TW201241840A - Copper-containing composition, method of producing metallic copper film, and metallic copper film - Google Patents

Copper-containing composition, method of producing metallic copper film, and metallic copper film Download PDF

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Publication number
TW201241840A
TW201241840A TW100148606A TW100148606A TW201241840A TW 201241840 A TW201241840 A TW 201241840A TW 100148606 A TW100148606 A TW 100148606A TW 100148606 A TW100148606 A TW 100148606A TW 201241840 A TW201241840 A TW 201241840A
Authority
TW
Taiwan
Prior art keywords
copper
metal
weight
copper film
resin
Prior art date
Application number
TW100148606A
Other languages
English (en)
Chinese (zh)
Inventor
Tomoyuki Kinoshita
Noriaki Oshima
Takahiro Kawabata
Tetsu Yamakawa
Original Assignee
Tosoh Corp
Sagami Chemical Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tosoh Corp, Sagami Chemical Res Inst filed Critical Tosoh Corp
Publication of TW201241840A publication Critical patent/TW201241840A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Chemically Coating (AREA)
  • Electrodes Of Semiconductors (AREA)
TW100148606A 2010-12-28 2011-12-26 Copper-containing composition, method of producing metallic copper film, and metallic copper film TW201241840A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010292582 2010-12-28

Publications (1)

Publication Number Publication Date
TW201241840A true TW201241840A (en) 2012-10-16

Family

ID=46382987

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100148606A TW201241840A (en) 2010-12-28 2011-12-26 Copper-containing composition, method of producing metallic copper film, and metallic copper film

Country Status (3)

Country Link
JP (1) JP2012151093A (enExample)
TW (1) TW201241840A (enExample)
WO (1) WO2012090881A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI607114B (zh) * 2013-07-10 2017-12-01 富士軟片股份有限公司 導電膜的製造方法以及導電膜
TWI676995B (zh) * 2015-01-29 2019-11-11 日商哈利瑪化成股份有限公司 導電性糊劑及印刷佈線基板

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5972187B2 (ja) 2013-02-04 2016-08-17 富士フイルム株式会社 導電膜形成用組成物、導電膜の製造方法
JP2014196427A (ja) * 2013-03-29 2014-10-16 富士フイルム株式会社 導電膜形成用組成物およびこれを用いる導電膜の製造方法
JP2014196384A (ja) * 2013-03-29 2014-10-16 富士フイルム株式会社 導電膜形成用組成物およびこれを用いる導電膜の製造方法
JP2016079439A (ja) * 2014-10-14 2016-05-16 四国化成工業株式会社 銅被膜形成剤およびその利用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1060319A (ja) * 1996-08-22 1998-03-03 Asahi Chem Ind Co Ltd 導電性ペースト組成物及びそれを用いた配線基板
JPH1087994A (ja) * 1996-09-10 1998-04-07 Polymertech Kk 複合導電性高分子および組成物ならびにその製造方法
TWI251018B (en) * 2002-04-10 2006-03-11 Fujikura Ltd Electroconductive composition, electroconductive coating and method of producing the electroconductive coating
JP4840097B2 (ja) * 2006-11-20 2011-12-21 住友ベークライト株式会社 導電性銅ペースト
JP5778382B2 (ja) * 2008-10-22 2015-09-16 東ソー株式会社 金属膜製造用組成物、金属膜の製造方法及び金属粉末の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI607114B (zh) * 2013-07-10 2017-12-01 富士軟片股份有限公司 導電膜的製造方法以及導電膜
TWI676995B (zh) * 2015-01-29 2019-11-11 日商哈利瑪化成股份有限公司 導電性糊劑及印刷佈線基板

Also Published As

Publication number Publication date
WO2012090881A1 (ja) 2012-07-05
JP2012151093A (ja) 2012-08-09

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