201246630 • - . 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種具電路板之LED光學反射結構，尤 指一種可使發光二極體利用金屬反射層之設置，而增加使用時 之變化性，且利用螢光層與金屬反射層之配合，增加發光二極 體發光時之光學穩定度以及亮度，而達到應用範圍廣泛、易於 製作、不易變色、發光效率佳以及降低製作成本之功效者。 【先前技術】 按，一般習用之發光二極體結構，係由一基板、一設於基 板上之框架、一設於基板上之發光二極體、以及封裝於框架中 之螢光層所構成’其中該框架係可由金屬、白色環氧樹脂(ep〇xy) 或白色矽膠(Silicone)等材質所製成，可使框架内之螢光層配合 發光二極體之混光進而反射出所需光源之光色以及亮度。 然而，以習用中金屬、白色環氧樹脂或白色矽膠等材質所 製成框架而言，至少會產生有下列之缺點： 1.金屬框架：雖然金屬材質不易變色因為需要於較厚之金 屬原材上開設孔洞，如此，不但會使得製作過程較為複雜更 會因為大量诮耗金屬而導致有成本較高之情形發生；且使用時 必須配合外部之電路控制，而造成無法增加實際使用時之變化 性。 2’自故氧_旨_ ••雜自色環氧樹騎製成之框架可 改善金雜架成本較高之舰，但是聽㈣躲過紫外線之 長舰射’而有黃變之情形發生，進而影響發光二極體之混光 光色’導致原本之光色變調。 201246630 .· . _ . . ' . 3.白色矽膠框架：雖然對紫外線之長期照射之穩定性較白 色環氧樹脂框架為高，但是由於白色矽膠價格較高且其折射率 以及反鱗金屬差’其加卫過軸#複雜才可結合於基板 上，因此’會有反光功效較差以及成本較高之情形發生。 故以、用之反射框架材質雨言，並無法符合實際製作情 形之所需。 · . 【發明内容】 本發明之主要目的係在於，可使發光二極體利用金屬反射 層之設置，而增加使用時變化性，且利用螢光層與金屬反射層 之配合，增加發光二極體發光時之光學穩定度，而達到應用範 圍廣泛、易於製作、不易變色、發光效率佳以及降低製作成本 之功效。 為達上述之目的’本發明係一種具電路板之LED光學反 射結構其包含有：一基板；一設於基板上之發光二極體；一結 合於基板上且位於發光二極體周緣之電路板，且使發光二極體 與電路板電性連接；一結合於電路板上之框架；至少塗佈於電 路板與框架内側且對應發光二極體之金屬反射層;以及一填充 於電路板與框架中且封閉該發光二極體之螢光層。 於本發明之一實施例中，該基板係可為銅或鋁之材質。 於丰發明之一實施例中，談電路板之底部係配合黏著劑與 基板結合.。..…. - · . ; · 於本發明之一實施例中’該電路板之一面上係可設有電路 佈局層，而該發光二極體#以導線與電路佈局層電性連接。 於本發明之一實施例中’該電路板與框架係可為一分別具 201246630 有相對應鏤空部之環狀體，可使發光二極體位於電路板之鏤空 部中’並將金屬反射層塗佈於電路板與框架之鏤空部内侧緣， 且讓螢光層填充於電路板與框架之鏤空部中。 於本發明冬一實施例中，該電路板係可為兩個相互對應之 板狀體’而該框架係可為兩個相互對應之塊狀體，且使各板狀 體與塊狀體之間分別定義出一相對應之鏤空部，可使發光二極 體位於電路板之鏤空部中’並將金屬反射層塗佈於電路板與框 架之鏤空部内側緣，且讓螢光層填充於電路板與框架之鏤空部 中。 於本發明之一實施例中，該框架之底部係配合黏著劑與電 路板結合。 於本發明之一實施例中’該框架係可為環氧樹脂(epoxy) 之材質。 於本發明之一實施例中，該框架係可為聚亞醯胺 (polyimide)之材質。 於本發明之一實施例中’該框架之材質硌可為環氧樹脂 (epoxy)與玻璃纖維(giass fiber)之混成體。 於本發明之一實施例中，該金屬反射層係可為銀（Ag)材 質所製成。 於本發明之一實施例中’該金屬反射層係可為鎳（Ni)材 質所製成。 【實施方式】 凊參閱『第1及第2圖』所示，係分別為本發明之結合狀 ·%示忍圖及本發明之分鮮狀態示意圖。。如圖所示：本發明係 201246630 . . - ... ， . .... ： . ...;.； . 一種具電路板之LED光學反射結構'其至少包备一墓板i、 • ' . . . · . 一發光二極體2、一電路板3、一框架4、金屬反射層5以及 一螢光層6所構成。 上述所之基板1係可為銅或紹之材質.。. 該發光二極體2係設於基板1上。 該電路板3之底部係配合黏著劑31結奋於基板1上且 位於發光二極體2之周緣，而該電路板3之一面上係可設有電 路佈局層32，可使該發光二極體2以導線21與電路佈局層 3 2電性連接’另該電路板3係可為一具有相鏤空部3 3之環 狀體，或為兩個相互對應之板狀體，可使發光二極體2位於該 鏤空部3 3中。 · . ... · 該框架4之底部係配合黏著劑41結合於電路板3上，其 中該框架4係可為環氧樹脂(epOXy)之材質、聚亞酿胺 (polyimide)之材質、或為環氧樹脂(epoxy)與破璃纖維(g細s fiber) 之混成體，另該框架44可為一具有鏤空部4 2之環狀體，或 為兩個相互對應之塊狀體，而該框架4之鏤空部4 2係與電路 板3之鏤空部33相對應。 各金屬反射層5至少塗佈於電路板3與框架4之鏤空部 3 3、4 2内側緣且對應發光二極體2，而各金屬反射層5係 可為銀（Ag)材質或鎳（Ni)材質所製成。 該螢光層6係填充於電路板3與框架4之鏤空部3 3、4 2中且封閉该發光二極體2。如是，藉由上述構成一全新之具 電路板之LED光學反射結構。 當本發明於製作時，係可將具有金屬反射層5之電路板3 底部塗佈黏著劑31後與基板1固定結合，之後再將具有金屬 201246630 r . . · . • · · • , - - * . -反射層5之反鼾樞架4底部塗佈黏著劑4 1後與^路板3固 定結合’待發光二極體2置於基板1上後，以導線丨2 1與電路 佈局層3 2電性連接，最後再將螢光層6填充於電路板3與框 架4之鏤空部3 3、4 2中中且將該發光二極艟2加以封閉， 而達到易於製作以及降低製作戒本之功效；可於使用時，可使 發光一極體2利用電路板3之設置，而增加使用時之變化性， 使其之_細可触為廣泛且乡元之設計，並由發光二極體 2配合電路板3與_ 4内之各金屬反射層5與螢光層4混 光而發射出所需光源之光色以及亮度，且可藉由框架4與金屬 反射層5之結構與材質之相互配合，進而增加本創作使用時之 穩定度，而達到易於製作以及不易變色之效用。 綜上所述’本發明具電路板之LED光學反射結構可有效 改善料之種種缺點，可使發光二極體彳_光層與金屬反射 層之配合，增加發光二極體發光時之光學穩定度以及亮度，而 達=應用範圍廣泛、易於製作、不易變色、發光效率佳以及降 低裝作成本之功效;進峨本發明之産生能更進步、更實用、 更符合消費者使用之所須，確已符合發明專利要 依法提出專利申請。 ^ ^ ，等效變化與修飾’皆應仍屬本㈣. f®式簡單說明】 第1圖，係本發明之結合狀態示意圖 201246630 · ..... 第2圖，係本發明之分解狀態示意圖。 【主要元件符號說明】 基板1 發光二極體2 導線2 1 電路板3 黏著劑3 1 電路佈局層32 鏤空部3 3 框架4 黏著劑4 1 鏤空部4 2 金屬反射層5 螢光層6201246630 • - . . . Description of the Invention: [Technical Field] The present invention relates to an LED optical reflection structure with a circuit board, and more particularly to an arrangement for making a light-emitting diode using a metal reflective layer The variability of time, and the use of the combination of the phosphor layer and the metal reflective layer, to increase the optical stability and brightness of the light-emitting diode, and to achieve a wide range of applications, easy to make, not easy to change color, good luminous efficiency and reduce production costs The effect of the person. [Prior Art] According to the conventional light-emitting diode structure, a substrate, a frame disposed on the substrate, a light-emitting diode disposed on the substrate, and a fluorescent layer encapsulated in the frame are formed. 'The frame can be made of metal, white epoxy (ep〇xy) or white silicone (Silicone), so that the fluorescent layer in the frame can be combined with the light-emitting diode to reflect the required light. Light color and brightness of the light source. However, the frame made of materials such as metal, white epoxy or white silicone in use has at least the following disadvantages: 1. Metal frame: although the metal material is not easily discolored because it needs to be thicker than the original metal material. Opening a hole, this will not only make the production process more complicated, but also cause a higher cost due to a large amount of metal consumption; and it must be combined with external circuit control, which can not increase the variability in actual use. . 2 'self-death oxygen _ purpose _ • • miscellaneous color epoxy tree riding frame can improve the cost of the gold shelf, but listen to (four) avoid the long-range ultraviolet light shot and the yellowing situation occurs , which in turn affects the mixed light color of the light-emitting diodes, causing the original light color to change. 201246630 .· . _ . . ' . 3. White silicone frame: Although the stability of long-term exposure to ultraviolet light is higher than that of white epoxy frame, the price of white silicone is higher and its refractive index and anti-scale metal are poor. The addition of the Axis # complex can be combined with the substrate, so 'there will be a poor reflective effect and a higher cost. Therefore, the use of reflective frame material rain words, and can not meet the needs of the actual production situation. The main purpose of the present invention is to enable the light-emitting diode to utilize the arrangement of the metal reflective layer to increase the variability in use, and to increase the light-emitting diode by using the combination of the fluorescent layer and the metal reflective layer. The optical stability of the body illuminates, and achieves a wide range of applications, is easy to manufacture, is not easy to change color, has good luminous efficiency, and reduces the cost of production. In order to achieve the above purpose, the present invention relates to a LED optical reflective structure having a circuit board, comprising: a substrate; a light emitting diode disposed on the substrate; and a circuit coupled to the substrate and located at a periphery of the light emitting diode a board, and electrically connecting the light emitting diode to the circuit board; a frame coupled to the circuit board; at least a metal reflective layer coated on the inner side of the circuit board and the frame and corresponding to the light emitting diode; and a filling on the circuit board And a fluorescent layer in the frame and enclosing the light emitting diode. In an embodiment of the invention, the substrate may be made of copper or aluminum. In one embodiment of Yufeng's invention, the bottom of the circuit board is bonded to the substrate with an adhesive. In one embodiment of the present invention, a circuit layout layer may be disposed on one side of the circuit board, and the light-emitting diode # is electrically connected to the circuit layout layer by wires. In an embodiment of the present invention, the circuit board and the frame system may be an annular body having a corresponding hollow portion in 201246630, so that the light emitting diode can be located in the hollow portion of the circuit board and the metal reflective layer is It is applied to the inner edge of the hollow portion of the circuit board and the frame, and the fluorescent layer is filled in the hollow portion of the circuit board and the frame. In the embodiment of the present invention, the circuit board may be two mutually corresponding plate-shaped bodies' and the frame system may be two mutually corresponding block-shaped bodies, and the plate-shaped bodies and the block-shaped bodies are A corresponding hollow portion is defined between the light-emitting diodes in the hollow portion of the circuit board, and the metal reflective layer is applied to the inner edge of the hollow portion of the circuit board and the frame, and the fluorescent layer is filled In the hollow of the board and frame. In one embodiment of the invention, the bottom of the frame is bonded to the circuit board in conjunction with an adhesive. In an embodiment of the invention, the frame may be made of epoxy. In one embodiment of the invention, the frame may be a material of polyimide. In one embodiment of the invention, the material of the frame may be a mixture of epoxy and giass fiber. In one embodiment of the invention, the metal reflective layer can be made of a silver (Ag) material. In one embodiment of the invention, the metal reflective layer can be made of nickel (Ni) material. [Embodiment] 凊 Refer to the "1st and 2nd drawings", which are respectively a combination of the present invention and a schematic diagram of the state of separation of the present invention. . As shown in the figure: the present invention is 201246630 . . - ... , . . . : . . . ; ; ; . . . . . . . . . . . . . . . . . . . . . . . . . . A light-emitting diode 2, a circuit board 3, a frame 4, a metal reflective layer 5, and a phosphor layer 6 are formed. The substrate 1 described above may be made of copper or the like. The light emitting diode 2 is provided on the substrate 1. The bottom of the circuit board 3 is bonded to the periphery of the substrate 1 and located on the periphery of the LED 2, and a circuit layout layer 32 may be disposed on one surface of the circuit board 3 to enable the LED The body 2 is electrically connected to the circuit layout layer 3 2 by the wire 21. Alternatively, the circuit board 3 can be an annular body having a phase hollow portion 33, or two mutually corresponding plate-like bodies, which can make the light-emitting two The pole body 2 is located in the hollow portion 3 3 . The bottom of the frame 4 is bonded to the circuit board 3 with an adhesive 41, wherein the frame 4 can be made of epoxy resin (epOXy), polyaluminum material, or It is a mixture of an epoxy resin and a glass fiber (g s fiber), and the frame 44 may be an annular body having a hollow portion 42 or two mutually corresponding block bodies, and The hollow portion 42 of the frame 4 corresponds to the hollow portion 33 of the circuit board 3. Each of the metal reflective layers 5 is applied to at least the inner edge of the hollow portions 3 3 and 4 2 of the circuit board 3 and the frame 4 and corresponds to the light-emitting diode 2, and each of the metal reflective layers 5 may be made of silver (Ag) material or nickel ( Ni) made of material. The phosphor layer 6 is filled in the hollow portions 3 3 and 42 of the circuit board 3 and the frame 4 and encloses the light-emitting diode 2 . Thus, by the above, a brand new LED optical reflection structure having a circuit board is constructed. When the present invention is fabricated, the bottom of the circuit board 3 having the metal reflective layer 5 can be fixedly bonded to the substrate 1 after being coated with the adhesive 31, and then the metal 201246630 r . . . . . . . *. - The bottom of the ruthenium frame 4 of the reflective layer 5 is coated with an adhesive 4 1 and then fixedly coupled with the circuit board 3. After the light-emitting diode 2 is placed on the substrate 1, the wire 丨 2 1 and the circuit layout layer are used. 3 2 electrical connection, finally fill the fluorescent layer 6 in the hollow portion 3 3, 4 2 of the circuit board 3 and the frame 4 and close the light-emitting diode 2 to achieve easy production and reduce the production ring The function of the present invention can be used to enable the light-emitting body 2 to utilize the setting of the circuit board 3, and to increase the variability in use, so that it can be touched widely and the design of the township is made by the light-emitting two The polar body 2 cooperates with the metal reflective layer 5 in the circuit board 3 and the light-emitting layer 4 to mix light to emit the light color and brightness of the desired light source, and can be configured by the structure of the frame 4 and the metal reflective layer 5. The mutual cooperation of the materials, thereby increasing the stability of the use of the creation, and achieving easy to make and not easy to change color use. In summary, the LED optical reflection structure with the circuit board of the present invention can effectively improve various shortcomings of the material, and can match the light-emitting diode 彳_light layer and the metal reflective layer, and increase the optical stability of the light-emitting diode when emitting light. Degree and brightness, and up to a wide range of applications, easy to make, not easy to change color, good luminous efficiency and reduce the cost of loading; the invention can be more advanced, more practical, and more suitable for consumer use, It is true that the invention patent has been filed in accordance with the law. ^ ^ , Equivalent change and modification ' should still belong to this (4). F® type simple description] Figure 1 is a schematic diagram of the combined state of the present invention 201246630 · ..... Figure 2 is the decomposition state of the present invention schematic diagram. [Description of main component symbols] Substrate 1 Light-emitting diode 2 Conductor 2 1 Circuit board 3 Adhesive 3 1 Circuit layout layer 32 Hollow part 3 3 Frame 4 Adhesive 4 1 Hollow part 4 2 Metal reflective layer 5 Fluorescent layer 6