TW201128797A - Groove machining tool for use with a thin-film solar cell and an angle regulation structure - Google Patents
Groove machining tool for use with a thin-film solar cell and an angle regulation structure Download PDFInfo
- Publication number
- TW201128797A TW201128797A TW99143640A TW99143640A TW201128797A TW 201128797 A TW201128797 A TW 201128797A TW 99143640 A TW99143640 A TW 99143640A TW 99143640 A TW99143640 A TW 99143640A TW 201128797 A TW201128797 A TW 201128797A
- Authority
- TW
- Taiwan
- Prior art keywords
- tool
- groove
- holder
- tool body
- groove processing
- Prior art date
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 31
- 238000003754 machining Methods 0.000 title claims abstract description 10
- 239000010408 film Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 4
- 230000001105 regulatory effect Effects 0.000 claims 1
- 230000000717 retained effect Effects 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 14
- 230000000149 penetrating effect Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 1
- 208000004350 Strabismus Diseases 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052951 chalcopyrite Inorganic materials 0.000 description 1
- -1 chalcopyrite compound Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/10—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/137—Batch treatment of the devices
- H10F71/1375—Apparatus for automatic interconnection of photovoltaic cells in a module
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0304—Grooving
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/929—Tool or tool with support
- Y10T83/9457—Joint or connection
- Y10T83/9488—Adjustable
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010002498A JP2011142236A (ja) | 2010-01-08 | 2010-01-08 | 薄膜太陽電池用の溝加工ツール及びその角度規制構造 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201128797A true TW201128797A (en) | 2011-08-16 |
Family
ID=43825397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW99143640A TW201128797A (en) | 2010-01-08 | 2010-12-14 | Groove machining tool for use with a thin-film solar cell and an angle regulation structure |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20110167978A1 (enExample) |
| EP (1) | EP2343172A1 (enExample) |
| JP (1) | JP2011142236A (enExample) |
| KR (1) | KR20110081761A (enExample) |
| CN (1) | CN102130216A (enExample) |
| TW (1) | TW201128797A (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5361967B2 (ja) * | 2011-09-28 | 2013-12-04 | 三星ダイヤモンド工業株式会社 | 基板の溝加工ツール |
| JP5779465B2 (ja) * | 2011-09-28 | 2015-09-16 | 三星ダイヤモンド工業株式会社 | 基板の溝加工装置 |
| JP2014188599A (ja) * | 2013-03-26 | 2014-10-06 | Mitsuboshi Diamond Industrial Co Ltd | 溝加工ツール、及びこれを用いた溝加工装置 |
| CN103600371A (zh) * | 2013-12-02 | 2014-02-26 | 吴中区甪直渡岘工艺品厂 | 一种角度可调模版夹具 |
| JP6406006B2 (ja) * | 2014-03-28 | 2018-10-17 | 三星ダイヤモンド工業株式会社 | 溝加工ツール並びにこの溝加工ツールを取り付けたスクライブ装置 |
| JP6406005B2 (ja) * | 2014-05-29 | 2018-10-17 | 三星ダイヤモンド工業株式会社 | ツールホルダ及び溝加工装置 |
| JP6582743B2 (ja) * | 2015-08-27 | 2019-10-02 | 三星ダイヤモンド工業株式会社 | 切断ツールおよび刃物 |
| CN107053316A (zh) * | 2017-06-22 | 2017-08-18 | 浙江美力凯光电科技有限公司 | 一种安全型自动裁切机 |
| CN109545902B (zh) * | 2018-12-10 | 2024-07-30 | 蚌埠凯盛工程技术有限公司 | 一种太阳能薄膜电池基板的识别装置 |
| CN119188876B (zh) * | 2024-11-27 | 2025-02-28 | 泉州市多乐油脂科技有限公司 | 一种人造奶油加工用分切设备及其分切方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1179753A (en) * | 1916-01-19 | 1916-04-18 | Harry Percival Parrock | Tool. |
| US2431566A (en) * | 1945-05-23 | 1947-11-25 | John F Kopczynski | Die |
| US4732069A (en) * | 1987-05-08 | 1988-03-22 | Gerber Scientific Products, Inc. | Knife and knife holder assembly |
| US5046389A (en) * | 1989-12-06 | 1991-09-10 | Micron Technology, Inc. | Universal punch block apparatus |
| JPH0680509U (ja) * | 1993-04-26 | 1994-11-15 | 大昭和精機株式会社 | サイドロック式工具チャック |
| JPH10328922A (ja) * | 1997-06-02 | 1998-12-15 | Canon Inc | 細溝加工方法及び装置及び細溝加工用切刃及び切刃保持装置 |
| JP2000315809A (ja) * | 1999-03-04 | 2000-11-14 | Matsushita Electric Ind Co Ltd | 集積型薄膜太陽電池の製造方法およびパターニング装置 |
| JP2002033498A (ja) | 2000-07-17 | 2002-01-31 | Matsushita Electric Ind Co Ltd | 集積型薄膜太陽電池の製造方法およびパターニング装置 |
| JP2004306209A (ja) * | 2003-04-08 | 2004-11-04 | Mst Corporation | 旋削工具ホルダ |
| TWI380868B (zh) * | 2005-02-02 | 2013-01-01 | Mitsuboshi Diamond Ind Co Ltdl | Fine processing method of sintered diamond using laser, cutter wheel for brittle material substrate, and method of manufacturing the same |
| US9132567B2 (en) * | 2007-03-23 | 2015-09-15 | Dayton Progress Corporation | Tools with a thermo-mechanically modified working region and methods of forming such tools |
| JP5114115B2 (ja) * | 2007-07-03 | 2013-01-09 | 株式会社ディスコ | バイトユニット |
| CN201168796Y (zh) * | 2008-02-04 | 2008-12-24 | 映钒企业有限公司 | 组合式车刀结构 |
| US20110126688A1 (en) * | 2008-05-26 | 2011-06-02 | Masanobu Soyama | Scribing apparatus for thin film solar cell |
| JP2010002498A (ja) | 2008-06-18 | 2010-01-07 | Sony Corp | パネルおよび駆動制御方法 |
-
2010
- 2010-01-08 JP JP2010002498A patent/JP2011142236A/ja active Pending
- 2010-12-14 TW TW99143640A patent/TW201128797A/zh unknown
- 2010-12-28 KR KR1020100136622A patent/KR20110081761A/ko not_active Ceased
- 2010-12-29 US US12/981,191 patent/US20110167978A1/en not_active Abandoned
-
2011
- 2011-01-05 EP EP20110150199 patent/EP2343172A1/en not_active Withdrawn
- 2011-01-07 CN CN2011100026506A patent/CN102130216A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP2343172A1 (en) | 2011-07-13 |
| US20110167978A1 (en) | 2011-07-14 |
| JP2011142236A (ja) | 2011-07-21 |
| KR20110081761A (ko) | 2011-07-14 |
| CN102130216A (zh) | 2011-07-20 |
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