TW201233280A - Chemical palladium-gold plating film method - Google Patents
Chemical palladium-gold plating film method Download PDFInfo
- Publication number
- TW201233280A TW201233280A TW100102661A TW100102661A TW201233280A TW 201233280 A TW201233280 A TW 201233280A TW 100102661 A TW100102661 A TW 100102661A TW 100102661 A TW100102661 A TW 100102661A TW 201233280 A TW201233280 A TW 201233280A
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- Prior art keywords
- layer
- replacement
- palladium
- gold
- reduction
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100102661A TW201233280A (en) | 2011-01-25 | 2011-01-25 | Chemical palladium-gold plating film method |
CN2011101925171A CN102605359A (zh) | 2011-01-25 | 2011-06-28 | 化学钯金镀膜结构及其制作方法、铜线或钯铜线接合的钯金镀膜封装结构及其封装工艺 |
JP2011229483A JP2012153974A (ja) | 2011-01-25 | 2011-10-19 | 化学パラジウム/金めっき皮膜構造及びその製造方法、銅線またはパラジウム/銅線で接合されたパラジウム/金めっき皮膜パッケージ構造及びそのパッケージプロセス |
US13/326,370 US20120186852A1 (en) | 2011-01-25 | 2011-12-15 | Structure of electrolessly palladium and gold plated films and process for making the same, assembled structure of palladium and gold plated films bonded with copper or copper-palladium wire and assembling process therefore |
KR1020120005470A KR20120086253A (ko) | 2011-01-25 | 2012-01-18 | 무전해 팔라듐 및 금 도금 필름의 구조 및 이의 제조방법, 구리 또는 구리-팔라듐 와이어가 결합된 팔라듐 및 금 도금 필름의 조립구조 및 이의 조립방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100102661A TW201233280A (en) | 2011-01-25 | 2011-01-25 | Chemical palladium-gold plating film method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201233280A true TW201233280A (en) | 2012-08-01 |
TWI409015B TWI409015B (ru) | 2013-09-11 |
Family
ID=47069856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100102661A TW201233280A (en) | 2011-01-25 | 2011-01-25 | Chemical palladium-gold plating film method |
Country Status (1)
Country | Link |
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TW (1) | TW201233280A (ru) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI560317B (ru) * | 2015-04-10 | 2016-12-01 | ||
US9591753B2 (en) | 2015-07-09 | 2017-03-07 | Subtron Technology Co., Ltd. | Circuit board and manufacturing method thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI251920B (en) * | 2003-10-17 | 2006-03-21 | Phoenix Prec Technology Corp | Circuit barrier structure of semiconductor package substrate and method for fabricating the same |
JP4379413B2 (ja) * | 2005-12-06 | 2009-12-09 | セイコーエプソン株式会社 | 電子部品、電子部品の製造方法、回路基板及び電子機器 |
JP5297083B2 (ja) * | 2007-07-17 | 2013-09-25 | 新光電気工業株式会社 | はんだバンプ形成方法 |
-
2011
- 2011-01-25 TW TW100102661A patent/TW201233280A/zh not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI560317B (ru) * | 2015-04-10 | 2016-12-01 | ||
US9591753B2 (en) | 2015-07-09 | 2017-03-07 | Subtron Technology Co., Ltd. | Circuit board and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
TWI409015B (ru) | 2013-09-11 |
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