TW201241072A - Conductive microparticle, resin particle, and anisotropic conductive material using same - Google Patents

Abstract

Provided is a conductive microparticle that has a low initial resistance value and can maintain a stable connected state while being a minute conductive microparticle. This conductive microparticle has a base material formed from a resin particle and at least one conductive metal layer formed on the surface of the base material. This conductive microparticle is characterized by the number-based average dispersed particle size for the resin particle being 1.0 - 2.5 [mu]m and the modulus of compressive elasticity when the diameter of the resin particle is displaced 10% (10% K value) being 12,000 N/mm2 or greater.

Description

201241072 V. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention. 益〇六、发明说明: Technical Field of the Invention The present invention relates to a fine conductive microparticle. The conductive fine particles which are generated by the short circuit in the state of being electrically connected are reduced. [Prior Art] Conventionally, in the assembly of an electronic device, in order to perform a large amount of electric power: or electrical connection between wiring lines, a connection method by an anisotropic conductive material is employed. The anisotropic conductive material is a material in which conductive fine particles are mixed with a binder resin or the like, for example, an anisotropic conductive paste (10), an anisotropic conductive film (ACF), an anisotropic conductive ink, an anisotropic conductive sheet, or the like. . Here, as the conductive fine particles used for the anisotropic conductive material, the surface of the metal particles or the resin particles serving as the substrate is coated with the conductive metal layer. However, in recent years, the miniaturization and high-performance of the t-sub-machines are getting more and more advanced. With this, the electronic components mounted on the electrical equipment are J-integrated and the density is built, and the electrodes or wiring systems of the electronic circuits are popular, and the fields are thin and thin. Then, as described above, the electrode or the wiring of the electronic circuit is made finer and narrower, or even if the conductive fine particles used for the anisotropic conductive material are used, the particle size is required to be smaller than 201241072 v. The microparticles having a particle diameter of less than 20% are used as a substrate, for example, which is composed of a resin or an inorganic compound and which has an average particle diameter of 0. 5 to 2. 5 μ m and a particle diameter of cv of 20% or less. Conductive fine particles (Patent Document 1). In addition, it is reported that in the core body composed of an organic polymer, the conductive particles of the metal electricity money are applied in a prescribed thickness so that the hardness of the conductive particles which have a good connection resistance in accordance with the diameter of the conductive particles is different. Conductive particles having a particle diameter of 1 to 2/zm (Patent Document 2). [PRIOR ART DOCUMENT] Patent Document 1: Japanese Laid-Open Patent Publication No. 2000-30526 (Patent Document 2) Japanese Patent No. 415 4 91 9 SUMMARY OF INVENTION [Problems to be Solved by the Invention] However, as always In the state only, the resistance value becomes high or cannot be generated in the initial state. The present invention is directed to the resin particles of the conductive fine particle substrate in which the fine conductive fine particles are simultaneously connected in the initial state, and the use material. The shape of the conductive fine particles is smaller, and the connection area is smaller. Therefore, it is completed in a state in which the stable connection state is maintained; the micro-resistance value is lowered and the stability can be maintained. The anisotropic conduction of the conductive fine particles of the fine particles 3 201241072 The present inventors have made a thorough study to solve the above problems. As a result, it has been found that in order to make the particle size of the conductive fine particles fine, and to ensure the amount of current equivalent to the state of the large particle diameter, it is important to relatively increase the connection area ratio with respect to the particle diameter. Therefore, it is possible to improve the indentation forming ability (specifically, the characteristics of the indentation can be formed at the time of the connection only at the time of the connection), and the conductive metal layer and the connected body can be sufficiently ensured in the connected state ( The adhesion of the electrodes). Then, the average dispersed particle diameter on the basis of the number is 1 〇 "m or more,

When the conductive fine particles are used as the base material, the resin particles of the above 1//_ can form sufficient dust marks for the connected electrode, so that the present invention can be completed. That is, the present invention is composed of the following configurations. (1) · A conductive fine particle, a substrate and a surface formed on the substrate

The number of the resin particles having at least one layer of the conductive metal layer composed of the resin particles is ≤ 2. m or less, and the resin is

Rate (10% K value) is 1 2 000N

In the conductive fine particles according to the above (1), the average dispersed particle diameter based on the number of the resin particles is less than 2.0 μm, and the compression modulus is when the diameter of the resin particles is shifted by 〇 〇 %. (ίο% κ value) is more than 1,900n / mm2. (4) The conductive fine particles according to any one of the above (1) to (3), wherein the resin particles have a compression-deformation deformation ratio of 3% by mass or more. (5) The conductive fine particles according to any one of (1) to (4), wherein the compressive elastic modulus of the resin particles having a diameter displacement of 3〇% is smaller than the above-mentioned 1 〇β/ β K value. (6) The conductive fine particles according to any one of (1) to (5), wherein at least a part of the surface is provided with an insulating resin layer. (Ό: A resin particle is a particle which is used as a base material of conductive fine particles. The average dispersed particle diameter of the number of bases is 1 ^ or more, 2.5 Å or less, and the diameter of the particle is displaced by 1 〇. The compression elastic modulus (10% K value) at % is i2, 〇〇〇N//mm2 or more. (8) The average particle diameter of the resin particles based on the number of the above-mentioned (7) is 2.0 (four) or more. The compressive elastic modulus (10% K value) when the diameter of the particle is displaced by 1% is i7, 〇〇〇N/mm2 or more. The average dispersion of the compressive elasticity (9) just described (7) 5 loaded resin particles The reference particle size is less than 2. 0 # m, and the rate (ίο% κ value) is more than 1 9 600 N/mm2 when the diameter of the particle is i 〇%. The resin particle is compressed (10) The damage deformation rate of any one of the above (7) to (9) is 30% or more. (11) The resin particle according to any one of the above (7) to (10) is a diameter displacement of the particle 201241072 The compression modulus at 30% (3〇% κ) is less than the above 10% 。. (12) An anisotropic conductive material characterized by any one of the above (1) to (6) According to the conductive fine particles of the present invention, even if the pressure is low, an indentation can be formed on the connected body (electrode). In addition, the adhesion between the conductive metal layer and the object to be bonded is improved, and the large connection area is ensured. Therefore, the diameter can be reduced, and the low initial resistance value can be sufficiently found and the stable connection state can be maintained. 1. The conductive fine particles of the present invention have a base material composed of resin particles and a conductive metal layer formed on at least one surface of the base material. The present invention is improved by fine conductive fine particles. Therefore, the particle size of the resin particle-based material which becomes the conductive fine particle substrate in the present invention is small, and the average dispersed particle diameter based on the number of the particles is 10 #m or more, preferably more than or more, more preferably h2//m. Above, even better is 13 ... on 'below 2.5' or less, preferably 2 3... under, more ideally 2" ^ down 'or even better than 19" below. If the tree The average particle (substrate) of the dispersion particle diameter within this range, then (iv) the fine conductive particles used in moderation ... connected to the electrical miniaturization and the narrowing of the electrode or the wiring.

In addition, the coefficient of variation (cv value) based on the number of the dispersed particle diameters of the resin particles (substrate) is preferably 100% or less, more preferably 8% or less, even more preferably 5.0%. The following is more preferably 4.5% or less, particularly preferably 4. 0% or less, and most preferably 3.5% or less. In this manner, the resin particles having a small variation coefficient of the dispersed particle diameter are not only uniform in primary particle diameter, but also have a single dispersion of the primary particle diameter extremely high. Therefore, by using such resin particles, as the substrate, conductive fine particles having uniform particle diameters and suppressing aggregation can be obtained. In addition, the average dispersed particle diameter on the basis of the number of resin particles of the present invention or a coefficient of variation thereof is a value measured by a Couter counter, and the measurement method is described in the examples. In the back. In the case where coarse particles are present, when the conductive particles are stored for a long period of time, the coarse particles are likely to settle and become a cause of aggregation of the conductive particles. Therefore, it is preferable that the aforementioned resin particle system removes coarse particles. In other words, the resin particle system described above is preferably a cumulative distribution curve on a number basis, and the particle diameter of the cumulative value of 9〇% is as follows, more preferably 2.2//Π1 or less, even more preferably 2 〇^ ^ The particle diameter of the ''integral value of 90% is the same as the average dispersed particle diameter, and indicates the particle diameter at which the cumulative value of the number is 90% by the cumulative distribution curve measured by the Coulter counter. In the present invention, the above-mentioned resin particles as the substrate have a compressive modulus (% κ κ value) of 12, 〇〇〇N/^m2 or more, which is important when the diameter is shifted by ί. When the 〇% κ value of the resin particles is in this range, 201241072 can form a sufficient indentation for the connected body (electrode), whereby the adhesion between the conductive metal layer and the connected body can be improved, and To ensure a large connection area. The 〇% Κ value of the resin particles is preferably l4, 〇〇〇N/mm2 or more, more preferably 15, 〇〇〇N/mm2 or more, even more preferably 17〇〇〇ν/μ: 2 More preferably, it is 20,000 N / off 2 or more 'preferably 5 〇〇〇〇 n / mm 2 or less, more preferably 40,000 N / mm 2 or less. In a preferred embodiment of the present invention, the average dispersed particle diameter based on the number of the resin particles is 2.0" or more, 2.5" or less, and the compression modulus (10% κ value when the diameter of the resin particles is shifted by 10%) The average dispersed particle diameter of the number of the above-mentioned resin particles is Π'ΟΟΟΝ/ιπιπ2 or more, or more than 2〇//111, and the diameter of the resin particles is shifted by 1 () The compression modulus (% (%) κ value) at % exceeds 19'600 N/mm2 (greater than 19, 6 〇〇Ν / off 2). If this is the case, the resistance value of the heteroconductive connection state is suppressed. The rise in time also achieves the effect of obtaining good connection reliability. That is, if the ίο% κ value of the resin particles is in the range of 1 2,000 N/mm 2 or more, the good indentation is obtained. A connection structure capable of obtaining a low connection resistance value without depending on the pressure condition at the time of the hetero-conducting connection is formed, but in order to obtain a high connection reliability, an appropriate 10% of the particle diameter of the resin particles is also present. The range of K values. The 10% κ value of the resin particles can be measured using a conventional micro compression tester. However, it is preferable to use a conventional micro compression tester (for example, "MCT_W5" manufactured by Shimadzu Corporation). Applying a load to the particles at a load rate of 2.2295 mN/sec at room temperature

S 8 201241072

In the compression test in the center direction, it is preferable to measure the weight (N) and the compression displacement (mm) of the enthalpy from the compression when the compression displacement becomes 10% of the particle diameter, and the following formula is used. The value. [Number 1] 3 XFE = 2 1/2, S3/2xr1/2 (here 'E: compression modulus (k F: dust load (8), s: compression displacement (mm), R: radius of the particle (_ The above-mentioned resin particle system which is the base material of the present invention has a crushing deformation rate of 4 30% or more. The resin particles are strongly compressed and deformed to have a strong force. Therefore, the connection area can be further increased to know that the compression deformation rate of the October 曰 particles is more than ideal, even more preferably 50% or more. In terms of the upper limit of the compression deformation rate, it is preferable that there is no damage. In addition, it is also possible to use a small compression tester (for example, Shimadzu Corporation, "MCT-W5〇〇", which is a small compression tester (for example, the Shimadzu Corporation). Etc.), a compression test in which the load is applied to the center of the particle at a load rate of 2. 2295 mN/sec at room temperature, and the compression displacement (em) at the time of particle arrival to destruction is measured, and is calculated by the following formula For example, the "MCT-W500" manufactured by Shimadzu Corporation is used as a micro pressure. In the state of the shrinkage tester, it is preferable to carry out the measurement by the "standard surface detection" mode of the test machine. Compression failure change rate (%) == [compression displacement particle size (#m)] xi〇 Further, in the present invention, it is preferable that the above-mentioned resin particle system as a substrate is 201241072, and the compression modulus (3〇% Κ value) when the diameter of the resin particles is displaced by 30% is smaller than the above-described 10% Κ value. When the 30% enthalpy is greater than the ι 〇 % κ value, high pressure is required to ensure the area due to deformation, but the rupture of the particles due to the squeezing causes loss of the restoring force of the particles and reduces the connection stability. Conversely, when the 3〇%κ value of the resin particles is less than 1〇%κ, large compression deformation can be ensured by the low pressure. Specifically, the value of 30% //100% Κ can be made. Preferably, it is 〇. 9 or less, more preferably 0.8 or less, even more preferably 〇. 7 or less. Further, in terms of biting into the electrode at the initial stage of compression and improving the biteness of the electrode, 30 % Κ / 1 0% The value of the Κ value is preferably 〇 · 3 or more, more The addition is preferably 0.4 or more. For the same reason, the compression modulus (20% Κ value) when the diameter of the resin particles is displaced by 2% is preferably less than the aforementioned 〇% κ value, 20% Κ The value of the value/10% Κ value is preferably 〇.8 or less, more preferably 0·7 or less, more preferably 〇·4 or more, more preferably 〇5 or more. Further, the diameter of the resin particles is displaced by 40%. The compression elastic modulus (4〇% κ value) is also preferably 2 〇 or less for the same reason, and more preferably i 〇 or less 'best is 0.4 or more, more preferably { 〇. 5 or more. . When the connection is made by heating, the compression connection is performed in a state where the compression deformation ratio is about 3〇% to 5〇%, and it is preferable that the pressure connection is obtained in a connection state in which the connection reliability of the height is obtained. 1〇%] (value, even in the case of 2〇%κ value, 30%Κ value, 40%Κ value, it is preferable that the position is in the aforementioned range. Further, the 2树脂% κ value of the aforementioned resin particle, The 3〇% κ value and the 4〇% κ value can be determined in the compression test in the same compression test as the above 丨〇% κ value.

S 10 201241072 Particles and straight (four) contraction displacements are m, 3_4 (four) stop dust load (8) and I contraction (dragon)' are determined according to the same formula as the above observation. The aforementioned resin particles (substrate) may contain (four) components, not (four)

The particles composed of an organic material may be particles composed of an organic-inorganic composite material. The conductive particles are excellent in characteristics by the resin particles serving as a substrate. A group of organic materials constituting the aforementioned resin particles, such as polyethylene, polypropylene, polyvinyl chloride, polytetrafluoroethylene, polyisobutylene polybutadiene, etc.; styrene resin, propylene a polyethylene polymer such as a resin, a styrene-acrylic resin, a polyacetate, a polyacetate, a polyethylene acetonate, a formic acid vinegar, or the like; a polycarbonate; a polyamine; a polyamine; Benzene age resin 'melamine resin; triammonium benzoguanamine formaldehyde: the purpose of 'urea formaldehyde resin; fluorenone resin. Further, as the organic-inorganic composite material, a material comprising the above-mentioned organic material and a poly-stone-fired bone-shaped material such as a poly-tender and an ethylene polymer is compounded. The material constituting the resin particles is appropriately selected from a wide range of materials, and the average particle diameter and the value can be controlled to be within the above range. The materials constituting the first & second tree can be used singly or in combination of two or more. The material constituting the resin particles is preferably at least one selected from the group consisting of ethylene-polymerized coarse and poly-stone-burned bone. By means of a material containing an ethylene polymer, the organic polymer formed by polymerization of a vinyl group has a good elastic deformation at the time of pressure connection. Further, the resin particles composed of the material containing the polyoxyalkylene skeleton of the package 11 201241072 are excellent in contact pressure with respect to the connected body at the time of pressure connection. In particular, the resin particles which are composed of the (4) oxygen-fired aggregate and the ethylene polymer are excellent in elastic deformability and contact pressure, and the connection of the obtained conductive fine particles is more sinful. Be ideal. In the month, the ethylene polymer is polymerized for a vinyl-containing monomer (radical polymerization in the present invention, in "vinyl", not only carbon one: double bond, and 'also contains, for example, (meth) a substituent of a polymerizable carbon-carbon double bond of acryloxy, allyl, isopropyl, ethyl phenyl or isopropyl phenyl. In addition, 'in this specification, '(meth) propylene "醯基", "also (meth) acrylonitrile _ oxy", "(meth) acrylate" or "(meth) propylene" respectively mean "acrylic acid, methyl propyl sulfhydryl" Species or two", "one or two of propylene oxy, methyl propylene oxide", "one or two of acryl vinegar, methacrylic acid" or {"propylene, methacryl One or two of the vinyl-containing monomers described above are contained in -. The saponin has a viscous base monomer (1), and has an ethyl bake group and a vinyl group in the ruthenium molecule. The monomer (2) having a functional group (a protonic hydrogen-containing group such as a carboxyl group hydroxyl group or an alkoxy group, etc.) and two or more monomers (3) in the ! molecule. The monomer (1) is an ethylene-based non-crosslinkable monomer. The mono-(2) system may be present in the other groups in the reaction (bonding) to the base of the ruthenium, the meridine, and the ruthenium group 4 In the state of the early morning, the cross-linked structure is formed, so that it is a vinyl-based cross-linking monomer, and it is a county.,, .c ^ 彳-疋, and the base of the reaction is not in the state of other monomers. It becomes a vinyl non-crosslinkable monomer.

12 201241072 . The body (3) is a vinyl crosslinkable monomer. These monomers (u to (3) may be used singly or in combination of two or more kinds. The monomer (1) (ethylene-based non-crosslinkable monomer) may be, for example, a methyl group (mercapto group). ) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, isopropyl hydrazide, pentyl (mercapto) Acetic acid vinegar, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (decyl) acrylate, fluorenyl (fluorenyl) acrylate, fluorenyl (fluorenyl) acrylate, Alkyl (meth) acrylates such as lauryl (meth) acrylate, stearic acid (meth) acrylate, 2-ethylhexyl (meth) acrylate; cyclopropyl (meth) acrylate Ester, cyclopentyl (fluorenyl) acrylate, cyclohexyl (meth) acrylate "cyclooctyl (meth) acrylate, cycloundecyl (meth) acrylate, cyclolauryl (fluorenyl) acrylate, isobornyl (meth) acrylate, 4-t-butylcyclohexyl (meth) propylene Cycloalkyl (meth) acrylates such as esters; phenyl (meth) acrylate, benzyl (meth) acrylate, tolyl (meth) acrylate, phenyl Aromatic (fluorenyl) acrylates such as fluorenyl acrylates; stupid ethylene '〇-methyl styrene, m. methyl styrene, p-mercapto styrene, α-methyl benzene Styrene-based styrenes such as alkyl styrenes such as ethylene, P-t-butyl styrene, fluorene-styrene, m-chlorostyrene, P-gas styrene, etc. A functional monomer, etc. As a monomer (2) (ethylene crosslinkable monomer or ethylene non-crosslinking raw monomer), for example, a repellent body such as (mercapto)acrylic acid; Hydroxyethyl (meth) acrylate, 2-hydroxypropyl (mercapto) acrylic acid, hydroxy group (methyl) 13 such as 2-hydroxybutyl (meth) acrylate, etc. 2012 201272 acrylate, a monomer having a hydroxyl group containing a vinyl group or the like; a methoxyethyl (meth) acrylate or a 3-methoxy group; Alkoxy styrene containing alkoxy (mercapto) acrylate such as butyl (fluorenyl) acrylate or 2-butoxyethyl (meth) acrylate or P-methoxy styrene A monomer having an alkoxy group, etc., etc. As the above-mentioned monomer (3) (ethylene crosslinkable monomer), for example, an allyl group such as a propyl (mercapto) acrylate is used. Acrylates; ethylene glycol bis(indenyl) acrylate, 1,4-butanediol di(methyl) acrylate, 1,6-hexanediol (fluorenyl) acrylate ' 1,9-nonanediol bis(indenyl) acrylate, 1,10-decanediol di(meth) acrylate, 1,3 - butene di(methyl) propyl Chain diol di(methyl)propionate such as dibasic acid ester; diethylene glycol di(meth) acrylate, triethylene glycol bis(indenyl) acrylate, ten ethylene glycol di(曱) Acrylate, pentadecyl ethylene di(meth) acrylate, one hundred and fifty ethylene glycol di(methyl) propionate, polyethylene glycol di(meth) acrylate Polypropylene glycol di(methyl) propyl a di(meth)acrylate such as a polyalkylene glycol di(meth)acrylic acid vinegar such as an acid ester or a polytetramethylene glycol bis(indenyl) acrylate; trimethylolpropane tris(III) Three (mercapto) acrylates such as methyl acrylate; tetrakis(yl) acrylates such as pentaerythritol tetrakis(meth) acrylate vinegar; and dipentaerythritol hexa(meth) acrylate vinegar; An aromatic hydrocarbon-based crosslinking agent (preferably a stupid vinyl-based polyfunctional monomer such as divinyl phenyl), such as dimethicone, divinyl benzene, divinyl naphthalene, and derivatives thereof; n, n - a hetero atom-containing crosslinking agent such as divinylaniline, diethyl ether, divinyl sulfide or divinyl acid.

S 14 201241072 The above-mentioned poly-stone-burning bone system is obtained by the (four) combination of the Si Xi Yuan series monomer. The above-mentioned (four) system is roughly divided into a money-parent monomer and a decane-based cross-linking single. body. Examples of the above-mentioned decane-based non-crosslinkable monomer include a dimercapto-dimethoxy-cut U-based group: an ethoxy group or the like, a second-complex (four) or the like: ― a functional monomer; a trimethylmethoxy group; H-methyl ethoxy shi xiyuan special three-burning base (four), etc. 丨 functional money W material. These non-crosslinking single systems can be used singly or in combination of more than one. There is no particular limitation on the case where the cross-linked single system of the Shishi-sinter system can be formed into a cross-linked structure. A series of crosslinked structures formed by cross-linking monomers of the Shixi system are cross-linked organic polymer skeletons (for example, ethylene polymer skeletons) and organic polymer skeletons (first form); cross-linked polycondensation矽 产 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨 骨Divinyl decane, methyl trivinyl decane, vinyl decane, etc. As a series in which the second form can be formed, for example, tetramethoxy decane, (5) ethoxy decane: tetraisopropoxy (tetra), tetrabutoxy A trifunctional decane monomer such as methyl trimethoxy decane, decyl triethoxy decane, ethyl trimethoxy decane or ethyl triethoxy decane As a series which can form the form of f 3 , for example, 3-mercapto acryloxypropyl trimethoxy decane, 3-mercapto propylene methoxy propyl triethoxy decane, 3- propylene oxy group Propyltrimethoxydecane, 3-methylpropene: oxygen 15 201241072 propyl propyl hydrazine Decane, 3-mercaptopropenyloxypropylmethyldiethoxydecane, 3-propenyloxypropyltriethoxydecane, 3-methylpropenyloxyethoxypropyltrioxane a compound having a (fluorenyl) acrylonitrile group such as a decane or the like; a vinyl group having a vinylidene trimethoxy group, a vinyl triethoxy group, a bismuth-vinyl stearoxy decane, or the like; 3 —glycidoxypropyl dimethoxy oxime, 3-glycidoxypropyl triethoxy oxime, 2 (3′4_5 oxocyclohexyl)ethyltrimethoxy shixiyuan, etc. Those having an epoxy group; 3-aminopropyltrimethoxy decane, 3-aminopropyltriethoxy decane, etc. having an amine group. These decane-based crosslinkable single systems can be used alone. Further, it is also possible to use two or more kinds of .....^^ w & 3' C* ^ compound and at least one of the materials of the poly-stone compound, which means that the formation of ethylene polymerization a vinyl-based cross-linkable monomer or a vinyl-based non-crosslinkable monomer, or a cross-linking or decane-based cross-linking single body comprising a skeletal oxide-forming skeleton It is the best in the case of the prefecture, and it is the best to control the resin particles. It is the best in the resin particle. It is by the burial of the ethylene polymer and the cross-linked polyoxane skeleton to the small material and the 7A 7 hole is also formed by at least one of the moon, and the resin particle system is also the county 筇. The following conditions 12 nnnw / a 4 tree know the 10% K value of the particles, into u, 〇〇〇 N / mm2 or more, so the fat 钿 2 as the first to start the shape of the monomer The male valve begins to form, at least the kind of sexual monomer == sex -: body".), Xiao Ba: & person 1 Also, S is only called "crosslinking; package 3 its total content | 4 days m # ' relative to the total amount of monomer components

16 201241072 20 quality / 〇 or more (preferably 3 〇 quality F, set above, more preferably 50% by mass or more) (Condition A). Then, satisfying the condition A^^^^", and also making the total mixture of the decane 糸 parent-linked early body and the decane-based non-crossing & 八+ > π # θ twins 95% of the knives in the knives (conditions Β), - 乂 疋矽 疋矽 糸 糸 糸 糸 矽 矽 矽 矽 矽 矽 矽 矽 矽 合 合 合 合 战 战 战 战 战 战 战 战 战 战 战 战 战〇°c or more, Xu 'X, heated to obtain the particles (condition C). That is, by satisfying the first two 4 ~ Ί 仟 A and then return to condition B,

Alternatively, the above-described condition A 19 nnnM / 2 and the condition C: described above are satisfied, and resin particles having a value of 12' or more are obtained. Specifically, when the condition A of the introduction is satisfied, the resin particles which are subjected to cross-linking by at least one of the cross-linking: cross-linking: at least one type of the monomer are obtained. In the condition B of the above description, the intersection of the resin particles is carried out in the main body of the ethylene crosslinking monomer, and in the above-mentioned condition C, the hunting is caused by the decane crosslinking monomer. Handing over becomes the subject. However, the Shixia-fired cross-linked single system forms a zeolitic oxygen bond by a condensation reaction: it constitutes a crosslinked structure, but at the stage after the polymerization, the ruthenium complex reaction is not sufficiently advanced. In the case where a large amount of a decane-based crosslinkable monomer is used, the resin particles after polymerization are recommended to be calcined (heat treatment at a high temperature). However, due to the thermal history of the resin particles after polymerization, the value of the 1% κ is greatly reduced. Therefore, under the condition of the aforementioned condition c, it is necessary to restrict the heating of the resin particles after the polymerization. 〜,, in the above-mentioned condition c, it is necessary to specify the winter heating system after the synthetic resin particles, and to heat the MB ^ 芍 object for all the particles, not only the above-mentioned firing (due to the decane series The sleeve reaction 17 201241072 (formation of the formation of the austenite bond)-heating by a person, and the like, and the addition of the resin particles after the synthesis of the resin particles, for example, heating in the case of hydrazine, is targeted.

Further, in the above-mentioned condition c I, the heat temperature becomes a predetermined..., and it is preferable to add a temperature to the range of the specification and to heat the inert gas atmosphere. The battle for the nitrogen on the other hand 'satisfies the above # #月 m " κ condition A and the condition B of the tree 曰 '5 ' does not limit the addition of resin particles after polymerization - ..., on the occasion In the state where the temperature is lower than the thermal decomposition temperature, the environment of the heat treatment is also an inert gas atmosphere such as nitrogen. The condition B is the condition of the pre-condition A and the condition Γ $4, and the early body component contains at least one of the ethylene-based crosslinked body and the sinter-fired cross-linking monomer, but Since the value of 1 〇 " of the resin particles is surely controlled to be i2 〇 _ / mm 2 or more, the more preferable ethylene-based crosslinkable monomer and the money-based cross-linking are described below. The early body is as described above. The ethylene cross-linking single system is more sure

In terms of 10% K value, Jixian County, +. DD currency J is best described as the monomer (3). Even in it, it is more desirable to have two or more (mercapto) acryl fluorenyl precursors in the first 9 and oo knives (that is, there are two or more acrylonitrile in the i molecule). The monomer of the group is either a monomer having two or more methyl propyl sulfonium groups in one molecule, or one or both of styrene-based polyfunctional monomers. The early system having two or more (meth) propyl fluorenyl groups in one molecule of the first one is the most suitable for obtaining resin particles having a high 〇 κ value. 18 201241072 A monomer (di(meth)acrylate) having two (meth)acrylonitrile groups therein. Among the bis(indenyl) acrylates, alkanediol di(meth)acrylates, polyalkylene glycol di(meth)acrylates are more preferred for the same reason, especially because Since the decrease in the strength of the particles after the coating of the conductive metal layer is small, an alkanediol di(meth)acrylate is preferable. Further, among the bis(indenyl) acrylates, it is particularly preferred to have a carbon-carbon double bond (C=C) bonded to two (meth) acrylonitrile groups and have an atomic number of 6 ～14 molecular structure of the two (meth) acrylate. In addition, the 'number of atoms' existing between the carbon-carbon double bonds is not calculated by carbon-carbon double bonds (c = carbon atoms of ruthenium itself, in the presence of a plurality of linked (meth) acrylonitrile groups In the state of the atomic chain between the two, the number of atoms that are the shortest atomic chain. As the styrene-based polyfunctional single system described earlier, the particle strength of the resin particles after the high (10) K value is easily obtained and the conductive metal layer is coated The aspect of the reduction is smaller. It is preferably a monomer having two vinyl groups (including two official 35 vinyl monomers) in the molecule, and even in it, it is preferably diethylbenzene. The monomer component for forming the resin particles preferably contains 10% by mass or more of the ethylene-based crosslinkable monomer, more preferably 3% by mass or more, even more preferably 50% by mass or more. When the content of the ethylene-based crosslinkable monomer is within this range, the 〇% κ value can be more reliably controlled to be 12 ΟΟΟΝ/mm 2 or more. The decane-based crosslinkable single system is more surely Control ίο% κ value, it is best to shape Crosslinking of the third aspect described above 19 201241072 The structure of the stone-fired system is cross-linked with M _ ΐ ΐ ΐ ΐ, and it is easy to obtain particles of high hardness. In the use of the above-mentioned Shi Xiyuan system cross-linking, Bu 4 „0 ^ ϋ early body In the state of the resin particles, it is preferable to contain a polyoxyalkylene skeleton which is formed by hydrolyzing and shrinking a decane-based monomer containing a cross-linking monomer of 石ω, ρω 3 糸 ,, but The polyoxyalkylene skeleton formed by at least hydrolyzing and condensing the decane-based crosslinkable monomer capable of forming the crosslinked structure of the third embodiment of the present invention has a carbon-containing carbon having a polymerizable 5 It is preferable that the decane-based crosslinkable single system having a double bond (for example, a vinyl group or a (meth) acryl fluorenyl group) has a crosslinked structure capable of forming the crosslinked structure of the third aspect. Methyl) acrylonitrile, having a vinyl group or having an epoxy group is more desirably having a (meth)allyl fluorenyl group, having a vinyl group or even preferably having a (meth) acrylonitrile group. Among the (meth) acrylonitrile groups, particularly preferably 3-methacryl oxime Propyl trimethoxy methoxy 3 propyl methoxy propyl methoxy methoxy methoxy siloxane, among the vinyl groups, particularly preferably vinyl trimethoxy decane. A and the above-mentioned condition B or the above-mentioned condition A and the condition C of the monomer component described above include at least one of a vinyl crosslinkable monomer and a decane crosslinkable monomer, but may also contain a vinyl group. At least one of a non-crosslinkable monomer and a decane-based non-crosslinkable monomer. In particular, when a vinyl-based non-crosslinkable monomer is contained, it is easy to control the compression characteristics such as recovery characteristics (recoverability) or breaking strength. Therefore, it is preferable that the ethylene-based non-crosslinkable single system is the aforementioned monomer (〇, more preferably an alkyl (meth) acrylate or a cycloalkyl (methyl) propyl group. Dilute vinegar, aromatic ring (methyl) propylene succinic acid s, styrene single " officer 20 201241072 energy monomer. Even in the case of controlling the recovery characteristics (restoration) or breaking the strength and easily obtaining a resin particle having a high K value of 1%, it is preferable to use a ketone group having a carbon number of 4 or less (methyl). Acrylates, cycloalkyl (meth) acrylates having a cycloalkyl group having 6 or less carbon atoms, and stupid vinyl monofunctional monomers are particularly in the form of resin particles having a value of 10% by weight. It is preferable that it is a styrene-based monofunctional monomer. As the present ethylene, the early system can be more preferably styrene in terms of easily obtaining a resin particle having a K value of 1% K. In a hospital having a carbon number of 4 or less. Among the alkyl (meth) acrylates, n-butyl acrylate, η-butyl methacrylate, and methyl methacrylate are preferred. The cycloalkyl group having a carbon number of 6 or less is preferred. Among the cycloalkyl (meth) acrylates, cyclohexyl acrylate "cyclohexyl decyl acrylate" is preferred. For example, a styrene-based monofunctional monomer is included as the monomer (j). Preferably, it is contained in one molecule having two or more (fluorenyl groups) The monomer of the olefin group or the styrene-based polyfunctional monomer is used as the form of the monomer (3). The amount of the above-mentioned resin particles is 10% Κ and becomes 12,000 Å/mm 2 or more. The body component is roughly divided into a form having a vinyl crosslinkable monomer and having no decane crosslinkable monomer, and (ii) having a sinter calcining crosslinkable monomer without an ethylene crosslink. The form of the unitary monomer, (iii) the form of the ethylene parent monomer and the calcined crosslinkable monomer. The combination of the particularly desirable monomers of each form is as follows: (i) The state of the form (having a vinyl cross-linking monomer and not having the form of a cross-linking monomer of the Shixiyuan system): 21 attached to two (mercapto) acrylonitrile groups 201241072 Carbon-carbon double bond The number of atoms existing between (c==c) (however, the carbon atom of the carbon-carbon double bond (c=c) is not calculated, and there are atomic bonds between a plurality of linked (meth) acryloyl groups. In the state, it becomes the atomic number of the shortest atomic chain.) It is 6 to 14 bis (meth) acrylate and monofunctional styrene a combination of (ii) a form (having a form of a decane-based crosslinkable monomer and no vinyl crosslinkable monomer): a decane having a (meth)acryl fluorenyl group or a vinyl group in a molecule a combination of crosslinkable monomers (for example, a combination of 3-methacryloxypropyltrimethoxydecane and 3-mercaptopropoxypropylmethyldimethoxydecane). (iii) a state of a form (having a form of a vinyl crosslinkable monomer and a decane crosslinkable early form): a decane crosslinkable monomer having a (meth) acrylonitrile group, a styrene-based polyfunctional monomer, and The number of atoms present between the carbon-carbon double bonds (C=C) of two (meth) propyl fluorenyl groups is 6 ~" bis(meth) acrylate combinations, + β, or a combination of a decane-based crosslinkable monomer having a (meth)acryl fluorenyl group, a stupid enantiomer, and a styrene-based monofunctional monomer. The state in which the average number of the particles of the resin particles is 2. 0 # m or more and 2. 5 # m or less

r In order to make the 10% K value of the resin particles to 17, 〇〇ON/mm2 or more, in addition to the above, the 10% K value is set to be 12,000 N/mm2 or more. The above conditions (satisfying the condition A and the condition B or satisfying the condition A and the condition "territory, both thousand 1") satisfy the following condition X and the following condition a ' or may satisfy the following Condition X and the following condition b 1. However, in combination with the condition A ^ ^ ' A and condition C are selected as

S 22 201241072 makes the l〇% K value become 1 2 000 N/mm 2 or more and the condition x and condition a. <In the condition of the condition, the monomer component for forming the resin particles is ... The content of the coupling monomer is 5 ff / for the total amount of the monomer component. In the case where the content of the decane-based precursor is less than 50% by mass based on the total amount of the monomer-forming knives, the content of the ethylene-based cross-linking precursor in the early component of the single A, 〇〇^ (1) The quantity is the same. /, L is 35 mass/6 or more in the total amount of the early body components. The condition a'帛 is such that the amount of ethylethylene in the monomer component forming the resin particles is based on the total amount of the monomer components! Below mass%. ": piece bl: the content of ethylvinylbenzene in the monomer component for forming the resin particles is more than 1% by mass relative to the total amount of the star-shaped, eight- θ, and the early-formed knives. The content of the ethylene-based crosslinkable monomer in the early forming of the resin particles is 80% by mass or more based on the total amount of the monomer components, and the resin particles are heated at 200 t or more. In the above-mentioned resin particles, you t,, + "k is relatively large (that is, the average dispersion of the number of particles is 2 η " ^ horse above the state), in order to more mention the South 10% depreciation ' Therefore, it is necessary to judge a > more to the father's private degree. When the above condition X is satisfied, it is possible to use R η » θ „ straw from 50 mass% or more of decane crosslinkable monomer or 35 The ethylene-based crosslinkable monomer having a mass% or more and more to improve the cross-linking, and the amount of the ethylidene which does not contribute to the cross-linking in the monomer component is controlled to be 1% by mass or less (the aforementioned Condition a), or if the content of ethyl vinyl stupid exceeds 1% by mass, in order to supplement this, therefore, the content of the parenteral monomer of the 偏 寸 糸 , , , It becomes 8 〇 23 23 201241072%% or more 'and the crosslinking is promoted by the heating of 赖定夕+勒## (the aforementioned condition bl). This ensures a higher cross-linking. 'In another aspect, the diameter of the number of the resin particles is 1. 0 /im is μ ο π τ The value of the 敢 板 粒子 粒子 粒子 * * * 、 、 、 、 、 、 、 、 、 、 、 ' ' 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了/β Κ value is greater than 19, 6〇〇N/mm2, the aforementioned 10% K value is A nnnM / 2 except for the condition of being 12, OOON/mm or more (read

And condition β both abbreviated aq u piece A / person 疋 satisfy both condition A and condition G), full n condition a ' or satisfy the following conditions b condition a and bar Γ A from * 彳- In the state where the condition C is selected as the heart so that the ln κ value becomes 12, and the condition of the coffee mm or more is satisfied, the aforementioned condition a is satisfied. Condition b2 - the rare base in the monomer component for forming the resin particles, the violent base: ... the monomer used to form the resin particles under the core of the total amount of the monomer component In the component, the ethylene-based cross-linking singularity of the component is 35% by mass or more based on the total amount of the monomer components, and the resin particles are heated at 200 C or more. = the state in which the particle diameter of the resin particles becomes small (that is, the number of reference states ^: the two diameters are less than the U state), and the degree of crosslinking is lower than that of the e Ρ which is larger than the particle diameter. Can increase the 1G% threshold. Also 2::,4 has increased the value of 1%% and the degree of cross-linking required to have a grain:; the tendency to become smaller and become lower. Therefore, in the state where the average number of the resin particles is less than 2. 0^^, when the above-mentioned condition is not required, the content of the ethyl vinyl group exceeds 1% by mass. The amount of the ethylene cross-linking monomer is 35% by mass or more (pre-b) and ensures a higher cross-linking.

S 24 201241072 This is a value which causes the compression of the resin particles to deform the deformable body T, and therefore, for example, it may contain an Ethylene-anthracene-type pre-existing body for use as a real field, and, for example, to form a resin. The monomer component of the particles, in the ethylene crosslinkable monomer, is 50% or more (more reasonable = 60% by mass or more, even more preferably 70% by mass or more), and has two vinyl groups in two. Monomer (containing 2-functional ethylenic monomer). Containing 2-functional ethylidene single / early body to be a crosslinkable monomer (Ethylene crosslinkable monomer and Shiqi burnt crosslinkable monomer) The total amount is 50% by mass or more, and even the most ambiguous (9) or more (more desirable to preferably 疋60% by mass or more) is also reduced in deformation rate and 20% to 4%% κ# && ▲, +, 々 ,; pressure, value becomes the aspect of the scope.

The M-emulsified polycondensate of the resin particles is not particularly limited, and examples thereof include a seed polymerization method and the like, and the sol-gel crystals and the sol-gel crystals have a particle diameter of the resin particles in a predetermined range. The most ",", and the second is good, for example, after the resin particles are formed by the seed polymerization method, the synthesis of the classified particles is carried out, and the seed polymerization method is used, and the resin is used. In addition, it is possible to adjust the average particle diameter by removing the coarse particles by the resin particles having a small distribution of eight or two human degrees, and to remove the coarse particles, thereby achieving a desired range. The polymerization method consists of crystallizing, merging into the corpse, "...the particle-adjusting process, the absorption of the particles, the detachment...the 构成一^ is composed of organic materials, and the acetylene monomer in the right 彳" To modulate the seed crystals in the form of "organic materials and particles with the characteristics of the granules of the granules of the granules" Particles (polyoxane particles). 25 201241072 A method of modulating seed crystal particles by using a vinyl monomer, for example, a saponification polymerization, for example, a saponification-free emulsion polymerization. The phenethyl hydrazide d: monomer component is preferably a method of modulating the seed particles (poly"-fired particles of the above-mentioned lithium monomer r by a singular method to carry out hydrolysis and polycondensation.体, 矽 糸韭 · · · 吏 刖 刖 刖 矽 矽 矽 矽 矽 矽 交 交 交 交 交 交 、 、 、 、 In addition, in the polyoxane skeleton; ^ r method polymer in the form of a composite can you " & alkane lattice and ethylene have a free radical poly-humanity Wu Zhiyuan system can be used to cross-link a monomer, a polymerized polyoxan oxide particle (a particle having a white 聚合 w 。 。 性 ) ) ) ) ) ) ) 心 心 心 心 心 心 心 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Ren Yifang Mu fj adopts methods such as generalization, division, continuous, etc. The hydrolysis is carried out to use the atmosphere, urea, and the catalyst system is preferably hydrogen negative "μ & alkanolamine, tetramethylammonium hydrogenation An alkaline catalyst such as an oxide, an alkali metal or an alkaline earth metal hydroxide. In the above-mentioned solvent containing water, the medium may contain an organic solvent in addition to water or a catalyst. Examples of # _ '"糸 include methanol, ethyl isopropyl alcohol, butyl alcohol, isobutyl alcohol, ethylene glycol, propylene glycol, i4 butyl/e..., "alcohol, 戍7 7 butane diol, and the like. Alcohols; ketones, methyl ethyl ketones, etc.; acetonitrile, „, yiyi 酉 4 esters; isooctane, cyclohexane (3⁄4) paraffin; stupid, A group of 4 aromatic hydrocarbons, etc. These systems are used alone or in combination of two or more. In the hydrolysis condensation, it is also possible to use an anionic, cationic or nonionic interfacial activity. Or a mixture of polyethylene glycol and polyethylene

S 26 201241072 and other polymer dispersants. These lines can be used singly or in two. The hydrolysis condensation system may be a decane monomer which is mixed as a raw material. And after the solvent containing the catalyst or water and organic solvent, by means of warm production. . Above, loot below, preferably. . . Above 7 (rc below, giving two minutes to die, less than 10 hours, and then undergoing hydrolysis condensation. In the month of the absorption process, in the seed particles, the method of absorbing monomer components is if it is in the seed particles In the presence of the monomer in the presence of the monomer, it is not particularly limited. Therefore, the monomer component may be added to the solvent of the particle, and may be in the solvent of:: early = component In addition, it is preferable to add a single component to the solvent in which the seed particles are dispersed in advance, in particular, it is not removed from the reaction liquid (seed particle dispersion). The seed crystal particles obtained by the condensation process are not complicated in the process of adding the components in the reaction liquid, and have good productivity, so that they are ideally separated. ¥ One absorption process, the addition time of the monomer components There is no special restriction on 'can be added in abundance' and 'can be divided into several times and added two: = 'can be supplied at any speed'. In addition, in force: early A, you can only Adding monomer into It is also possible to add each of the liquids of the single-grinding knife. However, it is more efficient to carry out the mixing of the seed particles in the emulsion of the monomer component by emulsifying and dispersing the monomer component in water or an aqueous medium. The above-mentioned emulsifier is not particularly limited, but, for example, an anionic surfactant or a polyoxyethylene alkyl ether, a polyoxyethylene alkyl phenyl group 27 201241072 ether, polyoxidation Non-ionic properties of ethylene fatty acid vinegar, sorbitol wild fatty acid vinegar, polyoxidation: sorbitol wild fatty acid vinegar, polyoxyethylene ethoxylate amine, glycerol fatty acid oxime ethylene oxide-propylene oxide block polymer In the surfactant system, the dispersion state of the seed particles after absorbing the seed particles and the monomer component can be stabilized, and it is preferable to use the emulsifier. These emulsifiers may be used alone or in combination of two. In addition, when emulsification and dispersion of a monomer component by an emulsifier, it is preferable to use water which is 3 times or more, or less than the mass of a monomer component, or a water-soluble organic solvent. As the above-mentioned water-soluble organic solvent: a series of methanol, ethanol, isopropanol, n-butanol, isobutanol, s alcohol, t-butanol, decyl alcohol, ethylene glycol, propylene glycol, An alcohol such as u-butanediol; (4) a ketone such as methyl ethyl ketone; a brewing such as ethyl acetate; etc. The 曰 absorption process is preferably in the above temperature range of 6 (rc or less) The mixture is stirred for 5 minutes or more and 720 minutes or less, and the absorption process is carried out at the same time. These conditions can be appropriately set depending on the type of the seed crystal or the monomer to be used, and the conditions can be only smear or combined. In the absorption process, in terms of the judgment of how the monomer component is absorbed into the seed particles, 'for example, by observing the particles by a microscope before the monomer component is added and after the end of the absorption phase, the monomer is observed. The absorption of the components confirms that the particle size becomes large and is easy to judge. In the polymerization process, a polymerization reaction is carried out for the monomer component absorbed in the seed particles. Here, 'the monomer component absorbed in the state in which the seed particles are polymerized polyoxyalkylene oxides and the free radicals of the polymerizable polyoxyalkylene oxide skeleton 28 201241072 Polymerization base system is polymerized, and the polymerization is carried out. The hospital bone and ethylene polymer are composited. The polymerization method is not particularly limited to PP. However, for example, a radical polymerization initiator is used, and the radical polymerization initiator is not particularly limited. For example, a peroxide-based initiator or an azo-based initiator can be used. Some of the radical polymerization initiators may be used singly or in combination of two or more. Lit# The reaction temperature at the time of (four) polymerization is preferably hunger or higher, more preferably 5 (TC or more, preferably 1 〇〇t or less, more preferably 8 〇 ° C or less. In a state where the reaction temperature is excessively low, There is a tendency that the degree of polymerization is not sufficiently increased and the mechanical properties of the composite particles are insufficient. On the other hand, in the state where the reaction temperature is excessively high, there is a tendency to cause coagulation between particles during polymerization. In addition, the reaction time during the radical polymerization may be appropriately changed in accordance with the type of the polymerization initiator to be used. However, it is usually preferably 5 minutes or longer, more preferably 1 minute or longer. It is preferably _min or less, and more preferably _min or less. In a state where the reaction time is too short, there is a state in which the degree of polymerization cannot be sufficiently increased, and in the state where the reaction time is excessively long, there is a possibility between the particles. The tendency to cause agglomeration occurs. b The average dispersed particle diameter of the number of resin particles after synthesis is preferably at least, more preferably 12 em or more, and even more preferably A m or more. 3.0/Z m or less is more preferably 28#m or less, and even more preferably 2.7/m or less. Further, the variation coefficient of the number of the dispersed particle diameters is preferably 1% or less, more preferably 9%. In the following, it is even more preferable to be 7% or less. 29 201241072 The resin particles synthesized as described above are preferably supplied to the classification in order to meet the required particle size. The classification method is not particularly limited, and for example, Screening by electroforming or the like; filtration using filters of membranes, leaf-fold filters, ceramic membrane filters, etc.; using conventional methods of classification by interaction of poor quality and poor fluid resistance The gravity difference of the device (the falling speed of the particles, etc. becomes the principle of the gravity classifier, the balance of the centrifugal force and the air resistance caused by the free vortex or the semi-free vortex is used as the principle (semi) free vortex centrifugation, by rotation The classification of the fan blade (rotor) and the centrifugal force generated by the swirling flow and the resistance caused by the air are used as the principle of the classification of the centrifugal fan of the additional rotating blade. Among these, from the viewpoint of classification accuracy and productivity, it is preferable to use an electroforming sieve. In the state where the electroforming sieve is used for classification, it is preferable to disperse the resin particles in the liquid. The dispersion of the medium is passed through an electrophoretic sieve. Examples of the liquid medium described above include water; alcohols such as decyl alcohol, ethanol, propanol, butanol; hydrocarbons such as hexane and octane; An aromatic hydrocarbon such as a benzene or a diphenylbenzene, etc. These may be used singly or in combination of two or more kinds thereof. Among them, an alcohol or a hydrocarbon is preferable, and methanol is more preferable. In addition, in order to increase the dispersibility of the resin particles, it is possible to add various dispersing agents to the liquid medium. The amount of the liquid medium used is preferably 100 parts by mass based on 100 parts by mass of the resin particles. The above is more preferably 200 parts by mass or more, even more preferably 500 parts by mass or more, more preferably 1,000,000 parts by mass or less, more preferably 5,000 parts by mass or less or even more preferably 2000.

S 30 201241072 The following is the cause of the injury. The resin particles are dispersed in the liquid medium. «For example, the method of irradiating the ultrasonic wave ** is not special. She is a stalker. For example, the stalking device, the two-speed stirring device, the colloid mill ～ A method in which water is dispersed in a pre-distribution device or the like. The temperature of the dispersion liquid when passing through the electroforming sieve is not particularly limited, and can be appropriately adjusted in accordance with the liquid medium to be used. However, usually 〇 = dm °, and the liquid temperature of the dispersion is of course not filled with liquid medium. 4 points. The pore size of the electroforming sieve can be changed to the required average particle diameter and coefficient of variation. It is possible to reduce the variation of the particle diameter of the resin particles by performing the classification by electroforming the sieve to remove the coarse particles. After the formation of T, the resin particles which are classified as needed are usually dried and added to the above-described baking (heat treatment). In the case of drying or heating treatment, it can be carried out according to a conventional method: However, as described above, the cross-linking monomer and money system used in the monomer component for forming the resin particles are used. The content ratio of the non-crosslinkable monomer is such that it is important to limit the temperature of such heat treatment to less than c c in a predetermined amount. The shape is not special, the gold flat sugar, the thin plate ‘preferably spherical, special

The resin particles (substrate) p 艮 , V obtained as described above may be, for example, any of a spherical shape, a spheroidal shape, or a needle-like shape, but it is preferably a true spherical shape. The substrate (resin particle) is formed as a conductive metal layer. The conductive fine particles of the present invention have at least one conductive metal layer on the surface. 31 201241072 The metal system does not have 牿Ει| κρ宋, & β, another j limited 疋 疋 ' enumeration such as gold, silver, copper, platinum, iron ϋ 、, 把, 录, 钱, 钌, 录, New Zealand, 锗, wrong, tin, cobalt, indium and metals such as nickel-phosphorus, nickel-boron or metal compounds, and alloys thereof. Even among these, it is preferable that gold, recording, silver, steel, and tin are conductive fine particles having good conductivity. In addition, in terms of cheap, it is best to be brocade, nickel alloy (Ni_虹, ^一Μ, l-Pd-Au, Ni-Ag); steel, copper alloy (Cu and y, c〇, Ni, Zn An alloy of at least one metal element selected from the group consisting of Sn, In, Ga, Ti, Zr, W, Mo, Rh, Ru, Ir, Ag, Au, Bi A1, Mn 'Mg, p, B, It is preferably an alloy of Ag, Ni, Sn' &alloy; silver, silver alloy ug and Fe, C0, Nl, Zn, Sn, In, Ga, Ti, Zr, w, M〇, Rh, Ru, Ir, Au, Bi, A1, Mn, Mg, p, "the alloy of at least one metal element selected from the group _q, preferably Ag_Ni, ^-Sn, Ag-Zn"; tin, tin alloy (for example, Sn- ", such as "Cu, such as ~

Cu-Ag'Sn-Zn, Sn-Sb, Sn-Bi-Ag, sn-Bi-~ Au, Sn-Pb, etc.). In the alloy, it is also possible to make the conductive metal layer more easily by hardening the nickel alloy particles. More preferably, the conductive metal layer is formed of a nickel or a nickel alloy as the above-mentioned metal or the like. The present invention achieves the desired effect by designing a high-pressure mark forming property of a resin as a substrate. However, in view of the effect, it is desirable that the surface of the conductive fine particles have a suitable hardness which can follow the substrate. When a metal layer composed of a nickel alloy is recorded, it has an appropriate hardness by the fruit. From this point of view

32 201241072 The nickel alloy of the conductive metal layer is particularly preferably a Ni alloy capable of using at least one of phosphorus (p) and boron (B) as an alloy component (Ni-p alloy, Ni-B alloy, Ni-P_B alloy) More preferably, it is an alloy containing phosphorus (p). The nickel alloy is softened by the inclusion of phosphorus (P) or boron (B), and the conductive metal layer is easily followed by the substrate. In a state in which the nickel alloy constituting the conductive metal layer contains phosphorus (p) or boron (B), the total content of phosphorus (P) and boron (B) is preferably relative to Ni, P in the alloy. The total of B is 1% by mass, and is 4% by mass or more, more preferably 5% by mass or more, and even more preferably 6% by mass or more. The phosphorus content is preferably 5% by mass or more, more preferably 5% by mass or more, even more preferably 6% by mass based on 1% by mass of the total of Ni, p, and B in the alloy. In addition, the content of the boron (B) alone is preferably 4% by mass or more, more preferably 5% by mass or more, even more preferably 5% by mass based on the total of Ni, P, and B in the alloy. 6 mass% or more. The more the content of phosphorus (p) or boron (B) is, the softer the nickel alloy is, and the effect of the present invention is easily exhibited. However, the content of phosphorus (p) or boron in the nickel alloy is high. When the amount is too large, the resistance value of the conductive metal layer becomes high. Therefore, the total content of phosphorus (P) and boron in the nickel alloy is preferably the total of Ν, Ρ, and β in the alloy. When the mass is 1% by mass, it is 15% by mass or less. For the same reason, the ρ content in the nickel alloy is preferably 15% by mass or less, and the niobium content in the nickel alloy is preferably the same. It is 丄〇% by mass or less. In addition, the P content and the B content in the nickel alloy are The P concentration, the B concentration, the pH value, and the like of the electroless nickel plating solution used for forming the conductive metal layer are controlled. 33 201241072 Further, the alloy alloy constituting the conductive metal layer may contain phosphorus (p). Or a metal component other than boron (B). The other metal component is preferably a non-oxidizable metal element such as Au or pd, insofar as it does not impair the effect of recording the alloy. It may be a single layer, and may also be a plurality of layers. In the state of a plurality of layers, it is preferable to enumerate, for example, a recording (recording alloy) - a gold ^ (10) alloy, and a recording (10) alloy) - a gold, a record Alloy) - a combination of silver and the like. The thickness of the conductive metal layer is preferably 〇〇1" or more, more preferably 〇.03...upper or even preferably 0.05..., preferably. .20..., more preferably.·18" Below, it is even better to be 0.15" or less" more preferably 0.12...the best is below._"The following. In the conductive metal layer which is a fine particle diameter of the resin particles as the substrate, if the thickness of the conductive metal layer is the above-mentioned range = when the electrically conductive fine particles are made as an anisotropic conductive material, S In order to maintain the stability of the electrical connection. The opening of the conductive metal layer is not particularly limited, and may be, for example, a method of electroless recording on the surface of the substrate, a method of electrolysis, or a substrate. The conductive metal layer is formed by a method of forming a conductive metal layer by a physical vapor deposition method such as vacuum evaporation, ion implantation, or lithography. Even in the case where two of these devices can be easily formed into a conductive metal layer, it is preferable that the large-sized one is electroless plating. In addition, the conductive metal layer described above may be coated on at least a portion of the surface of the resin particle 34 201241072. However, it is preferable that the conductive metal layer has a substantial fracture or not. This so-called electron microscope (the surface of the 曰 曰 表示 表示 察 察 察 察 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用The surface of the particle is exposed. The conductive metal layer of the 4th layer is preferably smooth and not specifically said by the number of protrusions above the surface of the conductive metal layer. The degree is 0.05 (four) two soil # Good is relative to each H® conductive micro-synthesis / 1. One is more ideally less than 5 'special most = full so-called protrusions are represented by the same as the conductive metal layer: genus or sheet metal The conductivity is a part of the gold-to-metal layer and the metal or junction 16 constituting the protrusion. When there is a protrusion of the body by the same layer as the conductive metal layer, the protrusion may be feared. '''crack The base layer causes the metal layer to be broken, and is high when electrically connected. In addition, it is preferable to use the electric conductivity of the metal layer in the above-mentioned conductivity=connection=variation, and there is no metal particle attached due to the hanging. Or, even if it is attached, it is preferable that the number of the attached ones is reduced. It is considered to be %. In the eighth place, it is preferable that the number of adhesion of the metal particles is preferably less than two for each conductive fine particle. The number average particle diameter of the conductive fine particles of the lunar month is preferably "above, more preferably U" or more, and even more preferably i. Above, particularly preferably "above, preferably 2 8" or less m. The ideal is 2.6#m or less, and even the best summer. <Good 疋2.4" The following 'specially the most' below. If the average number of particles is within this range, 201241072 can be subtle and narrow. In addition, it is preferable to use a flow type particle image analyzer (manufactured by Sysmex Corporation, ΓρρΐΑ (registered trademark) - 3000" as the number average particle diameter of the conductive fine particles. And find 3 pieces of grain The average particle diameter of the number-based reference is preferably used. The conductive fine particle system of the present invention preferably has a compressive modulus (10% κ value) of 1 2,000 N/mm 2 or more and 2 在 when the diameter is displaced by 丨〇%. 〇〇〇n / mm or less. More ideally 2 4, 〇〇〇N/龙2 or more, even better, 1 5,000 N/mm2 or more, more preferably 17 〇〇〇Ν/_2 or more, even ideal 疋More than 20,000 N/mm2, more preferably 15 〇, 〇〇〇 / _2 or less, even more preferably 1 00,000 N / inm 2 or less, more preferably 75, 〇〇〇 n / mm 2 or less. If it is conductive microparticles When the κ% κ value is in this range, a sufficient indentation can be formed for the connected body (electrode), whereby the adhesion between the conductive metal layer and the connected body can be improved, and a large connection area can be secured. . Further, the 1 G% κ value of the conductive fine particles can be measured in the same manner as the 〇% Κ value of the resin particles. The conductive fine particle system of the present invention may have an insulating resin layer on at least a portion of the surface. In other words, the insulating resin layer is further provided on the surface of the conductive metal layer. When the insulating resin layer is laminated on the conductive metal layer on the surface as described above, it is possible to prevent the lateral conduction of the high-density circuit or the terminal connection. As the insulating resin layer described in the month 1J, it is possible to ensure conductive fine particles.

S 36 201241072 The insulating property between the particles is not particularly limited as long as it is easily broken or peeled off by a certain pressure and/or heating, and examples thereof include polyolefins such as polyethylene; (Mercapto) acrylate polymers and copolymers such as (meth) acrylate; thermoplastic tree ruthenium or its parent conjugate such as polystyrene; epoxy resin, phenol resin, amine resin (melamine resin, etc.) And other thermosetting resins; water-soluble resins such as vinyl alcohol and the like, and the like. However, when the insulating resin layer is excessively harder than the substrate particles, it is likely that the m of the pure particles is destroyed first, and the insulating resin layer is used. A resin that is not crosslinked or has a low degree of crosslinking. Don't be fascinated by the insulating resin layer ~T / day l q μ 疋田复层. For example, a single or plural film-like layer may be formed, and may also have an insulating granular shape, a spherical shape, a block shape, and a scaly shape: a layer attached to the surface of the conductive metal layer, and The straw is chemically modified on the surface of the conductive metal layer to damage the second layer. The thickness of the insulating resin layer is preferably 〇l#m or more, 丨above or more, n R (four) or less, more preferably 0.02" or more and 0.5"·π or less, and even more preferably T, ® a 疋1^ 03# m or more, 0. 4// m ,

If the thickness of the insulating resin layer is a 、, A, 卜, , , , , , ^ and the degree is within the range of the range, M is good.. Because of the electrical insulation between the conductive particles Good, into conduction characteristics, and 1 2. anisotropic conductive material, the anisotropic conductive material of the present invention, dispersed; ^ Xiangren &&>, describe the conductive particles of the present invention Adhesive resin. 37 1 The form of the conductive material of the king is not limited. For example, various forms such as an anisotropic conductive film, an anisotropic conductive paste, an anisotropic conductive adhesive, and an anisotropic conductive ink are exemplified. These anisotropic conductive materials can be disposed between the substrates or between the electrode terminals to form a good electrical connection. Further, in the case of using the conductive fine particles of the present invention, the conductive material of the invention has a conductive material for a liquid crystal display element (a conduction gap portion and a composition thereof). f is not particularly limited as long as it is an insulating resin, and examples thereof include a thermoplastic resin such as an acrylic resin, an ethylene-vinyl acetate resin, or a styrene-diene-small block copolymer; A curable resin composition which is cured by reaction of a monomer or oligomer of oxypropyl group with a curing agent such as isocyanate; a curable resin composition which is cured by light or heat, or the like. Further, the anisotropic conductive material of the present invention is obtained by dispersing the conductive fine particles of the present invention in the above-mentioned binder resin to obtain a desired form, for example, by using a binder resin and conducting electricity, respectively. The fine particles are connected to each other between the substrates to be joined or between the electrode terminals with conductive fine particles and a binder resin. In the anisotropic conductive material of the present invention, the content of the conductive fine particles can be appropriately determined depending on the application. For example, it is preferable that the total amount of the anisotropic conductive material is one body or more. : Product: Above, even better than 5% by volume, preferably 5. Modesty is more ideal. Below volume%, even better. When the amount of the conductive fine particles is too small, the amount of the conductive fine particles is too small, and when there is no such thing, the state in which the charge is not easily obtained is formed.

S 38 201241072 When the amount of electricity is too large, the contact between the conductive particles is a state in which the function of the anisotropic conductive material occurs. The film thickness of the film of the anisotropic conductive material of the present invention, the coating film thickness of the paste or the carrier, the thickness of the printing film, etc., t 'preferably, the particle size of the conductive fine particles of the present invention to be used and The specifications of the electrodes to be connected are appropriately set, and the conductive fine particles are sandwiched between the electrodes to be connected, and # is filled with the adhesive resin layer to sufficiently fill the gap between the bonded substrates forming the electrodes to be connected. . EXAMPLES Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited by the following examples, and % can be appropriately changed within the scope of the following description. And implementation, these are all included in the technical scope of the present invention. In addition, in the following, "%" means "the quality is not particularly limited, and the "part" means "mass portion%". 1. Physical Property Measurement Method Various physical properties were measured by the following methods. &lt;Average Dispersion Particle Diameter of the Flake Particles and the Resin Particles&gt; 005 mass parts of the resin particles are added to the polyalkylene ether ether sulfate ammonium salt which is an emulsifier (manufactured by Dai-Il Pharmaceutical Co., Ltd., "HITEN0L 2 parts by mass of a 1% aqueous solution of (registered trademark) N—08”), which was dispersed by ultrasonic waves for 1 minute, and then measured by a particle size distribution measuring apparatus ("Coulter multisizer m type" manufactured by Beckman Coulter Co., Ltd.). The particle size (μm) of the particles was determined and the average dispersion of the number of bases was 39 201241072. &lt;Number average particle diameter of conductive fine particles&gt; In the case of conductive fine particles, the mass of one is broken, and the residual ethylene which is an emulsifier is added, and the alkenyl ether is added ("EMALGEN 430 ^ τ , ^ , , , n/. 4d(j", manufactured by Kasei Co., Ltd.) 1. 4% aqueous solution 1 7 5皙^ 'Quality' after being dispersed by ultrasonic for 10 minutes' using a flow particle image decomposing device (The FPIA (registered trademark, 30 〇〇)) Measured by the particle size (# m ) of 3000 particles to obtain the number average particle diameter. <Thickness of the conductive metal layer> The flow particle image analysis device ("FpiA (registered trademark)-3_")" manufactured by Sysmex Co., Ltd. measures the number of base particles (resin particles) 3 (4) XUni) and the conductive particles 30 () The number average particle diameter K (four)). Next, the film thickness of the conductive metal layer was calculated according to the following formula: Film thickness of the conductive metal layer (# m) = (γ_χ)/2 &lt; Phosphorus of the conductive metal layer ( Ρ)Content> A conductive metal layer (electroplated layer) in which conductive particles are dissolved by aqua regia, by induction The coupled plasma luminescence spectroscopic analyzer (Icp) ("ICPE-9GGG", manufactured by Shimadzu Corporation) was analyzed, and the mass of Ni and the mass of p contained in the conductive metal layer per lg were determined by the quantitative results obtained. The P content (%) β was calculated according to the following formula. Further, the conductive metal layer formed in the following examples did not contain boron (Β). Ρ content (% by mass) = Ρ mass xl 〇 0 /(Nl mass + ρ mass) &lt;1 〇%~40% of resin particles K value and compression failure deformation rate>

S 40 201241072 Using a small compression tester ("Shimadzu?", W500" manufactured by Shimadzu Corporation), at room temperature (25. 〇, it is spread on the sample table (material: sks material plate) Use a circular plate press (material: diamond) with a diameter of 5 〇//11], and apply the load to the center of the particle at a certain load speed (2.295 mN/s) in the "standard surface detection" mode. Next, the load (mN) when the compression displacement becomes 1%, 2 (10), 3〇%, and 4〇% of the particle diameter, and the amount of displacement when the particle is destroyed by the deformation (the compression load obtained by ...) is measured. The κ value was calculated from the compression load and the particle diameter of the particles. In addition, for each sample, the measurement system was performed for different particles, and the average value was used as the measurement value. 2 _Manufacture of conductive fine particles 2 - 1. Preparation of substrate particles (resin particles) (Production Example 1) In a four-port furnace equipped with a cooling tube, a thermometer, and a dropping port, 180 parts by mass of ion-exchanged water, 24 parts by mass of 25% ammonia water, and sterol were added. 6 〇〇 mass parts 'under stirring, by drops Starting from the bottom of the mouth, add 3 methacryloxypropyltrimethoxy zebra (MPTMS), 4 parts by mass, as a polymerizable stone compound (monomer component), into #3-methyl propylene The hydrolysis/condensation reaction of methoxypropyltrimethoxy sylvestre to prepare an emulsion of polyoxan oxide particles (flake particles) having a methyl propylene oxide group. The average particle size of the dispersion is 94. 94 in m. Next, in the emulsifier, the polyvinylidene-ethyl sulphate is used as a emulsifier, and the HITENOL (registered trademark) NF is manufactured by the Industrial Pharmaceutical Co., Ltd. ) 20% aqueous solution 3 〇 mass parts to be dissolved in ion-exchanged water Mo 41 201241072 Mass-injured solution '60 parts by mass of styrene (St) added to the brain for dissolving absorption (early body component) and _ _ , ττν „ 60 parts by mass of a private monomethacrylate (HXDMA) and 2 2' anthraquinone | 雔广0 sigh z, z 虱 虱 bis (2, 4 - dimethyl a nitrile) (made by Wako Pure Chemical Industries, Ltd.) , "penta b5") 1. 6 parts by mass of the solution, emulsified and dispersed to prepare the absorption sheet, 丨λ丨#, six and the use of early body After 2 hours from the start of the emulsification, the liquefied liquid will be added, added to the emulsion of polysiloxane beads (flake particles), 廿Η ^ y, and also ordered to stir. Confirmed in the emulsion

If you add 1 hour, you can avoid the A moxibustion. When you take a sample and mix it and observe it with a microscope, the Ju Shi Xi Oxygen and Lu #3α 7 crater particles will absorb the monomer for absorption. .叮 接 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The reaction solution was heated to 65 C under a nitrogen atmosphere, and maintained at 6 5 ° C for 2 hours to carry out radical polymerization of the monomer component. For the solid-liquid separation of the sputum after the radical polymerization: the ritual/sputum after the intersection, the sputum is washed by ion exchange water and decyl alcohol, each &gt;, after the filter cake Under a nitrogen atmosphere at 12 ° C, 2 hours of direct light private β-true drying was carried out to obtain resin particles (1). The average dispersed particle size of the obtained resin particles, 1 〇 % 1U/° Κ value, 2〇% Κ value, 30% Κ value, 40% Κ value, and compression failure deformation rate are shown in the table. (Manufacturing Example 2) In addition to changing the type and amount of the absorbing monomer (parts by mass) as shown in Table 1, + tw, at the same time, in the atmosphere of the rod, 280t, the implementation of the small Japanese car Xi Shile Other than the heat treatment at the time of nitrogen y| , , , the same as in Production Example 1, the resin particles were obtained by the resin particles, the dispersed particle diameter, the 10% g value, and the 2%% 卩i _ value. 3 (UK value, 40% K value, and compression 42 201241072 The deformation deformation rate is shown in Table i. (Manufacturing Example 3) The spear 'has changed when modulating the poly-stone burning particles> hole/sputum The amount of water used by the ion father is 1 750 f, and the amount of the water is 650 t t t 成为 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 650 The average dispersed particle size of the number reference is 1. The average dispersed particle size of the resin particles, 10% K value, 20% ί (value, μ./, Λ value 3 (U Κ value, 40% Κ value) And the compression-deformation deformation rate is as shown in Table 1. (Production Example 4) Except that the type and amount of the monomer for absorption are changed as shown in Table i, He at the same Department

In Example 1, resin particles were produced). The average dispersed particle diameter, 10% κ value H value, 30% κ value, Κ value, and compression failure deformation rate of the obtained resin particles are as shown in the table. (Production Example 5) ^ Resin particles (5) were prepared in addition to vacuum drying for 12 hours while changing (parts by mass) as shown in Table 1. The obtained resin pellets are 20% Κ, 30% Κ, 40% Κ 1. (Production Example 6) When the type of the monomer for the absorption and the amount of the monomer to be used are dry, the average dispersed particle diameter, 10% κ value, and value of the produced product are the same as in the production example 1 in the nitrogen atmosphere at 8 (rc). And the compression failure rate is as shown in the table except that as shown in Table 1, the type and amount of the polymerized stone monomer are changed (parts by mass), while the compound and the 'drying absorption are obtained 43 201241072

The resin particles obtained were also subjected to the heat treatment for i hours under a nitrogen atmosphere at 320 t, and the resin particles were produced in the same manner as in Production Example i (the average dispersed particle diameter, 丨〇% κ value of the obtained resin particles) 2% κ value, 3 (10) K value, 40% Κ value, and compression failure deformation rate are shown in Table 1. (Production Example 7) Resin particles were obtained in the same manner as in Production Example 6 except that no heat treatment was performed ( 7) The average dispersed particle diameter, ι〇%κ value, 20% enthalpy value, 30% enthalpy value, 40% enthalpy value, and compression failure deformation rate of the obtained resin particles are as shown in Table 1. (Manufacturing Example 8) In addition to changing the type and amount of the monomer to be used (parts by mass) as shown in Table ', the resin particles obtained by drying are also subjected to heat treatment at 28 (TC, η, and under nitrogen atmosphere). The resin particles (8) were produced in the same manner as in Production Example 1. The obtained resin particles had an average dispersed particle diameter, a 〇% κ value, a 20% κ value, a success value, a ship value, and a compression fracture deformation rate. Table 1 is shown. (Manufacturing Example 9) In addition to modulating the polyoxo oxy-fired particle emulsion In the case of the ion exchange, the use of water is 1: 21 GG parts by mass, and the amount of methanol used is 3 〇〇 里 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' 树脂 树脂 树脂The average dispersed particle diameter of the number of polyoxymethane particles in the emulsion of the polyoxyalkylene oxide emulsion, 〇 83 ". The average dispersed particle diameter of the obtained resin particles, 10% enthalpy, 20% I ( The value, 30% κ value, machine κ value, and compression failure deformation rate are shown in Table i.

S 44 201241072 (Manufacturing Example 1 o) In addition to the type and amount of the absorbing monomer (parts by mass) as shown in Table 1, the resin particles obtained by drying are also under the atmosphere, 28 ( In the same manner as in the production example 1, the resin particles (1 Å) were produced in the same manner as in the production example 1. The average dispersed particle diameter of the obtained resin particles, and the U, mK value, 3〇% κ value, and complex κ were obtained. The value and the compression-deformation rate are shown in Table 1. (Production Example 11) Resin particles were obtained in the same manner as in Production Example 10 except that no heat treatment was performed ((1). The average dispersed particle diameter of the obtained resin particles, ln κ value, 20% Κ value '3G% κ value, weight κ value, and compression failure deformation rate are shown in Table 1. (Manufacturing Example 1 2 ) In addition to the preparation of the poly-stone oxy-fired particle emulsion, When the ion 乂 = is changed, the amount of use is 21. The mass of methanol is _ mass part, and the rest is the same as in the production example 1. The resin particle () is produced in the litji temple The average score of the number of bases of the turbidity The particle size system &quot;3". The average particle size of the obtained resin particles, 1% K value m value, 30% K value, 40% κ value and compression failure deformation rate are shown in the table. Example 13) A resin particle was produced in the same manner as in Production Example 1 except that the type and mass (ppm) of the absorbing monomer were changed as in 矣9 όϊί. - -T- Table 2. The average dispersed particle size of the resin particles, 1 G% enthalpy, 20% κ 45 201241072 value, 30% K value, 40% K value, and compression failure rate are shown in Table 2. (Manufacturing Example 14) The resin particles (14) were produced in the same manner as in the production example except that the type and amount of the monomer to be used (parts by mass) were changed as shown in Table 2. The average particle diameter of the obtained resin particles was 1, (1) % κ value, 2〇% κ value, 30% Κ value, 40% Κ value, and compression failure deformation rate are shown in Table 2. (Manufacturing Example 1 5) Except for the absorption monomer as shown in Table 2 The type and amount of use (mass parts) 'at the same time' is obtained by drying the tree shreds, under the atmosphere, 2 papers for 1 hour heating The resin particles (15) were produced in the same manner as in Production Example i. The average value of the obtained resin particles, the 40% K value and the pressure dispersion particle diameter, the 10% K value, the 20% K value, and the 30% shrinkage deformation. The rate is as shown in Table 2. (Production Example 16) The resin particles (16) were obtained in the same manner as in Production Example 15 except that the heat treatment was not carried out. The average dispersed particle diameter of the obtained resin particles, 1% by K Value, 20% K value, 30% κ value, 4.% κ value, and compression failure deformation rate are shown in Table 2. (Production Example 17) / As shown in Table 2, the type of the monomer for absorption and the mass of one of the monomers were changed, and the resin particles obtained by drying were also subjected to an atmosphere of '23 (Γ': 1 hour) In addition to the heat treatment, resin particles (Π) were produced in Production Example 1. The obtained resin particles had a particle size, m K value, 2% κ value, 30% κ value, and 40% κ value. 46 201241072 The shrinkage deformation rate is as shown in Table 2. (Manufacturing Example 18) In addition to the type and amount of the absorbing monomer (the straight component) as shown in Table 2, the resin obtained by drying was obtained. The particles were also subjected to heat treatment at 300 ° C for 1 hour in a nitrogen atmosphere, and the resin particles (18) were produced in the same manner as in Production Example 1. The obtained resin particles had an average dispersed particle diameter, a 10% K value, and The 203⁄4 K value, the 30% K value, the 40% K value, and the compression failure deformation rate are as shown in Table 2. (Manufacturing Example 19) Resin particles were obtained in the same manner as in Production Example 18 except that no heat treatment was performed. The average dispersed particle size of the obtained resin particles, 1% K value, 2 (UK value, 30% K value) 40% K value and compression failure deformation rate are shown in Table 2. (Manufacturing Example 20) In addition to changing the type and amount of the absorbing monomer (quality smash) as shown in Table 2, at the same time, drying was carried out. The resin particles obtained were also subjected to heat treatment at 1300 °C for 1 hour in a nitrogen atmosphere, and the same was carried out in the same manner as in Production Example 1 to prepare resin particles (2 Å). The average of the obtained resin particles was a particle size. , 10% K value, 20% K value, 30% K value, 40% K value, and compression failure deformation rate are shown in Table 2. (Manufacturing Example 21) Except that the monomer for absorption was changed as shown in Table 2. The type and the amount of use (parts by mass) 'at the same time' the resin particles obtained by drying were also subjected to a heat treatment at 1300 ° C for 1 hour in a nitrogen atmosphere, and the rest were the same 47 201241072 in Production Example 1. Resin particles (21) were produced, and the obtained resin particles had an average dispersed particle diameter, a 10% K value, a 20% K value, a 30% K value, a 40% K value, and a compression failure deformation ratio as shown in Table 2. Example 22) In addition to the modulation of the ion exchange water emulsion, the ion exchange water was changed separately. The amount used is 16 parts by mass, and the amount of decyl alcohol used is a part by mass. The resin particles are produced in the same manner as in Production Example i except that the type and amount of the monomer for use (parts by mass) are changed as shown in Table 2. (22) At this time, the average dispersed particle diameter of the number of polysiloxane particles in the emulsion of the polyoxyalkylene oxide particles is 143 &quot; the average dispersed particle size of the obtained resin particles, 10% κ Value, 20% κ value, 30% κ value, K value, and compression failure deformation rate are shown in Table 2. (Production Example 23) 20% aqueous solution 10 of a polyvinylidene styrene phenyl sulfate sulphate ("HITENOL (registered trademark) NF-〇8" manufactured by Daiichi Kogyo Co., Ltd.) as an emulsifier a mass fraction of 3 parts by mass of ion-exchanged water, a monomer component composed of 50 parts by mass of I,9-decanediol dimethacrylate and 50 parts by mass of the present ethylene, and 2, 2 ,-Azobis(2,4-methylvaleronitrile) ("V-65" manufactured by Wako Pure Chemical Industries, Ltd.) 2 Mixed solution of mussels' emulsion is prepared by emulsifying and dispersing to prepare monomer components. . In a four-necked flask equipped with a cooling tube, a thermometer, and a dropping port, the obtained liquefied liquid was added, and after adding _ part by mass of ion-exchanged water, the reaction liquid was heated to a price, at 65 =: 2 In the hour, the free radical polymerization of the early body ingredients. For the opacity after the radical polymerization 48 201241072, the solid-liquid separation was carried out, and after the cake obtained by washing with ion-exchanged water or methanol, the wet classification was repeated, and the generation was carried out for 2 hours in 12 generations. The resin particles (2) were produced by vacuum drying. The average dispersed particle diameter, m κ value, m κ value, m κ value, 4〇% κ value, and compression fracture deformation ratio of the obtained resin particles are shown in Table 3. (Production Example 24) Resin particles (24) were produced in the same manner as in Production Example 23 except that 10 parts by mass of 1&gt;9-nonanediol dimethyl acrylate vinegar was changed. The average dispersed particle size Μ(10)κ, 20% Κ, 30% 、, 40% κ, and compression failure rate of the obtained resin particles are shown in Table 3. (Production Example 25) In addition to changing the monomer component, it was 75 parts by mass of trimethylolpropane trimethacrylate and divinylbenzene (manufactured by Nippon Steel Chemical Co., Ltd., "DVB960": containing divinylbenzene 96% and Resin particles (25) were produced in the same manner as in Production Example 23 except that the ethyl vinylbenzene 4% product was contained in an amount of 25 parts by mass. The average dispersed particle diameter, 1% κ value, 20% enthalpy value, 30% enthalpy value, 40% enthalpy value, and compression failure deformation rate of the obtained resin particles are shown in Table 3. (Production Example 26) The same applies to the production except that the monomer component was changed to 4 parts by mass of ethylene glycol dimethacrylate, 40 parts by mass of styrene, and 2 parts by mass of t-butyl methacrylate. In Example 23, resin particles (26) were produced. The average dispersed particle diameter of the obtained resin particles, 1 〇% j (value, 20% K value, 30% 49 201241072 K value, 40% K value, and compression failure deformation rate are shown in Table 3. 2 - 2. Conductive Production of the fine particles (formation of the conductive metal layer) (Example 1) After the etching treatment by sodium hydroxide is performed on the resin particles (1) as the substrate, the contact with the tin dichloride solution is performed. Photosensitive 'Next, a palladium core is formed by a method of performing activation by immersion in a di-palladium-palladium solution (photosensitive-activation method). Then, a palladium nucleus is formed by adding 'in the ion-exchanged water 4 ο mass parts' 2 parts by mass of the resin particles, after the ultrasonic dispersion treatment, the resin particle suspension obtained by heating at 70° (in a warm bath) is additionally added by heating the suspension in this manner. 600 parts by mass of an electroless plating solution ("Sumer S680" manufactured by Kanigen Co., Ltd., Japan) heated to 70 C, and an electroless nickel plating reaction was produced. After confirming the completion of hydrogen generation, solid-liquid separation was performed to ion Exchange the order of water and sterols The net 'at 100%., vacuum drying for 2 hours, and the particles for electric forging are obtained. Then 'H is replaced by gold in the form of gold carbonate containing potassium cyanide. The surface of the surface was also subjected to gold plating, and the thickness of the conductive metal layer of the obtained conductive fine particles was as shown in Table 4. (Examples 2 to 20 and Comparative Examples 1 to 2) Except that Table 4 or Table 5 was used, the conductive metal was the same as that of the conductive fine particles of Example 1. (Example 21) The resin particles were not used as a substrate to prepare conductive fine particles. The film thickness is as shown in Table 4 or Table 5, 201241072, except that the resin particles (23) are used as the substrate, and the concentration of the sulfuric acid recorded hexahydrate is 50 g/L, the concentration of sodium hypophosphite monohydrate is, and the concentration of sodium citrate is 50 g/L, an electroless nickel plating solution adjusted to 7.5 by an aqueous sodium hydroxide solution, and the electroconductive fine particles were prepared in the same manner as in Example 1 except for the electroless plating solution. The conductivity of the obtained conductive fine particles was obtained. Film thickness of metal layer The phosphorus content is shown in Table 6. (Example 22) Conductive fine particles were produced in the same manner as in Example 21 except that the resin particles (24) were used as the base material. The conductive metal of the obtained conductive fine particles was obtained. The film thickness and the phosphorus content of the layer are shown in Table 6. (Example 23) Conductive fine particles were produced in the same manner as in Example 2 except that the resin particles (25) were used as the substrate. The film thickness and the phosphorus content of the conductive metal layer of the fine particles are as shown in Table 6. (Example 24) Conductivity was produced in the same manner as in Example 21 except that the resin particles (26) were used as the substrate. Microparticles. The film thickness and phosphorus content of the conductive metal layer of the obtained conductive fine particles are as shown in Table 6. (Example 2 5) The same procedure as in Example 21 was carried out, except that the resin particles (26) were used as the substrate, and the pH of the electroless key solution was changed to 11.0 (adjusted with an aqueous sodium hydroxide solution). Conductive microparticles. The film thickness and the dish content of the conductive metal layer of the obtained conductive fine particles are as shown in Table 51 201241072. 3. The production and evaluation of the anisotropic bismuth material is evaluated by the following method:: Electrical material (isoelectric conductive thin - that is, 'in the ring of conductive microparticle resin) Oxygen resin (is 'added as a binding component, hardener J_8)) 100 mass standard) SH5. ")&quot;::广...," ld (Registry) factory material and toluene 1 〇〇蜇1mm oxidized granules 5,,,,,,,,,,,,,,,,,, : Made of stainless steel... The mixture is spread and dispersed by the bar coating. Then, the treated film 1 is peeled off and applied to the film. ' Drying is obtained. Anisotropic conductive thin l = in the = resistance-measuring line of the full-scale steam-recording glass substrate and the distance between the copper pattern of the polyimide film substrate, sandwiched between the two Γ ', 14 conductive film, In the case of two pressures (high pressure: 7 MPa' low pressure: under a 185 Torr, press-bonding is performed to produce a joint structure (a high-connected structure and a low-pressure joint structure). The initial resistance value A' between the electrodes was measured and the initial resistance value A was less than 3 Ω, and it was evaluated as "◎", and the state of 3 Ω or more and 5 Ω or less was evaluated as "〇", which exceeded 5. It is X. In addition, it is observed in a low pressure (2Mpa) house by a metal microscope (magnification: 1〇〇〇) After the anisotropic conductive sheet to contact the mold

On the surface of the electrode on the side of S 52 201241072, if the indentation is observed, it is evaluated as "〇", and if it is not confirmed to be indented, it is evaluated as "X". In addition, after the low-voltage connection structure placed in an atmosphere of 85 ° C and 85% RH for 500 hours, the resistance value B was measured in the same manner as the initial resistance value a described above, and the resistance value increase rate was determined according to the following formula. (%). The state in which the resistance value increase rate (%) was 1% or less was evaluated as "◎", and the state exceeding 1% or less was evaluated as "〇", and the state exceeding 3% was evaluated as "X". . Resistance increase rate (%) = [(B - A) / A] xl 〇〇 In addition, in Table 1, Table 2, and Table 3, the following abbreviations are used. MPTMS: 3 - mercapto propylene methoxy propyl trimethoxy decane ("KBM503", manufactured by Shin-Etsu Chemical Co., Ltd.) VTMS · Vinyl trimethoxy decane (manufactured by Shin-Etsu Chemical Co., Ltd., "KBM1 003")

St : Styrene HXDMA : 1,6 -hexanediol dimethacrylate DVB · Divinylbenzene (manufactured by Nippon Steel Chemical Co., Ltd., "DVB96〇": contains diethylbenzene 96% and ethyl vinyl 4% of the base benzene product; the following is a description of the quantity of DVB used as the amount of DVB used. The amount of "DVB960" actually used as the composition is calculated based on the substantially contained divinylbenzene. Value.) TMP-3EO~~ a: Trimethylolpropane E〇 deformation (3 mole) triacrylate vinegar TMP-6E0~~ a: Trimethylolpropane E〇 deformation (6 mole) tripropylene 53 201241072 Acid ester HXM : 1,6-hexanediol diacrylate MPMDMS : 3-methyl propylene methoxy propyl decyl decyl oxane (manufactured by Shin-Etsu Chemical Co., Ltd., "KBM502") 1,9 — ND : 1,9-decanediol dimethacrylate TMP-A: trimethyl methacrylate triacetate EGDMA: ethylene glycol dimercapto acrylate tBMA : t - butyl methacrylate

S 54 201241072 5 Physical compressive deformation rate of resin particles (8) CO CM CO od CO I no damage point I oo CO CO CO CO lO 兮oo oo CO csj LO 03 oo LO &lt; 1 oo LD 〇I 1 05 LT5 CD CO C5 1 CO C5 1 〇C3 s C5 C \ 〇LO 〇ogo 03⁄4 C5 05 CD CD 呀CD 〇05 m CD CD o CO CD 〇CO CO o CO o CQ (Ν1 〇oo oo CO c&gt; £5 o CO &lt;=&gt; 00 00 o in CD o CO CO o Οί CO o LO CD o* CO CO c&gt; CO ς〇o CO osg _ ^ ^ \ S-X 1 15068 1 1 05 o Another 15477 1 11254 1 | 12722 1 | 11437 1 14443 g画画W CO 乂\ S: SX 20953 1 17242 | 20326 21740 § LO CO 15290 13422 oo 03 15047 11359 CO in oo CT&gt; 14552 £ g ^ S 一CN1 乂\ 20166 1 17570 1 | 22738 | 20067 o CO 呀15666 16957 CO CO 05 15394 11419 oo &lt;x&gt; 15216 ^ \ 28027 25925 | 33984 | 27464 CO 03 LO 24018 27181 15365 23593 ! 18146 15654 23929 Average Dispersion Particle Size (ym) Bu* (CT> CO 5 cvi 1—^ CO 〇j CO OJ Modification and heat treatment of the sealing particles (°C) ◦ O O O O O o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o Alkene non-crosslinkable monomer (mass &lt;=5 c&gt; oo C5 〇* 〇oo C5 CD o GJ* ooooo CD o c&gt; decane crosslinkable monomer (% by mass) 〇m 〇〇oo oo LO oo oo LO o lo Cv5 CO 一〇§ 〇§ Bu cd Bu Bu Bu CO cd Bu cd Ethylene cross-linking monomer (% by mass) LO LT5 ai CO id ai CO oo (N1 CJ5 c&lt;i CT5 r —&lt; ooo § o § o § Usage absorption monomer (parts by mass) St=60 HXONA=60 I DVB-28 I DVB=28 St=97. 2 HXONA=23 St=240 DVB=17.5 DVB=17.5 DVB=100 St=100 DVB=100 St=100 ! DVB=200 DVB=200 DVB=200 Polymeric decane compound (parts by mass) MPTMS=40 | MPTMS:40 II MPTMS=40 I MPTMS=40 I MPTMS=40 I MPTMS=28.5 VTMS=41.5 HPTMS=28.5 VTMS=41.5 MPTMS=40 MPTMS-40 MPTMS=40 MPTMS=40 MPTMS=40 15^ /-N c5 CO S eg /-N gs? /-&quot;N /-~N Manufactured Example 2 Production Example 2 Production Example 3 Production Example 4 Production Example 5 Production Example 6 Production Example 7 Production Example 8 Production Example 9 Production Example 10 Production Example 11 Production Example 12 201241072 Physical property compression fracture of resin particles Deformation rate (%) in 'rr LO CO 00 01 LO CO tNI* CO L O LO 00 oi CO uo LO 05 OO CO 03 — &lt; \ 〇 CN CN1 Η CO 00 o OO ΟΪ d 1 ST—H 1 CO 00 o 1 OO \ 〇05 cri c&gt; o CO G&gt; § o CO o OO c=&gt; CO CD CO o inch σί ο \ CQ oo o ^-- CO CD 〇f 1 &lt;&lt;=j CO oo C=j oo CD a&gt; 05 CD o r-- C5 £ g ^ iw ^ \ Ο 21968 25842 10901 15483 1 | 11403 1 1 14625 i 1 17017 G § _, Chang w CO ^ \ &quot;ZL Sw/ 18263 18796 11830 12693 14293 S oo oo 12087 12982 13483 13462 r~N -Hnl £ CQ &lt; =5 ^ \= N'—/ CN] ^ X z s_x 12520 14598 10723 11189 14410 CN1 o Bu | 12645 | 12059 12807 11096 Q posture domain one — 乂 \ 5 17273 18834 10176 15848 19699 | 10892 1 | 18111 | 17701 18437 14395 Average dispersed particle size (//m) 03 ψ—^ cvi S c&lt;i LO oi CvJ oa S cm' LD cd oo TO csi oo 05 CO 〇j Modification heat treatment of the greased particles ΓΟ Rui another CS3 璀o CO CO C5 〇CO Late OJ Another Cvl 2 decane non-crosslinkable monomer (f*%) o OC=5 〇oooo C5 oooooooo C5 decane cross-linking monomer (% by mass) Bu CD r·&quot; ·' 〇» cd cd cd CD Cd oo I loo.o | og cd T-^ CO oo LO CO CO CO Ethylene cross-linking monomer (% by mass) Bu 'ΤΓ Bu Bu CO Bu CO CO CO T-HO oo Bu oo 〇0 o CO CO CO Usage Absorption monomer (parts by mass) St=100 TMP3EOA=100 St=100 HXDA=50 TMP6EOA=50 DVB:80 St=20 HXDA=100 DVB=80 St=20 HXDA=100 MPMDMS=188 HXDA =32 MPMDMS=180 MPMDMS=180 DVB=100 HXDA=100 MPMDMS=100 DVB=50 HXDA=50 St-40 IIXDA=40 Polymeric smoldering compound (parts by mass) MPTMS=40 MPTMS=40 MPTMS=40 MPTMS=40 MPTMS=40 MPTMS-40 | MPTMS=40 I MPTMS=40 MPTMS=40 MPTMS-40 /—N CO r&quot;NH /-N ΙΛ »*·&lt; /-N CO Nw/ /—N 卜 TO s—/ O Cvi / -s CsJ Vw / / - N CO oa Production Example 13 Production Example 14 Production Example CO Production Example 制造 Production Example 18 Production Example 19 Production Example 20 Production Example 21 Production Example 22 201241072 Physical property compression fracture of resin particles Deformation rate (3⁄4) CO·CO Ο CO LO CO CO D/A 1 0.94 0.72 1 C/AS 0.76 0.80 0.77 B/A £5 G&gt;;0.72 0.70 0.68 (D) 40% K value (N/mm2) 1 1 ;32635 26244 1 cO G §Back 1 1 \ 43003 26405 29126 15467 £ g ^ J 00 \ 36452 25225 25549 13590 =0 Q g _ circumference w ^ fad \ 'S-/ 41946 34890 36319 19967 average dispersion particle size (egg) LO LO LO r·^ CO 05 heat treatment (°C) difficult dish composition decane system Crosslinkable monomer (% by mass) 〇cz&gt; 〇CD C5 〇oo decane crosslinkable monomer (% by mass) ο ο o C3 CD CD o ^ ® ^ &lt; ' _ ^ ^ ^ tO ο S 100.0 o Ai CD o Absorption monomer (parts by mass) 1,9-ND/St =50 ozo 1 o 03⁄4 e. II TMP-A/DVB =75/25 EGDMA/St/tBMA =40/40/20 鹊(23) r---- (24) (25) (26) Production Example 23 Production Example 24 Production Example 25 Production Example 26 201241072 Table 4 Resin Particles as Substrate No. Film Thickness of Conductive Metal Layer (egg) Evaluation of conductive fine particles Indentation initial resistance value Resistance value increase rate High pressure and low pressure Example 1 (1) 0.10 〇 ◎ ◎ ◎ Example 2 (2) 0.11 〇 ◎ ◎ ◎ Example 3 (3) 0.10 〇 ◎ ◎ ◎ Example 4 (4) 0.09 〇 ◎ ◎ ◎ Comparative Example 1 (5) 0.12 XXXX Example 5 (6) 0.11 〇 ◎ ◎ ◎ Example 6 (7) 0.10 〇 ◎ ◎ ◎ Example 7 (8) 0.09◎ ◎ 〇 Example 8 (9) 0.11 〇 ◎ ◎ 例 Example 9 (10) 0.12 〇 ◎ ◎ ◎ Example 10 (11) 0.11 〇 ◎ ◎ 〇 Example 11 (12) 0.10 〇 ◎ ◎ ◎ Table 5 Resin Particles of Substrate No. Conductive Metal Layer Thickness (//m) Evaluation of Indentation Initial Resistance Value Resistance Value Increase Rate High Pressure Low Pressure Example 12 (13) 0.09 〇◎ 〇◎ Example 13 (14) 0.12 〇 ◎ 〇 ◎ Example 14 (15) 0.11 〇 ◎ ◎ 〇 Example 15 (16) 0.10 〇 ◎ ◎ 〇 Example 16 (17) 0.11 〇 ◎ ◎ ◎ Comparative Example 2 (18) 0.10 XXXX Example +17 (19 0.10 〇 ◎ ◎ 例 Example 18 (20) 0.12 〇 ◎ ◎ ◎ Example 19 (21) 0.10 〇 ◎ ◎ ◎ Example 20 (22) 0.10 〇 ◎ 〇〇 58 201241072 Table 6 Example 21 As a substrate Resin Particle No. (23) ^Example 22 (24) Example 23 ~~725)~ Example 24 (26) Example 25 (26) Conductive metal layer film thickness (_£m) 0.10 ).10 3.1 Structure content (% by mass) —_ mn Indentation resistance value 电阻 Resistance value increase rate ◎ ◎ ◎ [Industrial availability] Anisotropic conductive material such as an anisotropic conductive ink. The electrical microparticles are suitable for use in, for example, an anisotropic conductive ruthenium film, an anisotropic conductive paste, and an anisotropic conductive pattern. Explanation of symbols] fe 0 59

Claims (1)

201241072 VII. Patent application scope: 1. A conductive microparticle having a substrate composed of resin particles and a conductive metal layer formed on at least one surface of the substrate, wherein: the number of the resin particles is based on The average dispersion particle diameter is ～5·ym, and the compression modulus (10% K value) at the diameter displacement of the resin particles is i2, 〇〇〇N/_2 or more. 2. The conductive fine particles according to claim 1, wherein the average dispersed particle diameter of the number of the first j resin particles is 2. In the case where the diameter of the resin particles is displaced by 1%, the compression modulus (% 〇 κ value) is 17, 00ON/mm2 or more. 3. The conductive fine particles according to the ninth aspect of the invention, wherein the average dispersed particle diameter of the number of the resin particles is less than 2 Å/m, and the compression is performed when the diameter displacement of the resin particles is i 〇 % The modulus of elasticity (丨〇% κ value) is more than 196,600 N/mm2. 4. The conductive fine particles of any one of the above-mentioned claims, wherein the resin particles have a compression-deformation deformation ratio of 3 〇 % or more. 5. The conductive microparticles of any one of claims 1 to 4, wherein the compressive modulus of elasticity (30% K value) when the diameter of the resin particles is displaced by 3% is less than 前述 κ value. 6. The conductive fine particles according to any one of claims 1 to 5, wherein at least a part of the surface has an insulating resin layer. 7. A resin particle using particles as a substrate of conductive fine particles, S 60 201241072, characterized in that: Ί 隹 隹 quot quot 平均 平均 平均 平均 平均 平均 平均 平均 m m m m m m m m m m m m m m m m m m m The compression modulus (ι 〇 % κ value) at a displacement of 10% is ι 2 〇〇〇Ν / _2 or more. For example, the resin particles of the seventh item of the patent scope, wherein the average number of knives of the number of bases is 2. 〇# m or more, the compressive modulus of elasticity at the diameter displacement i 〇% of the particles (10% K value) ) is π, OOON/mm2 or more. 9. For the resin particles in the scope of patent application No. 7, wherein the number of bases is less than 2.0 μm, and the compression modulus is 1%% when the diameter of the particles is displaced by 1%. The κ value is more than 19, 6〇〇N/_2. 10. The resin particles according to any one of claims 7 to 9, wherein the 'compression failure deformation ratio is 3% or more. 11. The resin pellet of any one of claims 7 to 10, wherein the compressive modulus of elasticity κ value when the diameter of the particle is displaced by 30% is less than the aforementioned 10% enthalpy. 12. An anisotropic conductive material </ RTI> characterized in that the conductive fine particles according to any one of Items 1 to 6 are dispersed in a binder resin. 61