201200572 六、發明說明： 【發叫所屬之技術領域】 本發明係關㈣於將平而板以m合的躺柏層體及 稍增平面板。特別係關於能夠在手機、移動機器等行動資 訊終端機器中用於圖像顯示的内部構件的平面板貼合用樹 脂嵇柏體及積層平面板。 【先前技術】 ㈣的行㈣訊終端機器之货賴示部“，為了掩 蔽其設備叫部的t路等，制框_⑽丨⑽叫等對周邊部 分進行復蓋。而近年來，考處賴型化、平而設計較受歡 迎’已有在做為顯示板的平面板上施以框狀(額緣狀)的裝飾 印刷層等來代替框蓋β 一所謂裝倚印刷’通常是為了賦予掩蔽性及設計性而進 订的㈣。但是，通過進行裝飾印刷而設蓝的3〜心⑺左 右的微小高度差會成為顯示板的平面板與其它平面板贴今 泡的原因。因此，—般而言，為了解決在貼合時 ”· ^匕的_ ’大多情況下不是將平面板之間貼合而 疋使时f曲的膜做為其中—者等來進行貼合。 力-方面’做為行動資訊終端機器 搭載有電阻膜方式、靜雷^ 囬上夕見的疋 峻方式、電磁感應方式或紅外 觸控式面板的設備，其中，靜電 現㈣檢測(多點觸控），因此對於近年來的行動^ 二靜電容量式觸控式面板是檢測 言，為了實因此要求均勾的電場。-般而 ，膜-是有二==:合= 4/29 201200572 有效的。因此’對於靜電容量式觸控式面板而言，會 要求進行平面板之間的貼合。 ，做為將行動貧訊終端機器的内部構件之間貼合的傳統 =法，專利文獻丨巾提出了一種雙面黏合帶，其是在由聚 安土甲^ |g膜製成的芯材兩面使用了黏合劑的黏合帶。 但就專利文獻1的雙面黏合帶而言，在將平面板和可 變形的膜相貼合時，即使存在若干高度差，也能夠在不殘 =氣泡的K下實舰合。但是，在將平砂⑼相貼合 ^即，在不可變形的面之間進行貼合時，卻無法一邊趕 、氣心4進彳T貼合。這樣—來，會在貼合面混入氣泡， 進而導致無法完全隨動於高度差。 ★針對於此’專利文獻2中提出了一種雙面黏合帶，該 说合帶具有在動態黏彈譜上的損耗正切為G6〜15 H C下的儲存模數幻.Gx^Pa以上的黏合劑層。 寸利文獻2的雙面黏合帶，可通過進行高壓蒼 (autoclave)處理來除去在將表面保護面板貼合在圖像顯示 面板上時混人的氣泡。並且，即使在隨後進行進一步加熱 ’也不會導致上述氣泡復活或產生新的氣泡。 另外’專利文獻3令提出了—種顯示器用耐衝擊膜， 該膜由在25t下的tan5為0.5以上的第j層、在坑下的 福低於〇·5的第2層、以及在坑下的㈣§在〇 $ 的第3層構成。 ’、 對表專利文獻3的顯示器用耐衝擊膜而言，也可以通 過進行加熱加㈣縣消除在貼合時產线氣泡，且不会 在經過一定時間後再產生氣泡。 曰 [先前技術文獻] 5/29 201200572 丨:專利文獻:丨 專利文獻丨：13本特開平06-346032號公| 專利文獻2 :日本特開2()〇8_23丨358號公報 專利文獻3 :日本特開2009_300506號公報 【發明内容】 丨發明所欲解決的問題| (但是，本發明人等發現：在將專利义獻2的雙而黏合 V或4利文獻3的顯示器用耐衝擊脱貼合在典有岛度差的 而上，而不是贴合在破璃面板上時，在經過尚壓釜歲 ，會在經過一定時間後產生氣泡。 J 乂 本發明鑒於上述事實而完成，其目的在於提供一種平 而板站合用樹脂積層體及其積層平面板，該樹脂積層體能 夠除去在將具有高度差的平面板的貼合面彼此貼合時^ 的戒浥，並且能夠抑制在經過一定時間後產生氣泡。 丨用以解決問題的手段‘丨 為了解決上述問題，本發明人等進行了深入研究，結 果發現：通過控制平面板貼合用樹脂積層體的儲存模數f 此夠使上述問題得以解決。即，本發明提供下述（丨)〜(7) ·· (丨）本發明的第一態樣的平面板貼合用樹脂積層體是 用於將2 >{硬冑平面板賴合面彼舰合賴脂積層體， 其特徵在於，其巾-個平面板麵合面側具有高度為3〜5〇 的高度差，該平面板貼合用樹脂積層體具有樹脂層A 和樹脂層C，該樹脂層A被貼附在具有高度差的上述之其 中-個平面板的貼合面側’該樹脂層c被貼在另一平面板 的貼合面侧，該樹脂層C在23t：下的儲存模數高於該樹脂 層A在23°C下的儲存模數。 6/29 201200572 (2) 上述⑴所述的平面板貼合用樹月旨積層體，盆中， 在該樹脂層A和該樹脂層0之間進—步具有樹脂層β，且 I旨 各樹脂層在饥下的儲存模數的關係滿足：樹脂層八侧 層BS樹脂層C。 (3) 上述⑴或(2)所述的平面板貼合用樹月旨積層體，其 中’該樹脂層A在23。(：下的儲存模數為〇 〇〇〇jMpa以上且 小於O.lMPa，該樹脂層c在23。〇下的儲存模數為〇鳥 以上且小於〇.3MPa。 岸卿（4)並Μ1所述的^板貼合用樹脂積 H則度差是由上述平面板和設置在該平面板 上的印刷層引起的高度差。 本，明的第二態樣的積層平面板是利用上述 硬併平^壬一項所述的平面板貼合用樹脂積層體貼合2片 = 特徵在於’其中-個平面論 在呈右^ 鋒的高度差，該樹脂層A被貼附 =有4㈣上述之其中—個平面板的 月曰層C被貼附在上述另一平面板的貼合面側。亥树 右山^^^(5)所^的積層平面板，其被用作行動資訊炊 右而機益的圖像顯示構件。 貝 給Λ7)上述⑹所述的積層平面板，其被用作靜電灾旦々 觸控式面板的内部構件。 卜奸包合里式 [發明的效果] 能夠:去態樣的平_貼合用樹脂積層體， 能並且 依如、本發明的第二態樣的積層平面板，由於其不含有 7/29 201200572 =’因此適合用作行動资訊終端機B的⑸像瓶示構件而 不#對外觀造成破壞，並且，適合j|H乍靜张容觉式觸: 面板的内部構件而不會對t場的形成造成彩嚮。 【贲施方式】 ^ ^ 处樣的平面板貼合用樹脂積層體是用於將 1硬h +如板的貼合面彼此貼合的樹脂積層體，其屮—倘 平而板在貼合而侧具有高度為3.“爾差，該樹脂 4⑻以V有则W Λ和樹脂松〔，，」ι述樹船松Λ帔叫(时 度差的上述之其屮一個平而板的贴合而惻，上述樹 月《如C被貼附在另一平面板的貼合面側，且上述樹脂層。 ^ 23 C下的儲存模數高於上述樹脂層A在231下的儲存槔 本W明第一遮樣的平面板貼合用樹脂積層體只要是用 八將2 )Ί硬w平面板的貼合面彼此貼合的樹脂積層體即可 ，沒有特殊限制。該平面板貼合用樹脂積層體至少包括儲 存模數不同的樹脂層Λ及樹脂層C這2層。且樹脂層^在 h CT的儲存模數高於樹脂廣Λ在坑下的儲存根數。 在用於貼合的2 j彳平面板巾，其，.卜個平面板在貼合 ⑴側Λ有回度為3〜5G“m的高度差。另—個平面板實質上 在貼合面側不具有高度差。 、、 通過在兩個貼合面中具有高度差的上述其中一個平面 ，的貼合面侧貼合樹脂層A，另—個平面板的貼合面側貼 二樹脂層^，可確保高度差隨動性，從而不會出現氣泡問 ，=於本發明第-態樣的平峻貼合賴脂積層體而言 以在儲存模數不㈣樹脂層#細旨層c這2層之 8/29 201200572 間具有樹脂層β。較佳為在本發明第一能 =積層體中’在樹脂層八和樹脂層間進 各樹脂詹在23°CT的儲存模數 44月曰層知f脂層]^樹脂層匸。 各樹脂層的儲存模數滿足傾·係。在將包含 二=:t面ί貼合用樹脂積層體用於上述具有高 反差的+面板的貼合時，能夠抑制氣泡的產生。 门 'r及Γ本發明弟一態樣的平面板貼合用樹脂積層 弟ϋ的積層平面板的實施型態進行說明。 具體說明該實施型態是為了能夠更 ，在沒有特別指定的情況下，並不号用、丄此^乃的文點 發明進行限定。 1^疋用故些貫施方式對本 (丨）第一實施型態 圖ί是剖面示意圖，顯示了本發 貼合用樹脂積層體的第一實施型態。彳“樣料面板 片硬板貼合用掏.脂積層體〗是用於將2 片硬:千面板(平面板4和平面板6)的貼合面4a和貼合面 :積層體1平面板貼合用樹脂積層體]且有 ==^層A)和樹脂層3(樹脂層c)，該樹脂層脂 3^50/"m ό'ιιΐΜ,^^5 4 的具有敗飾印刷層5的貼八而4 g : 側，該樹脂層3(樹脂層 c)被貼5在另一平面板6的貼合面6 樹脂層C)在23。(：下的件在描古 坑下的儲存模^於樹脂層聰旨層A)在 的二飾印刷層5做為高度差的平面板 勺貫…仁，、有向度差的平面板並不限於此例，例如，還 0/29 201200572 *’J以是在成形時實施了具有岛度差的立體設計_船 曲板、或表而4有電路圆案的平而板。 " 減合U_合㈣手機、行 。；， ^終端機$中用於_顯示的構件的貼合 从u他'！悲的平面板貼合用樹脂積層®丨以樹脂妒2( 樹，Λ)為構成要素。對於上述樹峨樹脂“卿； 业㈣殊限制4列舉例如兩稀酸系樹脂、棟#系樹脂？ 聚=讀HU樹脂H卜從儲存缝以及Μ控 ㈣+面板4的黏合力的方面考| ’特別較佳為兩姊酸系 樹脂。 、 封於丙細酸系樹脂並無特殊限制，做為構成丙稀酸系 共聚物的，獨酸系I體者，可使用燒基的碳原子數為卜以 的ΓΡ基）丙豨峡基酿。做為（甲基)丙歸酸貌基酿，可列舉 .丙卸Ϊ酸甲酯、甲基丙烯酸甲酯、丙烯酸乙酯、甲基丙烯 酸乙醋、丙烯醆丙酷、甲基丙歸酸丙酿、丙缔酸異丙酿、 甲基丙烯酸異丙酯、丙烯酸正丁酯、甲基丙烯酸正丁酯、 丙烯酸異丁酯、甲基丙烯酸異丁酯、甲基丙烯酸正己酯、 丙烯酸2-乙基己酯、甲基丙烯酸2_乙基己酯、丙烯酸環己 酯、f基丙烯酸月桂酯、二甲基丙烯醯胺等。 另外，還可以使含有能夠與上述丙稀酸系單體共聚合 的官能基之單體進行共聚合。做為含有能夠共聚合的官能 基的單體，可使用分子内含有例如羥基、羧基、氨基、取 代氨基、環氧基等官能基的單體，較佳為使用含有羥基的 不飽和化合物、含有羧基的不飽和化合物。做為這類含有 言W基的單體的更具體的實例’可列舉：丙婦酸2_經基乙 10/29 201200572 酯、甲基丙烯酸2-羥基乙酯、丙烯酸2-羥基丙酯、曱基丙 烯酸2-羥基丙酯、丙烯酸2-羥基丁酯、曱基丙烯酸2-羥基 丁酯等含有羥基的丙烯酸酯；丙烯酸、曱基丙烯酸、伊康 酸等含有羧基的化合物。上述含有官能基的單體，可單獨 使用1者，也可以將2者以上組合使用。 此外，還可以使能夠與上述丙烯酸系單體共聚合的乙 烯系單體進行共聚合。做為可共聚合的乙烯系單體，可列 舉：笨乙烯、α-甲基苯乙烯、乙烯基曱苯、曱酸乙烯酯、 乙酸乙烯酯、丙烯腈、丙烯酸縮水甘油酯、曱基丙烯酸縮 水甘油S旨等。 另外，還可以依照需要在黏合劑中摻混適當的添加劑 。做為添加劑，可列舉例如交聯劑、增黏劑、顔料、染料 、填料等，也可以不摻混這些添加劑、僅以上述聚合物形 成黏合劑組合物。 較佳為樹脂層2(樹脂層Α)在23°C下的儲存模數為 0.0001 MPa以上且小於O.IMPa，更佳為0.00IMPa以上且 小於0.09MPa。樹脂層A在23°C下的儲存模數在〇.〇〇〇丨MPa 以上時，不存在因發生糊料滲出等而導致良率下降之虞； 樹脂層A在23°C下的儲存模數小於O.IMPa時，可實現良 好的高度差隨動性及平面板貼合適應性。 樹脂層A的厚度可以依照高度差(在第一實施型態中， 為之後敘述的裝飾印刷層5)的厚度適當選擇，但較佳為 5〜200//m，更佳為10〜〗50//m，特佳為15〜100//m。樹脂 層A的厚度在5//m以上時，可實現良好的高度差隨動性 及平面板貼合適應性；樹脂層A的厚度在200ym以下時 ，不存在因發生糊料滲出等而導致良率下降之虞 I 1/29 201200572 該货施型態的平而板叻合用樹脂坫松體丨以樹脂層3( 樹脂層C)為構成要素"對於上述樹脂層3 (樹脂層C)的材竹 並無特殊隈制，與樹脂層2(樹脂層八)同樣地，可列舉丙婶 酸系樹脂、橡膠系樹脂、聚矽氧樹脂、氟系樹脂等。其中 ，從Μ存模數以及容易控制與平面板6的黏合力方面考慮 ，特佳為丙烯酸系樹脂。 對於丙烯酸系樹脂並無特殊限制，可列舉與在Α料中 使川的樹脂相同的丙烯酸系共聚物及摻混冇添加劑的丙烯 酸系樹脂等。 樹脂層3(樹脂層C)在23 下的儲存棋數較佳為 〇.丨MPa以上且小於（).3MPa，更诖為〇丨5MPa以上且小於 〇.2MPa。樹脂層C在23t下的儲存模數在〇·1Μρ&以上時 ’不存在因發生糊料滲出等而導致良率下降之虞；樹脂層c 在23 C卜的儲存模數小於0.3MPa時，可實現良好的高度差 隨動性及平面板貼合適應性^ 、二 树脂層Μ樹脂層C)的厚度，與樹脂層2(樹规 /、— "‘-"a 二、W 阳;八 地，較佳為—5〜200_、更佳為|〇〜|5〇_、特俊為|5〜) =娜層,c的厚度在5//m j^上時，可實現良好的高 差)返祕及平面板貼合賴性；樹脂層c的厚度在2叫 以下％•’不存在因發生糊料滲出等而導致良訂降之声 2讲’樹脂層3(樹脂層C)的儲存模數高於‘ 。侧咖層2咖層八)轉 U在上相®，可_於具«飾_層5射 :4:貼合面知，從而抑制氣泡的產生。進一步，通過; ==Γ)的儲存模數控制在上述範圍，可以: 在&千面板6的貼合面6a之翻應力而導致氣泡產生 12/29 201200572 樹S AW ^皮么本么明目的的範圍内’可以在樹脂層2( 奶曰層Α)和樹脂層3(樹脂層c)之間設置樹脂居。 態樣的平面板貼合用樹脂積層㈣厚度較 1土兩〜600#ηι，更伟為0 積層體的厚度在l/以上日〜士 平面板貼合用樹脂 性μη μ 守，可貫現良好的高度差隨動 在6〇Γ 應性；平面板貼合用樹脂積層體的厚度 二以Ts^__加工等加工性的降低以及形 成树知層的膜時表面狀態的劣化。 严声Ϊί ^本發明第一態樣的平面板貼合用樹脂積層體的 在上述數值範圍内，較佳為依照高度差(在第一實施 上4面敘述的裝飾印刷層5)的厚度而適當選擇。 =^平面板貼合用樹脂積層體的厚度為高度差厚度的 ~ σ、,’ Μ為7〜15倍。平面板貼合用樹脂積層體的厚度 及厚度的5倍以上時，可實現良好的高度差隨動性 貼合適應性；平面板貼合用樹脂積層體的厚度為 :又差厚度的20倍以下時，可抑制沖壓加工等加工性的降 -以及形成樹脂層的膜時表面狀態的劣化。 、、做為平面板貼合用樹脂積層體丨的製作方法，可列舉 下述方法。 將上述丙烯酸系樹脂等的樹脂溶解液塗布在重 ^進行加熱、乾燥，以使重剝離片上形成樹脂層職脂 二）’然後’再在樹脂層2(樹脂層A)上積層輕剝離片的剝 1性二，作了夹持在2片剝離片之間的無基體材料黏 二:Ί。另—方面，在輕剝離片上塗布樹脂溶解液， 。仃y二熱、乾燥，以使輕剝離片上形成樹脂層3(樹脂層c) 進步，將上述無基體材料黏合性樹脂片上的輕剝離片 13/29 201200572 剝離，並將露出的樹脂層2(樹脂層Λ)與樹脂層3(樹脂層 C)貼合，從而得到了包括2層樹脂層的平而板贴合用樹脂 精層C 1。 做為上述樹脂溶解液的塗布方法，可列舉例如：棒塗 法、氣刀塗布法（丨coating)、概塗法、刮塗法（blade coaling)、模塗法、凹版印刷塗布法、簾式塗市法等以往於 知的方法“ 依照該平而板貼合川樹脂丨層微卜由於上述平而板贴 合川樹脂積層體丨包含儲存棋數不冏的樹脂層2(樹脂增Λ) 和财脂層3(樹脂層C) ’因此，能夠將具有高度差（即，裝飾 印刷層5)的平面板4的貼合面4a與平面板6的貼合面6a 贴合時產生的氣泡除去’並且能夠抑制在經過一定時間後 產生氣泡 圆2是剖面示意圖，顯示了本發明第二態樣的積層平 面板的第一實施型態。在圖2中，對於與在圖]的說;中 使用的元件相同的部分，採用相同的符號並省略其說明。 該實施型態的積層平面板7由硬質的平面板4的貼合 面4a與平面板6的貼合面6a貼合而成，該平面板4在^ 合面4a側具有裝飾印刷層5做為高度差，由於貼合時使= 了由樹脂層2(樹脂層A)和樹脂層3(樹脂層c)構成的樹脂 層體1，因此不會產生氣泡，視認性良好。 男 一該積料©板7特卿祕在手機、行㈣ 資訊終端機器的圖像顯示中使用的構件的貼合。丁 做為構成積層平面板7的平面板4，只 :、行動機器等的硬質材料即可，沒有特殊二夠 玻璃板、各種塑膠板等。 J ^ 14/29 201200572 板等做為塑膠板的具體例子，可列舉丙烯酸板'聚礙賴 該平面板4較佳為被用作表面保護面板。 平:板4的厚度較佳為如〜5_ _，更佳為200〜4_ ’ 特佳為 400〜3000"m。 以構成：4在貼° ^ 43側具有裝飾印刷層5。做為用 用飾印刷層5的印刷方法者，並無特殊限制，可使 用凹版印刷、網版印刷等。 對於印刷的圖案並無特殊限制，可 蔽用印刷、或賦予設計性的印刷。 丁才狀的电純 可使=於構成裝飾印刷層5的塗料，沒有特殊限制， 了使用‘知的塗料，例如，可使 化聚合型油墨等。 了使鬚線硬化型油墨、氧 刷層5的厚度為3〜50/，更佳為4〜3〇㈣， 特仏為5〜20_。裝飾印刷層5的厚度在以上時，可 後得充分的掩蔽性；其厚度在5〇//m以下時，亦無須加斤 才政月的柄月曰積層體，不會導致總厚度變厚。 一做為構成積層平面板7的平面板6,只要是可用於手機 二動機器等的硬質平面板即可，沒有特殊限制，可列舉 玻璃板、各種塑勝板等。 做為塑膠板的具體例子，可列舉丙晞酸板、聚碳酸 板0 膜草=卜^述平面板6也可以是由TCA(三乙酿纖維素） 月吴寻製成的積層板。 上述平面板6只要是硬質且具有平面的板即可，對於 ”厚度沒有特殊限定，也可以是如LCD板(液晶顯示板)之 15/29 201200572 包含複數個平而板的構件經積層而得者。此時，而烯酸板 板等平而板4可以在上述丨尤丨)板❹丨衝，時丄二 上述平面板6較佳為被用作圖像顯示而板。 依照該積層平面板7 ’在將其應用於手機、行動機巧嚀 行動资訊終端機器中構成圖像顯示的構件時，因為不:存 贴合悛產生氣泡，故可改善视認性。此外，在將該稍= 而板7應川於奸屯鉍证式觸控式面板的内部構件時，不合 因氣泡存在而對难場造成影響，可形成均勻的屯場。、U (2)笫二實施型態 1 ㈤3是剖面示意圖’顯示了本發㈣—態樣的平面板 貼合用樹脂積層體的第二實施型態。 在圖3中’對於與在圆！及_ 2的說明中使用的元件 相同的部分，採用相同的符號並省略其說明。 該平面板貼合用樹脂積層體9與平面板贴合用樹脂積 Μ丨_ ’可祕在手機、行__行動f訊終端機 益的圆像顯示中使用的構件的貼合。 就該實施型態的平面板貼合用樹脂積層體9而古，除 了平面板貼合用樹脂積層體,的結構以外，在樹蘭2(樹 脂層A)和樹脂層3(樹脂層Q之間進一步具有樹脂層8(樹脂 層B)。與平面板貼合用樹脂積層，體】相同，樹脂層3(樹脂 層C)在23t下的儲存模數高於樹脂層2(樹脂層A)的儲存 模，，並且，各樹脂層在饥下的儲存模數的關係滿足‘· 树月曰層2(細每層A)满脂層8(樹脂層β)讀脂層3(樹脂層 C)。 該實施型H的平面板貼合用樹脂制體9以樹脂層8( 16/29 201200572201200572 VI. Description of the invention: [Technical field to which the calling party belongs] The present invention relates to a fourth layer of a plaque layer and a slightly enlarged flat plate in which the flat plate is combined with m. In particular, it relates to a flat panel bonding resin enamel body and a laminated flat panel which can be used for an internal member for image display in a mobile communication terminal device such as a mobile phone or a mobile device. [Prior Art] (4) The line (4) The terminal of the goods of the terminal machine ", in order to cover the t-way of the equipment called the part, the frame _ (10) 丨 (10) called to cover the surrounding part. In recent years, the examination office Relying on the flat design, it is more popular. 'There is a frame-like (frontal) decorative printed layer on the flat panel used as the display panel instead of the frame cover. (4) The masking property and the designability are given. (4) However, the slight height difference of the 3~heart (7) which is set to blue by the decorative printing causes the flat panel of the display panel to be attached to the other flat panel. In general, in order to solve the problem, in the case of bonding, the _ ' is not bonded to the flat plates in many cases, and the film of the f-curve is used as the film. The Force-Aspect is a mobile information terminal device equipped with a resistive film method, static lightning, back to the sturdy way of seeing the last night, electromagnetic induction mode or infrared touch panel device, in which the static electricity (4) detection (multiple touch Control), so for the recent actions ^ two electrostatic capacitive touch panel is the detection of the word, in order to actually require the electric field. - In general, the membrane - is valid with two ==: combined = 4/29 201200572. Therefore, for electrostatic capacitance type touch panels, it is required to perform bonding between the flat plates. As a traditional method of fitting the internal components of the mobile terminal machine, the patent document wipes propose a double-sided adhesive tape which is on both sides of the core material made of polyanthene An adhesive tape using a binder. However, in the double-sided adhesive tape of Patent Document 1, when the flat plate and the deformable film are bonded to each other, even if there are a plurality of height differences, it is possible to perform the actual engagement without the K of the bubble. However, when the flat sand (9) is bonded to each other, that is, when it is bonded between the non-deformable surfaces, it is impossible to fit the entanglement and the temperament. In this way, bubbles will be mixed in the bonding surface, which will result in a failure to completely follow the height difference. ★ For this purpose, Patent Document 2 proposes a double-sided adhesive tape having a loss tangent on the dynamic viscoelastic spectrum of a storage modulus of G6~15 HC and a binder of more than Gx^Pa. Floor. The double-sided adhesive tape of the document 2 can be used to remove air bubbles which are mixed when the surface protection panel is attached to the image display panel by performing an autoclave process. Also, even if further heating is performed subsequently, the above bubbles are not revived or new bubbles are generated. Further, Patent Document 3 proposes an impact-resistant film for a display which has a j-th layer having a tan5 of 25 or more at 25t, a second layer of less than 〇·5 under the pit, and a pit. The next (four) § is composed of the third layer of 〇$. In the impact-resistant film for display of Patent Document 3, it is also possible to eliminate the line-forming air bubbles at the time of bonding by heating and adding (4) counties, and it is not necessary to generate bubbles after a certain period of time has elapsed.先前 [Prior Art Document] 5/29 201200572 丨: Patent Document: 丨 Patent Document 13: 13 Patent Publication No. 06-346032 | Patent Document 2: Japanese Patent Laid-Open No. 2() 〇 8_23丨 358 Patent Document 3: Japanese Laid-Open Patent Publication No. 2009-300506 [Summary of the Invention] The problem to be solved by the invention is as follows: (However, the present inventors have found that the display of the double-bonded V or the document 3 of the patent application 2 is resistant to impact peeling. In the case of the difference between the island and the island, instead of fitting it on the glass panel, after passing through the age of the kettle, bubbles will be generated after a certain period of time. J 乂 The present invention has been completed in view of the above facts, and its purpose It is to provide a flat laminated resin laminated body and a laminated flat plate which can remove the ringing when the bonding faces of the flat plates having the height difference are attached to each other, and can suppress the passage of a certain In the meantime, the inventors of the present invention conducted intensive studies to find out that the storage modulus f of the resin laminate for planar board bonding is sufficient. The above problem is solved. That is, the present invention provides the following (丨) to (7) (·) The first aspect of the present invention, the flat sheet bonding resin laminate is used for 2 > The planar board is a composite layer of a lining, and is characterized in that the surface of the face-faced surface of the towel has a height difference of 3 to 5 inches, and the resin laminate of the flat plate has a resin layer. A and the resin layer C, which is attached to the side of the bonding surface of the above-mentioned one of the flat plates having the height difference, the resin layer c being attached to the side of the bonding surface of the other planar plate, the resin layer The storage modulus of C at 23t: is higher than the storage modulus of the resin layer A at 23 ° C. 6/29 201200572 (2) The flat-plate laminate for the flat panel bonding described in the above (1), in the basin The resin layer β is further advanced between the resin layer A and the resin layer 0, and the relationship between the storage modulus of each resin layer under hunger is satisfied: the resin layer octa-layer BS resin layer C. (3 The above-mentioned (1) or (2), wherein the resin layer A is at 23 (the storage modulus of the lower layer is 〇〇〇〇jMpa). And less than 0.1 MPa, the resin layer c is 23. The storage modulus of the underarm is ostrich and less than 〇.3 MPa. The texture of the resin for the sheet bonding of the shore (4) and Μ1 is poor. It is a height difference caused by the above-mentioned flat plate and the printed layer provided on the flat plate. The second embodiment of the laminated flat plate is a flat plate bonded by the above-mentioned hard and flat type. The resin laminate is bonded to two sheets = the characteristic is that 'the one plane theory is at the height difference of the right side, and the resin layer A is attached = 4 (four) of the above-mentioned one of the plane sheets of the moon layer C is attached The laminating plane side of the other flat plate described above is a laminated flat plate of the Hi-Shojiyama (5), which is used as an image display member for action information. (7) The laminated flat panel according to the above (6), which is used as an internal member of a static-sensitive touch panel.卜 包 式 [ [ [ [ [ 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够201200572 = 'Therefore, it is suitable for use as the mobile information terminal B (5) like the bottle indicator member without # 对 外观 , , , , , , , , , , , , , , , , 适合 适合 : : : : : : : : : : : : : : : : : Formed to create a color direction. [Melting method] ^ ^ The resin laminated body for flat plate bonding is a resin laminated body for bonding the bonding surfaces of 1 hard h + such as a board, and the sheet is laminated if it is flat. The side has a height of 3. "Er, the resin 4 (8) with V, then W Λ and resin loose [,," ι 树 船 船 船 ( ( ( ( ( ( ( ( 船 船 船 船 船 船 船 船 船 船 船 船 船 船 船 船In the same manner, the above-mentioned tree month "such as C is attached to the side of the bonding surface of the other flat plate, and the above resin layer. ^ 23 C storage modulus is higher than the above-mentioned resin layer A under 231 storage transcript W The resin laminate for the flat sheet bonding of the first mask is not particularly limited as long as it is a resin laminate which is bonded to each other by a bonding surface of two hard) flat sheets. The resin laminated body for flat plate bonding includes at least two layers of a resin layer Λ and a resin layer C having different storage moduli. And the storage modulus of the resin layer ^ h CT is higher than the storage number of the resin under the pit. In the 2 j彳 flat stencil for lamination, the flat plate has a height difference of 3 to 5 G′m on the side of the fitting (1). The other flat plate is substantially in the bonding surface. The side does not have a height difference. The resin layer A is bonded to the side of the bonding surface having the height difference of the two bonding surfaces, and the resin layer A is attached to the bonding surface side of the other flat plate. ^, can ensure the height difference follow-up, so that there will be no bubble problem, = in the case of the first aspect of the present invention, the flat layer is laminated with the lyophilized layer, and the storage modulus is not (four) resin layer # The resin layer β is present between the 8/29 201200572 of the two layers. It is preferably in the first energy=layered body of the present invention 'the storage modulus of the resin between the resin layer eight and the resin layer at 23° CT444444 The resin layer of each resin layer satisfies the tilting system. The resin laminated body including the two-:t-surface bonding is used for the bonding of the above-mentioned high-contrast + panel. In the case of the present invention, it is possible to suppress the generation of the bubble. The implementation pattern of the laminated flat plate of the resin laminated layer of the planar plate bonding method of the present invention DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT This embodiment is intended to be able to be more limited, and is not limited to the case where it is not used, and the invention of the invention is limited. The first embodiment is a cross-sectional view showing the first embodiment of the resin laminated body for the hair bonding of the present invention. 彳 "Sample panel sheet for hard board bonding" is used for 2 Sheet hard: bonding surface 4a and bonding surface of a thousand panel (flat panel 4 and flat panel 6): laminated body 1 flat sheet bonding resin laminated body] and having ==^ layer A) and resin layer 3 (resin layer c), the resin layer 3^50/"m ό'ιιΐΜ, ^^5 4 has the embossed printed layer 5 of the affixed printing layer 5 and 4 g : side, the resin layer 3 (resin layer c) is pasted 5 On the bonding surface 6 of the other flat plate 6, the resin layer C) is at 23. (The lower part of the storage mold under the ancient pit is in the resin layer). The two-printed layer 5 is used as a flat plate with a height difference... a flat plate with poor directionality and Not limited to this example, for example, 0/29 201200572 *'J is a flat plate having a three-dimensional design with a difference in island degree, a ship curved plate, or a table with a circuit round. " Reduce U_he (four) mobile phone, line. ;, ^ Terminal machine $ for the assembly of the _ display member from u he'! The sorrow of the flat sheet is laminated with Resin®, which consists of resin 妒2 (tree, Λ). For the above-mentioned tree 峨 resin "Qing; industry (four) special restrictions 4, for example, two dilute acid resin, dong # resin? Poly = read HU resin H Bu from the storage joint and the control (four) + panel 4 adhesion test | In particular, it is preferably a bismuth acid-based resin. The acrylic acid-based resin is not particularly limited, and as the acrylic acid-based copolymer, the number of carbon atoms in the alkyl group can be used. For the ΓΡ ΓΡ ) ) ) ) ) ) ) ) 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 豨Vinegar, propylene, propylene, methyl propyl, isopropyl isopropyl, isopropyl methacrylate, n-butyl acrylate, n-butyl methacrylate, isobutyl acrylate, methacrylic acid Butyl ester, n-hexyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, cyclohexyl acrylate, lauryl acrylate, dimethyl decylamine, etc. Copolymerizing a monomer containing a functional group capable of copolymerizing with the above-mentioned acrylic acid monomer. As the monomer having a functional group capable of copolymerization, a monomer having a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group or an epoxy group in the molecule can be used, and a hydroxyl group-containing unsaturated compound or a carboxyl group-containing compound is preferably used. Unsaturated compound. A more specific example of such a monomer containing a W group can be exemplified as: B-glycolic acid 2_ylaminoacetic acid 10/29 201200572 ester, 2-hydroxyethyl methacrylate, acrylic acid 2- A hydroxy group-containing acrylate such as hydroxypropyl ester, 2-hydroxypropyl methacrylate, 2-hydroxybutyl acrylate or 2-hydroxybutyl methacrylate; a carboxyl group-containing compound such as acrylic acid, methacrylic acid or itaconic acid. The functional group-containing monomer may be used singly or in combination of two or more. Further, a vinyl monomer copolymerizable with the above acrylic monomer may be copolymerized. Examples of the polymerizable vinyl monomer include stupid ethylene, α-methylstyrene, vinyl anthracene, vinyl phthalate, vinyl acetate, acrylonitrile, glycidyl acrylate, and methacrylic acid shrinkage. In addition, an appropriate additive may be blended in the binder as needed. Examples of the additive include a crosslinking agent, a tackifier, a pigment, a dye, a filler, and the like, and may not be blended. The binder composition is formed only from the above polymer. Preferably, the storage modulus of the resin layer 2 (resin layer 在) at 23 ° C is 0.0001 MPa or more and less than 0.1 MPa, more preferably 0.00 MPa or more and less than 0.09 MPa. When the storage modulus of the resin layer A at 23 ° C is more than 〇〇〇丨.〇〇〇丨MPa, there is no flaw in yield due to the occurrence of paste bleeding or the like; the resin layer A is at 23 ° C When the storage modulus is less than 0.1 MPa, good height difference followability and flat panel adhesion can be achieved. The thickness of the resin layer A can be in accordance with the height difference (in the first embodiment, for the decoration described later) The thickness of the printed layer 5) is appropriately selected, but is preferably 5 to 200 / / m, more preferably 10 to 80 / / m, and particularly preferably 15 to 100 / / m. When the thickness of the resin layer A is 5/m or more, good height difference followability and flat plate adhesion can be achieved; when the thickness of the resin layer A is 200 μm or less, there is no occurrence of paste bleeding or the like.良I 1/29 201200572 The flat-plate composite resin of the product is in the form of a resin layer 3 (resin layer C) as a constituent element " for the above resin layer 3 (resin layer C) In the same manner as the resin layer 2 (resin layer VIII), a propionic acid resin, a rubber resin, a polyoxyn resin, a fluorine resin, or the like can be given. Among them, from the viewpoint of the storage modulus and the easy control of the adhesion to the flat plate 6, it is particularly preferable to be an acrylic resin. The acrylic resin is not particularly limited, and examples thereof include an acrylic copolymer which is the same as the resin of the product in the coating, and an acrylic resin in which the cerium additive is blended. The storage number of the resin layer 3 (resin layer C) at 23 is preferably 〇.丨MPa or more and less than (3. 3 MPa), more preferably 〇丨5 MPa or more and less than 〇.2 MPa. When the storage modulus of the resin layer C at 23t is 〇·1Μρ& or more, 'there is no drop in yield due to the occurrence of paste bleeding, etc.; when the storage modulus of the resin layer c is less than 0.3 MPa at 23 Cb, It can achieve good height difference followability and flatness of the flat plate, ^, the thickness of the two resin layer Μ resin layer C), and the resin layer 2 (tree gauge /, - "'-"a II, W yang Eight places, preferably -5~200_, better ||〇~|5〇_, 特俊为|5~) =Na layer, when the thickness of c is 5//mj^, it can achieve good Height difference) Rebound and flat panel bonding; the thickness of the resin layer c is less than 2%. • There is no sound due to the occurrence of paste exudation, etc. 2 Resin layer 3 (resin layer C ) The storage modulus is higher than '. Side coffee layer 2 coffee layer 8) Turn U in the upper phase ®, can be _ _ _ layer _ layer 5: 4: fit surface, thus suppressing the generation of bubbles. Further, the storage modulus of the ===Γ) is controlled within the above range, and the stress can be generated by the turning stress of the bonding surface 6a of the & thousand panel 6 12/29 201200572 Tree S AW ^皮么本明Within the scope of the purpose, a resin residence may be provided between the resin layer 2 (milk layer) and the resin layer 3 (resin layer c). The thickness of the flat sheet bonding resin layer (4) is thicker than 1 soil to 600# ηι, and the thickness is 0. The thickness of the layered body is l/above to the thickness of the flat plate, and the resinity μη μ is adhered to The good height difference is in accordance with the responsiveness; the thickness of the resin laminate for the flat sheet bonding is reduced by the workability such as Ts^__ processing and the deterioration of the surface state when the film of the tree layer is formed. In the above numerical range, the resin laminated body for flat sheet bonding according to the first aspect of the present invention is preferably in accordance with the height difference (the decorative printed layer 5 described in the four faces of the first embodiment). Appropriate choice. =^ The thickness of the resin laminate for flat panel bonding is ~ σ, and the thickness of the height difference is 7 to 15 times. When the thickness and thickness of the resin laminate for flat panel bonding are five times or more, a good height difference follow-up suitability can be achieved; the thickness of the resin laminate for flat panel bonding is 20 times the thickness difference In the following, it is possible to suppress the deterioration of workability such as press working and the deterioration of the surface state when the film of the resin layer is formed. The method for producing the resin laminated body for flat sheet bonding is exemplified by the following method. The resin solution such as the acrylic resin is applied to a weight, heated and dried to form a resin layer on the heavy release sheet, and then a light release sheet is laminated on the resin layer 2 (resin layer A). Peeling the second, the non-base material is sandwiched between the two release sheets: Ί. On the other hand, a resin solution is applied to the light release sheet.仃y is hot and dry to improve the formation of the resin layer 3 (resin layer c) on the light release sheet, and the light release sheet 13/29 201200572 on the above-mentioned substrate-free adhesive sheet is peeled off, and the exposed resin layer 2 is removed ( The resin layer 贴) was bonded to the resin layer 3 (resin layer C) to obtain a flat resin-bonded resin layer C 1 including two resin layers. Examples of the coating method of the resin solution include a bar coating method, a gas coating method, a coating method, a blade coaling method, a die coating method, a gravure coating method, and a curtain type. In the conventional method, such as the Tucson method, the resin layer 2 (the resin is added) and the financial layer 2 are stored in the same layer. Lipid layer 3 (resin layer C) ' Therefore, it is possible to remove bubbles generated when the bonding surface 4a of the flat plate 4 having the height difference (that is, the decorative printed layer 5) is bonded to the bonding surface 6a of the flat plate 6 And it is possible to suppress the generation of the bubble circle 2 after a certain period of time is a schematic cross-sectional view, showing the first embodiment of the laminated planar plate of the second aspect of the present invention. In Fig. 2, for use in the figure; The same components are denoted by the same reference numerals, and the description thereof will be omitted. The laminated flat plate 7 of this embodiment is formed by laminating the bonding surface 4a of the rigid flat plate 4 and the bonding surface 6a of the flat plate 6. The flat plate 4 has a decorative printed layer 5 on the side of the bonding surface 4a as a height difference In the case of bonding, the resin layer 1 composed of the resin layer 2 (resin layer A) and the resin layer 3 (resin layer c) is replaced, so that no air bubbles are generated and the visibility is good. 7 Special secrets in the mobile phone, line (4) The bonding of the components used in the image display of the information terminal machine. As the flat plate 4 constituting the laminated flat plate 7, only the hard material such as the mobile machine can be used. Special two glass plates, various plastic plates, etc. J ^ 14/29 201200572 A specific example of a plastic plate as a plate, etc., may be exemplified by the fact that the flat plate 4 is preferably used as a surface protection panel. The thickness of the plate 4 is preferably, for example, 〜5_ _, more preferably 200 〜4 _ ', particularly preferably 400 to 3000 " m. The composition: 4 has a decorative printed layer 5 on the side of the sticker 43. The printing method of the printing layer 5 is not particularly limited, and gravure printing, screen printing, etc. can be used. There is no particular limitation on the printing pattern, and printing or design printing can be masked. It is possible to use the paint which constitutes the decorative printed layer 5 without any particular limitation. For example, the thickness of the whisker-curable ink or the oxygen brush layer 5 is 3 to 50/, more preferably 4 to 3 Å (four), and particularly 5 to 20 Å. When the thickness of the decorative printed layer 5 is above, sufficient hiding property can be obtained; when the thickness is less than 5 〇//m, it is not necessary to add jins to the stalk of the moon, which does not cause the total thickness to become thick. The flat plate 6 constituting the laminated flat plate 7 is not particularly limited as long as it can be used for a rigid flat plate of a mobile phone two-moving machine, etc., and may be exemplified by a glass plate, various plastic winches, etc. Specific examples include a propionate plate, a polycarbonate plate, a film, a flat plate 6, and a laminate made of TCA (triethylcellulose). The flat plate 6 may be a rigid plate having a flat surface. The thickness is not particularly limited, and may be, for example, an LCD panel (liquid crystal display panel) 15/29 201200572 comprising a plurality of flat members. At this time, the plate of the olefin plate is equal and the plate 4 can be smashed in the above-mentioned plate, and the plate 6 is preferably used as an image display plate according to the layer. When the panel 7' is applied to a component for displaying an image in a mobile phone or a mobile device, the information display device does not: the air bubble is generated, so that the visibility can be improved. = When the board 7 is in the internal components of the smuggling type touch panel, it does not affect the hard field due to the presence of air bubbles, and can form a uniform field. U (2) 笫 2 implementation type 1 (5) 3 is a cross-sectional schematic view showing the second embodiment of the resin laminated body for flat panel bonding of the present invention (4). In Fig. 3, 'the same as the components used in the description of the circle! and _ 2 In part, the same symbols are used and the description thereof is omitted. The resin laminated body 9 is bonded to the flat sheet for resin _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In addition to the structure of the resin laminate for flat panel bonding, the resin laminate 8 is further provided between the tree 2 (resin layer A) and the resin layer 3 (the resin layer Q) The resin layer B) is laminated in the same manner as the resin for laminating the flat sheet, and the storage modulus of the resin layer 3 (resin layer C) at 23 t is higher than that of the resin layer 2 (resin layer A), and The relationship between the storage modulus of each resin layer under hunger satisfies '· Shuyue layer 2 (fine layer A) full fat layer 8 (resin layer β) lipid layer 3 (resin layer C). Resin body 9 for flat sheet bonding with resin layer 8 ( 16/29 201200572
smmM 2殊_ :與樹脂層2咖旨層A)、樹脂層3(樹脂層 系樹=舉，酸if脂、橡膠系樹脂、聚妙氧樹脂、氣 曰寻’ #佳為容易控制儲存模數的丙烯酸系樹月匕。 層樹脂 m Μ卞又孕乂<土為5〜200/zm、更佳為丨〇〜〗5〇// 从為15〜⑽/im。樹脂層B的厚度在5"心 =，良好的高度差隨動性及平面板貼合適應辭 =:°r以下時，不存在因發生糊料二 與平面板貼合用樹脂積層體I相同’本發 的樹脂積層體的厚度較佳為15〜__，更佳為 n”樹脂積層體的厚度在.以上時，可實現一= 度轉動性及平面板貼合適應性；樹脂制體的厚^在: ㈣以下時’可抑制沖壓加工等加工性的降低 脂層的膜時表面狀態的劣化。 _ /成树 樹脂層8(樹脂層印在听下的儲存模數 思〇〇〇〗〜G.3Mpa範圍内即可’沒有特殊限制， 層2(樹脂層A)的儲存模數以 了 /貝為树月曰 存模數以下。 在㈣層3(樹脂層B)的儲 不存在因㈣，出等’:導 在23C下的儲存模數在0 3Mp以 、·曰运 差隨動性及平面㈣合義性。『’以現良好的高度 進一步，藉由使各樹脂層的儲存桓 係，與平面板貼合用樹脂積層體】同^滿=述傾斜關 地，能夠除去在用 17/29 201200572 於典有芯度差的平而板的貼合時產生的氣泡，並且能夠抑 制在經過一定時間後產生氣泡。 做為平面板貼合用樹脂秸層體9的製作方法，可列舉 下述方法。 將樹脂溶解液塗布在重剝離片上，進行加熱、乾燥， 以使t剝離片上形成樹脂層2(樹脂層Λ)，然後，科在樹脂 層2(樹脂層Λ)上積層輕剝離片的剝離而，從而製作了夾将 在2 )丨剝離K之|1!|的無丛微材料黏合性樹脂〗丨λ只一方而 ，在輕剝離片上塗布樹脂溶解液，進行加熱、乾燦，與上 述樹脂飧Λ同樣地以無基鄕材料黏合性樹脂片的形態在輕 剝離片上形成樹脂層3(樹脂層〇及樹脂層η(樹脂層Β)。接 著，將樹脂層Α的無基體材料黏合性樹脂片上的輕剝離片 積層體。然後，將上述包含2 服積/'1'體上的輕剝離片剝離， β)與樹脂層3(樹脂層Q貼合， 的平面板貼合用樹脂積層體。 剝離，並將露出的樹脂層2(樹脂層A)與樹脂層8(樹脂層 B)貼4，ft而付到f巴含2層樹脂層的平面板貼合用樹脂 廣樹脂層的平面板貼合用樹 並將露出的樹脂層8(樹脂層 從而得到了包含三層樹脂層 面板貼合卿旨積層體9,除了平面板貼合用 树_脰丨以外，在樹脂層2 :⑽進-步積層有樹脂層_層= 面板貼合用樹脂積層體〗的效 _ * 了千 脂積層體9還具有優異的耐衝擊:，面板貼合用樹 貼合在整個面上的平面籍由 平面板4上的應力而獲得的。 、及收她加在 圖4是剖面示意圓，顯示了本發明第二態樣的積層平 201200572 面板的第二實施型態。在圓4 ㈣的元一部分，採用二 該實施型態的積層平面也丨n & 4a ^jr -4 r 板0由硬質的平面板4的贴合 :面:=的貼合面知貼合而成，該平面板4在點 :了做為巧差的裝飾印刷層5，由於貼合時使 月。2(树月曰層Α)、樹脂層8(樹脂層戰樹脂層 ^曰層〇的樹脂積層體9,因此不會產生氣泡，視認性良 該積層平面板10特別適用於 訊终端機器的圖像顯示令使用的構件的貼=枝心寻灯動負 依,¾ έ亥積層平面板丨〇，除且 以外，在庫用於手沪一有層平面板7的效果 偉顯亍ί 、订動機器等行動資訊終端機器的圖 ^ ”可防止在受到衝擊時上述圖像顯示產生❹， 亚且，可逋過由貼合在整個面 入 體9來吸收衝擊時施加在平面板二=^=樹脂積層 收性。 板4上的應力而獲得衝擊吸 與上述實施型態中所述的内容 發明第二鲅梓的笋层正权1土马將上述本 顯示構件使^做為行動資訊終端機器的圖像 近年來，對於行動資訊終端機器的圖像噸 現薄型化並遮蔽來自資訊顯 ，、、#，就貫 ，會在做;“ 先的觀點而言 為-不板的平面板上施加框狀的裝飾印刷@ 行裝娜印刷而設置的微小高度差會造成將但 :板與其它平面板貼合時混入氣泡。而這些氣泡合^平 美觀的問題。 、g成為影 19/29 201200572 山於在本發明笫二態樣的稍層 Ή A差1¾奶性的本發明的平而板！ 此不存在内部產生氣泡之處。由此 板用於行動資訊終端機器的圈像顯示，smmM 2 special _: with the resin layer 2, the layer A), the resin layer 3 (resin layer tree = lifting, acid fat, rubber resin, poly-oxygen resin, gas 曰 ') #佳为 Easy to control the storage mold The number of acrylic trees is sputum. The layer resin m Μ卞 and the 乂 乂 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 In the case of 5"heart=, good height difference follow-up and flat panel sticker ==°r or less, there is no resin which is the same as the resin laminate I used for bonding the flat sheet to the flat sheet. The thickness of the laminate is preferably 15 to __, more preferably the thickness of the n" resin laminate is above, and a degree of rotation and flat panel adhesion can be achieved; the thickness of the resin body is: (4) In the following case, it is possible to suppress the deterioration of the surface state of the film of the fat layer such as the press working. _ / The resin layer 8 (the resin layer is printed in the listening mode of the listening layer) ~ G.3Mpa range There is no special restriction, and the storage modulus of layer 2 (resin layer A) is below /2 for the tree-month storage modulus. The storage of (4) layer 3 (resin layer B) does not exist (4) Waiting ': the storage modulus at 23C is 0 3Mp, · 曰 随 随 及 及 及 及 及 及 。 。 。 。 。 。 。 。 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 现 现 现 现 现 现 现 现 现 现The resin laminated body for bonding to a flat plate can eliminate the air bubbles generated when the flat plate of 17/29 201200572 is used for the flatness of the plate, and can be suppressed. The bubble is generated after a certain period of time. The method for producing the resin straw layer 9 for flat panel bonding includes the following method: The resin solution is applied onto a heavy release sheet, and heated and dried to form a t-sheet. After the resin layer 2 (resin layer Λ), the peeling of the light release sheet is laminated on the resin layer 2 (resin layer ,), thereby producing a non-clustered layer in which the clip is peeled off by 2) K|| The material-adhesive resin 只 丨 λ is applied to the light release sheet by applying a resin solution to the light release sheet, heating and drying, and forming a resin on the light release sheet in the form of a binder-free resin sheet in the same manner as the resin sheet. Layer 3 (resin layer 树脂 and resin layer η (resin layer Β) Next, a light-peeled laminated body on the base material-free adhesive sheet of the resin layer is peeled off. Then, the above-mentioned light release sheet containing the two-package/'1' body is peeled off, β) and the resin layer 3 (resin layer) The resin laminate of the flat sheet bonding is bonded, and the exposed resin layer 2 (resin layer A) and the resin layer 8 (resin layer B) are attached 4, ft and the f bar contains 2 layers of resin. The planar flat sheet of the layer is bonded to the flat sheet bonding resin of the resin wide resin layer, and the exposed resin layer 8 is formed (the resin layer is obtained to include a three-layer resin layer panel-bonded laminate layer 9 except for the flat sheet bonding) In addition to the tree _ ,, the resin layer 2: (10) is laminated with a resin layer _ layer = the resin laminated body for panel bonding _ * The 1000-layer laminated body 9 also has excellent impact resistance: The plane in which the fitting tree is applied to the entire surface is obtained by the stress on the flat plate 4. Figure 4 is a cross-sectional schematic circle showing a second embodiment of the laminated flat 201200572 panel of the second aspect of the present invention. In the part of the circle 4 (four), the laminated plane using the two embodiments is also 丨n & 4a ^jr -4 r The plate 0 is bonded by the rigid flat plate 4: the surface of the face: = fit The flat plate 4 is at the point: the decorative printed layer 5 is made as a coincidence, and the moon is made due to the fitting. 2 (tree 曰 曰 layer), resin layer 8 (resin layer of resin layer 树脂 layer of resin layered layer 9 so that no air bubbles are generated, and the laminated flat plate 10 is particularly suitable for the image of the terminal machine. For example, the display of the components used for the display is dependent on the light, and the 3⁄4 έ 积 积 积 积 丨〇 丨〇 丨〇 丨〇 丨〇 丨〇 丨〇 丨〇 丨〇 一 一 一 一 一 一 一 一 一 一 一 一The figure of the action information terminal machine such as a machine can prevent the above-mentioned image display from being generated when the impact is received, and can be applied to the flat plate by the fit of the entire surface into the body 9 to absorb the impact. Resin build-up. The stress on the plate 4 is obtained by impact and the second layer of the invention described in the above embodiment is the right to the right. 1 The horse is used as the mobile information terminal machine. In recent years, the image of the mobile information terminal machine has been thinned and obscured from the information display, and #, and it will be done; "In the first point of view, it is applied to the flat panel. Frame-shaped decorative printing @行装娜印刷 and setting a small height difference will The result is that the board is mixed with other flat plates and mixed with air bubbles. These bubbles are flat and beautiful. G becomes a shadow 19/29 201200572 Mountain in the present invention, a slight layer of Ή A difference 13⁄4 milk The flat board of the present invention! There is no internal bubble generation. The board is used for the circle image display of the mobile information terminal machine.
著將上述秸層平面 能夠消除上述問題The above-mentioned straw layer plane can eliminate the above problems
此外，較佳為將本發明第二態才 屯^兑式觸控式面板的内部構件„In addition, it is preferred that the second component of the present invention is an internal component of the touch panel.
做為行動货訊終端機災，士 ^ 膜方式、靜t容贷方式、 觸控式面板的設備，其中 檢测表面靜電容量變化的方式，㈣要求均句的電場。而 為了形成均勻的電場，玻璃等平滑面是有效的。因此，對 於靜電容量式觸控式面板而言，會要求進行平面板 貼合。 ：Ν 本發明第二態樣的平面板貼合用樹脂積層體對於硬質 平面板之間的貼合也顯示出優異的高度差貼合適應性。因 此，對於使用了上述平而板贴合用樹脂積層體的本發明第 —也樣的積層平面板而言，不會因氣泡存在而對電場浩成 影響’可保持均勻的電場。 因此’上述積層平面板能夠適用於靜電容量式觸控式 面板的内部構件。 以下，結合實施例對本發明進行更為具體的說明，但 本發明並不限定於下述實施例。 (樹脂溶解液丨的製備） 向由丙稀酸丁酯(BA)、丙稀酸酽醋(ΜΑ)、丙稀酸4-經 基丁酯（4ΗΒΑ)構成的兩烯酸系共聚物 20/29 201200572 (BA/MA/4HBA=79/20/1，重量平均分子量為90篇）丨00質量 份中混合0.05質量份的異氰酸酯系交聯劑(綜研化學公司製 造，製品名為“TD-75” ，濃度75%)，用甲基乙基δ同進行 稀釋，製作了不揮發成分濃度為30%的樹脂溶解液】° (樹脂溶解液2的製備） 向由丙烯酸丁酯(ΒΑ)、丙烯酸乙酯(ΈΑ)、丙稀酸(AAc) 構成的丙烯酸系共聚物(BA/EA/AAc =77/20/3 ’重量平均分 子量為90萬）〗〇〇質量份中混合4質量份的鋁螯合物系交聯 劑（綜研化學公司製造，製品名為“M-5A” ’濃度4·95%) ，用曱基乙基酮進行稀釋，製作了不揮發成分濃度為30% 的樹脂溶解液2。 (樹脂溶解液3的製備） 向由丙烯酸丁酯(ΒΑ)、丙烯酸曱醋(ΜΑ)、丙烯酸(AAc) 形成的丙烯酸系共聚物(BA/MA/AAc =77/20/3 ’重量平均分 子量為90萬）1〇〇質量份中混合1.75質量份的異氰酸醋系交 聯劑（東洋油墨公司製造，製品名為“BHS-8515” ’濃度 37.5%)和1.75質量份的鋁螯合物系交聯劑(綜研化學公司製 造，製品名為“M-5A” ，濃度4.95%)，用曱基乙基嗣進行 稀釋，製作了不揮發成分濃度為28%的樹脂溶解液3 ° (樹脂溶解液4的製備） 配製了丙烯酸系黏合劑(Lintec股份有限公司製造’製 品名為“PM”）的曱基乙基酮稀釋液，並以此做為樹脂溶解 液4。 (樹脂溶解液5的製備） 向由丙烯酸2-乙基己酯(2EHA)、丙烯酸環己酯（CHA) 、丙烯酸2-羥基乙酯（HEA)構成的丙烯酸系共聚物 21/29 201200572 (2miA/aiA/miA=^.7/40/0.3,重量平均分子觉為80誠）丨〇〇 竹金份屮混合0.5 S t份的異氘酸酯系交聯劑（東洋油墨公 司製造，製品名為“BllS-85ir ，濃度37.5%)，用甲基乙 基_進行豨釋，製作了不揮發成分濃度為3(>%的樹脂溶解 液5 ' (1:Γ施例1) 將樹脂溶解液丨塗布在赉剝離片（丨,illlc(;股份有限公司 製造’製品名為“SP-IM.ynsi丨”）上，在丨2()‘'c下加熱2分 鐘，從而在重剝離片上形成了厚丨0()μιΐ1的Λ層t，然後， 在Λ精上稍層輕剝離片（UntCG股份有限公司製造，製品名 為SP-l>irn8〇r >的剝離面，從而製作了夾持在2片剝離 片之問的無基體材料黏合性樹脂片。另一方面，在輕剝離 片（丨;im:cc股份有限公司製造，製品名為“δΡ·ΡΕΤ38()丨”） 上塗布樹脂溶解液2，在丨2〇°c下加熱2分鐘，從而在輕剝 片上形成了厚5 ()从m的c層。進一步，將上述無基體材 料黏合性樹脂片上的輕剝離片剝離，並將露出的Λ層與c 層貼合，從而得到了由2層樹脂層構成的實施例丨的平面 板貼合用樹脂積層體。 (實施例2) 除了由樹脂溶解液丨形成厚100#ηι的Α層、並由樹 月曰洛解液3形成厚50/im的C層以外，按照與實施例！相 同的方法得到了實施例2的平面板貼合⑽脂積層體。 (實施例3) ,將樹脂溶解液4塗布在重剝離片（Lintec股份有限公司 製造，製品名為“sp_pET38n”）上，在]2(rc下加熱2分 知，在重剝離片上形成了厚50以m的A層。 22/29 201200572 制進—步’在A層上積層輕剝離片（Lintec股份有限公司 衣k，製品名為“Sp_PET38〇r )的剝離面，從而製作了夹 持在2片剝離片之間的無基體材料黏合性樹脂片。 、 口另—方面，在輕剝離片（Lintec股份有限公司製造，製 名為SP-PETT38〇r )上塗布樹脂溶解液】，在丨2〇。〇下 加，2分鐘，從而在輕剝離片上形成了厚5〇_的β層。 接著，將上述無基體材料黏合性樹脂片上的輕剝離片^離 ’並將露出的Α層與Β層貼合，從而得到了由2層樹脂層 構成的平面板貼合用樹脂積層體。 曰 再另方面，在輕剝離片（Linlec股份有限公司製诰， 製品名為“SP-PET38〇r )上塗布樹脂溶解液2，在 下加熱2分鐘’從而在輕剝離片上形成了厚5〇^⑴的c層 。接著’將上述由2 |樹脂層構成的平面板貼合用樹^ 層體上的輕剝離片剝離，並將露出的B層與c層貼人，從 而得到了由3層樹脂層構成的實施例3的平面二;二 脂積層體。 (實施例4) 除了由樹脂溶解液1形成厚的Α層、並由樹 脂溶解液5形成厚的c層以外，按照與實施例1相 同的方法得到了實施例4的平面板貼合用樹脂積層體。 (比較例1) 除了由樹脂溶解液丨形成厚· m的A層、由樹脂溶 解液2形成厚5G/Zm的B層、並由樹脂溶解液】形成厚曰知 β m的C層以外’按照與實施例3相同的方法得到了比較 例1的平面板貼合用樹脂積層體。 (比較例2) 23/29 201200572 除了由樹胎溶解液2形成厚50 // m的λ層、並由樹脂 溶解液I形成厚的C Μ以外，按照與货施例丨相同 的方法得到了比較例2的平而板贴合用樹脂稍層體 (比較例3) 除了山樹脂洛解液2形成厚50 μ m的Λ層、由樹脂溶 解液2形成厚50 V m的Β層、並由樹脂溶解液2形成厚5() μ m的C楷以外’按照與货施例3相同的方法得到了比較 例3的平而板叻合用樹脂秸層體°比蛟例3的平而板丨沾合 用樹脂積層e货竹上是三層均由相同的樹脂2構成的樹脂 嵇層微。 (比較例4) 除了由樹脂溶解液4形成厚50,的a層、由樹脂溶 解液4形成厚50// m的B層、並由樹脂溶解液4形成厚"二 # m則L疮以外’按照與比較例3相同的方法得到了比丰 例4的平φ㈣合騎脂積層體。比較例4料面板貼二 爾上是三層均由相同的樹脂4構成的如; m M m ° 地過下述試射法對各實施财__ 用樹脂積層體的性狀進行了測定^ ⑴厚度測定 η衣丨；；τ不 施例及比較财得到的無基體材料約生. 定器aEC_股份有 上=恆壓厚度; 進行了測定。另外，八？|卢..表坆取°〇名為PG-02” 對各《相厚度進彳$ 前的單體樹脂層的狀態- (2)储存模數 24/29 201200572 去丨*各只％例及比較例中得到的無基體材料黏合性樹 月曰片上的剝離片後，十夕〜 數片®合，形成了厚2.0ηιηΊ的片 ^品。將形成的以樣品裁切成直徑On画高2.0卿的 p、主狀’使用黏弹性挪定褒置⑽e〇_,icScie【^c公司製 造:商品名為‘‘RDAir )、通過扭轉剪切法在丨他的測定 頻率下啦了抗下―存模數。 (3)间度差貼合適應性(.發泡的有無） 使用UV硬化型油墨(帝國油墨公司製造，製品名為“ P 91丨墨）在丙％峻樹脂板(三菱Ray〇n公司製造，製品 名為 “ACRYLITE L〇ii” 士 1 ’長 70mmx寬 40mmx厚 l.5nim) 的表面進行框狀（外形， ^ 長70mmxl 40丨nm，框肓5卬爪）印 刷’使得塗布厚度達到 Η 0 V m及20 β m，並進行UV硬化 作了以過印刷而具有高度差的丙稀酸板。 :彳収彳㈣的無基體材料黏合性樹脂片 裁切成長70mmx寬4〇1Tlm 的形狀，去除輕剝離片後，使用 積層機(FUIIPLA公司萝、生〜 J衣造，製品名為“LPD3214”）將露出 的樹脂層面制在上^_板的印刷面上，並使上述樹 脂層面包覆整個框狀印咏1 @。 積層後剝一重剝離片，利用上述積層機將玻璃板(NSG Precision 4<c〇rning glass E&gje χ〇„ , 厚長7〇_寬7Qmm)積層在露出的樹脂層面上， 製作了尚度差貼合適應性評估用樣品。 然伋’貫把南壓金處理(5〇t：、〇.5MPa、2〇分並 破認了氣泡的有無。㈣、下述標準分下述3轉級泡 的有無進行了判斷。 〇：完全沒有氣泡 25/29 201200572 A :有丨、2處泥入了氣泡 X:冇3 4以上混入了氣泡 另外’在23t：、50%l<h環境中放置7天，内樣地退_ 了氣泡的有無的確認。 (4)沖壓加工性 利用沖壓加工裝置(Linlec股份有限公司製造，制n 枚U1J名 為“Ι'ΡΜ 3()0”）將施例及比較例中得到的無基：材:卜丨扣 合性樹脂）丨沖壓加工為長70mmx宽40mm的尺寸，U4h.二 脂精殆的形狀變形及樹脂層的滲出進行了確認。將巧 了形狀變形或出现了樹脂層的滲出的情況判定為x，將朱發 生形狀變形及樹脂層的滲出的情況判定為〇。 各货施例及比較例中的試驗結果歸納示於表丨中。 4JJ.As a mobile cargo terminal, the company's membrane mode, static capacity, and touch panel devices, in which the surface capacitance changes are detected, and (4) the electric field of the sentence is required. In order to form a uniform electric field, a smooth surface such as glass is effective. Therefore, for electrostatic capacitive touch panels, flat panel bonding is required. Ν The resin laminated body for flat sheet bonding according to the second aspect of the present invention also exhibits an excellent height difference suitable for bonding between the rigid flat sheets. Therefore, in the laminated flat plate of the present invention which uses the flat laminated resin laminate, the electric field is not affected by the presence of bubbles, and a uniform electric field can be maintained. Therefore, the above laminated flat panel can be applied to the internal members of the electrostatic capacitance type touch panel. Hereinafter, the present invention will be specifically described with reference to the examples, but the present invention is not limited to the following examples. (Preparation of Resin Dissolving Solution 向) To the enedenoic acid copolymer 20/ composed of butyl acrylate (BA), acenoacetic acid vinegar (acrylic acid), and butyl acrylate (4 fluorene). 29 201200572 (BA/MA/4HBA=79/20/1, weight average molecular weight: 90) 0.05 00 parts by mass of 0.05 parts by mass of isocyanate-based cross-linking agent (manufactured by Soken Chemical Co., Ltd., product name: TD-75) ”, concentration 75%), diluted with methyl ethyl δ, to prepare a resin solution with a non-volatile content of 30%] (preparation of resin solution 2) to butyl acrylate (acrylic acid), acrylic acid Acrylic copolymer composed of ethyl ester (hydrazine) and acrylic acid (AAc) (BA/EA/AAc = 77/20/3 'weight average molecular weight: 900,000). 4 parts by mass of aluminum mixed in parts by mass Chelate-based cross-linking agent (manufactured by Soken Chemical Co., Ltd., product name "M-5A" 'concentration 4.95%), diluted with mercaptoethyl ketone to make a resin with a non-volatile content of 30% dissolved Liquid 2. (Preparation of Resin Dissolving Solution 3) An acrylic copolymer (BA/MA/AAc = 77/20/3 ' weight average molecular weight formed of butyl acrylate (acrylic acid), acrylic acid (A), acrylic acid (AAc) 1.5 parts by mass of an isocyanate-based cross-linking agent (manufactured by Toyo Ink Co., Ltd., product name "BHS-8515" 'concentration 37.5%) and 1.75 parts by mass of aluminum chelate The cross-linking agent (manufactured by Zaken Chemical Co., Ltd., product name "M-5A", concentration 4.95%) was diluted with mercaptoethyl hydrazine to prepare a resin solution with a concentration of 28% non-volatile content of 3 ° (resin Preparation of Dissolving Solution 4 A bismuthyl ketone diluted solution of an acrylic adhesive (product name "PM" manufactured by Lintec Co., Ltd.) was prepared and used as the resin dissolving solution 4. (Preparation of Resin Dissolving Solution 5) Acrylic Copolymer composed of 2-ethylhexyl acrylate (2EHA), cyclohexyl acrylate (CHA), and 2-hydroxyethyl acrylate (HEA) 21/29 201200572 (2miA /aiA/miA=^.7/40/0.3, weight average molecular sensation is 80 丨〇〇) 丨〇〇 金 金 屮 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 For "BllS-85ir, concentration 37.5%", the methyl ethyl group was used for the release, and a resin having a nonvolatile content of 3 (>% of the resin solution 5' (1: Example 1) was dissolved. The liquid helium is coated on a ruthenium release sheet (丨, illlc (; manufactured by the company, 'product name "SP-IM. ynsi丨)), heated at 丨 2 () ''c for 2 minutes, thereby on the heavy release sheet A tantalum layer t having a thickness of 0 () μιΐ1 was formed, and then a thin layer of a peeling sheet (manufactured by UntCG Co., Ltd., product name: SP-l>irn8〇r > A non-base material adhesive resin sheet sandwiched between two release sheets. On the other hand, in a light release sheet (manufactured by im: cc, the product name is "δΡ·ΡΕ 38()丨”) was coated with the resin solution 2 and heated at 丨2°°C for 2 minutes to form a c layer having a thickness of 5 (m) from the lightly peeled sheet. Further, the above-mentioned matrix-free material was adhered. The light release sheet on the resin sheet was peeled off, and the exposed tantalum layer and the c layer were bonded together to obtain a resin sheet laminate for flat sheet bonding of Example 2 composed of two resin layers. (Example 2) The flat sheet bonding of Example 2 was obtained in the same manner as in Example except that the resin solution was formed into a layer of 100# η thick and a layer C having a thickness of 50/im was formed from the tree sap solution 3 (10). (Example 3), the resin solution 4 was applied to a heavy release sheet (manufactured by Lintec Co., Ltd., product name "sp_pET38n"), and heated at 2 (rc) for 2 minutes. An A layer having a thickness of 50 m is formed on the sheet. 22/29 201200572 Manufacture - Step 'Laminating the peeling surface of the light peeling sheet (Lintec Co., Ltd., product name "Sp_PET38〇r)) on the A layer A non-base material adhesive resin sheet sandwiched between two release sheets. Applying a resin dissolving solution on a light release sheet (manufactured by Lintec Co., Ltd., SP-PETT38〇r), and adding it to the crucible for 2 minutes, thereby forming a thickness of 5 〇 on the light release sheet. Next, the light release sheet on the substrate-free adhesive sheet is bonded, and the exposed tantalum layer is bonded to the tantalum layer to obtain a flat sheet bonding resin composed of two resin layers. Laminated body. On the other hand, the resin dissolving solution 2 was applied to a light release sheet (manufactured by Linlec Co., Ltd., product name "SP-PET38〇r", and heated for 2 minutes" to form a thickness of 5 〇 on the light release sheet. (c) layer c. Then, the light-peeling sheet on the layer of the flat-plate bonding layer made of the resin layer is peeled off, and the exposed layer B and layer c are attached, thereby obtaining three layers. Plane 2 and diester layered body of Example 3 composed of a resin layer. (Example 4) Except that a thick ruthenium layer was formed from the resin solution 1 and a thick c layer was formed from the resin solution 5, In the same manner, the resin laminate for flat sheet bonding of Example 4 was obtained. (Comparative Example 1) A layer of thickness m was formed from a resin solution liquid, and B having a thickness of 5 G/Zm was formed from the resin solution 2 In the same manner as in Example 3, the resin laminate for flat panel bonding of Comparative Example 1 was obtained in the same manner as in Example 3 (Comparative Example 2) 23/29. 201200572 In addition to the formation of a λ layer of 50 // m thick from the tree tire solution 2, and formed thick by the resin solution I In the same manner as in the case of the product, the flat layer of the resin sheet for the flat-plate bonding of Comparative Example 2 was obtained (Comparative Example 3), except that the mountain resin Lotion solution 2 was formed into a layer of 50 μm thick. A ruthenium layer having a thickness of 50 V m was formed from the resin solution 2, and C 楷 having a thickness of 5 () μ m was formed from the resin solution 2, and the flat plate of Comparative Example 3 was obtained in the same manner as in the third embodiment. The resin-containing resin layer is used in comparison with the resin of the example 3, and the resin layer is formed on the bamboo. The resin layer is composed of the same resin 2 (Comparative Example 4). 4, a layer 50 having a thickness of 50, a B layer having a thickness of 50/m from the resin solution 4, and a thickness formed by the resin solution 4; "2 #m is not a l sore" in the same manner as in Comparative Example 3. A flat φ(four) hussen-heavy layered body of Comparative Example 4 was obtained. In Comparative Example 4, the panel was attached to the same layer of three layers of the same resin 4; m M m ° was subjected to the following test method for each implementation __ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The parts have the upper = constant pressure thickness; the measurement was carried out. In addition, the eight?|Lu.. table 〇 ° 〇 〇 PG 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 单体 单体 单体 单体) Storage modulus 24/29 201200572 After removing the peeling piece on the adhesive layer of the base material without the base material obtained in each of the % and the comparative examples, the tenth day to the several pieces of the film form a piece of 2.0 ηιη thick ^品. The formed sample is cut into a diameter of 2.0 on the height of the p, the main shape 'Using the viscoelasticity setting device (10) e〇_, icScie [manufactured by the company: trade name ''RDAir), by torsional shearing The law has resisted the under-memory modulus at the frequency of his measurement. (3) The difference between the appropriateness (the presence or absence of foaming) is made using a UV-curable ink (manufactured by Imperial Ink Co., Ltd., the product name is "P 91 丨 ink") on a polypropylene resin plate (Mitsubishi Ray〇n Co., Ltd.) The surface of the product name "ACRYLITE L〇ii" 1 'length 70mmx width 40mmx thickness l.5nim) is framed (outline, ^ 70mm x l 40丨nm, frame 卬 5 claws) printing 'making the coating thickness Η 0 V m and 20 β m, and UV hardening is used to make the acrylic plate with height difference by printing. : The base material adhesive resin sheet of 彳 彳 (4) is cut into a shape of 70 mm x width 4 〇 1 Tlm. After the light release sheet was removed, the exposed resin layer was formed on the printing surface of the upper plate using a laminating machine (FUIIPLA Co., Ltd., product name: "LPD3214"), and the above resin layer was baked. Cover the entire frame of the stamp 1 @. After laminating, peel off a peeling piece, and use the above-mentioned laminator to laminate the glass plate (NSG Precision 4<c〇rning glass E&gje χ〇„, thick and long 7〇_width 7Qmm) On the resin level, a sample for the evaluation of the appropriateness was prepared. Then, the treatment of the south pressure gold (5〇t:, 〇.5MPa, 2〇 points and the presence or absence of the bubble is recognized. (4), the following criteria are judged by the presence or absence of the following three grades of bubbles. No bubbles at all 25/29 201200572 A : There are cockroaches, 2 muds in the air bubble X: 冇 3 4 or more mixed with air bubbles and another 'in 23t:, 50% l<h environment for 7 days, the inner sample retreat _ (4) Pressing workability The base material obtained in the examples and the comparative examples was obtained by a press working apparatus (manufactured by Linlec Co., Ltd., and made n pieces of U1J named "Ι'ΡΜ 3()0"). : Material: 丨 丨 丨 树脂 丨 丨 丨 丨 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The case where the shape was deformed or the bleed out of the resin layer occurred was judged as x, and the case where the shape of the blister was deformed and the bleed of the resin layer was judged as 〇. The test results in the respective articles and comparative examples are summarized in the table. 4JJ.
η in! 在2 3_'(:下的诎冇权奶 名沒述说合適虎社（；纪的々無.） (Ml'it) 印刷A度足 10 μ πι 卬刷^度羌 20 μ ») 加工·Η Λ柏 li層 (，功 Λ層 li層 C:培 叱妞過 A/C A/C 夾埋 Ϊ u後 A/C (錢 A/C Jk 後 贫施例1 feiiKil (100) — 私1骀2 ㈣ 0.079 — 0.170 〇 〇 〇 〇 〇 實旎例2 榭《il (100) ~ 相船3 (50) 0.079 — 0.187 〇 〇 〇 〇 〇 實旄例3 樹胎4 (50) 樹脂1 (50) 榭脂2 (50) 0.034 0.079 0.170 〇 〇 〇 〇 〇 實旌例4 樹乩1 (100) — 樹腊5 (50) 0.079 — 0.107 0 〇 〇 〇 〇 比較例1 樹脂l (50) 樹脂2 (50) 樹脂1 (50) 0.079 0.170 0.079 〇 X X X 0 比較例2 榭脂2 (50) 樹脂丨 (100) 0.170 - 0.079 Δ X X X 0 比較例3 .抝脂2 (150) - - 0.170 - - △ X X X 〇 比較例4 樹脂·） (150) - - 0.034 * - 〇 〇 〇 △ X XA/C:高壓釜處理 如表1所示，實施例中得到的本發明的平面板貼合用 26/29 201200572 層體’對於具有·ηΐ及·ηι印刷高度差的Μ 夂二不出良好的高度差貼合適應性。另-方面，對於在 =，的财不符合傾制叙比較例丨、及α = :::在0 ·丨MP a以上之比較例2中得到的平面板貼合用樹 曰j體而言’其高度差貼合適應性不良。此外，對於僅 士一f構成之比較例3及比較例4中得到的平面板貼合 树脂置層體而言’其高度差貼合適應性或沖壓加工性不良 【圖式簡單說明】 圖丨是剖面示意圖，顯示了本發明第一態樣的平面板 貼合用樹脂積層體的第一實施型態。 圖2是剖面示意圖，顯示了本發明第二態樣的積層平 面板的第一實施型態。 、曰 圖3是剖面示意圖，顯示了本發明第一態樣的平面板 貼合用樹脂積層體的第二實施型態。 圖4是剖面示意圖’顯示了本發明第二態樣的積層平 面板的第二實施型態。 【主要元件符號說明】 1、9 平面板貼合用樹脂積層體 2 樹脂層A 3 樹脂層C 8 樹脂層B 4 > 6 平面板 4a ' 6a 貼合面 5 裝飾印刷層 7、10 積層平面板 27/29η in! In 2 3_' (: The name of the right milk does not say that the appropriate tiger company (; Ji 々 no.) (Ml'it) Printing A degree foot 10 μ πι 卬 brush ^ degree 羌 20 μ ») Processing · Η Λ li li layer (, Gong Λ layer li layer C: Pei 叱 过 over A / CA / C 夹 Ϊ u after A / C (money A / C Jk after the poor example 1 feiiKil (100) - private 1骀2 (4) 0.079 — 0.170 〇〇〇〇〇 旎 Example 2 榭 il (100) ~ Phase Ship 3 (50) 0.079 — 0.187 〇〇〇〇〇 Example 3 Tree Tire 4 (50) Resin 1 ( 50) Rouge 2 (50) 0.034 0.079 0.170 〇〇〇〇〇 旌 Example 4 Tree 乩 1 (100) — Tree wax 5 (50) 0.079 — 0.107 0 〇〇〇〇Comparative Example 1 Resin l (50) Resin 2 (50) Resin 1 (50) 0.079 0.170 0.079 〇XXX 0 Comparative Example 2 Rouge 2 (50) Resin 丨 (100) 0.170 - 0.079 Δ XXX 0 Comparative Example 3 . Rouge 2 (150) - - 0.170 - - △ XXX 〇 Comparative Example 4 Resin·) (150) - - 0.034 * - 〇〇〇 Δ X XA/C: autoclave treatment As shown in Table 1, the flat sheet bonding of the present invention obtained in the examples was 26/ 29 201200572 Layer body 'for print height difference with ·ηΐ and ·ηι Μ 夂 二 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不In the case of the flat panel bonding, the height difference is not suitable for the flat panel bonding. In addition, the flat panel bonding resin obtained in Comparative Example 3 and Comparative Example 4 which consists of only one f is used. In the case of the body, the height difference is suitable for the fit or the press workability is poor. [Simplified illustration of the drawings] Fig. 丨 is a schematic cross-sectional view showing the first embodiment of the resin laminate for flat sheet bonding according to the first aspect of the present invention. Fig. 2 is a schematic cross-sectional view showing a first embodiment of a laminated flat panel according to a second aspect of the present invention. Fig. 3 is a schematic cross-sectional view showing a resin for flat panel bonding according to a first aspect of the present invention. Fig. 4 is a cross-sectional view showing a second embodiment of a laminated flat plate according to a second aspect of the present invention. [Description of main components] 1. 9 resin lamination for flat panel bonding Body 2 resin layer A 3 resin layer C 8 resin layer B 4 > 6 Panel 4a '6a bonding surface of the decorative print layer 5 stacked planar plates 27/29 7,10