TW201128797A - Groove machining tool for use with a thin-film solar cell and an angle regulation structure - Google Patents

Groove machining tool for use with a thin-film solar cell and an angle regulation structure Download PDF

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Publication number
TW201128797A
TW201128797A TW99143640A TW99143640A TW201128797A TW 201128797 A TW201128797 A TW 201128797A TW 99143640 A TW99143640 A TW 99143640A TW 99143640 A TW99143640 A TW 99143640A TW 201128797 A TW201128797 A TW 201128797A
Authority
TW
Taiwan
Prior art keywords
tool
groove
holder
tool body
groove processing
Prior art date
Application number
TW99143640A
Other languages
English (en)
Chinese (zh)
Inventor
Masanobu Soyama
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201128797A publication Critical patent/TW201128797A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/10—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/137—Batch treatment of the devices
    • H10F71/1375—Apparatus for automatic interconnection of photovoltaic cells in a module
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0304—Grooving
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9457—Joint or connection
    • Y10T83/9488—Adjustable

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Photovoltaic Devices (AREA)
TW99143640A 2010-01-08 2010-12-14 Groove machining tool for use with a thin-film solar cell and an angle regulation structure TW201128797A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010002498A JP2011142236A (ja) 2010-01-08 2010-01-08 薄膜太陽電池用の溝加工ツール及びその角度規制構造

Publications (1)

Publication Number Publication Date
TW201128797A true TW201128797A (en) 2011-08-16

Family

ID=43825397

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99143640A TW201128797A (en) 2010-01-08 2010-12-14 Groove machining tool for use with a thin-film solar cell and an angle regulation structure

Country Status (6)

Country Link
US (1) US20110167978A1 (enExample)
EP (1) EP2343172A1 (enExample)
JP (1) JP2011142236A (enExample)
KR (1) KR20110081761A (enExample)
CN (1) CN102130216A (enExample)
TW (1) TW201128797A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5779465B2 (ja) * 2011-09-28 2015-09-16 三星ダイヤモンド工業株式会社 基板の溝加工装置
JP5361967B2 (ja) * 2011-09-28 2013-12-04 三星ダイヤモンド工業株式会社 基板の溝加工ツール
JP2014188599A (ja) * 2013-03-26 2014-10-06 Mitsuboshi Diamond Industrial Co Ltd 溝加工ツール、及びこれを用いた溝加工装置
CN103600371A (zh) * 2013-12-02 2014-02-26 吴中区甪直渡岘工艺品厂 一种角度可调模版夹具
JP6406006B2 (ja) * 2014-03-28 2018-10-17 三星ダイヤモンド工業株式会社 溝加工ツール並びにこの溝加工ツールを取り付けたスクライブ装置
JP6406005B2 (ja) * 2014-05-29 2018-10-17 三星ダイヤモンド工業株式会社 ツールホルダ及び溝加工装置
JP6582743B2 (ja) * 2015-08-27 2019-10-02 三星ダイヤモンド工業株式会社 切断ツールおよび刃物
CN107053316A (zh) * 2017-06-22 2017-08-18 浙江美力凯光电科技有限公司 一种安全型自动裁切机
CN109545902B (zh) * 2018-12-10 2024-07-30 蚌埠凯盛工程技术有限公司 一种太阳能薄膜电池基板的识别装置
US12495804B2 (en) * 2024-02-27 2025-12-16 Hundred Machinery Enterprise Co., Ltd. Cutting, forming, and adjusting device for food processing machine
CN119188876B (zh) * 2024-11-27 2025-02-28 泉州市多乐油脂科技有限公司 一种人造奶油加工用分切设备及其分切方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1179753A (en) * 1916-01-19 1916-04-18 Harry Percival Parrock Tool.
US2431566A (en) * 1945-05-23 1947-11-25 John F Kopczynski Die
US4732069A (en) * 1987-05-08 1988-03-22 Gerber Scientific Products, Inc. Knife and knife holder assembly
US5046389A (en) * 1989-12-06 1991-09-10 Micron Technology, Inc. Universal punch block apparatus
JPH0680509U (ja) * 1993-04-26 1994-11-15 大昭和精機株式会社 サイドロック式工具チャック
JPH10328922A (ja) * 1997-06-02 1998-12-15 Canon Inc 細溝加工方法及び装置及び細溝加工用切刃及び切刃保持装置
JP2000315809A (ja) * 1999-03-04 2000-11-14 Matsushita Electric Ind Co Ltd 集積型薄膜太陽電池の製造方法およびパターニング装置
JP2002033498A (ja) 2000-07-17 2002-01-31 Matsushita Electric Ind Co Ltd 集積型薄膜太陽電池の製造方法およびパターニング装置
JP2004306209A (ja) * 2003-04-08 2004-11-04 Mst Corporation 旋削工具ホルダ
TWI380868B (zh) * 2005-02-02 2013-01-01 Mitsuboshi Diamond Ind Co Ltdl Fine processing method of sintered diamond using laser, cutter wheel for brittle material substrate, and method of manufacturing the same
US9132567B2 (en) * 2007-03-23 2015-09-15 Dayton Progress Corporation Tools with a thermo-mechanically modified working region and methods of forming such tools
JP5114115B2 (ja) * 2007-07-03 2013-01-09 株式会社ディスコ バイトユニット
CN201168796Y (zh) * 2008-02-04 2008-12-24 映钒企业有限公司 组合式车刀结构
KR101193929B1 (ko) * 2008-05-26 2012-10-23 미쓰보시 다이야몬도 고교 가부시키가이샤 박막 태양전지의 스크라이브 장치
JP2010002498A (ja) 2008-06-18 2010-01-07 Sony Corp パネルおよび駆動制御方法

Also Published As

Publication number Publication date
EP2343172A1 (en) 2011-07-13
US20110167978A1 (en) 2011-07-14
KR20110081761A (ko) 2011-07-14
JP2011142236A (ja) 2011-07-21
CN102130216A (zh) 2011-07-20

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