CN207217584U - A kind of COB modules of adjustable color temperature - Google Patents
A kind of COB modules of adjustable color temperature Download PDFInfo
- Publication number
- CN207217584U CN207217584U CN201721155066.3U CN201721155066U CN207217584U CN 207217584 U CN207217584 U CN 207217584U CN 201721155066 U CN201721155066 U CN 201721155066U CN 207217584 U CN207217584 U CN 207217584U
- Authority
- CN
- China
- Prior art keywords
- chip
- color temperature
- substrate
- adjustable color
- ladder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model provides a kind of COB modules of adjustable color temperature, including substrate, chip and packaging plastic, the substrate is stepped, including some highly different ladders, the chip is separately positioned on the ladder, and the packaging plastic is by the chip package on substrate.The COB modules of adjustable color temperature provided by the utility model, can adjust colour temperature, to meet different colour temperature demands.
Description
Technical field
A kind of COB modules of adjustable color temperature are the utility model is related to, belong to LED technology field.
Background technology
With energy-saving and emission-reduction active demand, the fast development of LED Related product technologies, the continuous improvement of light efficiency, LED illumination
Obtain increasingly to be widely applied, and must substitute conventional incandescent, fluorescent lamp continuous；And then requirement of the people to LED
More and more higher, the demand of light color variable are also suggested.
The existing White-light LED illumination technology based on LED chip, the letter in a manner of blue chip coordinates fluorescent material
Single easy, research is most widely used.The core of lighting LED white light technology is the coating processes of fluorescent material, fluorescent material
The controllability and uniformity of the thickness of coating directly influence going out for the brightness of LED white lights, colourity uniformity and light source entirety
Light efficiency, or even influence whether the colour temperature stability and use reliability of light source in use.Existing fluorescent material coating
Technology is that glue (epoxy resin, silica gel or silicones etc.) and luminescent material are mixed into either manually or automatically point
Glue machine point is on the chip of die bond bonding wire, then toast sizing.Dispensing amount is difficult to control in the technology so that is done in batch
The photochromic difference of COB light source gone out is larger, and fluorescent material easily settles, and coating is uneven, causes fluorescent material to be distributed one in chip surface
Cause property is poor, so as to cause the skewness of single light source overall luminous intensity and colour temperature in all directions of space.
Utility model content
Deficiency, the technical problems to be solved in the utility model are to provide a kind of COB modules of adjustable color temperature based on more than, can
To adjust colour temperature, to meet different colour temperature demands.
In order to solve the above technical problems, the utility model employs following technical scheme：
A kind of COB modules of adjustable color temperature, including substrate, chip and packaging plastic, the substrate are stepped including some
Highly different ladders, the chip are separately positioned on the ladder, and the packaging plastic is by the chip package on substrate.
The substrate includes some substrate films being stacked, and the substrate film forms the ladder respectively.
Chip-in series on each ladder are connected, and the chip between ladder is connected in parallel.
Chip between ladder is connected in parallel by bonding wire.
Also include wire jumper piece, the wire jumper piece is arranged on the ladder, and the bonding wire is connected on the wire jumper piece.
Through hole, the through hole connection are provided with the substrate film, the through-hole wall is provided with conductive material.
The chip is LED blue chips.
The blue chip wavelength is 450-460nm.
Also include the box dam structure for surrounding the chip.
The substrate is ceramic substrate.
Using above technical scheme, the utility model achieves following technique effect：
(1) substrate is arranged to stepped, and chip is arranged on highly different ladders, and the chip on different ladders is encapsulating
When silica gel and fluorescent material, the thickness of fluorescence coating can be different, fluorescence coating corresponding to the ladder of upper strata can than relatively thin, light color temperature compared with
It is high；Lower floor's ladder corresponds to fluorescence coating can be thicker, and light color temperature is relatively low；Fluorescence thickness can be adjusted indirectly by adjusting ladder height
Degree, the light color temperature that goes out of different parts can be controlled, and then improve colour temperature, reach the colour temperature effect required for us；
(2) by wire jumper piece, first bonding wire is connected on wire jumper piece, is connected on chip, favourable can must reduce bonding wire
Bank, increase the reliability of COB light source.
Brief description of the drawings
Fig. 1 is the front view of the COB modules of the utility model adjustable color temperature；
Fig. 2 is the top view of the COB modules of the utility model adjustable color temperature.
Embodiment
As depicted in figs. 1 and 2, the utility model provides a kind of COB modules of adjustable color temperature, including substrate 1, chip 2
With packaging plastic 3, the substrate 1 is stepped, including some highly different ladders, the chip 2 are separately positioned on the rank
On ladder, the packaging plastic 3 encapsulates the chip 2 on substrate 1.Substrate 1 is arranged to stepped, and chip 2 is arranged on height not
On same ladder, for the chip 2 on different ladders in packaging silicon rubber and fluorescent material, the thickness of fluorescence coating can be different, causes
The light color temperature of chip 2 on different ladders is different, and fluorescence coating can be than relatively thin corresponding to the ladder of upper strata, and light color temperature is higher；Lower floor's rank
The corresponding fluorescence coating of ladder can be thicker, and light color temperature is relatively low；Fluorescent layer thickness can be adjusted indirectly by adjusting ladder height, can control
Different parts go out light color temperature, and then improve colour temperature, reach the colour temperature effect required for us.
Wherein, substrate 1 includes some substrate films 11 being stacked, and the substrate film 11 forms the ladder respectively.Rank
Chip 2 is set on ladder, and chip 2 is LED blue chips 2.The wavelength of blue chip 2 is 450-460nm.On each ladder
Chip 2 be connected in series by bonding wire 4, the chip 2 between ladder is connected in parallel by bonding wire 4.In the present embodiment, also in ladder
Upper setting wire jumper piece 5, the bonding wire 4 being connected on a chip 2 is first coupled on wire jumper piece 5, is connected on another chip 2.Base
Through hole 111 is provided with plate 11, through hole 111 connects, and the through-hole wall is provided with conductive material, passes through between substrate film 11
The conductive material connection.It is provided with box dam structure 6 around the substrate film 11 of the top, box dam structure 6 is by the chip 2
Surround.Filling packaging plastic 3 and fluorescent material in box dam structure 6, chip 2 is all covered.
Wherein, substrate 1 is ceramic heat-dissipating substrate 1, including low temperature co-fired multilayer ceramic substrate 1, high temperature co-firing multi-layer ceramics,
Directly engage copper base 1, direct copper plating substrate 1.
Finally it should be noted that：Preferred embodiment of the present utility model is these are only, is not limited to this practicality
It is new, although the utility model is described in detail with reference to embodiment, for those skilled in the art, its according to
The technical scheme described in foregoing embodiments can so be modified, or which part technical characteristic is equally replaced
Change, but it is all within the spirit and principles of the utility model, any modification, equivalent substitution and improvements made etc., it all should include
Within the scope of protection of the utility model.
Claims (10)
- A kind of 1. COB modules of adjustable color temperature, it is characterised in that：Including substrate, chip and packaging plastic, the substrate is ladder Shape, including some highly different ladders, the chip are separately positioned on the ladder, and the packaging plastic seals the chip On substrate.
- 2. the COB modules of adjustable color temperature according to claim 1, it is characterised in that：The substrate includes what is be stacked Some substrate films, the substrate film form the ladder respectively.
- 3. the COB modules of adjustable color temperature according to claim 2, it is characterised in that：Chip string on each ladder Connection is connected, and the chip between ladder is connected in parallel.
- 4. the COB modules of adjustable color temperature according to claim 3, it is characterised in that：Chip between ladder passes through bonding wire It is connected in parallel.
- 5. the COB modules of adjustable color temperature according to claim 4, it is characterised in that：Also include wire jumper piece, the wire jumper piece It is arranged on the ladder, the bonding wire is connected on the wire jumper piece.
- 6. the COB modules of adjustable color temperature according to claim 3, it is characterised in that：Through hole is provided with the substrate film, The through hole connection, the through-hole wall are provided with conductive material.
- 7. the COB modules of adjustable color temperature according to claim 1, it is characterised in that：The chip is LED blue chips.
- 8. the COB modules of adjustable color temperature according to claim 7, it is characterised in that：The blue chip wavelength is 450- 460nm。
- 9. the COB modules of adjustable color temperature according to claim 1, it is characterised in that：Also include surround the chip Box dam structure.
- 10. the COB modules of adjustable color temperature according to claim 1, it is characterised in that：The substrate is ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721155066.3U CN207217584U (en) | 2017-09-08 | 2017-09-08 | A kind of COB modules of adjustable color temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721155066.3U CN207217584U (en) | 2017-09-08 | 2017-09-08 | A kind of COB modules of adjustable color temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207217584U true CN207217584U (en) | 2018-04-10 |
Family
ID=61823912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721155066.3U Active CN207217584U (en) | 2017-09-08 | 2017-09-08 | A kind of COB modules of adjustable color temperature |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207217584U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107507903A (en) * | 2017-09-08 | 2017-12-22 | 广东晶科电子股份有限公司 | A kind of COB modules of adjustable color temperature |
-
2017
- 2017-09-08 CN CN201721155066.3U patent/CN207217584U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107507903A (en) * | 2017-09-08 | 2017-12-22 | 广东晶科电子股份有限公司 | A kind of COB modules of adjustable color temperature |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208045002U (en) | High contrast integration packaging display module structure | |
| CN101592291A (en) | LED lamp preparation method that a kind of colour temperature is adjustable and LED lamp | |
| CN103872034A (en) | Total-angle light emitting LED light source based on light transmission substrate and packaging method of total-angle light emitting LED light source | |
| CN102148296A (en) | LED (Light Emitting Diode) manufacturing method and LED device | |
| CN108365075A (en) | Wafer-class encapsulation light-emitting device with inclined-plane chip catoptric arrangement and its manufacturing method | |
| CN103050615B (en) | A kind of White LED with high color rendering property device | |
| CN102185042A (en) | Light-emitting diode (LED) packaging method, packaging device and light adjusting method and system | |
| CN204088315U (en) | MCOB LED fluorescent powder separate package structure | |
| CN103972222A (en) | LED (light-emitting diode) light source packaging method, LED light source packaging structure and light source module | |
| CN103840063A (en) | LED package substrate and manufacturing method thereof | |
| CN207852729U (en) | A kind of double-colored temperature LED light sources of upside-down mounting COB | |
| CN101442087B (en) | Low power low light loss white light LED | |
| CN107507903A (en) | A kind of COB modules of adjustable color temperature | |
| CN207217584U (en) | A kind of COB modules of adjustable color temperature | |
| CN102082142B (en) | Packaging structure | |
| TWM393643U (en) | LED device with coating structure | |
| CN206353544U (en) | A kind of COB light source | |
| CN201221690Y (en) | LED plane illuminating device | |
| CN105575957A (en) | COB light source for white light LED | |
| CN207097855U (en) | A kind of quantum dot LED encapsulation structure | |
| CN205264697U (en) | Adjustable color temperature's LED integrated optical source | |
| CN209045612U (en) | A kind of novel instruction class LED backlight | |
| CN208806270U (en) | A kind of LED encapsulation structure | |
| CN208538903U (en) | A kind of encapsulating structure of high-luminous-efficiency LED wafer | |
| CN206401357U (en) | Gao Se areas centrality white-light LED encapsulation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |