TW201251318A - Piezoelectric device and fabricating method of the piezoelectric device - Google Patents

Piezoelectric device and fabricating method of the piezoelectric device Download PDF

Info

Publication number
TW201251318A
TW201251318A TW101119448A TW101119448A TW201251318A TW 201251318 A TW201251318 A TW 201251318A TW 101119448 A TW101119448 A TW 101119448A TW 101119448 A TW101119448 A TW 101119448A TW 201251318 A TW201251318 A TW 201251318A
Authority
TW
Taiwan
Prior art keywords
plate
sealing material
piezoelectric
wafer
piezoelectric element
Prior art date
Application number
TW101119448A
Other languages
English (en)
Chinese (zh)
Inventor
Ryoichi Ichikawa
Yoshiaki Amano
Original Assignee
Nihon Dempa Kogyo Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co filed Critical Nihon Dempa Kogyo Co
Publication of TW201251318A publication Critical patent/TW201251318A/zh

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0595—Holders or supports the holder support and resonator being formed in one body
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • User Interface Of Digital Computer (AREA)
TW101119448A 2011-06-03 2012-05-31 Piezoelectric device and fabricating method of the piezoelectric device TW201251318A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011124837A JP2012253587A (ja) 2011-06-03 2011-06-03 圧電デバイス及び圧電デバイスの製造方法

Publications (1)

Publication Number Publication Date
TW201251318A true TW201251318A (en) 2012-12-16

Family

ID=47234630

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101119448A TW201251318A (en) 2011-06-03 2012-05-31 Piezoelectric device and fabricating method of the piezoelectric device

Country Status (4)

Country Link
US (1) US20120306320A1 (https=)
JP (1) JP2012253587A (https=)
CN (1) CN102811028A (https=)
TW (1) TW201251318A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012217155A (ja) * 2011-03-30 2012-11-08 Nippon Dempa Kogyo Co Ltd 圧電デバイス及び圧電デバイスの製造方法
JP2013258519A (ja) * 2012-06-12 2013-12-26 Nippon Dempa Kogyo Co Ltd 圧電振動片及び圧電デバイス
JP7013767B2 (ja) * 2017-09-25 2022-02-01 Tdk株式会社 振動ユニット
CN111615755B (zh) * 2018-12-25 2023-06-16 株式会社村田制作所 振动结构体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2822846B2 (ja) * 1992-10-29 1998-11-11 関西日本電気株式会社 ガラス−セラミック複合体を用いた水晶振動子用フラットパッケージおよびこれを用いた水晶振動子
JP2005210185A (ja) * 2004-01-20 2005-08-04 Seiko Epson Corp 圧電振動片および圧電デバイスの製造方法
JP4843424B2 (ja) * 2006-09-05 2011-12-21 日本電波工業株式会社 水晶振動子用のガラス封止カバー及びこれを用いた水晶振動子の製造方法
JP5216290B2 (ja) * 2007-09-27 2013-06-19 日本電波工業株式会社 圧電デバイス及び圧電デバイスの製造方法

Also Published As

Publication number Publication date
JP2012253587A (ja) 2012-12-20
CN102811028A (zh) 2012-12-05
US20120306320A1 (en) 2012-12-06

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