TW201221848A - Low-cost multi functional heatsink for LED arrays - Google Patents
Low-cost multi functional heatsink for LED arrays Download PDFInfo
- Publication number
- TW201221848A TW201221848A TW100137961A TW100137961A TW201221848A TW 201221848 A TW201221848 A TW 201221848A TW 100137961 A TW100137961 A TW 100137961A TW 100137961 A TW100137961 A TW 100137961A TW 201221848 A TW201221848 A TW 201221848A
- Authority
- TW
- Taiwan
- Prior art keywords
- unit
- light source
- illumination device
- unit structure
- heat sink
- Prior art date
Links
- 238000003491 array Methods 0.000 title description 2
- 238000005286 illumination Methods 0.000 claims description 26
- 239000000853 adhesive Substances 0.000 claims description 19
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 2
- 239000011888 foil Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 210000004027 cell Anatomy 0.000 abstract 6
- 210000001316 polygonal cell Anatomy 0.000 abstract 1
- 239000000463 material Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 241001494479 Pecora Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Planar Illumination Modules (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP10188362 | 2010-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201221848A true TW201221848A (en) | 2012-06-01 |
Family
ID=44898107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100137961A TW201221848A (en) | 2010-10-21 | 2011-10-19 | Low-cost multi functional heatsink for LED arrays |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8974083B2 (enExample) |
| EP (1) | EP2630408A2 (enExample) |
| JP (1) | JP5854530B2 (enExample) |
| CN (1) | CN103168198B (enExample) |
| BR (1) | BR112013009349A2 (enExample) |
| TW (1) | TW201221848A (enExample) |
| WO (1) | WO2012052889A2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102518964A (zh) * | 2011-12-11 | 2012-06-27 | 深圳市光峰光电技术有限公司 | 光源和照明装置 |
| USD744156S1 (en) * | 2014-06-25 | 2015-11-24 | Martin Professional Aps | Light lens |
| FR3044821B1 (fr) * | 2015-12-02 | 2019-05-10 | Schneider Electric Industries Sas | Connecteur electrique comportant un dissipateur thermique et appareil electrique equipe d'un tel connecteur |
| US10649130B2 (en) | 2016-04-22 | 2020-05-12 | Signify Holding B.V. | Pebble-plate like louvre with specific domain characteristics |
| WO2017182392A1 (en) * | 2016-04-22 | 2017-10-26 | Philips Lighting Holding B.V. | Pebble-plate like louvre |
| US10415787B2 (en) | 2018-01-11 | 2019-09-17 | Osram Sylvania Inc. | Vehicle LED lamp having recirculating air channels |
| US11437429B2 (en) | 2019-09-30 | 2022-09-06 | Nichia Corporation | Light emitting device |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4527545A (en) * | 1982-07-06 | 1985-07-09 | Nagron Steel And Aluminium B.V. | Solar energy system and solar heat collector |
| JP2003209296A (ja) | 2002-01-17 | 2003-07-25 | Asahi Matsushita Electric Works Ltd | 発光ダイオード集合体 |
| JP4604819B2 (ja) * | 2005-04-28 | 2011-01-05 | 豊田合成株式会社 | 発光装置 |
| JP2007242244A (ja) * | 2006-03-03 | 2007-09-20 | Air Cycle Sangyo Kk | 照明器具 |
| US20070247851A1 (en) | 2006-04-21 | 2007-10-25 | Villard Russel G | Light Emitting Diode Lighting Package With Improved Heat Sink |
| US10295147B2 (en) | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
| EP2201286A1 (en) | 2007-09-07 | 2010-06-30 | Philips Solid-State Lighting Solutions | Methods and apparatus for providing led-based spotlight illumination in stage lighting applications |
| CN201282610Y (zh) * | 2007-12-26 | 2009-07-29 | 宗珀工业有限公司 | 蜂巢型散热体 |
| CN101539282B (zh) * | 2008-03-19 | 2011-06-29 | 富准精密工业(深圳)有限公司 | 发光二极管模组 |
| CN201429055Y (zh) | 2009-07-14 | 2010-03-24 | 柯建锋 | Led灯具用的散热装置 |
| CN101730455B (zh) * | 2009-12-22 | 2011-09-28 | 张志强 | 电子元器件散热装置 |
| CN101818871A (zh) | 2009-12-25 | 2010-09-01 | 江苏生日快乐光电科技有限公司 | 蜂窝结构烟道式散热led照明装置 |
-
2011
- 2011-10-13 WO PCT/IB2011/054532 patent/WO2012052889A2/en not_active Ceased
- 2011-10-13 JP JP2013534420A patent/JP5854530B2/ja not_active Expired - Fee Related
- 2011-10-13 EP EP11776572.7A patent/EP2630408A2/en not_active Withdrawn
- 2011-10-13 CN CN201180050799.XA patent/CN103168198B/zh not_active Expired - Fee Related
- 2011-10-13 US US13/879,844 patent/US8974083B2/en not_active Expired - Fee Related
- 2011-10-13 BR BR112013009349A patent/BR112013009349A2/pt not_active Application Discontinuation
- 2011-10-19 TW TW100137961A patent/TW201221848A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP2630408A2 (en) | 2013-08-28 |
| JP5854530B2 (ja) | 2016-02-09 |
| CN103168198A (zh) | 2013-06-19 |
| WO2012052889A2 (en) | 2012-04-26 |
| US20130322078A1 (en) | 2013-12-05 |
| BR112013009349A2 (pt) | 2016-07-26 |
| WO2012052889A3 (en) | 2012-08-16 |
| US8974083B2 (en) | 2015-03-10 |
| CN103168198B (zh) | 2016-04-06 |
| JP2013540338A (ja) | 2013-10-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201221848A (en) | Low-cost multi functional heatsink for LED arrays | |
| TWI460878B (zh) | 固態發光單元及其形成方法 | |
| TWI322915B (en) | Heat dissipation structure of backliht module | |
| CN102907183B (zh) | 用于led的镀层系统 | |
| JP4763709B2 (ja) | 回路付きストリップを使用した照明組立品 | |
| TWI302821B (en) | Flexible circuit board with heat sink | |
| JP5038398B2 (ja) | Ｌｅｄアレイグリッド、前記ｌｅｄグリッド、及び前記において使用するｌｅｄコンポーネントを作製する方法並びに装置 | |
| US10542616B2 (en) | Systems and methods for combined thermal and electrical energy transfer | |
| CN102187487B (zh) | Led阵列模块及其制造方法 | |
| CN1393653A (zh) | 发光二极管的模块化安装装置和方法 | |
| CN101869006A (zh) | 用于led安装与互连的可弯曲电路结构 | |
| CN111226072A (zh) | 用于发光元件和照明装置的支撑件 | |
| CN104078522A (zh) | 轻质的太阳电池子阵、该子阵的制作方法和电池阵 | |
| US8011821B2 (en) | Planar illumination device | |
| RU2573640C2 (ru) | Модуль источника света и светоизлучающее устройство | |
| TWI333580B (en) | Backlight module and liquid crystal display using the same | |
| CN2634572Y (zh) | 具有模块化发光二极管的电路板结构 | |
| CN102202459A (zh) | 带有金属微散热器的印刷电路板 | |
| CN100469217C (zh) | 可挠式散热电路基板 | |
| CN106024803A (zh) | 光照射模块 | |
| JP3164969U (ja) | 可塑性発光ダイオードパッケージ構造 | |
| CN101826517B (zh) | 发光装置 | |
| KR101395880B1 (ko) | Led 모듈의 제조방법 및 그 led 모듈 | |
| CN104421708A (zh) | 具有散热结构的led灯具 | |
| TW200903842A (en) | Light emitting diode unit and light emitting diode module composed by the same |