TW201241072A - Conductive microparticle, resin particle, and anisotropic conductive material using same - Google Patents

Conductive microparticle, resin particle, and anisotropic conductive material using same Download PDF

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Publication number
TW201241072A
TW201241072A TW101102433A TW101102433A TW201241072A TW 201241072 A TW201241072 A TW 201241072A TW 101102433 A TW101102433 A TW 101102433A TW 101102433 A TW101102433 A TW 101102433A TW 201241072 A TW201241072 A TW 201241072A
Authority
TW
Taiwan
Prior art keywords
value
particles
resin particles
resin
monomer
Prior art date
Application number
TW101102433A
Other languages
English (en)
Chinese (zh)
Inventor
Kazuaki Matsumoto
Naoki Kobayashi
Yoshikuni Sasaki
Original Assignee
Nippon Catalytic Chem Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Catalytic Chem Ind filed Critical Nippon Catalytic Chem Ind
Publication of TW201241072A publication Critical patent/TW201241072A/zh

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW101102433A 2011-01-25 2012-01-20 Conductive microparticle, resin particle, and anisotropic conductive material using same TW201241072A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011013403 2011-01-25

Publications (1)

Publication Number Publication Date
TW201241072A true TW201241072A (en) 2012-10-16

Family

ID=46580768

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101102433A TW201241072A (en) 2011-01-25 2012-01-20 Conductive microparticle, resin particle, and anisotropic conductive material using same

Country Status (5)

Country Link
JP (1) JP5140209B2 (ja)
KR (1) KR101454194B1 (ja)
CN (1) CN103329217B (ja)
TW (1) TW201241072A (ja)
WO (1) WO2012102199A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI643213B (zh) * 2016-01-13 2018-12-01 日商山王股份有限公司 導電性微粒子及導電性微粒子的製造方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101534841B1 (ko) * 2012-11-07 2015-07-07 제일모직주식회사 돌기형 도전성 미립자 및 이를 포함하는 이방 도전성 필름
JP6374689B2 (ja) * 2013-04-04 2018-08-15 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
KR101676527B1 (ko) * 2013-06-25 2016-11-16 제일모직주식회사 이방성 도전 필름, 이를 포함하는 영상 표시 장치 및 반도체 장치
JP6737566B2 (ja) * 2014-01-14 2020-08-12 積水化学工業株式会社 基材粒子、導電性粒子、導電材料及び接続構造体
KR102545861B1 (ko) * 2014-10-29 2023-06-21 데쿠세리아루즈 가부시키가이샤 도전 재료
CN107849427B (zh) * 2015-11-20 2021-09-24 积水化学工业株式会社 粒子、连接材料及连接结构体
JP2017147163A (ja) * 2016-02-19 2017-08-24 三菱マテリアル株式会社 導電性ペースト及びこれを用いて形成された導電性膜
KR20190132341A (ko) * 2017-03-30 2019-11-27 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체
JP2019179647A (ja) * 2018-03-30 2019-10-17 デクセリアルズ株式会社 導電材料、及び接続体の製造方法
JP7352608B2 (ja) * 2020-12-17 2023-09-28 ドク サン ネオルクス カンパニー リミテッド 高強度ビーズ、及びこれを用いた導電粒子

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001216841A (ja) * 1999-11-26 2001-08-10 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
JP3581618B2 (ja) * 1999-11-29 2004-10-27 積水化学工業株式会社 導電性微粒子、異方性導電接着剤及び導電接続構造体
US20080275181A1 (en) * 2004-05-27 2008-11-06 Sumitomo Electric Industries, Ltd Block Copolymerized Polyimide Ink Composition for Printing
JP2006028242A (ja) * 2004-07-13 2006-02-02 Tomoegawa Paper Co Ltd 電子部品用接着テープおよび電子部品
JP2006040546A (ja) * 2004-07-22 2006-02-09 Sanyo Chem Ind Ltd 導電性微粒子
SG119379A1 (en) * 2004-08-06 2006-02-28 Nippon Catalytic Chem Ind Resin composition method of its composition and cured formulation
JP4662748B2 (ja) * 2004-10-04 2011-03-30 積水化学工業株式会社 導電性微粒子及び異方性導電材料
JP2006269296A (ja) * 2005-03-24 2006-10-05 Sekisui Chem Co Ltd 突起粒子の製造方法、突起粒子、導電性突起粒子及び異方性導電材料
JP4950451B2 (ja) * 2005-07-29 2012-06-13 積水化学工業株式会社 導電性微粒子、異方性導電材料、及び、接続構造体
CN101153212A (zh) * 2006-09-14 2008-04-02 信越化学工业株式会社 系统级封装型半导体装置用树脂组成物套组
JP5024260B2 (ja) * 2007-11-01 2012-09-12 日立化成工業株式会社 導電粒子、絶縁被覆導電粒子及びその製造方法、異方導電性接着剤

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI643213B (zh) * 2016-01-13 2018-12-01 日商山王股份有限公司 導電性微粒子及導電性微粒子的製造方法

Also Published As

Publication number Publication date
KR101454194B1 (ko) 2014-10-27
JP5140209B2 (ja) 2013-02-06
WO2012102199A1 (ja) 2012-08-02
CN103329217B (zh) 2016-06-29
JPWO2012102199A1 (ja) 2014-06-30
KR20130114188A (ko) 2013-10-16
CN103329217A (zh) 2013-09-25

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