201232655 六、發明說明： f發明所屬之技術領域j 本發明係錢-_將電軸_之 成電鏟或截刻圖案之方法，特別是—種具有_ 具有圖案之峨而於工件切鋼_方法。她”及使用此 【先前技術】 電鑛與姓刻是許多產品都需要用到的加工工藝，如外 ^外觀_紋路、銘板的製造、IC腳架的= =等等。目前各產業對於需要特定圖案或線路的電 造方法大都相似，圖la至圖le所示為習知_ 電鍍方法流«，如圖la所示，先敎件1G上印刷或塗== 鍍之感光材料12或進行貼膜；接著如圖lb所示，使用且有圖^之光 ί丨24 ，並如圖1C所示，進行顯影製程，以便圖案化感光材 抖^並顯露出欲附著電鑛層之工件表面1〇1;之後如圖id所示，將 :件圖案化感光材料12置於電鍍槽(圖中未示)内進行電鑛製 ί光工件表面1〇1形成一電錢層16;最後進行剝膜，將 上先材科12 除’如圖le所示’圖案化電鑛層16即形成於工件ι〇 圖2a至圖_2e所示為習知一種於工件上形成圖案之侧方法流程 : ^所不先於工件1〇上印刷或塗佈一層抗姓之感光材料12 艺仃貼膜，接著如圖2b所示，使用具有圖案之光罩Μ進行曝光， =圖〜所示，進行顯影製程’以_化感光材料12覆蓋部分不欲 2刻之工件表面⑼；讀如圖2d卿，將讀料同圖案化感 ^材料U置於餘刻槽(圖中未示)内進舰刻製程，藉以對未被感光材 12覆盍之工件表面1〇1進行蝕刻而形成凹 剝 ，光材料U清除，如圖2e所示，即於,_^=凹 糟18圖案。 201232655 料，主要較—嫩布感光材 ^ 1後進行電鍍或酬’再剝膜以清除防鍵或抗姓的 感先材枓，在适些過程中，為了限制電鍍或糊作用的區域，以產生 所需之特定圖案或線路’即便製做相同的圖案亦需—再的重覆塗布感 光材料、曝光、顯影，及賴等高溫、高濕、強酸、舰之製程，製 程複雜性高，且f使敎量水電與各類化學品，對環躺傷害較大。 【發明内容】 為了解決上述問題，本發明目的之一係提出一種具有圖案之網板 ，具及使用此具有圖案之網板模具而於卫件上形成_的方法，具有 簡化製程工序、大幅縮短製造所需時間及提昇產品良率之優點^可 =低成本，減少水電與各類化學品的制需求，大幅減少對環境的傷 害。 人.^；了達到上述目的，本發明一實施例之具有圖案之網板模具包 3 ’’雜、、’σ構包含至少—層網狀結構及—框架結構框^於網狀結構 之一周緣結構包含有補之—第-絲及—第二絲；一遮蔽 圖案膚連結於網狀結構之第一表面或延伸至第二表面上，遮蔽圖案層 已έ圖案化遮蔽區覆蓋部分網狀結構：一多孔性基材設置於網狀結 構之第二表面，多孔性基材具有孔隙以供一反應液體於孔隙中流動並 流經網狀結構未被圖案化遮蔽區覆蓋的區域。 本發明又一實施例之具有圖案之網板模具，包含··一多孔性基 材’其係具有孔隙以供-反應液體於孔隙中流動；以及一遮蔽圖案層 連結於多孔性基材之一側並伸入多孔性基材中，遮蔽圖案層包含一圖 案化遮蔽區覆蓋部分多孔性基材。 本發明又一實施例之於工件上形成圖案之方法包含：提供一工 件，具有一工作表面；提供一具有圖案之網板模具，其包含一多孔性 基材及-额職層設置於多孔性基材上，賴聽層包含有一圖案 5 201232655 化遮蔽區；設置具有圖案之網板模具於工件上，使圖案化遮蔽區遮蔽 部分工件表面；置放工件及具有圖案之網板模具於—反應槽中，使反 應槽中之-反應液體流經多孔性基材及未被_匕遮蔽區遮蔽之部分 工件表面進行化學反應；以及移除具有_之網板模具。 【實施方式】 圖3所示為本發明一實施例具有圖案之網板模具示意圖，如圖3 所不，具有圖案之網板模具20包含—網板結構22、—遮蔽圖案層24 ^夕孔基材26 ’而構成—二層式結構。網板結構22包含一層或 數，之網狀結構221，網狀結構221之周緣並以一框架結構222框設， :=冓⑵包含有相對之一第—表面223及一第 圖结於網狀結構221之第—表面223，遮蔽圖案層％包含 1覆蓋部分網狀結構22卜其中圖案化遮蔽區241 益?4工4加工或化學加卫方切成，於另—實施例卜遮 結於網狀結構22之第一表面223且延伸至第二表面 設置於網狀結構221之第二表*咖，多孔性 二動並二中未示)以供一反應液體(圖中未示)於孔隙中自由 尤周狀結構幼未被圖案化遮蔽區241覆蓋的圖案化未遮蔽 係將此 2G於—瓣程糊製程時， 上，使難Γ 5 壓合至—欲形成圖案之工件(圖中未示） 使圖案化遮敝區241遮蔽部分工 之網板模具20置人電___ 2I 3圖案 ，區241覆蓋的圓案化未遮蔽區242 =梭化^ 未被圖案化遮蔽區241τ电殺狀:¾蝕刻液穿梭，對 在工件上开Μ堂蚀 Ρ刀工件表面進行電鑛或敍刻反應，而 201232655 心，上述卿’ #進行鶴絲辦化學作鱗，係框” f 222對網狀結構221提供—張力，以保持網狀 ^ ^ 辭额财«，敎作料產姻核^ 再者’進灯作業時’位於網狀結構221第二表面224之多孔 係對網狀結構221施加一壓力，使^ ^ 土材26 工件緊密貼合，藉以在工件==；；構221 一遮蔽圖案層24與 广圃件之限疋&域上完成覆蓋保護，如此即可進 丁圖案或線路之電鍍或_健；其中多孔 之配置為可分離或緊密連結關係。 版，，。構22! 4所干圖4呈Hi本發明又一實施例具有圖案之網板模具示意圖，如圖 案之贿模具2G包含—多孔性基 層2設置於多孔性基材26之一侧並伸入至多 =案 結構，且遮蔽_24包含—圖案化遮蔽區24 部分多孔性基材26，其中圖案區”盖 或化學加工方式形成。 魏L 41係以機械加卫、雷射加工 程時有圖案之網板模具20於電錢製程或敍刻製 如可容，電圖案化遮蔽區241覆蓋的圖案化未遮蔽區 分工穿梭，對未被圖案化遮蔽區241遮蔽之部 案趣m。行電麟制反應，而在轉上形成電鍍圖 面及=上述說明’當工件表面具有高低起伏時，多孔性基材26表 工件表圖Γ遮㈣24可形絲—具麵伏三維構造之結構，與 時，遮匹配’藉以當具有圖案之網板模具20壓合至工件 遮敝圖案層24之圖案化遮蔽區241與工件表面緊密貼合。 在本發明中’具有圆案之網板模具2〇可依工件圖案 二層式或三層式設計，對圖案精度要求不高的產品Si 而對圖案精度要求較高的產品則可採用三層式設計。 ·.，、响疋-層式或三層式之具有圖案之網板模具2Q皆可重複使用於每 S] 7 201232655 於：需將具有圖案之網板模具2°壓合 錄祖、心 鍵或蝕刻，改善習知需針對每-工件重複塗布感 才能於每祙嶋’及剝膜之高溫、高濕、強酸、強驗等複雜製程 畔:心/上形成圖案的缺失，相較於傳統製程，本發明可少掉 序’大幅縮短製造所需時間，提昇產品良率，並節省許多 核與化學㈣需求，躲降減本與環麵❹魏大的幫助。另 制，合捲料之連續性生產需求時’具有圖案之網板模具亦可 ®筒狀’且II由控侧筒之树方向上之賴随層的尺寸 精度而製作一具有高圖案精度之產品。201232655 VI. INSTRUCTIONS: f The invention belongs to the technical field j. The invention relates to a method for making a power shovel or a cut pattern, in particular, a type having a pattern and cutting a steel workpiece _ method. She" and the use of this [previous technology] electric mine and surname are the processing techniques that many products need to use, such as the appearance of external appearance, the manufacture of the nameplate, the == of the IC tripod, etc. The electroforming methods of specific patterns or lines are mostly similar. Figures la to l show the conventional _ electroplating method flow «, as shown in Fig. la, the photosensitive material 12 is printed or coated on the first piece 1G. a film; then, as shown in FIG. 1b, a light-curing film is used, and as shown in FIG. 1C, a developing process is performed to pattern the photosensitive material and expose the surface of the workpiece to be adhered to the electric ore layer. 〇1; then, as shown in FIG. id, the patterned photosensitive material 12 is placed in a plating bath (not shown) for electro-mineralization. The surface of the workpiece 1〇1 forms a layer of electricity money 16; Membrane, the upper precursor class 12 is divided into 'as shown in the figure', the patterned electro-mine layer 16 is formed on the workpiece ι. Figure 2a to Figure _2e shows a conventional method for forming a pattern on the workpiece: ^ Do not print or coat a layer of anti-surname photographic material 12 geisha film before the workpiece 1 ,, then as shown in Figure 2b, Exposing with a patterned mask ,, as shown in Fig. 〜, performing a development process 'covering part of the workpiece surface (9) that is not intended for 2 moments with the photographic material 12; read Fig. 2d, reading the material with the same pattern ^ Material U is placed in the engraved groove (not shown) into the ship engraving process, whereby the surface of the workpiece 1〇1 which is not covered by the photosensitive material 12 is etched to form a concave peeling, and the optical material U is removed, as shown in Fig. 2e As shown, _^= concave grain 18 pattern. 201232655 material, mainly compared to - tender cloth photosensitive material ^ 1 after plating or paying 're-peeling film to remove anti-key or anti-surname of the first material, suitable In these processes, in order to limit the area of plating or paste, to produce the specific pattern or line required, even if the same pattern is made, it is necessary to repeatedly apply the photosensitive material, expose, develop, and high temperature and high. Wet, strong acid, ship process, process complexity is high, and f makes hydropower and various chemicals more harmful to the lie. [Invention] In order to solve the above problems, one of the objects of the present invention is to provide a Patterned stencil with and using this patterned stencil The method of forming _ on the Guardian has the advantages of simplifying the process, greatly shortening the time required for manufacturing, and improving the yield of the product. ^Can reduce the cost of water and electricity and various chemicals, and greatly reduce the damage to the environment. In order to achieve the above object, a patterned stencil mold package according to an embodiment of the present invention has a three-dimensional, "sigma" structure comprising at least a layered network structure and a frame structure frame in a mesh structure. The peripheral edge structure comprises a complementary - a first wire and a second wire; a shielding pattern skin is attached to the first surface of the mesh structure or extends to the second surface, and the shielding pattern layer has a patterned shielding area covering a part of the mesh Structure: A porous substrate is disposed on the second surface of the network structure, and the porous substrate has pores for a reactive liquid to flow in the pores and flow through the region of the network structure not covered by the patterned masking region. A patterned screen mold according to still another embodiment of the present invention comprises: a porous substrate having pores for allowing a reaction liquid to flow in the pores; and a masking pattern layer bonded to the porous substrate One side extends into the porous substrate, and the shielding pattern layer comprises a patterned masking region covering a portion of the porous substrate. A method for forming a pattern on a workpiece according to still another embodiment of the present invention includes: providing a workpiece having a working surface; providing a patterned stencil mold comprising a porous substrate and a forefront layer disposed on the porous On the substrate, the ray-receiving layer comprises a pattern 5 201232655 masking area; the patterned stencil is placed on the workpiece so that the patterned masking area shields part of the workpiece surface; the workpiece and the patterned stencil mold are placed on - In the reaction tank, the reaction liquid in the reaction tank flows through the porous substrate and a part of the surface of the workpiece which is not shielded by the 匕 shielding area, and chemically reacts; and the stencil mold having _ is removed. [Embodiment] FIG. 3 is a schematic view of a stencil mold having a pattern according to an embodiment of the present invention. As shown in FIG. 3, the stencil mold 20 having a pattern includes a stencil structure 22, a occlusion pattern layer 24 26 'and constitutes - two-tier structure. The stencil structure 22 comprises one or more mesh structures 221, and the periphery of the mesh structure 221 is framed by a frame structure 222. :=冓(2) includes a relative first surface 223 and a first image The first surface 223 of the structure 221, the shielding pattern layer % comprises 1 covering part of the mesh structure 22, wherein the patterned shielding area 241 is processed or chemically cured, and the other embodiment is covered. The first surface 223 of the mesh structure 22 and extending to the second surface is disposed on the second surface of the mesh structure 221, which is not shown in the second embodiment, and is provided for a reaction liquid (not shown). The patterned unmasked system in the pores is free from the surrounding structure and is not covered by the patterned masking region 241. When the 2G is in the process of the paste process, the hardened 5 is pressed to the workpiece to be patterned ( The stencil 20 of the patterned concealing area 241 is partially shielded from the stencil ___ 2I 3 pattern, and the rounded unmasked area 242 covered by the area 241 = shuttled ^ unpatterned occlusion area 241τ electric killing: 3⁄4 etching liquid shuttles, for the surface of the workpiece on the workpiece to carry out electric or mineral engraving Ying, and 201232655 heart, the above Qing ' # carry the crane to do the chemical squaring, the frame " f 222 to the mesh structure 221 to provide - tension, to maintain the network ^ ^ resignation of wealth «, 敎 料 产 产 产When the 'lighting operation' is located, the porous system located on the second surface 224 of the mesh structure 221 applies a pressure to the mesh structure 221, so that the workpiece of the soil material 26 is closely adhered, thereby obscuring the workpiece at the workpiece==; The pattern layer 24 and the cover layer are covered and protected on the field, so that the pattern or the line can be plated or reinforced; wherein the porous configuration is separable or closely connected. 4 is a schematic diagram of a stencil mold having a pattern according to still another embodiment of the present invention. For example, the pattern bristle mold 2G includes a porous base layer 2 disposed on one side of the porous substrate 26 and extending into at most one case. The structure, and the mask _24 includes a patterned masking region 24 partially porous substrate 26, wherein the pattern regions are formed by capping or chemical processing. The Wei L 41 series is a mechanically-assisted, laser-added pattern stencil mold 20 in the electric money process or the engraving system, and the patterned non-shadowing division is covered by the electric patterning masking area 241. The part that is not covered by the patterned masking area 241 is interesting. The electrolysis process is carried out, and the electroplated surface is formed on the turn and the above description 'When the surface of the workpiece has high and low undulations, the porous substrate 26 is shown in the surface of the workpiece. (4) 24 shapeable wire - structure with a three-dimensional structure of the surface And, when the mask is matched, the patterned masking region 241 which is pressed to the workpiece concealing pattern layer 24 when the patterned screen mold 20 is pressed is closely adhered to the surface of the workpiece. In the present invention, the stencil mold 2 having a round shape can be designed in a two-layer or three-layer design according to the workpiece pattern, and the product Si having a low pattern precision requirement and the product having a high pattern precision can be used in three layers. Design. ·,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Or etching, improvement knowing that it is necessary to repeat the coating feeling for each workpiece to achieve the high-temperature, high-humidity, strong acid, strong test and other complex processes of each 祙嶋 and the film: the lack of pattern on the heart/top, compared with the traditional Process, the invention can be less than the order of 'substantially shorten the time required for manufacturing, improve product yield, and save a lot of nuclear and chemical (four) demand, hide the loss and reduce the burden and help. In addition, when the continuous production demand of the coil material is required, the 'patterned stencil mold can also be tube-shaped' and II is made by the dimensional accuracy of the layer in the direction of the tree of the control side cylinder, and has a high pattern precision. product.
圖5所示為本發明一實闕於工件上形成圖案之方法流程示意 盆如圖所示’提供—工件及一具有圖案之網板模具，此為步驟， /、中工件具有—工件表面，而具有_之網板模具可為圖3所示之包 含網板結構、賴圖簡及多祕基材之三層式結構，或綱4所示 之包含遮蔽_層及多紐基材之二層式結構；接著將具有圖案之網 板核具壓合於工件上，且賴随層之難化遮蔽區覆蓋部分工件表 面’此為步驟32 ;之後Μ工件及具有圖案之贿模具於一反應槽中， ，反應槽巾之-反應液體流經多孔性基材及未被圖案化遮蔽區遮蔽之 β刀工件表面進行化學反應，此為步驟34;最後於化學反應完成之後， 移除具有圖案之網板模具，此為步驟36。 於一實施例中，上述之反應槽係為一電鍍槽，反應液體係為一電 鍍液，化學反應係於未被圖案化遮蔽區遮蔽之部分工件表面形成一電 鍍圖案。於另一實施例令，反應槽係為一化學蝕刻槽或電解蝕刻槽， 反應液體係為一蝕刻液，化學反應係於未被圖案化遮蔽區遮蔽之部分 工件表面形成一蝕刻圖案。另一方面上述之具有圖案之網板模具與工 件的壓合係可於電鑛槽或姓刻槽中進行。 為使本發明之目的、特徵和優點更明顯易懂，以下提出五種應用 本發明之於工件上形成圖案之方法之剖面示意圖。 201232655 圖6a至圖仏所示為本發明第一實施例於工件上形成圖案之方法 2=面’如圖6a所示’準備二詹式之具錢案之網板模具 v、’、匕3孔性基材26及一遮蔽圖案層24;接著如圖6b所示， =有酸之網碗具20與件40壓合在-起，使圖案化遮蔽區241 遮敝部分X件絲4G1 ;讀駐件4()及具有_找_且2〇置 ㈣巾進行驗，如圖&所示，於未蝴化遮蔽區 且㈣安 件表面仙形成一電鍵層42 ;接著如圖6d所示，將 具有圖案之網板模具2〇與工件4〇分開，此時工件表面顧上已 電鍍層42酵；_後之_ _ «具20則 更換之工件40壓合在—起，重複圖6b至圖6d之步驟，可 再-人το成圖6e所不之電鍍層42圖案。 ，亍标為本侧第二實細於工件上形成圖案之方法 及一遮蔽圖荦層24 .垃κι % 夕札注暴材26 工件40壓HI 标，_圖_域具2〇與 後將工件/π ’使圖案化遮蔽區241遮蔽部分工件表面仙；之 姓刻，如圖7c所干圖2〇置於綱槽(圖中未示)中進行 口化所不，於未被圖案化遮蔽區 :::r^ 二圖案；上已完成如圖〜所示之_凹槽 域刻二:_7b·7⑽驟’可州成，所示 圖8a至圖8e所示為本發a月第三實施例於工件上 剖面示意圖，在聽以進行電職二摘_ 之方法 所示，準備三層式之且古国右 馬例首先，如圖8a -、，_；!===;:網板結構 圖案之網板模具2。與，壓合在—起，使圖案化遮 201232655 件4G料m將轉及且 一 ^肩板杈具20置於電鍍槽(圖中未示)中 案化遮蔽區241遮蔽之部分工件表面形成—電^ =8__具2()與工件40分開，此 且有圖宰之網板桓且Γπ 之電鑛層42圖案；而分離後之 之雕模具2〇則用以與另一更換之工件40磨合在-起，重 驟，可再次完_6所示之_42圖案。其 -次銅等步=财紅先完讀孔、鍍仙、電鍍 钔專步驟巾元成本電鍍加工後亦另須施加其它工序。 圖9a至圖9e所示為本發明第四實施例於 ^Μμ 〇 ^ ,7« 9：；： ’備-層式之具有圖案之網板模具20 =索層24及-多孔.圖二：： 工件=〇Γ 40 a合在—起’使圖案化遮蔽區241遮蔽部分 Γ=匕件40係為一電路板，其中工㈣係為-電： ，，之後將工件40及具有圖案之網板模具 電路 中進_，如圖9c所示，於未被圖案化遮蔽區241遮== 表面401 凹槽44 ;接著如圖％所示 模具20與工件40分開 =有圖案之網板 槽私圖案;而分離後之且有圖索= 已4如圖％所示之_凹 工件㈣合在-起，重複^至^1 2〇則用以與另一更換之 示福刻凹槽44圖案圖至圖別之步驟，可再次完成_斤 圖10a至圖l〇g所示為本發明第五實施 法剖面示意圖，牛2:=方 ，，如圖所示，準備三層式之具有圖案之== 戶^將宰^蔽圖案層24及一多孔性基㈣接著如圖10b ==::==件㈣合在-起，使圖案化遮 (政P刀件表面，其中工件4〇之材質係為難鑛材料， 201232655 與電社之金狀有較低之結合 有圖案之網板模具20置於電鐘槽(圖中未示）中進行電鑛，如圖】㈣斤 不，於未被圖案化遮蔽區241遮蔽之部分工件表φ 4〇1形成一電鑛層 :供作為—金料電線路；接著如圖所示，將具有酸之網板 與工件40分開，此時工件表面401上已完成如圖收所示之 ，層42圖案；之後如圖1〇f所示，將工件4〇與—介電材杯塵合， 、=溫度提昇至介紐46的輕猶溫妙上，_輕_後再降 =度至破璃轉換溫度以下；最後分離工件⑼與介電材#，此時原 鍍於工件40上的電鐵層42，即金屬導電線路，轉移至介電材46 =如圖1〇g所示，即可製作一基本電路板5〇。又此已將電:: 轉移之I件4G可與分雜之具有_之峨模具Μ再次壓 :起’重複圖10b至圖l〇d之步驟，可再次完成圖1〇e戶斤示之金 板ίο路以及重複圖1〇f至圖1〇g之步驟’即可再次製作一基本電路 在上述之實施例中均以單面加工做為示範，若雙面均須進行 日、，可分做兩套具有_之網板模具，於加謂雙面皆覆 之具有圖案之網板模具，再進入電鑛槽或姓刻槽中進行加工。而 本發明之於工件上形賴案之方法，可取代傳統製 感=料、曝光、顯影、供烤’及剝膜之高溫、高濕、強酸、= 復雜製程。對量產型產品㈣，減即可少掉許多製缸序， 短製造所需時間’提昇產品良率，並節省許多水電與化學品y 可有效降低縣，大巾峨丨鱗賴傷害。 '’ 以上所述之實關僅料制本發明之独思想轉點 在使熟習此項技藝之人士能夠瞭解本發明之内容並據以實施，卷的 ，之限疋本發明之專利範圍，即大凡依本發明所揭示之精 不此 等變化或修飾，域涵蓋在本發明之專繼_。 之均 201232655 【圖式簡單說明】 圖la至圖le所示為習知一種於工件上形成圖案之電鍍方法流程 圖。 圖2a至圖2e所示為習知一種於工件上形成圖案之蝕刻方法流程 圖。 圖3所示為本發明一實施例具有圖案之網板模具示意圖。 圖4所示為本發明又一實施例具有圖案之網板模具示意圖。 圖5所示為本發明一實施例於工件上形成圖案之方法流程示意 圖。 圖6a至圖6e所示為本發明第一實施例於工件上形成圖案之方法 剖面示意圖。 圖7a至圖7e所示為本發明第二實施例於工件上形成圖案之方法 剖面示意圖。 圖8a至圖8e所示為本發明第三實施例於工件上形成圖案之方法 剖面示意圖。 圖9a至圖9e所示為本發明第四實施例於工件上形成圖案之方法 剖面示意圖，其係用以進行電路板線路圖案之蝕刻。 圖10a至圖10g所示為本發明第五實施例於工件上形成圖案之方 法剖面示意圖。 【主要元件符號說明】 10 工件 101 工件表面 12 感光材料 12 201232655FIG. 5 is a schematic flow chart showing a method for forming a pattern on a workpiece according to the present invention. As shown in the figure, a 'provided-workpiece and a patterned stencil mold, which is a step, /, the middle workpiece has a workpiece surface, The stencil mold having the _ can be a three-layer structure including a stencil structure, a simplification and a multi-secret substrate as shown in FIG. 3, or a shi-layer and a multi-nuclear substrate as shown in FIG. a layered structure; then the patterned stencil core is pressed onto the workpiece, and the difficult masking area of the layer covers part of the workpiece surface'. This is step 32; then the workpiece and the patterned brim mold are reacted in one step. In the tank, the reaction liquid flows through the porous substrate and the surface of the β-knife workpiece not shielded by the patterned masking region, and is in step 34; finally, after the chemical reaction is completed, the pattern is removed. The stencil mold, this is step 36. In one embodiment, the reaction tank is an electroplating bath, and the reaction liquid system is an electroplating solution. The chemical reaction is formed on an electroplating pattern on a portion of the workpiece that is not shielded by the patterned masking region. In another embodiment, the reaction tank is a chemical etching bath or an electrolytic etching bath, and the reaction liquid system is an etching liquid, and the chemical reaction forms an etching pattern on a portion of the workpiece surface which is not shielded by the patterned masking region. On the other hand, the above-mentioned patterned stencil mold and the pressing of the workpiece can be carried out in an electric ore tank or a groove. In order to make the objects, features and advantages of the present invention more comprehensible, a cross-sectional view of a method for forming a pattern on a workpiece of the present invention is presented below. 201232655 FIG. 6a to FIG. 仏 show a method for forming a pattern on a workpiece according to a first embodiment of the present invention. 2=face 'as shown in FIG. 6a. 'Preparing the stencil mold v, ', 匕 3 hole substrate of the two-legged money case 26 and a masking pattern layer 24; then, as shown in FIG. 6b, the acid-containing mesh bowl 20 is pressed against the member 40, so that the patterned masking region 241 conceals a portion of the X-piece wire 4G1; the reading member 4 () and having _ looking for _ and 2 〇 (four) towels for inspection, as shown in the figure &, in the unshaded masking area and (4) the surface of the mounting surface forming a key layer 42; then as shown in Figure 6d, will have The pattern of the stencil mold 2 〇 is separated from the workpiece 4 ,, at this time the surface of the workpiece is coated with the electroplated layer 42; _ _ _ « with 20 replace the workpiece 40 press-up, repeat Figure 6b to Figure 6d In the step, the pattern of the plating layer 42 which is not shown in Fig. 6e can be made again. , 亍 为本 为本 为本 为本 为本 为本 为本 为本 为本 为本 为本 为本 为本 为本 为本 为本 为本 为本 为本 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . The workpiece /π' causes the patterned masking area 241 to cover part of the surface of the workpiece; the last name is as shown in Fig. 7c, and the image is not placed in the groove (not shown) for the purpose of singulation. Masking area:::r^ Two patterns; the above has been completed as shown in Figure ~ _ groove field engraved two: _7b · 7 (10) step 'Keju, shown in Figure 8a to Figure 8e is the first month of the month The three embodiments are schematic diagrams of the upper part of the workpiece, and the three-layered and ancient country example is prepared as shown in the method of listening to the second job of the electric job. First, as shown in Fig. 8a -, _;! ===; The stencil mold 2 of the board structure pattern. And, pressing together, so that the patterned cover 201232655 4G material m will be transferred and the shoulder plate cooker 20 is placed in a plating tank (not shown) in the surface of the part of the workpiece shielded by the masking area 241 - The electric ^ 8__ has 2 () separated from the workpiece 40, and there is a pattern of the electric ore layer 42 of the stencil and Γ π; and the separated stencil 2 用以 is used for replacement with another The workpiece 40 is run-in, and the pattern is repeated, and the pattern of _42 shown in Fig. 6 can be completed again. It - the second step of the copper = Caihong first read the hole, plating, plating, 钔 special step towel cost processing, and other processes must be applied. 9a to 9e show a fourth embodiment of the present invention in a pattern of a stencil mold 20 with a pattern of a layer-type layer 24 and a porous layer. Figure 2: : workpiece = 〇Γ 40 a in the same - 'patterning masking area 241 shielding part Γ = element 40 is a circuit board, where the work (four) is - electric:, then the workpiece 40 and the patterned network In the board mold circuit, as shown in Fig. 9c, the masking area 241 is not covered by the masking area 241 == surface 401 groove 44; then the mold 20 is separated from the workpiece 40 as shown in Fig. = patterned stencil Pattern; and after separation and with a map = 4 as shown in Figure _ concave workpiece (four) in the - up, repeat ^ to ^ 1 2 〇 for another replacement with the display of the groove 44 pattern The steps from the figure to the figure can be completed again. Figure 10a to Figure 10g show a cross-sectional view of the fifth embodiment of the present invention. The cow 2:= square, as shown, prepares a three-layer pattern. == Household ^ will smear the pattern layer 24 and a porous base (four) then as shown in Figure 10b ==::== (4) in the -, to make the pattern cover (political P-knife surface, where the workpiece 4 The material of 〇 is difficult to mineral , 201232655 The stencil mold 20 with a lower pattern combined with the gold of the electric company is placed in the electric clock slot (not shown) for electric ore, as shown in the figure (4), not in the patterned masking area. 241 part of the workpiece table φ 4〇1 forms an electric ore layer: for the gold material line; then, as shown, the acid plate is separated from the workpiece 40, at which time the workpiece surface 401 has been completed. The figure shows the pattern of the layer 42; after that, as shown in Fig. 1〇f, the workpiece 4〇 and the dielectric cup are dusted together, and the temperature is raised to the lightness of the button 46, _light_ After that, the temperature is lowered to below the glass transition temperature; finally, the workpiece (9) and the dielectric material # are separated, and the electric iron layer 42 originally plated on the workpiece 40, that is, the metal conductive line, is transferred to the dielectric material 46. 1〇g, you can make a basic circuit board 5〇. This has already been charged:: Transfer of the 4 pieces of the 4G can be mixed with the mold Μ 峨 Μ Μ again: from the repeated Figure 10b to Figure l 〇d step, you can complete the steps of Figure 1〇e 斤 示 之 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及In the embodiment, the single-sided processing is used as an example. If both sides are required to be carried out, the two sets of stencil molds with _ can be divided into two. The electric ore tank or the surname is processed in the groove. The method of the invention on the workpiece can replace the traditional sensation=material, exposure, development, baking, and high temperature, high humidity, strong acid, = Complicated process. For mass production products (4), reduce the number of cylinders, reduce the time required for manufacturing, increase product yield, and save a lot of water, electricity and chemicals. </ br> <br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br> The scope, that is, the variations or modifications that are disclosed in the present invention, are encompassed by the present invention. 201232655 [Simple description of the drawings] Figures la to l show a flow chart of a plating method for forming a pattern on a workpiece. 2a to 2e are flow diagrams showing a conventional etching method for forming a pattern on a workpiece. 3 is a schematic view of a stencil mold having a pattern according to an embodiment of the present invention. 4 is a schematic view of a stencil mold having a pattern according to still another embodiment of the present invention. Fig. 5 is a flow chart showing a method of forming a pattern on a workpiece according to an embodiment of the present invention. Fig. 6a to Fig. 6e are schematic cross-sectional views showing a method of forming a pattern on a workpiece according to a first embodiment of the present invention. 7a to 7e are schematic cross-sectional views showing a method of forming a pattern on a workpiece according to a second embodiment of the present invention. 8a to 8e are schematic cross-sectional views showing a method of forming a pattern on a workpiece in accordance with a third embodiment of the present invention. 9a to 9e are cross-sectional views showing a method of forming a pattern on a workpiece according to a fourth embodiment of the present invention, which is used for etching a circuit pattern of a circuit board. Fig. 10a to Fig. 10g are schematic cross-sectional views showing a method of forming a pattern on a workpiece according to a fifth embodiment of the present invention. [Main component symbol description] 10 Workpiece 101 Workpiece surface 12 Photosensitive material 12 201232655
14 光罩 16 電鍍層 18 凹槽 20 網板模具 22 網板結構 221 網狀結構 222 框架結構 223 第一表面 224 第二表面 24 遮蔽圖案層 241 圖案化遮敝區 242 圖案化未遮蔽區 26 多孔性基材 30 ' 32 ' 步驟 34、36 40 工件 401 工件表面 42 電鍍層 44 蝕刻凹槽 46 介電材 50 基本電路板 1314 Photomask 16 Plating layer 18 Groove 20 Stencil mold 22 Stencil structure 221 Mesh structure 222 Frame structure 223 First surface 224 Second surface 24 Shadow pattern layer 241 Patterned concealer area 242 Patterned unmasked area 26 Porous Substrate 30 ' 32 'Steps 34, 36 40 Work piece 401 Work piece surface 42 Plating layer 44 Etching groove 46 Dielectric material 50 Basic circuit board 13