TW201133577A - Substrate processing device - Google Patents

Substrate processing device Download PDF

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Publication number
TW201133577A
TW201133577A TW099118782A TW99118782A TW201133577A TW 201133577 A TW201133577 A TW 201133577A TW 099118782 A TW099118782 A TW 099118782A TW 99118782 A TW99118782 A TW 99118782A TW 201133577 A TW201133577 A TW 201133577A
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TW
Taiwan
Prior art keywords
liquid
substrate
processing
glass substrate
treatment
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TW099118782A
Other languages
Chinese (zh)
Inventor
Takuto Kawakami
Kazuo Jodai
Eiji Yamashita
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Dainippon Screen Mfg
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Publication of TW201133577A publication Critical patent/TW201133577A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Liquid Crystal (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention provides a substrate processing device capable of effectively supplying processing liquid to the whole substrate surface without consuming large amount of processing liquid. A liquid-collecting member 71 is arranged along the transporting direction of the glass substrate 100 from the edge rim position of the glass substrate 100 from both sides along the transporting direction of the glass substrate 100 by a transporting roller 9, and the distance D between the edge rim of the glass substrate 100 transported by a transporting roller 9 and the liquid-collecting member 71 is less than 2mm. Also, the upper surface height of the liquid-collecting member 71 is higher than the surface height of glass substrate 100 by H. The value H is preferably greater than the film thickness of the processing liquid jetted from the jetting nozzle 2 of processing liquid and supplied to the surface of the glass substrate 100.

Description

201133577 六、發明說明: 【發明所屬之技術領域】 本發明係關於藉由處理液,處理LCD(液晶顯示裝置)或 PDP(電漿顯示器)等之FPD(平面顯示器)用玻璃基板、有機 EL用玻璃基板、光罩用玻璃基板等之基板的基板處理裝 置。 【先前技術】 例如,製造LCD時,於玻璃基板上形成非晶矽,將該矽 層表面之自然氧化膜進行蝕刻處理,洗淨及乾燥處理後, 照射雷射,將非晶矽層熔融再結晶化。此時,在蝕刻步驟 等中,先前採用之構成有:在水平支撐基板的狀態下一 面圍繞垂直軸旋轉,一面依序將蝕刻液供給至其表面,將 基板之表面進行蝕刻處理。又,採用之構成有蝕刻處理後 之基板由於具有強斥水性,故一面低速旋轉蝕刻後之基板 一面供給洗淨液,在因其表面張力而形成有洗淨液之液膜 的狀態下,對基板整面施與洗淨處理,然後使基板快速旋 轉,除去洗淨液(參照專利文獻1)。 [先行技術文獻] [專利文獻] [專利文獻1]日本特開2003-17461 【發明内容】 [發明所欲解決之問題] 由於近年來之被處理基板之大型化,如專利文獻1所纪 載之發明,一面旋轉基板一面進行蝕刻處理有其困難。因 148873.doc 201133577 此’提出有一面於水平方向搬送基板,一面對基板之表面 供給蝕刻液等之處理液,從而處理基板。 即’考慮一面藉由複數個搬送輥朝水平方向搬送基板, 一面由與基板之表面對向配置之狹縫喷嘴或喷霧喷嘴,對 基板之表面供給處理液,藉此利用處理液處理基板。然 而’基板之表面具有強斥液性(斥水性)之情況時,處理液 在基板之表面被排斥’從而產生無法將處理液供給至基板 之表面全域之問題。 尤其是在使用氟酸作為處理液之蝕刻處理中,自然氧化 膜經除去後,使得基板之表面呈強斥水性,從而使作為處 理液之姓刻液在基板之表面上被排斥。因此,考慮對基板 之表面,供給極其大量之處理液,從而使處理液遍佈於基 板表面之全域。然而’該情況不僅處理液徒勞消耗,且即 使採用如此之構成’由於處理液之表面張力之作用,亦不 易將處理液供給至基板之表面整體。 圖19(a)係顯示對玻璃基板100之表面供給處理液時之狀 態之概要圖。 如該圖所示,玻璃基板100之表面具有強斥液性(斥水 性)之情況時,處理液101會在基板之表面被排斥,由於處 理液101之表面張力之作用,在玻璃基板1〇〇之端緣附近, 產生不存在處理液1〇1之區域。如此之區域之產生由於在 大量供給處理液1 〇 1之情形下,處理液1 0 i亦會從玻璃基板 1 〇〇之端緣流出’故為同樣產生之現象。產生如此之現象 之情況時,不能適當地處理玻璃基板100。 148873.doc 201133577 本發明係為解決上述問題而完成者,其目的在於提供一 種無而消耗大量之處理液,而可有效地將處理液供給至基 板之表面全域的基板處理裝置。 . [解決問題之技術手段] .技術方案1記載之發明之特徵為具備有:搬送機構,其 在其主面呈大致水平方向的狀態下,支撐矩形之基板,且 於大致水平方向搬送該基板;處理液喷出喷嘴,其將朝向 下方之處理液喷出口延設在與利用上述搬送機構之基板之 搬送方向交叉之方向,且用於對由上述搬送機構搬送之基 板之表面供給處理液;及液體收集構件,其在上述基板之 搬送方向之兩側,沿著上述基板之搬送方向,配設於接近 或抵接於上述基板之端緣之位置,且其上表面之高度位置 係配置於上述基板之表面之高度位置以上的位置,並藉由 表面張力之作用,使由上述處理液喷出喷嘴供給至上述基 板之表面之處理液擴張至上述基板之端緣為止。 技術方案2記載之發明係在技術方案1記载 述液體收集構件之上表面之高度位置,係:成:::述: 理液喷出噴嘴供給至上述基板之表面的處理液之膜厚以上 的方式,配置於高於上述基板之表面之高度位置的位置。 技術方案3記載之發明係在技術方案2記載之發明中,上 述液體收集構件與上述基板之端緣相互隔離,且上述液體 收集構件與上述基板之端緣之距離為2 mm以下。 技術方案4記載之發明係在技術方案3記載之發明中,上 述液體收集構件具有沿著上述基板之搬送方向而延設之長 148873.doc 201133577 條型之形狀,並固定於上述基板之搬送方向之兩側。 技術方案5記載之發明係在技術方案3記載之發明中,上 述液體收集構件沿著上述基板之搬送方向,與利用上述搬 送機構之上述基板之搬送速度同步移動。 技術方案6記載之發明係在技術方案5記載之發明中,上 述搬送機構具備從其下面支撐旋轉基板之搬送輥,且上述 液體收集構件包含捲繞於上述搬送輥之環狀帶。 技術方案7記載之發明係在技術方案6記載之發明中,上 述處理液喷出喷嘴相互隔離複數個配設於利用上述搬送機 構之基板之搬送方向,且包含上述環狀帶之液體收集構 件,在上述複數個處理液噴出喷嘴之間之位置,係以一對 配設於由上述搬送機構搬送之基板之兩側之位置。 技術方案8記載之發明係在技術方案6記載之發明中,上 述處理液喷出喷嘴相互隔離複數個配設於利用上述搬送機 構之基板之搬送方向,且包含上述環狀帶之液體收集構件 分別對應於上述複數個處理液喷出噴嘴,複數對配設於由 上述搬送機構搬送之基板之兩側之位置,且於上述複數對 液體收集構件間’形成有可使處理液流下之間隙。 技術方案9記載之發明係在技術方案丨至技術方案8中記 載之任一項發明中,上述處理液喷出喷嘴配置於上述處理 液喷出口與由上述搬送機構搬送之基板之表面之距離,藉 由由上述處理液喷出口喷出之處理液之液膜,而使該等之 間呈液密狀態的位置,且具備將處理液之積液保持在與處 理液喷出口對向之位置的處理液保持面,進而具備配置在 148873.doc 201133577 於上述處理液嘴出口盥 /、上述處理液保持面之距離’該等之 間可形成處理液之锫 之積液之位置的積液保持構件。 [發明效果] 根據技術方案1 0 . .,^ M D载之發明由於可藉由液體收集構件之 作用,將處理液擴带 ' 土板之端緣為止,故即使基板之表[Technical Field] The present invention relates to a glass substrate for FPD (planar display) for processing an LCD (Liquid Crystal Display) or PDP (plasma display) by a processing liquid, and an organic EL A substrate processing apparatus for a substrate such as a glass substrate or a glass substrate for a photomask. [Prior Art] For example, when an LCD is manufactured, an amorphous germanium is formed on a glass substrate, and a natural oxide film on the surface of the germanium layer is etched, washed and dried, and then irradiated with a laser to melt the amorphous germanium layer. Crystallization. At this time, in the etching step or the like, the structure which has been previously employed is such that the etching liquid is sequentially supplied to the surface while the horizontal support substrate is rotated about the vertical axis, and the surface of the substrate is etched. In addition, since the substrate after the etching treatment is made to have a strong water repellency, the cleaning liquid is supplied to the substrate after the low-speed rotation etching, and the liquid film of the cleaning liquid is formed by the surface tension. The entire surface of the substrate is subjected to a washing treatment, and then the substrate is rapidly rotated to remove the cleaning liquid (see Patent Document 1). [PRIOR ART DOCUMENT] [Patent Document 1] [Patent Document 1] JP-A-2003-17461 [Disclosure of the Invention] [Problems to be Solved by the Invention] Due to the increase in size of substrates to be processed in recent years, as disclosed in Patent Document 1, According to the invention, it is difficult to perform etching treatment while rotating the substrate. According to pp. 148873.doc 201133577, it is proposed that the substrate is transported in the horizontal direction, and the processing liquid such as an etching liquid is supplied to the surface of the substrate to process the substrate. In other words, it is considered that the substrate is transported in the horizontal direction by a plurality of transport rollers, and the processing liquid is supplied to the surface of the substrate by a slit nozzle or a spray nozzle disposed opposite to the surface of the substrate, whereby the substrate is treated with the processing liquid. However, when the surface of the substrate has a strong liquid repellency (water repellency), the treatment liquid is repelled on the surface of the substrate, causing a problem that the treatment liquid cannot be supplied to the entire surface of the substrate. In particular, in the etching treatment using hydrofluoric acid as the treatment liquid, after the natural oxide film is removed, the surface of the substrate is made highly water-repellent, so that the engraved liquid as the treatment liquid is repelled on the surface of the substrate. Therefore, it is considered that an extremely large amount of the treatment liquid is supplied to the surface of the substrate, so that the treatment liquid spreads over the entire surface of the substrate. However, in this case, not only the treatment liquid is consumed in vain, but also the treatment liquid is supplied to the entire surface of the substrate due to the surface tension of the treatment liquid. Fig. 19 (a) is a schematic view showing a state in which a treatment liquid is supplied to the surface of the glass substrate 100. As shown in the figure, when the surface of the glass substrate 100 has a strong liquid repellency (water repellency), the treatment liquid 101 is repelled on the surface of the substrate, and the surface tension of the treatment liquid 101 acts on the glass substrate. In the vicinity of the edge of the crucible, an area where the treatment liquid 1〇1 does not exist is generated. The occurrence of such a region is caused by the fact that the processing liquid 1 0 i also flows out from the edge of the glass substrate 1 when a large amount of the processing liquid 1 供给 1 is supplied. When such a phenomenon occurs, the glass substrate 100 cannot be properly processed. 148873.doc 201133577 The present invention has been made to solve the above problems, and an object thereof is to provide a substrate processing apparatus which can efficiently supply a processing liquid to the entire surface of a substrate without consuming a large amount of processing liquid. [Technical Solution to Problem] The invention according to the first aspect of the invention is characterized in that the conveying mechanism includes a rectangular substrate and a substrate in a substantially horizontal direction while the main surface thereof is substantially horizontal. a treatment liquid discharge nozzle that extends the processing liquid discharge port facing downward in a direction intersecting with a conveyance direction of the substrate by the conveyance mechanism, and supplies a treatment liquid to a surface of the substrate conveyed by the conveyance mechanism; And a liquid collecting member disposed at a position close to or in contact with an edge of the substrate along a direction in which the substrate is conveyed on both sides of the transfer direction of the substrate, wherein a height position of the upper surface is disposed The processing liquid supplied from the processing liquid discharge nozzle to the surface of the substrate is expanded to the edge of the substrate by a surface tension at a position above the height of the surface of the substrate. According to a second aspect of the present invention, in the height position of the upper surface of the liquid collecting member, the thickness of the processing liquid supplied to the surface of the substrate by the chemical liquid discharging nozzle is greater than or equal to the thickness of the surface of the liquid collecting member. The method is disposed at a position higher than a height position of a surface of the substrate. According to a third aspect of the invention, the liquid collecting member is isolated from an edge of the substrate, and a distance between the liquid collecting member and an edge of the substrate is 2 mm or less. According to a third aspect of the invention, the liquid collecting member has a shape of a length of 148873.doc 201133577 extending along a direction in which the substrate is conveyed, and is fixed to a conveying direction of the substrate. On both sides. According to the invention of claim 3, in the invention of the third aspect, the liquid collecting member moves in synchronization with the conveying speed of the substrate by the conveying mechanism along the conveying direction of the substrate. According to the invention of the fifth aspect of the invention, the conveying mechanism includes a conveying roller that supports the rotating substrate from the lower surface thereof, and the liquid collecting member includes an endless belt wound around the conveying roller. According to the invention of the sixth aspect of the invention, the processing liquid discharge nozzle is provided with a plurality of liquid collecting members that are disposed in a conveying direction of the substrate by the conveying mechanism and that includes the endless belt. A position between the plurality of processing liquid discharge nozzles is disposed at a position on both sides of the substrate conveyed by the transfer mechanism. According to a sixth aspect of the invention, in the invention of the sixth aspect, the processing liquid ejecting nozzles are separated from each other by a plurality of liquid collecting members that are disposed in a conveying direction of the substrate by the conveying mechanism, and include the endless belt In response to the plurality of processing liquid discharge nozzles, a plurality of pairs are disposed at positions on both sides of the substrate conveyed by the transfer mechanism, and a gap between the plurality of liquid collecting members is formed to allow the processing liquid to flow. According to a seventh aspect of the invention, the process liquid discharge nozzle is disposed at a distance between the processing liquid discharge port and a surface of the substrate conveyed by the transfer mechanism, The liquid film of the treatment liquid discharged from the treatment liquid discharge port is in a liquid-tight state, and the liquid of the treatment liquid is held at a position opposed to the treatment liquid discharge port. The liquid holding member is disposed at a position at which the liquid immersion liquid of the processing liquid can be formed between the processing liquid nozzle outlet 盥 / and the distance between the processing liquid holding surface 148873.doc 201133577 . [Effect of the Invention] According to the invention, the invention according to the first aspect of the invention can expand the processing liquid to the end edge of the earth plate by the action of the liquid collecting member, so even the surface of the substrate

面呈斥水性,亦可右4 Ur 0 A 有效地將處理液供給至基板之表面全 域0 根據技術方荦„ 。己载之發明,可在將基板之表面之處理 液之膜厚維持在期望之 的狀t下,有效地將處理液供給 至基板之表面全域。 根據技術方案3記載之發明叮 集構件之接觸,—二由1二可—面防止基板與液體收 液供认… ®藉由表面張力之作用,有效地將處理 液供、、、σ至基板之表面全域。 根據技術方案4記恭夕欢οη 株^ "月,可簡單地構成液體收集構 件,又,其定位亦變得容易。 根據技術方案5 f?恭夕3又。η 同牛^ & 力之务明’由於液體收集構件與基板 同步移動’故可更有效地發捏 作用。 u發揮相對於處理液之表面張力之 根據技術方案6記載之私明 | 又 可兼用搬送輥與液體收集 構件之移動機構,從而使得 八 同步移動。 Μ體收集構件更容易地與基板 根據技術方案7記載之發明, 之間之你署f丄 设数個處理液噴出噴嘴 之間之位置’可猎由液體收集構件 ^ 防止處理液從 基板之端緣流下。因此,可 处/夜攸 、基板之表面全域總是維持處 148873.doc 201133577 理液。 根據技術方案8記載之發明,可使最初之由處理液供給 喷嘴供給之處理液從液體收集構件間之間隙流下。因此, 不會存在由先前之處理液供給喷嘴供給之處理液,或可在 減;的狀態下,由下一個處理液供給喷嘴供給新的處理 液。 根據技術方案9記載之發明,可藉由形成於處理液喷出 喷嘴與積液保持構件之間之積液之作用,將處理液供給至 由搬送機構搬送之基板之表面之前端部全域,又,其後, 可藉由處理液之液膜,將處理液喷出喷嘴與基板之表面之 間。又為液费狀態,對基板之表面供給處理液。因此,可更 有效地將處理液供給至基板之表面全域。 【實施方式】 以下,基於圖式,說明本發明之實施形態。圖丨係本發 明之基板處理裝置之側視概要圖。又,圖2係放大顯示處 理.洗淨單元1之側視圖。 該基板處理裝置係在對於其表面形成有非晶矽層之玻璃 基板100進行雷射退火前,用以進行形成於矽層表面之氧 化膜之蝕刻者。該基板處理裝置具備在其主面呈水平方向 的狀態下支撐玻璃基板100且於水平方向搬送該玻璃基板 1〇〇之複數個搬送輥9 ; 4個處理.洗淨單元la、lb、lc、The surface is water-repellent, and the right 4 Ur 0 A can effectively supply the treatment liquid to the surface of the substrate. According to the technical method, the film thickness of the treatment liquid on the surface of the substrate can be maintained at the desired level. In the shape t, the treatment liquid is effectively supplied to the entire surface of the substrate. According to the invention described in the third aspect of the invention, the contact of the collector member is prevented by the 1-2 surface-protecting substrate and the liquid liquid collection... The effect of the surface tension is to effectively supply the treatment liquid to the surface of the substrate to the entire surface of the substrate. According to the technical scheme 4, the liquid collection member can be simply constructed, and the positioning thereof is also changed. According to the technical solution 5 f? Gong Xi 3 again. η with the cattle ^ & force of the 'because the liquid collecting member and the substrate move synchronously' can be more effective in pinching. u play relative to the treatment liquid According to the privacy statement described in claim 6, the surface tension can be used in combination with the moving mechanism of the conveying roller and the liquid collecting member, so that the eight-synchronous movement is performed. The carcass collecting member is more easily described with the substrate according to the seventh aspect. According to the invention, the position between the nozzles of the plurality of processing liquids is set to 'between the liquid collecting member ^ to prevent the processing liquid from flowing down from the edge of the substrate. Therefore, the surface of the substrate can be placed/night, the surface of the substrate According to the invention of claim 8, the treatment liquid initially supplied from the treatment liquid supply nozzle can flow down from the gap between the liquid collection members. Therefore, there is no previous The treatment liquid supplied from the treatment liquid supply nozzle may be supplied with a new treatment liquid from the next treatment liquid supply nozzle in a state of being reduced. According to the invention of the ninth aspect, the treatment liquid discharge nozzle may be formed. The liquid supply between the liquid holding members serves to supply the processing liquid to the entire end portion of the surface of the substrate conveyed by the conveying mechanism, and thereafter, the processing liquid can be ejected from the nozzle by the liquid film of the processing liquid. Between the surface of the substrate and the surface of the substrate, the processing liquid is supplied to the surface of the substrate. Therefore, the processing liquid can be more efficiently supplied to the entire surface of the substrate. The embodiment of the present invention will be described below with reference to the drawings. Fig. 2 is a side elevational view of the substrate processing apparatus of the present invention. Fig. 2 is an enlarged view showing the side view of the cleaning unit 1. An etcher for forming an oxide film formed on the surface of the ruthenium layer before performing laser annealing on the glass substrate 100 having the amorphous ruthenium layer formed thereon. The substrate processing apparatus has a state in which the main surface thereof is horizontal a plurality of conveying rollers 9 that support the glass substrate 100 and transport the glass substrate 1 in the horizontal direction; four processes. The cleaning units la, lb, lc,

Id(.統稱該等時稱為「處理·洗淨單元丨」);及液體收集構 件71。 各處理.洗淨單元丨具備用於將處理液供給至由複數個搬 I48873.doc 201133577 送輥9搬送之玻璃基板loo之表面之處理液喷出喷嘴2;用 於在該處理液噴出喷嘴2之間形成處理液之積液之積液保 持構件3 ;及用於洗淨玻璃基板1 〇〇之背面之一對背面洗淨 部4。藉由4個處理·洗淨單元la、lb、lc、ld之作用,依序 實行對由搬送輥9搬送之玻璃基板ι00表面之處理液供給及 其背面之洗淨。 圖3係顯示由搬送輥9搬送之玻璃基板ι〇〇與液體收集構 件之71之關係的平面圖,圖4係顯示其重要部分之正視 圖。 該液體收集構件71係在由搬送輥9搬送之玻璃基板1〇〇之 搬送方向之兩側的接近或抵接於玻璃基板i 00之端緣之位 置,沿著玻璃基板100之搬送方向配設。如圖1所示,該液 體收集構件7 1具有沿著玻璃基板1 〇〇之搬送方向而延設之 長條型之形狀。該液體收集構件71如上所述,固定於玻璃 基板100之搬送方向之兩側。 該液體收集構件71更佳為與由搬送輥9搬送之玻璃基板 1〇〇之端緣相互隔離’且玻璃基板100與液體收集構件71之 距離D為2 mm以下。又,液體收集構件71之上表面之高度 位置較玻璃基板100之表面之高度位置高Η。該Η之值較佳 為由處理液喷出喷嘴2供給至玻璃基板100之表面之處理液 之膜厚以上。 藉由採用如此之構成,如後所述,可在將玻璃基板100 之表面之處理液之膜厚維持於期望之值的狀態下,一面防 止玻璃基板100與液體收集構件71之接觸,一面藉由表面 148873.doc 201133577 張力之作用,有效地將處理液供給至玻璃基板100 全域。 衣面 再者,作為該液體收集構件71之材質’較佳為採用具有 耐藥品性,且金屬離子等不會溶出,可確保處理之清潔性 的例如氟樹脂製者。 其次,說明洗淨.處理單元1之處理液喷出喷嘴2之構 成。圖5係處理液喷出噴嘴2之仰視圖。 該處理液喷出喷嘴2之構成為在與由搬送輥9搬送之玻璃 基板100對向之下面,形成有複數個處理液喷出口 21。該 等之處理液喷出口 21列設在與由搬送輥9搬送之玻璃基板 100之搬送方向正交之方向。該處理液喷出口 21例如具有 0.5 mm左右之直徑,並以5爪爪至⑺mm左右之間距,形成 於處理液噴出喷嘴2之長度方向(與由搬送輥9搬送之玻璃 基板1〇〇之搬送方向正交之方向該處理液喷出口21設置 於玻璃基板100之寬度方向(與由搬送輥9搬送之玻璃基板 100之搬送方向正交之方向)全域上。 處理玻璃基板1 〇〇時,如後所述,由該處理液噴出口 2 J 喷出處理液’供給至玻璃基板1〇〇之表面。此時,如後所 述’由於處理液喷出口 21與由搬送輥9搬送之玻璃基板1〇〇 之表面之距離,必須藉由由處理液喷出口 21所喷出之處理 液之液膜’使該等之間呈液密狀態,故較佳為盡可能小。 另一方面’若處理液喷出口 21與由搬送輥9搬送之玻璃基 板100之表面之距離過小,則玻璃基板1〇〇與處理液喷出喷 嘴2有衝撞之虞。為一面避免玻璃基板1〇〇與處理液喷出喷 148873.doc •10· 201133577 嘴之衝撞,一面藉由處理液之液膜,將處理液喷出噴嘴2 與玻璃基板100之表面之間設為液密狀態,較佳為將處理 液喷出喷嘴2之處理液噴出口21(即,處理液噴出噴嘴2之 下面)與由搬送輥9搬送之玻璃基板1〇〇之表面的距離di(參 照圖2)設為1 mm至2 mm。 又,為使處理液喷出喷嘴2與由搬送輥9搬送之玻璃基板 100之表面之間,藉由由處理液喷出口 21喷出之處理液之 液膜而呈液密狀態,較佳為將處理液噴出喷嘴2之下面之 形狀設為平面狀,或將玻璃基板1〇〇之包含搬送方向與垂 直方向之平面之剖面形狀設為下方呈凸之圓弧狀。藉由採 用如此之形狀,可於處理液喷出喷嘴2與玻璃基板1〇〇之表 面之間,形成處理液之液膜,從而可容易地達成液密狀 態。再者,為將處理液喷出喷嘴2之下面設為如上所述之 下方呈凸之圓弧狀,使處理液喷出噴嘴2包含例如令複數 個處理液噴出口形成於其下端部之導管即可。且該處理液 喷出喷嘴2之材質較佳為採用不會溶出金屬離子等,可確 保處理之清潔性的例如氟樹脂製者。 圖6係顯示對處理液喷出喷嘴2供給處理液之供給機構之 概要圖。 如圖6(a)所示,處理液喷出喷嘴2經由管路23,與保留處 理液之貯存槽22連接。該貯存槽2.2配置於較處理液喷出噴 嘴2更上方之位置,且於管路23配設有開閉閥24。因此, 藉由開放開閉閥24,貯存槽22内之處理液從處理液噴出喷 嘴2之處理液喷出口 21喷出。 148873.doc 11 201133577 圖6(b)顯示對處理液喷出喷嘴2供給處理液之供給機構 之其他之實施形態。在該實施形態中,處理液喷出喷嘴2 經由管路23,與保留處理液之貯存槽22連接,且於管路Μ 配設有泵25。在該實施形態中,藉由泵乃之驅動,貯存槽 22内之處理液從處理液喷出喷嘴2之處理液喷出口 Μ喷 出。 再者’作為處理液喷出喷嘴2之處理液喷出口 21,為防 止未處理玻璃基板1〇〇時之處理液流下,較佳為在未對供 給至其之處理液賦予壓力的狀態下,將處理液喷出口幻設 為藉由處理液之表面張力之作用處理液不會從處理液喷出 口 21流下之大小。即,係在圖6(a)所示之閉合開閉閥24 , 或圖6(b)之未驅動泵25的狀態下,藉由處理液之表面張力 之作用不使處理液從處理液噴出口 2丨流下之大小。作為該 處理液噴出口 21之大小,雖亦受處理液之粘度影響,但較 佳為如上所述設為0.5 mrn左右。 但’亦可取代列設於玻璃基板1 〇〇之搬送方向之複數個 處理液喷出口 21,採用於玻璃基板1〇〇之搬送方向延伸之 狹縫狀喷出口。 徒上述之4個處理.洗淨單元1 a、1 b、1 c、1 d,供給作為 處理液之蝕刻液。作為如此之蝕刻液,可使用例如氣酸 (氫氣酸/HF)。再者’為刻意於玻璃基板1〇〇之表面形成均 一之氧化膜’可從處理.洗淨單元la、或處理.洗淨單元Id (collectively referred to as "processing and cleaning unit"); and liquid collecting member 71. Each of the treatments and the cleaning unit 丨 is provided with a treatment liquid discharge nozzle 2 for supplying the treatment liquid to the surface of the glass substrate loo conveyed by the plurality of conveyance rollers 933, 307 201133577; for the treatment liquid discharge nozzle 2 An effusion holding member 3 for forming a effusion of the treatment liquid, and a back surface cleaning portion 4 for cleaning the back surface of the glass substrate 1 . The supply of the treatment liquid on the surface of the glass substrate ι00 conveyed by the conveyance roller 9 and the cleaning of the back surface thereof are sequentially performed by the action of the four treatment and cleaning units la, lb, lc, and ld. Fig. 3 is a plan view showing the relationship between the glass substrate ι carried by the conveying roller 9 and the liquid collecting member 71, and Fig. 4 is a front view showing an important part thereof. The liquid collecting member 71 is disposed along the conveying direction of the glass substrate 100 at a position close to or in contact with the edge of the glass substrate i 00 on both sides in the conveying direction of the glass substrate 1 that is conveyed by the conveying roller 9 . . As shown in Fig. 1, the liquid collecting member 7 1 has a long strip shape extending along the conveying direction of the glass substrate 1 . The liquid collecting member 71 is fixed to both sides of the glass substrate 100 in the conveying direction as described above. The liquid collecting member 71 is preferably separated from the edge of the glass substrate 1A conveyed by the conveying roller 9, and the distance D between the glass substrate 100 and the liquid collecting member 71 is 2 mm or less. Further, the height of the upper surface of the liquid collecting member 71 is higher than the height of the surface of the glass substrate 100. The value of the crucible is preferably equal to or greater than the film thickness of the treatment liquid supplied to the surface of the glass substrate 100 by the treatment liquid discharge nozzle 2. By adopting such a configuration, as described later, while maintaining the film thickness of the processing liquid on the surface of the glass substrate 100 at a desired value, the glass substrate 100 can be prevented from coming into contact with the liquid collecting member 71. The treatment liquid is effectively supplied to the entire glass substrate 100 by the action of the surface 148873.doc 201133577. In addition, as the material of the liquid collecting member 71, it is preferable to use a fluororesin which is chemically resistant and which does not elute metal ions or the like, and which ensures the cleanability of the treatment. Next, the configuration of the treatment liquid discharge nozzle 2 of the cleaning treatment unit 1 will be described. Fig. 5 is a bottom view of the treatment liquid ejection nozzle 2. The processing liquid discharge nozzle 2 is configured such that a plurality of processing liquid discharge ports 21 are formed on the lower surface of the glass substrate 100 conveyed by the conveying roller 9. The processing liquid discharge ports 21 are arranged in a direction orthogonal to the conveying direction of the glass substrate 100 conveyed by the conveying roller 9. The processing liquid discharge port 21 has a diameter of about 0.5 mm, for example, and is formed in the longitudinal direction of the processing liquid discharge nozzle 2 at a distance of about 5 claws to (7) mm (transportation with the glass substrate 1 conveyed by the conveying roller 9) The processing liquid discharge port 21 is provided in the direction orthogonal to the direction of the glass substrate 100 in the width direction (the direction orthogonal to the conveying direction of the glass substrate 100 conveyed by the conveying roller 9). When the glass substrate 1 is processed, As described later, the processing liquid effluent from the processing liquid discharge port 2 J is supplied to the surface of the glass substrate 1A. At this time, as described later, the processing liquid discharge port 21 and the glass substrate conveyed by the conveying roller 9 are described later. The distance from the surface of the crucible must be such that it is in a liquid-tight state by the liquid film of the treatment liquid ejected from the treatment liquid discharge port 21, so that it is preferably as small as possible. When the distance between the treatment liquid discharge port 21 and the surface of the glass substrate 100 conveyed by the conveyance roller 9 is too small, the glass substrate 1〇〇 collides with the treatment liquid discharge nozzle 2 to avoid the glass substrate 1 and the treatment liquid. Spray 148873.doc •10·201133577 When the nozzle collides, the liquid to be sprayed between the nozzle 2 and the surface of the glass substrate 100 is liquid-tight by the liquid film of the treatment liquid, preferably the treatment liquid is ejected from the nozzle 2 The distance di (see FIG. 2) between the liquid discharge port 21 (that is, the lower surface of the treatment liquid discharge nozzle 2) and the surface of the glass substrate 1A conveyed by the conveyance roller 9 is set to 1 mm to 2 mm. The liquid ejecting nozzle 2 and the surface of the glass substrate 100 transported by the transporting roller 9 are in a liquid-tight state by the liquid film of the processing liquid ejected from the processing liquid discharge port 21, and it is preferable to eject the processing liquid from the nozzle. The shape of the lower surface of the second layer is a flat shape, or the cross-sectional shape of the plane including the transport direction and the vertical direction of the glass substrate 1 is a convex arc shape. The shape can be used for the treatment liquid. A liquid film of the treatment liquid is formed between the discharge nozzle 2 and the surface of the glass substrate 1 to easily achieve a liquid-tight state. Further, the lower surface of the treatment liquid discharge nozzle 2 is as described above. The lower surface has a convex arc shape, so that the processing liquid ejection nozzle 2 includes For example, a plurality of processing liquid discharge ports may be formed in the lower end portion of the pipe. The material of the processing liquid discharge nozzle 2 is preferably made of, for example, fluororesin, which does not elute metal ions or the like, and ensures the cleanability of the treatment. Fig. 6 is a schematic view showing a supply mechanism for supplying a treatment liquid to the treatment liquid discharge nozzle 2. As shown in Fig. 6(a), the treatment liquid discharge nozzle 2 is connected to a storage tank for retaining the treatment liquid via a line 23. The storage tank 2.2 is disposed above the processing liquid discharge nozzle 2, and the opening and closing valve 24 is disposed in the line 23. Therefore, by opening the opening and closing valve 24, the processing liquid in the storage tank 22 is The treatment liquid discharge port 21 of the treatment liquid discharge nozzle 2 is discharged. 148873.doc 11 201133577 Fig. 6(b) shows another embodiment of the supply mechanism for supplying the treatment liquid to the treatment liquid discharge nozzle 2. In this embodiment, the treatment liquid discharge nozzle 2 is connected to the storage tank 22 in which the treatment liquid is retained via the line 23, and the pump 25 is disposed in the line Μ. In this embodiment, the processing liquid in the storage tank 22 is ejected from the processing liquid discharge port of the processing liquid discharge nozzle 2 by the pump. In addition, as the treatment liquid discharge port 21 of the treatment liquid discharge nozzle 2, in order to prevent the treatment liquid from flowing down when the untreated glass substrate 1 is removed, it is preferable that the pressure is not applied to the treatment liquid supplied thereto. The treatment liquid discharge port is slid to a size that the treatment liquid does not flow down from the treatment liquid discharge port 21 by the action of the surface tension of the treatment liquid. That is, in the state in which the opening and closing valve 24 is closed as shown in Fig. 6 (a) or the pump 25 is not driven in Fig. 6 (b), the treatment liquid is not discharged from the treatment liquid by the action of the surface tension of the treatment liquid. 2 The size of the stream. The size of the treatment liquid discharge port 21 is also affected by the viscosity of the treatment liquid, but it is preferably about 0.5 mrn as described above. However, it is also possible to replace the plurality of processing liquid discharge ports 21 arranged in the conveying direction of the glass substrate 1 and to use a slit-shaped discharge port extending in the conveying direction of the glass substrate 1 . The above four treatments are performed. The cleaning units 1 a, 1 b, 1 c, and 1 d are supplied as an etching liquid for the treatment liquid. As such an etching liquid, for example, a gas acid (hydrogen acid/HF) can be used. Further, 'detailively forming a uniform oxide film on the surface of the glass substrate 1' can be processed from the cleaning unit la, or treated.

Id、或處理.洗淨單元1&與id,取代餘刻液而供給臭氧 水。 148873.doc -12· 201133577 再者,作為較佳之實施形態,具有例如全部從上述之4 個處理.洗淨單元1^卜…對玻璃基板⑽供給氣 酸之實施形態,與從4個處理·洗淨單元u、I卜、Η中 於玻璃基板1〇0之搬送方向之上游側之3個處理·洗淨單元 供給敗酸,從最τ游側之處理,洗淨單元邮 給臭氧水之實施形態。但,亦可使用氣酸或臭氧水以外之 触刻液。 其次,說明洗淨,處理單元i之積液保持構件3之 圖7係顯示積液保持構件3之概要之圖,圖7⑷係積液伴持 構件3之縱剖面圖,x,圖7(b)係積液保持構们之部分平 面圖。再者,圖8係積液保持構件3之部分立體圖。 該積液保持構件3係用於在與處理液喷出喷嘴2之間形成 處理液之積液者。該積液保持構件3具備在與處理液喷出 喷嘴2之處理液喷出口21對向之位置,保持處理液之積液 之處理液保持面31。且於該處理液保持面”,凹設有處理 液之積液保持用之凹部3 2。 該凹部32用於在處理液保持面31適當地保持處理液之積 液。即’作為積液保持構件3之材質,較佳為採用不會溶 出金屬離子等’可確保處理之清潔性之與處理液喷出喷嘴 2同樣的例如氣樹脂製者。此處,氟樹脂具有排斥處理液 之強斥液性。因此’使得處理液容易從積液保持構件3之 處理液保持面31流下。為防止如此之流下,於處理液保持 面^形成有凹部32。再者’作為積液保持構件3之材質使 用氯乙烯等之樹脂的情況時,可省略該凹部Μ。 148873.doc •13- 201133577 如圖7及圖8所示,該凹部32具有於積液保持構件3之長 度方向(與由搬送輥9搬送之玻璃基板1〇〇之搬送方向正交 之方向)延伸之形狀》該凹部32形成於玻璃基板1〇〇之寬度 方向(與由搬送輥9搬送之玻璃基板100之搬送方向正交之 方向)全域上。但,該凹部32並非限定於如此之形狀。 圖9係其他之實施形態之積液保持構件3之部分立體圖。 如圖9所示’可使用列設在與由搬送輥9搬送之玻璃基板 100之搬送方向正交之方向的複數個凹部33 ^該情況時, 處理液喷出噴嘴2之處理液喷出口 21與積液保持構件3之凹 部33亦可並非對向。處理液喷出喷嘴2之處理液喷出口21 與積液保持構件3之凹部33亦可相對於由搬送輥9搬送之玻 璃基板1 00之搬送方向,位於相同之位置。 在對玻璃基板1 00供給處理液前之階段,如後所述,必 須從處理液喷出喷嘴2之處理液喷出口 21喷出處理液,於 處理液喷出喷嘴2與積液保持構件3之處理液保持面3丨之 間’形成處理液之積液。因此,處理液噴出喷嘴2與積液 保持構件3之處理液保持面3丨之距離較佳為在玻璃基板1 〇 〇 可通過之範圍内,盡可能地小。另一方面,若積液保持構 件3與由搬送輥9搬送之玻璃基板100之背面之距離過小, 則玻璃基板100與積液保持構件3有衝撞之虞。為一面避免 玻璃基板100與積液保持構件3之衝撞,一面於處理液喷出 喷嘴2與積液保持構件3之間,形成處理液之積液,較佳為 將積液保持構件3之處理液保持面31與由搬送輥9搬送之玻 璃基板1〇〇之背面之距離D2(參照圖2)設為丨mms2 mm。 148873.doc 14- 201133577 再者,形成於處理液喷出喷嘴2與積液保持構件3之處理 液保持面31之間的處理液之積液,無需形成於處理液喷出 喷嘴2與積液保持構件3之處理液保持面3丨之間之全域。例 如,在處理液喷出噴嘴2之長度方向之各個區域,亦可存 在。P刀未开’成積液之區域。若於處理液喷出喷嘴2與積液 保持構件3之處理液保持面31之間之一定區域形成積 液則由搬送輥9搬送之玻璃基板100之前端部進入積液 時,可將形成於處理液噴出噴嘴2與積液保持構件3之處理 液保持面31之間之一定區域的積液,擴展至處理液喷出噴 嘴2與積液保持構件3之處理液保持面3丨之間之全區域。 其次,說明洗淨·處理單元丨之背面洗淨部4之構成。圖 ,示背面洗淨部4之概要之圖,圖1〇⑷係背面洗淨部斗 之部,立體圖’又,圖1〇(b)係背面洗淨部4之縱剖面圖。 該背面洗淨部4係用於洗淨玻璃基板100之背面者。如圖 1及圖2所示,該背面洗淨部4在4個處理·洗淨單元la、 1 b \ 1 、c、ld中,各沿著由搬送輥9搬送之玻璃基板丨㈧之搬 〆 對配坟。該背面洗淨部4其上表面成為保持洗 二’二積液之洗淨液保持面42。且,於該洗淨液保持面 凹设有洗淨液之積液保持用之凹部Μ,且於該 3 形成有洗淨液噴出口 41。 凹部43用·^ +、丄 ;在洗淨液保持面42適當地保持洗淨液 液。即,作為昔 金屬離子等Ϊ面洗淨部4之材f,較佳為採用不會溶出 或積液保持構= 呆處理之清潔性之與處理液喷出噴嘴2 、 同樣的例如氟樹脂製者。此處,氟樹脂 I48873.doc 15- 201133577 具有排斥洗淨液之強斥液性。因此,使得洗淨液容易從背 面洗淨部4之洗淨液保持面42流下。為防止如此之流下, 於洗淨液保持面42形成有凹部43。再者,作為背面洗淨部 4之材質使用氣乙稀等之樹脂的情況時,可省略該凹部 43 ° 如圖10(a)所示’該凹部43具有於背面洗淨部4之長度方 向(與由搬送輥9搬送之玻璃基板1〇〇之搬送方向正交之方 向)延伸之形狀。該凹部43形成於玻璃基板1〇〇之寬度方向 (與由搬送輥9搬送之玻璃基板1〇〇之搬送方向正交之方向) 全域上《且,洗淨液喷出口 41沿著凹部43列設複數個。 處理玻璃基板100時’如後所述’從該洗淨液喷出口 4 i 噴出洗淨液,供給至玻璃基板1〇〇之背面。此時,如後所 述,由於洗淨液保持面42與由搬送輥9搬送之玻璃基板1〇〇 之背面之距離’必須藉由由洗淨液喷出口 41喷出之洗淨液 之液膜’使該等之間呈液密狀態,故較佳為盡可能小。另 一方面,若背面洗淨部4與由搬送輥9搬送之玻璃基板1〇〇 之背面之距離過小,則玻璃基板1〇〇與背面洗淨部4有衝撞 之虞。為一面避免玻璃基板1〇〇與背面洗淨部4之衝撞,一 面藉由洗淨液之液膜將背面洗淨部4之洗淨液保持面42與 玻璃基板100之背面之間設為液密狀態’較佳為將背面洗 淨部4之洗淨液保持面42與由搬送輥9搬送之玻璃基板i 〇〇 之背面之距離D2(參照圖2)設為1 mm至2 mm。 其次’說明藉由上述之基板處理裝置處理玻璃基板1〇〇 之處理動作。圖11至圖1 5係顯示利用本發明之基板處理裝 148873.doc • 16- 201133577 置之玻璃基板100之處理動作的說明圖《再者,在圖丨丨至 圖15,在處理.洗淨單元1之一對背面洗淨部4中,僅顯示 有上游側之背面洗淨部4。另一者之背面洗淨部4亦實行與 上游側之背面洗淨部4同樣之動作。 由複數個搬送輥9於水平方向搬送之玻璃基板1〇〇之前端 在到達處理·洗淨單元1之前,如圖11所示,從處理液喷出 噴嘴2之處理液喷出口21噴出少量處理液,並預先於處理 液喷出噴嘴2之處理液喷出口21與積液保持構件3之處理液 保持面31之間,形成有處理液之積液51。又,於背面洗淨 部4之洗淨液保持面42上,形成有洗淨液之積液61。 在該狀態下,若進而繼續由搬送輥9搬送玻璃基板1〇〇, 則如圖12所不,玻璃基板1〇〇之前端進入形成於至處理液 噴出噴嘴2與積液保持構件3之間之處理液之積液“中。若 玻璃基板100之前端到達至處理液之積液5丨,則從處理液 噴出喷嘴2喷出處理液。再者,來自處理液噴出噴嘴2之處 理液之喷出可於玻璃基板1〇〇之前端到達處理液之積液51 之刖開始,亦可於為了處理玻璃基板100而運轉裝置期 間’持續繼續喷出處理液。 在該狀態下進而於水平方向搬送玻璃基板丨〇〇之情況 日 ^·_ ^ 如圖13所不’於處理液喷出喷嘴2與玻璃基板100之表 面之間’形成處理液之液膜52,從而藉由處理液之液膜 ^使·彳于處理液喷出喷嘴2與玻璃基板1〇〇之表面之間呈液 役狀態。即,祐痛龙ρ 圾碼基板100之前端進入至形成於處理液喷 出噴驚2與積液保持構件3之間之處理液之積液5 i中後藉 148873.doc 201133577 由處理液之表面張力,使從處理液喷出喷嘴2所嘴出之處 理液擴展,D此不會被排斥而敍塗於玻璃基板⑽之表 面全域。此時,在處理液喷出喷嘴2之長度方向之各個區 域,即使部分存在未形成積液之區域,隨著玻璃基板_ 繼續移動,該等之區域亦可以處理液填滿,從而藉由處理 液之液膜52,使處理液喷出喷嘴2與玻璃基板1〇〇之表面之 間呈液密狀態。此處,所謂液録置是指該等之間全部以 處理液填滿之狀態。 且,在藉由處理液之液膜52,使處理液喷出噴嘴2與玻 璃基板100之間呈液密狀態的狀態下,於水平方向搬送玻 璃基板100,藉此,如圖14所示,在藉由處理液之液膜 52,使處理液喷出喷嘴2與玻璃基板1〇〇之表面之間呈液密 狀態的情形下’對玻璃基板100之表面全域供給處理液。 再者,玻璃基板100之前端進入至形成於處理液喷出喷 嘴2與積液保持構件3之間之處理液之積液5 i中時如圖i 2 所示’處理液亦到達玻璃基板100之背面側。該處理液藉 由背面洗淨部4洗淨。 即,如圖14所示’於水平方向搬送之玻璃基板1〇〇之前 端到達背面洗淨部4之前,於背面洗淨部4之洗淨液保持面 42(參照圖1 0) ’形成有由洗淨液喷出口 41所噴出之洗淨液 之液膜61。在該狀態下’若進而搬送玻璃基板100,通過 背面洗淨部4 ’則如圖15所示’於玻璃基板ι〇〇之背面與背 面洗淨部4之洗淨液保持面42之間,形成洗淨液之液膜 62’從而藉由洗淨液之液膜62,使玻璃基板100之背面與 148873.doc •18- 201133577 背面洗淨部4之間呈液密狀態。 在如此之狀態下,若繼續搬送玻璃基板1〇〇,則於玻璃 基板100之表面形成處理液之液獏52。且,如圖19(1^所 不,忒液膜52藉由液體收集構件71之表面張力之作用將 處理液之液膜52擴張至玻璃基板100之端緣為止。藉此, 可在將玻璃基板100之表面之處理液的膜厚維持於期望之 值的情形下,有效地將處理液供給至玻璃基板100之表面 全域。 在如此之狀態下,進而繼續搬送玻璃基板100,藉此於 玻璃基板100之表面,形成處理液之液臈52,從而對其整 面供給處理液,且於玻璃基板100之背面,形成洗淨液之 液膜62,從而洗淨其整面。 如上所述,在本發明之基板處理裝置中由於在藉由液 體收集構件71之作用,於處理液喷出噴嘴2與玻璃基板1〇〇 之表面之間,形成有處理液之液膜Μ的狀態下,使該處理 液擴張供給於玻璃基板100之表面全域,故即使在使用之 處理液之量極少的情形下,亦可將處理液供給至玻璃基板 10 0之整面。 又,如圖1所示,在該基板處理裝置中,列設有4個具有 如上所述之構成之處理·洗淨單元i。由複數個搬送輥9於 水平方向搬送之玻璃基板100藉由該等之4個處理·洗淨單 元la、lb、lc、id,依序供給處理液,且洗淨背面。因 此’即使在使用蝕刻液作為處理液之蝕刻處理的情形下, 或在開始蝕刻後使玻璃基板丨00之表面呈強斥液性之情形 I48873.doc -19- 201133577 下’均可藉由處理液之液膜52,將處理液喷出喷嘴2與破 璃基板⑽之間設為液密,#而防止蝕刻液被排斥,進而 利用4個處理.洗淨單元1a、lbH,重複該動作4次, 藉此可將作為處理液之㈣液等確實供給至玻璃基板⑽ 之表面,且伴隨於此可確實實行玻璃基板ι〇〇之背面洗 淨。 再者,在該實施形態中,雖將單一之液體收集構件71配 置於4個處理·洗淨單元la、lb、lc、此全域上,但亦可 於各處理·洗淨單元la、lb、lc、ld,個別配置液體收集構 件。 其次,說明本發明之其他實施形態。圖16係放大顯示本 發明之第2貫施形態之基板處理裝置之處理洗淨單元^之 側視圖。再者,就與上述之第丨實施形態同樣之構件,附 注相同之符號’省略詳細之說明。 在上述之第1實施形態中,使用有具有沿著玻璃基板丨〇〇 之搬送方向延設之長條型形狀之液體收集構件7 1。且,該 液體收集構件71固定於玻璃基板1〇〇之搬送方向之兩側。 相對於此,在該第2實施形態之基板處理裝置中,使用包 含捲繞於搬送輥9之環狀帶之液體收集構件72,藉此,將 該液體收集構件7 2設為與利用搬送報9之玻璃基板1 〇 〇之搬 送速度同步而移動之構成。 即’如圖16所示,包含環狀帶之液體收集構件72繞著3 個搬送輥9捲繞。且,在該3個搬送輥9中,在位於液體收 集構件72之兩端之搬送輥9,進而捲繞有其他之液體收集 148873.doc •20· 201133577 構件72。因此’於玻璃基板1 〇〇之侧方,互不相同地列設 複數個液體收集構件72,且該等之複數個液體收集構件72 沿者玻璃基板100之搬送方向延設。 如此,使用包含捲繞於搬送輥9之環狀帶之液體收集構 件72 ’在將該液體收集構件72採用與利用搬送輥9之玻璃 基板100之搬送速度同步而移動之構成的情形下,可使相 對於在液體收集構件72與玻璃基板1〇〇之間產生之處理液 之表面張力的作用更有效。 再者’如此互不相同地列設複數個液體收集構件72之情 況,為了將圖2及圖3所示之玻璃基板1〇〇與液體收集構件 71之距離D設為2 mm以下,必須將液體收集構件72自身之 寬度設為2 mm以下。 其次,進而說明本發明之其他之實施形態。圖17係放大 顯示本發明之第3實施形態之基板處理裝置之處理洗淨單 兀1之側視圖。再者,就與上述之第i實施形態同樣之構 件’附注相同之符號,省略詳細之說明。 在上述之第1、第2實施形態中,設為藉由處理液之液膜 使處理液喷出噴嘴2與玻璃基板1〇〇之間呈液密狀態之構 成,且使用用於形成積液之積液保持構件3。相對於此, 在該第3實施形態中,省略積液把持構件3,且使用用於對 玻璃基板100之表面供給相對較多量之處理液,而形成處 理液之液膜52的處理液喷出噴嘴82。 又在圖17所示之第3實施形態中,包含環狀帶之液體 收集構件73與圖16所示之第2實施形態同樣地,繞著3個搬 148873.doc •21 - 201133577 送輥9捲繞。且,該等液體收集構件73在各處理液噴出噴 嘴82之間之位置,配設於由搬送輥9搬送之玻璃基板兩 側之位置。 在採用如此之構成之情形下,在複數個處理液喷出喷嘴 82之間之位置,可藉由液體收集構件”之作用,防止處理 液之液膜52從玻璃基板1〇〇之端緣流下。因此,可於玻璃 基板100之表面全域總是維持處理液。因此,即使從處理 液喷出喷嘴82喷出相對較多量之處理液,亦可藉由液體收 集構件73將其維持於玻璃基板丨〇〇之表面,從可將處理液 有效地供給至玻璃基板100之表面全域。 其次’進而說明本發明之其他之實施形態。圖18係放大 顯示本發明之第4實施形態之基板處理裝置之處理.洗淨單 元1之側視圖。再者,就與上述之第3實施形態同樣之構 件’附注相同之符號,省略詳細之說明。 在該第4實施形態中,與第3實施形態之情況同樣地,省 略積液保持構件3,且使用有用於對玻璃基板1〇〇之表面供 給相對較多量之處理液,而形成處理液之液膜52之處理液 喷出噴嘴82。 又’在圖18所示之第4實施形態中與圖17所示之第3實 施形態同樣地,包含環狀帶之液體收集構件74繞著3個搬 送輥9捲繞。且,該等液體收集構件74分別對應於各處理 液喷出喷嘴82,複數對配設於由搬送輥9搬送之玻璃基板 1 〇〇之兩侧之位置,且在圖18中,如箭頭A所示,於該等之 複數對液體收集構件74間,形成有處理液可流下之間隙。 148873.doc -22- 201133577 在採用如此之構成之情形下,如箭頭A所示,可使從最 初之處理液供給喷嘴82供給之處理液,從液體收集構件74 間之間隙流下。因此,在先前之從處理液供給喷嘴82供給 之處理液不存在或減少之狀態下,可從下一個處理液供給 喷嘴82供給新的處理液。 因此,在從複數個處理液供給噴嘴82供給相同之處理液 之情形下’為處理玻璃基板100,可使已供給之舊的處理 液從液體收集構件74間之間隙流下後,進而藉由新的處理 液’處理玻璃基板100。 又,例如在採用在4個處理·洗淨單元la、lb、lc、ld 中,從玻璃基板100之搬送方向之上游側之3個處理.洗淨 單兀la ' lb、lc供給氟酸,而從最下游側之處理·洗淨單元 1 dt、、·’σ大氧水之貫施开> 態的情形下’在供給氟酸之處 理.洗淨單元1C與供給臭氧水之處理.洗淨單元“中,採用 如此之構成’藉此可防止氟酸與臭氧水混合。 再者,在上述之實施形態中,雖在其主面呈水平方向的 狀態下支撐玻璃基板100,並於水平方向搬送,但玻璃基 板100亦可略微傾斜。例如,即使將玻璃基板100相對於與 其搬送方向正交之方向傾斜丨度左右’亦可適用本發明。 即’本發明不限於在水平方向正確地支撐玻璃基板刚之 情況,亦可適用於大致於水平方向支撐之情況。 又,在上述之實施形態,雖對玻璃基板1〇〇之表面供 給有作為㈣液之該等,但本發明並非限定於此。例 如,本發明亦可適用於藉由對玻璃基板1〇〇供給顯影液, H8873.doc •23- 201133577 而進行顯影處理之基板處理裝置。再者,本發明亦可適用 於使用其他之處理液之基板處理裝置。 【圖式簡單說明】 圖1係本發明之基板處理裝置之側視概要圖; 圖2係放大顯示處理.洗淨單元丨之側視圖; 圖3係顯示由搬送輥9搬送之玻璃基板1〇〇與液體收集構 件之71之關係的平面圖; 圖4係顯不由搬送輥9搬送之玻璃基板丨〇〇與液體收集構 件71之重要部分的正視圖; 圖5係處理液噴出喷嘴2之仰視圖; 圖6(a)、(b)係顯示對處理液喷出喷嘴2供給處理液之供 給機構之概要圖; 圖7(a)、(b)係顯示積液保持構件3之概要之圖; 圖8係積液保持構件3之部分立體圖; 圖9係其他實施形態之積液保持構件3之部分立體圖; 圖10(a)、(b)係顯示背面洗淨部4之概要之圖; 圖11係顯不利用本發明之基板處理裝置之玻璃基板100 之處理動作的說明圖; 圖12係顯不利用本發明之基板處理裝置之玻璃基板100 之處理動作的說明圖; 圖13係顯不利用本發明之基板處理裝置之玻璃基板100 之處理動作的說明圖; 圖14係顯不利用本發明之基板處理裝置之玻璃基板1〇〇 之處理動作的說明圖; 148873.doc •24- 201133577 圖1 5係顯示利用本發明之基板處理裝置之玻璃基板1 〇〇 之處理動作的說明圖; 圖16係放大顯示本發明之第2實施形態之基板處理裝置 . 之處理·洗淨單元1的側視圖; 圖1 7係放大顯示本發明之第3實施形態之基板處理裝置 之處理.洗淨單元1的側視圖; 圖1 8係放大顯示本發明之第4實施形態之基板處理裝置 之處理·洗淨單元1的侧視圖;及 圖19⑷' (b)係顯示對玻璃基板1〇〇之表面供給處理液時 之狀態之概要圖。 【主要元件符號說明】 1 處理·洗淨單元 2 處理液喷出噴嘴 3 積液保持構件 4 背面洗淨部 9 搬送輥 21 處理液喷出口 22 貯存槽 23 管路 24 開閉閥 25 泵 31 處理液保持面 32 凹部 33 凹部 148873.doc -25- 201133577 41 42 43 52 71 72 73 74 82 100 D Η 洗淨液喷出口 洗淨液喷出口 凹部 液膜 液體收集構件 液體收集構件 液體收集構件 液體收集構件 處理液喷出喷嘴 玻璃基板 距離 玻璃基板之表面之高度位置高 148873.doc -26·Id, or treatment. The cleaning unit 1 & and id, instead of the residual liquid, supplies ozone water. 148873.doc -12· 201133577 Further, as a preferred embodiment, for example, all of the above-described four processes, the cleaning unit, and the like, are supplied to the glass substrate (10). The three processing and cleaning units on the upstream side in the transport direction of the glass substrate 1〇0 in the cleaning unit u, I, and 供给 are supplied with rancid acid, and the cleaning unit is mailed to the ozone water from the most τ side. Implementation form. However, it is also possible to use a contact liquid other than sulphuric acid or ozone water. Next, the cleaning of the liquid holding member 3 of the processing unit i will be described with reference to Fig. 7 showing a schematic view of the liquid holding member 3, and Fig. 7 (4) is a longitudinal sectional view of the liquid holding member 3, x, Fig. 7 (b) ) A partial plan view of the effusion holding structure. In addition, FIG. 8 is a partial perspective view of the fluid holding member 3. The liquid holding member 3 is used for forming a liquid repellency between the processing liquid and the processing liquid discharge nozzle 2. The liquid holding member 3 is provided with a processing liquid holding surface 31 that holds the liquid of the processing liquid at a position opposed to the processing liquid discharge port 21 of the processing liquid discharge nozzle 2. The concave portion 32 for holding the liquid for the treatment liquid is recessed in the treatment liquid holding surface. The concave portion 32 is for appropriately holding the liquid of the treatment liquid on the treatment liquid holding surface 31. The material of the member 3 is preferably made of, for example, a gas resin which is the same as the treatment liquid discharge nozzle 2 which can ensure the cleanability of the treatment without eluting metal ions, etc. Here, the fluororesin has a repulsion of the repellent treatment liquid. Therefore, the processing liquid is easily discharged from the processing liquid holding surface 31 of the liquid holding member 3. In order to prevent such a flow, the concave portion 32 is formed on the processing liquid holding surface. Further, as the liquid holding member 3 When a resin such as vinyl chloride is used as the material, the concave portion 可 can be omitted. 148873.doc • 13- 201133577 The concave portion 32 is provided in the longitudinal direction of the liquid holding member 3 as shown in Figs. 7 and 8 The shape in which the direction in which the glass substrate 1 is transported by the roller 9 is perpendicular to the direction in which the transport direction is orthogonal is formed. The recessed portion 32 is formed in the width direction of the glass substrate 1 (orthogonal to the transport direction of the glass substrate 100 transported by the transport roller 9) Direction The recessed portion 32 is not limited to such a shape. Fig. 9 is a partial perspective view of the effusion holding member 3 of another embodiment. As shown in Fig. 9, 'can be used in a row and transported by the transport roller 9. The plurality of concave portions 33 in the direction in which the glass substrate 100 is conveyed in the direction orthogonal to each other. In this case, the processing liquid discharge port 21 of the processing liquid discharge nozzle 2 and the concave portion 33 of the liquid storage holding member 3 may not be opposed to each other. The processing liquid discharge port 21 of the discharge nozzle 2 and the recessed portion 33 of the liquid storage holding member 3 may be located at the same position with respect to the conveyance direction of the glass substrate 100 conveyed by the conveyance roller 9. The processing liquid is supplied to the glass substrate 100. In the previous stage, as described later, it is necessary to eject the treatment liquid from the treatment liquid discharge port 21 of the treatment liquid discharge nozzle 2 between the treatment liquid discharge nozzle 2 and the treatment liquid holding surface 3 of the liquid retention member 3. The formation liquid of the treatment liquid is formed. Therefore, the distance between the treatment liquid discharge nozzle 2 and the treatment liquid holding surface 3 of the liquid retention member 3 is preferably as small as possible within the range in which the glass substrate 1 can pass. On the other hand, if the fluid is insured When the distance between the member 3 and the back surface of the glass substrate 100 conveyed by the conveying roller 9 is too small, the glass substrate 100 collides with the liquid holding member 3. When the glass substrate 100 and the liquid holding member 3 are prevented from colliding, Between the processing liquid ejecting nozzle 2 and the liquid holding member 3, an effusion of the processing liquid is formed, and it is preferable that the processing liquid holding surface 31 of the liquid holding member 3 and the glass substrate 1 conveyed by the conveying roller 9 are The distance D2 (see FIG. 2) of the back surface is set to 丨mms2 mm. 148873.doc 14-201133577 Further, the treatment liquid formed between the treatment liquid discharge nozzle 2 and the treatment liquid holding surface 31 of the liquid retention member 3 The liquid accumulation does not need to be formed in the entire area between the treatment liquid discharge nozzle 2 and the treatment liquid holding surface 3 of the liquid accumulation holding member 3. For example, it may exist in various regions in the longitudinal direction of the treatment liquid discharge nozzle 2. The P knife is not open' into the area of the effusion. When liquid is formed in a certain area between the processing liquid discharge nozzle 2 and the processing liquid holding surface 31 of the liquid holding member 3, the front end of the glass substrate 100 conveyed by the conveying roller 9 enters the liquid accumulation, and can be formed in the liquid. The liquid in a certain area between the processing liquid discharge nozzle 2 and the processing liquid holding surface 31 of the liquid holding member 3 is extended to between the processing liquid discharge nozzle 2 and the processing liquid holding surface 3 of the liquid holding member 3. All regions. Next, the configuration of the back surface cleaning unit 4 of the cleaning and processing unit 说明 will be described. The figure shows the outline of the back surface cleaning part 4, and Fig. 1 (4) is a part of the back surface cleaning part hopper, and the perspective view is further shown in Fig. 1 (b) is a longitudinal sectional view of the back surface cleaning part 4. The back surface cleaning unit 4 is used to clean the back surface of the glass substrate 100. As shown in FIG. 1 and FIG. 2, the back surface cleaning unit 4 moves along the glass substrate (eight) conveyed by the conveyance roller 9 in each of the four processing and cleaning units la, 1 b \ 1 , c, and ld. 〆 配 对 对. The back surface cleaning portion 4 has a cleaning liquid holding surface 42 on which the upper surface of the cleaning portion 4 is held. Further, a recess Μ for holding the liquid for the cleaning liquid is recessed in the cleaning liquid holding surface, and a cleaning liquid discharge port 41 is formed in the third. The recessed portion 43 is provided with a cleaning liquid, and the cleaning liquid is appropriately held on the cleaning liquid holding surface 42. In other words, it is preferable that the material f of the kneading surface cleaning unit 4 such as a metal ion is used in the same manner as the treatment liquid discharge nozzle 2, which is made of a fluororesin, which does not elute or maintain the liquid retention structure. By. Here, the fluororesin I48873.doc 15- 201133577 has a strong repellency of the repellent liquid. Therefore, the cleaning liquid is easily discharged from the cleaning liquid holding surface 42 of the back surface cleaning portion 4. In order to prevent such a flow, a recess 43 is formed in the cleaning liquid holding surface 42. In the case where a resin such as ethylene oxide is used as the material of the back surface cleaning portion 4, the concave portion 43° can be omitted. As shown in FIG. 10(a), the concave portion 43 has the longitudinal direction of the back surface cleaning portion 4. The shape which extends (direction orthogonal to the conveyance direction of the glass substrate 1 conveyed by the conveyance roller 9). The concave portion 43 is formed in the width direction of the glass substrate 1 (in a direction orthogonal to the conveyance direction of the glass substrate 1 that is conveyed by the conveyance roller 9), and the cleaning liquid discharge port 41 is along the concave portion 43. Set a plurality. When the glass substrate 100 is processed, the cleaning liquid is ejected from the cleaning liquid discharge port 4 i as will be described later, and is supplied to the back surface of the glass substrate 1 . At this time, as described later, the distance between the cleaning liquid holding surface 42 and the back surface of the glass substrate 1 that is conveyed by the conveying roller 9 must be the liquid of the cleaning liquid sprayed by the cleaning liquid discharge port 41. The membrane ' is such that it is in a liquid-tight state, so it is preferably as small as possible. On the other hand, when the distance between the back surface cleaning portion 4 and the back surface of the glass substrate 1A conveyed by the conveyance roller 9 is too small, the glass substrate 1A and the back surface cleaning portion 4 collide with each other. In order to prevent the collision between the glass substrate 1 and the back surface cleaning portion 4, the liquid cleaning film of the cleaning liquid 4 is used as a liquid between the cleaning liquid holding surface 42 of the back surface cleaning portion 4 and the back surface of the glass substrate 100. In the dense state, it is preferable that the distance D2 (see FIG. 2 ) of the cleaning liquid holding surface 42 of the back surface cleaning unit 4 and the back surface of the glass substrate i 搬 conveyed by the conveying roller 9 is 1 mm to 2 mm. Next, the processing operation of processing the glass substrate 1 by the substrate processing apparatus described above will be described. Fig. 11 to Fig. 1 are explanatory views showing the processing operation of the glass substrate 100 provided by the substrate processing apparatus 148873.doc • 16-201133577 of the present invention. Further, in Fig. 15 to Fig. 15, in the treatment. In the back surface cleaning unit 4 of one of the units 1, only the back side cleaning unit 4 on the upstream side is displayed. The other side of the back surface cleaning unit 4 also performs the same operation as the back side cleaning unit 4 on the upstream side. When the front end of the glass substrate 1 that has been transported in the horizontal direction by the plurality of transport rollers 9 reaches the processing and cleaning unit 1, as shown in FIG. 11, a small amount of processing is ejected from the processing liquid discharge port 21 of the processing liquid discharge nozzle 2. The liquid is preliminarily formed between the treatment liquid discharge port 21 of the treatment liquid discharge nozzle 2 and the treatment liquid holding surface 31 of the liquid storage holding member 3, and the liquid storage 51 of the treatment liquid is formed. Further, on the cleaning liquid holding surface 42 of the back surface cleaning portion 4, the effusion liquid 61 of the cleaning liquid is formed. In this state, if the glass substrate 1 is further conveyed by the transport roller 9, the front end of the glass substrate 1 is formed between the processing liquid discharge nozzle 2 and the liquid holding member 3 as shown in FIG. When the front end of the glass substrate 100 reaches the effusion of the treatment liquid 5 丨, the treatment liquid is ejected from the treatment liquid discharge nozzle 2. Further, the treatment liquid from the treatment liquid discharge nozzle 2 The discharge can be started after the effusion 51 of the treatment liquid reaches the front end of the glass substrate, and the processing liquid can be continuously continued during the operation of the apparatus for processing the glass substrate 100. In this state, the horizontal direction is further When the glass substrate is transferred, the liquid film 52 of the processing liquid is formed between the processing liquid ejection nozzle 2 and the surface of the glass substrate 100 as shown in FIG. The membrane is in a liquid state between the treatment liquid ejection nozzle 2 and the surface of the glass substrate 1〇〇, that is, the front end of the Painlong ρ refuse code substrate 100 is formed to be formed in the treatment liquid spray spurt 2 The product of the treatment liquid with the fluid holding member 3 5 i and then borrowed 148873.doc 201133577 The surface tension of the treatment liquid spreads the treatment liquid from the mouth of the treatment liquid spray nozzle 2, and D is not repelled and is applied to the entire surface of the glass substrate (10). In the respective regions in the longitudinal direction of the treatment liquid discharge nozzle 2, even if there is a portion where the liquid accumulation is not formed, the glass substrate _ continues to move, and the regions can be filled with the treatment liquid, thereby treating the liquid The liquid film 52 is in a liquid-tight state between the processing liquid discharge nozzle 2 and the surface of the glass substrate 1 . Here, the liquid recording means a state in which all of the liquid is filled with the processing liquid. In the state in which the liquid ejecting nozzle 2 and the glass substrate 100 are in a liquid-tight state by the liquid film 52 of the processing liquid, the glass substrate 100 is conveyed in the horizontal direction, whereby, as shown in FIG. When the liquid film 52 of the processing liquid is in a liquid-tight state between the surface of the processing liquid discharge nozzle 2 and the glass substrate 1 ', the processing liquid is supplied to the entire surface of the glass substrate 100. Further, the glass substrate The front end of 100 enters to form a discharge of the treatment liquid When the liquid immersion 5 i of the treatment liquid between the nozzle 2 and the liquid holding member 3 is as shown in Fig. i 2, the treatment liquid also reaches the back side of the glass substrate 100. The treatment liquid is washed by the back surface cleaning unit 4. In other words, as shown in Fig. 14, the front end of the glass substrate 1 that has been transported in the horizontal direction reaches the back surface cleaning unit 4, and the cleaning liquid holding surface 42 of the back surface cleaning unit 4 (see Fig. 10) is formed. There is a liquid film 61 of the cleaning liquid sprayed from the cleaning liquid discharge port 41. In this state, if the glass substrate 100 is further conveyed, the back surface cleaning portion 4' is as shown in Fig. 15 on the glass substrate. Between the back surface of the crucible and the cleaning liquid holding surface 42 of the back surface cleaning portion 4, a liquid film 62' of the cleaning liquid is formed, whereby the liquid film 62 of the cleaning liquid is used to make the back surface of the glass substrate 100 and 148873.doc. 18- 201133577 The back side cleaning parts 4 are in a liquid-tight state. In this state, when the glass substrate 1 is continuously conveyed, the liquid helium 52 of the treatment liquid is formed on the surface of the glass substrate 100. Further, as shown in Fig. 19 (1), the liquid film 52 expands the liquid film 52 of the treatment liquid to the edge of the glass substrate 100 by the action of the surface tension of the liquid collecting member 71. Thereby, the glass can be used. When the film thickness of the processing liquid on the surface of the substrate 100 is maintained at a desired value, the processing liquid is efficiently supplied to the entire surface of the glass substrate 100. In this state, the glass substrate 100 is further conveyed, thereby being used for the glass. On the surface of the substrate 100, the liquid helium 52 of the treatment liquid is formed, and the treatment liquid is supplied to the entire surface thereof, and the liquid film 62 of the cleaning liquid is formed on the back surface of the glass substrate 100 to wash the entire surface. In the substrate processing apparatus of the present invention, in the state in which the liquid film 处理 of the processing liquid is formed between the processing liquid discharge nozzle 2 and the surface of the glass substrate 1 by the action of the liquid collecting member 71, Since the treatment liquid is expanded and supplied to the entire surface of the glass substrate 100, even when the amount of the treatment liquid to be used is extremely small, the treatment liquid can be supplied to the entire surface of the glass substrate 100. Further, as shown in FIG. Processing on the substrate In the middle, four processing and cleaning units i having the above-described configuration are arranged in a row. The glass substrate 100 conveyed in the horizontal direction by a plurality of conveying rollers 9 is subjected to the four processing and cleaning units la, Lb, lc, id, sequentially supply the treatment liquid, and wash the back surface. Therefore, even in the case of using an etching solution as an etching treatment for the treatment liquid, or after starting the etching, the surface of the glass substrate 丨00 is made to be a strong repellency liquid. In the case of I48873.doc -19- 201133577, the liquid film 52 of the treatment liquid can be used to make the liquid immersion nozzle 2 and the glass substrate (10) liquid-tight, and the etching liquid is prevented from being repelled. Furthermore, the four processes, the cleaning units 1a and 1bH, are repeated four times, whereby the liquid (4) or the like as the processing liquid can be surely supplied to the surface of the glass substrate (10), and the glass substrate can be surely carried out. In the embodiment, the single liquid collecting member 71 is disposed in the four processing and cleaning units la, lb, and lc, but the entire processing and washing is performed. Net unit la, lb, lc, ld, individual configuration liquid collection structure Next, another embodiment of the present invention will be described. Fig. 16 is a side elevational view showing the processing and cleaning unit of the substrate processing apparatus according to the second aspect of the present invention, which is the same as the above-described third embodiment. In the first embodiment described above, the liquid collecting member 71 having an elongated shape extending along the conveying direction of the glass substrate 使用 is used. The liquid collecting member 71 is fixed to both sides of the glass substrate 1 in the transport direction. In contrast, in the substrate processing apparatus according to the second embodiment, a liquid including an endless belt wound around the conveying roller 9 is used. The collecting member 72 is configured to move the liquid collecting member 72 in synchronization with the transport speed of the glass substrate 1 by the transport report 9. That is, as shown in Fig. 16, the liquid collecting member 72 including the endless belt is wound around the three conveying rollers 9. Further, among the three conveying rollers 9, the conveying roller 9 located at both ends of the liquid collecting member 72 is further wound with another liquid collecting member 148873.doc • 20· 201133577 member 72. Therefore, a plurality of liquid collecting members 72 are arranged differently from each other on the side of the glass substrate 1, and the plurality of liquid collecting members 72 are extended in the conveying direction of the glass substrate 100. In the case where the liquid collecting member 72' including the endless belt wound around the conveying roller 9 is moved in synchronization with the conveying speed of the glass substrate 100 by the conveying roller 9, the liquid collecting member 72' can be used. The effect of the surface tension of the treatment liquid generated between the liquid collection member 72 and the glass substrate 1 is more effective. In the case where a plurality of liquid collecting members 72 are arranged differently from each other, in order to set the distance D between the glass substrate 1A and the liquid collecting member 71 shown in FIGS. 2 and 3 to 2 mm or less, it is necessary to The width of the liquid collecting member 72 itself is set to 2 mm or less. Next, other embodiments of the present invention will be described. Fig. 17 is a side elevational view showing the process cleaning unit 1 of the substrate processing apparatus according to the third embodiment of the present invention. The same components as those in the above-described first embodiment are denoted by the same reference numerals, and the detailed description thereof will be omitted. In the above-described first and second embodiments, the liquid ejecting nozzle 2 and the glass substrate 1 are in a liquid-tight state by the liquid film of the processing liquid, and the liquid is used to form the liquid. The effusion holding member 3. On the other hand, in the third embodiment, the liquid holding member 3 is omitted, and the processing liquid for forming the liquid film 52 of the processing liquid is supplied by using a relatively large amount of the processing liquid for supplying the surface of the glass substrate 100. Nozzle 82. Further, in the third embodiment shown in Fig. 17, the liquid collecting member 73 including the endless belt is fed around the three transports 148873.doc • 21 - 201133577 in the same manner as the second embodiment shown in Fig. 16 . Winding. Further, the liquid collecting members 73 are disposed at positions on both sides of the glass substrate conveyed by the conveying roller 9 at positions between the respective processing liquid discharge nozzles 82. In the case of such a configuration, at a position between the plurality of processing liquid ejection nozzles 82, the liquid film 52 of the treatment liquid can be prevented from flowing from the edge of the glass substrate 1 by the action of the liquid collecting member. Therefore, the treatment liquid can be always maintained over the entire surface of the glass substrate 100. Therefore, even if a relatively large amount of the treatment liquid is ejected from the treatment liquid discharge nozzle 82, it can be maintained on the glass substrate by the liquid collection member 73. The surface of the crucible can be efficiently supplied to the entire surface of the glass substrate 100. Next, another embodiment of the present invention will be described. Fig. 18 is an enlarged view showing a substrate processing apparatus according to a fourth embodiment of the present invention. The processing unit of the third embodiment is denoted by the same reference numerals, and the detailed description thereof will be omitted. In the fourth embodiment, the third embodiment is used. In the same manner, the liquid holding member 3 is omitted, and a treatment liquid for supplying a relatively large amount of the treatment liquid to the surface of the glass substrate 1 to form the liquid film 52 of the treatment liquid is used. In the fourth embodiment shown in FIG. 18, similarly to the third embodiment shown in FIG. 17, the liquid collecting member 74 including the endless belt is wound around the three conveying rollers 9. Further, the liquid collecting members 74 correspond to the respective processing liquid discharge nozzles 82, and the plurality of pairs are disposed at positions on both sides of the glass substrate 1 that is conveyed by the conveying roller 9, and in FIG. As shown, between the plurality of liquid collecting members 74, a gap in which the treatment liquid can flow is formed. 148873.doc -22- 201133577 In the case of such a configuration, as indicated by the arrow A, the initial The processing liquid supplied from the processing liquid supply nozzle 82 flows down from the gap between the liquid collecting members 74. Therefore, in the state where the processing liquid supplied from the processing liquid supply nozzle 82 is not present or reduced, the next processing liquid can be removed from the next processing liquid. The supply nozzle 82 supplies a new processing liquid. Therefore, when the same processing liquid is supplied from a plurality of processing liquid supply nozzles 82, the old processing liquid can be supplied from the liquid collecting member 74. Gap flow Then, the glass substrate 100 is processed by a new processing liquid. Further, for example, three of the four processing and cleaning units la, lb, lc, and ld are used from the upstream side in the transport direction of the glass substrate 100. Treatment. Washing the unit 兀la ' lb, lc to supply the fluoric acid, and from the most downstream side of the treatment and cleaning unit 1 dt, · ' σ ○ big oxygen water open> in the case of 'in the supply of fluorine Acid treatment. Washing unit 1C and treatment of supplying ozone water. The cleaning unit "in this configuration" prevents the mixing of hydrofluoric acid and ozone water. Further, in the above-described embodiment, the glass substrate 100 is supported while being horizontal in the main surface, and is transported in the horizontal direction. However, the glass substrate 100 may be slightly inclined. For example, the present invention can be applied even if the glass substrate 100 is inclined by a right angle with respect to a direction orthogonal to the direction in which it is conveyed. That is, the present invention is not limited to the case where the glass substrate is correctly supported in the horizontal direction, and may be applied to the case where it is supported substantially in the horizontal direction. Further, in the above-described embodiment, the surface of the glass substrate 1 is supplied with the liquid (4), but the present invention is not limited thereto. For example, the present invention is also applicable to a substrate processing apparatus which performs development processing by supplying a developing solution to a glass substrate 1H, H8873.doc • 23-201133577. Furthermore, the present invention is also applicable to a substrate processing apparatus using other processing liquids. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side elevational view of a substrate processing apparatus of the present invention; Fig. 2 is an enlarged view showing a side view of a cleaning unit; and Fig. 3 is a view showing a glass substrate conveyed by a conveying roller 9; FIG. 4 is a front view showing an important portion of the glass substrate 丨〇〇 and the liquid collecting member 71 which are not carried by the conveying roller 9; FIG. 5 is a bottom view of the processing liquid discharging nozzle 2. 6(a) and 6(b) are schematic views showing a supply mechanism for supplying a treatment liquid to the treatment liquid discharge nozzle 2; and Figs. 7(a) and 7(b) are views showing an outline of the liquid retention member 3; Fig. 8 is a partial perspective view of the liquid holding member 3; Fig. 9 is a partial perspective view of the liquid holding member 3 of the other embodiment; Figs. 10(a) and (b) are views showing the outline of the back surface cleaning unit 4; 11 is an explanatory view showing a processing operation of the glass substrate 100 of the substrate processing apparatus of the present invention; FIG. 12 is an explanatory view showing a processing operation of the glass substrate 100 not using the substrate processing apparatus of the present invention; Glass base using the substrate processing apparatus of the present invention FIG. 14 is an explanatory view showing a processing operation of a glass substrate 1 without using the substrate processing apparatus of the present invention; 148873.doc • 24-201133577 FIG. 1 shows a use of the present invention. FIG. 16 is a side view showing the processing and cleaning unit 1 of the substrate processing apparatus according to the second embodiment of the present invention. FIG. The processing of the substrate processing apparatus according to the third embodiment of the present invention, the side view of the cleaning unit 1 and the side view of the processing and cleaning unit 1 of the substrate processing apparatus according to the fourth embodiment of the present invention are shown in an enlarged manner; 19(4)' (b) is a schematic view showing a state in which a processing liquid is supplied to the surface of the glass substrate 1A. [Description of main components] 1 Processing and cleaning unit 2 Processing liquid discharge nozzle 3 Liquid holding member 4 Back surface cleaning unit 9 Transfer roller 21 Processing liquid discharge port 22 Storage tank 23 Line 24 Opening and closing valve 25 Pump 31 Treatment liquid Retaining surface 32 recess 33 recess 148873.doc -25- 201133577 41 42 43 52 71 72 73 74 82 100 D Η cleaning liquid discharge port cleaning liquid discharge port recess liquid film liquid collecting member liquid collecting member liquid collecting member liquid collecting member The height at which the processing liquid ejects the nozzle glass substrate from the surface of the glass substrate is 148873.doc -26·

Claims (1)

201133577 七、申請專利範圍: 1· 一種基板處理裝置,其特徵為具備有: 搬迗機構,其在其主面呈大致水平方向的狀態下,支 ㈣形之基板,且於大致水平方向搬送該基板; 處理液喷出噴嘴’其將朝向下方之處理液喷出口延設 - 在與利用上述搬送機構之基板之搬送方向交叉之方向, 且用於對由上述搬送機構搬送之基板之表面供給處理 液;及 液體收集構件,其在上述基板之搬送方向之兩側沿 著上述基板之搬送方向,配設於接近或抵接於上述基板 之端緣之位置’ _§_其上表面之高度位置係配置於上述基 板之表面之高度位置以上的位置,並藉由表面張力之作 用,使由上述處理液喷出噴嘴供給至上述基板之表面之 處理液擴張至上述基板之端緣為止。 2·如請求項1之基板處理裴置,其中上述液體收集構件之 表面之南度位置,係以成為由上述處理液喷出噴嘴供 給至上述基板之表面的處理液之膜厚以上的方式,配置 於尚於上述基板之表面之高度位置的位置。 3. 如請求項2之基板處理裝置,其中上述液體收集構件與 上述基板之端緣相互隔離,且上述液體收集構件與上述 基板之端緣之距離為2 mm以下。 4. 如請求項3之基板處理裝置,其中上述液體收集構件具 有著上述基板之搬送方向而延設之長條型之形狀,並 固定於上述基板之搬送方向之兩側。 148873.doc 201133577 5.如請求項3之基板處理裝置, 其中上述液體收集構件沿201133577 VII. Patent application scope: 1. A substrate processing apparatus characterized by comprising: a loading mechanism that supports a (four)-shaped substrate in a state in which a main surface thereof is substantially horizontal, and conveys the object in a substantially horizontal direction a processing liquid ejecting nozzle that extends toward the processing liquid ejecting port that is downward-in a direction intersecting the transport direction of the substrate by the transport mechanism, and for supplying surface treatment to the substrate transported by the transport mechanism And a liquid collecting member disposed at a position close to or abutting the edge of the substrate in a direction in which the substrate is conveyed on both sides of the transfer direction of the substrate: a position of the upper surface of the substrate It is disposed at a position above the height of the surface of the substrate, and the treatment liquid supplied from the processing liquid discharge nozzle to the surface of the substrate is expanded to the edge of the substrate by the action of the surface tension. 2. The substrate processing apparatus according to claim 1, wherein the southmost position of the surface of the liquid collecting member is equal to or larger than a film thickness of the processing liquid supplied to the surface of the substrate by the processing liquid discharge nozzle. The position is disposed at a height position of the surface of the substrate. 3. The substrate processing apparatus according to claim 2, wherein the liquid collecting member is isolated from an edge of the substrate, and a distance between the liquid collecting member and an edge of the substrate is 2 mm or less. 4. The substrate processing apparatus according to claim 3, wherein the liquid collecting member has a strip shape extending in a direction in which the substrate is conveyed, and is fixed to both sides of the substrate in the conveying direction. 148873.doc 201133577 5. The substrate processing apparatus of claim 3, wherein the liquid collecting member is along 板之搬送速度同步移動。The transport speed of the board moves synchronously. 其下面支撐、旋轉基板之搬送輥,且 上述液體收集構件包含捲繞於上述搬送輥之環狀帶。 如請求項6之基板處理裝置,其中上述處理液喷出喷嘴 相互隔離複數個配設於利用上述搬送機構之基板之搬送 方向,且 包含上述環狀帶之液體收集構件在上述複數個處理液A conveyance roller that supports and rotates the substrate, and the liquid collection member includes an endless belt wound around the conveyance roller. The substrate processing apparatus according to claim 6, wherein the processing liquid ejection nozzles are separated from each other by a plurality of liquid collecting members disposed in a conveying direction of the substrate by the conveying mechanism, and the liquid collecting member including the endless belt is in the plurality of processing liquids 送之基板之兩側之位置。 8, 如請求項6之基板處理裝置,其中上述處理液喷出喷嘴 相互隔離複數個配設於利用上述搬送機構之基板之搬送 方向,且 包含上述環狀帶之液體收集構件分別對應於上述複數 個處理液噴出喷嘴,複數對配設於由上述搬送機構搬送 之基板之兩側之位置’且於上述複數對之液體收集構件 間,形成有處理液可流下之間隙。 9. 如請求項1至8中任一項之基板處理裝置,其中上述處理 液喷出噴嘴係配置於:上述處理液噴出口與由上述搬送 機構搬送之基板之表面之距離係藉由由上述處理液喷出 口喷出之處理液之液膜使該等之間呈液密狀態的位置,且 具備將處理液之積液保持在與處理液噴出口對向之位 148873.doc 201133577 置的處理液保持面,進而具備積液保持構件,其係配置 在於上述處理液喷出口與上述處理液保持面之距離係可 在該等之間形成處理液之積液之位置。 148873.docThe position of the two sides of the substrate. 8. The substrate processing apparatus according to claim 6, wherein the processing liquid ejection nozzles are separated from each other by a plurality of transporting directions disposed in a transport direction of the substrate by the transport mechanism, and the liquid collecting members including the annular strips respectively correspond to the plurality of Each of the processing liquid discharge nozzles has a plurality of positions disposed on both sides of the substrate conveyed by the transfer mechanism, and a gap through which the processing liquid can flow is formed between the plurality of pairs of liquid collecting members. 9. The substrate processing apparatus according to any one of claims 1 to 8, wherein the processing liquid ejection nozzle is disposed at a distance between the processing liquid ejection port and a surface of the substrate conveyed by the conveying mechanism The liquid film of the treatment liquid sprayed from the liquid discharge port is in a liquid-tight state, and the treatment for holding the liquid of the treatment liquid at a position opposite to the discharge port of the treatment liquid is 148873.doc 201133577. The liquid holding surface further includes a liquid holding member disposed at a position at which the distance between the processing liquid discharge port and the processing liquid holding surface is such that a liquid of the processing liquid is formed between the liquid. 148873.doc
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