TW201228508A - Mobile electronic device containing heat dissipative flexible circuit board structure and manufacturing method thereof - Google Patents
Mobile electronic device containing heat dissipative flexible circuit board structure and manufacturing method thereof Download PDFInfo
- Publication number
- TW201228508A TW201228508A TW99146555A TW99146555A TW201228508A TW 201228508 A TW201228508 A TW 201228508A TW 99146555 A TW99146555 A TW 99146555A TW 99146555 A TW99146555 A TW 99146555A TW 201228508 A TW201228508 A TW 201228508A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- flexible circuit
- mobile electronic
- heat
- flexible
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052802 copper Inorganic materials 0.000 claims abstract description 30
- 239000010949 copper Substances 0.000 claims abstract description 30
- 230000017525 heat dissipation Effects 0.000 claims abstract description 30
- 230000007246 mechanism Effects 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 7
- 238000009413 insulation Methods 0.000 claims abstract 5
- 238000000034 method Methods 0.000 claims description 8
- 230000003014 reinforcing effect Effects 0.000 claims description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 8
- 241000282320 Panthera leo Species 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 101100327917 Caenorhabditis elegans chup-1 gene Proteins 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- LEYJJTBJCFGAQN-UHFFFAOYSA-N chembl1985378 Chemical compound OC1=CC=C2C=CC=CC2=C1N=NC(C=C1)=CC=C1N=NC1=CC=C(S(O)(=O)=O)C=C1 LEYJJTBJCFGAQN-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99146555A TW201228508A (en) | 2010-12-29 | 2010-12-29 | Mobile electronic device containing heat dissipative flexible circuit board structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99146555A TW201228508A (en) | 2010-12-29 | 2010-12-29 | Mobile electronic device containing heat dissipative flexible circuit board structure and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201228508A true TW201228508A (en) | 2012-07-01 |
| TWI406620B TWI406620B (enExample) | 2013-08-21 |
Family
ID=46933660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW99146555A TW201228508A (en) | 2010-12-29 | 2010-12-29 | Mobile electronic device containing heat dissipative flexible circuit board structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201228508A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104869751A (zh) * | 2015-05-19 | 2015-08-26 | 广州杰赛科技股份有限公司 | Pcb板及其生产工艺 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1806789B1 (en) * | 2004-10-04 | 2012-05-09 | Kabushiki Kaisha Toshiba | Lighting apparatus comprising light emitting diodes and liquid crystal display comprising the lighting apparatus |
| JP2009069473A (ja) * | 2007-09-13 | 2009-04-02 | Panasonic Corp | プラズマディスプレイ装置 |
| TWM328671U (en) * | 2007-09-19 | 2008-03-11 | Flexium Interconnect Inc | Heat-dissipation flexible circuit board for backlight module |
-
2010
- 2010-12-29 TW TW99146555A patent/TW201228508A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI406620B (enExample) | 2013-08-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |