CN101945540B - Flexibility circuit board FPC finger folding bonding method and special tool - Google Patents
Flexibility circuit board FPC finger folding bonding method and special tool Download PDFInfo
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- CN101945540B CN101945540B CN2009101121619A CN200910112161A CN101945540B CN 101945540 B CN101945540 B CN 101945540B CN 2009101121619 A CN2009101121619 A CN 2009101121619A CN 200910112161 A CN200910112161 A CN 200910112161A CN 101945540 B CN101945540 B CN 101945540B
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Abstract
The invention relates to a flexibility circuit board FPC finger folding bonding method and a special tool. In the invention, special tools for pre-folding, pre-pressing and rolling are adopted, a FPC to be folded is located on the special tool for pre-folding; a pressing plate is sleeved; the FPC to be folded is folded along the folding line; then the FPC is taken down and is located on the pre-pressing tool; the upper pressing plate of the pre-pressing tool is pressed; the FPC is folded and deepened along the folding line; the FPC is taken down from the special tool for pre-pressing; and a release paper of a pressure-sensitive adhesive is uncovered and then passes through a rolling wheel for rolling. Because the special tools for pre-folding, pre-pressing, and rolling are adopted, finger folding bonding is realized before the production formation and the whole flexibility circuit board is processed by the tools, so that the production efficiency is improved, the production operation method is stable and the quality of the product after being folded and bonded is ensured.
Description
Technical field
The present invention relates to folded, glued method and the used tool of a kind of flexible electric circuit board FPC, particularly a kind of flexible electric circuit board FPC finger folded, glued method and specific purpose tool.
Background technology
In flexible electric circuit board (the English FPC that the is called for short) industry, a lot of FPC need be after finger position pastes pressure sensitive adhesive, and it is bonding to point folding 180 degree backs again.Prior art is pure manual folded, glued; Monolithic FPC carries out the manual folded, glued of manual folded, glued or whole piece FPC, and to occur between two-layer after folding dislocation easily irregular; Defective productss such as off normal, few glue, glue be overlapping occur, production efficiency is low simultaneously, can't realize a large amount of productions.
Summary of the invention
The present invention provides kind of a flexible electric circuit board FPC finger folded, glued method and a specific purpose tool; Use pre-folds, precompressed, roll extrusion special tooling; Make the finger folded, glued be implemented in before the product shaping whole and carry out, improved production efficiency, guaranteed product quality behind the folding sticking platform with instrument.
For achieving the above object, the present invention provides a kind of flexible electric circuit board FPC finger folded, glued method, and concrete steps are following:
(1) will treat that folding FPC is positioned on the instrument of pre-folding by location hole, the cover top board.Be specially through the location hole on FPC and the pressing plate and with alignment pin on the base station FPC accurately located and fix FPC, base station and platen edge accurately overlap with the fold line on the FPC.Eliminated in the manual folding process and caused locating inaccurate few glue, the overlapping problem of glue of producing because of the FPC softness.
(2) press and pre-fold tool switch, briquetting is vertically descending, will wait that rolling over FPC folds along fold line.Briquetting is vertically descending, makes FPC along fold line while pressurized, has eliminated the off normal that manual folding FPC unbalance stress causes.
(3) take off FPC from the instrument of pre-folding, be positioned on the prepressing means.
(4) depress the prepressing means top board.FPC is further deepened folding along fold line, the angle that is folded is less than 90 degree, has deepened the effect that pre-folds, is convenient to roll extrusion.
(5) take off FPC from prepressing means, take the release liners of pressure sensitive adhesive off.
(6) with the folding limiting plate that is close to of FPC, cross roller and carry out roll extrusion.Spacing through limiting plate, indeformable behind the FPC.The FPC translational speed can reach 15 meters/minute, has improved production efficiency.
For achieving the above object, the present invention provides the specific purpose tool of flexible electric circuit board FPC finger folded, glued method, comprises the instrument of pre-folding, prepressing means, rolling tools.
The described instrument that pre-folds is made up of base station, pressing plate, briquetting, and pressing plate is positioned on the base station, and briquetting is positioned at pressing plate the place ahead and vertical with pressing plate.
Described prepressing means is made up of top board, lower platen, connecting axle, and top board, lower platen link to each other through connecting axle.
Described rolling tools are made up of table top, limiting plate, upper roller, bottom roller, and limiting plate vertically places on the table top, and upper roller is positioned on the table top, and bottom roller is positioned under the table top, and symmetrical with upper roller.Upper roller, bottom roller link to each other with external motor, and driven by motor upper roller, bottom roller rotation realize the roll extrusion to FPC.
Since adopted pre-fold, precompressed, roll extrusion specific purpose tool, make the finger folded, glued be implemented in before the product shaping whole and carry out with instrument, both improved production efficiency, also make the production operation method stable, guaranteed product quality after the folded, glued.
Description of drawings
Fig. 1 places the structural representation on the instrument of pre-folding for FPC of the present invention;
Fig. 2 places the structural representation on the prepressing means for FPC of the present invention;
Fig. 3 places the structural representation on the rolling tools for FPC of the present invention.
Embodiment
Combine Fig. 1, Fig. 2, Fig. 3 that the present invention is further described down.
The present invention provides a kind of flexible electric circuit board FPC finger folded, glued method, and concrete steps are following:
(1) will treat that folding FPC1 is positioned on the instrument of pre-folding by location hole, cover top board 2.Be specially through the location hole on FPC1 and the pressing plate 2 and with alignment pin on the base station 3 FPC1 accurately located and fix, base station 3 accurately overlaps with the fold line on the FPC1 with pressing plate 2 edges.
(2) press and pre-fold tool switch, briquetting 4 is vertically descending, will wait that rolling over FPC1 folds along fold line.
(3) take off FPC1 from the instrument of pre-folding, be positioned on the prepressing means.
(4) depress prepressing means top board 5, FPC1 is further deepened folding along fold line, and the angle that is folded is less than 90 degree.
(5) take off FPC1 from prepressing means, take the release liners of pressure sensitive adhesive off.
(6) with the folding limiting plate 6 that is close to of FPC1, cross roller 7,8 and carry out roll extrusion, the FPC translational speed can reach 15 meters/minute.
The described instrument that pre-folds is made up of base station 3, pressing plate 2, briquetting 4, and pressing plate 2 is positioned on the base station 3, and briquetting 4 is positioned at pressing plate 2 the place aheads and vertical with pressing plate 2.
Described prepressing means is made up of top board 5, lower platen 9, connecting axle 10, and top board 5, lower platen 9 link to each other through connecting axle 10.
Described rolling tools are made up of table top 11, limiting plate 6, upper roller 7, bottom roller 8, and limiting plate 6 vertically places on the table top 1, and upper roller 7 is positioned on the table top 11, and bottom roller 8 is positioned at table top 11 times, and with upper roller 7 symmetries.Upper roller 7, bottom roller 8 link to each other with external motor, and driven by motor upper roller 7, bottom roller 8 rotations realize the roll extrusion to FPC1.
Since adopted pre-fold, precompressed, roll extrusion specific purpose tool, make the finger folded, glued be implemented in before the product shaping whole and carry out with instrument, both improved production efficiency, also make the production operation method stable, guaranteed product quality after the folded, glued.
Claims (2)
1. flexible electric circuit board finger folded, glued method is characterized in that comprising the steps:
(1) will treat that the folding flexible circuit board is positioned on the instrument of pre-folding, the cover top board;
(2) press and pre-fold tool switch, briquetting is vertically descending, will wait that rolling over flexible electric circuit board folds along fold line;
(3) take off flexible electric circuit board from the instrument of pre-folding, be positioned on the prepressing means;
(4) depress the prepressing means top board, flexible electric circuit board is further deepened folding along fold line, and the angle that is folded is less than 90 degree;
(5) take off flexible electric circuit board from prepressing means, take the release liners of pressure sensitive adhesive off;
(6) with the folding limiting plate that is close to of flexible electric circuit board, cross roller and carry out roll extrusion.
2. the specific purpose tool in the flexible electric circuit board finger folded, glued method as claimed in claim 1; It is characterized in that: specific purpose tool comprises the instrument of pre-folding, prepressing means, rolling tools; The described instrument that pre-folds is made up of base station, pressing plate, briquetting; Pressing plate is positioned on the base station, and briquetting is positioned at pressing plate the place ahead and vertical with pressing plate; Described prepressing means is made up of top board, lower platen, connecting axle, and top board, lower platen link to each other through connecting axle; Described rolling tools are made up of table top, limiting plate, upper roller, bottom roller, and limiting plate vertically places on the table top, and upper roller is positioned on the table top, and bottom roller is positioned under the table top, and symmetrical with upper roller.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2009101121619A CN101945540B (en) | 2009-07-09 | 2009-07-09 | Flexibility circuit board FPC finger folding bonding method and special tool |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2009101121619A CN101945540B (en) | 2009-07-09 | 2009-07-09 | Flexibility circuit board FPC finger folding bonding method and special tool |
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CN101945540A CN101945540A (en) | 2011-01-12 |
CN101945540B true CN101945540B (en) | 2012-04-25 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105388645A (en) * | 2015-12-29 | 2016-03-09 | 王昌华 | FPC (Flexible Printed Circuit) automatic bending machine for LCD (Liquid Crystal Display) and automatic being process of FPC automatic bending machine |
CN108260280B (en) * | 2017-12-04 | 2020-12-01 | 深圳市新宇腾跃电子有限公司 | FPC bending forming process |
CN111930071B (en) * | 2020-08-04 | 2021-10-26 | 歌尔光学科技有限公司 | Control method based on electronic cam, terminal device and storage medium |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002319750A (en) * | 2001-04-23 | 2002-10-31 | Toshiba Chem Corp | Printed-wiring board, semiconductor device, and their manufacturing methods |
CN1703768A (en) * | 2002-09-30 | 2005-11-30 | 英特尔公司 | Forming folded-stack packaged device using progressive folding tool |
CN1266715C (en) * | 2001-10-23 | 2006-07-26 | 沙夫纳Emv股份公司 | Multilayer circuit and method of manufacturing |
JP2008235594A (en) * | 2007-03-20 | 2008-10-02 | Sumitomo Electric Printed Circuit Inc | Bonded body of wiring boards and method of manufacturing the same |
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2009
- 2009-07-09 CN CN2009101121619A patent/CN101945540B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002319750A (en) * | 2001-04-23 | 2002-10-31 | Toshiba Chem Corp | Printed-wiring board, semiconductor device, and their manufacturing methods |
CN1266715C (en) * | 2001-10-23 | 2006-07-26 | 沙夫纳Emv股份公司 | Multilayer circuit and method of manufacturing |
CN1703768A (en) * | 2002-09-30 | 2005-11-30 | 英特尔公司 | Forming folded-stack packaged device using progressive folding tool |
JP2008235594A (en) * | 2007-03-20 | 2008-10-02 | Sumitomo Electric Printed Circuit Inc | Bonded body of wiring boards and method of manufacturing the same |
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CN101945540A (en) | 2011-01-12 |
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