TWI420114B - - Google Patents

Info

Publication number
TWI420114B
TWI420114B TW100109785A TW100109785A TWI420114B TW I420114 B TWI420114 B TW I420114B TW 100109785 A TW100109785 A TW 100109785A TW 100109785 A TW100109785 A TW 100109785A TW I420114 B TWI420114 B TW I420114B
Authority
TW
Taiwan
Application number
TW100109785A
Other languages
Chinese (zh)
Other versions
TW201239365A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW100109785A priority Critical patent/TW201239365A/zh
Priority to US13/425,410 priority patent/US20120242360A1/en
Priority to SG2012020665A priority patent/SG184681A1/en
Publication of TW201239365A publication Critical patent/TW201239365A/zh
Application granted granted Critical
Publication of TWI420114B publication Critical patent/TWI420114B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW100109785A 2011-03-22 2011-03-22 High frequency coupling signal adjustment manner and test device thereof TW201239365A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW100109785A TW201239365A (en) 2011-03-22 2011-03-22 High frequency coupling signal adjustment manner and test device thereof
US13/425,410 US20120242360A1 (en) 2011-03-22 2012-03-20 High-frequency coupling testing device by coupling effect
SG2012020665A SG184681A1 (en) 2011-03-22 2012-03-22 High-frequency coupling testing device by coupling effect

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100109785A TW201239365A (en) 2011-03-22 2011-03-22 High frequency coupling signal adjustment manner and test device thereof

Publications (2)

Publication Number Publication Date
TW201239365A TW201239365A (en) 2012-10-01
TWI420114B true TWI420114B (enExample) 2013-12-21

Family

ID=46876818

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100109785A TW201239365A (en) 2011-03-22 2011-03-22 High frequency coupling signal adjustment manner and test device thereof

Country Status (3)

Country Link
US (1) US20120242360A1 (enExample)
SG (1) SG184681A1 (enExample)
TW (1) TW201239365A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI754335B (zh) * 2020-07-28 2022-02-01 矽品精密工業股份有限公司 檢測裝置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI512300B (zh) * 2013-07-15 2015-12-11 Mpi Corp Cantilever high frequency probe card
JP6184301B2 (ja) * 2013-11-14 2017-08-23 株式会社日本マイクロニクス 検査装置
TWI564571B (zh) * 2014-11-14 2017-01-01 Mpi Corp Cantilever high frequency probe card
TWI576590B (zh) * 2015-07-03 2017-04-01 Mpi Corp Cantilever high frequency probe card
IT201600127581A1 (it) 2016-12-16 2018-06-16 Technoprobe Spa Testa di misura per un’apparecchiatura di test di dispositivi elettronici con migliorate proprietà di filtraggio
IT201700021389A1 (it) * 2017-02-24 2018-08-24 Technoprobe Spa Testa di misura con migliorate proprietà in frequenza
TWI713807B (zh) 2016-12-16 2020-12-21 義大利商探針科技公司 具有增進的頻率性質的測試頭
IT201700021400A1 (it) 2017-02-24 2018-08-24 Technoprobe Spa Testa di misura a sonde verticali con migliorate proprietà in frequenza
IT201700021397A1 (it) * 2017-02-24 2018-08-24 Technoprobe Spa Testa di misura con migliorate proprietà in frequenza
TWI681195B (zh) * 2018-11-21 2020-01-01 中華精測科技股份有限公司 探針卡裝置及其調節式探針
IT202300017040A1 (it) * 2023-08-09 2025-02-09 Technoprobe Spa Scheda di misura con una guida dotata di metallizzazioni

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1130630A (ja) * 1997-07-10 1999-02-02 Tokyo Kasoode Kenkyusho:Kk 探針用プローブ及びプローブカード
US6812720B1 (en) * 2003-04-17 2004-11-02 Chipmos Technologies (Bermuda) Ltd. Modularized probe card with coaxial transmitters
TWI301543B (enExample) * 2006-08-18 2008-10-01 Microelectonics Technology Inc
TWM374060U (en) * 2009-08-24 2010-02-11 Rosenberger Hochfrequenztech Measurement probe

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW345713B (en) * 1997-09-02 1998-11-21 United Semiconductor Corp Connection structure of testkey and probe card suitable for testing electrical properties of integrated circuits
US6822469B1 (en) * 2000-07-31 2004-11-23 Eaglestone Partners I, Llc Method for testing multiple semiconductor wafers
US7579856B2 (en) * 2006-04-21 2009-08-25 Formfactor, Inc. Probe structures with physically suspended electronic components
US7368928B2 (en) * 2006-08-29 2008-05-06 Mjc Probe Incorporation Vertical type high frequency probe card
SG153689A1 (en) * 2007-12-17 2009-07-29 Test Max Mfg Pte Ltd Contactor assembly for integrated circuit testing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1130630A (ja) * 1997-07-10 1999-02-02 Tokyo Kasoode Kenkyusho:Kk 探針用プローブ及びプローブカード
US6812720B1 (en) * 2003-04-17 2004-11-02 Chipmos Technologies (Bermuda) Ltd. Modularized probe card with coaxial transmitters
TWI301543B (enExample) * 2006-08-18 2008-10-01 Microelectonics Technology Inc
TWM374060U (en) * 2009-08-24 2010-02-11 Rosenberger Hochfrequenztech Measurement probe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI754335B (zh) * 2020-07-28 2022-02-01 矽品精密工業股份有限公司 檢測裝置

Also Published As

Publication number Publication date
US20120242360A1 (en) 2012-09-27
TW201239365A (en) 2012-10-01
SG184681A1 (en) 2012-10-30

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees