TW201241072A - Conductive microparticle, resin particle, and anisotropic conductive material using same - Google Patents
Conductive microparticle, resin particle, and anisotropic conductive material using same Download PDFInfo
- Publication number
- TW201241072A TW201241072A TW101102433A TW101102433A TW201241072A TW 201241072 A TW201241072 A TW 201241072A TW 101102433 A TW101102433 A TW 101102433A TW 101102433 A TW101102433 A TW 101102433A TW 201241072 A TW201241072 A TW 201241072A
- Authority
- TW
- Taiwan
- Prior art keywords
- value
- particles
- resin particles
- resin
- monomer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011013403 | 2011-01-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201241072A true TW201241072A (en) | 2012-10-16 |
Family
ID=46580768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101102433A TW201241072A (en) | 2011-01-25 | 2012-01-20 | Conductive microparticle, resin particle, and anisotropic conductive material using same |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5140209B2 (ja) |
KR (1) | KR101454194B1 (ja) |
CN (1) | CN103329217B (ja) |
TW (1) | TW201241072A (ja) |
WO (1) | WO2012102199A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI643213B (zh) * | 2016-01-13 | 2018-12-01 | 日商山王股份有限公司 | 導電性微粒子及導電性微粒子的製造方法 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101534841B1 (ko) * | 2012-11-07 | 2015-07-07 | 제일모직주식회사 | 돌기형 도전성 미립자 및 이를 포함하는 이방 도전성 필름 |
JP6374689B2 (ja) * | 2013-04-04 | 2018-08-15 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
KR101676527B1 (ko) * | 2013-06-25 | 2016-11-16 | 제일모직주식회사 | 이방성 도전 필름, 이를 포함하는 영상 표시 장치 및 반도체 장치 |
JP6737566B2 (ja) * | 2014-01-14 | 2020-08-12 | 積水化学工業株式会社 | 基材粒子、導電性粒子、導電材料及び接続構造体 |
KR102545861B1 (ko) * | 2014-10-29 | 2023-06-21 | 데쿠세리아루즈 가부시키가이샤 | 도전 재료 |
CN107849427B (zh) * | 2015-11-20 | 2021-09-24 | 积水化学工业株式会社 | 粒子、连接材料及连接结构体 |
JP2017147163A (ja) * | 2016-02-19 | 2017-08-24 | 三菱マテリアル株式会社 | 導電性ペースト及びこれを用いて形成された導電性膜 |
KR20190132341A (ko) * | 2017-03-30 | 2019-11-27 | 세키스이가가쿠 고교가부시키가이샤 | 도전성 입자, 도전 재료 및 접속 구조체 |
JP2019179647A (ja) * | 2018-03-30 | 2019-10-17 | デクセリアルズ株式会社 | 導電材料、及び接続体の製造方法 |
JP7352608B2 (ja) * | 2020-12-17 | 2023-09-28 | ドク サン ネオルクス カンパニー リミテッド | 高強度ビーズ、及びこれを用いた導電粒子 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001216841A (ja) * | 1999-11-26 | 2001-08-10 | Sekisui Chem Co Ltd | 導電性微粒子及び導電接続構造体 |
JP3581618B2 (ja) * | 1999-11-29 | 2004-10-27 | 積水化学工業株式会社 | 導電性微粒子、異方性導電接着剤及び導電接続構造体 |
US20080275181A1 (en) * | 2004-05-27 | 2008-11-06 | Sumitomo Electric Industries, Ltd | Block Copolymerized Polyimide Ink Composition for Printing |
JP2006028242A (ja) * | 2004-07-13 | 2006-02-02 | Tomoegawa Paper Co Ltd | 電子部品用接着テープおよび電子部品 |
JP2006040546A (ja) * | 2004-07-22 | 2006-02-09 | Sanyo Chem Ind Ltd | 導電性微粒子 |
SG119379A1 (en) * | 2004-08-06 | 2006-02-28 | Nippon Catalytic Chem Ind | Resin composition method of its composition and cured formulation |
JP4662748B2 (ja) * | 2004-10-04 | 2011-03-30 | 積水化学工業株式会社 | 導電性微粒子及び異方性導電材料 |
JP2006269296A (ja) * | 2005-03-24 | 2006-10-05 | Sekisui Chem Co Ltd | 突起粒子の製造方法、突起粒子、導電性突起粒子及び異方性導電材料 |
JP4950451B2 (ja) * | 2005-07-29 | 2012-06-13 | 積水化学工業株式会社 | 導電性微粒子、異方性導電材料、及び、接続構造体 |
CN101153212A (zh) * | 2006-09-14 | 2008-04-02 | 信越化学工业株式会社 | 系统级封装型半导体装置用树脂组成物套组 |
JP5024260B2 (ja) * | 2007-11-01 | 2012-09-12 | 日立化成工業株式会社 | 導電粒子、絶縁被覆導電粒子及びその製造方法、異方導電性接着剤 |
-
2012
- 2012-01-20 WO PCT/JP2012/051184 patent/WO2012102199A1/ja active Application Filing
- 2012-01-20 TW TW101102433A patent/TW201241072A/zh unknown
- 2012-01-20 JP JP2012529465A patent/JP5140209B2/ja active Active
- 2012-01-20 KR KR1020137016539A patent/KR101454194B1/ko active IP Right Grant
- 2012-01-20 CN CN201280006245.4A patent/CN103329217B/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI643213B (zh) * | 2016-01-13 | 2018-12-01 | 日商山王股份有限公司 | 導電性微粒子及導電性微粒子的製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101454194B1 (ko) | 2014-10-27 |
JP5140209B2 (ja) | 2013-02-06 |
WO2012102199A1 (ja) | 2012-08-02 |
CN103329217B (zh) | 2016-06-29 |
JPWO2012102199A1 (ja) | 2014-06-30 |
KR20130114188A (ko) | 2013-10-16 |
CN103329217A (zh) | 2013-09-25 |
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