TW201142876A - Light-reflective conductive particle, anisotropic conductive adhesive, and light-emitting device - Google Patents
Light-reflective conductive particle, anisotropic conductive adhesive, and light-emitting device Download PDFInfo
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- TW201142876A TW201142876A TW099126886A TW99126886A TW201142876A TW 201142876 A TW201142876 A TW 201142876A TW 099126886 A TW099126886 A TW 099126886A TW 99126886 A TW99126886 A TW 99126886A TW 201142876 A TW201142876 A TW 201142876A
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- Prior art keywords
- light
- particles
- reflective
- anisotropic conductive
- particle
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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- Led Device Packages (AREA)
Description
201142876 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種帛以將發光(元件異向性導電連接於 配線板之異向性導電接著劑用的光反射性導電粒子、含有 其之異向性導電接著劑、及使用該接著劑將發光元件構裝 於配線板而成之發光裝置。 【先前技術】 使用發光二極體(led,Light Emitting Diode)元件之發 光裝置得到廣泛使用,舊式之發光裝置之結構係如圖4所 示,用黏晶接著劑32將LED元件33接合於基板31上,並 用金線37將其上面之p電極34及n電極35與基板31之 連接端子36打線接合,將LED元件33整體用透明模樹脂 38密封而成。然而,於圖4之發光裝置之情形時,存在以 下問題:於LED元件33發出之光中,金線會吸收朝上面側 出射之400〜500 nm之波長之光,又,朝下面側出射之光 之一部分會被黏晶接著劑32吸收’而使LED元件33之發 光效率降低。 因此,如圖5所示,提出將LED元件33覆晶構裝(專 利文獻1)。於該覆晶構裝技術中,於p電極34與n電極35 上分別形成有凸塊39,進而,於LED元件33之凸塊形成 面上,以使P電極3 4與π電極3 5絕緣之方式設置光反射 層40。並且,使用異向性導電膏41或異向性導電膜(未圖 示)並使該等硬化來連接固定LED元件33與基板3卜因此, 201142876 於圖5之發光I置中,朝LED元件33之上方出射之光 被金線吸收,且朝下方出射之光之大部分由光反射層4〇反 射而朝上方出射,因此發光效率(光取出效率)不會降低。 專利文獻1 :日本特開平u_ 168235號公報 【發明内容】 然而’於專利文獻1之技術中必須藉由金屬蒸鍵法於 led 7G件33上以使p電極34與n電極35絕緣之方式設置 光反射層4G,於製造上,存在無法避免成本增加之問題。 另一方面,於不設置光反射層4〇之情形時亦存在以 下問題:已硬化之異向性導電膏或異向性導電臈中之以 金、錄或銅包覆之冑電粒子之表面呈茶色乃至暗茶色,又, 分散有導電粒子之環氧樹脂黏合劑本身亦因其硬化所常用 之咪唑系潛伏性硬化劑而呈茶色,從而難以提高發光元件 發出之光的發光效率(光取出效率),且無法使光之 光色)以其原本之顏色進行反射。 本發明之目的係解決以上先前技術之問題,並提供·· 於使用異向性導電接著劑將發光二極體(LED)元件等發光 疋件覆晶構裝於配線板來製造發光裝置時,即便不於LED 元件上設置如會導致製造成本增加之光反射層,亦不會使 發光效率降低,且+會於發光元件之發&色與反射光色之 間產生色相差之光反射性導電粒子、含有其之異向性導電 接著劑、及使用該接著劑將發光元件覆晶構裝於配線板而 成之發光裝置。 201142876 本發明者於若使異向性導電接著劑本身具有光反射功 能’則可使發光效率不降低之假設下,發現藉由在調配於 異向性導電接著劑中之導電粒子之表面,設置由特定無機 粒子所構成之白色〜灰色之光反射層,則可使發光元件之 發光效率不降低且於發光元件之發光色與導電粒子之反射 光色之間不產生色相差,從而完成了本發明。 即’本發明提供一種光反射性導電粒子,其係用於用 以將發光元件異向性導電連接於配線板之異向性導電接著 劑用’且係由被金屬材料包覆之核心粒子與於核心粒子表 面由折射率為1.52以上之光反射性無機粒子形成之光反射 層所構成。 又,本發明提供一種異向性導電接著劑,其係用以將 發光7L件異向性導電連接於配線板者,且係於熱硬化性樹 脂組成物分散有上述光反射性導電粒子而成者,該熱硬化 性樹脂組成物能提供對於波長38〇〜78〇 nm之可見光的光 程長度1 cm之透光率(JIS K71〇5)為8〇%以上之硬化物。 又,本發明提供一種發光裝置,其係經由上述異向性 導電接著劑,將發光元件以覆晶方式構裝於配線板而成。 用以將發光元件異向性導電連接於配線板之異向性導 電接著劑用之本發明之光反射性導電粒子,係由被金屬材 料弘覆之核心粒子與於核心粒子表面由折射率為152以上 之光反射性無機粒子所形成之白色〜灰色之光反射層所構 成》又’本發明之異向性導電接著劑係於熱硬化性樹脂組 成物分散有該光反射性導電粒子而成者,該熱硬化性樹脂 201142876 組成物能提供對於波長380〜780 nm之可見光的光程長度i cm之透光率(jIS K71〇5)為8〇%以上的硬化物。因此,使用 本發明U肖性導電㈣層,㈣光元件覆晶構裝於配線 板所獲得之發光裝置即便使異向性導電接著劑硬化亦不產 生著色,且所含有之光反射性導電粒子對可見光之反射特 性之波長相依性較小,因此可使發光效率提高,且可使發 光元件之發光色以其原本之顏色進行反射。 【實施方式】 一面參照圖式一面對本發明進行詳細說明。 圖1A圖1B係異向性導電接著劑用之本發明之光反 射性導電粒子1〇、2G之剖面圖。首先,自圖1A之光反射 性導電粒子開始說明。 光反射性導電粒子10由被金屬材料包覆之核心粒子1 與於核〜粒子1表面由折射率為i ·52以上之光反射性無機 粒子2所形成之光反射層3所構成。 折射率為1.52以上之光反射性無機粒子2係於太陽光 下呈白色之無機粒子。因此,由該等形成之光反射層3呈 白色〜灰色。所謂呈白色〜灰色,係指對可見光之反射特 性之波長相依性較小,且易反射可見光。 較佳之光反射性無機粒子2可列舉選自氧化鈦(Ti〇2) 粒子、氧化鋅(ZnO)粒子或氧化鋁(Ai2〇3)粒子之至少一種。 另’於氧化鈦粒子、氧化鋅粒子或氧化銘粒子中,當已硬 化之異向性導電接著劑之熱硬化性樹脂之硬化物有發生光 6 201142876 劣化的顧慮時,較佳為可使用對光劣化無觸媒性,且折射 率亦較高之氧化鋅。 由於核心粒子1係一同參與異向性導電連接者,因此 其表面由金屬材料構成。此處,表面由金屬材料包覆之態 樣可列舉核心粒+ i本身為金屬材料之態樣,或者樹脂粒 子之表面由金屬材料包覆之態樣。 金屬材料可利用異向性導電連接用之先前導電粒子中 所使用之金屬材料。例如,可列舉金、鎳、銅、銀焊錫、 纪、銘、該等之合金、該等之多層化物(例如,鍵録/金閃鍛 敷物(gold flash plating))等。其中,由於金、鎳、銅使導電 粒子呈茶色,因此與其他金屬材料相比更能展現本發明之 效果。 另’當核心粒子1係由金屬材料包覆樹脂粒子而成者 之情形時,樹脂粒子亦可利用先前以來用作為異向性導電 連接用導電粒子之金屬包覆樹脂粒子之樹脂粒子部分。此 種樹脂粒子可列舉苯乙烯系樹脂粒子、苯並胍胺 (benzoguanamine)樹脂粒子、尼龍樹脂粒子等。以金屬材料 包覆樹脂粒子之方法亦可採用先前公知之方法,可利用無 電傻法、電鑛法等。又,包覆之金屬材料之層厚為足以確 保1好之連接可靠性之厚度,雖亦取決於樹脂粒子之粒徑 或金屬之種類,但通常為〇1〜3 ,較佳為。」…"m。 具有金屬材料表面之核心粒子1之粒徑若過小,則變 得導通不良’若過大則有於圖案間發生短路之傾向,因此 較佳為1 20 #m’更佳為3〜5 "m,特佳為3〜5 "m。 201142876 於此情形時,核心粒子1之形狀較佳為球形,亦可為薄片 狀、橄欖球(rugby卜811)狀。 關於由光反射性無機粒子2所形成之光反射層3之層 厚,就與核心粒子1之粒徑之相對大小之觀點而言,相對 於核心粒子1之粒徑,若過小則反射率會降低,若過大則 有變得導通不良之傾向,因此較佳為〇 5〜5〇%,更佳為ι 〜25%。 又,於光反射性導電粒子10中,關於構成光反射層3 之光反射性無機粒子2之粒徑,若過小則難以產生光反射 現象若過大則有難以形成光反射層之傾向,因此較佳為 0.02〜4 "m,更佳為〇·ι〜j ,特佳為〇 2〜〇 5 "爪。 於此情形時,就反射光的波長之觀點而言,為使應反射之 光(即,發光元件發出之光)不會穿透,光反射性無機粒子2 之粒徑較佳為該光之波長之5〇%以上。於此情形時,光反 射性無機粒子2之形狀可列舉無定型、球狀、鱗片狀、針 狀等,其中,就光擴散效果之方面而言較佳為球狀,就總 反射效果之方面而言較佳為鱗片狀之形狀。 圖ι A之光反射性導電粒子丨〇可藉由公知之成膜技術 (所谓機械融合(Mechanofusion)法)來製造,即藉由使大小之 粉末彼此發生物理性碰撞而於大粒徑粒子之表面形成由小 粒裎粒子所構成之膜。於此情形時,光反射性無機粒子2 係以陷入核心粒子1表面之金屬材料之方式而固定,另一 方面,無機粒子彼此難以熔接固定,因此無機粒子之單層 便構成光反射層3。因此,於圖丨八之情形時,可認為光反 8 201142876 之粒徑相等或略薄於 射層3之層厚與光反射性無機粒子2 光反射性無機粒子2之粒徑。 其次’對圖1B之光反射性導電粒子2G進行說明。於 該光反射性導電粒子2G中’於光反射層3含有發揮出作為 接著劑功能的熱塑性樹脂4,光反射性無機粒子2彼此亦由 此熱塑性樹脂4所固定,因而光反射性無機粒子〇層化⑼ 如多層化為2層或3層),此點與圖1A之光反射性導電粒 子10不同。藉由含有此種熱塑性樹脂4,光反射層3之機 械強度會提高,並且變得難以發生無機粒子之脫落等。 圖1B之光反射性導電粒子2〇可藉由機械融合法進行 製造。於此情形時,除光反射性無機粒子2與核心粒子i 以外,再併用微粒子狀之熱塑性樹脂4即可。另於藉由 機械融合法製造圖1B之光反射性導電粒子2〇之情形時, 亦司時製造圖1A之光反射性導電粒子1〇。 熱塑性樹脂4’為了減輕環境負荷而較佳為可使用無齒 素之熱塑性樹脂,例如’較佳為可使用聚乙烯、聚丙烯等 聚烯烴或聚苯乙烯、丙烯酸樹脂等。 此種光反射性導電粒子20亦可藉由機械融合法進行製 造。適用於機械融合法之熱塑性樹脂4之粒徑,若過小則 作為接著劑之效果變小,若過大則變得難以附著於核心粒 子1,因此較佳為0.02〜4 /zm,更佳為〇」〜! 。又, 關於此種熱塑性樹脂4之調配量,若過少則作為接著劑之 效釆較小,若過多則會生成不願見到之粒子凝聚體,因此 相對於核心粒子1之100質量份,較佳為〇 2〜5〇〇質量份, 201142876 更佳為4〜25質量份。 其次,對本發明之異向性導電接著劑進行說明。該異 向性導電接著劑係於熱硬化性樹脂組成物分散有本發明之 光反射H導電粒子而成者,可選取膏狀、膜狀等形態。 本發明之異向性導電接著劑中所使用之熱硬化性樹脂 、’且成物,較佳為儘量使用無色透明者。原因在於,不會使 異向ί±導電接著劑中之光反射性導電粒子之光反射效率降 低:且在不改變入射光之光色下使其反射。此處,所謂無 色透明’係指異向性導電接著劑之硬化物對於波長38〇〜 780 nm之可見光的光程長度1 cm之透光率(jIS〖71〇5)為 80〇/。以上,較佳為90。/。以上。 於本發明之異向性導電接著劑中,光反射性導電粒子 相對於熱硬化性樹脂組成物1〇〇質量份之調配量,若過少 則變侍導通不(,若過多則有於圖案間發生短路之傾向, 因此較佳^ 1〜100質量份,更佳為10〜50質量份。 ,關於本發明之異向性導電接著劑之反射特性,為提高 發光70件之發光效率,較理想的是異向性導電接著劑之 厚之硬化物對於波長45〇nm之光的反射率(jis Κ7ΐ〇5) 至少為15〇/〇。為達到此種反射率,只要對所使用之光反射 I·生導電粒子之反射特性或調配量、熱硬化性樹脂組成物之 調配組成等進行適當調整即可。通常,若增加反射特性良 好之光反射丨生導電粒子之調量,則有反射率亦增大之傾 向。 又,亦可自折射率(JIS K7142)之觀點對異向性導電接 201142876 著劑之反射特性進行評價。即,原因在於,若異向性導電 接著劑之熱硬化性樹脂組成物與光反射性導電粒子之間的 折射率之差過大,則光反射性導電粒子與包園其之熱硬化 性樹脂組成物之硬化物之界面中的光反射量會增大。具體 而呂,較理想的是熱硬化性樹脂組成物與光反射性無機粒 子之間的折射率之差為〇 〇2以上,較佳為〇 3以上。另, 通常,以m氧樹脂為主體之熱硬化性樹脂組成物之折射率 為約1.5 。 構成本發明之異向性導電接著劑之熱硬化性樹脂組成 物,可利用先前異向性導電接著劑或異向性導電膜中所使 2者—般而言,此種熱硬化性樹脂組成物係於絕緣性黏 澍月曰中調配硬化劑而成者。絕緣性黏合樹脂,較佳為可 歹^舉以脂環族環氧樹脂或雜環系環氧化合物或氫化環氧樹 脂等為主成分之環氧系樹脂。 p脂環族環氧化合物較佳為可列舉分子内具;t 2個以上 裒虱基者。該等既可為液態,亦可為固體狀。具體而言, 3可列舉縮水甘油基六氫雙齡A、3,4-環氧環己絲甲基一 中;㈣環氧環己烯甲酸酯等。其中’就可確保適宜於硬化物 7 /冓裝LED元件等之异读,叫 “ 寻之先透過性’且速硬化性亦優異之方面 〇 ’較佳為可使用縮水甘油基_Λ 己缔基曱基…—環氧環己之、氫雙“、3’4-環氧環 :環系環氧化合物可列舉具有三。井環之環氧化合物 s 壤氧環己烯曱酸酯 1,3,5-三(2,3 诖 丙基)一1,3,5 —三嗪一 2’4,6- (ιη,3Η,5Η)- 201142876 氮化環氧化合物可 ^ ^ 使用上述月曰環族環氧化合物哎雜援 系環氧化合物之氫化物 口卿及雜環 虱化物,或其他公知之氣 於本發明申,扣馆从 艰乳樹知。 曰裒族環氧化合物或雜環纟 或氫化環氧化合物既可單…^ 合物 视咪了單獨使用,亦可併用2 除該等環氧化合物以外,只要不損及本發明之效果;; 併用其他環氧化合物,如可列舉:使雙盼果亦: “、四甲基雙“、二芳基雙“、氮酿、苯二:間: :酚、甲酚、四漠雙酚A、三羥基聯苯、二苯甲酮、雙間苯 雙紛六氟丙_、日甲基雙盼A、四曱基雙盼F、三(經 苯基)曱烧 '聯二甲苯齡、苯紛紛路、甲齡盼駿等多紛與表 氣醇反應所獲得之縮水甘油醚;使甘油、新戊二醇、乙二 醇、丙二醇、丁二醇、己二醇、$乙二醇、聚丙二醇等: 肪族多元醇與表氣醇反應所獲得之聚縮水甘油醚;使如羥 基苯曱酸、沒一羥基萘甲酸之羥基羧酸與表氣醇反應所獲 得之縮水甘油醚酯;由如鄰苯二甲酸、甲基鄰苯二曱酸、 間苯二甲酸、對苯二甲酸、四氫鄰苯二甲酸、内亞甲基四 氫鄰苯二甲酸、内亞甲基六氩鄰苯二甲酸、偏苯三甲酸、 聚合脂肪酸之聚羧酸所獲得之聚縮水甘油酯;由胺基苯 酚、胺基烷基苯酚所獲得之縮水甘油基胺基縮水甘油醚; 由胺基苯甲酸所獲得之縮水甘油基胺基縮水甘油g旨;由苯 胺、甲苯胺、三溴苯胺、二甲苯二胺、二胺基環己烷、二 胺基甲基環己烷、4,4’一二胺基二苯甲烷' 4,4·~二胺基二 苯基砜等所獲得之縮水甘油胺;環氧化聚烯烴等公知之環 氧樹脂類。 12 201142876 硬化劑可使用酸酐、咪唑化合物、二氰等。其中,較 佳為可使用不易使硬化物變色之酸酐,特佳為可使用脂環 族酸針系硬化劑。具體而言,較佳為可使用甲基六氫鄰笨 二曱酸酐(MeHHPA)等。 於本發明之異向性導電接著劑之熱硬化性樹脂組成物 中’使用脂環族環氧化合物與脂環族酸酐系硬化劑之情形 時,關於各自之使用量’若脂環族酸酐系硬化劑過少則未 硬化環氧化合物增多而產生硬化不良,若過多則有由於剩 餘之硬化劑之影響而促進被黏附體材料腐蝕之傾向,因此 相對於脂環族環氧化合物100質量份,較佳為以8〇〜12〇 f量份,更佳為以95〜105質量份之比例使用脂環族酸酐 系硬化劑。 本發明之異向性導電接著劑可藉由均勻地混合光反射 性導電粒子與熱硬化性樹脂組成物而製造。又於將異向 陡導電接著劑用作為異向性導電膜之情形時,只要進行以 下處理即可·將該等與甲苯等溶劑一同分散混合,以達到 所需之厚度之方式塗佈於經剝離處理之pET(p〇lyethylene ephthalate,聚對笨二甲酸乙二酯)膜上並於約左 右之溫度下進行乾燥。 其-人,一面參照圖2 一面對本發明之發光裝置進行說 明’發光裝i 200係於基板21上之連接端子22、與分別形 成’、作為發光7L件之LED元件23之η電極24與p電極25 I接用凸塊26之間’塗佈上述本發明之異向性導電接著 劑’因而覆晶構裝有基板21與led_ 23之發光裝置。 13 201142876 此處,異向性導電接著劑之硬㈣⑽係光反射性導電粒 子10分散於熱硬化性樹脂組成物之硬化物u中而成者。 另’視需要,亦可用透明模槲 供樹月日以覆蓋整個LED元件23之 方式將其密封。 於如此所構成之發光奘朁 •«疋衮置200中,於LED元件23發出 之光中’朝基板21侧發出之掛& JI ί«之先由異向性導電接著劑之硬化 物100中之光反射性導電粒+10 Τ电祖于10反射,而自LED元件23 之上面出射。因此,可防止發光效率之降低。 實施例 實施例1 (光反射性導電粒子之製成) 將平均粒徑0.5 Am之氧化鈦粉末(KR—38〇,鈦工業 (Than K〇gyo)(股))4質量份、以及外觀色為茶色之平均粒徑 5 "m之Au包覆樹脂導電粒子(對平均粒徑46以爪之球 狀丙稀酸樹脂粒子實施〇.2心厚之無電解鍍金而成之粒 子:Bright 20GNB4.6EH,曰本化學工業(股)2〇質量份,投 入機械融合裝置(AMS - GMP,Hos〇kawa Mier〇n(股)),並於 旋轉速度1000 rpm,旋轉時間20分鐘之條件下於導電粒子 之表面形成由氧化鈦粒子所構成之約〇3以爪厚之光反射 層,藉此獲得實施例1之光反射性導電粒子。該光反射性 導電粒子之外觀色為灰色。 (光反射率評價試驗) 使用真空消泡攪拌裝置將所獲得之光反射性導電粒子 15質量份與折射率為約丨.5之無色透明之熱硬化型環氧系 201142876 黏合劑蛆成物(ΥΧ — 8000,JER(股))1〇〇質量份均勻地混 合,藉此獲得實施例1之異向性導電接著劑。 將所獲得之異向性導電接著劑以使乾燥厚度達到1〇〇 "m之力式塗佈於陶瓷製之白色板上,並於2〇〇。匸下加熱i 分鐘,使其硬化。對於該硬化物,使用分光光度計(U33〇〇, 曰立製作所(版)),測定對波長45〇 nm之光之反射率(HS K/105)。將所獲得之結果示於表1及圖3。 (電氣特性(導通可靠性、絕緣可靠性)評價試驗) 使用於光反射率評價試驗時所製備之異向性導電接著 劑,於具有對50 間距之銅配線實施Ni/Au(5 〇 "爪厚 /0.3 厚)鍍敷處理而成之配線的環氧玻璃基板上於 2〇〇t、60移、、i Kg/晶片之條件下覆晶構裝具# 15 高之金凸塊之6 mm見方試驗用IC晶片(導體連接面積/導 體-間隙= 1600 "mV50 "mP),而獲得試驗用IC模組。 1 ·導通可靠性 對所獲得之試驗用IC模組交替進行加熱、冷卻至低溫 (-40 C )與高溫(1〇〇t )之溫度的溫度循環試驗(代τ ,
Temperature Cycle 丁叫⑽C5〇3〇),並藉由初始與則循 環後之四端子法來測^電阻值。將電阻值未達1 Ω之情形 评價為「〇」’將i Ω以上之情形評價為「χ」。將所獲得 之結果示於表1。 2.絕緣可靠性 對另外製成之試驗用IC模組進行於85它、85%RH2 環境下故置刪小時之老化試驗,並測定初始與删小 15 201142876 時後之電阻值。將電阻值為 將未達ΙΟ6 Ω之情形評價為 10 Ω以上之情形評價為「〇」, 「X」8將所獲得之結果示於表 實施例2 除使用平均粒徑5.0 "…i包覆 (讓-4細,日本化學工業(股))代替AU包 : 粒子以外,以與實施例丨同樣的方式,獲得 之光反射性導電粒子,進而獲彳 為又色 逛而獲侍異向性導電接著 以與實關1同樣的方式’進行光反射率評價試驗與電氣 特性(導通可靠性、絕緣可靠性)評價試驗。將所獲得 示於表1 » 實施例3 將平均粒徑0.5 之氧化欽粉末(KR—38〇,欽工業 (股))4質量份、作為接著劑粒子之平均粒徑”之聚 笨乙稀(pS(P〇iystyrene))粒子(G1〇ssdelI _,三井化學 (股))3質量份、及平均粒徑…之導電粒子(對平均粒徑 4.6 之球狀丙烯酸樹脂粒子實施〇2以爪厚之無電解 鍍金而成之粒子·· Bright 20GNB4 6EH,日本化學工業 (股))2〇質#份’投入機械融合裝置(AMS — GMp,Η。·麵 Micron(股)),且於旋轉速度1〇〇〇rpm,旋轉時間2〇分鐘之 條件下於導電粒子之表面形成由苯乙烯與氧化鈦粒子所構 成之約1 厚之光反射層,藉此獲得外觀色為灰色之光 反射性導電粒子,進而獲得異向性導電接著劑。又,以與 實施例1 ί«的方,式,進行光反射率評價試驗與電氣特性 16 201142876 (碎通可靠性、絕緣可靠性)評價試驗。將所獲得之結果示於 表1。 實施例4 除使用平均粒柯< $ ^ ^立彳丄5.0 之Ni包覆樹脂導電粒子 (5繼一4細,曰本化學工業(股))代替An包覆樹脂導電 粒子以外,以與實施例3同樣的方式,獲得外觀色為灰色 之光反射性導電粒子1而獲得異向性導電接著劑。又, 進而以與實施Μ1同樣的方式,進行光反射率評價試驗與 電氣特性(導通可靠性、絕緣可靠性)評價試驗。將所獲得之 結果不於表1。 實施例5 除使用平均粒徑0.2㈣之聚乙稀(pE(p〇iyethyiene)) 粒子(Chemipearl WF300 ,三井化學(股))’來代替平均粒徑 〇.0 m之聚苯乙稀粒子⑹〇ssdeU 2〇4s,三井化學(股))以 外’以與實㈣3同樣的方式,獲得外觀色為灰色之光反 射性導電粒子,進而獲得異向性導電接著劑。&,以與實 施例1同樣的方式’進行光反射率評價試驗與電氣特性(導 通5Γ靠性、絕緣可靠性)評價試驗^將所獲得之結果示於表 實施例6 除使用平均粒徑0.5心之氧化辞粉末(氧化w種, HakUsuitech(股))代替平均粒徑〇5㈣《氧化㈣末以 外,以與實施例3同樣的方式’獲得外觀色為灰色之光反 射性導電粒子,進而獲得異向性導電接著劑。X,以與實 17 201142876 施例1同樣的方式,進行光反射㈣㈣驗與電氣特性(導 通可靠性、絕緣可靠性)評價試驗1所獲得之結果示於表 實施例7 除使用平均粒徑0.5 之氧化紹粉末(ae—25刪,
Admateehs(股))代替平均粒徑0 5 # m之氧化欽粉末以外, 以與實施们同樣的方式,獲得外觀色為灰色之光反射性 導電粒子,進而獲得異向性導電接著劑。又,以與實施例ι 同樣的方式,進行光反射率評價試驗與電氣特性(導通可靠 性、絕緣可靠性)評價試驗。將所獲得之結果示於表卜 實施例8 除使用平均粒徑〇.5 Mm之碳酸鎂代替平均粒徑〇5 A m之氧㈣粉末以外’以與實施例3同樣的方式獲得外 觀色為灰色之光反射性導電粒子,進而獲得異向性導電接 者劑。又’以與實施们㈣的方式,進行光反射率評價 試驗與電氣特性(導通可純、絕緣可靠性)評價試驗。將所 獲得之結果示於表1。 實施例9 除使用平均粒徑〇 2 # m之氧化鈦粉末(JR4〇5,
Tayca(股))代替平均粒徑Q 5 ^⑺之氧化欽粉末以外,以與 實施例3同樣的方式,獲得外觀色為灰色之光反射性導電 粒子’進而獲得異向性導電接著劑。&,以與實施例丄同 樣的方式,進行光反射率評價試驗與電氣特性(導通可靠 性、絕緣可靠性)評價試%。將所獲得之結果示於表i。 201142876 比較例1 ,用外觀色為茶色之Au包覆樹脂導電粒子(對平均粒 位…m之球狀丙婦酸樹脂粒子實施〇2… 鍍金而成之粒子:Bright 20GNB4.6EH,日太介與專 (股)),以與實施你Μ同樣的方式,獲得異向性導電接予著工劑; :’以與實施…樣的方式’進行光反射率評價試驗與 電氣特性(導通可#性、絕緣可靠性)評價試驗1所獲得之 結果示於表1。亦將光反射率示於圖3。 比較例2 除使用外觀色為茶色之平均粒徑5·〇 ^仿之犯包覆樹 脂導電粒子(52NR-4.6EH,日本化學工業(股))代替Au包 覆樹脂導電粒子以外,以與比㈣i同樣的方式,獲得異 向性導電接著劑。又,以與實施咖"同樣的方式,進行光 反射率#價試驗與電氣特性(導通可靠性、絕緣可靠性 試驗。將所獲得之結果示於表^ ” 比較例3 將平均粒徑0.2 a m之聚苯乙烯系粒子(G1〇ssdeU 2〇4S,二井化學(股))3質量份、以及平均粒徑5 // m之導 電缸子(對平均粒徑4.6私m之球狀丙烯酸樹脂粒子實施 〇,2 厚之無電鍍金而成之粒子:Bright 20GNB4.6EH, 曰本化學工業(股))20質量份,投入機械融合裝置(ams — GMP,Hosokawa Micron(股))’且於旋轉速度 1000 rpm,旋 轉時間20分鐘之條件下於導電粒子之表面形成〇2从爪厚 之笨乙歸層’藉此獲得外觀色為茶色之樹脂包覆導電粒 201142876 子’進而獲得異向性導電接著 ..^ ^又,以與實施例1同樣 紹方式,進行光反射率評價試驗與電氣特性(導通可靠性、 ,'緣可靠性)評價試驗。將所獲得之結果示於表卜 比較例4 除使用平均粒徑0.5以爪夕条化^
κ 之氧化石夕粉末(SEAHOSTER KEP-30’日本觸媒(股))代替 粉古丨v^ 祖^ 0.5 A m之氧化鈦 々末以外,以與實施例3同樣的 之练雷^ 也 万式’獲得外觀色為茶色 〈導電粒子,進而獲得異向性導 β余巴 例1同樣的方式,進行光反射率者劑。又’以與實施 可靠性、絕緣可靠性)評價試驗 ^驗與電氣特性(導通 所獲得之結果示於表1。 20 201142876 比較例 寸 C ο »η m Ρη (N Ο Si〇2 Ο 茶色 Os 〇 〇 〇 〇 m 3 C ο C/l 〇Η (Ν C> 1 1 1 茶色 00 〇 〇 〇 X (N ο ΙΛ 1 1 1 1 1 黑色 Os 〇 〇 X X ο 1 1 1 1 1 茶色1 00 〇 〇 X X ..». t- · 1 I犯們 as < ο ιη ζΛ 〇Η (Ν Ο Ti〇2 (Ν c> 1灰色| 〇 〇 〇 〇 00 =3 < ο C/3 〇Η <Ν Ο 1 MgCOs ^r\ Ο 丨 1.52 1 Γ灰色1 <n 〇 〇 〇 〇 卜 < ο wS (Λ 〇Η <Ν Ο Al2〇3 κη ο 1 1·76 1 灰色I 卜 «-Η 〇 〇 〇 〇 v〇 < ο uS m 0-1 (Ν C> 1 ZnO I ο ϋ^95| 灰色 CS <N 〇 〇 〇 〇 Ο <〇 ω CL, Τ-Η Ο Ti02 ο [mi\ 灰色| 〇 〇 〇 〇 寸 ο »〇 κη Ρη (Ν <ό Ti〇2 ο llZLl 灰色 <N 〇 〇 〇 〇 m < Ο ιη 〇Η CN Ο Ti02 c5 灰色| 沄 〇 〇 〇 〇 <N ο t 1 Ti02 ο ^7lJ 灰色| CN cn 〇 〇 〇 〇 »—H < ο 1 Ti02 ο 17il 灰y 〇 〇 〇 〇 |表面金屬i 粒徑("m) 種類 粒徑("m) 種類 粒徑("m) 折射率nl 顏色 反射率(%) 初始 TCT 後 I 初始 老化後 原料導電粒子 接著劑粒子 無機粒子 光反射性導電粒子 導通可靠性 絕緣可靠性 201142876 由表1可知以下結果:使用實施例1〜9之光反射性導 電粒子之異向性導電接著劑之光反射率均為3〇%以上,45〇 nm之光之藍色以其原本之顏色進行反射。且導通可靠性及 絕緣可靠性亦良好。 相對於此,於比較例1〜3之情形時,由於未在導電粒 子之表面設置光反射層’因此光反射率為1〇%左右,關於 比較例1、2,自初始發生短路,於比較例3之情形時於 老化後發生短路,絕緣可靠性存在問題。於比較例4之情 形時,由於使用氧化矽作為無機粒子,因此於形成無機粒 子層後導電粒子之顏色亦呈茶色,且光反射率為1〇%左右。 認為其原因在於,氧化矽與異向性導電接著劑之黏合劑組 成物之間的折射率差未達0 〇2。 [產業上之可利用性] 本發明之光反射性導電粒子於使用異向性導電接著劑 將發光二極體(LED)元件等發光元件覆晶構裝於配線板而 製造發光裝置時,不需於發光元件上設置例如會導致製造 成本增加之光反射層,而可使發光效率不降低,且可於發 光兀件之發光色與反射光色之間不產生色相差。由此,本 發明之異向性導電接著劑於覆晶構裝LED/t件時有用。 【圖式簡單說明】 圖1A係異向性導電接著劑用之本發明之光反射性導電 粒子之剖面圖。 圖1B係異向性導電接著劑用之本發明之光反射性導電 22 201142876 粒子之剖面圖。 圖2係本發明之發光裝置之剖面圖。
圖3係表示實施例1與比較例1之I 劑 井向性導電接著 之硬化物對波長之光反射率的圖。 圖4係先前之發光裝置之剖面圖。 圖5係先前之發光裝置之剖面圖。 【主要元件符號說明】 1 核心粒子 2 光反射性無機粒子 3 光反射層 4 熱塑性樹脂 10 ' 20 光反射性導電粒子 11 熱硬化性樹脂組成物之硬化物 21、31 基板 22 > 36 連接端子 23 ' 33 LED元件 24、35 η電極 25 ' 34 Ρ電極 26 ' 39 凸塊 32 黏晶接著劑 37 金線 38 透明模樹脂 40 光反射層 23 201142876 41 100 200 異向性導電膏 異向性導電接著劑之硬化物 發光裝置 24
Claims (1)
- 201142876 七、申請專利範圍: 1. -種光反射性導電粒子,其係用於用以將發光元件異 向性導電連接於配線板之異向性導電接著齊丨,且係由被金 屬材料包覆之核心粒子與於核心粒子表面由折射率為152 以上之光反射性無機粒子形成之光反射層所構成。 2. 如申請專利範圍帛i項之光反射料電粒子,其中包 覆核心粒子之金屬材料為金、鎳或銅。 3. 如申請專利範圍帛1JR之光反射性冑電粒子,其中核 〜粒子本身為金、錄或鋼之粒子。 4. 如申請專利範圍第丨項或第2項之光反射性導電粒 子其+核'U粒子係用金、鎳或銅包覆樹脂粒子而成者。 5·如中請專利範圍第i項至第3項中任—項之光反射性 導電粒子,其中核心粒子之粒徑A卜2() _,光反射層 之層厚為核心粒徑之〇.5〜5〇%。 &如申請專利範圍第丨項至第3項中任—項之光反射性 導電粒子’其中光反射性無機粒子係選自氧化欽粒子、氧 化鋅粒子或氧化㈣子之至少—種無機粒子。 7. 如申請專利範圍第i項至第3項中任一項之光反射性 導f粒子,其中光反射層含有 。 8. 如申請專利範圍第7項之光反射性導電粒子,其中執 塑V生樹脂為聚烯烴。 … …性導電接著劑,其係用以將發光元件異向性 項:r::r 性樹散 固弟1項至第8項卡任一項之光反射性導電 25 201142876 粒子而成者,該熱硬化性樹脂組成物能提供對於波長38〇 〜750 nm之可見光的光程長度1 cm之透光率(JIS K71〇5) 為80%以上之硬化物。 10. 如申請專利範圍第9項之異向性導電接著劑,其中 光反射性導電粒子相對於熱硬化性樹脂組成物1〇〇質量份 之調配量為1〜1〇〇質量份。 11. 如申請專利範圍第9項或第10項之異向性導電接著 劑,其中異向性導電接著劑之1 〇〇从m厚之硬化物對於波 長450 nm之光的反射率(JIS K71〇5)至少為15%。 12. 如申請專利範圍第9項或第1〇項之異向性導電接著 劑,其中熱硬化性樹脂組成物與光反射性無機粒子之間的 折射率之差為〇.〇2以上。 13. 如申請專利範圍第9項或第1〇項之異向性導電接著 劑,其中熱硬化性樹脂組成物含有環氧樹脂與酸酐系硬化 劑。 、 14.一種發光裝置,其經由申請專利範圍第$項至第u 項中任一項之異向性導電接著劑,將發光元々 構農於㈣板。 式 其中發光元件 I5.如申請專利範圍第14項之發光裝置 為發光二極體。 八、圖式: (如次頁) 26
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TWI575053B (zh) * | 2012-06-15 | 2017-03-21 | Dexerials Corp | 光反射性異向性導電接著劑及發光裝置 |
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CN102576798A (zh) | 2012-07-11 |
US8796725B2 (en) | 2014-08-05 |
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TWI534839B (zh) | 2016-05-21 |
KR20120070537A (ko) | 2012-06-29 |
JP2011086823A (ja) | 2011-04-28 |
US9340710B2 (en) | 2016-05-17 |
US20140103266A1 (en) | 2014-04-17 |
EP2490271A4 (en) | 2014-08-06 |
TW201447922A (zh) | 2014-12-16 |
WO2011045962A1 (ja) | 2011-04-21 |
JP5526698B2 (ja) | 2014-06-18 |
TWI450280B (zh) | 2014-08-21 |
CN102576798B (zh) | 2016-11-16 |
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