer diameter. It is a figure which shows a mode that the fin member is arrange | positioned. (A) is an example using a fin member in which the dimension in the width direction changes discontinuously along the length direction, and (b) is a diagram showing an example in which a plurality of fin members having different dimensions in the width direction are used. It is. (A) shows a state in which three fin members 9H and three fin members 9V are integrally formed, and (b) shows a state in which three fin members 9H and three fin members 9V are arranged in the front-rear direction. FIG. It is a figure which shows an example of the holding member for positioning and holding a fin member in the predetermined position in an illumination optical path. (A) is a light-shielding unit composed of a holding member to which a fin member having a dimension in the width direction is fixed along the length direction, and (b) is a plurality of fin members having different dimensions in the width direction. It is a figure which shows the light-shielding unit which consists of a holding member. It is a figure which shows an example of the holding member which can make the relative positional relationship of a several fin member variable. It is a figure explaining the structure and effect | action of the holder of FIG. It is a figure which shows the structure which winds or rewinds the tape-shaped fin member from which a width dimension and thickness dimension change along a length direction. It is a figure which shows the example of the light-shielding member which has the form of the side surface of a plane parallel plate. It is a figure explaining the effect | action of the light-shielding member of FIG. It is a flowchart which shows the manufacturing process of a semiconductor device. It is a flowchart which shows the manufacturing process of liquid crystal devices, such as a liquid crystal display element.

  Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a drawing schematically showing a configuration of an exposure apparatus according to an embodiment of the present invention. In FIG. 1, the Z axis along the normal direction of the exposure surface (transfer surface) of the wafer W, which is a photosensitive substrate, and the Y axis in the direction parallel to the paper surface of FIG. In the W exposure plane, the X axis is set in a direction perpendicular to the paper surface of FIG.

  Referring to FIG. 1, in the exposure apparatus of the present embodiment, exposure light (illumination light) is supplied from a light source 1. As the light source 1, for example, an ArF excimer laser light source that supplies light with a wavelength of 193 nm, a KrF excimer laser light source that supplies light with a wavelength of 248 nm, or the like can be used. The light beam emitted from the light source 1 is converted into a light beam having a required cross-sectional shape by the shaping optical system 2 and then enters the afocal lens 4 via the diffractive optical element 3 for annular illumination, for example.

  The afocal lens 4 is set so that the front focal position thereof and the position of the diffractive optical element 3 substantially coincide with each other, and the rear focal position thereof substantially coincides with the position of the predetermined surface 5 indicated by a broken line in the drawing. System (non-focal optical system). The diffractive optical element 3 is formed by forming a step having a pitch of about the wavelength of exposure light (illumination light) on the substrate, and has a function of diffracting an incident beam to a desired angle. Specifically, the diffractive optical element 3 for annular illumination has a function of forming an annular light intensity distribution in the far field (or Fraunhofer diffraction region) when a parallel light beam having a rectangular cross section is incident. Have

  Therefore, the substantially parallel light beam incident on the diffractive optical element 3 is emitted from the afocal lens 4 with a ring-shaped angular distribution after forming a ring-shaped light intensity distribution on the pupil plane of the afocal lens 4. In the optical path between the front lens group 4a and the rear lens group 4b of the afocal lens 4, a correction filter 6 is disposed at or near the pupil position. The correction filter 6 has a shape of a plane parallel plate, and a dense pattern of light-shielding dots made of chromium, chromium oxide or the like is formed on the optical surface thereof. That is, the correction filter 6 has a transmittance distribution with different transmittances depending on the incident position of light. The specific operation of the correction filter 6 will be described later.

  The light passing through the afocal lens 4 passes through a zoom lens 7 for varying a σ value (σ value = mask-side numerical aperture of the illumination optical system / mask-side numerical aperture of the projection optical system), and is a micro fly as an optical integrator. The light enters the eye lens (or fly eye lens) 8. The micro fly's eye lens 8 is, for example, an optical element composed of a large number of micro lenses having positive refracting power arranged vertically and horizontally and densely, and by performing etching treatment on a parallel plane plate, a micro lens group is formed. It is configured.

  Each micro lens constituting the micro fly's eye lens is smaller than each lens element constituting the fly eye lens. Further, unlike a fly-eye lens composed of lens elements isolated from each other, a micro fly-eye lens is formed integrally with a large number of micro lenses (micro refractive surfaces) without being isolated from each other. However, the micro fly's eye lens is the same wavefront division type optical integrator as the fly eye lens in that lens elements having positive refractive power are arranged vertically and horizontally. As the micro fly's eye lens 8, for example, a cylindrical micro fly's eye lens can be used. The configuration and action of the cylindrical micro fly's eye lens are disclosed in, for example, US Pat. No. 6,913,373.

  The position of the predetermined surface 5 is disposed at or near the front focal position of the zoom lens 7, and the incident surface of the micro fly's eye lens 8 is disposed at or near the rear focal position of the zoom lens 7. In other words, the zoom lens 7 arranges the predetermined surface 5 and the incident surface of the micro fly's eye lens 8 substantially in a Fourier transform relationship, and consequently the pupil surface of the afocal lens 4 and the incident surface of the micro fly's eye lens 8. Are arranged almost conjugate optically.

  Accordingly, on the incident surface of the micro fly's eye lens 8, for example, a ring-shaped illumination field centered on the optical axis AX is formed in the same manner as the pupil surface of the afocal lens 4. The overall shape of the annular illumination field changes in a similar manner depending on the focal length of the zoom lens 7. The incident surface (that is, the unit wavefront dividing surface) of each microlens in the micro fly's eye lens 8 is a rectangular shape having a long side along the Z direction and a short side along the X direction, for example. It has a rectangular shape similar to the shape of the illumination area to be formed above (and thus the shape of the exposure area to be formed on the wafer W).

  The light beam incident on the micro fly's eye lens 8 is two-dimensionally divided, and an illumination field formed on the incident surface of the micro fly's eye lens 8 at the rear focal plane or a position in the vicinity thereof (and hence the position of the illumination pupil). A secondary light source having substantially the same light intensity distribution as the light source, that is, a secondary light source (pupil intensity distribution) composed of a ring-shaped substantial surface light source centered on the optical axis AX. A fin member 9 as a light shielding member is disposed at or near the rear focal plane of the micro fly's eye lens 8. The configuration and operation of the fin member 9 will be described later.

  An illumination aperture stop (not shown) having a ring-shaped opening (light transmitting part) corresponding to a ring-shaped secondary light source on the rear focal plane of the micro fly's eye lens 8 or in the vicinity thereof if necessary. ) Is arranged. The illumination aperture stop is configured to be detachable with respect to the illumination optical path, and is configured to be switchable with a plurality of aperture stops having apertures having different sizes and shapes. As an aperture stop switching method, for example, a well-known turret method or slide method can be used. The illumination aperture stop is disposed at a position optically conjugate with an entrance pupil plane of the projection optical system PL described later, and defines a range that contributes to illumination of the secondary light source.

  The light that has passed through the micro fly's eye lens 8 and the fin member 9 illuminates the mask blind 11 in a superimposed manner via the condenser optical system 10. Thus, a rectangular illumination field corresponding to the shape and focal length of the microlens of the micro fly's eye lens 8 is formed on the mask blind 11 as an illumination field stop. The light that has passed through the rectangular opening (light transmission portion) of the mask blind 11 passes through the imaging optical system 12 including the front lens group 12a and the rear lens group 12b, and the mask M on which a predetermined pattern is formed. Are illuminated in a superimposed manner. That is, the imaging optical system 12 forms an image of the rectangular opening of the mask blind 11 on the mask M.

  A pattern to be transferred is formed on the mask M held on the mask stage MS, and a rectangular shape having a long side along the Y direction and a short side along the X direction in the entire pattern region ( The pattern area of the slit shape is illuminated. The light transmitted through the pattern area of the mask M forms an image of the mask pattern on the wafer (photosensitive substrate) W held on the wafer stage WS via the projection optical system PL. That is, a rectangular stationary image having a long side along the Y direction and a short side along the X direction on the wafer W so as to optically correspond to the rectangular illumination area on the mask M. A pattern image is formed in the exposure area (effective exposure area).

  Thus, according to the so-called step-and-scan method, the mask stage MS and the wafer stage WS along the X direction (scanning direction) in the plane (XY plane) orthogonal to the optical axis AX of the projection optical system PL, As a result, by moving (scanning) the mask M and the wafer W synchronously, the wafer W has a width equal to the dimension in the Y direction of the static exposure region and corresponds to the scanning amount (movement amount) of the wafer W. A mask pattern is scanned and exposed to a shot area (exposure area) having a length.

  In the present embodiment, as described above, the secondary light source formed by the micro fly's eye lens 8 is used as a light source, and the mask M arranged on the irradiated surface of the illumination optical system (2 to 12) is Koehler illuminated. For this reason, the position where the secondary light source is formed is optically conjugate with the position of the aperture stop AS of the projection optical system PL, and the formation surface of the secondary light source is the illumination pupil plane of the illumination optical system (2 to 12). Can be called. Typically, the irradiated surface (the surface on which the mask M is disposed or the surface on which the wafer W is disposed when the illumination optical system including the projection optical system PL is considered) is optical with respect to the illumination pupil plane. A Fourier transform plane.

  The pupil intensity distribution is a light intensity distribution (luminance distribution) on the illumination pupil plane of the illumination optical system (2 to 12) or a plane optically conjugate with the illumination pupil plane. When the number of wavefront divisions by the micro fly's eye lens 8 is relatively large, the overall light intensity distribution formed on the incident surface of the micro fly's eye lens 8 and the overall light intensity distribution of the entire secondary light source (pupil intensity distribution). ) And a high correlation. For this reason, the light intensity distribution on the incident surface of the micro fly's eye lens 8 and the surface optically conjugate with the incident surface can also be referred to as a pupil intensity distribution. In the configuration of FIG. 1, the diffractive optical element 3, the afocal lens 4, the zoom lens 7, and the micro fly's eye lens 8 are distribution forming optics that form a pupil intensity distribution in the illumination pupil behind the micro fly's eye lens 8. The system is configured.

  In place of the diffractive optical element 3 for annular illumination, a plurality of diffractive optical elements (not shown) for multipole illumination (two-pole illumination, four-pole illumination, octupole illumination, etc.) are set in the illumination optical path. Polar lighting can be performed. A diffractive optical element for multipole illumination forms a light intensity distribution of multiple poles (bipolar, quadrupole, octupole, etc.) in the far field when a parallel light beam having a rectangular cross section is incident. It has the function to do. Accordingly, the light beam that has passed through the diffractive optical element for multipole illumination is incident on the incident surface of the micro fly's eye lens 8 from, for example, an illumination field having a plurality of predetermined shapes (arc shape, circular shape, etc.) centered on the optical axis AX. To form a multipolar illuminator. As a result, the same multipolar secondary light source as the illumination field formed on the incident surface is also formed on or near the rear focal plane of the micro fly's eye lens 8.

  Moreover, instead of the diffractive optical element 3 for annular illumination, a normal circular illumination can be performed by setting a diffractive optical element (not shown) for circular illumination in the illumination optical path. The diffractive optical element for circular illumination has a function of forming a circular light intensity distribution in the far field when a parallel light beam having a rectangular cross section is incident. Therefore, the light beam that has passed through the diffractive optical element for circular illumination forms, for example, a circular illumination field around the optical axis AX on the incident surface of the micro fly's eye lens 8. As a result, a secondary light source having the same circular shape as the illumination field formed on the incident surface is also formed on or near the rear focal plane of the micro fly's eye lens 8. Also, instead of the diffractive optical element 3 for annular illumination, various forms of modified illumination can be performed by setting a diffractive optical element (not shown) having appropriate characteristics in the illumination optical path. As a switching method of the diffractive optical element 3, for example, a known turret method or slide method can be used.

  In the following description, in order to facilitate understanding of the operational effects of the present embodiment, a quadrupole pupil as shown in FIG. It is assumed that an intensity distribution (secondary light source) 20 is formed. In addition, it is assumed that the single fin member 9 is disposed immediately after the formation surface of the quadrupole pupil intensity distribution 20. Further, in the following description, the term “illumination pupil” simply refers to the illumination pupil in the rear focal plane of the micro fly's eye lens 8 or in the vicinity thereof.

  Referring to FIG. 2, a quadrupole pupil intensity distribution 20 formed on the illumination pupil has a pair of arc-shaped substantial surface light sources (hereinafter simply referred to as “a” and “a”) spaced apart in the X direction across the optical axis AX. 20a, 20b) and a pair of arcuate substantial surface light sources 20c, 20d spaced apart in the Z direction across the optical axis AX. The X direction in the illumination pupil is the short side direction of the rectangular microlens of the micro fly's eye lens 8 and corresponds to the scanning direction of the wafer W. The Z direction in the illumination pupil is the long side direction of the rectangular microlens of the micro fly's eye lens 8 and corresponds to the scanning orthogonal direction (Y direction on the wafer W) perpendicular to the scanning direction of the wafer W. ing.

  On the wafer W, as shown in FIG. 3, a rectangular still exposure region ER having a long side along the Y direction and a short side along the X direction is formed. Correspondingly, a rectangular illumination area (not shown) is formed on the mask M. Here, the quadrupole pupil intensity distribution formed on the illumination pupil by light incident on one point in the still exposure region ER has substantially the same shape without depending on the position of the incident point. However, the light intensity of each surface light source constituting the quadrupole pupil intensity distribution tends to differ depending on the position of the incident point.

  Specifically, as shown in FIG. 4, in the case of a quadrupole pupil intensity distribution 21 formed by light incident on the central point P1 in the still exposure region ER, the surface light source 21c and the surface light source 21c spaced apart in the Z direction and The light intensity of 21d tends to be higher than the light intensity of the surface light sources 21a and 21b spaced apart in the X direction. On the other hand, as shown in FIG. 5, in the case of a quadrupole pupil intensity distribution 22 formed by light incident on peripheral points P2 and P3 spaced from the central point P1 in the still exposure region ER in the Y direction, The light intensities of the surface light sources 22c and 22d spaced in the Z direction tend to be smaller than the light intensities of the surface light sources 22a and 22b spaced in the X direction.

  In general, regardless of the outer shape of the pupil intensity distribution formed on the illumination pupil, the pupil intensity distribution related to the center point P1 in the still exposure region ER on the wafer W (the pupil formed on the illumination pupil by the light incident on the center point P1). As shown in FIG. 6A, the light intensity distribution along the Z direction of the intensity distribution has a concave curve distribution that is the smallest at the center and increases toward the periphery. On the other hand, the light intensity distribution along the Z direction of the pupil intensity distribution related to the peripheral points P2 and P3 in the static exposure region ER on the wafer W is the largest at the center and toward the periphery as shown in FIG. It has a decreasing convex curve distribution.

  The light intensity distribution along the Z direction of the pupil intensity distribution does not depend much on the position of the incident point along the X direction (scanning direction) in the still exposure region ER, but the Y direction in the still exposure region ER. There is a tendency to change depending on the position of the incident point along the (scanning orthogonal direction). As described above, when the pupil intensity distribution (pupil intensity distribution formed on the illumination pupil by the light incident on each point) on each point in the still exposure region ER on the wafer W is not substantially uniform, for each position on the wafer W. Further, the line width of the pattern varies, and the fine pattern of the mask M cannot be faithfully transferred onto the wafer W with a desired line width over the entire exposure region.

  In the present embodiment, as described above, the correction filter 6 having a transmittance distribution with different transmittance according to the incident position of light is disposed at or near the pupil position of the afocal lens 4. The pupil position of the afocal lens 4 is optically conjugate with the incident surface of the micro fly's eye lens 8 by the rear lens group 4b and the zoom lens 7. Therefore, the light intensity distribution formed on the incident surface of the micro fly's eye lens 8 is adjusted (corrected) by the action of the correction filter 6, and as a result, formed on the rear focal plane of the micro fly's eye lens 8 or the illumination pupil in the vicinity thereof. The pupil intensity distribution to be adjusted is also adjusted.

  However, the correction filter 6 uniformly adjusts the pupil intensity distribution for each point in the still exposure region ER on the wafer W without depending on the position of each point. As a result, by the action of the correction filter 6, for example, adjustment is made so that the quadrupole pupil intensity distribution 21 with respect to the center point P <b> 1 becomes substantially uniform, and thus the light intensities of the surface light sources 21 a to 21 d become substantially equal to each other. In this case, however, the difference in light intensity between the surface light sources 22a and 22b and the surface light sources 22c and 22d in the quadrupole pupil intensity distribution 22 with respect to the peripheral points P2 and P3 becomes larger.

  That is, in order to adjust the pupil intensity distribution relating to each point in the static exposure region ER on the wafer W almost uniformly by the action of the correction filter 6, the pupil intensity relating to each point may be adjusted by means other than the correction filter 6. It is necessary to adjust the distribution to distributions having the same properties. Specifically, for example, in the pupil intensity distribution 21 related to the center point P1 and the pupil intensity distribution 22 related to the peripheral points P2 and P3, the magnitude relationship between the light intensities of the surface light sources 21a and 21b and the surface light sources 21c and 21d and the surface light sources 22a and 22a. It is necessary to match the magnitude relationship of the light intensity between 22b and the surface light sources 22c and 22d at substantially the same ratio.

  In the present embodiment, in order to make the properties of the pupil intensity distribution related to the center point P1 and the properties of the pupil intensity distribution related to the peripheral points P2 and P3 substantially coincide, the surface light sources 22a and 22b in the pupil intensity distribution 22 related to the peripheral points P2 and P3. A fin member 9 is provided as a light shielding member for adjusting the light intensity so that the light intensity is smaller than the light intensity of the surface light sources 22c and 22d. 7 and 8 are views for explaining the operation of the fin member 9 of the present embodiment. FIG. 9 is a diagram illustrating a light attenuation rate characteristic of the fin member 9 of the present embodiment.

  As shown in FIG. 2, the fin member 9 has a plate-like form, and extends along the X direction so as to correspond to a pair of surface light sources 20 a and 20 b spaced apart in the X direction across the optical axis AX. It is positioned. Specifically, the fin member 9 has, for example, a form of a parallel plane plate having a rectangular outer shape, and its thickness direction (Z direction) is substantially parallel to the plane of the illumination pupil (XZ plane), and They are arranged such that the width direction (Y direction) is substantially parallel to the direction of the optical axis AX. That is, the thickness direction of the fin member 9 substantially coincides with the long side direction of the rectangular unit wavefront dividing surface of the micro fly's eye lens 8.

  Therefore, in the quadrupole pupil intensity distribution 20, light from the surface light sources 20 a and 20 b is affected by the fin member 9, but light from the surface light sources 20 c and 20 d is not affected by the fin member 9. In this case, as shown in FIG. 7, the light reaching the center point P 1 in the static exposure region ER on the wafer W, that is, the light reaching the center point P 1 ′ of the opening of the mask blind 11, Since the light enters the XZ plane on the side end face at an incident angle of 0, the amount of light blocked by the fin member 9 is small. In other words, the light attenuation rate of the fin member 9 of light from the surface light sources 21a and 21b of the pupil intensity distribution 21 with respect to the center point P1 is a value close to 0%.

  On the other hand, as shown in FIG. 8, the light reaching the peripheral points P2 and P3 in the static exposure region ER on the wafer W, that is, the light reaching the peripheral points P2 ′ and P3 ′ of the opening of the mask blind 11 is 9 is incident at an incident angle of ± θ on the XZ plane on the end face on the illumination pupil side, so that the amount of light blocked by the fin member 9 is relatively large. In other words, the dimming rate of the fin member 9 for light from the surface light sources 22a and 22b of the pupil intensity distribution 22 with respect to the peripheral points P2 and P3 is a relatively large value according to the magnitude of the absolute value of the incident angle ± θ. become.

  In this way, the light attenuation rate by the fin member 9 of light directed to one point on the stationary exposure region ER that is the irradiated surface is as shown in FIG. 9 with respect to the XZ plane on the end face of the fin member 9 on the illumination pupil side. It is configured to increase in accordance with the magnitude of the absolute value of the incident angle, that is, to increase from the center to the periphery of the static exposure region ER. More specifically, the fin member 9 as a light shielding member is stationary along the long side direction (Z direction: Y direction on the stationary exposure region ER) of the rectangular unit wavefront dividing surface of the micro fly's eye lens 8. The dimming rate is configured to increase from the center of the exposure region ER to the periphery.

  7 and 8, reference numeral B1 indicates the outermost point (see FIG. 2) along the X direction of the surface light source 20a (21a, 22a), and reference numeral B2 indicates the surface light source 20b (21b, 21b, 21a, 22a). 22b) shows the outermost point along the X direction (see FIG. 2). Further, in order to facilitate understanding of the explanation related to FIGS. 7 and 8, the point of the outermost edge along the Z direction of the surface light source 20c (21c, 22c) is indicated by reference numeral B3, and the surface light source 20d (21d, 21d, The point of the outermost edge along the Z direction of 22d) is indicated by reference numeral B4. However, as described above, the light from the surface light source 20c (21c, 22c) and the surface light source 20d (21d, 22d) does not receive the dimming action of the fin member 9.

  Thus, in the pupil intensity distribution 21 related to the center point P1, the light from the surface light sources 21a and 21b is subjected to the dimming action of the fin member 9, but the light intensity hardly changes. Since the light from the surface light sources 21c and 21d does not receive the dimming action of the fin member 9, the light intensity does not change. As a result, as shown in FIG. 10, the pupil intensity distribution 21 related to the center point P1 is slightly adjusted to a pupil intensity distribution 21 ′ having substantially the same properties as the original distribution 21 even when the fin member 9 is dimmed. It is only done. That is, also in the pupil intensity distribution 21 ′ adjusted by the fin member 9, the light intensity of the surface light sources 21c and 21d spaced in the Z direction is higher than that of the surface light sources 21a ′ and 21b ′ spaced in the X direction. Properties greater than light intensity are maintained.

  On the other hand, in the pupil intensity distribution 22 related to the peripheral points P2 and P3, the light from the surface light sources 22a and 22b is subjected to the dimming action of the fin member 9, and the light intensity decreases. Since the light from the surface light sources 22c and 22d does not receive the dimming action of the fin member 9, the light intensity does not change. As a result, the pupil intensity distribution 22 related to the peripheral points P2 and P3 is adjusted to a pupil intensity distribution 22 'having a different property from the original distribution 22 by the dimming action of the fin member 9, as shown in FIG. That is, in the pupil intensity distribution 22 ′ adjusted by the fin member 9, the light intensity of the surface light sources 22c and 22d spaced in the Z direction is the light of the surface light sources 22a ′ and 22b ′ spaced in the X direction. It changes to a property larger than strength.

  Thus, due to the dimming action of the fin member 9, the pupil intensity distribution 22 relating to the peripheral points P2 and P3 is adjusted to a distribution 22 'having substantially the same properties as the pupil intensity distribution 21' relating to the center point P1. Similarly, the pupil intensity distribution for each point arranged along the Y direction between the center point P1 and the peripheral points P2 and P3, and hence the pupil intensity distribution for each point in the still exposure region ER on the wafer W is also the center. The distribution is adjusted to a distribution having substantially the same property as the pupil intensity distribution 21 ′ relating to the point P1. In other words, the pupil intensity distribution for each point in the still exposure region ER on the wafer W is adjusted to a distribution having substantially the same property by the dimming action of the fin member 9. In other words, the fin member 9 has a required dimming rate characteristic necessary for adjusting the pupil intensity distribution for each point to a distribution having substantially the same property.

  As described above, the illumination optical system according to the present embodiment has a required dimming rate characteristic that changes according to the incident position of light on the static exposure region ER on the wafer W, and each of the optical components in the static exposure region ER. The pupil intensity distribution for each point is obtained by the cooperative action of the fin member 9 that independently adjusts the pupil intensity distribution for each point and the correction filter 6 that uniformly adjusts the pupil intensity distribution for each point in the still exposure region ER. Can be adjusted substantially uniformly. Therefore, the exposure apparatus (1 to WS) of the present embodiment uses the illumination optical system (2 to 12) that adjusts the pupil intensity distribution at each point in the static exposure region ER on the wafer W almost uniformly. Therefore, it is possible to perform good exposure under appropriate illumination conditions according to the fine pattern of the mask M. As a result, the fine pattern of the mask M is faithfully applied on the wafer W with a desired line width over the entire exposure region. Can be transferred to.

  In the present embodiment, it is conceivable that the light amount distribution on the wafer (irradiated surface) W is affected by, for example, the dimming action (adjusting action) of the fin member 9. In this case, the illuminance distribution in the still exposure region ER or the shape of the still exposure region (illumination region) ER can be changed as necessary by the action of the light quantity distribution adjusting unit having a known configuration. Specifically, as the light amount distribution adjusting unit for changing the illuminance distribution, configurations described in Japanese Patent Application Laid-Open Nos. 2001-313250 and 2002-1000056 (and US Pat. Nos. 6,771,350 and 6927836 corresponding thereto). And techniques can be used. Further, as the light amount distribution adjusting unit for changing the shape of the illumination area, the configuration and method described in the pamphlet of International Patent Publication No. WO2005 / 048326 (and the corresponding US Patent Publication No. 2007/0014112) are used. Can do.

  In the above-described embodiment, the single fin member 9 is disposed immediately after the formation surface of the quadrupole pupil intensity distribution 20. However, the present invention is not limited to this, and for example, as shown in FIG. 12, a required number (three in the example of FIG. 12) of fin members 9 may be arranged as necessary. In FIG. 12A, three fin members 9 act on the light from the pair of surface light sources 30a and 30b in the quadrupole pupil intensity distribution 30 having a large outer diameter. In FIG. 12B, only the central fin member 9 acts on the light from the pair of surface light sources 31a and 31b in the quadrupole pupil intensity distribution 31 having a small outer diameter.

  2 and 12, one or a plurality of fin members 9 are arranged along the short side direction (X direction) of the rectangular unit wavefront dividing surface of the micro fly's eye lens 8. However, the present invention is not limited to this, and the fin member 9 may be slightly inclined with respect to the short side direction of the unit wavefront dividing surface. In other words, the fin member 9 may be slightly inclined with respect to the arrangement direction (short side direction or long side direction) of the lens elements of the micro fly's eye lens 8. In general, various forms are possible for the outer shape, number, arrangement, and the like of the fin member 9.

  Further, in the above-described embodiment, the fin member 9 having a rectangular outer shape and a parallel plane plate shape, that is, the dimension in the width direction (Y direction in FIG. 2) is in the length direction (X direction in FIG. 2). A fin member 9 is used which is constant along. However, the present invention is not limited to this. Fins whose dimensions in the width direction change discontinuously along the length direction, for example, as shown in FIG. The member 9 can also be used. For example, as shown in FIG. 13B, a plurality of fin members 9 having different dimensions in the width direction (three in the example in FIG. 13B) can be used.

  2 and 12, one or more fin members 9 are arranged one-dimensionally along one direction. However, the present invention is not limited to this, and the plurality of fin members 9 can be two-dimensionally arranged as necessary. That is, for example, as shown in FIGS. 14A and 14B, one or more fin members 9H are arranged along one direction (horizontal direction in the figure), and one or more fin members 9V are arranged. You may arrange | position along the other direction (vertical direction in a figure). 14A, the three fin members 9H and the three fin members 9V are integrally formed, and in FIG. 14B, the three fin members 9H and the three fin members 9V are arranged at the front and rear.

  In order to position and hold the one or more fin members 9 at predetermined positions in the illumination optical path, for example, a holding member 50 as shown in FIG. 15 can be used. The holding member 50 includes an annular main body 51 and a pair of holders 52 provided at positions opposed to the main body 51 in the radial direction. One or more fin members 9 are attached to the pair of holders 52.

  For example, as shown in FIG. 15, a holding member 50 to which one or a plurality of fin members 9 are attached can be used as one light shielding unit, and a plurality of light shielding units having different characteristics can be configured to be replaceable. As an example, a light shielding unit including a holding member 50A to which a fin member 9A having a certain dimension in the width direction along the length direction as shown in FIG. 16A is attached, and as shown in FIG. It is possible to replace the light-shielding unit including the holding member 50B to which the plurality of fin members 9B having different dimensions in the width direction are attached. At this time, the length direction of the fin member in the state where each light shielding unit is attached to the illumination optical path can be appropriately selected.

  In the holding member shown in FIGS. 15 and 16, the relative positional relationship between the plurality of fin members is fixed unless a special measure is taken. When it is necessary to change the relative positional relationship between the plurality of fin members, a holding member 60 as shown in FIG. 17 can be used. The holding member 60 includes an annular main body 61 and three pairs of holders 62 provided at positions opposed to the radial direction of the main body 61. One fin member 9 is attached to each pair of holders 62.

  For example, as shown in FIG. 18, the holder 62 reciprocates the shaft 62a to which one end of the fin member 9 is attached, and the shaft 62a in the direction of the arrow F1. And an operation unit 62b for reciprocating in the direction. In the holding member 60, the relative positional relationship between the plurality of fin members 9 can be appropriately changed by changing the position of one end of the fin member 9 in each holder 62.

  In the above-described embodiment, the fin member 9 whose outer shape is fixed and unchanged is used. However, the present invention is not limited to this. For example, as shown in FIG. 19, a configuration in which a tape-like fin member 9C whose width dimension or thickness dimension changes along the length direction is wound or unwound is also possible. . In this configuration, it is possible to vary the width dimension and thickness dimension of the fin member positioned in the illumination optical path, that is, to vary the outer shape of the fin member.

  Moreover, in the above-mentioned embodiment, the fin member 9 which has the form of a plane parallel plate, ie, a plate shape, is used as a light shielding member. However, the present invention is not limited to this, and for example, a light shielding member having the form of the side surface 90a of the plane parallel plate 90 as shown in FIG. 20 can be used. In the plane parallel plate unit 90U shown in FIG. 20, the side surfaces 90a of the four plane parallel plate 90 are exemplarily brought into contact with each other. However, in the plane parallel plate unit 90U, it is important that the contact between the side surfaces 90a does not depend on the optical contact.

  As shown in FIG. 21, the plane parallel plate unit 90 </ b> U is disposed, for example, immediately after the formation surface of the quadrupole pupil intensity distribution. At this time, the plane parallel plate unit 90U is positioned so that the side surface 90a as the light shielding member corresponds to a state in which the thickness of the fin member 9 shown in FIGS. That is, the thickness direction (Z direction) of the side surface 90a as the light shielding member is substantially parallel to the surface of the illumination pupil (XZ plane), and the width direction (Y direction) of the side surface 90a is substantially parallel to the direction of the optical axis AX. It is.

  Therefore, as shown in FIG. 21, the light reaching the peripheral points P2 and P3 in the static exposure region ER on the wafer W, that is, the light reaching the peripheral points P2 ′ and P3 ′ of the opening of the mask blind 11 is blocked by the light shielding member. As a side surface 90a. On the other hand, although not shown, the light reaching the center P1 in the static exposure region ER on the wafer W, that is, the light reaching the center P1 ′ of the opening of the mask blind 11 is almost blocked by the side surface 90a as a light shielding member. Absent.

  In this way, in the example using the side surface 90a as the light shielding member, the light attenuation rate by the side surface 90a of light toward one point on the stationary exposure region ER that is the irradiated surface is the same as in the embodiment using the fin member 9. The exposure area ER is configured to increase from the center to the periphery. As a result, even in the example using the plane parallel plate unit 90U, the same effect as that of the embodiment using the fin member 9 can be obtained.

  In the above description, the operational effects of the present invention are described by taking, as an example, modified illumination in which a quadrupole pupil intensity distribution is formed on the illumination pupil, that is, quadrupole illumination. However, the present invention is not limited to quadrupole illumination. For example, annular illumination in which an annular pupil intensity distribution is formed, multipolar illumination in which a multipolar pupil intensity distribution other than quadrupole is formed, and the like. In contrast, it is apparent that the same effects can be obtained by applying the present invention.

  In the above description, the light shielding member (fin member 9, side surface 90a) is disposed immediately behind the rear focal plane of the micro fly's eye lens 8 or the illumination pupil in the vicinity thereof. However, the present invention is not limited to this, and the light shielding member can be disposed immediately before the rear focal plane of the micro fly's eye lens 8 or the illumination pupil in the vicinity thereof. Further, the light is blocked immediately before or immediately after another illumination pupil behind the micro fly's eye lens 8, for example, immediately before or immediately after the illumination pupil between the front lens group 12a and the rear lens group 12b of the imaging optical system 12. Members can also be placed. When the light shielding member is disposed at the position of the illumination pupil, since the light shielding member has a width dimension along the optical axis direction, it can be considered that the light shielding member is disposed immediately before and after the illumination pupil. .

  The exposure apparatus of the above-described embodiment is manufactured by assembling various subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Is done. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  Next, a device manufacturing method using the exposure apparatus according to the above-described embodiment will be described. FIG. 22 is a flowchart showing a manufacturing process of a semiconductor device. As shown in FIG. 22, in the semiconductor device manufacturing process, a metal film is vapor-deposited on a wafer W to be a semiconductor device substrate (step S40), and a photoresist, which is a photosensitive material, is applied on the vapor-deposited metal film. (Step S42). Subsequently, using the exposure apparatus of the above-described embodiment, the pattern formed on the mask (reticle) M is transferred to each shot area on the wafer W (step S44: exposure process), and the transfer of the wafer W after the transfer is completed. Development, that is, development of the photoresist to which the pattern has been transferred is performed (step S46: development process). Thereafter, using the resist pattern generated on the surface of the wafer W in step S46 as a mask, processing such as etching is performed on the surface of the wafer W (step S48: processing step).

  Here, the resist pattern is a photoresist layer in which unevenness having a shape corresponding to the pattern transferred by the exposure apparatus of the above-described embodiment is generated, and the recess penetrates the photoresist layer. is there. In step S48, the surface of the wafer W is processed through this resist pattern. The processing performed in step S48 includes, for example, at least one of etching of the surface of the wafer W or film formation of a metal film or the like. In step S44, the exposure apparatus of the above-described embodiment performs pattern transfer using the wafer W coated with the photoresist as the photosensitive substrate, that is, the plate P.

  FIG. 23 is a flowchart showing manufacturing steps of a liquid crystal device such as a liquid crystal display element. As shown in FIG. 23, in the liquid crystal device manufacturing process, a pattern formation process (step S50), a color filter formation process (step S52), a cell assembly process (step S54), and a module assembly process (step S56) are sequentially performed.

  In the pattern forming process of step S50, a predetermined pattern such as a circuit pattern and an electrode pattern is formed on the glass substrate coated with a photoresist as the plate P using the exposure apparatus of the above-described embodiment. In this pattern formation process, an exposure process for transferring the pattern to the photoresist layer using the exposure apparatus of the above-described embodiment and development of the plate P to which the pattern is transferred, that is, development of the photoresist layer on the glass substrate are performed. And a developing step for generating a photoresist layer having a shape corresponding to the pattern, and a processing step for processing the surface of the glass substrate through the developed photoresist layer.

  In the color filter forming step of step S52, a large number of sets of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix or three R, G, and B A color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning direction.

  In the cell assembly process in step S54, a liquid crystal panel (liquid crystal cell) is assembled using the glass substrate on which the predetermined pattern is formed in step S50 and the color filter formed in step S52. Specifically, for example, a liquid crystal panel is formed by injecting liquid crystal between a glass substrate and a color filter. In the module assembling process in step S56, various components such as an electric circuit and a backlight for performing the display operation of the liquid crystal panel are attached to the liquid crystal panel assembled in step S54.

  In addition, the present invention is not limited to application to an exposure apparatus for manufacturing a semiconductor device, for example, an exposure apparatus for a display device such as a liquid crystal display element formed on a square glass plate or a plasma display, It can also be widely applied to an exposure apparatus for manufacturing various devices such as an image sensor (CCD or the like), a micromachine, a thin film magnetic head, and a DNA chip. Furthermore, the present invention can also be applied to an exposure process (exposure apparatus) when manufacturing a mask (photomask, reticle, etc.) on which mask patterns of various devices are formed using a photolithography process.

In the above-described embodiment, ArF excimer laser light (wavelength: 193 nm) or KrF excimer laser light (wavelength: 248 nm) is used as the exposure light. However, the present invention is not limited to this, and other appropriate laser light sources are used. For example, the present invention can also be applied to an F ₂ laser light source that supplies laser light having a wavelength of 157 nm.

  In the above-described embodiment, the present invention is applied to a step-and-scan type exposure apparatus that scans and exposes the pattern of the mask M on the shot area of the wafer W. However, the present invention is not limited to this, and the present invention can also be applied to a step-and-repeat type exposure apparatus that repeats the operation of collectively exposing the pattern of the mask M to each exposure region of the wafer W.

  In the above-described embodiment, the present invention is applied to the illumination optical system that illuminates the mask or wafer in the exposure apparatus. However, the present invention is not limited to this, and the irradiated surface other than the mask or wafer is illuminated. The present invention can also be applied to a general illumination optical system.

1 Light Source 3 Diffractive Optical Element 4 Afocal Lens 6 Correction Filter 7 Zoom Lens 8 Micro Fly Eye Lens (Optical Integrator)
9 Fin member (light shielding member)
10 Condenser optical system 11 Mask blind 12 Imaging optical system M Mask PL Projection optical system AS Aperture stop W Wafer

Claims (25)

In the illumination optical system that illuminates the illuminated surface with light from the light source,
A distribution forming optical system having an optical integrator and forming a pupil intensity distribution in an illumination pupil on the rear side of the optical integrator;
A light shielding member disposed at a position immediately before or immediately after the illumination pupil,
The illumination optical system characterized in that the light shielding member is configured such that a light reduction rate of the light directed to one point on the illuminated surface by the light shielding member increases from the center to the periphery of the illuminated surface. . The light shielding member has a plate shape, the thickness direction of the light shielding member is substantially parallel to the surface of the illumination pupil, and the width direction of the light shielding member is substantially parallel to the optical axis direction of the illumination optical system. The illumination optical system according to claim 1, wherein the illumination optical system is provided. The light shielding member has a shape of a side surface of a plane parallel plate, the thickness direction of the light shielding member is substantially parallel to the surface of the illumination pupil, and the width direction of the light shielding member is the optical axis direction of the illumination optical system. The illumination optical system according to claim 1, wherein the illumination optical system is substantially parallel. The optical integrator has an elongated rectangular unit wavefront dividing surface along a predetermined direction,
4. The illumination optical system according to claim 2, wherein a thickness direction of the light shielding member substantially coincides with the predetermined direction. The optical integrator has an elongated rectangular unit wavefront dividing surface along a predetermined direction,
4. The illumination optical system according to claim 1, wherein the light shielding member is configured so that the light attenuation rate increases from a center to a periphery along the predetermined direction. 5. The illumination optical system according to claim 2, 4 or 5, wherein a dimension in the width direction of the light shielding member changes along a length direction of the light shielding member. The illumination optical system according to claim 1, comprising a plurality of the light shielding members. A plurality of the light shielding members;
6. The illumination optical system according to claim 2, wherein a dimension in the width direction of the first light shielding member among the plurality of light shielding members is different from a dimension in the width direction of the second light shielding member. The light shielding member is positioned so as to act on light from a pair of regions spaced in a direction orthogonal to the predetermined direction across the optical axis of the illumination optical system in the illumination pupil. The illumination optical system according to any one of claims 4 to 8. The light quantity distribution adjustment part which changes the illumination intensity distribution on the said to-be-irradiated surface or the shape of the illumination area | region formed on the to-be-irradiated surface is further provided. Lighting optics. The illumination optical system according to claim 10, wherein the light amount distribution adjusting unit corrects an influence on the light amount distribution on the irradiated surface by the light shielding member. In the illumination optical system that illuminates the illuminated surface with light from the light source,
A distribution forming optical system having an optical integrator and forming a pupil intensity distribution in an illumination pupil on the rear side of the optical integrator;
A light shielding member having a plate-like shape disposed at a position immediately before or after the illumination pupil,
An illumination optical system, wherein a thickness direction of the light shielding member is substantially parallel to a surface of the illumination pupil, and a width direction of the light shielding member is substantially parallel to an optical axis direction of the illumination optical system. The projection pupil is used in combination with a projection optical system that forms a surface optically conjugate with the irradiated surface, and the illumination pupil is at a position optically conjugate with an aperture stop of the projection optical system. The illumination optical system according to any one of 1 to 12. An exposure apparatus comprising the illumination optical system according to claim 1 for illuminating a predetermined pattern, and exposing the predetermined pattern onto a photosensitive substrate. A projection optical system for forming an image of the predetermined pattern on the photosensitive substrate; and moving the predetermined pattern and the photosensitive substrate relative to the projection optical system along a scanning direction to The exposure apparatus according to claim 14, wherein the pattern is exposed to projection on the photosensitive substrate. The illumination optical system according to claim 4 or 5 for illuminating a predetermined pattern;
A projection optical system that forms an image of the predetermined pattern on the photosensitive substrate,
An exposure apparatus that projects and exposes the predetermined pattern onto the photosensitive substrate by moving the predetermined pattern and the photosensitive substrate relative to the projection optical system along a scanning direction.
The exposure apparatus according to claim 15, wherein the predetermined direction in the optical integrator corresponds to a direction orthogonal to the scanning direction. 17. The exposure apparatus according to claim 16, wherein the dimension of the light shielding member in the width direction changes along the length direction of the light shielding member . The exposure apparatus according to claim 16 or 17, comprising a plurality of the light shielding members. A plurality of the light shielding members;
19. The exposure apparatus according to claim 16, wherein a dimension in the width direction of the first light shielding member among the plurality of light shielding members is different from a dimension in the width direction of the second light shielding member. . The light shielding member is positioned so as to act on light from a pair of regions spaced in a direction orthogonal to the predetermined direction across the optical axis of the illumination optical system in the illumination pupil. The exposure apparatus according to any one of claims 16 to 19. 21. The light intensity distribution adjusting unit according to any one of claims 16 to 20, further comprising a light amount distribution adjusting unit that changes an illuminance distribution on the irradiated surface or a shape of an illumination area formed on the irradiated surface. Exposure equipment. The exposure apparatus according to claim 21, wherein the light quantity distribution adjusting unit corrects an influence on the light quantity distribution on the irradiated surface by the light shielding member. An illumination optical system for illuminating a predetermined pattern with light from a light source;
A projection optical system that forms an image of the predetermined pattern on the photosensitive substrate,
An exposure apparatus that projects and exposes the predetermined pattern onto the photosensitive substrate by moving the predetermined pattern and the photosensitive substrate relative to the projection optical system along a scanning direction.
The illumination optical system includes:
A distribution forming optical system having an optical integrator and forming a pupil intensity distribution in an illumination pupil on the rear side of the optical integrator;
A light shielding member having a plate-like shape disposed at a position immediately before or after the illumination pupil,
The light blocking member is configured such that a light reduction rate by the light blocking member of light directed to one point on the irradiated surface increases from the center to the periphery of the irradiated surface,
The thickness direction of the light shielding member is substantially parallel to the surface of the illumination pupil, and the width direction of the light shielding member is substantially parallel to the optical axis direction of the illumination optical system,
The optical integrator has an elongated rectangular unit wavefront dividing surface along a predetermined direction,
The exposure apparatus according to claim 1, wherein the predetermined direction in the optical integrator corresponds to a direction orthogonal to the scanning direction. The exposure apparatus according to any one of claims 15 to 23, wherein the illumination pupil is at a position optically conjugate with an aperture stop of the projection optical system. An exposure step of exposing the predetermined pattern to the photosensitive substrate using the exposure apparatus according to any one of claims 14 to 24;
Developing the photosensitive substrate to which the predetermined pattern is transferred, and forming a mask layer having a shape corresponding to the predetermined pattern on the surface of the photosensitive substrate;
And a processing step of processing the surface of the photosensitive substrate through the mask layer.

Images