CN109306247A - A kind of no base material adhesive tape heating fitting removes glue bubble production technology - Google Patents
A kind of no base material adhesive tape heating fitting removes glue bubble production technology Download PDFInfo
- Publication number
- CN109306247A CN109306247A CN201811044777.2A CN201811044777A CN109306247A CN 109306247 A CN109306247 A CN 109306247A CN 201811044777 A CN201811044777 A CN 201811044777A CN 109306247 A CN109306247 A CN 109306247A
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- base material
- material strip
- release film
- material adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
Abstract
The present invention relates to a kind of no base material adhesive tape heating fittings to remove glue bubble production technology, the following steps are included: firstly, by pre-processed 0.03 without base material adhesive tape material strip, 0.05 without base material adhesive tape material strip, release film 2., release film 1. arrange after simultaneously enter bonder in be bonded；Secondly, the material strip after fitting is compacted by least one compaction apparatus；Again, release film is removed 1. from the material strip after compacting, and remove two genuine release papers without base material adhesive tape material strip simultaneously；Finally, being 3. fitted in respectively two parts of pre-processed release films after the upper and lower of the material strip come out in step 3, while being bonded into heating bonding device.Production technology of the invention reduces the bubble between colloid and release film using heating rubber roller high temperature preheating, and provides the high temperature pressure of continuous-stable, realizes the completeness contacted between no base material adhesive tape and release film, solves colloid air bubble problem.
Description
Technical field
The present invention relates to a kind of no base material adhesive tape heating fittings to remove glue bubble production technology.
Background technique
It is at present that will be transferred to without base material adhesive tape after two common roller bearings press without substrate double-sided adhesive fitting release film technique
On release film, the bubble of colloid and release film surface that such technique generates, bad rate is higher, and production capacity is lower.
Summary of the invention
The invention aims to overcome the deficiencies of the prior art and provide it is a kind of using heating rubber-surfaced roll axis preheating after press
It is posted no base material adhesive tape manufacturing technology, colloid bubble fold etc. in no base material adhesive tape process can be solved and be bonded scheme not
Foot.
In order to achieve the above objectives, the technical solution adopted by the present invention is that: a kind of no base material adhesive tape heating fitting removes glue bubble
Production technology, including following operating procedure:
Step 1: by be posted 0.03 without base material adhesive tape material strip, 0.05 without base material adhesive tape material strip, release film 2., release film 1.
It is sequentially arranged on feeding roller；
Step 2: by pre-processed 0.03 without base material adhesive tape material strip, 0.05 without base material adhesive tape material strip, release film 2., it is release
Film enters in bonder simultaneously after 1. arranging to be bonded；Wherein 0.03 without base material adhesive tape material strip and 0.05 without base material adhesive tape material
Band is covered with the one of adhesive tape down, while being fitted in the top of release film 2., 2. the release film is fitted in release film 1. upper
Side；While fitting, the described 0.03 waste material discharge without base material adhesive tape material strip and 0.05 without base material adhesive tape material strip；
Step 3: the material strip after fitting is compacted by least one compaction apparatus；
Step 3: from the material strip after compacting remove release film 1., and simultaneously remove two genuine without base material adhesive tape material strip from
Type paper；
Step 4: 3. two parts of pre-processed release films to be fitted in the upper and lower of the material strip come out from step 3 respectively
Afterwards, while into heating bonding device it is bonded；
Heating bonding device in above-mentioned steps four includes drive shaft and heating roll shaft；It is described heating roll shaft work when temperature be
60 ° of constant temperature.
Preferably, to be posted 0.03 first without base material adhesive tape material strip without base material adhesive tape material strip, 0.05 in the step 1
After 350 degree of high temperature preheatings, conform to release film 2. on.
Preferably, the heating roll shaft carries out rotation before bonding process and preheats 60 degree 10 minutes.
Due to the application of the above technical scheme, compared with the prior art, the invention has the following advantages:
A kind of no base material adhesive tape heating fitting of technical solution of the present invention removes glue bubble production technology, utilizes heating rubber roller and pressing
High temperature preheating reduces the bubble between colloid and release film between roller bearing, and provides the high temperature pressure of continuous-stable, realizes nothing
The completeness contacted between base material adhesive tape and release film, and then colloid caused by avoiding because of bubble is contacted with release film and is not exclusively led
The crepe rubber of cause, colloid destroy, and can not remove etc. abnormal, realize without substrate fitting not fold, give up the continuous quick existence of the glue；This
Invention improves production capacity and yield, while solving no base material adhesive tape patch by solving colloid air bubble problem after process optimization
Condensation material matches unstable problem.
Detailed description of the invention
Technical scheme of the present invention is further explained with reference to the accompanying drawing:
Attached drawing 1 is that technique of the invention produces schematic diagram；
Wherein: 1,0.03 without base material adhesive tape material strip；2,0.05 without base material adhesive tape material strip；3, release film is 2.；4, release film is 1.；5, it glues
It attaches together and sets；6, compaction apparatus；7, genuine release paper；8, release film is 3.；9, heating bonding device；91, drive shaft；92, heating roller
Axis.
Specific embodiment
Below in conjunction with the accompanying drawings and specific embodiment, the present invention is described in further details.
As shown in Figure 1, a kind of no base material adhesive tape heating fitting of the present invention removes glue bubble production technology, including as follows
Operating procedure:
Step 1: it is pre- that be posted 0.03 without base material adhesive tape material strip 1,0.05 first passes through 350 degree of high temperature without base material adhesive tape material strip 2
Heat, then by be posted 0.03 without base material adhesive tape material strip 1,0.05 without base material adhesive tape material strip 2, release film 2. 3, release film 1.
4 are sequentially arranged on feeding roller；
Step 2: by pre-processed 0.03 without base material adhesive tape material strip 1,0.05 without base material adhesive tape material strip 2, release film 2. 3, from
Type film 1. 4 arrangement after simultaneously enter bonder 5 in be bonded；Wherein 0.03 without base material adhesive tape material strip 1 and 0.05 without substrate
Adhesive tape material strip 2 be covered with adhesive tape one down, while be fitted in release film 2. 3 top, the release film 2. 3 be fitted in it is release
Film 1. 4 top；While fitting, described 0.03 is arranged without base material adhesive tape material strip 1 and 0.05 without the waste material of base material adhesive tape material strip 2
Out；
Step 3: the material strip after fitting is compacted by least one compaction apparatus 6；
Step 3: remove release film 1. 4 from the material strip after compacting, and remove simultaneously two genuine without base material adhesive tape material strip from
Type paper 7；
Step 4: by two parts of pre-processed release films 3. 8 be fitted in respectively from step 3 come out material strip upper and lower
Afterwards, while into heating bonding device 9 it is bonded；
Heating bonding device 9 in above-mentioned steps four includes drive shaft 91 and heating roll shaft 92；When the heating roll shaft 92 works
Temperature be 60 ° of constant temperature.
To above scheme further instruction, the heating roll shaft 92 carries out 60 degree 10 points of rotation preheating before bonding process
Clock.
A kind of no base material adhesive tape heating fitting of technical solution of the present invention removes glue bubble production technology, using heating rubber roller with
The bubble between roller bearing between high temperature preheating reduction colloid and release film is pressed, and the high temperature pressure of continuous-stable is provided, is realized
Without the completeness contacted between base material adhesive tape and release film, so colloid caused by avoiding because of bubble contact with release film it is endless
Crepe rubber caused by complete, colloid destroy, and can not remove etc. abnormal, realize without substrate fitting not fold, give up the continuous fast fast-growing of the glue
It deposits；The present invention solves colloid air bubble problem after passing through process optimization, improves production capacity and yield, while solving no substrate glue
Unstable problem is matched with laminated material.
The above is only specific application examples of the invention, are not limited in any way to protection scope of the present invention.All uses
Equivalent transformation or equivalent replacement and the technical solution formed, all fall within rights protection scope of the present invention.
Claims (3)
1. a kind of no base material adhesive tape heating fitting removes glue bubble production technology, it is characterised in that: including following operating procedure:
Step 1: by be posted 0.03 without base material adhesive tape material strip (1), 0.05 without base material adhesive tape material strip (2), release film 2. (3),
1. (4) release film is sequentially arranged on feeding roller；
Step 2: by pre-processed 0.03 without base material adhesive tape material strip (1), 0.05 without base material adhesive tape material strip (2), release film 2.
(3), release film 1. (4) arrangement after simultaneously enter bonder (5) in be bonded；Wherein 0.03 without base material adhesive tape material strip (1)
Be covered with the one of adhesive tape down without base material adhesive tape material strip (2) with 0.05, while being fitted in the top of release film 2. (3), it is described from
2. (3) type film is fitted in the top of release film 1. (4)；While fitting, described 0.03 without base material adhesive tape material strip (1) and 0.05 nothing
The waste material of base material adhesive tape material strip (2) is discharged；
Step 3: the material strip after fitting is compacted by least one compaction apparatus (6)；
Step 3: removing release film 1. (4) from the material strip after compacting, and two genuine without base material adhesive tape material strip are removed simultaneously
Release paper (7)；
Step 4: 3. (8) two parts of pre-processed release films are fitted in the upper and lower of the material strip come out from step 3 respectively
Fang Hou, while being bonded into heating bonding device (9)；
Heating bonding device (9) in above-mentioned steps four includes drive shaft (91) and heating roll shaft (92)；The heating roll shaft
(92) temperature when working is 60 ° of constant temperature.
2. a kind of no base material adhesive tape heating fitting according to claim 1 removes glue bubble production technology, it is characterised in that: institute
State in step 1 to be posted 0.03 first passed through without base material adhesive tape material strip (1), 0.05 without base material adhesive tape material strip (2) it is 350 degree high
After temperature preheating, release film is being conformed to 2. on (3).
3. a kind of no base material adhesive tape heating fitting according to claim 1 removes glue bubble production technology, it is characterised in that: institute
State heating roll shaft (92) carried out before bonding process rotation preheating 60 degree 10 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811044777.2A CN109306247A (en) | 2018-09-07 | 2018-09-07 | A kind of no base material adhesive tape heating fitting removes glue bubble production technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811044777.2A CN109306247A (en) | 2018-09-07 | 2018-09-07 | A kind of no base material adhesive tape heating fitting removes glue bubble production technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109306247A true CN109306247A (en) | 2019-02-05 |
Family
ID=65224744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811044777.2A Pending CN109306247A (en) | 2018-09-07 | 2018-09-07 | A kind of no base material adhesive tape heating fitting removes glue bubble production technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109306247A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111909632A (en) * | 2020-06-29 | 2020-11-10 | 苏州滕艺科技有限公司 | Manufacturing method of anti-bubble base-material-free adhesive sticker |
| CN111923389A (en) * | 2020-06-29 | 2020-11-13 | 苏州滕艺科技有限公司 | Manufacturing method of bubble-proof notebook computer adhesive tape |
| CN114574113A (en) * | 2022-03-17 | 2022-06-03 | 苏州达翔新材料有限公司 | Substrate-free adhesive tape transferring equipment and adhesive tape transferring method thereof |
| CN117341217A (en) * | 2023-12-05 | 2024-01-05 | 淄博鲁嘉环保科技有限公司 | Polystyrene insulation material processing equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102199403A (en) * | 2010-03-23 | 2011-09-28 | 琳得科株式会社 | Resin lamination body for attaching of flat panel and lamination flat panel |
| CN103360965A (en) * | 2012-03-30 | 2013-10-23 | 琳得科株式会社 | Substrate-free two-sided adhesive tape and manufacturing method thereof, and adhesive tape reel and manufacturing method thereof |
-
2018
- 2018-09-07 CN CN201811044777.2A patent/CN109306247A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102199403A (en) * | 2010-03-23 | 2011-09-28 | 琳得科株式会社 | Resin lamination body for attaching of flat panel and lamination flat panel |
| CN103360965A (en) * | 2012-03-30 | 2013-10-23 | 琳得科株式会社 | Substrate-free two-sided adhesive tape and manufacturing method thereof, and adhesive tape reel and manufacturing method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111909632A (en) * | 2020-06-29 | 2020-11-10 | 苏州滕艺科技有限公司 | Manufacturing method of anti-bubble base-material-free adhesive sticker |
| CN111923389A (en) * | 2020-06-29 | 2020-11-13 | 苏州滕艺科技有限公司 | Manufacturing method of bubble-proof notebook computer adhesive tape |
| CN114574113A (en) * | 2022-03-17 | 2022-06-03 | 苏州达翔新材料有限公司 | Substrate-free adhesive tape transferring equipment and adhesive tape transferring method thereof |
| CN117341217A (en) * | 2023-12-05 | 2024-01-05 | 淄博鲁嘉环保科技有限公司 | Polystyrene insulation material processing equipment |
| CN117341217B (en) * | 2023-12-05 | 2024-09-03 | 淄博鲁嘉环保科技有限公司 | Polystyrene insulation material processing equipment |
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| PB01 | Publication | ||
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Application publication date: 20190205 |