TW201239365A - High frequency coupling signal adjustment manner and test device thereof - Google Patents
High frequency coupling signal adjustment manner and test device thereof Download PDFInfo
- Publication number
- TW201239365A TW201239365A TW100109785A TW100109785A TW201239365A TW 201239365 A TW201239365 A TW 201239365A TW 100109785 A TW100109785 A TW 100109785A TW 100109785 A TW100109785 A TW 100109785A TW 201239365 A TW201239365 A TW 201239365A
- Authority
- TW
- Taiwan
- Prior art keywords
- frequency
- transmission line
- signal
- coupling
- metal needle
- Prior art date
Links
- 230000008878 coupling Effects 0.000 title claims abstract description 81
- 238000010168 coupling process Methods 0.000 title claims abstract description 81
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 81
- 238000012360 testing method Methods 0.000 title claims abstract description 74
- 230000005540 biological transmission Effects 0.000 claims abstract description 154
- 239000002184 metal Substances 0.000 claims abstract description 136
- 229910052751 metal Inorganic materials 0.000 claims abstract description 136
- 239000000523 sample Substances 0.000 claims description 59
- 239000000758 substrate Substances 0.000 claims description 46
- 238000000034 method Methods 0.000 claims description 12
- 230000008859 change Effects 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims description 2
- 235000012054 meals Nutrition 0.000 claims 1
- 239000000725 suspension Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 7
- 230000008054 signal transmission Effects 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 206010011224 Cough Diseases 0.000 description 2
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 241001136800 Anas acuta Species 0.000 description 1
- 241000282320 Panthera leo Species 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100109785A TW201239365A (en) | 2011-03-22 | 2011-03-22 | High frequency coupling signal adjustment manner and test device thereof |
| US13/425,410 US20120242360A1 (en) | 2011-03-22 | 2012-03-20 | High-frequency coupling testing device by coupling effect |
| SG2012020665A SG184681A1 (en) | 2011-03-22 | 2012-03-22 | High-frequency coupling testing device by coupling effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100109785A TW201239365A (en) | 2011-03-22 | 2011-03-22 | High frequency coupling signal adjustment manner and test device thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201239365A true TW201239365A (en) | 2012-10-01 |
| TWI420114B TWI420114B (enExample) | 2013-12-21 |
Family
ID=46876818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100109785A TW201239365A (en) | 2011-03-22 | 2011-03-22 | High frequency coupling signal adjustment manner and test device thereof |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20120242360A1 (enExample) |
| SG (1) | SG184681A1 (enExample) |
| TW (1) | TW201239365A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI564571B (zh) * | 2014-11-14 | 2017-01-01 | Mpi Corp | Cantilever high frequency probe card |
| CN106324301A (zh) * | 2015-07-03 | 2017-01-11 | 旺矽科技股份有限公司 | 悬臂式高频探针卡 |
| CN110325866A (zh) * | 2017-02-24 | 2019-10-11 | 泰克诺探头公司 | 具有改进的频率性能的垂直探针测试头 |
| TWI681195B (zh) * | 2018-11-21 | 2020-01-01 | 中華精測科技股份有限公司 | 探針卡裝置及其調節式探針 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI512300B (zh) * | 2013-07-15 | 2015-12-11 | Mpi Corp | Cantilever high frequency probe card |
| JP6184301B2 (ja) * | 2013-11-14 | 2017-08-23 | 株式会社日本マイクロニクス | 検査装置 |
| IT201600127581A1 (it) | 2016-12-16 | 2018-06-16 | Technoprobe Spa | Testa di misura per un’apparecchiatura di test di dispositivi elettronici con migliorate proprietà di filtraggio |
| IT201700021389A1 (it) * | 2017-02-24 | 2018-08-24 | Technoprobe Spa | Testa di misura con migliorate proprietà in frequenza |
| TWI713807B (zh) | 2016-12-16 | 2020-12-21 | 義大利商探針科技公司 | 具有增進的頻率性質的測試頭 |
| IT201700021397A1 (it) * | 2017-02-24 | 2018-08-24 | Technoprobe Spa | Testa di misura con migliorate proprietà in frequenza |
| TWI754335B (zh) * | 2020-07-28 | 2022-02-01 | 矽品精密工業股份有限公司 | 檢測裝置 |
| IT202300017040A1 (it) * | 2023-08-09 | 2025-02-09 | Technoprobe Spa | Scheda di misura con una guida dotata di metallizzazioni |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1130630A (ja) * | 1997-07-10 | 1999-02-02 | Tokyo Kasoode Kenkyusho:Kk | 探針用プローブ及びプローブカード |
| TW345713B (en) * | 1997-09-02 | 1998-11-21 | United Semiconductor Corp | Connection structure of testkey and probe card suitable for testing electrical properties of integrated circuits |
| US6822469B1 (en) * | 2000-07-31 | 2004-11-23 | Eaglestone Partners I, Llc | Method for testing multiple semiconductor wafers |
| US6812720B1 (en) * | 2003-04-17 | 2004-11-02 | Chipmos Technologies (Bermuda) Ltd. | Modularized probe card with coaxial transmitters |
| US7579856B2 (en) * | 2006-04-21 | 2009-08-25 | Formfactor, Inc. | Probe structures with physically suspended electronic components |
| TW200811444A (en) * | 2006-08-18 | 2008-03-01 | Microelectonics Technology Inc | Vertical high frequency probe card |
| US7368928B2 (en) * | 2006-08-29 | 2008-05-06 | Mjc Probe Incorporation | Vertical type high frequency probe card |
| SG153689A1 (en) * | 2007-12-17 | 2009-07-29 | Test Max Mfg Pte Ltd | Contactor assembly for integrated circuit testing |
| TWM374060U (en) * | 2009-08-24 | 2010-02-11 | Rosenberger Hochfrequenztech | Measurement probe |
-
2011
- 2011-03-22 TW TW100109785A patent/TW201239365A/zh not_active IP Right Cessation
-
2012
- 2012-03-20 US US13/425,410 patent/US20120242360A1/en not_active Abandoned
- 2012-03-22 SG SG2012020665A patent/SG184681A1/en unknown
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI564571B (zh) * | 2014-11-14 | 2017-01-01 | Mpi Corp | Cantilever high frequency probe card |
| CN106324301A (zh) * | 2015-07-03 | 2017-01-11 | 旺矽科技股份有限公司 | 悬臂式高频探针卡 |
| CN110325866A (zh) * | 2017-02-24 | 2019-10-11 | 泰克诺探头公司 | 具有改进的频率性能的垂直探针测试头 |
| CN110325866B (zh) * | 2017-02-24 | 2022-04-08 | 泰克诺探头公司 | 具有改进的频率性能的垂直探针测试头 |
| TWI681195B (zh) * | 2018-11-21 | 2020-01-01 | 中華精測科技股份有限公司 | 探針卡裝置及其調節式探針 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI420114B (enExample) | 2013-12-21 |
| US20120242360A1 (en) | 2012-09-27 |
| SG184681A1 (en) | 2012-10-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |