TW201120377A - Led illuminator - Google Patents

Led illuminator Download PDF

Info

Publication number
TW201120377A
TW201120377A TW099121497A TW99121497A TW201120377A TW 201120377 A TW201120377 A TW 201120377A TW 099121497 A TW099121497 A TW 099121497A TW 99121497 A TW99121497 A TW 99121497A TW 201120377 A TW201120377 A TW 201120377A
Authority
TW
Taiwan
Prior art keywords
light
layer
led
led lighting
led element
Prior art date
Application number
TW099121497A
Other languages
Chinese (zh)
Inventor
Tatsuichiro Kon
Original Assignee
Teijin Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teijin Ltd filed Critical Teijin Ltd
Publication of TW201120377A publication Critical patent/TW201120377A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/008—Combination of two or more successive refractors along an optical axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/02—Combinations of only two kinds of elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/02—Combinations of only two kinds of elements
    • F21V13/04—Combinations of only two kinds of elements the elements being reflectors and refractors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/0018—Redirecting means on the surface of the light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/002—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/0045—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Planar Illumination Modules (AREA)

Abstract

Provided is a LED illuminator which does not adversely affect user's eyes, and is excellent in lightweight properties, design properties, and electrical reliability. The LED illuminator is characterized by comprising the following components, (1) a LED element, (2) a light transmissive layer having a surface opposite to the light emitting surface-side of the LED element, wherein a light emitted from the LED element passes through the surface, and a light guiding diffusion layer which is provided on the opposite side of the surface opposite to the LED element and which has a function to most intensively emit the light which has passed through the surface within an angular region of 45 DEG or more and 135 DEG or less with respect to the vertical direction of the LED element, and (3) a surrounding housing of the LED element.

Description

201120377 六、發明說明： 【發明所屬之技術領域】 本發明乃有關使用發光二極體（LED)於光源之照明 具’即有關可成爲進行LED照明光之指向性或點徑之控 制而利於眼睛之照明，在輕量性、設計性、電性可靠性（ 絕緣可靠性）、落地安全性等優異，具有充分熱可靠性（ 散熱性）、機械可靠性（機械強度）的LED照明具者。 【先前技術】 近年以來，普遍開始將具有省能源、長壽命之特徵之 發光二極體（LED )使用於光源之照明具，做爲替代白織 電炮、鹵素燈、氪燈等之以往光源。（例如專利文獻1、 2 ) [先前技術文獻] [專利文獻] [專利文獻1]日本特開2009-93926號公報 [專利文獻2]日本特開2001-243809號公報 【發明內容】 [發明欲解決之課題] 但是在之前所提案之LED照明具與白織電炮、鹵素 燈、氪燈等之以往之各種照明用光源對比之時，照明光所 需之指向性控制（配光分布、點徑等之控制）難以稱爲充 -5- 201120377 分，又易於成爲源自LED元件之點光源狀之照明光之故 ，當直視之時會變得非常危險，有著不能成爲利用眼睛之 照明的問題。 [爲解決課題之手段] 本發明之LED照明具乃關於前述解決課題，爲至少 具備以下之構成要素爲特徵之LED照明具。 1 ) LED元件 2 )從相對於前述LED元件之發光面側之面，入射前 述LED元件之射出光的光透過性之層、和設於與相對於 前述光透過性之層之前述LED元件之發光面的面在相反 側之面，將前述入射之射出光，對於前述LED元件之發 光面之鉛直方向而言，在45度以上且135度以下之角度 範圍，具有射出較其他之角度範圍強光之機能的導光擴散 層 3)入射從前述導光擴散層之射出光的LED元件之周 圍框體 又，本發明乃前述導光擴散層，在入射於該導光擴散 層之LED射出光之全光量中，具有從該導光擴散層，對 於鉛直方向而言，射出至45度以上、1 3 5度以下之角度 範圍的光量，較從與相對於該導光擴散層之LED元件之 面之相反側面，對於鉛直方向而言，射出至〇度以上不足 45度之角度範圍的光量爲大之機能者爲特徵之LED照明 具0 -6- 201120377 又’本發明乃於相對於前述導光擴散層之前述LED 元件之面、或挾持於前述導光擴散層與前述LED元件之 空間內，具備折射來自前述LED元件之射出光，於前述 鉛直方向，收斂前述射出光之進行方向的光折射透鏡者爲 特徵之LED照明具。 又，本發明亦包含具備具有光反射性之反射面之框體 ，具有將來自導光擴散層之射出光，以該反射面反射，沿 前述鉛直方向射出之框體爲特徵之LED照明具。 又，更且，本發明乃關於LED元件之散熱，具備至 少層之一部分接近配置於LED元件，對於至少一方向之 熱傳導率爲2W/m · K，平均厚度爲0.5〜10mm之熱傳導 層之LED照明具。 又，內藏LED元件之發光控制用電子電路，LED元 件發光控制用電子電路爲體積阻抗爲1〇ηΩ· cm以上， 厚度方向之IEC61000基準之靜電破壞電壓爲5kV以上， 絕緣破壞電壓爲〇.5kV以上，包圍在平均厚度0.3〜3mm 電性絕緣層之LED照明具，該電性絕緣層乃V型切口耐 衝擊強度爲5kJ/m2以上之層之LED照明具。 又，更且，於不相對於形成在LED元件發光控制用 電子電路之周圍之電性絕緣層之發光驅動控制電路側之面 的至少一部分，層積形成熱傳導層的LED照明具。 更且，本發明乃前述LED元件之周圍框體及/或光 透過性覆蓋層及/或導光擴散層及/或電性絕緣層乃成形 樹脂或樹脂組成物之層的LED照明具。 201120377 然後，更且本發明乃LED元件之周圍框體，在該底 面部分按壓LED安裝基板之至少一部分之形式，固定於 LED照明具內之LED照明具者。 [發明之效果] 此等之本發明LED照明具乃可得進行LED照明光之 指向性或點徑之控制，而利於眼睛之照明，又對於LED 照明具之構成零件，經由多使用樹脂成型材料，可做爲在 輕量性、設計性、電性可靠性（絕緣可靠性）、落地安全 性等爲優異’具有充分熱可靠性（散熱性）、機械可靠性 (機械強度）的LED照明具，利用在廣泛之用途上。 【實施方式】 本發明之LED照明具如前所述，爲至少具備以下之 構成要素爲特徵之LED照明具。 1 )做爲光源之LED元件 2)接近LED元件之射出面側而設置之光透過性之層 中，於相對LED元件之面與相反側之層表面，形成約略 逆圓錐狀之凹部所成之全反射面，於將LED元件之射出 光導光至LED元件之鉛直方向後，在全反射面加以全反 射’對於鉛直方向而言，在45度以上，135度以下之角 度範圍’具有射出最強光之機能的導光擴散層 3 ) LED元件之周圍框體 然而’在此錯直方向乃指LED元件之發光面（平面 201120377 )爲基準時’與發光面垂直之方向。又’平面方向乃 LED元件之發光面（平面）爲基準時’與發光面平行之 向。 又，更且，本發明之LED照明具乃做爲與已知光 中多做爲點光源使用之附有鏡面之鹵素燈（分色鹵素燈 等之類似之可控制光之指向性（配光分布）之led照 具而言，LED元件之周圍框體之至少一部分具有光反射 之框體中，具有從導光擴散層之射出光乃在具有光反射 之框體面，反射光線之後，從光透過性覆蓋層向外部射 之光學系統的LED照明具者。 以下，對於本發明之實施形態，順序加以說明。 [LED照明具之具體構造例] 將本發明之LED照明具之具體構造例，例示於圖〗 6、 21〜24、 27、 31、 39、 40、 42 及 43。圖 42、 43 乃 圖24之LED照明具從斜方向觀察時之外觀圖，圖中， 電性絕緣層12上，存在3次元賦型層19。又，圖1〜ί 圖2 1〜2 4、2 7、3 1、3 9、及4 0乃例示L E D照明具之剖 圖之例。圖42、43之A — Α’之剖面圖例乃對應於圖 之LED照明具之例。然而，剖面之切斷面之位置，乃 示於圖1〜6、21〜23、27、31、39及40乃例示LED 明具亦相同》此等乃共通具有導光擴散層3。於導光擴 層3中，於與相對LED元件1之面與相反側之面（圖 記號3a所示全反射面、和圖26記號3b所示深淵部面 指 方 源 ) 明 性 性 出 將 於 > 面 2 4 例 照 散 25 之 -9- 201120377 2個所成之面），形成約略逆圓錐狀之凹部所成全反射面 (圖5之全反射面3a )，將LED元件1之射出光導光至 LED元件1之鉛直方向（圖中之縱方向）之後，於全反射 面3 a，多數之光線則全反射至導光擴散層3內。 在此約略逆圓錐狀之凹部乃指圖25之記號3a所示全 反射面之剖面圖所見之V字谷形狀之部分，雖共通有圖 1〜6、9 ' 14〜28、31之各例之記號3所示之導光擴散層， 非僅爲完全直線所成V字，亦包含多少成爲曲線狀之V 字形狀。即，以3次元形狀加以表現時，包含完全之逆圓 錐形之凹形狀、和多少成爲曲面狀之大約逆圓錐形之凹形 狀。本發明中，配合此等，本說明書以「約略逆圓錐狀之 凹部」加以表現。 根據此全反射，將導光至鉛直方向之許多之LED射 出光之進行方向，從鉛直方向變換示平面方向（圖中橫方 向）’在對於從導光擴散層3向鉛直方向而言45度以上 、1 3 5度以下之角度範圍（例示於LED元件1之相對位置 26之圖32 )，射出最強之光。 在此’ 「射出最強之光」乃指入射至導光擴散層3之 LED射出光之全光量中，從導光擴散層3對於鉛直方向而 言’射出至45度以上、135度以下之角度範圍之光量， 至少較從與相對導光擴散層3之LED元件1之面相反側 之面（圖25記號3a所示之全反射面、和圖26記號3b所 示之深淵部面之2個所成之面），對於鉛直方向而言，射 出至〇度以上不足45度之角度範圍之光量爲大者。 -10- 201120377 即’此等LED照明具中’ LED元件1所射出之光乃 經由導光擴散層3之下面入射後，向錯直方向層內導光之 後，於導光擴散層3上面之全反射面3a，其大部分接受 全反射’於變換行進方向之後，射出導光擴散層3。雖會 由於導光擴散層3之形狀有所不同，在全反射面3 a接受 全反射之光’在許多情形下’成爲從導光擴散層3之側面 (圖25記號3d所示之面）射出之形式。在此，經由使用 適切形狀之導光擴.散層3，可對於鉛直方向而言，在45 度以上、1 3 5度以下之角度範圍，射出強光。 在此’一般而言’ LED元件1乃除了將特別之光學透 鏡層積於元件上之情形等之外，則以鉛直方向爲中心射出 光線，光射之擴展方式爲少。即，一般而言，對於鉛直方 向而言，在〇度以上不足45度之角度範圍所射出之光量 ，爲佔LED元件1之全射光量之50%以上。 如此，一般而言，對於以鉛直方向爲中心射出之L E D 射出光而言，本發明之導光擴散層乃具有對於鉛直方向而 言，在45度以上，135度以下之角度範圍，變換光線之 行進路徑之機能之故，可使光之射出方向大爲擴展。 如前所述，不使用本發明之導光擴散層之以往LED 照明具時，LED射出光爲直進性，光之擴展方式爲小之故 ，只要不遠離LED照明具，每一射出光之剖面積之能量 (光束密度）爲大，尤其在高照度之LED照明具中，會 產生無法直視之光線’光線對於眼睛而言不柔和等之問題 -11 - 201120377 對此，使用本發明之導光擴散層之led照明具時， 抑制LED射出光之直進性，使光之擴展變大之故，每射 出光之剖面積之能量（光束密度）相對會變小，而成爲對 眼睛柔和之光線。 又，本發明之LED照明具中，如此將以導光擴散層 擴展之光線，以另外設置之具有光反射性之框體反射面 6a加以反射之形式之LED照明具中，經由框體反射面6a 之傾斜角度或形狀之控制，窄化反射後之光射出之角度分 布，而可得到接近該平行光線之指向性爲高之LED照明 光線。 此時，具有較LED元件1之射出面大許多之面積的 框體反射面6a，則做爲擬似光源加以工作之故，LED元 件1之直接射出光則與強烈看來像點光源狀者不同，是爲 面狀之光線之故，即使設計成射出光之角度分布狹窄，指 向性爲強之時，亦可使成爲對於眼睛柔和之光線》 圖1〜3、21、23、24、27乃與多做爲點照明使用之 已知之鹵素燈等類似之光之指向性（配光分布）可被控制 之LED照明具。此等之LED照明具中，LED元件之周圍 框體4中，使用至少該一部分具有光反射性之框體反射面 6 a者。 於此等之LED照明具中，從導光擴散層3，對於鉛直 方向而言，向45度以上、135度以下之角度範圍射出之 光線乃在框體反射面6a，接受反射，再於以鉛直方向爲 中心之方向，變換行進方向，之後，通過光透過性覆蓋層 -12- 201120377 5 ’向LED照明具外部射出。 在此，導光擴散層3上面之約略逆圓錐狀凹部之形成 面乃看來像是在此有光源的樣子，即做爲擬似光源而加以 工作。經由如此系統，可成爲使與以往之附有鏡子之圈素 燈（二色性鹵素燈）等在外觀上類似而無不適應感，且可 適於做爲點光源之具有配光分布之LED照明具。 然而，如例示於對應在圖27之圖37之記號28之光 路，本發明之LED照明具中，LED元件1之射出光之一 部分，則從框體反射面6a以外之部位，即從具有光透過 性之部分，直接射出至外部空間亦可。此乃經由故意在 LED照明具之側面側、後方側，洩漏一部分之光線，賦予 LED照明具從側面側、後方側視之時仍能美觀地發亮之設 計效果、以及式樣性爲目的者。然而，本目的乃經由如例 示在對應於圖27之圖38之符號29之光路，使框體反射 面6a透過一部分之光線，其他成爲加以反射之半透過光 反射性（半反射鏡等），透過此半透過反射性之部位，向 外部空間射出之方法加以實現。 如此，於LED照明具之側面側、後方側故意漏出一 部分之光線時，令LED照明具之全光束爲100之時，對 於全光束而言，令透過或通過周圍框體，從周圍框體之外 周面射出光束之比例成爲1〜40之範圍，較佳爲2〜30之 範圍，更佳爲3〜20之範圍者爲佳。前述比例爲不足1之 爲小之時，光之洩漏無法充分被辨視，設計效果，式樣性 等之賦予易於變得不充分。又’比例爲超過40爲大之時 -13- 201120377 ’射出至LED照明具之鉛直方向之光量會變得不充分， 爲得必要照度之下，不喜好爲此之情形較多。 如此，如前所述，於LED照明具之側面側、後方側 不故意漏出一部分之光線時，令LED照明具之全光束爲 100之時，對於全光束而言，令透過或通過周圍框體，從 周圍框體之外周面射出光束之比例爲不足1者爲佳。 然而，在此，從LED照明具向外部空間射出之光束 量（全光量）乃於專用測定裝置之積分反射球之中央，配 設LED照明具，將從LED照明具向外部空間射出之光線 ，在積分反射球之表面反射，將此反射光聚光於受光感測 器，進行光強度之測定進而算出。又，透過或通過周圍框 體，從周圍框體之外周面射出之光束量乃例如取下LED 照明具之光透過性覆蓋層5，經由替換成光吸收性之黑色 板（本發明測定之時，使用光透過率0%、光吸收率97% 以上之光吸收性之黑色板）等之手段，在完全遮蔽從LED 照明具向鉛直方向射出之光線上，於使用前述同樣之積分 反射球之光強度之測定加以算出。 然而，使用具有此等光反射性之框體之LED照明具 之光射出角度分布之控制乃經由導光擴散層3與框體反射 面6a之形狀等之設計而加以進行。整體設計上，在框體 反射面6a之設計自由度儘可能爲高者爲佳之關係下，從 導光擴散層3之光射出角度範圍設計成較前述適切範圍多 少爲窄者爲佳。 即，設計成較佳爲從導光擴散層3對於鉛直方向而言 -14- 201120377 ’爲50度以上13〇度以下之角度範圍，更佳爲55度以上 ’ 125度以下之角度範圍，最佳爲60度以上，κο度以下 之角度範圍所射出之光量，較從與導光擴散層3之LED 元件1相對之面相反側之面，對於鉛直方向而言，向〇度 以上’不足45度之角度範圍之光量爲大者爲佳。 又’從導光擴散層3之射出光之光束乃設計成到達框 體反射面6a之前，暫時具有收斂點者爲佳，此時，可令 本收斂點爲焦點之拋物面、雙曲面等做爲框體反射面6a 之形狀或成爲該基礎之形狀加以利用。然而，收斂點乃非 嚴密之點，可爲在進行光學設計上，不會造成大的困擾之 程度之大小亦可。 又，圖4〜6、22、31之例乃與前述圖1〜3、21、23 、24、27之例不同，LED元件1之周圍框體4乃大部分 成爲光透過性。從導光擴散層3，對於鉛直方向而言，向 45度以上，135度以下之角度範圍射出之光線乃透過LED 元件1之周圍框體4，向LED照明具之外部，以廣角度範 圍加以射出。於此等之LED照明具中，從LED照明具儘 可能向廣角度射出光線而加以設計者爲佳之情形爲多，從 導光擴散層3之射出方向乃對於鉛直方向而言，使向45 度以上，135度以下之角度範圍之射出比率成爲最大爲前 提，包含其他以外之角度範圍，儘可能成爲角度廣範圍者 爲佳。 在此，導光擴散層3上面之約略逆圓錐狀凹部之形成 面乃看來像是在此有光源的樣子，即做爲擬似光源而加以 -15- 201120377 工作。經由如此系統，可成爲使與以往之球型燈泡、小型 氪燈等在外觀上類似而無不適應感，且具有非常廣角之配 光分布之LED照明具。 然而，於此例示之LED照明具中，熱傳導層2、導光 擴散層3、LED元件1之周圍框體4、LED元件1之周圍 框體4之螺絲嵌合部4a、光透過性覆蓋層5、框體反射面 6a、光反射層形成部位6b、LED元件1發光控制用電子 電路之配置空間7、礙子部8、接點9a、9b、電性絕緣層 1 0、電性絕緣層（兼補強層）1 2、低熱阻抗層3、LED安 裝基板1 4、表面保護用電性絕緣性薄膜5、黏著薄片6、 低熱阻.抗性之黏著層或散熱膏層1 7、頂板層1 8、3次元 賦型層形成部位19、第1之散熱層20、第2之散熱層21 、光折射透鏡23 (圖3 1 )、光反射性之光反射層24 (圖 3 1 )乃將各圖所記從正面所視之剖面圖，以縱軸方向旋轉 之形狀者，做上面圖而言，看似爲圓形或同心圓之形狀。 惟，在各零件之組合之關係上，有在於圓周方向除去一部 分，成爲圓弧狀之情形。 當然，本發明之熱傳導性樹脂複合成形體或LED照 明裝置之構造非限定於此等之例示者，亦包含上面圖成爲 多角形之形狀，可有各種之形式版本。又，各構成零件間 依需要，可經由黏著劑或螺絲鎖定等加以固定爲佳。又， 依需要，爲不使水分進入，可進行密封性優異黏著劑，或 密封材料之倂用等。 -16- 201120377 [LED元件1] 乃做爲LED照明具之光源所使用之發光二極體（LED )型之發光元件。於本發明中，由於做爲LED照明具可 得充分照度、光學設計上之觀點、構造小型化之觀點，使 用晶片型之高輸出LED者爲佳，做爲定額輸出適於使用 0.5W以上，較佳爲1 W以上，更佳爲2W以上者。發光色 乃無特別之限定，可利用各種色溫者，或爲了達著色目的 者，但在使用於泛用用途之時，使用類似市售之已知燈泡 之燈泡色型或白色型之LED元件1者爲佳。 LED元件1 一般而言人做爲元件特性，雖規定有內部 之熱阻抗，但以內部之熱阻抗爲小者爲佳，較佳爲20°C /W以下，更佳爲10t /W以下者，更甚者乃使用5°C /W 以下者爲佳。 LED元件1可使用1個，亦可使用複數個。配設LED 元件1之位置乃經由光學性設計（指向性、配光分布之設 計）之觀點視之，考量後述之導光擴散層3、周圍框體4 (於內面配設光反射層6 a )之位置關係，設於適切之位 置。例如，如圖1所例示之LED照明具，導光擴散層3 ( 圓柱狀）、周圍框體4 (半球狀）皆爲旋轉對稱之形狀之 時，於使用1個LED元件之時，設於旋轉中心之軸附近 之位置爲佳。又，複數個使用LED元件1之時’使此等 之重心位置會來到旋轉中心之軸附近加以配設’且LED 元件1相互儘可能臨接地加以配設者爲佳。 -17- 201120377 [導光擴散層3] 導光擴散層3乃由接近設於LED元件1之射出面側 之光透過性之素材所成，具有約略逆圓錐狀之凹部形狀部 位，導光從LED元件1之光線加以擴散之層。約略逆圓 錐狀之凹部形狀部位乃成爲全反射面3a。在此，「光透 過性」乃指做爲本發明之LED照明具之發光源使用之 LED元件1之主發光波長帶中，光透過率爲高之意思，更 具體而言，定義爲將形成導光擴散層3之材料，成型成厚 度2mm之平板狀，以該400〜70 Onm之可視波長範圍，測 定光透過率之時，前述波長範圍中之至少2 Onm寬度（例 如 400〜42Qnm ' 540〜560nm等）之波長帶域下，具有 70%以上之光透過率者。在此，光透過率較佳爲80%以 上，更佳爲85%以上，最佳爲90%以上。又，對於光透 過率成爲70 %之波長範圍或帶域之大小無特別之限制， 例如使用白色之LED元件1之時，除了爲使照明光著色 ，於導光擴散層3本身具有光吸收性之情形之外，於400 〜700nm之波長整體，具有70%以上之光透過率者爲佳 〇 本發明之導光擴散層3乃如前所述，於相對LED元 件1之面與相反側之層表面，形成約略逆圓錐狀之凹部所 成之全反射面3a，於將LED元件1射出光導光至LED元 件1之鉛直方向後，在全反射面3 a加以全反射，對於鉛 直方向而言’在45度以上，135度以下之角度範圍，具 有射出最強光之機能的層。 -18- 201120377 即，導光擴散層3乃至少具有使從導光擴散層3對於 鉛直方向而言，向45度以上135度以下之角度範圍射出 之光量，較從與導光擴散層3之LED元件1相對之面相 反側之面，對於鉛直方向而言，向0度以上，不足4 5度 之角度範圍射出之光量爲大者之機能者爲佳。 即’令從導光擴散層3對於錯直方向而言，向45度 以上135度以下之角度範圍射出之光量爲1〇〇之時，從與 導光擴散層3之LED元件1相對之面相反側之面，對於 鉛直方向而言，向0度以上，不足45度之角度範圍射出 之光量乃較佳爲70以下，更佳爲50以下，更甚者爲30 以下，最佳爲2 0以下。 關於前述約略逆圓錐狀之凹部之形狀，非限定於完全 之約略逆圓錐狀者，亦包含類似其之形狀，例如包含其錐 面多少成爲曲面者（例如圖4或圖6之符號3 )。即，即 使不是完全之逆圓錐狀，只要可做爲全反射面3a加以工 作之類似形狀即可。 即，約略逆圓錐狀之凹部乃對於入射於該部之光而言 ，可做爲全反射面3 a加以工作之故，對於鉛直方向而言 ，具有一定之傾斜者爲佳。入射光之入射角度僅爲鉛直方 向之時，於全反射之臨界角條件，雖可決定傾斜之適切範 圍，但實際上，入射光之入射角度對於鉛直方向而言，具 有某種程度之參差之時，對於鉛直方向而言，在約0〜60 度之範圍內加以傾斜者爲佳。即，對於與約略逆圓錐狀之 凹部所形成之導光擴散層3之LED元件1相對之面相反 19- 201120377 側之表面之總面積而言，就鉛直方向而言，在0〜6 0度之 傾斜角範圍之面之積算面積佔50%以上者爲佳。 約略逆圓錐狀之凹部乃如前述，雖以滿足挾著反射面 之2個媒質之折射率差與向反射面之光入射角所定之全反 射條件的全反射面之形狀者爲最佳，但可依需要，於約略 逆圓錐狀之凹部上，層積光反射率高之金屬層，介電質層 等之單層膜或層積膜亦可。 然而，於導光擴散層3之LED元件1側之面，或挾 持於導光擴散層3與LED元件1之空間內，折射及或反 射來自LED元件1之射出光，令鉛直方向爲中心，收斂 光之行進方向，於前述約略逆圓錐狀之凹部所成全反射面 3a，具有提高直接射入之光之比例之機能的光學層者爲佳 。本光學層之設置乃在提高LED元件1射出光之光利用 效率上，或在得到本發明之目的之人可直視柔和之照明光 的目的上爲佳者。做爲此等之光學層，例如可列舉具有凹 凸形狀之光折射透鏡（例如圖25之符號3c之凸透鏡）、 菲涅鏡、利用空氣界面之全反射或高光反射率之反射層所 成光反射之反射鏡等。 此等之中，由於在有限之空間中可有效率收斂光線者 、提高全反射層之光入射效率者，在於全反射層之光入射 角度之控制性優異者等之理由下，尤其以具有凸透鏡狀之 光折射面之透鏡者可被有利地加以使用。 光折射透鏡乃配置於導光擴散層3之LED元件1側 之面者爲佳，對於LED元件1而言，設於透鏡成爲凸狀 -20- 201120377 之朝向者爲佳。又，就情形而言，除導光擴散層3之外， 設置光折射透鏡爲佳，配置於挾持於導光擴散層3與LED 元件1之空間內。後者之情形下，導光擴散層3與光折射 透鏡可爲直接層積，亦可爲隔一定距離（就情形而言，可 介入有空氣層等）加以分離配置亦可。例如，例示於圖4 〜6之球狀電燈型之本發明之LED照明具中，進行將做爲 擬似光源工作之全反射層之位置，配置於球狀之周圍框體 4之中心附近之設計時’有需取得大的導光擴散層3之全 反射面3 a與LED元件1之空間距離的必要。此時，光學 設計上，不使光折射透鏡與LED元件1之空間距離變大 ，取得大的光折射透鏡與導光擴散層3之空間距離者爲佳 之情形爲多，考量導光擴散層3內部之光吸收所造成之光 損失或零件重量之提升、成形收縮所造成之形狀精度之下 降等，有以分離配置爲佳之情況。 然而，如圖 31、 33、 34、 35、 36、 39、 40、 41 所例 示，包圍LED元件1之周圍，或LED元件1與導光擴散 層3或光折射透鏡23(圖31)之一部分之形式下’設置 光反射率50%以上之光反射層24亦可。光反射層24乃 將LED元件1之射出光之中，採取不直接入射於導光擴 散層3之光路之光線，即將不向設有導光擴散層3或光折 射透鏡2 3 (圖3 1 )之方向射出之光’暫時加以反射’經 由入射至導光擴散層3或光折射透鏡23 (圖3 1 )，提高 入射至導光擴散層3之光線的總量’提高光之利用效率爲 其目的所在。然而，光反射層24乃如圖31、39、40、41 -21 - 201120377 所例示，兼具導光擴散層3或光折射透鏡23 (圖3 1 )之 機械性支持層亦可。 做爲光反射層24，可列舉成形複合光反射性之顏料 (氧化鈦、碳酸鈣等）等之樹脂材料所成之層、於樹脂成 形層蒸著、濺鍍光反射率高之金屬材料等而層積所成之層 、成形光反射率高之金屬所成之層、於樹脂成形層貼合光 反射性高之薄膜所成之層等。 光反射性之層24之光反射率較佳爲60%以上，更佳 爲70%以上，更甚者爲80%以上，最佳爲90%以上。 然而，光反射層24乃黏著固定於LED安裝基板14 而配置之時，可做爲將.LED安裝基板14之熱散發至外部 之散熱片加以工作。此時，在可能之範圍下，以表面積爲 大之形狀加以形成者爲佳，又，做爲層之材料，使用熱傳 導率及或紅外線輻射率高之材料者爲佳。 有關光折射透鏡3c或23 (圖31)之形狀，較佳地可 到舉圖1或圖2所例示之球面之一部分所成曲面，或橢圓 曲面、雙曲面、拋物面圖之一部分所成曲面、圖3或圖5 所例示之圓錐狀之面、圖4或圖6所例示之緩和之曲面等 ，亦可採用菲涅透鏡狀之形狀。又，亦可爲組合複數之球 面、圓錐、曲面之形狀。LED射出光之收斂性之控制乃在 曲面之時，爲經由該曲率，圓錐狀之時，經由該錐面之傾 斜角等加以進行。 然而，於LED照明具中，使用複數個之LED元件1 時，如圖14 (在此例示使用2個LED元件1之情形）所 -22- 201120377 例示，於對應於各LED元件1之位置的位置，設置複數 個光折射透鏡3c或23 (圖31)所成凸部形狀亦可。此時 ，使通過LED元件1之光發光部之重心位置的垂線幾近 與成爲光折射面之凸部之頂點一致之位置加以對準者爲佳 〇 然而，複數個之LED元件1排列成陣列狀之LED照 明具中，依需要可對應LED元件1之位置，令複數個之 導光擴散層3排列呈陣列狀加以使用。尤其，將LED元 件1於直線上排列呈複數個陣列狀之時，或在縱橫比大之 LED元件1等之時，導光擴散層3乃可在如圖15之特定 方向，使用尺寸長的導光擴散層3。 對於此等導光擴散層3之材質，較佳爲透明性優異之 樹脂、玻璃等，尤其適於使用聚甲基丙烯酸甲酯樹脂及該 共聚物（尤其包含環及該衍生物所成之構造者）、聚碳酸 酯樹脂及該共聚物、聚乳酸樹脂及該共聚物、環狀聚烯烴 類及該共聚物（尤其包含環及該衍生物所成之構造樹脂、 例如〗SR製註冊商標「ARTON」、三井化學製註冊商 標「APEL」、日本ΖΕΟΝ製註冊商標「ΖΕΟΝΕΧ」等） ’聚甲基戊烯類及該共聚物（例如三井化學製註冊商標 「ΤΡΧ」等）、聚矽氧烷樹脂、環氧樹脂等之樹脂，或無 機玻璃材料（石英玻璃等），而以輕量性、設計性之觀點 視之’使用樹脂材料者爲佳。有關成形方法，可對應該形 狀’自射出成形、加壓成形、鑄造（聚合）、吹塑成形等 之方法加以選擇。 -23- 201120377 然而，本發明之導光擴散層3乃雖具有意圖利用導光 擴散層3與空氣界面之全反射及或折射現象之複數之傾斜 面之形狀而形成者，由此具有適切設計之複數之傾斜面之 導光擴散層3乃在層內部，加上導光LED光線之機能， 經由提高從LED光源至導光擴散層3之光入射效率（光 導入效率）之目的，或將從導光擴散層3射出之LED光 線向廣角擴展之目的，更且經由廣角射出，增加光反射層 6a等之形成之周圍框體4之光入射量，由於在光反射層 6a的再反射，可實現得指向性高之照明光之光學系的實 現及或，可在做爲透鏡、光擴散層加以工作等之目的下被 適切使用》 有關本導光擴散層3之形狀設計，則如圖1 6所示， 主要存在有以下之參數。即從LED元件1視之，令鉛直 方向爲Z軸，與其垂直之面爲XY面，令LED元件1表 面之Z座標爲z=0之時，A)導光擴散層3之入射透鏡 面（3 c )之頂點位置之Z座標（z 1 ) 、B )入射透鏡面之 曲率半徑（rl) 、C)入射透鏡面之錐形常數（kl) 、D )入射透鏡面之XY面投影長度（pl) 、E)全反射面3a 之頂點位置之Z座標（z2) 、F)全反射面3a之Z軸投影 深度（ql) 、G)全反射面3a之形狀控制參數（q2) 、H )全反射面3a之XY面投影長度（p2 ) 、I )與導光擴散 層3之LED元件1相對之面相反側面之XY面投影長度（ p3 )等。然而，單位使用mm。 在此，C)之錐形常數（k)乃規定曲面（錐形面）之 -24- 201120377 形狀之參數，以下加以供予。在此，k = 0時爲球面，-1 <k<〇時爲橢圓面、k=-l時爲拋物面、k<-l時爲雙曲 面，k>〇時爲偏球面。 b = c a2/ [1+ {1 — (1+k) c2 a2} 1/2] (式 1) (在此，a、b乃顯示圖17中圖示之部分之長度。c乃曲 面之曲率，相當於曲率半徑之倒數） 又，關於G )全反射面3 a之形狀控制參數（q2 )， 則如圖1 8〜20所圖示，於全反射面3a之中間（通過全反 射面3a之深度ql之中點之XY面與凹部斜面之交點）， 設置控制點，近似於旋轉掃過通過（3次）本控制點之樣 條曲線所成面形狀，將本控制點/旋轉軸間距離（q2)做 爲參數使用，經由變更本參數，進行諸形狀之表現。 又，其他，導光擴散層3之折射率亦成爲如此設計參 數的一個。 此等各參數則經由目的之照度分布，雖然最佳範圍不 同，做爲一般適切之範圍，大約爲如下所述。 zl: 0〜5mm(更佳爲1〜3mm) z2: 7〜50mm (更佳爲 12 〜20mm) rl : 2〜15mm (更佳爲4〜10mm) kl : -1.2 〜1.0 (更佳爲-0.8 〜0.5) pi、p2、p3 : 3〜50mm (更佳爲 6〜30mm) ql: 1〜20mm (更佳爲2〜14mm) q2: 0.5 〜8mm (更佳爲 0.5 〜6mm) pi/p 3 = 0.1 〜1_5 (更佳爲 0.3 〜1.2) -25- 201120377 ρ2/ρ3=0·8〜1 (更佳爲 0.9〜1 ) ql/p 2 = 0.2〜1.5 (更佳爲 0.4 〜1) q2/p2 = 0.1 〜0.4(更佳爲 0.13 〜0_3) 導光擴散層3之折射率：1.4〜1.7 (更佳爲1.48〜1.62 ) 然而，在此，此等之適切範圍乃對於具有導光擴散層 3之達成前述機能之形狀之基本單位之規定，於導光擴散 層3之基本單位爲排列成多數個之陣列狀所成之導光擴散 層3，或融合鄰接之基本單位之一部分所成圖22所例示 之導光擴散層3等之時，上述適切範圍有並不見得適用之 情形》 又，全反射面3a或導光擴散層3之XY面射影像不 見得需要是圓形，亦可爲橢圓形、正方形、長方形等。 做爲實際之光學系之實例，例如於後述之實施例1 ( 於圖1顯示槪略圖）所使用之光學系中，A)乃zl = 2.5mm、B)乃 rl=6mm、C)乃 k=0、D)乃 pl=10mm 、E)乃 z2 = 12.8mm、F)乃 ql=6.0mm、G)乃 q2 = 2.9mm、H)乃 p2 = 12mm。 後述之實施例1中，於從圖1 〇所圖示之LED元件1 之位置向鉛直方向隔著1 000mm之距離之平面內（光照射 面），可得圖1 1所示具有指向性之點狀之照度分布，於 從最大照度所成LED正下方之位置約隔著100mm之位置 ，可得前述最大照度之一半之照度。 本照度分布乃在市售之點光源中，適於較抑制光之擴 -26- 201120377 散之型式（強力照明較狹範圍之較佳型式）的 又，後述之實施例5中，導光擴散層3之 施例1相同，但L E D元件1 (約4 m m平方、 )則成爲以中心間隔約5mm配置2個之系統 中，於前述光照射面，從LED正下方之位置 約在離開320mm之位置，於Y方向，約在離丨 位置，得前述最大照度之一半之照度。本照度 售之點光源中，適於使光之擴散變大之型式（ 之範圍被柔和照射之型式）的照度分布。 然而，於實施例1、5中，更要提高照明 時（抑制光擴展，提高LED元件1之正下方 )，例如如以下之參數的選擇爲有效的。即 4.7mm、B)乃 rl=7mm、C)乃 k=-0.37、 10mm 不變更、E)乃 z2 = 13.7mm、F)乃 ql 變更、G)乃 q2=2.2mm、Η)乃 p2=12mm 不 此時，實施例1中，於前述光照射面內， 照度之LED正下方之位置，隔著約80mm之 實施例5中，於前述光照射面，從LED正下 於X方向，隔著約1 90mm之位置中，於Y方 1 8 0mm之位置中，可得前述最大照度之一半 同時提高指向性（抑制光之擴展）。 [LED元件1之周圍框體4] 又，周圍框體4乃如圖1例示，經由與其 照度分布。 參數雖與實 高約0.9 m m ，本光學系 冷X方向， _ 2 5 0 m m 之 分布乃在市 適於令較廣 光之指向性 亮度之情形 A )乃 z 1 = D )乃 p 1 = =6.0mm 不 〇 從成爲最大 位置中，或 方之位置， 向，隔著約 之照度，可 他零件之雌 -27- 201120377 雄螺絲所成之螺絲嵌合部4 a等之手段加以固定，以周圍 框體4之底面被LED安裝基板14之一部分（~般而言爲 端部）按壓之形式加以固定亦可。由此，可達成LED安 裝基板1 4歷時性之局部剝離等之抑制，提高LED照明具 之長期的可靠性。 又，於周圍框體4中，依需要，在提高燈內部與外部 之空氣之流通性（空氣之交換性），將內部之蓄熱向外部 氣體散熱之目的下，使周圍框體4設置內外貫通之空氣孔 亦可。 又，於周圍框體4中，對應用途或製品設計上之需要 ，在將LED元件1之射出光之一部分積極性向外部洩漏 之目的下，使周圍框體4設置內外貫通之漏光孔亦可。尤 其，做爲周圍框體4，使用無光透過性或小的材料（例如 金屬，後述之熱傳導樹脂等）之時，經由漏光孔之形成， 設計性會有提升之情形，可被適切地加以進行。然而，漏 光孔可兼做爲前述之空氣孔。 此等空氣孔、漏光孔之形狀，尺寸雖未特別加以限定 ，但以真圓狀、橢圓狀、多角形狀、狹縫狀等爲佳，依情 形可爲隨機之不定形狀。就尺寸而言，就真圓近似直徑而 言，大約爲1〜5mm程度者爲適切者。 類似圖1〜3例示已知光源之附有鏡子之鹵素燈（二 色性鹵素燈等）形狀之LED照明具等之時’在控制光指 向性之目的，或提高光源利用效率之目的下’使用具有周 圍框體4之至少一部分，具有光反射性之構造體者爲佳。 -28- 201120377 例如’形成於圖1〜3之框體反射面6a之部位的光反射層 ’即是所指。此時，周圍框體4乃做爲LED照明具，則 做爲爲了得較佳之照度分布之光學設計上之反射體（反射 器）而工作。 即，此等LED照明裝置中，光源之周圍框體4乃對 於從光源發出之光而言，具有做爲照明裝置爲了得較佳之 照度分布之光學設計上之反射體（反射器）而工作之部位 〇 又，反射體之形狀雖未特別加以限定，較佳可使用半 球狀、圓錐狀、多角錐狀等之形狀。半球狀之時，該傾斜 面乃球面、雙曲面、抛物面、橢圓面、偏球面或近似此等 之形狀爲佳。反射體之形狀乃與前述之導光擴散層3之形 狀相同，關連於照明光之指向性控制（配光分布控制）， 適切設計形狀，經由與導光擴散層3組合使用，可得多種 多樣之照明光之指向性（配光分布）。尤其，從導光擴散 層3之射出光乃設計成在反射器入射以前，具有光收斂點 而設計導光擴散層3之時，經由成爲使本光收斂點爲焦點 之拋物線狀之反射體，反射器反射光乃可約成爲平行光線 化，可有用於得指向性高之照明光。 即，經由此等光學系之利用，本發明之LED照明具 之照明光乃從來自LED之點光源狀變換爲面光源狀之故 ，而成爲對眼睛柔和之照明光，經由反射體之形狀、前述 導光擴散層3之形狀之組合等’可控制光之指向性、收斂 性等之控制，可使光照明點之大小做種種之變化。 -29 - 201120377 然而，做爲其他之機能，具有從LED元件1射出之 光線中，反射光學設計上不佳之各射出方向射出之光（即 迷光等），將此等之至少一部分回到較佳之射出方向而加 以利用之光利用效率提升爲目的之機能亦可（例如圖1之 記號6b之部位）。 對應此等之目的，光反射性之構造乃配置於適切之範 圍者爲佳。 具體而言，例如可適切列舉於鋁等金屬之加壓成形體 、或透明玻璃之鑄型成形體或本發明之熱傳導層2所成成 形體（此時，兼具本發明之熱傳導層2之形式）、具有透 明性之樹脂材料（聚碳酸酯、丙烯酸等）所成射出成形或 吹塑成形、鑄型成形等之成形體等之表面之至少一部分（ 例如圖1中，例示於框體反射面6a，或記號6b之範圍） ，將鋁、銀、不鏽鋼等之金屬膜及介電質多層膜等所成光 反射層，經由真空蒸鍍、濺鍍等加以形成之光反射性之成 形體等。光反射層乃經由該膜厚或層積構成之控制，做爲 完全光反射性之層亦可，成爲半透鏡狀之具備兼顧光反射 性與光透過性層之亦可。 又，更且，成爲反射層之基材之周圍框體4之成型表 面（或是塗佈面）之凹凸形成，或經由反射層之層積條件 之控制等，使反射面之表面具有微細凹凸，成爲具有些微 反射性之反射層亦可。 又，依情形而言，可採用將光反射性高之薄膜例如白 色反射PET薄膜、PEN薄膜（例如帝人Dupont薄膜公司 -30- 201120377 製註冊商標Tetoron薄膜、註冊商標 Teonex薄膜、註 冊商標 Teflex薄膜之白色型等），多層光干涉薄膜（例 如帝人Dupont薄膜公司製註冊商標Tetoron薄膜MLF) 、爲金屬蒸鍍薄膜等，貼附於周圍框體4之表面（一般而 言爲內面側），或於周圍框體4之成形時，經由插入成形 一體化層積、或於周圍框體4之附近（一般而言爲內面側 )，將薄膜單獨自立配置等之方法。 光反射層乃依需要，於其基材設置樹脂或金屬薄膜等 之塗佈所成底塗層，以達緊密性或耐久性之提升者爲佳， 又，於光反射層上，做爲表面保護層，層積塗佈樹脂或金 屬氧化膜等，以達耐摩耗性之提升或膜質劣化之抑制。然 而，底塗層或表面保護層乃對應照明色之調整或式樣上之 需要，施以著色者亦可。 然而，於以框體成爲光反射面之成型體表面，對於散 亂/擴散反射光線之目的，提高式樣性之目的，以周期性 或隨機之圖案賦予凹凸形狀亦可。 又，於框體之外面側，在提高式樣性之觀點下，塗佈 混合來自光多重干涉之光干涉發色型塡料（例如帝人 fiber公司製註冊商標「MORPHTEX」等）的塗料，使多 層光干涉薄膜（例如帝人Dupont薄膜公司製註冊商標 Tetoron薄膜MLF)進行嵌件模塑，爲了光學性機能或觸 感之提升，施以適當之凹凸加工亦可。 又，關於樹脂、玻璃、金屬等所成周圍框體4之本身 ，可對應照明色之調整或式樣上之需要，施以著色亦可。 -31 - 201120377 [光透過性覆蓋層] 又，光透過性覆蓋層（符號5)乃LED照明裝置之主 要光射出部位。因此’做爲光透過性覆蓋層5之構成材料 ’光透過性優異之材料爲佳，以玻璃或各種透明樹脂爲佳 。由輕量性、設計自由度、掉落安全性等之觀點，使用樹 脂材料爲更佳。做爲成形方法，可對應該形狀，自射出成 形、加壓成形、鑄造（聚合）、吹塑成形等之方法加以選 f§9 擇。 又，關於層內之光之折射性或擴散性之控制，進而在 控制照明光之指向性（收斂性、擴散性）之目的下.，將光 擴散性塡料、光反射性塡料等複合於層內，對於層本體持 有光學機能，層本身成爲透鏡狀之3次元形狀（凹透鏡、 凸透鏡等）亦可，或於層之表面賦予透鏡構造（凹透鏡、 凸透鏡、菲涅鏡等），或適切之圖案之3次元凹凸形狀等 ，或於層表面，進行光反射性、光散亂性之塗佈或印刷等 亦可。又，在照明色之調整、式樣性等之觀點下，進行著 色亦可。在提高LED照明裝置之耐衝擊性之觀點下，耐 衝擊性優異之聚碳酸酯樹脂者爲適切者，而在重視透明性 、耐損傷性硬度之情形下，丙烯酸樹脂、環狀聚烯烴材料 等之利用者爲佳。又，依需要，經由塗佈等，將硬敷層’ 形成於光透過性覆蓋層5之表面亦無妨。 [熱傳導層] -32- 201120377 本發明之LED照明具乃具有至少層之一部分接近鄰 接於LED元件1加以配置之熱傳導層2者爲佳。即，熱 傳導層2乃至少層之一部分接近配置於LED元件1，爲司 掌LED元件1之散熱之層，對於層之至少一方向之熱傳 導率爲2W/m . K以上，平均厚度爲0.5〜5mm之層者爲 佳。熱傳導率乃較佳爲1 〇W/m . K以上，更佳爲1 5W/m . K以上，更甚者爲20W/m . K以上’最佳爲25W/m . K以 上，平均厚度乃較佳爲0.5〜3mm，更佳爲0.5〜2.5mm， 更甚者爲0.5〜2mm，最佳爲0.5〜l_5mm。 經本發明檢討之結果，發現使用於本發明之熱傳導層 2之熱傳導率與厚度（平均厚度、單位 m)之積爲 0.0 1 W/K以上者爲佳。即，於熱傳導層2之熱傳導率與厚 度之積和LED元件1之散熱性能之間，有臨界點，當積 不足0.0 1 W/K之時，散熱性則下降，LED元件1之充分 散熱則變得困難。 熱傳導層2之熱傳導率與平均厚度之積乃較佳爲 0.02W/K以上，更佳爲 0.03W/K 以上，更甚者爲 〇.04W/K以上，最佳爲0.05W/K以上。然而，熱傳導層2 之熱傳導率與平均厚度之積之實質上限爲約2W/K (熱傳 導層2爲純銀制’厚度5mm之時’ 420W/m. Kx〇.005m = 2 > 1W/K)。 滿足此等之適切條件之觀點中’熱傳導層2之熱傳導 率乃2W/m . K以上者爲佳。不足2W/m · K時，爲滿足適 切條件，必需使平均厚度超過5mm’會增加產生無用之 -33- 201120377 體積、重量之故，並不喜好。 又，有關於熱傳導層2之平均厚度’超過5mm之時 會招來無用之體積、重量之增加，而不足〇.5mm時，在 機械性強度、成形性等之面則會產生問題。 又，熱傳導層2乃使該表面積（m2)除以LED元件 1之投入電力（W)之値爲0.0005〜0.02m2/W之範圍爲佳 ，更佳爲 0.001〜0.01m2/W，更甚者爲 0.0015〜 0.005m2/W 之範圍。 在此，熱傳導層2之表面積乃除了與外部空氣之界面 之外，爲包含與LED基板、補強層、電性絕緣層等之部 分之總體面積，對應LED元件1所產生之熱量，存在有 將此向外部散熱之較佳表面積之範圍。當不足 0.00 05m2/W時，投入電力1W以上之功率LED元件1之 散熱會易於不充分。然而，在增加熱傳導層2之表面積之 目的下，於熱傳導層2之表面賦予凹凸者亦可被較佳地進 行。經由進行凹凸賦型時，較平坦之時，可使表面積增加 1.5倍以上，更佳爲2倍以上，更佳爲2.5倍以上。 然而，使該表面積（m2)除以LED元件1之投入電 力（W)之値超過0.02m2/W時，雖然做爲散熱性能可得 非常高的效果者，但另一方面，多會伴隨熱傳導層2之無 用體積、重量之增加之故，由燈之小型化、輕量化之觀點 視之，並不喜好。 又如圖6所示之LED照明具中，於自LED元件1正 下方至接點部9a之內面側之空間，形成有熱傳導層2 ( -34- 201120377 唯，接點與熱傳導層2間乃藉由電性絕緣層1 2 )。經由 如此，有效散熱面積變廣的同時，可使LED元件1之發 熱藉由接點部9a，向外部插槽側，以固體接觸產生散熱 路徑之故，對於發熱量多之LED照明具，是特別有效的 〇 熱傳導層2只要是可滿足此等適切要件之層，不論是 何材質，皆可適宜地被使用，具體例則於後詳述之。 然而，在熱傳導層2之機械性補強之目的，或電性絕 緣性之確保的目的下，將耐衝擊性或電性絕緣性優異之層 ，層積於熱傳導層2亦可。前者之目的中，以層積附有缺 口艾氏耐衝擊強度爲SkJ/m2以上，平均厚度爲0.3〜3mm 之補強層者爲佳，後者目的之時，則層積體積阻抗1 〇1 1 Ω .cm以上，平均厚度爲0.01〜3mm，熱傳導層2與電性 絕緣層12之層積體之厚度方向之IEC 6 1 000規定靜電破壞 電壓5kV以上，絕緣破壞電壓〇.5kV以上之電性絕緣層 1 2者爲佳。然而，此等之補強層與電性絕緣層1 2可成爲 兼顧兩者機能面之平均厚度0.3〜3mm之層。 然而，補強層之附有缺口艾氏耐衝擊強度較佳爲 10kJ/m2以上，更佳爲20kJ/m2以上，最佳爲30kJ/m2，電 性絕緣層12之體積阻抗則較佳爲1〇13Ω . cm以上，靜電 破壞電壓則較佳爲10kV，更佳爲20kV以上，絕緣破壞電 壓則較佳爲；kV以上，更佳爲5kV以上。 尤其，熱傳導層2採位於LED照明具之最表層之構 成之時’在LED照明具表面之電性絕緣性之提升，損傷 -35- 201120377 之防止、式樣性（外觀色彩等）之提升等目的下，於熱傳 導層2之至少一部分之表面，形成電性絕緣層2爲佳。 形成於位於此等LED照明具之最表層之熱傳導層2 上的電性絕緣層12，例如使用樹脂材料、陶瓷材料等之 塗佈，電性絕緣性之熱收縮管之加熱收縮所成被覆方法等 皆可形成，且可包含爲著色層之顏料、紫外線吸收劑、熱 傳導性或熱輻射性高之塡料等之副成分亦可。 做爲適於本發明滿足前述要件之熱傳導層2，具體而 言，可列舉例如選自銅、銀、鋁、鐵、不鏽鋼、鋅、鈦、 矽、鉻、鎂等之金屬者。金屬可爲單體或合金。此等金屬 所成熱傳導層2乃可經由鑄造法、锻造法、嵌段狀之金屬 塊之切削加工等加以形成。然而，做爲鑄造法，可列舉於 模具內，供予壓縮力而成形之壓鑄法，單純流入至模具， 自然冷卻成形之方法等。又，做爲鍛造法，可較佳地列舉 於加熱之金屬層供予剪切應力，進行延展性加工之冷锻造 法等。 尤其，於銅、銀、鋁、矽類中，具有100W/m · K以 上之熱傳導率者爲多，在LED元件1之散熱性（LED元 件1溫度之效率性之減低）之觀點來看，可非常喜好地被 使用。 又，做爲熱傳導層2，亦可利用無機氧化物之成形層 。例如氧化鋁、氮化鋁、氮化硼等之無機氧化物中，雖然 會由於該結晶構造而有所不同，但有具有數十W以上之 熱傳導率者，可適用於本用途之中。做爲成型方法，例如 -36- 201120377 可列舉將粉體 ，邊以高溫熱 的下，將無機 烯醇、聚乙二 燒除樹脂黏合 ，亦可被適切 惟，由於 熱有效地被進 於熱傳導層2 具之發光控制 使得照明具整 保持具需要大 搬運性、或照 慮。 又，更且 增加來自電源 於熱傳導層2 多量之電流之 之情形。 即，做爲 用電源串連之 之發光控制用 之觀點下，做 之層爲佳，做 狀之無機氧化物塡充於模具內，邊施 處理、燒結之方法。又，爲提高成形 氧化物之粉體與樹脂黏合劑，例如倂 醇等進行成形，透過高溫之熱處理、 劑之部分，以得無機氧化物之成型層 地加以利用。 LED照明具之用途，爲使LED元件 行，需要大體積之熱傳導層2之情形 使用金屬或無機氧化物之時，與內藏 用電子電路、電源、電池等之重量合 體之重量變得相當重，使得照明具固 費周章之物，使得照明具施工時之處 明具一旦掉落時等之人體安全性等會 ，於熱傳導層2使用高導電率之金屬 配線之洩漏電流、激發電流之情形爲 與電源配線之短路不斷地產生之時等 故，做爲照明具之安全性上，會有產 LED照明具之電性安全性，在於減 配線、LED元件1之安裝基板、LED 電路、電源、電池等之洩漏電流、激 爲熱傳導層2，使用電阻（體積阻抗 爲層之體積阻抗，至少lxl (Τ2 ( Ω . 加高壓 性之目 用聚乙 燒結， 之方法 1之散 爲多， 於照明 起來， 定用之 理性、 產生疑 之時， 多，又 ，流入 生疑慮 低從商 元件1 發電流 )爲大 cm )以 -37- 201120377 上爲佳，較佳爲lxl〇Q ( Ω · cm )以上，更佳 Ω · cm)以上，最佳爲1χ104( Ω · cm)以上 經由此等之觀點，熱傳導層2乃複合各種 料，特別適於使用成形層內之至少一方向之 5W/m · K以上之熱傳導性樹脂組成物而成之 率較佳爲1 5W/m · K以上，更佳爲20W/m · K 爲25W/m ♦ K以上。 使用此等熱傳導性樹脂組成物之熱傳導層 前述金屬之時比較，可成爲低比重而輕量，可 度成形，較金屬電阻爲大，可實現前述適切之 之故，可得做爲LED照明具之輕量性、掉落 計自由度（熱傳導層2之加工精度或形狀自由 LED照明具之其他之構成零件之嵌合性、以〕 照明具之電性安全性。 此等熱傳導性樹脂組成物乃對於該基塊樹 份而言，熱傳導性塡料之含量爲10〜100體積 熱傳導性塡料之含量不足10體積份之時，難 導性。相反，熱傳導性塡料之含量超過100體 熱傳導性塡料則分散於樹脂，難以得均勻之熱 組成物，或是於使樹脂之流動性變得不充分。 料之含量較佳爲20〜90體積份》 熱傳導性塡料與基塊樹脂之混合乃使用單 混練裝置、二軸型之熔融混練裝置等之公知之 置而實施。 爲 lxlO2 ( 〇 熱傳導性塡 熱傳導率爲 層。熱傳導 以上，最佳 2乃與使用 微細且高精 體積阻抗等 安全性、設 度等）、與 泛做爲LED 脂1〇〇體積 份者爲佳。 以得高熱傳 積份之時， 傳導性樹脂 熱傳導性塡 軸型之熔融 熔融混練裝 -38- 201120377 做爲熱傳導性塡料，可列舉氧化鋁、氧化鎂、氧化矽 、氧化鋅等之金屬氧化物、氫氧化鋁、氫氧化鎂等之金屬 氫氧化物、氮化硼、氮化鋁等之金屬氮化物、氧化氮化鋁 等之金屬氧氮化物、碳化矽等之金屬碳化物、金、銀、銅 、鋁等之金屬或金屬合金、碳纖維、天然石墨、人造石墨 、膨脹石墨、鑽石等之碳材料等，且可2種類以上倂用。 爲提高熱傳導層12之熱傳導率，使用瀝青基石墨化 短纖維者爲佳，其中，使用以介晶相瀝青爲出發材料，石 墨結晶構造非常發達之瀝青基石墨化短纖維者尤佳。即， 石墨化短纖維之熱傳導性主要來自傳播石墨結晶之晶格構 造之聲子振動之故，爲了提高熱傳導性，提高石墨結晶之 結晶性、即石墨結晶之晶格構造儘可能無缺陷，且大而廣 地擴展者爲佳。 使用於本發明之瀝青基系石墨化短纖維即相當於所謂 中纖維，該平均纖維長度（L1)乃更佳爲2〇〜500/im。 在此，平均纖維長係數個平均纖維長，在顯微鏡下測定特 定之條數，由此平均値而求得。L1小於2 0 β m之時，該 短纖維彼此難以接觸，無法得具有高熱傳導率之熱傳導性 組成物。相反，當L1較500//m爲大之時，混練基塊與 瀝青基石墨化短纖維之時之黏度會變高’在操作上會變得 困難。更佳則爲2 0〜3 0 0 y m之範圍。做爲如此得歷青基 石墨化短纖維之手法’雖未特別加以限制’經由調整混練 之條件，即調整切刀等之粉碎時之切刀之旋轉速度、球磨 之旋轉數、噴射粉碎之氣流速度、壓碎之衝擊次數、混練 -39- 201120377 裝置中之滯留時間，可控制平均纖維長。又，從混 瀝青基系碳短纖維，進行節等之分級操作，可經由 之纖維長或長之纖維長之瀝青基系碳短纖維加以調 本發明所使用之瀝青基系石墨化短纖維乃由石 所成，由來於六角網面之成長方向之結晶尺寸（L< 爲20nm以上，更佳爲30nm以上，更甚爲40nm以 佳爲5 Onm以上者爲佳。結晶子尺寸乃於六角網面 方向，對應於石墨化度（石墨結晶之結晶性）之高 爲發現熱物性時，需一定尺寸以上。六角網面之成 之結晶子尺寸乃以X線繞射法加以求得。測定手 中法，做爲解析手法乃適於使用學振法。六角網面 方向之結晶子尺寸乃可使用從（1 1 0 )面之繞射線 得。 又，做爲顯示石墨化度之其他參數，有石墨結 間隔，層間隔愈小，結晶性愈高。石墨結晶之層間 如做爲根據d002之X繞射線之計算値，至少爲〇. 以下，較佳爲〇.3 3 95nm以下，更佳者爲0.3370nm 最佳爲0.33 62nm以下。 又，石墨烯薄片端面構造乃會由於在石墨化前 碎’或在石墨化後實施粉碎，而有大的差異。即， 化後進行粉碎處理時，石墨化成長之石墨烯薄片會 裂之故，石墨烯薄片端面會易於成爲開啓之狀態。 面’於石墨化前進行粉碎處理時，在石墨之成長過 墨烯薄片端面會彎曲成U字上，彎曲部分易於成 練後之 除去短 整。 墨結晶 :)至少 上，最 之成長 低者， 長方向 法爲集 之成長 加以求 晶之層 隔乃例 3 42 Onm 以下， 實施粉 於石墨 切斷破 另一方 程，石 爲齒ttj -40- 201120377 於瀝青基系石墨化短纖維端部之構造。爲此’爲得石墨烯 薄片端面閉鎖率超過80%之瀝青基系石墨化短纖維時’ 以在粉碎後進行石墨化處理者爲佳。 使用於本發明之瀝青基系石墨化短纖維乃以掃猫型電 子顯微鏡之側面之觀察表面實質上爲平坦者爲佳。在此’ 實質上爲平坦乃指使如纖維化構造之激烈凹凸’不存在於 瀝青基系石墨化短纖維者之意思。於瀝青基系石墨化短纖 維之表面，存在激烈之凹凸之缺陷時’在基塊之混練之時 ，會引起表面積增大伴隨之黏度增大’使成形性惡化。因 此，如表面凹凸之缺陷乃儘可能爲小者之狀態爲佳。更具 體而言，於掃瞄型電子顯微鏡中，在1 000倍觀察之像之 觀察視野中，如凹凸之缺陷爲在1 〇個以下者。做爲獲得 如此瀝青基系石墨化短纖維之手法，於進行混練後，實施 石墨化處理而可優異地獲得。 構成熱傳導層2之熱傳導性樹脂組成物中，除了熱傳 導性塡料之外，更爲提高成形性、機械物性、難燃性、其 他之特性’除前述以外之碳纖維（例如聚丙烯腈或纖維素 等爲出發原料之碳纖維等）、玻璃纖維、鈦酸鉀細絲、氧 化鋅細絲、硼化鋁細絲、氮化硼細絲、醯胺纖維、氧化鋁 纖維、碳化矽纖維、石棉纖維、石膏纖維、金屬纖維等之 纖維狀塡料、以及砂灰石、沸石、絹雲母、高領土、雲母 、黏土、葉蠟石、皂土、石棉、滑石、矽酸鋁等之矽酸鹽 、碳酸銘、碳酸鎂、白雲石等之碳酸鹽、硫酸鈣、硫酸鋇 等之硫酸鹽、坡璃珠、玻璃薄片及陶瓷珠 '氫氧化鋁、氫 -41 - 201120377 氧化鎂等之非纖維狀塡料亦可依需要適切加以添加。此等 可爲中空者，更且將此等2種以上倂用亦可。惟，上述化 合物中，密度大於瀝青基系石墨化短纖維者爲多，在輕量 化爲目的之時，需注意添加量或添加比率。 又，於熱傳導層中，除此之外，依需要，添加公知之 老化防止劑、紫外線吸收劑、紅外線吸收劑、難燃劑、白 色或其他顏色之顏料、染料等亦無妨。 對於成基塊之樹脂而言，例如可廣爲利用熱可塑性樹 脂、硬化性樹脂。做爲硬化性樹脂，雖可列舉熱硬化性樹 脂、紫外線·電子線等之活性光線硬化型樹脂等，主要是 使用熱硬化性樹脂。 做爲熱可塑性樹脂，可列舉例如聚酯類及該共聚合物 (聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚2,6-萘 二甲酸乙二酯）、聚苯乙烯類（聚苯乙烯、對位性聚苯乙 烯等）及該共聚物（苯乙烯-丙烯腈共聚物、ABS樹脂、 AES樹脂等）、聚甲基丙烯酸甲酯類及其共聚物（尤其是 包含環及該衍生物所成構造者）、聚乳酸樹脂及其共聚物 、聚丙烯腈類及其共聚物、環狀聚烯烴類及其共聚物（尤 其是含環之樹脂，例如JSR製，商標名「ARTON」、三 井化學製商標名「APEL」、曰本 ΖΕΟΝ製，商標名「 ΖΕΟΝΕΧ等」）、聚甲基戊烯類及該共聚物（例如三井化 學製登錄商標「ΤΡΧ」等）、聚苯烯醚（ΡΡΕ)類及該共 聚物（包含改性ΡΡΕ樹脂等）、脂肪族聚醯胺類及該共 聚物、聚醯亞胺類及該共聚物、聚醯胺醯亞胺類及該共聚 -42- 201120377 物、聚碳酸酯類及該共聚物、聚苯硫醚類及該共聚物、聚 颯類及該共聚物、聚醚碾類及該共聚物、聚醚腈類及該共 聚物、聚醚酮類及該共聚物、聚醚醚酮類及該共聚物、聚 酮類及該共聚物、彈性體、液晶性聚酯類等之液晶性彈性 體等。由此等單獨使用一種’或適切組合二種以上加以使 用皆可。 做爲熱硬化性樹脂’雖可列舉酚類、環氧類、聚砂氧 烷類、不飽和聚酯類、三聚氰胺類等’其中以耐熱性、機 械強度之觀點來看，酚類、環氧類、尤其爲佳。 此等熱硬化性樹脂可列舉將先驅液塡充於模具內之後 ，於模具內進行熱硬化，得成形體之鑄型法、將粉體狀之 先驅材料（一般稱鑄造混合物），塡充於模具內之後，順 序進行加熱熔融、熱硬化，得成形體之粉體成形法等。 惟，爲獲得高熱傳導率之實現、微細且精密之成形體 之觀點來看，使用粉體成形法時，較佳的情形爲多。 然而’於熱傳導層2，依需要，可添加提升輻射率（ 紅外線放射率）之添加劑、各種著色劑、難燃劑、紫外線 吸收劑、紅外線吸收劑 '氧化防止劑等之添加物。 又’熱傳導層2可依需要’於層之整體或一部分，採 取組合熱傳導性樹脂組成物所成熱傳導層與金屬所成熱傳 導層之複層構成。此時，金屬係使用熱傳導率爲l〇〇w/m • κ以上者（鋁、銅、銀等）爲佳，從輕量化之觀點使 用比重較小之鋁或該合金者尤佳。又，考量使用在對應於 LED照明具之LED元件1之發熱量、發熱密度、通過熱 -43- 201120377 傳導層2之熱流密度等之散熱設計下，在輕量化之觀點下 ，儘可能使自熱傳導樹脂組成物所成之熱傳導層2之體積 比例變多者爲佳。 例如，如圖22所示，於LED安裝基板1 4側之面， 使用鋁等金屬成形所成之第1之熱傳導層20，於LED照 明具之側面部，使用熱傳導樹脂組成物之成形所成之第2 之熱傳導層21。即，熱傳導層中，於熱流密度非常高之 發熱源（LED元件1)附近之部位，配置金屬所成熱傳導 層20(尤其較佳爲熱傳導率lOOW/m · K以上之金屬之成 形層），儘可能使熱快速被發散，於較發熱源（LED元件 1 )附近相對熱流密度爲低之LED照明具之側面部，經由 配置熱傳導樹脂組成物所成熱傳導層21 (尤其較佳爲熱 傳導率爲15W/m · K以上，比重爲1.8以下之熱傳導樹脂 組成物之成形層），可有效率兼顧散熱與LED照明具整 體之輕量化。 又，如圖23所例示，熱傳導層2 1之一部分部位有複 雜之形狀、細微之形狀等之時（圖23時，相當於形成在 最外廓部表面之3次元賦型層），此等之形狀乃一般而言 使用具有較金屬成形性更優異之特徵之熱傳導性樹脂組成 物而成形，而除此之外之較單純之形狀乃使用金屬成形， 使兩層在至少一部分加以層積，形成界面之形式者爲佳。 然而，做爲熱傳導性樹脂組成物所成之熱傳導層與金 屬所成熱傳導層之複合化之方法，除了將各別形成之層， 使用熱傳導性佳之黏著劑等加以黏著之方法，如圖22所 -44 - 201120377 不螺絲締結之方法寺之外’可較佳列舉先成形金屬所成熱 傳導層，設定於樹脂成形模具之模孔內，進行熱傳導樹脂 之射出成形而加以一體化之嵌件成形法。 又，在提升熱傳導層之表面積，提高從熱傳導層至外 部（空氣或其他之層）之熱散熱效率之目的下，以後述之 要領，施以3次元凹凸形狀之賦型等爲佳。尤其，熱傳導 層做爲LED照明具之最外廓層使用之時，即熱傳導層之 一部分或整體，設於與空氣接觸之位置時，關於接觸此空 氣之面，經由3次元凹凸形狀之賦型等，提升表面積者爲 佳。 又，使熱傳導層使用包含前述之熱傳導性碳纖維（尤 其瀝青基系石墨化短纖維）之熱傳導樹脂而射出成形之時 ，使樹脂射出模具之閘門部，配置於發熱源之LED元件1 附近者爲佳。即，熱傳導性碳纖維之配向方向乃與熱傳導 樹脂之流動方向一致之故，於LED元件1附近，設置閘 門者，可使LED元件1之散熱方向與熱傳導性碳纖維之 配向方向（熱傳導樹脂之熱傳導率成爲最大之方向）幾近 一致之故，可更有效率地加以散熱。 [LED元件1發光控制用電子電路] 本發明之LED照明具中，可較佳爲內藏LED元件1 之發光控制電子電路之LED照明具。LED元件1發光控 制用電子電路乃組合AC - DC變換電路、DC - AC變換電 路、DC — DC變換電路、AC— AC變換電路、輸出可變電 -45- 201120377 路（含調光電路）、安全電路（含溫度反饋控制電路、保 險絲等之電路等）、雜訊濾波電路等之單獨或幾個而構成 。視情形而定，可內藏各種電池。又，具有從外部遙控操 作可調光之紅外線或電磁波信號之收訊部及處理電路亦可 〇 此等LED元件1之發光控制用電子電路乃依需要， 就被覆於電性絕緣性之樹脂材料，或幾乎完全包覆之形式 而言，可安裝於燈之外殼內。做爲電性絕緣性之樹脂材料 ，利用環氧、胺基甲酸乙酯、聚矽氧烷等之熱硬化樹脂材 料（一般而言，以接合材、封閉材等之名稱加以使用）爲 佳，更佳乃配合提高熱傳導率之塡料之電性絕緣性之樹脂 材料加以使用爲佳。此時，電性絕緣性之樹脂材料乃可做 爲將LED元件1之發光控制用電子電路所產生之熱，向 外部電源連接用之礙子部（接點周圍之殻體面）散發之散 熱路徑加以利用，經由礙子部之殼體內面與該樹脂材料在 面接觸之形式下加以塡充，可得目的之效果。 又，插入AC100V等之商用電源、外部電源之插槽類 加以使用之時，可與插槽類安定嵌合，具備與前述發光驅 動用電源電路電性連接之接點、插銷等者爲佳。做爲接點 ，可廣爲使用一般所使用之Ell、E12、E17、E26等之接 點0 [電性絕緣層12] 然而，LED照明具直接連結100V等之商用電源加以 -46- 201120377 使用之時，或連接於鋰離子電池等之高 等加以使用之時，雖然在電氣安全法等 壓且高電流之電源電路、電子電路等之 ，洩漏電流或激發電流之減低、短路之 之觀點下，以電性絕緣性之層加以包圍 外部電源連接用之接點之礙子部8，同 絕緣可靠性之電性絕緣層。 此等電性絕緣層1 2乃在爲得高電 械強度之觀點下，體積阻抗爲ι〇ηω_ 向之IEC61000規定之靜電破壞電壓爲 壞電壓爲0.5 kV以上，平均厚度爲0.3 ‘ 更且電性絕緣層1 2係由機械強度之觀 耐衝擊強度爲5kJ/m2以上之層者爲更佳 做爲構成此等電性絕緣層1 2及或5 可列舉陶瓷材料、樹脂材料等’以電性 之機械強度優異之層者爲佳。尤佳者爲 ，由樹脂或樹脂組成物所成，V型切 5kJ/m2以上，且平均厚度爲〇·〇5〜3mm 定所需之厚度部分以外之部分之平均厚 體積阻抗爲1〇ΜΩ · cm以上，更佳爲] 層者。 又，層之靜電破壞電壓爲10kv以 以上，更佳爲3 OkV以上，絕緣破壞電I 佳爲5kV以上，更佳爲10kV以上。 能容量之內藏電池 亦有規定，處理高 周圍乃在漏電防止 防止之電性安全性 者爲佳。又，固定 樣需要具有高電性 性絕緣可靠性、機 cm以上，厚度方 5kV以上，絕緣破 〜3mm爲佳。又， 點視之，V型切口 〇 疑子部8之材料， 絕緣性，構造保持 與前述補強層相同 J 口耐衝擊強度爲 ，更佳爲於接點固 爲 0.5〜1.5mm，該 1〇13Ω · cm以上之 上，較佳爲20kV 藍爲1 kV以上，較 -47- 201120377 又，電性絕緣層12乃更佳爲熱傳導率高之層，對於 至少層內之一方向之熱傳導率爲0.5W/m . K以上者爲佳 ’更佳爲1 W/m . K以上。 使電性絕緣層1 2以樹脂或樹脂組成物形成之時，做 爲樹脂，就前述熱傳導層2之樹脂基塊材料所例示之樹脂 被適切例示，做爲樹脂組成物，則適切例示有於前述樹脂 基塊材料，添加玻璃纖維、聚芳醯胺纖維等之補強用纖維 材料’或適於各種用途之添加劑之樹脂組成物。 爲提高層之熱傳導率，較佳爲電性絕緣性之塡料之混 合’補強層乃對於基塊樹脂100體積部而言，含有5〜 1 〇〇體積部之電性絕緣性之熱傳導性塡料者爲佳。做爲電 性絕緣性之塡料，例如可列舉氧化鋁、氧化鎂、氧化矽、 氧化鋅、氧化鈦等之金屬氧化物、氫氧化鋁、氫氧化鎂等 之金屬氫氧化物、氮化硼、氮化鋁等之金屬氮化物、氧化 氮化鋁等之金屬氧氮化物、碳化矽等之金屬碳化物等。 又’就用途而言，混合氧化鈦、硫酸鋇等之光散亂性 、光反射性之塡料或層之著色用之顏料等亦無妨。惟，於 電性絕緣層1 2多量混合如此之塡料之時，層之耐衝擊性 下降之情形爲多，在本發明之主旨下，在確保充分耐衝擊 性之範圍’混合塡料者爲佳。 又依需要，於電性絕緣層1 2，可添加提升輻射率（ 紅外線放射率）之添加劑、各種著色劑、難燃劑、紫外線 吸收劑、紅外線吸收劑、氧化防止劑等之添加物。 -48- 201120377 [最外廓層之仕樣] 於本發明中，做爲位於LED照明具之最表面之層（ 以下稱最外廓層），雖會由於LED照明具之構成而有所 不同，配置前述電性絕緣層12、熱傳導層2、補強層等之 情形爲多。 於此等最外廓層中，在提高做爲LED照明具整體之 外觀設計之目的下，將著色顏料、染料等添加於層者爲佳 ，尤其可較佳使用白色系之顏料、染料。更且，最外廓層 乃從隱蔽性之觀點視之，對於可視光而言，成爲高光反射 率層爲佳之情形爲多。 又，最外廓層乃在於LED照明具之最表面之故，施 以提升防止損傷、光學性、式樣性之機能、耐藥品性、輻 射率（紅外線放射率）之塗佈或3次元凹凸形狀之表面賦 型等亦可。 在此，3次元形狀賦型乃經由增加最外廓層之表面積 ，增加與外部空氣層之接觸面積，在提升最外廓層/外部 空氣層之界面之傳熱性之目的下加以形成。在L E D元件1 之促進散熱之觀點下，使外部空氣層之周圍溫度（離開從 燈至某程度之距離之處）與補強層表面之溫度差儘可能爲 小地，提升本界面之傳熱性者爲重要的部分。本界面之傳 熱性乃關連於空氣分子與最外廓層之衝突頻繁度、從最外 廓層至外部空間之紅外線輻射率之故，最外廓層之表面積 、表面形狀、紅外線輻射率等則成爲控制因子，以提升最 外廓層之紅外線輻射率、且使最外廓層之表面積變大、成 -49- 201120377 爲提高與外部空氣之熱交換效率之適切表面形狀者爲佳。 本表面賦型所成最外廓層之表面積乃對於平坦面之情 形’至少爲1.2倍以上者爲佳，更佳爲1 .5倍以上，更甚 者爲2倍以上，最佳者爲2.5倍以上。 3次元形狀賦型面之凸部平均高度（凸部頂點與最外 廓層之最底點或最底面間之距離）乃至少爲5mm以下爲 佳。凸部之平均高度超過5mm之時，會招致LED照明具 之無用尺寸（直徑等）之增加，並不喜好之情爲多。凸部 之平均高度乃3mm以下爲佳，更佳爲2mm以下，更甚者 爲1mm以下，最佳爲〇.8mm以下。 又，3次元形狀賦型面之凸部之平均寬度或平均粗度 乃至少爲2mm以下。凸部之平均寬度或平均粗度超過 2 mm之時’爲提高3次元形狀賦型面之表面積所需之凸 部高度會變大，而招致LED照明具之無用尺寸（直徑等 )之增加。凸部之平均寬度或平均粗度乃較佳爲i.smm 以下，更佳爲1.2mm以下，更甚者爲〇.9mm以下，最佳 爲0.6mm以下。 做爲3次元形狀賦型之具體例，例如可列舉圖示於圖 7，8之凸形狀圖案等。即，圖7乃具有矩形狀之剖面形 狀之凸形狀圖案之例’圖8乃於凸部之前端部，具有曲面 部位（曲率）之凸圖案例者。 例如圖7所例示之剖面形狀圖案中，令凸部高度爲 1mm、凸部之寬度爲1mm，底部（凹部）之寬度爲lmm 之時（幾近於圖7所例示之形狀），相較於無賦型之平坦 -50- 201120377 面，可使表面積增加約2倍。又，令凸部高度爲lmm、 凸部之寬度爲1mm，底部（凹部）之寬度爲2mm之時（ 與圖7所例示之形狀有所差異），相較於無賦型之平坦面 ，可使表面積增加約1 . 7倍。 又，圖8所例示之剖面形狀圖案中，令凸部高度爲 0.7mm、凸部之寬度爲 〇.6mm，凸前端部之曲率半徑爲 〇.3mm，底部（凹部）之寬度爲0.4mm，令底部成爲曲率 半徑0.2mm之凹部之時（幾近於圖8所例示之形狀）， 相較於無賦型之平坦面，可使表面積增加約2倍。又，令 凸部高度爲、凸部之寬度爲0.6mm，凸前端部之曲 率半徑爲〇.3mm，底部（凹部）之寬度爲1 .4mm，於底部 邊緣部分不設曲率半徑之時（與圖8所例示之形狀多少有 差異），相較於無賦型之平坦面，可使表面積增加約1.6 倍。 關於3次元形狀之形狀尺寸，以燈之使用環境、設計 、用途上之燈之尺寸限制等爲前提，適切加以設定者爲佳 〇 然而，圖7、圖8之例中，雖爲在於與LED照明具之 長度平行之方向，排列3次元賦型圖案（凹凸形狀圖案） 之形式，但3次元形狀賦型圖案可排列在平行於LED照 明具之周方向（與長方向垂直之方向）之方向’排列在除 此之外之方向，或隨機加以形成皆可。 又，3次元賦型之形狀，除了連接於如圖7、圖8之 1方向之規則性之凹凸形狀以外’可爲點存在複數之獨立 -51 - 201120377 之凹凸部（突起、凹陷）之形狀，無規則性隨機連接之凹 凸形狀等多種之利用。 將實際LED照明具之應用例，記載於圖21、23、24 、27、39、40。其中，圖21、23、40乃熱傳導層2之3 次元形狀賦型之例，圖24、27、39乃電性絕緣層12之3 次元形狀賦型之例。 然而，此等之表面賦型乃經由在於射出成形之模具內 面，施以形狀刻印，在成形階段之實施爲佳，亦可爲成形 後之後處理之實施，例如可列舉對成形品表面之凸邊加工 (經由具有特定之凹凸圖案之切削刀之按壓所成之表面切 削加工）.，或於成形品按壓施以表面賦型用之形狀刻印之 模具面，經由熱加壓進行表面賦型之方法、將事先表面賦 型之樹脂性之薄膜，層積於成形品表面，或藉由黏著層等 加以貼附之方法、加熱收縮事先表面賦型之熱收縮管，層 積於成形品表面等之手法。 然而，進行對最外廓層之塗佈或3次元形狀賦型之時 ，儘可能使此等塗佈層、3次元形狀賦型之層之熱傳導率 提高者爲佳，具體而言爲0.5W/m · K以上，較佳爲1 W/m .K以上，更佳爲2W/m · K以上。 [其他之構成要素、構成例] 於本發明之LED照明具中，做爲使照明具之整體尺 寸變小之構造上之技巧，可較佳例示於LED元件1發光 控制用電子電路之周圍，包圍電性絕緣層1 2 (或電性絕 -52- 201120377 緣層兼補強層）而形成，不相對於電性絕緣層1 2之發光 控制用電子電路側之面之至少一部分，層積形成熱傳導層 2之構成。然而，此時，電性絕緣層1 2與散熱層乃經由 公知之二色樹脂成形法或嵌件成形法、模內裝飾成形法等 之各種複合成形法’而~體成形者亦可。然而，嵌件成形 、模內裝飾成形之時’可將金屬或金屬合金所成散熱層與 樹脂所成電性絕緣層1 2，於成形時加以一體化。 然而’於LED照明具之各接合部中，設置頂板用之 層（例如3圖3之符號1 8 )，抑制來自外部之水分之浸 入，又具有吸收LED照明具之溫度變化等所產生扭曲之 機能者。做爲頂板層1 8，市售之板金、密封材、頂板油 脂等可被較佳地使用。 做爲LED元件1之安裝基板，可使用陶瓷基材、金 屬基材基板、可撓性基板、玻璃環氧基板等。從提高散熱 性之觀點來看，金屬基材基板、可撓性基板尤其爲佳。可 撓性基板乃將聚醯亞胺薄膜、聚萘二甲酸乙二醇酯薄膜等 之耐熱性薄膜做爲基板使用，於基板上雖具有圖案化之銅 箔，使薄膜基板之厚度大約10〜5〇 V m，更佳爲20〜40 #m，可明顯減低對於向厚度方向散熱之熱流而言之熱阻 抗之故，是爲更佳。 又，提高LED元件1之光之利用效率之觀點下，照 射於LED元件1之安裝基板之光射出面側之面的光反射 性爲高者爲佳。此乃使光反射率高之層層積於基板之最表 層者爲佳，與配線圖案之電性絕緣、機械性保護一倂，層 -53- 201120377 積光反射率高之白色樹脂印刷層或白色覆蓋薄膜（例如帝 人Dupont薄膜商標名Teflex薄膜白色反射型等）等者 更佳。就此等之層之反射率而言，爲70%以上，更佳爲 8 0%以上，最佳爲90%以上者爲佳。 又，LED安裝基板1 4與散熱層乃在熱傳達性上優異 之層，即介由低熱阻抗層1 3 (熱傳導性黏著層、熱傳導 性黏著層、熱傳導性薄片等）加以固定者爲佳。使用熱傳 達性不佳之層（高熱阻抗層）時，於安裝基板與散熱層間 ，會產生大的溫度差，散熱性能會變得極端不佳，而成不 喜好之情形者爲多。 然而，在.LED元件1發光控制用電子電路之發熱零 件（1C、線圈等）之散熱促進，或從燈（LED照明具）之 最外廓至外部空氣層之傳熱效率提升之觀點（與空氣分子 之接觸頻繁度之提升、燈外廓附近之層流形成之防止等） 視之，將小型散熱風扇、壓電陶瓷、壓電薄膜等所成振動 板等，安裝於燈上，於燈殻體內或燈外廓附近，經由強制 產生氣流，更可提高散熱能力。尤其可將經由前述發熱零 件或LED發熱限制於燈殻體內部之暖空氣，有效率地向 外部散出，可與外部之冷氣交換之故，可獲得更高的散熱 效果。 此等之振動板乃設置於燈內部或外廓殼體附近爲佳， 亦可於燈外廓1處所乃至複數處所，設置跨過燈內部/外 部之氣流之通氣孔。此等元件之驅動電路乃與L E D元件1 發光控制用電子電路相同，在基板安裝上，設置於燈殼體 -54- 201120377 內者爲佳。而元件則儘可能，使用小型，易於安裝在燈上 ’且可省電者爲佳。對於振動振動板之頻率，雖未特別加 以限定，較佳爲不使人耳有吵雜之感覺，成爲可聽音域以 上之頻率者爲佳’爲20ΚΗζ以上，更佳爲40ΚΗζ以上者 爲佳。 又，除此之外’可將前述振動板固定配置於燈之任一 處所（散熱層、電性絕緣層等），經由以外部電性信號振 盪振動板，於燈之最外廓，可激發微細之振動。由此，振 動傳達至燈之最外廓附近之外氣，可使外氣強制被流動， 在提高燈附近之外氣之流動性下，可提高從燈內部向外氣 之熱散發，而可提高led元件1之散熱性。 然而，將本發明之LED照明具，安裝於熱傳導率高 之金屬或無機氧化物、熱傳導樹脂等之成形體所成之安裝 器具（具有插槽之器具）時，在挾持於LED照明具之最 外廓與安裝器具之空間’挾入高熱傳導性材料所成之層， 提高自LED照明具向安裝器具之傳熱性者爲佳。做爲高 熱傳導性材料所成之層，尤其可較佳列舉熱傳導率1 W/m • K以上之柔軟之樹脂、橡膠所成之層，可事先於led 照明具及或安裝器具內面，層積形成層體者，或將led 照明具固定於安裝器具後，於兩者之間隙，插入層體加以 固定等之方法所實施者。 [LED照明具之全光束量、照度] 本發明之LED照明具乃全光束量爲90流明以上者爲 -55- 201120377 佳。全光束量乃指從LED照明具向外部空間射出之光束 的總量，例如經由積分反射球型之光束測定裝置加以測定 者。 全光束量不足90流明之時，無法實現照明具之各種 用途所需之亮度之情形爲多。全光束量較佳爲1 40流明以 上，更佳爲1 90流明以上，更甚者爲240流明以上，最佳 爲2 90流明以上。然而，此等適切範圍之全光束量乃需在 LED元件之接合面溫度在規定溫度以下之投入電力條件下 加以實現。 又，本發明之LED照明具乃1 m正下方照度爲至少 40勒克斯以上者爲佳。在此，lm正下方照度乃指圖10 所示之配置中，從LED元件1之重心位置（LED元件1 爲複數之時，爲複數之LED元件1之重心位置）向鉛直 方向（與LED元件1之光射出面垂直之方向），在隔離 1 000mm距離之平面（光照射面）上，使通過LED元件1 之重心位置之該平面之垂線與該平面之交點爲LED照明 具之1 m正下方點，而在此點所測定之LED照明具之照度 者。 1 m正下方照度不足40勒克斯之時，在照明具之用途 上，照度會不充分，難以被使用之情形爲多。1 m正下方 照度較佳爲90勒克斯以上，更佳爲140勒克斯以上，更 甚者爲190勒克斯以上，最佳爲240勒克斯以上。然而， 此等適切範圍之lm正下方照度乃需在LED元件1之接合 面溫度在規定溫度以下之投入電力條件下加以實現。 -56- 201120377 [實施例] 以下，雖爲顯示實施例，但本發明非限定於此等者。 然而，實施例1〜12之各値乃根據以下之方法（i ) 〜（1 3 )加以求得。 (1) 瀝青基系石墨化短纖維之平均纖維徑乃根據 JIS R7607，在光學顯微鏡下，使用尺度測定60條，而由 該平均値求得。 (2) 瀝青基系石墨化短纖維之平均纖維長乃使用 SEISIN企業製PITA1，測定1 5 00條，而由該平均値求得 〇 (3 )瀝青基系石墨化短纖維之結晶子尺寸乃測定X 線繞射顯現之（1 1 〇 )面之反射，以學振法加以求得。 (4) 瀝青基系石墨化短纖維之端面乃以透過型電子 顯微鏡，以100萬倍之倍率觀察，以照片擴大至400萬倍 ，確認石墨烯薄片。 (5) 瀝青基系石墨化短纖維之表面乃以掃瞄型電子 顯微鏡，以1 〇〇〇倍之倍率觀察，確認凹凸。 (6 )熱傳導性樹脂組成物之熱傳導率乃由4mm厚之 熱傳導性組成物之成形體，取樣切出3mmx 10mm之長方 形狀，向橫方向排列一體化，使用NETZSCH製LFA_447 ，求得面內方向之熱傳導率。 (7 )樹脂或樹脂組成物之耐衝擊性乃根據 ISO 180/1A，由V型切口耐衝擊強度（V型切口）得。 -57- 201120377 (8 )樹脂或樹脂組成物之體積阻抗乃作成50mmx 100mmx2mm之板狀成形體，使用DIA INSTRUMENTS製 HIRESTA UP力卩以求得。 (9) 成形體之厚度方向之靜電破壞電壓乃根據 IEC6 1000，使用NOISE硏究所股份有限公司製靜電試驗 器模型 ESS-2002，測定成形體之厚度方向之靜電破壞電 壓（KV )。測定乃使用5枚之試驗片加以實施，其中以 最低之値，成爲試驗片之靜電破壞電壓値。 (10) 成形體之厚度方向之絕緣破壞電壓乃根據 IEC60243短時間法，使用YAMAYO試驗器製絕緣破壞試 驗裝置YST-243- 1 00RHO，測定成形體之厚度方向之絕緣 破壞電壓（KV)。測定乃使用5枚之試驗片加以實施， 其中以最低之値，成爲試驗片之靜電破壞電壓値。 (1 1 )執傳導性樹脂組成物之體積阻抗乃作成 100mmx50mmx2mm厚度之熱傳導性組成物之射出成形體 ，使用 DIA INSTRUMENTS 製 LOWRESTA 力口以測定。 (1 2 ) LED照明具之光束量乃將從LED照明具向外 部空間射出之光束，以配置於LED照明具之周圍之積分 反射球加以反射，聚光於受光感測器，進行測定。 (13 ) LED照明具之lm正下方照度乃在於從LED照 明具向鉛直方向離開1 m之平面上之測定點，放置照度計 加以測定。 又，後述之實施例1〜1 2乃根據以下之參考例1〜1 7 者。 -58- 201120377 [參考例1 ]中間相系瀝青石墨化短纖維之製造 縮合多環碳化氣化合物所成之歷青爲主原料。光學性 向異性比率爲100%，軟化點爲2 83 °c。使用直徑0.2 mm<i>之孔之蓋子，從狹縫，將加熱空氣以每分鐘5 5 00m 之線速度噴出，牽引熔融瀝青，製作平均直徑14.5ym之 歷青系短纖維。此時之紡絲溫度爲328 °C，熔融黏度爲 13.5Pa · s ( 135poiSe)。將紡出之纖維，捕捉集中於帶上 而成爲墊子，更且以交錯包裝，成爲400g/m2之瀝青系碳 纖維先驅體所成瀝青系碳纖維先驅體織物。201120377 VI. Description of the Invention: [Technical Field] The present invention relates to an illuminating device that uses a light-emitting diode (LED) in a light source, that is, it can be used to control the directivity or spot diameter of LED illumination light. LED lighting fixtures that are excellent in light weight, design, electrical reliability (insulation reliability), and floor safety, and have sufficient thermal reliability (heat dissipation) and mechanical reliability (mechanical strength). [Prior Art] In recent years, light-emitting diodes (LEDs) with energy-saving and long-life characteristics have been widely used as lighting devices for light sources, as a substitute for white light electric guns, halogen lamps, xenon lamps and the like. . (Patent Documents 1 and 2) [Prior Art Document] [Patent Document 1] [Patent Document 1] JP-A-2009-93926 (Patent Document 2) JP-A-2001-243809 (Summary of Invention) [Invention Problem to be solved] However, when the LED lighting fixture proposed in the past is compared with various conventional lighting sources such as white-woven electric guns, halogen lamps, xenon lamps, etc., the directivity control required for illumination light (light distribution, point) The control of the diameter, etc.) is difficult to call the charging -5, 2011,20,377 points, and it is easy to become the light source of the LED element. It is very dangerous when it is directly viewed, and it cannot be used as the illumination of the eye. problem. [Means for Solving the Problem] The LED lighting device of the present invention is an LED lighting device characterized by at least the following constituent elements. 1) an LED element 2) a light-transmissive layer that enters the light emitted from the LED element from a surface on a light-emitting surface side of the LED element, and a LED element that is provided on a layer that is transparent to the light-transmitting layer The surface of the light-emitting surface is on the opposite side, and the incident light is emitted, and the vertical direction of the light-emitting surface of the LED element is 45° or more and 135 degrees or less, and the emission is stronger than other angle ranges. The light guiding diffusion layer 3) of the optical function is incident on the surrounding frame of the LED element that emits light from the light guiding diffusion layer. The present invention is the light guiding diffusion layer, and the light emitted from the LED incident on the light guiding diffusion layer The total amount of light has an amount of light emitted from the light guiding diffusion layer in an angular range of 45 degrees or more and 135 degrees or less in the vertical direction, and is equivalent to the LED element with respect to the light guiding diffusion layer. The opposite side of the surface, for the vertical direction, the LED illuminating device is characterized by a large amount of light that is emitted to an angle range of less than 45 degrees above the twist. 0 -6- 201120377 Further, the present invention is relative to the foregoing guide Light expansion a surface of the LED element of the dispersion layer or a space between the light guide diffusion layer and the LED element, and a light refraction that refracts light emitted from the LED element and converges in a direction perpendicular to the direction in which the emitted light is emitted Lens is a characteristic LED lighting fixture. Further, the present invention also includes a housing having a reflecting surface having a light reflectivity, and an LED illuminator characterized in that the light emitted from the light guiding diffusion layer is reflected by the reflecting surface and is emitted in the vertical direction. Furthermore, the present invention relates to an LED having a heat conduction layer in which at least one of the layers is disposed close to the LED element and has a thermal conductivity of at least one direction of 2 W/m · K and an average thickness of 0.5 to 10 mm. Lighting fixtures. Further, the electronic circuit for controlling the light-emitting control of the LED element, the electronic circuit for controlling the light-emitting of the LED element has a volume impedance of 1 〇 Ω·cm or more, and the electrostatic breakdown voltage of the IEC61000 standard in the thickness direction is 5 kV or more, and the dielectric breakdown voltage is 〇. An LED illuminator that is surrounded by an electrically insulating layer having an average thickness of 0.3 to 3 mm or more, which is a layer of LED illuminators having a V-notch impact resistance of 5 kJ/m 2 or more. Further, an LED illuminator in which a heat conduction layer is formed is laminated on at least a part of a surface on the side of the light-emission drive control circuit of the electrically insulating layer formed around the LED element light-emission control electronic circuit. Furthermore, the present invention is an LED illuminator in which a peripheral frame and/or a light transmissive cover layer and/or a light guiding diffusion layer and/or an electrically insulating layer of the LED element are layers of a resin or a resin composition. Further, in the present invention, the present invention is a peripheral frame of an LED element, and at least a part of the LED mounting substrate is pressed at the bottom portion to be fixed to the LED illuminator in the LED illuminator. [Effect of the Invention] The LED illuminating device of the present invention can control the directivity or spot diameter of the LED illumination light, and is advantageous for the illumination of the eyes, and for the components of the LED illuminator, the resin molding material is used. It can be used as an LED illuminator with excellent thermal reliability (heat dissipation) and mechanical reliability (mechanical strength) in terms of lightweight, design, electrical reliability (insulation reliability), and floor safety. Used in a wide range of uses. [Embodiment] As described above, the LED lighting device of the present invention is an LED lighting device characterized by having at least the following constituent elements. 1) In the layer of light transmittance provided by the LED element 2) which is a light source, which is close to the emission surface side of the LED element, a concave portion having a substantially inverted conical shape is formed on the surface of the surface opposite to the LED element and the layer on the opposite side. The total reflection surface, after the light emitted from the LED element is guided to the vertical direction of the LED element, is totally reflected on the total reflection surface. For the vertical direction, the angle range of 45 degrees or more and 135 degrees or less has the strongest light emission. The functional light-diffusing layer 3) the surrounding frame of the LED element. However, the direction of the straight line is the direction perpendicular to the light-emitting surface when the light-emitting surface of the LED element (plane 201120377) is used as a reference. Further, the 'plane direction' is a direction parallel to the light-emitting surface when the light-emitting surface (plane) of the LED element is used as a reference. Moreover, the LED illuminating device of the present invention is used as a mirror-attached halogen lamp (a color-matching halogen lamp or the like which is similar to a known light source). In the LED illumination device, at least a part of the surrounding frame of the LED element has a light reflecting frame, and the light emitted from the light guiding diffusion layer is on the frame surface having light reflection, and after the light is reflected, the light is received. An LED illuminator for an optical system that emits light to the outside through a permeable cover layer. Hereinafter, an embodiment of the present invention will be described in order. [Specific Configuration Example of LED Illuminator] A specific configuration example of the LED illuminator of the present invention is Illustrated in Figures 6, 21~24, 27, 31, 39, 40, 42 and 43. Figures 42 and 43 are external views of the LED illuminator of Figure 24 when viewed from an oblique direction, in which the electrically insulating layer 12 is shown. There is a three-dimensional shaped layer 19. Further, Fig. 1 to Fig. 2 1 to 2 4, 2 7, 3 1 , 3 9 , and 40 are examples of sectional views of the LED lighting device. Figs. The section of the A- Α' section corresponds to the example of the LED illuminator of the figure. However, the section cut The positions of the faces are shown in FIGS. 1 to 6, 21 to 23, 27, 31, 39, and 40, and the LEDs are also identical. These are common to the light-diffusing diffusion layer 3. In the light-guiding diffusion layer 3, On the surface opposite to the opposite side of the LED element 1 (the total reflection surface shown in Fig. 3a and the source of the abyss surface shown in symbol 3b of Fig. 26), the appearance will be as follows. 2525-9-201120377 2 formed faces), forming a total reflection surface (the total reflection surface 3a of FIG. 5) of the recessed portion having a substantially inverted conical shape, and guiding the light emitted from the LED element 1 to the vertical direction of the LED element 1 (in the longitudinal direction in the figure), most of the light is totally reflected into the light guiding diffusion layer 3 on the total reflection surface 3a. Here, the concave portion having a substantially inverted conical shape refers to a portion of the V-shaped valley shape as seen in the cross-sectional view of the total reflection surface shown by symbol 3a in Fig. 25, and the examples of Figs. 1 to 6, 9', 14 to 28, and 31 are common. The light-conducting diffusion layer shown by the symbol 3 is not only a V-shaped word formed by a complete straight line, but also includes a V-shaped shape which is somewhat curved. In other words, when expressed in a three-dimensional shape, it includes a concave shape having a completely inverted conical shape, and a concave shape having a somewhat inverted conical shape. In the present invention, in conjunction with these, the present specification is expressed by "a concave portion having a substantially inverted conical shape". According to the total reflection, a plurality of LEDs that are guided to the vertical direction emit light in the direction in which the light is directed, and the direction of the plane is changed from the vertical direction (the horizontal direction in the drawing) to 45 degrees in the vertical direction from the light guiding diffusion layer 3. The above angle range of 135 degrees or less (illustrated in Fig. 32 of the relative position 26 of the LED element 1) emits the strongest light. Here, 'the light that emits the strongest light' is the total amount of light emitted from the LED that is incident on the light-guiding diffusion layer 3, and is emitted from the light-guiding diffusion layer 3 in the vertical direction to an angle of 45 degrees or more and 135 degrees or less. The amount of light in the range is at least two from the surface opposite to the surface of the LED element 1 of the light guiding diffusion layer 3 (the total reflection surface shown by the symbol 3a in Fig. 25 and the abdomen surface shown by the symbol 3b in Fig. 26). In the vertical direction, the amount of light that is emitted to an angle range of less than 45 degrees above the twist is the largest. -10- 201120377 That is, in the "LED illuminators", the light emitted by the LED element 1 is incident on the lower surface of the light-guiding diffusion layer 3, and then guided to the light-diffusing layer 3, and then on the light-diffusing layer 3 The total reflection surface 3a, which receives most of the total reflection 'after shifting the traveling direction, exits the light guiding diffusion layer 3. Although the shape of the light guiding diffusion layer 3 is different, the light that is totally reflected at the total reflection surface 3a 'in many cases' becomes the side surface from the light guiding diffusion layer 3 (the surface shown by the symbol 3d in Fig. 25). The form of the shot. Here, by using the light guide diffusion layer 3 having a suitable shape, it is possible to emit strong light in an angular range of 45 degrees or more and 135 degrees or less in the vertical direction. Here, the "generally" LED element 1 emits light in the vertical direction in addition to the case where a special optical lens is laminated on the element, and the light projection is expanded in a small amount. In other words, in the vertical direction, the amount of light emitted in an angular range of less than 45 degrees above the twist is 50% or more of the total amount of light emitted from the LED element 1. As described above, in general, the light-transmitting diffusion layer of the present invention has an angle range of 45 degrees or more and 135 degrees or less in the vertical direction with respect to the LED light emitted from the vertical direction. The function of the path of travel can greatly expand the direction of light emission. As described above, when the conventional LED lighting device of the light guiding diffusion layer of the present invention is not used, the LED emitting light is straightforward, and the light expansion method is small, as long as it is not far from the LED lighting device, each of the outgoing light is cut. The energy of the area (beam density) is large, especially in high-illuminance LED illuminators, which may cause light that cannot be directly viewed. 'The light is not soft to the eyes, etc. -11 - 201120377 For this, the light guide of the present invention is used. In the case of the led illuminator of the diffusion layer, the directivity of the light emitted from the LED is suppressed, and the spread of the light is increased, so that the energy (beam density) of the cross-sectional area of each of the emitted light is relatively small, and becomes a soft light to the eyes. Further, in the LED lighting device of the present invention, the LED illuminating device in the form of a light reflecting the light-diffusing layer and being reflected by the frame-reflecting surface 6a having the light-reflecting property is further reflected in the frame illuminating surface. The inclination angle or shape of 6a is controlled to narrow the angular distribution of the reflected light, and the LED illumination light having a high directivity close to the parallel light can be obtained. At this time, the frame reflection surface 6a having a larger area than the emission surface of the LED element 1 operates as a pseudo-light source, and the direct light emitted from the LED element 1 is different from that of a point light source. It is a light of the surface, even if it is designed such that the angular distribution of the emitted light is narrow and the directivity is strong, it can also become a soft light for the eyes. Figures 1 to 3, 21, 23, 24, and 27 are It is used as a LED illuminator in which the directivity (light distribution) of a known halogen lamp or the like which is used for point illumination can be controlled. In such an LED lighting fixture, at least a part of the frame reflection surface 6a having light reflectivity is used in the frame 4 around the LED element. In the LED lighting device of the present invention, the light emitted from the light guiding diffusion layer 3 in an angular range of 45 degrees or more and 135 degrees or less in the vertical direction is reflected on the frame reflecting surface 6a, and is further reflected. The direction of the vertical direction is the center, and the direction of travel is changed. Then, the light-transmitting cover layer -12-201120377 5 ' is emitted to the outside of the LED illuminator. Here, the formation surface of the approximately opposite conical recess on the light guiding diffusion layer 3 appears to have a light source as it is, i.e., operates as a pseudo light source. With such a system, it is possible to make the LED with the light distribution of the circle lamp (dichroic halogen lamp) and the like which are similar to the conventional ones, and which is similar in appearance and suitable for use as a point light source. Lighting fixtures. However, as exemplified in the optical path corresponding to the symbol 28 of FIG. 37, in the LED lighting device of the present invention, a part of the light emitted from the LED element 1 is from the portion other than the frame reflecting surface 6a, that is, from the light. The part that is transparent can be directly injected into the external space. This is because the light is partially leaked on the side and rear sides of the LED illuminator, and the LED illuminator is designed to be aesthetically pleasing when viewed from the side and the rear side. However, the object is to illuminate the frame reflection surface 6a through a part of the light path, and to reflect the semi-transmissive light reflection (half mirror or the like), as illustrated by the light path corresponding to the symbol 29 of FIG. The method of emitting the light to the external space through the semi-transmissive portion is realized. In this way, when a part of the light is intentionally leaked on the side surface and the rear side of the LED illuminator, when the total light beam of the LED illuminator is 100, the entire light beam is transmitted through or through the surrounding frame from the surrounding frame. The ratio of the light beam emitted from the outer peripheral surface is in the range of 1 to 40, preferably in the range of 2 to 30, more preferably in the range of 3 to 20. When the ratio is less than one, the leakage of light cannot be sufficiently observed, and the design effect, the pattern, and the like are likely to be insufficient. In addition, when the ratio is more than 40, the amount of light that is emitted in the vertical direction of the LED illuminator will become insufficient. Under the illuminance necessary, it is not preferable. As described above, when a part of the light is not intentionally leaked on the side and rear sides of the LED illuminator, when the total light beam of the LED illuminator is 100, the entire light beam is transmitted through or through the surrounding frame. It is preferable that the ratio of the light beam emitted from the outer peripheral surface of the surrounding frame is less than one. Here, the amount of the beam (the total amount of light) emitted from the LED illuminator to the external space is disposed at the center of the integral reflection ball of the dedicated measuring device, and is provided with an LED illuminator to emit light from the LED illuminator to the external space. The surface of the integral reflecting sphere is reflected, and the reflected light is collected by a light receiving sensor, and the light intensity is measured and calculated. Further, the amount of the light beam emitted from the outer peripheral surface of the surrounding frame through or through the surrounding frame is, for example, the light-transmitting cover layer 5 of the LED illuminator is removed, and the black plate replaced by the light absorbing property is replaced (at the time of measurement of the present invention) By using a light-absorbing transmittance of 0% and a light absorption rate of 97% or more, a light-absorbing black plate is used to completely shield the light emitted from the LED illuminator in the vertical direction, and the same integral reflection ball is used. The measurement of the light intensity was calculated. However, the control of the light emission angle distribution of the LED illuminator using the frame having such light reflectivity is carried out by designing the shape of the light guiding diffusion layer 3 and the frame reflecting surface 6a. In the overall design, in the case where the design freedom of the frame reflection surface 6a is as high as possible, it is preferable that the light emission angle range from the light guide diffusion layer 3 is set to be smaller than the aforementioned suitable range. That is, it is preferably designed such that the light guiding diffusion layer 3 is in the range of angles of 50 degrees or more and 13 degrees or less in the vertical direction, and more preferably in the range of angles of 50 degrees or more and 13 degrees or less. Preferably, the amount of light emitted by the angle range of 60 degrees or more and κο degrees or less is larger than the side opposite to the surface opposite to the LED element 1 of the light guiding diffusion layer 3, and the direction of the vertical direction is less than 45. The amount of light in the angular range is preferably greater. Further, it is preferable that the light beam emitted from the light guiding diffusion layer 3 is designed to have a convergence point before reaching the frame reflecting surface 6a. In this case, the parabolic surface, the hyperboloid, etc., where the convergence point is the focus, can be The shape of the frame reflection surface 6a or the shape of the base is utilized. However, the convergence point is not a strict point, and it can be used in optical design without causing major troubles. Further, in the examples of Figs. 4 to 6, 22, and 31, unlike the above-described examples of Figs. 1 to 3, 21, 23, 24, and 27, the peripheral frame 4 of the LED element 1 is mostly light-transmitting. From the light guiding diffusion layer 3, in the vertical direction, light emitted from an angle range of 45 degrees or more and 135 degrees or less is transmitted through the surrounding frame 4 of the LED element 1 to the outside of the LED lighting fixture, and is widely used in a wide angle range. Shoot out. In such LED lighting fixtures, it is preferable to design the LED lighting fixture to emit light as far as possible from a wide angle. The direction from the light guiding diffusion layer 3 is 45 degrees to the vertical direction. As described above, it is preferable that the injection ratio of the angle range of 135 degrees or less is maximized, and it is preferable to include an angle range other than the angle range as much as possible. Here, the formation surface of the approximately opposite conical recess on the light guiding diffusion layer 3 appears to be a light source, i.e., as a pseudo light source, -15-201120377. According to such a system, it is possible to provide an LED illuminator having a very wide-angle distribution of light distribution, which is similar in appearance to a conventional bulb type lamp, a small xenon lamp, and the like. However, in the LED lighting device illustrated in the above, the heat conductive layer 2, the light guiding diffusion layer 3, the surrounding frame 4 of the LED element 1, the screw fitting portion 4a of the surrounding frame 4 of the LED element 1, and the light transmissive covering layer. 5. Frame reflection surface 6a, light reflection layer formation portion 6b, arrangement space 7 of LED element 1 light emission control electronic circuit, insulator portion 8, contact points 9a, 9b, electrically insulating layer 10, electrically insulating layer (also reinforced layer) 1, 2, low thermal resistance layer 3, LED mounting substrate 1 4, surface protective electrical insulating film 5, adhesive sheet 6, low thermal resistance, resistant adhesive layer or thermal grease layer 17 , top layer The first and third dimensional shaped layer forming portions 19, the first heat dissipating layer 20, the second heat dissipating layer 21, the light refraction lens 23 (Fig. 3 1), and the light reflective light reflecting layer 24 (Fig. 31) The shape of the cross-sectional view viewed from the front in each figure, which is rotated in the direction of the vertical axis, looks like a circular or concentric shape in the above figure. However, in the relationship between the combinations of the parts, there is a case where one part is removed in the circumferential direction and becomes an arc shape. Of course, the structure of the thermally conductive resin composite molded body or the LED lighting device of the present invention is not limited to those exemplified, and the shape shown in the above figure is a polygonal shape, and various versions are available. Further, it is preferable that the components are fixed by an adhesive or a screw lock as needed. Further, if necessary, in order to prevent moisture from entering, an adhesive having excellent sealing properties or a sealing material can be used. -16- 201120377 [LED component 1] is a light-emitting diode (LED) type light-emitting element used as a light source for LED lighting. In the present invention, since the LED illuminator can obtain sufficient illuminance, optical design, and structure miniaturization, it is preferable to use a wafer type high output LED, and it is suitable for use as a quota output of 0.5 W or more. It is preferably 1 W or more, more preferably 2 W or more. The luminescent color is not particularly limited, and may be used for various color temperatures, or for coloring purposes, but when used for general purposes, a bulb-shaped or white-type LED element similar to a commercially available known bulb is used. It is better. LED element 1 Generally, as a component characteristic, although internal thermal resistance is specified, it is preferable that the internal thermal impedance is small, preferably 20 ° C /W or less, and more preferably 10 t /W or less. It is better to use 5 ° C /W or less. One LED element 1 can be used, and a plurality of LED elements can be used. The position of the LED element 1 is determined by optical design (design of directivity and light distribution), and the light-diffusing diffusion layer 3 and the surrounding frame 4 described later are considered (the light reflection layer 6 is disposed on the inner surface). a) The positional relationship is set at the appropriate location. For example, when the LED light illuminator as illustrated in FIG. 1 has a shape in which the light guiding diffusion layer 3 (cylindrical shape) and the surrounding frame body 4 (hemispherical shape) are rotationally symmetrical, when one LED element is used, it is provided. The position near the axis of the center of rotation is preferred. Further, when a plurality of LED elements 1 are used, it is preferable to arrange such center-of-gravity positions near the axis of the rotation center and to arrange the LED elements 1 as close to each other as possible. -17- 201120377 [Light-Conducting Diffusion Layer 3] The light-guiding diffusion layer 3 is formed of a material that is close to the light-transmitting property provided on the emitting surface side of the LED element 1, and has a concave-shaped concave portion shape, and the light guiding is The layer of light from the LED element 1 is diffused. The concave-shaped concave portion shape portion is a total reflection surface 3a. Here, "light transmittance" means that the light transmittance is high in the main light-emitting wavelength band of the LED element 1 used as the light-emitting source of the LED lighting device of the present invention, and more specifically, it is defined as being formed. The material of the light-diffusing diffusion layer 3 is formed into a flat plate having a thickness of 2 mm, and at least 2 nm width in the wavelength range (for example, 400 to 42 Qnm '540) when the light transmittance is measured in the visible wavelength range of 400 to 70 Onm. In the wavelength band of ~560nm, etc., it has a light transmittance of 70% or more. Here, the light transmittance is preferably 80% or more, more preferably 85% or more, and most preferably 90% or more. Further, the wavelength range in which the light transmittance is 70% or the size of the band is not particularly limited. For example, when the white LED element 1 is used, in addition to coloring the illumination light, the light-diffusing layer 3 itself has light absorption. In addition, in the case of a wavelength of 400 to 700 nm, the light transmittance of 70% or more is good. The light-diffusing layer 3 of the present invention is as described above, and is opposite to the opposite side of the LED element 1. The surface of the layer forms a total reflection surface 3a formed by a concave portion having a substantially inverted conical shape, and after the LED element 1 emits light to the vertical direction of the LED element 1, it is totally reflected on the total reflection surface 3a, for the vertical direction. 'In the angle range of 45 degrees or more and 135 degrees or less, it has the function of emitting the strongest light. -18-201120377 In other words, the light guiding diffusion layer 3 has at least an amount of light which is emitted from the light guiding diffusion layer 3 in an angular range of 45 degrees or more and 135 degrees or less in the vertical direction, and is different from the light guiding diffusion layer 3 The surface on the opposite side of the surface of the LED element 1 is preferably a function of an amount of light that is emitted in an angular range of 0 degrees or more and less than 45 degrees in the vertical direction. In other words, when the amount of light emitted from the light guiding diffusion layer 3 in the angular direction of 45 degrees or more and 135 degrees or less is 1 , from the light guiding diffusion layer 3, the surface opposite to the LED element 1 of the light guiding diffusion layer 3 is faced. On the opposite side, in the vertical direction, the amount of light emitted from an angle of 0 degrees or more and less than 45 degrees is preferably 70 or less, more preferably 50 or less, even more preferably 30 or less, and most preferably 2 0. the following. Regarding the shape of the recessed portion which is approximately inversely conical, the shape is not limited to a completely inverted conical shape, and includes a shape similar thereto, for example, including a surface whose taper surface is somewhat curved (for example, symbol 3 of Fig. 4 or Fig. 6). That is, even if it is not completely inverted conical, it can be used as a shape similar to that of the total reflection surface 3a. That is, the concave portion having a substantially inverted conical shape can be used as the total reflection surface 3a for the light incident on the portion, and it is preferable that the vertical direction has a certain inclination. When the incident angle of the incident light is only in the vertical direction, the critical angle of the total reflection can determine the appropriate range of the tilt, but in reality, the incident angle of the incident light has a certain degree of variation for the vertical direction. In the case of the vertical direction, it is preferable to incline in the range of about 0 to 60 degrees. That is, the total area of the surface opposite to the side of the 19-201120377 side of the LED element 1 of the light-diffusing diffusion layer 3 formed by the approximately concave conical recess is 0 to 60 degrees in the vertical direction. It is preferable that the integrated area of the surface of the inclined angle range accounts for 50% or more. The recessed portion having a substantially inverted conical shape is preferably the same as the shape of the total reflection surface of the total reflection condition determined by the refractive index difference between the two media of the reflecting surface and the total incident angle of the light incident on the reflecting surface. A metal layer having a high light reflectance, a single layer film or a laminated film such as a dielectric layer may be laminated on the concave portion of the approximately conical shape as needed. However, on the side of the LED element 1 side of the light guiding diffusion layer 3, or in the space of the light guiding diffusion layer 3 and the LED element 1, the light emitted from the LED element 1 is refracted or reflected, and the vertical direction is centered. It is preferable that the traveling direction of the convergent light is an optical layer having a function of increasing the ratio of light directly incident on the total reflection surface 3a formed by the recessed portion having a substantially inverted cone shape. The optical layer is preferably provided for the purpose of improving the light utilization efficiency of the light emitted from the LED element 1, or for the purpose of obtaining the soft illumination light by the person who has the object of the present invention. The optical layer for this purpose may, for example, be a light-refractive lens having a concave-convex shape (for example, a convex lens of the symbol 3c of FIG. 25), a Fresnel mirror, a light reflection by a reflection layer of a total reflection of a air interface or a high light reflectance. Mirrors, etc. Among them, those who can efficiently converge light in a limited space and improve the light incident efficiency of the total reflection layer are particularly advantageous in that the control of the light incident angle of the total reflection layer is excellent, etc. The lens of the refracting surface of the light can be advantageously used. It is preferable that the light-refracting lens is disposed on the side of the LED element 1 of the light-guiding diffusion layer 3, and it is preferable that the LED element 1 is provided in a direction in which the lens is convex -20-201120377. Further, in some cases, in addition to the light guiding diffusion layer 3, a light refraction lens is preferably provided, and is disposed in a space sandwiched between the light guiding diffusion layer 3 and the LED element 1. In the latter case, the light guiding diffusion layer 3 and the light refracting lens may be directly laminated, or may be separated and disposed at a certain distance (in some cases, an air layer may be interposed). For example, in the LED lighting device of the present invention which is illustrated in the spherical electric lamp type of FIGS. 4 to 6, the position of the total reflection layer which is to operate as a pseudo light source is arranged, and is disposed near the center of the spherical frame 4 around the spherical shape. At the time of "there is a need to obtain a large spatial distance between the total reflection surface 3a of the light guiding diffusion layer 3 and the LED element 1. In this case, in optical design, the spatial distance between the light-refracting lens and the LED element 1 is not increased, and the spatial distance between the large light-refracting lens and the light-guiding diffusion layer 3 is preferably high. Considering the light-diffusing diffusion layer 3 The light loss caused by the absorption of the internal light, the increase in the weight of the part, and the decrease in the shape accuracy caused by the forming shrinkage may be preferable in the case of separation. However, as illustrated in FIGS. 31, 33, 34, 35, 36, 39, 40, 41, the periphery of the LED element 1 or a part of the LED element 1 and the light-diffusing diffusion layer 3 or the light-refractive lens 23 (FIG. 31) is enclosed. In the form of the light reflection layer 24 having a light reflectance of 50% or more. The light reflecting layer 24 emits light from the LED element 1 and takes light that is not directly incident on the light path of the light guiding diffusion layer 3, that is, the light guiding diffusion layer 3 or the light refraction lens 2 is not provided (FIG. 3 1 The light emitted in the direction of 'transparent reflection' increases the total amount of light incident on the light guiding diffusion layer 3 by incident on the light guiding diffusion layer 3 or the light refraction lens 23 (Fig. 3 1). Its purpose. However, the light-reflecting layer 24 may be exemplified as shown in Figs. 31, 39, 40, 41 - 21 - 201120377, and may also have a mechanical support layer of the light-diffusing diffusion layer 3 or the light-refractive lens 23 (Fig. 31). Examples of the light-reflecting layer 24 include a layer formed of a resin material such as a composite light-reflecting pigment (titanium oxide or calcium carbonate), a metal material which is vaporized in the resin molded layer, and a high light reflectance. Further, a layer formed by lamination, a layer formed of a metal having a high light reflectance, and a layer formed of a film having high light reflectivity are bonded to the resin molded layer. The light reflectance of the light-reflective layer 24 is preferably 60% or more, more preferably 70% or more, still more preferably 80% or more, and most preferably 90% or more. However, when the light-reflecting layer 24 is adhered and fixed to the LED mounting substrate 14, it can be used as a heat sink for radiating the heat of the LED mounting substrate 14 to the outside. In this case, it is preferable to form it in a shape having a large surface area, and as a material of the layer, it is preferable to use a material having a high thermal conductivity and a high infrared radiance. The shape of the light-refracting lens 3c or 23 (FIG. 31) is preferably a curved surface formed by one of the spherical surfaces illustrated in FIG. 1 or FIG. 2, or a curved surface formed by one of an elliptical curved surface, a hyperbolic surface, and a parabolic surface. The conical surface illustrated in Fig. 3 or Fig. 5, the curved surface exemplified in Fig. 4 or Fig. 6, and the like may be in the shape of a Fresnel lens. Further, it is also possible to combine the shapes of a plurality of spheres, cones, and curved surfaces. The control of the convergence of the light emitted from the LED is performed on the curved surface, through the curvature, in the case of a conical shape, by the inclination angle of the tapered surface or the like. However, in the LED lighting device, when a plurality of LED elements 1 are used, as illustrated in FIG. 14 (in the case where two LED elements 1 are used herein), -22 to 201120377 are illustrated, corresponding to the positions of the respective LED elements 1. The position may be a convex shape formed by a plurality of light-refracting lenses 3c or 23 (Fig. 31). In this case, it is preferable to align the vertical line passing through the position of the center of gravity of the light-emitting portion of the LED element 1 with the apex of the convex portion which becomes the light-refractive surface. However, the plurality of LED elements 1 are arranged in an array. In the LED lighting device, the position of the LED element 1 can be matched as needed, and a plurality of light guiding diffusion layers 3 are arranged in an array. In particular, when the LED elements 1 are arranged in a plurality of arrays on a straight line, or when the LED elements 1 having a large aspect ratio or the like, the light guiding diffusion layer 3 can be used in a specific direction as shown in FIG. Light guiding diffusion layer 3. The material of the light-transmitting diffusion layer 3 is preferably a resin or glass which is excellent in transparency, and is particularly suitable for using a polymethyl methacrylate resin and the copolymer (particularly comprising a ring and a structure formed by the derivative) ), a polycarbonate resin, the copolymer, a polylactic acid resin, the copolymer, a cyclic polyolefin, and the copolymer (especially comprising a ring and a structural resin formed by the derivative, for example, a registered trademark of the SR) ARTON", the registered trademark "APEL" of Mitsui Chemicals Co., Ltd., and the registered trademark "ΖΕΟΝΕΧ" in Japan, etc.) 'Polymethylpentenes and copolymers (such as Mitsui Chemicals registered trademark "ΤΡΧ", etc.), polyoxyalkylene A resin such as a resin or an epoxy resin, or an inorganic glass material (such as quartz glass) is preferable from the viewpoint of lightness and design. The molding method can be selected in accordance with the method of the shape of "self-injection molding, press molding, casting (polymerization), blow molding, and the like. -23- 201120377 However, the light guiding diffusion layer 3 of the present invention has a shape which is intended to utilize the shape of a plurality of inclined surfaces of the total reflection and refraction phenomenon of the light guiding diffusion layer 3 and the air interface, thereby having an appropriate design. The light guiding diffusion layer 3 of the plurality of inclined surfaces is inside the layer, and the function of guiding the light of the LED is added, thereby improving the light incidence efficiency (light introduction efficiency) from the LED light source to the light guiding diffusion layer 3, or The LED light emitted from the light guiding diffusion layer 3 is extended to a wide angle, and is emitted through a wide angle, and the amount of light incident on the surrounding frame 4 formed by the light reflecting layer 6a or the like is increased, due to re-reflection in the light reflecting layer 6a. The realization of the optical system of the illumination light having high directivity and the like can be suitably used for the purpose of working as a lens or a light diffusion layer, etc., regarding the shape design of the light guiding diffusion layer 3, as shown in the figure As shown in Fig. 6, there are mainly the following parameters. That is, from the LED element 1, the vertical direction is the Z axis, and the surface perpendicular thereto is the XY plane, and when the Z coordinate of the surface of the LED element 1 is z=0, A) the incident lens surface of the light guiding diffusion layer 3 ( 3 c ) Z coordinate (z 1 ), B) radius of curvature of the incident lens surface (rl), C) cone constant of the incident lens surface (kl), D) XY plane projection length of the incident lens surface ( Pl), E) Z coordinate (z2) of the vertex position of the total reflection surface 3a, F) Z-axis projection depth (ql) of the total reflection surface 3a, G) Shape control parameter (q2) of the total reflection surface 3a, H) The XY plane projection length (p2) of the total reflection surface 3a, I) the XY plane projection length (p3) of the opposite side surface of the light-conducting diffusion layer 3 opposite to the LED element 1, and the like. However, the unit uses mm. Here, the cone constant (k) of C) is a parameter specifying the shape of the curved surface (conical surface) -24-201120377, which is supplied below. Here, when k = 0, it is spherical, -1 <k <〇 is an elliptical surface, k=-l is a paraboloid, k <-l is a hyperbolic surface, and k> is a spherical surface. b = c a2/ [1+ {1 — (1+k) c2 a2} 1/2] (Formula 1) (here, a and b show the length of the part shown in Fig. 17. c is the surface The curvature corresponds to the reciprocal of the radius of curvature. Further, the shape control parameter (q2) of the G) total reflection surface 3a is shown in Figs. 18 to 20, and is in the middle of the total reflection surface 3a (through the total reflection surface). The intersection of the XY plane of the point in the depth ql of 3a and the slope of the concave section), the control point is set, and the control point/rotation axis is approximated by the shape of the surface of the spline curve of the control point (3 times). The distance (q2) is used as a parameter, and the shape is expressed by changing the parameter. Further, the refractive index of the light guiding diffusion layer 3 is also one of such design parameters. These parameters are distributed via the illuminance of the purpose, although the optimum range is different, and as a general range, it is approximately as follows. Zl: 0 to 5 mm (more preferably 1 to 3 mm) z2: 7 to 50 mm (more preferably 12 to 20 mm) rl: 2 to 15 mm (more preferably 4 to 10 mm) kl: -1.2 to 1.0 (better for - 0.8 to 0.5) pi, p2, p3: 3 to 50 mm (more preferably 6 to 30 mm) ql: 1 to 20 mm (more preferably 2 to 14 mm) q2: 0.5 to 8 mm (more preferably 0.5 to 6 mm) pi/p 3 = 0.1 to 1_5 (more preferably 0.3 to 1.2) -25- 201120377 ρ2/ρ3 = 0·8 to 1 (more preferably 0.9 to 1) ql/p 2 = 0.2 to 1.5 (more preferably 0.4 to 1) Q2/p2 = 0.1 to 0.4 (more preferably 0.13 to 0_3) Refractive index of the light-transmitting diffusion layer 3: 1.4 to 1.7 (more preferably 1.48 to 1.62) However, here, the suitable range is for the light guide The basic unit of the shape of the diffusion layer 3 that achieves the above-described function is defined in that the basic unit of the light-diffusing diffusion layer 3 is a light-diffusing diffusion layer 3 formed by arranging a plurality of arrays, or a part of a basic unit of fusion adjacent When the light-diffusing layer 3 or the like illustrated in FIG. 22 is used, the above-mentioned suitable range is not necessarily applicable. Further, the XY-surface image of the total reflection surface 3a or the light-diffusing diffusion layer 3 does not necessarily need to be circular. Can also be oval, square, rectangular, etc. . As an example of the actual optical system, for example, in the optical system used in the first embodiment (shown in FIG. 1 for the schematic drawing), A) is zl = 2.5 mm, B) is rl = 6 mm, and C) is k. =0, D) is pl=10mm, E) is z2 = 12.8mm, F) is ql=6.0mm, G) is q2 = 2.9mm, H) is p2 = 12mm. In the first embodiment to be described later, in the plane (light-irradiating surface) at a distance of 1 000 mm from the position of the LED element 1 shown in Fig. 1 to the vertical direction, the directivity shown in Fig. 11 can be obtained. The point-like illuminance distribution can obtain the illuminance of one-half of the maximum illuminance from a position directly below the LED formed by the maximum illuminance at a position of about 100 mm. The illuminance distribution is in a commercially available point light source, and is suitable for suppressing the light expansion -26-201120377 type (a preferred type of a narrow range of strong illumination), and in the fifth embodiment to be described later, the light diffusion is The first embodiment of the layer 3 is the same, but the LED element 1 (about 4 mm square) is placed in a system in which two are arranged at a center interval of about 5 mm, and the light irradiation surface is about 320 mm away from the position directly under the LED. The position, in the Y direction, about the distance from the ,, gives the illumination of one-half of the maximum illuminance. In the point light source sold by this illuminance, an illuminance distribution suitable for a pattern in which the diffusion of light is increased (the range in which the range is softly irradiated) is obtained. However, in the first and fifth embodiments, it is more necessary to increase the illumination (suppressing the light spread and raising the direct side of the LED element 1), for example, the selection of the following parameters is effective. That is, 4.7mm, B) is rl = 7mm, C) is k = -0.37, 10mm is not changed, E) is z2 = 13.7mm, F) is ql change, G) is q2 = 2.2mm, Η) is p2 = In the first embodiment, in the first embodiment, in the light-irradiating surface, the position directly under the LED of the illuminance is separated by about 80 mm, and the light-irradiating surface is separated from the LED in the X direction. In the position of about 1 90 mm, in the position of 180 mm on the Y side, one-half of the maximum illuminance can be obtained at the same time to improve directivity (inhibition of light expansion). [Rear Frame 4 around LED Element 1] Further, the surrounding frame 4 is exemplified by the illuminance distribution as illustrated in Fig. 1 . Although the parameter is about 0.9 mm from the real height, the distribution of the cold X direction of the optical system, _ 2 50 mm is suitable for the directional brightness of the wider light. A) is z 1 = D ) is p 1 = = 6.0mm does not mean that it is in the maximum position, or the position of the square, and the illuminance of the part can be fixed by the means of the female fitting of the -27-201120377 male screw. The bottom surface of the surrounding frame 4 may be fixed by being pressed by a portion (generally, an end portion) of the LED mounting substrate 14. Thereby, suppression of partial peeling of the LED mounting substrate 14 for a long period of time can be achieved, and the long-term reliability of the LED lighting fixture can be improved. In addition, in the surrounding frame 4, if necessary, the flow of the air inside the lamp and the outside air (air exchangeability) is increased, and the heat storage inside is dissipated to the outside air, so that the surrounding frame 4 is internally and externally connected. The air hole can also be used. Further, in the peripheral casing 4, the peripheral casing 4 may be provided with a light leakage hole penetrating inside and outside the object for the purpose of leaking one of the light emitted from the LED element 1 to the outside in accordance with the design of the use or the product. In particular, when a material having no light transmittance or a small material (for example, a metal, a heat conductive resin to be described later) is used as the surrounding frame 4, the design is improved by the formation of the light leakage hole, and it can be appropriately adjusted. get on. However, the light leakage hole can also serve as the aforementioned air hole. The shape of the air holes and the light leakage holes is not particularly limited in size, but is preferably a true circular shape, an elliptical shape, a polygonal shape, a slit shape, or the like, and may be a random shape depending on the situation. In terms of size, it is suitable for a true round approximate diameter of about 1 to 5 mm. Similar to FIGS. 1 to 3, an example of an LED illuminator having a mirror-mounted halogen lamp (a dichroic halogen lamp or the like) of a known light source is used for the purpose of controlling light directivity or improving the efficiency of light source utilization. It is preferable to use a structure having at least a part of the surrounding frame 4 and having light reflectivity. -28- 201120377 For example, the light reflecting layer ′ formed at the portion of the frame reflecting surface 6a of Figs. 1 to 3 is referred to. At this time, the peripheral frame 4 is used as an LED illuminator, and operates as a reflector (reflector) for optical design with a better illuminance distribution. That is, in such an LED illumination device, the surrounding frame 4 of the light source operates for the light emitted from the light source as an optical device design reflector (reflector) for the illumination device to have a better illumination distribution. Further, the shape of the reflector is not particularly limited, and a shape such as a hemisphere shape, a conical shape, or a polygonal pyramid shape can be preferably used. In the case of a hemisphere, the inclined surface is preferably a spherical surface, a hyperboloid, a paraboloid, an elliptical surface, an off-spherical surface or a shape similar thereto. The shape of the reflector is the same as that of the above-described light guiding diffusion layer 3, and is related to the directivity control of the illumination light (light distribution control), and the shape is appropriately designed, and can be used in combination with the light guiding diffusion layer 3 to obtain various shapes. The directivity of the illumination light (light distribution). In particular, the light emitted from the light-guiding diffusion layer 3 is designed such that when the light-conducting diffusion layer 3 is designed to have a light convergence point before the incident of the reflector, the reflector is a parabolic reflector that focuses on the convergence point of the light. The reflected light of the reflector can be approximately parallel light, and can be used for illumination with high directivity. In other words, the illumination light of the LED illuminator of the present invention is converted from a point light source from the LED to a surface light source through the use of the optical system, and is an illumination light that is soft to the eyes, and is shaped by the reflector. The combination of the shapes of the light guiding diffusion layers 3 and the like can control the directivity, convergence, and the like of the light, and can change various sizes of the light illumination points. -29 - 201120377 However, as a function of other functions, in the light emitted from the LED element 1, the light emitted from each of the emission directions which is poorly reflected in the optical design (ie, the light, etc.), at least a part of which is returned to the preferred one. The function of improving the utilization efficiency of the light used for the emission direction may also be (for example, the portion of the symbol 6b of Fig. 1). For the purpose of these, it is preferred that the light reflective structure is disposed within a suitable range. Specifically, for example, a press-formed body of a metal such as aluminum or a cast molded body of transparent glass or a molded body of the heat-conductive layer 2 of the present invention can be suitably used (in this case, the heat-conductive layer 2 of the present invention) At least a part of the surface of a molded body such as a molding material, a resin material (polycarbonate or acrylic acid) having transparency, such as injection molding, blow molding, or mold molding (for example, in FIG. a light-reflective molded body formed by a metal film such as aluminum, silver or stainless steel or a dielectric multilayer film, which is formed by vacuum deposition, sputtering, or the like, is formed on the surface 6a or the mark 6b. Wait. The light-reflecting layer may be controlled by the film thickness or the lamination, and may be a layer having a complete light reflectivity, and may have a light-reflective property and a light-transmitting layer in a semi-lens shape. Moreover, the unevenness of the molding surface (or the coating surface) of the surrounding frame 4 of the base material of the reflective layer is formed, or the surface of the reflecting surface has fine unevenness by controlling the deposition conditions of the reflective layer or the like. It can also be a reflective layer with some micro-reflectivity. Further, depending on the case, a film having high light reflectivity such as a white reflective PET film or a PEN film (for example, Tetonon film manufactured by Teijin Dupont Film Co., Ltd. -30-201120377, registered trademark Teonex film, registered trademark Teflex film) may be used. a white-type optical interference film (for example, a Tetoron film MLF, which is a registered trademark of DuPont Film Co., Ltd.), a metal vapor-deposited film, or the like, attached to the surface of the peripheral frame 4 (generally, the inner surface side), or At the time of molding the surrounding frame 4, the film is integrally laminated or formed in the vicinity of the surrounding frame 4 (generally, the inner surface side) by insert molding, and the film is separately placed in a separate manner. The light-reflecting layer is provided with a resin or a metal film or the like as a primer layer on the substrate as needed, so as to improve the tightness or durability, and as a surface protection on the light-reflecting layer. The layer is laminated with a resin or a metal oxide film to suppress the abrasion resistance or the deterioration of the film quality. However, the undercoat layer or the surface protective layer may be applied to the adjustment of the illumination color or the pattern, and may be applied to the colorant. However, the surface of the molded body in which the frame is a light-reflecting surface may be provided with a concave or irregular shape in a periodic or random pattern for the purpose of scattering or diffusing the reflected light for the purpose of improving the pattern. In addition, on the outer surface of the casing, a coating material that absorbs light-interfering color-type paint (for example, "MORPHTEX", for example, manufactured by Teijin Fiber Co., Ltd.) from the light multi-interference is applied to the outer surface of the casing to form a multilayer. An optical interference film (for example, the Tetoron film MLF, which is a registered trademark of Teijin Dupont Film Co., Ltd.) is subjected to insert molding, and appropriate concave and convex processing may be applied for the improvement of optical function or touch. Further, the surrounding frame 4 formed of resin, glass, metal, or the like may be colored in accordance with the adjustment of the illumination color or the need for the pattern. -31 - 201120377 [Light transmissive cover layer] Further, the light transmissive cover layer (symbol 5) is the main light exiting portion of the LED illumination device. Therefore, it is preferable that the material of the light-transmitting cover layer 5 is excellent in light transmittance, and glass or various transparent resins are preferable. It is preferable to use a resin material from the viewpoints of light weight, design freedom, drop safety, and the like. As the forming method, it is possible to select the shape, the self-forming shape, the press forming, the casting (polymerization), the blow molding, and the like. Further, the control of the refraction or diffusibility of the light in the layer is further combined with the light diffusing material and the light reflective material for the purpose of controlling the directivity (convergence and diffusibility) of the illumination light. In the layer, the layer body has an optical function, and the layer itself may have a lenticular shape of a ternary shape (a concave lens, a convex lens, or the like), or a lens structure (a concave lens, a convex lens, a Fresnel mirror, etc.) may be provided on the surface of the layer, or The third-order uneven shape of the pattern may be applied, or the surface of the layer may be coated or printed with light reflectivity or light scattering. Further, it is also possible to perform coloring from the viewpoints of adjustment of illumination color, pattern, and the like. From the viewpoint of improving the impact resistance of the LED lighting device, the polycarbonate resin having excellent impact resistance is suitable, and in the case of paying attention to transparency and damage resistance, acrylic resin, cyclic polyolefin material, etc. The user is better. Further, if necessary, the hard coat layer ' may be formed on the surface of the light-transmitting cover layer 5 by coating or the like. [Thermal Conductive Layer] -32- 201120377 The LED lighting device of the present invention is preferably one having at least one of the layers of the heat conducting layer 2 disposed adjacent to the LED element 1. That is, the heat conducting layer 2 is at least partially disposed close to the LED element 1 and is a layer of heat dissipation of the LED element 1. The thermal conductivity of at least one direction of the layer is 2 W/m. K or more, and the average thickness is 0.5~ The 5mm layer is better. The thermal conductivity is preferably 1 〇W/m·K or more, more preferably 15 W/m. K or more, or even 20 W/m. K or more 'best is 25 W/m. K or more, the average thickness is It is preferably 0.5 to 3 mm, more preferably 0.5 to 2.5 mm, still more preferably 0.5 to 2 mm, most preferably 0.5 to 1 to 5 mm. As a result of the review of the present invention, it is found that the product of the thermal conductivity and the thickness (average thickness, unit m) of the heat conductive layer 2 used in the present invention is preferably 0.0 1 W/K or more. That is, there is a critical point between the product of the thermal conductivity and the thickness of the heat conduction layer 2 and the heat dissipation performance of the LED element 1. When the product is less than 0.01 W/K, the heat dissipation is lowered, and the heat dissipation of the LED element 1 is sufficient. It has become difficult. The product of the thermal conductivity and the average thickness of the heat conductive layer 2 is preferably 0.02 W/K or more, more preferably 0.03 W/K or more, and even more preferably 〇.04 W/K or more, and most preferably 0.05 W/K or more. However, the product of the thermal conductivity and the average thickness of the heat conducting layer 2 is substantially limited to about 2 W/K (the heat conducting layer 2 is made of pure silver 'thickness 5 mm' 420 W/m. Kx 〇.005m = 2 > 1 W/K) . From the viewpoint of satisfying the appropriate conditions, the thermal conductivity of the heat conduction layer 2 is preferably 2 W/m or more. When it is less than 2 W/m · K, in order to satisfy the appropriate conditions, it is necessary to make the average thickness more than 5 mm' increase the use of -33-201120377 volume and weight, which is not preferred. Further, when the average thickness ‘ of the heat-conductive layer 2 exceeds 5 mm, an increase in volume and weight is caused, and when it is less than 55 mm, problems such as mechanical strength and formability are caused. Further, the heat conduction layer 2 is preferably a range of 0.0005 to 0.02 m 2 /W in which the surface area (m 2 ) is divided by the input power (W) of the LED element 1 , more preferably 0.001 to 0.01 m 2 /W, and even more. It is in the range of 0.0015 to 0.005 m 2 /W. Here, the surface area of the heat conduction layer 2 is an area including the LED substrate, the reinforcing layer, the electrical insulating layer, and the like, in addition to the interface with the outside air, and the heat generated by the LED element 1 is present. The range of preferred surface area for this external heat dissipation. When it is less than 0.0005 m2/W, heat dissipation of the power LED element 1 having a power of 1 W or more is likely to be insufficient. However, it is also preferable to impart unevenness to the surface of the heat conductive layer 2 for the purpose of increasing the surface area of the heat conductive layer 2. When the uneven shape is formed, the surface area can be increased by 1.5 times or more, more preferably 2 times or more, and more preferably 2.5 times or more. However, when the surface area (m2) is divided by the input power (W) of the LED element 1 and exceeds 0.02 m 2 /W, although the heat dissipation performance can be very high, on the other hand, it is accompanied by heat conduction. The useless volume and weight of the layer 2 are not preferred because of the miniaturization and weight reduction of the lamp. Further, in the LED lighting device shown in Fig. 6, a heat conduction layer 2 is formed in a space from the lower side of the LED element 1 to the inner surface side of the contact portion 9a (-34-201120377 only, between the contact and the heat conduction layer 2) It is by means of an electrically insulating layer 1 2 ). As a result, the effective heat dissipation area is widened, and the heat of the LED element 1 can be generated by the contact portion 9a to the external socket side by the solid contact, thereby generating a heat dissipation path for the solid-state LED illuminator. The particularly effective heat-conductive layer 2 can be suitably used as long as it is a layer that satisfies such suitable requirements, and a specific example will be described later in detail. However, in the purpose of mechanical reinforcement of the heat conduction layer 2 or the purpose of ensuring electrical insulation, a layer excellent in impact resistance or electrical insulation may be laminated on the heat conduction layer 2. For the purpose of the former, it is preferable to laminate a reinforced layer having a notched Izod impact strength of SkJ/m2 or more and an average thickness of 0.3 to 3 mm, and the latter has a laminated volume impedance of 1 〇1 1 Ω. Above .cm, the average thickness is 0.01~3mm, the thickness of the laminated layer of the heat conductive layer 2 and the electrically insulating layer 12 is IEC 6 1 000, the electrostatic breakdown voltage is 5kV or more, and the dielectric breakdown voltage is more than 5kV. Layer 1 is better. However, the reinforcing layer and the electrically insulating layer 12 can be a layer having an average thickness of 0.3 to 3 mm both of the functional surfaces. However, the reinforced impact strength of the reinforcing layer is preferably 10 kJ/m2 or more, more preferably 20 kJ/m2 or more, most preferably 30 kJ/m2, and the volume resistivity of the electrically insulating layer 12 is preferably 1 〇. Above 13 Ω·cm, the electrostatic breakdown voltage is preferably 10 kV, more preferably 20 kV or more, and the dielectric breakdown voltage is preferably kV or more, more preferably 5 kV or more. In particular, when the heat-conducting layer 2 is located at the outermost layer of the LED lighting fixture, the electrical insulation of the surface of the LED lighting fixture is improved, and the prevention of the damage - 35-201120377, the improvement of the style (appearance color, etc.) Preferably, the electrically insulating layer 2 is formed on the surface of at least a portion of the heat conducting layer 2. The electrical insulating layer 12 formed on the heat conducting layer 2 located on the outermost layer of the LED lighting fixture is coated with a resin material, a ceramic material, or the like, and the heat-shrinkable tube of the electrically insulating heat shrinkable tube is coated. Either or the like may be formed, and may include a pigment which is a colored layer, an ultraviolet absorber, a thermal conductivity or a material having a high heat radiation property. The heat conductive layer 2 which satisfies the above-mentioned requirements is suitable for the present invention, and specific examples thereof include those selected from the group consisting of copper, silver, aluminum, iron, stainless steel, zinc, titanium, ruthenium, chromium, magnesium, and the like. The metal can be a monomer or an alloy. The heat-conductive layer 2 formed of these metals can be formed by a casting method, a forging method, a block-shaped metal block, or the like. However, as the casting method, a die casting method in which a compressive force is formed in a mold, a simple inflow into a mold, a method of natural cooling forming, and the like can be exemplified. Further, as the forging method, a cold forging method in which a molten metal layer is supplied with shear stress and ductile processing can be preferably used. In particular, among copper, silver, aluminum, and bismuth, there are many heat conductivity of 100 W/m·K or more, and from the viewpoint of heat dissipation of the LED element 1 (the efficiency of the temperature of the LED element 1 is lowered), Can be used very much. Further, as the heat conductive layer 2, a formed layer of an inorganic oxide can also be used. For example, inorganic oxides such as alumina, aluminum nitride, and boron nitride may differ depending on the crystal structure. However, those having a thermal conductivity of several tens of W or more are suitable for use in the present application. As a molding method, for example, -36-201120377, it is possible to bond the inorganic enol and the polyethylene-containing resin to the powder while being heated at a high temperature, and it is also suitable for the heat to be efficiently carried in. The illuminating control of the heat conducting layer 2 allows the illuminating device to have a large handling property or care. Moreover, the situation of a large amount of current from the power supply to the heat conduction layer 2 is increased. In other words, as a light-emitting control for connecting power sources in series, a layer to be formed is preferably used, and a method of processing and sintering is carried out by filling an inorganic oxide in a mold. Further, in order to increase the powder of the formed oxide and the resin binder, for example, decyl alcohol or the like, it is passed through a high-temperature heat treatment or a part of the agent to obtain a molded layer of an inorganic oxide. The use of the LED illuminator is such that when a large amount of the heat conductive layer 2 is required to use the metal or inorganic oxide, the weight of the weight of the built-in electronic circuit, the power source, the battery, etc. becomes quite heavy. Therefore, the illumination has a solid cost, so that the safety of the illuminating device can be used when the utility device is dropped, and the leakage current and the excitation current of the metal wiring with high conductivity are used in the heat conduction layer 2. In order to prevent the short circuit of the power supply wiring from being generated, the electrical safety of the LED lighting device is improved as the safety of the lighting fixture, and the wiring, the mounting substrate of the LED component 1, the LED circuit, and the power supply are reduced. The leakage current of the battery, etc., is the heat conduction layer 2, and the resistance is used. (The volume impedance is the volume impedance of the layer, at least lxl (Τ2 (Ω. Adding high-pressure, the purpose of the polyethylene sintering, the method 1 is more scattered, Lighting up, the rationality of the use, the time of doubt, and more, the inflow of doubts and low currents from the commercial component 1 is a large cm), preferably -37-201120377, preferably lxl〇Q ( Ω · cm or more, more preferably Ω · cm) or more, and most preferably 1 χ 104 ( Ω · cm) or more. From these viewpoints, the heat conductive layer 2 is a composite material, and is particularly suitable for use in at least one direction in the formed layer. The ratio of the thermally conductive resin composition of 5 W/m·K or more is preferably 15 W/m·K or more, more preferably 20 W/m · K is 25 W/m ♦ K or more. When the heat conductive layer of the heat conductive resin composition is used, the metal can be made into a low specific gravity and can be formed into a light weight, and can be formed into a lighter shape. The metal resistance is larger than the metal resistance, and the above-mentioned appropriateness can be achieved. Lightweight and drop gauge degrees of freedom (the processing accuracy of the heat-conducting layer 2 or the shape of the other components of the LED illuminator, the electrical compatibility of the illuminators). These thermally conductive resin compositions For the base tree, when the content of the thermally conductive material is 10 to 100 volumes, the content of the thermally conductive material is less than 10 parts by volume, which is difficult to conduct. Conversely, the content of the thermally conductive material exceeds 100% of the heat conduction. The conductive material is dispersed in the resin, and it is difficult to obtain a uniform thermal composition, or the fluidity of the resin is insufficient. The content of the material is preferably 20 to 90 parts by volume. "The thermally conductive material and the base resin are The mixing is carried out using a known method such as a single kneading device or a two-axis type melt kneading device. It is lxlO2 (〇thermal conductivity, thermal conductivity layer, heat conduction or higher, optimum 2 is used and micro And high-precision volume resistance and other safety, setting, etc.), and ubiquitous as the LED grease 1 〇〇 volume is better. When the high heat transfer part, the conductive resin thermal conductivity 塡-axis type melt-melt kneading -38- 201120377 As the thermally conductive material, metal oxides such as alumina, magnesia, cerium oxide, and zinc oxide, metal hydroxides such as aluminum hydroxide and magnesium hydroxide, boron nitride, and nitrogen can be cited. Metal nitride such as aluminum nitride, metal oxynitride such as aluminum oxide oxide, metal carbide such as tantalum carbide, metal or metal alloy such as gold, silver, copper, aluminum, carbon fiber, natural graphite, artificial graphite, and expansion For carbon materials such as graphite and diamond, it can be used in two or more types. In order to increase the thermal conductivity of the heat-conducting layer 12, it is preferable to use pitch-based graphitized short fibers, in which mesogen-based pitch is used as a starting material, and graphite is used. It is especially preferable for asphalt-based graphitized short fibers having a well-developed crystal structure. That is, the thermal conductivity of the graphitized short fibers is mainly derived from the phonon vibration of the lattice structure of the graphite crystal, in order to improve Conductivity, which improves the crystallinity of graphite crystals, that is, the crystal lattice structure of graphite crystals is as free from defects as possible, and is large and widely spread. The pitch-based graphitized short fibers used in the present invention are equivalent to so-called medium fibers. The average fiber length (L1) is more preferably from 2 〇 to 500 / im. Here, the average fiber length coefficient is an average fiber length, and a specific number of bars is measured under a microscope, thereby obtaining an average enthalpy. L1 is smaller than When 2 0 β m, the short fibers are difficult to contact each other, and a thermally conductive composition having high thermal conductivity cannot be obtained. Conversely, when L1 is larger than 500//m, the kneaded base and the pitch-based graphitized short fiber are mixed. At that time, the viscosity will become higher, which may become difficult in operation. More preferably, it is in the range of 20 to 300 ym. The method of obtaining the thus-based graphite-based short fibers is not particularly limited. Adjusting the conditions of the kneading, that is, adjusting the rotation speed of the cutter when the cutter is pulverized, the number of rotations of the ball mill, the air flow speed of the jet pulverization, the number of impacts of the crushing, and the retention time in the apparatus-39-201120377 can be controlled Average fiber long. Further, the pitch-based graphitized staple fiber used in the present invention can be adjusted from the pitch-based carbon short fiber by the classification operation of the pitch, etc., by the pitch-based carbon short fiber having a long fiber length or a long fiber length. Made of stone, the crystal size derived from the growth direction of the hexagonal mesh surface (L < is 20 nm or more, more preferably 30 nm or more, and even more preferably 40 nm or more is preferably 5 Onm or more. The crystallite size is in the direction of the hexagonal mesh surface, and corresponds to the degree of graphitization (crystallinity of graphite crystal). When the thermal property is found, a certain size or more is required. The crystallite size of the hexagonal mesh surface is obtained by X-ray diffraction. The method of measuring the hand is used as an analytical method and is suitable for using the method of learning vibration. The crystal size of the hexagonal mesh surface can be obtained by using a ray from the (1 1 0) plane. Further, as other parameters showing the degree of graphitization, there is a graphite junction interval, and the smaller the interlayer interval, the higher the crystallinity. The interlayer of the graphite crystal is calculated as the X-ray according to d002, and is at least 〇. Hereinafter, it is preferably 〇3 3 95 nm or less, more preferably 0.3370 nm and most preferably 0.33 62 nm or less. Further, the end face structure of the graphene sheet may be greatly different due to pulverization before graphitization or pulverization after graphitization. In other words, when the pulverization treatment is carried out after the pulverization treatment, the graphene sheet grown by graphitization is cracked, and the end surface of the graphene sheet is likely to be opened. When the surface is subjected to pulverization before graphitization, the end face of the graphene grown in the graphite is bent into a U-shape, and the bent portion is easily removed after being trained. Ink crystal:) At least, the lowest growth, the long-term method for the growth of the set to crystallize the layer is the case of 3 42 Onm below, the implementation of powder in the graphite cut to break another equation, stone for the tooth ttj -40 - 201120377 Construction of the ends of graphitized short fibers of asphalt based. For this reason, it is preferable to carry out graphitization after pulverization in the case of obtaining pitch-based graphitized short fibers having a graphene sheet end face blocking ratio of more than 80%. The pitch-based graphitized short fibers used in the present invention are preferably those in which the observation surface of the side of the whisk cat type electron microscope is substantially flat. Here, "substantially flat means that the fibrillation of the fibrous structure" does not exist in the case of the pitch-based graphitized short fibers. On the surface of the pitch-based graphitized short fiber, when there is a strong unevenness, the viscosity increases with an increase in the surface area when the base is kneaded, and the formability is deteriorated. Therefore, it is preferable that the defects of the surface unevenness are as small as possible. More specifically, in the scanning electron microscope, in the observation field of the image of the observation of 1,000 times, the defect such as the unevenness is one or less. As a method of obtaining such a pitch-based graphitized short fiber, it is excellently obtained by performing a graphitization treatment after kneading. The heat conductive resin composition constituting the heat conductive layer 2 has improved moldability, mechanical properties, flame retardancy, and other characteristics in addition to the thermally conductive material, such as carbon fiber (for example, polyacrylonitrile or cellulose). Carbon fiber, etc. for starting materials, glass fiber, potassium titanate filament, zinc oxide filament, aluminum boride filament, boron nitride filament, guanamine fiber, alumina fiber, tantalum carbide fiber, asbestos fiber, Fibrous materials such as gypsum fibers and metal fibers, and silicates and carbonates such as sandstone, zeolite, sericite, high territories, mica, clay, pyrophyllite, bentonite, asbestos, talc, and aluminum citrate Non-fibrous materials such as carbonates such as carbonates, magnesium sulfate, and dolomite, sulfates such as calcium sulfate and barium sulfate, glass beads, glass flakes, and ceramic beads, such as aluminum hydroxide and hydrogen-41 - 201120377 magnesium oxide. Can be added as needed. These may be hollow, and it is also possible to use these two or more types. However, among the above compounds, the density is higher than that of the pitch-based graphitized short fibers, and when the purpose of weight reduction is concerned, it is necessary to pay attention to the addition amount or the addition ratio. Further, in addition to the heat conduction layer, a known aging inhibitor, an ultraviolet absorber, an infrared ray absorbing agent, a flame retardant, a white or other color pigment, a dye or the like may be added as needed. For the resin of the base block, for example, a thermoplastic resin or a curable resin can be widely used. The curable resin is, for example, a thermosetting resin such as a thermosetting resin or an active light curing resin such as an ultraviolet ray or an electron beam. Examples of the thermoplastic resin include polyesters and the copolymers (polyethylene terephthalate, polybutylene terephthalate, polyethylene-2,6-naphthalate), and polycondensation. Styrene (polystyrene, para-polystyrene, etc.) and the copolymer (styrene-acrylonitrile copolymer, ABS resin, AES resin, etc.), polymethyl methacrylate and copolymers thereof (especially It is a structure comprising a ring and a derivative thereof, a polylactic acid resin and a copolymer thereof, a polyacrylonitrile and a copolymer thereof, a cyclic polyolefin, and a copolymer thereof (especially a resin containing a ring, such as JSR) , the trade name "ARTON", Mitsui Chemicals trade name "APEL", 曰本ΖΕΟΝ制, the trade name "ΖΕΟΝΕΧ", etc.), polymethylpentene and the copolymer (for example, Mitsui Chemicals registered trademark "ΤΡΧ", etc. ), polyphenylene ether (ΡΡΕ) and the copolymer (including modified oxime resin, etc.), aliphatic polyamines and the copolymer, polyimine and the copolymer, polyamidimide And the copolymer-42- 201120377, polycarbonate and the copolymer Polyphenylene sulfides and copolymers thereof, polybenzazoles and copolymers thereof, polyether mills and copolymers, polyether nitriles and copolymers, polyether ketones and copolymers, polyetheretherketones And a copolymer, a polyketone, a liquid crystalline elastomer, such as this copolymer, an elastomer, and a liquid crystalline polyester. Thus, it is possible to use either one alone or two or more suitable combinations. Examples of the thermosetting resin include phenols, epoxies, polysiloxanes, unsaturated polyesters, and melamines. Among them, phenols and epoxies are used in terms of heat resistance and mechanical strength. Classes are especially good. The thermosetting resin is a method in which a precursor liquid is filled in a mold and then thermally cured in a mold to obtain a molded body mold method, and a powder-shaped precursor material (generally referred to as a casting mixture) is used in the mold. After the inside of the mold, the film is heated and melted and thermally cured to obtain a powder molding method of the molded body. However, in order to obtain a high thermal conductivity and a fine and precise molded body, it is preferable to use a powder molding method. However, in the heat conduction layer 2, an additive such as an additive for increasing the emissivity (infrared emissivity), various coloring agents, a flame retardant, an ultraviolet absorber, an infrared absorber, an oxidation inhibitor, or the like may be added as needed. Further, the heat-conducting layer 2 may be formed of a composite layer of a heat-conductive layer formed by combining a thermally conductive resin composition and a heat-transferring layer formed of a metal, as needed or in part. In this case, it is preferable that the metal has a thermal conductivity of l〇〇w/m • κ or more (aluminum, copper, silver, etc.), and it is preferable to use aluminum having a small specific gravity or the alloy from the viewpoint of weight reduction. Further, in consideration of the heat dissipation design of the LED element 1 corresponding to the LED lighting device, the heat generation density, and the heat flow density of the conductive layer 2 through the heat-43-201120377, in terms of weight reduction, it is possible to The volume ratio of the heat conductive layer 2 formed by the heat conductive resin composition is preferably increased. For example, as shown in FIG. 22, the first heat conduction layer 20 is formed on the surface of the LED mounting substrate 14 by using a metal such as aluminum, and the heat conductive resin composition is formed on the side surface portion of the LED lighting device. The second heat conduction layer 21. In other words, in the heat conduction layer, a heat conduction layer 20 made of a metal is disposed in a portion near the heat source (LED element 1) having a very high heat flux density (particularly, a metal formation layer having a thermal conductivity of 100 W/m·K or more). As much as possible, the heat is quickly dissipated, and the heat conduction layer 21 is formed by arranging the heat conductive resin composition at a side portion of the LED illuminator having a relatively low heat flux density near the heat source (LED element 1) (especially preferably a thermal conductivity) 15W/m · K or more, the molding layer of the heat conductive resin composition having a specific gravity of 1.8 or less) can efficiently reduce the heat dissipation and the overall weight reduction of the LED lighting fixture. Further, as illustrated in Fig. 23, when a part of the heat conduction layer 21 has a complicated shape or a minute shape (in Fig. 23, it corresponds to a 3-dimensional shaped layer formed on the outermost surface), The shape is generally formed by using a thermally conductive resin composition having characteristics superior to metal moldability, and the other simple shape is formed by metal forming so that at least a part of the two layers are laminated. It is better to form the form of the interface. However, as a method of combining the heat conductive layer formed by the composition of the heat conductive resin with the heat conductive layer formed by the metal, in addition to the layers formed separately, a method of adhering with a heat conductive adhesive or the like is used, as shown in FIG. -44 - 201120377 The method of inserting a metal into a heat-transfer layer, which is a heat-transfer layer formed by forming a metal, is set in a die hole of a resin molding die, and is formed by injection molding of a heat-conductive resin. . Further, in order to increase the surface area of the heat conduction layer and improve the heat dissipation efficiency from the heat conduction layer to the outside (air or other layer), it is preferable to apply a three-dimensional concave-convex shape or the like in the following. In particular, when the heat conducting layer is used as the outermost layer of the LED illuminator, that is, a part or the whole of the heat conducting layer is disposed at a position in contact with the air, and the surface contacting the air is shaped by the 3 dimensional concavo-convex shape. Etc., it is better to increase the surface area. Further, when the heat conductive layer is injection-molded using a heat conductive resin containing the above-described thermally conductive carbon fiber (especially, pitch-based graphitized short fiber), the resin is injected into the shutter portion of the mold, and is disposed in the vicinity of the LED element 1 of the heat source. good. In other words, the direction in which the thermally conductive carbon fibers are aligned with the direction in which the thermally conductive resin flows is such that a gate is provided in the vicinity of the LED element 1, and the direction of heat dissipation of the LED element 1 and the direction in which the thermally conductive carbon fibers are aligned (thermal conductivity of the thermally conductive resin) It is the most consistent direction. It can be more efficiently dissipated. [Electronic Circuit for Illumination Control of LED Element 1] In the LED illuminator of the present invention, an LED illuminator in which an illuminating control electronic circuit of the LED element 1 is incorporated can be preferably used. The LED element 1 illumination control electronic circuit is a combination of an AC-DC conversion circuit, a DC-AC conversion circuit, a DC-DC conversion circuit, an AC-AC conversion circuit, an output variable power-45-201120377 (including a dimming circuit), The safety circuit (including a temperature feedback control circuit, a circuit such as a fuse, etc.), a noise filter circuit, or the like is formed separately or in several. Depending on the situation, various batteries can be built in. Further, the receiving portion and the processing circuit for operating the dimmable infrared or electromagnetic wave signal from the external remote control may be coated with the electrically insulating resin material as needed, and the electronic circuit for controlling the light emission of the LED element 1 may be applied thereto. Or in the form of an almost completely covered, it can be mounted in the outer casing of the lamp. It is preferable to use a thermosetting resin material such as epoxy, urethane or polyoxyalkylene (generally, it is used in the name of a bonding material or a sealing material) as the electrically insulating resin material. More preferably, it is preferably used in combination with an electrically insulating resin material which improves the thermal conductivity. In this case, the electrically insulating resin material can be used as a heat dissipation path for dissipating the heat generated by the electronic circuit for controlling the light emission of the LED element 1 to the external power source for the obstruction portion (the casing surface around the contact). It is used, and the effect is obtained by filling the inner surface of the casing of the insufficiency part with the resin material in surface contact. Further, when a commercial power supply such as an AC100V or a slot for an external power supply is used, it can be stably fitted to the slot type, and it is preferable to have a contact or a plug electrically connected to the power supply circuit for the light-emitting drive. As a contact, it can be widely used as the contact point of Ell, E12, E17, E26, etc. generally used [Electrical Insulation Layer 12] However, LED lighting is directly connected to commercial power supply such as 100V. -46- 201120377 In the case of a high-voltage power supply circuit, an electronic circuit, or the like, the leakage current or the excitation current is reduced or short-circuited, etc., when it is connected to a lithium-ion battery or the like. The insulative portion 8 that surrounds the contacts for external power supply connection is made of an electrically insulating layer, and is electrically insulated with an insulating reliability. The electrical insulating layer 12 has a volume impedance of ι〇ηω from the viewpoint of high electrical strength. The electrostatic breakdown voltage specified by IEC61000 is a negative voltage of 0.5 kV or more, and an average thickness of 0.3 Å. The insulating layer 12 is preferably made of a layer having a mechanical strength of 5 kJ/m 2 or more. The electrically insulating layer 12 or 5 may be exemplified by a ceramic material or a resin material. It is better to have a layer of excellent mechanical strength. More preferably, it is made of a resin or a resin composition, and the V-shaped cut is 5 kJ/m2 or more, and the average thickness and thickness of the portion other than the thickness portion required for the average thickness of 〇·〇5 to 3 mm is 1 〇ΜΩ. · More than cm, better for] layer. Further, the electrostatic breakdown voltage of the layer is 10 kV or more, more preferably 3 OkV or more, and the dielectric breakdown electric current is preferably 5 kV or more, more preferably 10 kV or more. The built-in battery with capacity can also be stipulated. It is better to handle the electrical safety around the high leakage prevention. In addition, the fixed sample needs to have high electrical insulation reliability, machine cm or more, thickness of 5kV or more, and insulation breakage of ~3mm. In addition, the material of the V-shaped slit suspected sub-portion 8 is insulative, and the structure maintains the same impact strength as the above-mentioned reinforcing layer, but it is more preferably 0.5 to 1.5 mm at the joint. Above 13 Ω · cm, preferably 20 kV blue is 1 kV or more, compared with -47-201120377. The electrically insulating layer 12 is preferably a layer having a high thermal conductivity, and the thermal conductivity is at least one direction in the layer. 0.5W/m . K or more is better than 1 W/m. K or more. When the electrically insulating layer 12 is formed of a resin or a resin composition, the resin exemplified as the resin block material of the heat conductive layer 2 is appropriately exemplified, and as a resin composition, it is suitably exemplified. The resin block material is a resin composition of a reinforcing fiber material such as glass fiber or polyarsenamide fiber or an additive suitable for various uses. In order to increase the thermal conductivity of the layer, it is preferable to use a mixture of electrically insulating materials. The reinforcing layer is a thermal insulating material having an electrical insulating property of 5 to 1 〇〇 by volume for the volume portion of the base resin 100. The material is better. Examples of the electrical insulating material include metal oxides such as alumina, magnesia, cerium oxide, zinc oxide, and titanium oxide, metal hydroxides such as aluminum hydroxide and magnesium hydroxide, and boron nitride. A metal nitride such as aluminum nitride, a metal oxynitride such as aluminum oxide oxide, or a metal carbide such as tantalum carbide. Further, in terms of use, it is also possible to mix a light-scattering property such as titanium oxide or barium sulfate, a light-reflective coating material, or a pigment for coloring a layer. However, when such a coating material is mixed in a large amount in the electrically insulating layer 12, the impact resistance of the layer is lowered. Under the gist of the present invention, in the range of ensuring sufficient impact resistance, good. Further, an additive such as an additive for increasing the emissivity (infrared emissivity), various coloring agents, a flame retardant, an ultraviolet absorber, an infrared absorber, an oxidation inhibitor, or the like may be added to the electrically insulating layer 12 as needed. -48- 201120377 [The outermost layer of the official sample] In the present invention, as the layer on the outermost surface of the LED lighting fixture (hereinafter referred to as the outermost layer), although it will be different due to the composition of the LED lighting fixture There are many cases in which the above-described electrically insulating layer 12, heat conducting layer 2, reinforcing layer, and the like are disposed. Among these outermost layers, it is preferable to add a coloring pigment, a dye, or the like to the layer for the purpose of improving the overall design of the LED lighting fixture, and it is preferable to use a white pigment or dye. Furthermore, the outermost layer is viewed from the viewpoint of concealability, and it is preferable that the high light reflectance layer is preferable for visible light. Moreover, the outermost layer is the outermost surface of the LED illuminator, and is applied to improve the function of preventing damage, optical properties, pattern properties, chemical resistance, emissivity (infrared emissivity), or 3-dimensional concave-convex shape. The surface type can also be used. Here, the 3-dimensional shape forming is formed by increasing the surface area of the outermost layer and increasing the contact area with the outer air layer for the purpose of improving the heat transfer property at the interface between the outermost outer layer and the outer air layer. From the viewpoint of promoting heat dissipation of the LED element 1, the temperature difference between the ambient temperature of the outer air layer (distance from the lamp to a certain distance) and the surface of the reinforcing layer is made as small as possible, and the heat transfer property of the interface is improved. The person is an important part. The heat transfer of the interface is related to the frequency of collision between the air molecules and the outermost layer, the infrared radiance from the outermost layer to the outer space, the surface area of the outermost layer, the surface shape, the infrared radiance, etc. Then, it becomes a control factor to increase the infrared radiance of the outermost layer and to increase the surface area of the outermost layer, and it is preferable to form a suitable surface shape for improving the heat exchange efficiency with the outside air. The surface area of the outermost layer formed by the surface forming is preferably at least 1.2 times or more for the flat surface, more preferably 1.5 times or more, and even more than 2 times, and the best is 2.5. More than double. The average height of the convex portion of the 3 dimensional shape forming surface (the distance between the apex of the convex portion and the lowest point or the bottommost surface of the outermost layer) is preferably at least 5 mm. When the average height of the convex portion exceeds 5 mm, the useless size (diameter, etc.) of the LED lighting device is increased, and there is no preference for it. The average height of the convex portion is preferably 3 mm or less, more preferably 2 mm or less, and even more preferably 1 mm or less, and most preferably 〇. 8 mm or less. Further, the average width or average thickness of the convex portions of the three-dimensional shape forming surface is at least 2 mm or less. When the average width or average thickness of the convex portion exceeds 2 mm, the height of the convex portion required to increase the surface area of the three-dimensional shape forming surface becomes large, resulting in an increase in the useless size (diameter, etc.) of the LED lighting device. The average width or average thickness of the convex portion is preferably i.smm or less, more preferably 1.2 mm or less, and even more preferably 〇.9 mm or less, and most preferably 0.6 mm or less. Specific examples of the three-dimensional shape forming include, for example, a convex shape pattern shown in Figs. 7, 8. That is, Fig. 7 is an example of a convex pattern having a rectangular cross-sectional shape. Fig. 8 is a convex pattern having a curved portion (curvature) at the front end portion of the convex portion. For example, in the cross-sectional shape pattern illustrated in Fig. 7, when the height of the convex portion is 1 mm, the width of the convex portion is 1 mm, and the width of the bottom portion (concave portion) is 1 mm (nearly the shape illustrated in Fig. 7), compared with The unshaped flat-50-201120377 surface can increase the surface area by about 2 times. Further, when the height of the convex portion is 1 mm, the width of the convex portion is 1 mm, and the width of the bottom portion (concave portion) is 2 mm (different from the shape illustrated in Fig. 7), compared with the flat surface having no shape, The surface area is increased by about 1.7 times. Further, in the cross-sectional shape pattern illustrated in Fig. 8, the height of the convex portion is 0.7 mm, the width of the convex portion is 〇.6 mm, the radius of curvature of the convex front end portion is 〇.3 mm, and the width of the bottom portion (concave portion) is 0.4 mm. When the bottom portion is a concave portion having a curvature radius of 0.2 mm (nearly the shape illustrated in Fig. 8), the surface area can be increased by about 2 times as compared with the flat surface having no shape. Further, the height of the convex portion is such that the width of the convex portion is 0.6 mm, the radius of curvature of the convex front end portion is 〇.3 mm, and the width of the bottom portion (recessed portion) is 1.4 mm, and when the bottom edge portion is not provided with a radius of curvature ( The shape illustrated in Fig. 8 is somewhat different), and the surface area can be increased by about 1.6 times compared to the unformed flat surface. The shape and size of the three-dimensional shape are based on the use environment of the lamp, the size limit of the lamp for design and use, etc., and it is preferable to set it appropriately. However, in the examples of FIG. 7 and FIG. The length of the illuminating device is parallel to the direction of the three-dimensional shaped pattern (concave-convex pattern), but the three-dimensional shape forming pattern can be arranged in a direction parallel to the circumferential direction of the LED illuminator (the direction perpendicular to the long direction) 'Arranged in other directions, or randomly formed. In addition, the shape of the three-dimensional shape is not limited to the regular uneven shape of the direction shown in Fig. 7 and Fig. 8, and the shape of the concave-convex portion (protrusion, depression) of the independent-51 - 201120377 may be present as a point. , the irregular shape of random connection, and the like. An application example of an actual LED lighting device is described in FIGS. 21, 23, 24, 27, 39, and 40. 21, 23, and 40 are examples of the three-dimensional shape forming of the heat conducting layer 2, and Figs. 24, 27, and 39 are examples of the three-dimensional shape forming of the electrically insulating layer 12. However, such surface forming is performed by shape marking on the inner surface of the mold for injection molding, preferably in the forming stage, and may be carried out after the forming, for example, the convex surface of the molded article may be mentioned. Edge processing (surface cutting by pressing of a cutting blade having a specific concave-convex pattern), or pressing a mold surface of a molded article by a shape for surface forming, and surface forming by thermal pressurization In the method, a resin film which has been previously formed on the surface of the molded article is laminated on the surface of the molded article, or adhered by an adhesive layer or the like, a heat shrinkable tube which is heat-shrinked and previously surface-formed, and laminated on the surface of the molded article. The trick. However, when coating the outermost layer or the three-dimensional shape, it is preferable to increase the thermal conductivity of the layer of the coating layer or the three-dimensional shape as much as possible, specifically 0.5 W. /m · K or more, preferably 1 W/m·K or more, more preferably 2 W/m · K or more. [Other components and configuration examples] In the LED lighting device of the present invention, as a structural technique for reducing the overall size of the illuminating device, it is preferably exemplified in the vicinity of the electronic circuit for controlling the light emission of the LED element 1. It is formed by surrounding the electrically insulating layer 1 2 (or the electrically insulating layer - 52 - 201120377 edge layer and the reinforcing layer), and is laminated without forming at least a part of the surface on the side of the electronic circuit for light emission control of the electrically insulating layer 12 The composition of the heat conducting layer 2. However, in this case, the electrically insulating layer 12 and the heat dissipating layer may be molded by various methods such as a known two-color resin molding method, an insert molding method, or an in-mold decoration molding method. However, when the insert molding or the in-mold decoration is formed, the heat-dissipating layer formed of a metal or a metal alloy and the electrically insulating layer 12 made of a resin can be integrated at the time of molding. However, in each of the joint portions of the LED lighting device, a layer for the top plate (for example, the symbol 18 of FIG. 3) is provided to suppress the intrusion of moisture from the outside, and to absorb the distortion caused by the temperature change of the LED lighting device. Functional person. As the top layer, commercially available sheet metal, sealing material, top plate grease, etc. can be preferably used. As the mounting substrate of the LED element 1, a ceramic substrate, a metal substrate, a flexible substrate, a glass epoxy substrate, or the like can be used. The metal base substrate and the flexible substrate are particularly preferable from the viewpoint of improving heat dissipation. The flexible substrate is made of a heat-resistant film such as a polyimide film or a polyethylene naphthalate film, and has a patterned copper foil on the substrate, so that the thickness of the film substrate is about 10 〜 5 〇 V m , more preferably 20 to 40 #m, can significantly reduce the thermal resistance to heat flow in the thickness direction, which is better. Further, from the viewpoint of improving the light use efficiency of the LED element 1, it is preferable that the light reflectance on the surface on the light exit surface side of the mounting substrate of the LED element 1 is high. Therefore, it is preferable that the layer having a high light reflectance is laminated on the outermost layer of the substrate, and the electrical insulation and mechanical protection of the wiring pattern are the same, and the layer-53-201120377 white resin printed layer having a high light reflectance or A white cover film (for example, Teijin Dupont film brand name Teflex film white reflection type, etc.) is preferable. The reflectance of the layers is preferably 70% or more, more preferably 80% or more, and most preferably 90% or more. Further, it is preferable that the LED mounting substrate 14 and the heat dissipation layer are excellent in heat transfer property, that is, by fixing the low thermal resistance layer 13 (the thermally conductive adhesive layer, the thermally conductive adhesive layer, the thermally conductive sheet, or the like). When a layer having a poor heat transfer property (high thermal resistance layer) is used, a large temperature difference occurs between the mounting substrate and the heat dissipation layer, and the heat dissipation performance becomes extremely poor, which is a case where there is no preference. However, the heat dissipation of the heat-generating component (1C, coil, etc.) of the electronic circuit for controlling the light-emitting of the LED element 1 or the improvement of the heat transfer efficiency from the outermost profile of the lamp (LED illuminator) to the outer air layer (with The increase in the contact frequency of the air molecules and the prevention of the formation of the laminar flow in the vicinity of the lamp outline, etc.), the vibrating plate such as a small heat radiating fan, a piezoelectric ceramic, or a piezoelectric film is mounted on the lamp. In the vicinity of the housing or near the outer periphery of the lamp, the heat dissipation capability can be improved by forcibly generating airflow. In particular, the warm air that is limited to the inside of the lamp housing via the above-described heat generating component or LED heat can be efficiently discharged to the outside, and can be exchanged with the outside cold air to obtain a higher heat dissipation effect. Preferably, the vibrating plates are disposed in the vicinity of the lamp or in the vicinity of the outer casing, and may also be provided with a venting hole that traverses the inner/outer portion of the lamp at the outer portion of the lamp 1 or at a plurality of locations. The driving circuit of these components is the same as the electronic circuit for lighting control of the L E D component 1. It is preferable to install the substrate in the lamp housing -54-201120377. The components are as small as possible, easy to install on the lamp and can save power. The frequency of the vibrating plate is not particularly limited, and it is preferable that the human ear is not disturbed, and it is preferable that the frequency of the audible sound is more than 20 ,, more preferably 40 ΚΗζ or more. In addition, the vibrating plate can be fixedly disposed in any position of the lamp (heat dissipation layer, electrical insulating layer, etc.), and the vibrating plate can be excited by an external electrical signal to excite the outermost portion of the lamp. Fine vibration. Therefore, the vibration is transmitted to the air outside the outermost contour of the lamp, so that the external air can be forced to flow, and the heat of the gas from the inside of the lamp can be increased while improving the fluidity of the gas outside the lamp. The heat dissipation of the LED element 1 is improved. However, when the LED lighting device of the present invention is attached to a mounting tool (a device having a socket) formed of a molded body such as a metal having high thermal conductivity or an inorganic oxide or a heat conductive resin, it is held in the most LED lighting fixture. The space between the outer casing and the mounting device is better than the layer formed by the high thermal conductivity material, and the heat transfer from the LED lighting fixture to the mounting device is improved. As a layer formed of a highly thermally conductive material, in particular, a layer of a soft resin or rubber having a thermal conductivity of 1 W/m·K or more can be preferably used, which can be previously applied to the inside of the led illuminating device or the mounting device. If the laminated illuminator is formed, or the LED illuminator is fixed to the mounting tool, the method of inserting the layer body and fixing it is performed in the gap between the two. [Full beam amount and illuminance of LED illuminator] The LED illuminator of the present invention has a total beam amount of 90 lumens or more and is preferably -55-201120377. The total beam amount refers to the total amount of light beams emitted from the LED illuminator to the external space, for example, measured by an integrated reflection sphere type beam measuring device. When the total beam amount is less than 90 lumens, the brightness required for various uses of the illuminator cannot be achieved. The total beam amount is preferably 1 40 lumens or more, more preferably 1 90 lumens or more, more preferably 240 lumens or more, and most preferably 2 90 lumens or more. However, the full beam amount in such a suitable range is required to be achieved under the input power conditions in which the junction surface temperature of the LED element is below a predetermined temperature. Further, the LED lighting device of the present invention is preferably such that the illuminance immediately below 1 m is at least 40 lux. Here, the illuminance immediately below lm means that the position of the center of gravity of the LED element 1 (the position of the center of gravity of the plurality of LED elements 1 when the LED element 1 is plural) is in the vertical direction (with the LED element) in the arrangement shown in FIG. 1) The plane of the light exiting the plane is perpendicular to the plane of the distance of 1 000 mm (light-irradiated surface), so that the intersection of the perpendicular line of the plane passing through the center of gravity of the LED element 1 and the plane is 1 m of the LED illuminator The point below, and the illuminance of the LED illuminator measured at this point. When the illuminance below 1 m is less than 40 lux, the illuminance will be insufficient for the use of the illuminator, and it is difficult to use it. The illumination below 1 m is preferably 90 lux or more, more preferably 140 lux or more, and even more than 190 lux, and most preferably 240 lux or more. However, the illuminance immediately below the lm of the appropriate range is required to be achieved under the input electric power of the junction temperature of the LED element 1 below a predetermined temperature. -56-201120377 [Examples] Hereinafter, the examples are shown, but the present invention is not limited thereto. However, each of Examples 1 to 12 was obtained by the following methods (i) to (1 3). (1) The average fiber diameter of the pitch-based graphitized short fibers is determined by the average enthalpy according to JIS R7607 under the optical microscope using 60 scales. (2) The average fiber length of the pitch-based graphitized short fibers is determined by using the PITA1 manufactured by SEISIN Co., Ltd., and the crystal size of the (3) pitch-based graphitized short fibers is determined by the average enthalpy. The reflection of the (1 1 〇) plane of the X-ray diffraction is measured and found by the vibration method. (4) The end face of the pitch-based graphitized short fiber was observed at a magnification of 1 million times by a transmission electron microscope, and the photo was expanded to 4 million times to confirm the graphene sheet. (5) The surface of the pitch-based graphitized short fiber was observed with a scanning electron microscope at a magnification of 1 , to confirm the unevenness. (6) The thermal conductivity of the composition of the thermally conductive resin is a molded body of a thermally conductive composition of 4 mm thick, which is sampled and cut into a rectangular shape of 3 mm x 10 mm, and arranged in the horizontal direction, and LFA_447 made of NETZSCH is used to obtain the in-plane direction. Thermal conductivity. (7) The impact resistance of the resin or resin composition is obtained from the V-notch impact strength (V-notch) according to ISO 180/1A. -57- 201120377 (8) The volume resistance of the resin or resin composition was made into a 50 mm x 100 mm x 2 mm plate-shaped formed body, which was obtained by using HIRESTA UP force manufactured by DIA INSTRUMENTS. (9) The electrostatic breakdown voltage in the thickness direction of the molded body was measured according to IEC6 1000 using an electrostatic tester model ESS-2002 manufactured by NOISE Research Co., Ltd., and the electrostatic breakdown voltage (KV) in the thickness direction of the molded body was measured. The measurement was carried out using five test pieces, the lowest of which was the electrostatic breakdown voltage 试验 of the test piece. (10) The dielectric breakdown voltage in the thickness direction of the molded body is measured by the short-time method of IEC 60243, and the insulation breakdown voltage (KV) in the thickness direction of the molded body is measured using a YAMAYO tester insulation breakdown test apparatus YST-243-100RHO. The measurement was carried out using five test pieces, the lowest of which was the electrostatic breakdown voltage 试验 of the test piece. (1 1 ) The volume resistivity of the conductive resin composition was measured as an injection molded body of a heat conductive composition having a thickness of 100 mm x 50 mm x 2 mm, which was measured using a LOWRESTA force port manufactured by DIA INSTRUMENTS. (1 2) The amount of beam of the LED illuminator is a beam that is emitted from the LED illuminator to the outside space, and is reflected by an integral reflecting ball disposed around the LED illuminator, and concentrated on the light receiving sensor for measurement. (13) The illuminance directly under the lm of the LED illuminator is measured at a measuring point on a plane that is 1 m away from the LED illuminator in the vertical direction, and is measured by an illuminometer. Further, Examples 1 to 1 2 which will be described later are based on the following Reference Examples 1 to 17. -58- 201120377 [Reference Example 1] Production of mesophase pitch graphitized short fibers The condensed polycyclic carbonized gas compound was used as a raw material. The optical anisotropy ratio was 100% and the softening point was 2 83 °c. Use a diameter of 0.2 mm The lid of the hole of <i> was sprayed from the slit at a linear velocity of 5 5 00 m per minute, and the molten pitch was pulled to prepare a green short fiber having an average diameter of 14.5 μm. The spinning temperature at this time was 328 ° C, and the melt viscosity was 13.5 Pa · s (135 poiSe). The spun fiber was collected and concentrated on a belt to form a mat, and was further interlaced to form a pitch-based carbon fiber precursor fabric of a 400 g/m2 pitch-based carbon fiber precursor.

將此瀝青基系碳纖維先驅體織物，在空氣中，從170 °C至3 2 0 °C，以平均昇溫速度5 °C /分加以昇溫而不融化， 更且於8 00 °C進行燒成。將此瀝青系碳纖維織物，使用刀 刃（TURBO工業製），以700rpm加以粉碎，於3000°C 下石墨化。 瀝青基系石墨化短纖維之平均纖維徑爲9.8 // m，對 於平均纖維徑而言之纖維徑分散之比（CV値）爲9%。 個數平均纖維長乃 170// m，由來於六角網面之成長方向 之結晶尺寸爲70 nm。 瀝青基系石墨化短纖維之端面乃經由透過型顯微鏡之 觀察，確認石墨烯薄片被封閉。又’表面乃經由掃瞄型電 子顯微鏡之觀察，凹凸僅爲1個，實質上爲平坦者。 [參考例2]中間相系瀝青石墨化短纖維之製造 -59- 201120377 於參考例1中，除了經由粉碎時間之調整， 之個數平均纖維長爲140 以外，與參考例1 造中間相系瀝青石墨化短纖維。 [參考例3 ]熱傳導層2 (熱傳導性樹脂組成物） 將參考例1所得之瀝青基石墨化短纖維45 聚碳酸酯樹脂（帝人化成製panlite (註冊商標） )1 〇〇體積份，使用單軸混鍊裝置熔融混鍊，得 樹脂之錠片。使用此錠片，使用射出成形機（東 EC40NII )，得厚4mm之熱傳導性成形品。熱傳 品之熱傳導率爲13.8W/(mvK)，體積阻抗爲 (Ω · cm)，耐衝擊性爲3. Ik J/m2，靜電破壞電 10kV -絕緣破壞電壓乃不足lkV。 然而，本熱傳導層2之比重爲低至1.51，尤 LED照明具之輕量化。 [參考例4]熱傳導層2 (熱傳導性樹脂組成物） 做爲熱傳導層2之基塊，使用根據日本 2007-1 46 1 05號記載之合成方法之聚苯硫醚樹脂 裝備攪拌機之15升之高溫滅菌鍋，置入Na2S 1 8 66g及N-甲基-2-吡咯酮（以下記爲NMP。） 在氮氣流下邊攪拌，邊徐徐昇溫至205 °C，餾出 水。將此系統冷卻至14(TC後，添加p-二氯苯 NMP 1500g，於氮氣流下’封入系統。將此系 使短纖維 相同，製 體積份， L- 1 225Y 熱傳導性 芝機械製 導性成形 約 6 X 1 0 1 壓乃不足 其適用於 泛開特許 。即，於 • 2.8H2〇 5公升， 407g 之 2280g 與 流昇溫至 -60- 201120377 2 2 5 °C ’於2 2 5 °C 進行2小時聚合。聚合終了之後，冷卻 至室溫’將聚合物組由離心分離器加以分離。以溫水重覆 洗淨聚合物’在1〇〇 °C下乾燥一晝夜，更且在空氣氣氛下 ，於2 3 5 °C進行加熱硬化處理，得聚（p _苯硫醚）樹脂。 將此聚（p-苯硫醚）樹脂，使用粉碎機，做爲粉末形 狀之後’將參考例1所得之瀝青基石墨化短纖維69體積 份，前述聚（p -苯硫醚）樹脂1 0 0體積份，使用二軸混鍊 裝置熔融混鍊，得熱傳導性樹脂之錠片。使用此錠片，使 用射出成形機（東芝機械製EC40NII )，得厚4mm之熱 傳導性成形品。熱傳導性成形品之熱傳導率爲1 8.6W/ ( m .K ) ’體積阻抗爲約3 X 1 0Q ( Ω . cm )，耐衝擊性爲 1 .5k〗/m2 ’靜電破壞電壓乃不足1 〇kV，絕緣破壞電壓乃不 足 lkV。 然而，本熱傳導層2之比重爲低至1.7，尤其適用於 LED照明具之輕量化。 [參考例5]熱傳導層2 (熱傳導性樹脂組成物） 將參考例4所得之聚（p-苯硫醚）樹脂1 〇〇體積份， 和參考例2所得瀝青基石墨化短纖維92體積份，使用二 軸混鍊裝置熔融混鍊，得熱傳導性樹脂之錠片。使用此錠 片，使用射出成形機（東芝機械製ECMONII )，得厚4mm 之熱傳導性成形品。熱傳導性成形品之熱傳導率爲 20.4W/ ( m . K )，體積阻抗爲約 8x 1 (Γ1 ( Ω . cm )，耐 衝擊性爲l.lkJ/m2，靜電破壞電壓乃不足10kV，絕緣破 -61 - 201120377 壞電壓乃不足lkV。 然而，本熱傳導層2之比重爲低至1.75，尤其適用於 LED照明具之輕量化。 [參考例6]熱傳導層2 (熱傳導性樹脂組成物） 將參考例1所得之瀝青基石墨化短纖維55體積份， 環狀聚烯烴樹脂（JSR股份有限公司 「ARTON」D4531F )1〇〇體積份，使用二軸混鍊裝置熔融混鍊，得熱傳導性 樹脂之錠片。使用此錠片，使用射出成形機（東芝機械製 EC40NII)，得厚4mm之熱傳導性成形品。熱傳導性成形 品之熱傳導率爲15.9W/(m.K)，體積阻.抗爲約9X10·1 (Ω · cm )，耐衝擊性爲2.2kJ/m2，靜電破壞電壓乃不足 10kV，絕緣破壞電壓乃不足lkV。 然而，本熱傳導層2之比重爲低至1.48，又對於屋外 耐氣候性優異之故，尤其適用於LED照明具之輕量化， 或屋外之利用等。 [參考例7]電性絕緣層1 2 (樹脂） 使用聚碳酸酯樹脂（帝人化成製panlite (註冊商標 )L- 1 225Y)，得厚4mm之成形品。本成形品之熱傳導率 爲0.2W/ ( m · K )，耐衝擊性爲72kJ/m2，體積阻抗爲 1013 ( Ω · cm)。 然而，本電性絕緣層1 2之比重爲低至1 .2，尤其適用 於LED照明具之輕量化 -62- 201120377 [參考例8 ]電性絕緣層1 2 (樹脂） 於聚碳酸酯樹脂（帝人化成製panlite (註冊商標） L- 1 225Y) 100重量份，將平均粒徑約30//m之氧化鋁粒 子（micron公司製 A 3 5 - 0 1 ) 8 0重量份、平均粒徑約8 之氧化鋁粒子（micron公司製 AX10-32) 60重量份 、纖維長3mm之玻璃纖維1 5重量份，經由二軸混鍊混合 所成之樹脂，做爲電性絕緣層1 2使用，得厚4mm之白色 成形品。本成形品之熱傳導率爲〇.8W/ ( m · K) ’耐衝擊 性爲8kJ/m2，體積阻抗爲約l〇12(n.cm)。 然而，本電性絕緣層1 2之比重爲低至約1 .7 ’尤其適 用於LED照明具之輕量化。又，熱傳導率爲高之故，適 於LED元件1之散熱效果。 [參考例9]電性絕緣層1 2 (樹脂） 使用在於聚碳酸酯樹脂’添加白色顔料等所成白色之 聚碳酸酯樹脂（帝人化成製Panlite (註冊商標）難燃光 高反射等級 LN-3010RM)，得厚4mm之白色成形品。本 成形品之熱傳導率爲0.3W/ ( m · K ) ’耐衝擊性爲 12kJ/xn2，體積阻抗爲1〇13Ω . cm’光反射率95%，難燃 性乃在1 .6mm厚度條件下’爲V-0。 然而，本電性絕緣層1 2之比重爲低至1 .3，尤其適用 於LED照明具之輕量化。又，光反射率高爲白色之故， 適於提高LED照明具之外觀設計。 -63- 201120377 [參考例1 0]電性絕緣層1 2 (樹脂） 使用在於聚碳酸酯樹脂’添加白色顏料等所成白色之 聚碳酸酯樹脂（帝人化成製panlite (註冊商標）難燃光 高反射等級 LN-3 000RM ) ’經由射出成型’得厚4mm之 白色成形品。本成形品之熱傳導率爲〇.3W/ ( m · K)，耐 衝擊性爲60kJ/m2，體積阻抗爲1〇13Ω · cm ’光反射率95 %，難燃性乃在1.6mm厚度條件下，爲V-0。 然而，本電性絕緣層1 2之比重爲低至約1 .3，尤其適 用於LED照明具之輕量化。又，光反射率高爲白色之故 ，適於提高LED照明具之外觀設計。 [參考例1 1 ]電性絕緣層1 2 (樹脂） 使用市售玻璃纖維強化聚（P-苯硫醚）樹脂（ POLYPLASTICS 製 FORTRON 註冊商標 1 130A1 )，經 由射出成型，得厚4mm之成形品。本成形品之熱傳導率 爲0.2W/(m.K)，耐衝擊性爲約l〇kJ/m2，體積阻抗爲 1014Ω · cm，難燃性乃在1.6mm厚度條件下，爲V-0，比 重爲1 .57。 [參考例1 2]熱傳導層2與電性絕緣層1 2之一體成形 將參考例3所得之熱傳導性樹脂錠片、和參考例7之 聚碳酸酯樹脂，使用將射出成形機（東芝機械製EC40NII )爲基礎之二色射出成形機，得平板狀之熱傳導性樹脂複 -64- 201120377 合成形體（熱傳導性二色樹脂成形體）。熱傳導性樹脂淀 片所成熱傳導層2之平均厚度爲2.3mm，聚碳酸醋所成電 性絕緣層（補強層）之平均厚度爲1 m m。 所得熱傳導性樹脂複合成形體之耐衝擊性爲 1 1.8kJ/m2。又’靜電破壞電壓爲30kV以上’絕緣破壞電 壓爲1 0 k V以上。 [參考例1 3 ]熱傳導層2與電性絕緣層1 2之一體成形 使用參考例4所得之熱傳導性樹脂錠片、和參考例 11之樹脂錠片’使用將射出成形機（東芝機械製EC40N11 )爲基礎之二色射出成形機，得平板狀之熱傳導性樹脂複 合成形體（熱傳導性二色樹脂成形體）。參考例4之熱傳 導性樹脂錠片所成熱傳導層之平均厚度爲2.3mm ’參考例 11之樹脂錠片所成電性絕緣層（補強層）之平均厚度爲 1 mm ° 所得熱傳導性樹脂複合成形體之耐衝撃性爲6. lk]/m2 。又，靜電破壞電壓爲3 OkV以上’絕緣破壞電壓爲1 OkV 以上。 [參考例14]熱傳導層2與電性絕緣層1 2 (補強層）之層 積 各別作成使用參考例4所得之熱傳導性樹脂錠片之平 均厚度2.3mm之平板、使用參考例7之聚碳酸酯樹脂之 平均厚度1 mm之電性絕緣層1 2 (補強層）之平板後，將 -65- 201120377 兩者使用市售之環氧聚矽氧系黏著劑（CEMEDINE製註 冊商標 CEMEDINE SUPER X)，在將黏著劑薄薄地延伸 之狀態下，完全黏著固定而一體化。 所得熱傳導性樹脂複合成形體之耐衝擊性爲9.2kJ/m2 。又，靜電破壞電壓爲3 OkV以上，絕緣破壞電壓爲10k V 以上。 [參考例15]熱傳導層2與電性絕緣層12 (補強層）之層 積 各別作成使用參考例5所得之熱傳導性樹脂錠片之平 均厚度2.3mm之平板、使用參考例7之聚碳酸酯樹脂之 平均厚度1 mm之電性絕緣層1 2 (補強層）之平板後，將 兩者使用市售之環氧聚矽氧系黏著劑（CEMEDINE製註 冊商標CEMEDINE SUPER X)，在將黏著劑薄薄地延伸 之狀態下，完全黏著固定而一體化。 所得熱傳導性樹脂複合成形體之耐衝擊性爲8.4kJ/m2 。又，靜電破壞電壓爲30kV以上，絕緣破壞電壓爲10kV 以上。 [參考例1 6 ]熱傳導層2與電性絕緣層1 2 (補強層）之層 積 各別作成使用參考例6所得之熱傳導性樹脂錠片之平 均厚度2.3mm之平板、使用參考例7之聚碳酸酯樹脂之 平均厚度1 mm之電性絕緣層1 2 (補強層）之平板後，將 -66- 201120377 兩者使用市售之環氧聚矽氧系黏著劑（CEMEDINE製註 冊商標CEMEDINE SUPER X) ’在將黏者劑薄薄地延伸 之狀態下，完全黏著固定而一體化。 所得熱傳導性樹脂複合成形體之耐衝擊性爲 10.1kJ/m2。又，靜電破壞電壓爲30kV以上，絕緣破壞電 壓爲1 OkV以上。 [參考例1 7 ]熱傳導層2與電性絕緣層1 2 (補強層）之一 體成形 各別作成使用參考例4所得之熱傳導樹脂錠片之平均 厚度2.3mm之平板、使用參考例丨〇之白色聚碳酸酯樹脂 之平均厚度1 m m之電性絕緣層1 2 (補強層）之平板後’ 將兩者使用環氧聚矽氧系黏著劑（CEMEDINE製註冊商 標CEMEDINE SUPER X)，在將黏著劑薄薄地延伸之狀 態下，完全黏著固定而一體化。所得熱傳導性樹脂複合成 形體之耐衝擊性爲8.2kJ/m2。又’靜電破壞電壓爲30kV 以上，絕緣破壞電壓爲1 OkV以上。 [實施例1 ] 組裝圖1所圖示之LED照明具。 熱傳導層2乃使用參考例3之熱傳導性樹脂組成物， 於電性絕緣層1 2使用參考例7之聚碳酸酯樹脂，經由二 色樹脂成形法加以一體成形。熱傳導層2之外周直徑乃 28mm，令高度爲 25mm，厚度爲側面部 2mm、平面部 -67- 201120377 3.5mm (熱傳導層2總體平均厚度約2.3mm )，電性絕緣 層12之平均厚度爲1.5 mm。本熱傳導層2之熱傳導率與 平均厚度之積乃0.032 (W/K)，熱傳導層2之表面積爲 約 0.005m2。 又，於熱傳導層2之外周側面之補強層之未層積側之 面，經由熱收縮管之被覆，層積電性絕緣性之薄層1〇。 即使用飽和聚酯樹脂所成熱收縮管（帝人化成製商品名 teletube，厚約100/zm)，使包圍熱傳導層2之周圍，配 置管體後，經由來自加熱至200°C之加熱器之送風，加熱 管體，進行熱收縮，於熱傳導層2之外周側面，一樣地層 積電性絕緣性之薄層10。然而，層積後之層厚乃約130 // m。另外測定所成電性絕緣性之薄層1 0之體積阻抗乃6 xl Ο13 Ω · cm。又，於另外作成之2mm厚之本熱傳導層2 之平板狀成形體之單面，層積本電性絕緣性之薄層1 〇之 成形體之厚度方向之靜電破壞電壓爲30kV以上，絕緣破 壞電壓乃約10 kV以上。 做爲LED元件1，使用1盞日亞化學工業製之燈泡色 晶片型LED NS9L153MT-H3(規定輸出約3W，接合溫度 規格1 5 0 °C )者，做爲LED安裝基板14，使用厚度約 1mm之鋁爲基礎之直徑22mm之鋁基礎之安裝基板。安裝 基板之背面乃介著熱傳導性聚矽氧系黏著橡膠（信越 SILICONE製 縮合型 RTV橡膠 KE3466，熱傳導率 1.9W/m . K)所成厚約30 # m之熱傳導性黏著層，固定 於熱傳導層2。又，於銅配線圖案上，印刷成形白色之樹 -68- 201120377 脂絕緣層。 然而’從電源電路向LED元件1之投入電力爲2.7W 。將熱傳導層2表面積，以LED元件1投入電力加以除 得之値爲約0.001 9m2/w。 然而’於LED元件1之周圍框體4中，使用參考例7 之聚碳酸酯樹脂所成平均厚度2.4mm，半徑約25mm之半 球狀之成型體，於該內面側，形成鋁之真空蒸鍍所成厚度 約5Onm之光反射層，成爲框體光反射面6a。然而，雖在 圖1有所省略，在LED照明具之外觀設計之觀點下，於 光反射面之形成面，形成小酒渦狀之凸狀形狀圖案。 又，於本實施例中，周圍框體4乃在螺絲嵌合部4a 所成固定之時，使框體之底面在LED安裝基板14之端面 從上方按壓之形式下被固定。由此，可達成安裝基板歷時 性之剝離之抑制，提高LED照明具之長期的可靠性。 導光擴散層3乃經由丙烯酸樹脂之射出成形，成爲具 有於上面約略逆圓錐狀之凹部所成全反射面3a、於下面 切除球面之一部分所成之凸透鏡形狀所成之光折射面的導 光擴散層3。圖44A〜C乃令實施例1之導光擴散層3， 從斜方向觀察時之外觀圖。然而，約略逆圓錐狀之凹部所 形成之導光擴散層3上面之直徑乃約12mm，圓錐之高度 (凹部之深度）乃約6mm。又，導光擴散層3下面之凸 透鏡形狀乃由半徑6mm之球面之一部分所成曲面者。又 ，導光擴散層3最下面與L E D元件1發光面之間隔乃約 2.5mm。 -69 - 201120377 即本導光擴散層3乃令圖1 6之入射透鏡面（光折射 面）之頂點位置之Z座標（z 1 )爲2 · 5 ( mm )，入射透鏡 面之曲率半徑（Γ1)爲6mm，入射透鏡面之錐形常數（kl )爲〇(球面），入射透鏡面之XY面投射直徑（pi)爲 10mm，全反射面 3a之頂點位置之 Z座標（z2 )爲 12.8mm，全反射面3a之Z軸投影長度（ql)爲6mm、全 反射面3a之形狀控制點/旋轉軸間距離（q2 )爲2.9mm， 全反射面3a之XY面投射直徑（P2 )爲1 1 .6mm，與導光 擴散層3之LE D元件1相對之面相反側面之XY面投射直 徑（p3)爲 12.6mm。 然而，本實施例中，導光擴散層3乃令從導光擴散層 3對於鉛直方向而言，向45度以上135度以下之角度範 圍射出之光量爲100之時，使從與導光擴散層3之LED 元件1相對之面相反側之面，對於鉛直方向而言，向〇度 以上，不足45度之角度範圍射出之光量，設計成爲15前 後者。 又，於導光擴散層3之LED元件相對之面之一部分 ’做爲光反射層，黏著厚50 之白色反射PET薄膜（ 帝人DUPONT薄膜製），成爲光反射面6b。 光透過性覆蓋層5中，使用三聚氰胺系之硬敷層被形 成於單面之表面之厚1.5mm之聚碳酸酯薄片（帝人化成 製商標名 「panlite MR薄片 P C - 8 1 9 9」），使光射出 側成爲硬敷面，於LED元件1之周圍框體4之上部，以 黏著劑加以固定而使用。 -70- 201120377 又’礙子部8乃使用參考例9之白色聚碳酸酯樹脂， 做爲含接點固定部之厚度部之平均厚度爲約2.5mm之成 型體而被成形。 將本LED照明具之點燈試驗，在調整成周圍溫度爲 25°C之室內進行，於LED元件1之陰極側焊錫接合部之 附近’固定K型熱電偶，測定LED元件1之發熱狀態。 然而，對於LED元件1之溫度測定，則透過本發明 人之檢討，會因爲其手法，容易產生大的誤差，此等乃主 要起因於熱電偶與LED元件1間（溫度測定點間）之接 觸固定狀態而有熱阻抗之不均所造成。根據此發現，爲使 熱阻抗之不均極盡地變少，採取使用薄型具有柔軟性之面 狀熱電偶（厚度1 00 # m )，在測定點於面上使之緊密之 手法。本熱電偶之黏著固定中，使用熱傳導性聚矽氧系黏 著橡膠（信越SILICONE製縮合型RTV橡膠 KE3466, 熱傳導率1.9W/m · K)所成厚約30 v m之熱傳導性黏著 層。又，如此使熱電偶與測定點面緊密固定之後，於熱電 偶之周圍整體，亦塗佈前述熱傳導性聚矽氧黏著橡膠，使 熱電偶被聚矽氧黏著橡膠包覆之形式，更完全進行熱電偶 之固定。 又，對於LED之安裝基板而言，於基板內，使用局 部溫度不均爲少之鋁基材之安裝基板時，得知測定誤差爲 少之故，採用鋁基材之LED安裝基板14。 經由此等手法之採用，更可提升LED元件1之溫度 測定精度，在以下實施例中，可進行可靠性更高之溫度測 -71 - 201120377 定。 於本實施例之LED照明具中，電力投入3 0分後之 LED元件1之溫度乃79°C (換算接合溫度約l〇6°C )。 更且，本LED照明具之全光束量爲95流明，lm正 下方照度爲82勒克斯。 接著，取下本LED照明具之光透過性覆蓋層5，配置 光吸收性之黑色板（光透過率0%，光吸收率98%)，完 全切斷向LED照明具之鉛直方向射出之光下，進行光束 量之測定的結果，光束量爲約5流明。即，令LED照明 具之全射出光束爲100之時，透過或通過周圍框體，從周 圍框體之外周面射出之光束之比率約爲5。 然而本LED照明具中，如圖9 (光學模擬結果）所示 ，LED元件1之射出光的大部分，則入射至導光擴散層3 ，導光至層內後，以導光擴散層3上部之逆圓錐形之凹部 加以全反射，入射至在於側面3 d之光源之周圍框體4， 以形成於框體內面之鋁之光反射層再反射後，採取從光透 過性覆蓋層5射出至照明具外之光路。即，做爲照明具， 成爲自周圍框體4之反射面整體，射出照明光之形式之故 ，不同於以點光源狀，直行性強之LED元件1本身之射 出光，可成爲對於眼睛優異之面狀之照明光。然而，圖9 之各部位之形狀或大小之相對關係乃與實際尺寸上之相對 關係幾近相同地被記載。 更且’於圖1之LED照明具中，關於照明光之指向 性（配光分布），可得圖11所例示之照度分布。即，圖 -72- 201120377 1 1之照度分布乃如圖1 〇所示，雖顯示從L E D元 置向鉛直方向隔著1 000mm之距離之平面內（光 上之照度分布之例，可做爲照明光被適度收斂， 限制之面積範圍，適於點狀強照之點照明用之照 具有適切之照度分布。然而，圖Π之縱軸乃相 橫軸乃前述光照射面上之位置L ( mm )。 然而，本實施例中，在於前述光照射面從成 度之LED正下方之位置，離開約100mm之位置 述最大照度之一半之照度。 又，令熱傳導層2、導光擴散層3、光透過 5、電性絕緣層1 2、LED元件1之周圍框體4， 或樹脂組成物作成之故，LED照明具非常輕量， 耐衝擊性高之樹脂或樹脂組成物之故，成爲機械 下安全性高之LED照明具。 [實施例2] 於實施例1中，使用參考例4之熱傳導性樹 、和參考例1 1之電性絕緣層1 2之外，其他所有 作成LED照明具。本熱傳導層2之熱傳導率與 之積乃〇.〇47(W/K)，熱傳導層2之表面積爲約 。將熱傳導層2表面積，以LED元件1投入電 得之値爲約0.0 0 1 9 m 2。 將本LED照明具之點燈試驗，在調整成周 2 5 °C之室內進行，於LED元件1之陰極側焊錫 件1之位 照射面） 將比較被 明具，而 對照度、 爲最大照 ，可得前 性覆蓋層 皆以樹脂 更且使用 強度或落 脂組成物 皆相同地 平均厚度 0.005m2 力加以除 圍溫度爲 接合部之 -73- 201120377 附近，固定K型熱電偶，測定LED元件1之發熱 結果，電力投入30分後之LED元件之溫度爲76°C 接合溫度約103 °C )。更且，做爲LED照明具之全 爲97流明，lm正下方照度爲84勒克斯。接著， LED照明具之光透過性覆蓋層5，配置光吸收性之 (光透過率〇%，光吸收率98%)，完全切斷向 明具之鉛直方向射出之光下，進行光束量之測定的 光束量爲約5流明。即，令LED照明具之全射出 100之時，透過或通過周圍框體，從周圍框體之外 出之光束之比率約爲5。 [實施例3] 於實施例1中，熱傳導層2使用參考例6之熱 樹脂組成物，電性絕緣層1 2使用參考例7之聚碳 脂，使兩者各別成形之下，令兩者使用市售之環氧 系黏著劑（CEMEDINE製註冊商標 CEMEDINE X)，在使黏著層薄薄延伸之狀態下，完全黏著固 體化，成爲本LED照明具之框體。然後，其他以 施例1完全同樣，作成LED照明具。 本熱傳導層2之熱傳導率與平均厚度之積乃i W/K)，熱傳導層2之表面積爲0.005m2。將熱傳 表面積，以 LED元件1投入電力加以除得 0.00 1 1 m2/w ° 將本LED照明具之點燈試驗，在調整成周圍 狀態之 (換算 光束量 取下本 黑色板 LED照 結果， 光束爲 周面射 傳導性 酸酯樹 聚矽氧 SUPER 定而一 外與實 ).037 ( 導層2 之値爲 溫度爲 -74- 201120377 25°C之室內進行，於LED元件1之陰極側焊錫接合部之 附近，固定κ型熱電偶，測定LED元件1之發熱狀態之 結果，電力投入30分後之LED元件1之溫度爲75 °C (換 算接合溫度約1 〇2°C )。然而，本LED照明具之全光束量 爲96流明，1 m正下方照度爲83勒克斯。接著，取下本 LED照明具之光透過性覆蓋層5，配置光吸收性之黑色板 (光透過率〇%，光吸收率98%)，完全切斷向LED照 明具之鉛直方向射出之光下，進行光束量之測定的結果， 光束量爲約5流明。即，令LED照明具之全射出光束爲 100之時，透過或通過周圍框體，從周圍框體之外周面射 出之光束之比率約爲5。 [實施例4] 於實施例1中，除了做爲熱傳導層2，則經由鋁/鎂系 合金（JIS合金、A5056 熱傳導率 110W/m. K’比重約 2.6 )之基塊之切削加工，作成與實施例1相同形狀者， 將熱傳導層2設定於模具空腔內後，經由插入成形法，將 電性絕緣層12層積於熱傳導層2之外，與實施例1完全 相同，組裝LED照明具，進行點燈試驗。 本熱傳導層2之熱傳導率與平均厚度之積乃0.253 ( W/K )，熱傳導層2之表面積爲約0.005m2，將熱傳導層 2表面積以 LED元件 1投入電力除得之値爲約 0.00 1 9m2/W = 又’電力投入30分後之LED元件1之溫度乃65°C ( -75- 201120377 換算接合溫度約9 2 °C )。然而，本L E D照明具$ 量爲102流明，lm正下方照度爲88勒克斯。接奉 本LED照明具之光透過性覆蓋層5，配置光吸收名 板（光透過率〇%，光吸收率98%) ’完全切斷 照明具之鉛直方向射出之光下’進行光束量之測穷 ，光束量爲約5流明。即，令L E D照明具之全身 爲100之時，透過或通過周圍框體’從周圍框體二 射出之光束之比率約爲5。 [實施例5] 組裝圖2所圖示之LED照明具。 熱傳導層2乃使用參考例4之熱傳導性樹脂組 而電性絕緣層12與礙子部8乃使用參考例9之聚 樹脂。熱傳導層2之外周直徑乃28mm，令高度赁 ，厚度爲側面部2mm、平面部3.5mm (熱傳導層2 均厚度約2.3mm)，電性絕緣層12之平均厚度爲 。本熱傳導層2之熱傳導率與平均厚度之積乃 W/K)，熱傳導層2之表面積爲約0.005m2。 然而，在熱傳導層2與電性絕緣層12各別躬 而得成形體之下，令兩者使用市售之環氧聚矽氧系 (CEMEDINE 製註冊商標 CEMEDINE SUPER ) 使黏著層薄薄延伸之狀態下，完全黏著固定而一體 爲本LED照明具之框體。 然而，圖2所圖之LED照明具中，於熱傳導 全光束 ，取下 之黑色 向 LED 的結果 出光束 外周面 L成物， :碳酸酯 | 2 5 mm 總體平 1.5mm 0.043 ( :出成形 :黏著劑 C )，在 丨化，成 層2之 -76- 201120377 外周側面，雖層積參考例9之聚碳酸酯所成電性絕緣層 1 2，有關於此電性絕緣性，使另外作成之2.3 mm厚之熱 傳導層2，1 Jmm之電性絕緣層1 2，以黏著劑層積之平板 狀成形體之厚度方向之靜電破壞電壓爲30kV以上，絕緣 破壞電壓爲約1 OkV以上。 做爲LED元件1，使用2盞日亞化學工業製之燈泡色 晶片型LED NS9L153MT-H3C規定輸出約3W，接合溫度 規格1 5 0 °C )者，使兩晶片之中心間距離（發光面重心間 距離）成爲約5 mm (兩晶片端部間之間隙約1 mm )。 做爲LED安裝基板14，使用令厚約1mm之鋁爲基材 之直徑22mm之鋁基材之安裝基板。安裝基板之背面乃介 著熱傳導性聚矽氧系黏著橡膠（信越SILICONE製縮合 型RTV橡膠 KE3466，熱傳導率1.9W/m· K)所成厚約 30#m之熱傳導性黏著層，固定於熱傳導層2。又，於銅 配線圖案上，印刷成形白色之樹脂絕緣層。 然而，從電源電路向各LED元件1之投入電力約爲 2.2W，2盞合計約爲4.4W。 將熱傳導層2表面積，以LED元件1投入電力加以 除得之値爲0.001 lm2/W。 然而，於LED元件1之周圍框體4中，使用參考例7 之聚碳酸酯樹脂所成平均厚度2.4mm，半徑約25mm之半 球狀之成型體，於該內面側，形成鋁之真空蒸鍍所成厚度 約5Onm之光反射層，成爲框體反射面6a。然而，雖在圖 2有所省略，於光反射面之形成面，形成小酒渦狀之凸狀 -77- 201120377 形狀圖案。 導光擴散層3乃經由丙烯酸樹脂之射出成形 置在於上面約略逆圓錐狀之凹部所成全反射面 下面切除球面之一部分所成之凸透鏡形狀所成之 的導光擴散層3。然而，約略逆圓錐狀之凹部所 光擴散層3上面之直徑乃約12mm，逆圓錐之高 之深度）乃約6mm。又，導光擴散層3下面之 狀乃由半徑6mm之球面之一部分所成曲面者。 擴散層3最下面與LED元件1發光面之間隔乃 即本導光擴散層3乃令圖16之入射透鏡面 面）之頂點位置之Z座標（zl )爲2.5 ( mm)， 面之曲率半徑（rl )爲6mm，入射透鏡面之錐形 )爲〇(球面），入射透鏡面之XY面投射直徑 10mm，全反射面 3a之頂點位置之 Z座標 12.8mm，全反射面3a之Z軸投影長度（ql)爲 反射面3 a之形狀控制點/旋轉軸間距離（q2 )爲 全反射面3a之XY面投射直徑（p2)爲11.6mm 擴散層3之LED元件1相對之面相反側面之XY 徑（p3 )爲 1 2.6mm。 然而，本實施例中，導光擴散層3乃令從導 3對於鉛直方向而言，向45度以上135度以下 圍射出之光量爲100之時，使從與導光擴散層： 元件1相對之面相反側之面，對於鉛直方向而言 ，成爲設 3 a、在於 光折射面 形成之導 度（凹部 凸透鏡形 又，導光 約 2 · 5 mm (光折射 入射透鏡 常數（kl (P 1 )爲 (z 2 )爲 6mm、全 2.9mm > ，與導光 面投射直 光擴散層 之角度範 丨之LED ，向〇度 -78- 201120377 以上，不足45度之角度範圍射出之光量，設計成爲 後者。 又，周圍框體4乃在螺絲嵌合部4a所成固定之 使框體之底面在LED安裝基板14之端面從上方按壓 式下被固定。由此，可達成安裝基板歷時性之剝離之 ，提高LED照明具之長期的可靠性。 光透過性覆蓋層5中，使用三聚氰胺系之硬敷層 成於單面之表面之厚1.5 mm之聚碳酸酯薄片（帝人 製商標名 「panlite MR薄片 PC8199」），使光 側成爲硬敷面，於LED元件1之周圍框體4之上部 黏著劑加以固定而使用。 將本LED照明具之點燈試驗，在調整成周圍溫 2 5 °C之室內進行，於LED元件1之陰極側焊錫接合 附近，固定K型熱電偶，測定LED元件1之發熱狀 結果，電力投入30分後之LED元件1之溫度乃98 °C 算接合溫度約120 °C )。然而，本LED照明具之全光 爲152流明，lm正下方照度爲1 12勒克斯。接著， 本LED照明具之光透過性覆蓋層5，配置光吸收性之 板（光透過率〇%，光吸收率98%)，完全切斷向 照明具之鉛直方向射出之光下，進行光束量之測定的 ，光束量爲約20流明。即，令LED照明具之全射出 爲100之時，透過或通過周圍框體，從周圍框體之外 射出之光束之比率約爲13。 然而本LED照明具中，與實施例1相同，LED 71 30前 時， 之形 抑制 被形 化成 射出 ，以 度爲 部之 能。 (換 束量 取下 黑色 LED 結果 光束 周面 i件1 -79- 201120377 之射出光的大部分，則入射至導光擴散層3，導光至層內 後，以導光擴散層3上部之逆圓錐形之凹部加以全反射， 入射至在於側面3 d之光源之周圍框體4，以形成於框體 內面之鋁之光反射層再反射後，採取從光透過性覆蓋層5 射出至照明具外之光路。即，做爲照明具，成爲自周圍框 體4之反射面整體，射出照明光之形式之故，不同於以點 光源狀，直行性強之LED元件1本身之射出光，可成爲 對於眼睛優異之面狀之照明光。 更且，於圖2所例示之LED照明具中，關於照明光 之指向性（配光分布），可得圖1 3所例示之照度分布。 即，圖13之照度分布乃如圖10所示，雖顯示從LED元 件1之位置向鉛直方向隔著1 000mm之距離之平面內（光 照射面）上之照度分布之例，如圖1 2所說明，令LED元 件1垂直朝向2個並列之方向（令此爲X方向），LED元 件1平行朝向2個並列之方向（令此爲Y方向）時，於X 方向與Y方向，照度分布多少有差異，皆適度收斂照明 光，做爲將較爲限制之面積範圍以適於強照於點狀之點照 明用之照明具，具有適切之照度分布者。然而，圖13之 縱軸乃相對照度、橫軸乃前述光照射面上之位置L ( mm )。 然而，本實施例中，於前述光照射面中，從LED正 下方之位置向X方向，離開約320mm之位置，在γ方向 則離開約250mm之位置，可得前述最大照度之一半之照 度。 • 80 - 201120377 又，令熱傳導層2、導光擴散層3、光透過性覆蓋層 5、電性絕緣層12、LED元件1之周圍框體4，皆以樹脂 或樹脂組成物作成之故，L E D照明具非常輕量，更且使用 耐衝擊性高之樹脂或樹脂組成物之故，成爲機械強度或落 下安全性高之LED照明具。 又，經由於L E D照明具之最外層使用光反射率高之 白色層，可提升LED照明具之外觀、式樣。 [實施例6 ] 於實施例5中，使用參考例5之熱傳導性樹脂組成物 之外，與實施例5完全相同地，作成LED照明具。本熱 傳導層2之熱傳導率與平均厚度之積乃0.047 ( W/K)， 熱傳導層2之表面積爲約0.005m2。將熱傳導層2表面積The pitch-based carbon fiber precursor fabric was heated and heated at 170 ° C to 320 ° C in an air at an average temperature increase rate of 5 ° C / min, and further fired at 800 ° C. . This pitch-based carbon fiber woven fabric was pulverized at 700 rpm using a blade (manufactured by TURBO Co., Ltd.), and graphitized at 3000 °C. The average fiber diameter of the pitch-based graphitized short fibers is 9. 8 // m, the fiber diameter dispersion ratio (CV値) for the average fiber diameter is 9%. The average fiber length is 170/m, and the crystal size from the growth direction of the hexagonal mesh surface is 70 nm. The end faces of the pitch-based graphitized short fibers were observed through a transmission microscope to confirm that the graphene sheets were closed. Further, the surface was observed by a scanning electron microscope, and the number of irregularities was only one, which was substantially flat. [Reference Example 2] Production of mesophase pitch graphitized short fibers - 59-201120377 In Reference Example 1, except that the number average fiber length was 140, which was adjusted by the pulverization time, an intermediate phase was formed with Reference Example 1. Asphalt graphitized staple fiber. [Reference Example 3] Heat-conductive layer 2 (heat-conductive resin composition) The pitch-based graphitized short fiber 45 polycarbonate resin (panlite (registered trademark)) obtained in Reference Example 1 was used in a volume of one part. The shaft mixing device melts the mixed chain to obtain a resin tablet. Using this pellet, an injection molding machine (East EC40NII) was used to obtain a thermally conductive molded article having a thickness of 4 mm. The thermal conductivity of the heat transfer product is 13. 8W / (mvK), volume impedance (Ω · cm), impact resistance is 3.  Ik J/m2, electrostatic breakdown power 10kV - insulation breakdown voltage is less than lkV. However, the specific gravity of the heat conduction layer 2 is as low as 1. 51, especially LED lighting fixtures are lightweight. [Reference Example 4] Heat Conductive Layer 2 (Thermal Conductive Resin Composition) As a base block of the heat conductive layer 2, 15 liters of a blender was equipped with a polyphenylene sulfide resin according to the synthesis method described in Japanese Patent Publication No. 2007-1 46 1 05 In a high-temperature sterilizer, Na 2S 1 8 66 g and N-methyl-2-pyrrolidone (hereinafter referred to as NMP) were placed, and the mixture was stirred under a nitrogen stream, and the temperature was gradually raised to 205 ° C to distill off water. After cooling the system to 14 (TC, add 1500 g of p-dichlorobenzene NMP, and seal it into the system under a nitrogen stream. This system makes the short fibers the same, the volume fraction, L-1 225Y thermal conductivity, mechanically guided formation Approximately 6 X 1 0 1 pressure is insufficient for its application to the general opening license. 8H2〇 5 liters, 407g of 2280g and stream temperature raised to -60-201120377 2 2 5 °C ' at 2 2 5 °C for 2 hours of polymerization. After the end of the polymerization, the mixture was cooled to room temperature. The polymer group was separated by a centrifugal separator. The polymer was washed with warm water and dried at 1 ° C for one day and night, and further heat-hardened at 23 ° C under an air atmosphere to obtain a poly(p-phenylene sulfide) resin. This poly(p-phenylene sulfide) resin was used as a powder shape after the use of a pulverizer, and then 69 parts by volume of the pitch-based graphitized short fiber obtained in Reference Example 1, the aforementioned poly(p-phenylene sulfide) resin 10 0 parts by volume, the mixed chain was melted using a two-axis mixed chain device to obtain a pellet of a thermally conductive resin. Using this pellet, an injection molding machine (EC40NII manufactured by Toshiba Machine Co., Ltd.) was used to obtain a thermally conductive molded article having a thickness of 4 mm. The thermal conductivity of the thermally conductive molded article is 18. 6W/ ( m . K ) ' volume impedance is about 3 X 1 0Q ( Ω .  Cm ), impact resistance is 1 . 5k〗/m2 ’ The electrostatic breakdown voltage is less than 1 〇kV, and the dielectric breakdown voltage is less than lkV. However, the specific gravity of the heat conduction layer 2 is as low as 1. 7, especially suitable for the lightweight of LED lighting. [Reference Example 5] Heat Conductive Layer 2 (Thermal Conductive Resin Composition) 1 part by volume of the poly(p-phenyl sulfide) resin obtained in Reference Example 4, and 92 parts by volume of the pitch-based graphitized short fiber obtained in Reference Example 2 The melt-mixed chain is melted using a two-axis mixed-chain device to obtain a pellet of a thermally conductive resin. Using this ingot, an injection molding machine (ECMONII manufactured by Toshiba Machine Co., Ltd.) was used to obtain a thermally conductive molded article having a thickness of 4 mm. The thermal conductivity of a thermally conductive molded article is 20. 4W/ ( m .  K ), the volume impedance is about 8x 1 (Γ1 ( Ω .  Cm), impact resistance is l. lkJ/m2, the electrostatic breakdown voltage is less than 10kV, and the insulation is broken. -61 - 201120377 The bad voltage is less than lkV. However, the specific gravity of the heat conduction layer 2 is as low as 1. 75, especially suitable for the lightweight of LED lighting. [Reference Example 6] Heat Conductive Layer 2 (Thermal Conductive Resin Composition) 55 parts by volume of the pitch-based graphitized short fiber obtained in Reference Example 1, and a cyclic polyolefin resin (JSR Co., Ltd. "ARTON" D4531F) The melt-blended chain was melted using a two-axis mixed chain device to obtain a pellet of a thermally conductive resin. Using this pellet, an injection molding machine (EC40NII manufactured by Toshiba Machine Co., Ltd.) was used to obtain a thermally conductive molded article having a thickness of 4 mm. The thermal conductivity of the thermally conductive molded article is 15. 9W/(m. K), volume resistance. The resistance is about 9X10·1 (Ω · cm ) and the impact resistance is 2. 2kJ/m2, the electrostatic breakdown voltage is less than 10kV, and the dielectric breakdown voltage is less than lkV. However, the specific gravity of the heat conduction layer 2 is as low as 1. 48. It is also especially suitable for the light weight of LED lighting fixtures or the use of outdoor housing for excellent weather resistance outside the house. [Reference Example 7] Electrically insulating layer 1 2 (resin) A polycarbonate resin (panlite (registered trademark) L-1 225Y) was used to obtain a molded article having a thickness of 4 mm. The heat conductivity of the molded article is 0. 2W / ( m · K ), impact resistance of 72kJ / m2, volume impedance of 1013 (Ω · cm). However, the specific gravity of the electrically insulating layer 12 is as low as one. 2, especially suitable for lightweighting of LED lighting fixtures-62-201120377 [Reference Example 8] Electrical insulating layer 1 2 (resin) in polycarbonate resin (Pentite (registered trademark) L-1 225Y) 100 weight Alumina particles (A 3 5 - 0 1 manufactured by Micron Co., Ltd.) having an average particle diameter of about 30/m, 80 parts by weight, and alumina particles having an average particle diameter of about 8 (AX10-32, manufactured by Micron Co., Ltd.) 60 weight A resin having a fiber length of 3 mm and 15 parts by weight of a resin mixed by a biaxial mixed chain was used as the electrically insulating layer 12 to obtain a white molded article having a thickness of 4 mm. The thermal conductivity of the molded article is 〇. 8W / ( m · K) ' impact resistance is 8kJ / m2, volume impedance is about l 〇 12 (n. Cm). However, the specific gravity of the electrically insulating layer 12 is as low as about 1. 7 ' is especially suitable for lightweighting LED lighting. Further, since the thermal conductivity is high, it is suitable for the heat dissipation effect of the LED element 1. [Reference Example 9] Electrically Insulating Layer 1 2 (Resin) Polycarbonate resin was used in which a white pigment or the like was added to a polycarbonate resin (Panlite (registered trademark), a non-flammable light high-reflection grade LN- 3010RM), a white molded product with a thickness of 4 mm. The heat conductivity of the molded article is 0. The 3W/(m · K ) ' impact resistance is 12kJ/xn2 and the volumetric impedance is 1〇13Ω.  The light reflectivity of cm' is 95%, and the flame retardancy is 1. Under the condition of 6 mm thickness, 'V-0. However, the specific gravity of the electrically insulating layer 12 is as low as one. 3, especially suitable for the lightweight of LED lighting. Moreover, the high light reflectance is white, and it is suitable for improving the design of the LED lighting fixture. Ref. High reflection grade LN-3 000RM ) 'Bladding molded' 4mm thick white molded article. The thermal conductivity of the molded article is 〇. 3W / ( m · K), impact resistance is 60kJ / m2, volume impedance is 1 〇 13 Ω · cm ′ light reflectivity 95%, flame retardancy is 1. Under the condition of 6mm thickness, it is V-0. However, the specific gravity of the electrically insulating layer 12 is as low as about 1. 3, especially suitable for the lightweight of LED lighting. Moreover, the high light reflectance is white, and it is suitable for improving the design of the LED lighting fixture. [Reference Example 1 1] Electrically insulating layer 1 2 (resin) A commercially available glass fiber reinforced poly(P-phenylene sulfide) resin (FORTRON registered trademark 1 130A1 manufactured by POLYPLASTICS) was used to obtain a molded article having a thickness of 4 mm by injection molding. . The heat conductivity of the molded article is 0. 2W/(m. K), the impact resistance is about l〇kJ/m2, the volume impedance is 1014 Ω · cm, and the flame retardancy is 1. Under the condition of 6mm thickness, it is V-0 and the specific gravity is 1. 57. [Reference Example 1 2] The heat conductive layer 2 and the electrically insulating layer 1 were integrally molded. The thermally conductive resin pellet obtained in Reference Example 3 and the polycarbonate resin of Reference Example 7 were used in an injection molding machine (manufactured by Toshiba Machine Co., Ltd.). The EC40NII-based two-color injection molding machine has a flat-plate heat-conductive resin composite-64-201120377 synthetic body (thermal conductive two-color resin molded body). The average thickness of the heat conductive layer 2 formed by the thermally conductive resin sheet is 2. 3mm, the average thickness of the electrical insulating layer (reinforcing layer) made of polycarbonate is 1 m m. The impact resistance of the obtained thermally conductive resin composite molded body is 1 1. 8kJ/m2. Further, the electrostatic breakdown voltage is 30 kV or more and the dielectric breakdown voltage is 10 kV or more. [Reference Example 1 3] The heat conductive layer 2 and the electrically insulating layer 12 were formed by one body using the thermally conductive resin ingot obtained in Reference Example 4 and the resin ingot of Reference Example 11 using an injection molding machine (EC40N11 manufactured by Toshiba Machine Co., Ltd.) In the two-color injection molding machine based on the above, a flat-shaped thermally conductive resin composite molded body (thermally conductive two-color resin molded body) is obtained. The average thickness of the heat conducting layer formed by the thermally conductive resin pellet of Reference Example 4 was 2. The average thickness of the electrically insulating resin layer (reinforcing layer) of the resin ingot of the reference example 11 was 1 mm °, and the heat-resistant resin composite molded body had a punching resistance of 6.  Lk]/m2. Further, the electrostatic breakdown voltage is 3 OkV or more and the dielectric breakdown voltage is 1 OkV or more. [Reference Example 14] The layers of the heat conductive layer 2 and the electrically insulating layer 1 2 (reinforcing layer) were each formed into an average thickness of the thermally conductive resin ingot obtained in Reference Example 4. A 3 mm flat plate, a flat plate of an electrically insulating layer 1 2 (reinforcing layer) having an average thickness of 1 mm using the polycarbonate resin of Reference Example 7 was used, and a commercially available epoxy polyoxynene system was used for both -65-201120377. Adhesive (CEMEDINE SUPER X, a registered trademark of CEMEDINE), is completely adhered and integrated while the adhesive is stretched thinly. The impact resistance of the obtained thermally conductive resin composite molded body was 9. 2kJ/m2. Further, the electrostatic breakdown voltage is 3 OkV or more, and the dielectric breakdown voltage is 10 kV or more. [Reference Example 15] The layers of the heat conductive layer 2 and the electrically insulating layer 12 (reinforcing layer) were each formed into an average thickness of the thermally conductive resin ingot obtained in Reference Example 2. A 3 mm flat plate, a flat plate of an electrically insulating layer 1 2 (reinforcing layer) having an average thickness of 1 mm using the polycarbonate resin of Reference Example 7 was used, and a commercially available epoxy polyoxygen adhesive (CEMEDINE) was used. The registered trademark CEMEDINE SUPER X) is completely adhered and integrated while the adhesive is extended thinly. The impact resistance of the obtained thermally conductive resin composite molded body was 8. 4kJ/m2. Further, the electrostatic breakdown voltage is 30 kV or more, and the dielectric breakdown voltage is 10 kV or more. [Reference Example 1 6] The layers of the heat conductive layer 2 and the electrically insulating layer 1 2 (reinforcing layer) were each formed into an average thickness of the thermally conductive resin ingot obtained in Reference Example 2. A 3 mm flat plate, a flat plate of an electrically insulating layer 1 2 (reinforcing layer) having an average thickness of 1 mm using the polycarbonate resin of Reference Example 7 was used, and a commercially available epoxy polyfluorene system was used for both -66-201120377. Adhesive (CEMEDINE SUPER X, registered trademark of CEMEDINE) 'In the state where the adhesive is stretched thinly, it is completely adhered and integrated. The impact resistance of the obtained thermally conductive resin composite molded body was 10. 1kJ/m2. Further, the electrostatic breakdown voltage is 30 kV or more, and the dielectric breakdown voltage is 1 OkV or more. [Reference Example 1 7] One of the heat conductive layer 2 and the electrically insulating layer 1 2 (reinforcing layer) was formed into an average thickness of the heat conductive resin pellet obtained by using Reference Example 2. A 3 mm flat plate, using a white polycarbonate resin of the reference example, an average thickness of 1 mm, an electric insulating layer 1 2 (reinforcing layer), and then using both epoxy-based epoxy adhesives (manufactured by CEMEDINE) The registered trademark CEMEDINE SUPER X) is completely adhered and integrated while the adhesive is extended thinly. The impact resistance of the obtained thermally conductive resin composite molded body was 8. 2kJ/m2. Further, the electrostatic breakdown voltage is 30 kV or more, and the dielectric breakdown voltage is 1 OkV or more. [Embodiment 1] The LED lighting fixture shown in Fig. 1 was assembled. The heat conductive layer 2 was formed by using the heat conductive resin composition of Reference Example 3, and the polycarbonate resin of Reference Example 7 was used for the electrically insulating layer 12, and integrally molded by a two-color resin molding method. The outer diameter of the heat conducting layer 2 is 28 mm, the height is 25 mm, the thickness is 2 mm on the side, and the flat portion is -67-201120377. 5mm (the total average thickness of the heat conducting layer 2 is about 2. 3mm), the average thickness of the electrically insulating layer 12 is 1. 5 mm. The product of the thermal conductivity and the average thickness of the heat conducting layer 2 is 0. 032 (W/K), the surface area of the heat conducting layer 2 is about 0. 005m2. Further, on the unlaminated side of the reinforcing layer on the outer peripheral side of the heat conducting layer 2, a thin layer of electrical insulating layer is laminated by coating with a heat shrinkable tube. In other words, a heat-shrinkable tube made of a saturated polyester resin (trade name teletube, about 100/zm thick) was placed around the heat-conducting layer 2, and the tube was placed, and then passed through a heater heated to 200 ° C. The air is blown, the tube body is heated, and heat shrinkage is performed, and the electrically insulating thin layer 10 is laminated on the outer peripheral side of the heat conductive layer 2 in the same manner. However, the layer thickness after lamination is about 130 // m. In addition, the volume impedance of the thin layer 10 which is electrically insulating is measured to be 6 x l Ο 13 Ω · cm. Further, on one side of the flat-shaped molded body of the heat-transfer layer 2 of 2 mm thick, the electrostatic breakdown voltage in the thickness direction of the molded body in which the electrically insulating thin layer 1 is laminated is 30 kV or more, and the dielectric breakdown is broken. The voltage is about 10 kV or more. As the LED element 1, a light bulb color chip type LED NS9L153MT-H3 (a predetermined output of about 3 W, a junction temperature specification of 150 ° C) manufactured by Nichia Chemical Industry Co., Ltd. is used as the LED mounting substrate 14, and the thickness is about A mounting base of aluminum base based on a 1 mm aluminum base with a diameter of 22 mm. The back side of the mounting substrate is based on a thermally conductive polyoxygenated adhesive rubber (Shin-Etsu SILICONE condensed RTV rubber KE3466, thermal conductivity 1. 9W/m.  K) A thermally conductive adhesive layer having a thickness of about 30 #m is fixed to the heat conducting layer 2. Further, a white insulating tree-68-201120377 grease insulating layer was printed on the copper wiring pattern. However, the power input from the power supply circuit to the LED element 1 is 2. 7W. The surface area of the heat conducting layer 2 is reduced by the input of the LED element 1 to about 0. 001 9m2/w. However, in the surrounding frame 4 of the LED element 1, the polycarbonate resin of Reference Example 7 was used to have an average thickness of 2. A 4 mm-shaped hemispherical molded body having a radius of about 25 mm is formed on the inner surface side to form a light-reflecting layer having a thickness of about 5 nm from the vacuum deposition of aluminum, and becomes a frame-shaped light-reflecting surface 6a. However, although it is omitted in Fig. 1, from the viewpoint of the design of the LED lighting device, a convex shape pattern of a small wine swirl is formed on the surface on which the light reflecting surface is formed. Further, in the present embodiment, when the screw fitting portion 4a is fixed, the peripheral frame 4 is fixed such that the bottom surface of the casing is pressed from the upper end surface of the LED mounting substrate 14. Thereby, the suppression of the peeling of the mounting substrate over time can be achieved, and the long-term reliability of the LED lighting fixture can be improved. The light-guiding diffusion layer 3 is formed by injection molding of an acrylic resin, and has a light-diffusing surface having a light-refractive surface formed by a convex lens shape formed by a concave portion formed by a concave portion in a substantially inverted conical shape and a convex lens portion formed by cutting a spherical surface. Layer 3. 44A to 44C are external views of the light guiding diffusion layer 3 of the first embodiment as seen from an oblique direction. However, the diameter of the light guiding diffusion layer 3 formed by the approximately concave conical recess is about 12 mm, and the height of the cone (depth of the recess) is about 6 mm. Further, the shape of the convex lens below the light guiding diffusion layer 3 is a curved surface formed by a part of a spherical surface having a radius of 6 mm. Further, the distance between the lowermost portion of the light guiding diffusion layer 3 and the light emitting surface of the L E D element 1 is about 2. 5mm. -69 - 201120377 The light guiding diffusion layer 3 is such that the Z coordinate (z 1 ) of the vertex position of the incident lens surface (light refractive surface) of Fig. 16 is 2 · 5 ( mm ), and the radius of curvature of the incident lens surface ( Γ1) is 6 mm, the cone constant (kl) of the incident lens surface is 〇 (spherical surface), the XY plane projection diameter (pi) of the incident lens surface is 10 mm, and the Z coordinate (z2) of the apex position of the total reflection surface 3a is 12 . 8mm, the Z-axis projection length (ql) of the total reflection surface 3a is 6 mm, and the shape control point/rotation axis distance (q2) of the total reflection surface 3a is 2. 9mm, the XY plane projection diameter (P2) of the total reflection surface 3a is 1 1 . The diameter of the XY plane projection (p3) of the opposite side of the face opposite to the LE D element 1 of the light guiding diffusion layer 3 is 6 mm. 6mm. However, in the present embodiment, the light-guiding diffusion layer 3 diffuses the light guide light from the light guide diffusion layer 3 when the amount of light emitted from the light guide diffusion layer 3 in the range of 45 degrees or more and 135 degrees or less is 100. In the vertical direction of the LED element 1 of the layer 3, the amount of light emitted in an angular range of less than 45 degrees in the vertical direction is designed to be 15 or so. Further, a portion of the surface of the light-conducting diffusion layer 3 opposite to the LED element was used as a light-reflecting layer, and a white reflective PET film (manufactured by Teijin DUPONT Film) having a thickness of 50 was adhered thereto to form a light-reflecting surface 6b. In the light-transmitting cover layer 5, a hard coating layer of melamine is used to form a thickness of one surface of the single side. A 5 mm polycarbonate sheet (trade name "panlite MR sheet PC - 8 1 9 9" manufactured by Teijin Chemicals Co., Ltd.) is used to make the light emitting side a hard surface, and is attached to the upper portion of the frame 4 around the LED element 1 with an adhesive. Fixed and used. -70- 201120377 Further, the 'Blocking Section 8' is a white polycarbonate resin of Reference Example 9, and the average thickness of the thickness portion including the joint fixing portion is about 2. It is formed by a 5 mm molded body. The lighting test of the LED illuminator was carried out in a room where the ambient temperature was adjusted to 25 ° C, and a K-type thermocouple was fixed in the vicinity of the cathode-side solder joint portion of the LED element 1 to measure the heat generation state of the LED element 1. However, the temperature measurement of the LED element 1 is likely to cause a large error due to the method of the present inventors, which is mainly caused by the contact between the thermocouple and the LED element 1 (between temperature measurement points). Fixed state and caused by uneven thermal impedance. According to this finding, in order to minimize the unevenness of the thermal resistance, a thin-shaped thermocouple (thickness of 100 Å #m) having a softness is used, and the measurement point is made tight on the surface. In the adhesion of the thermocouple, a thermally conductive polyoxygenated adhesive rubber (a condensed RTV rubber KE3466 manufactured by Shin-Etsu SILICONE) was used. 9W/m · K) A thermally conductive adhesive layer of approximately 30 v m thick. Further, after the thermocouple is closely fixed to the surface of the measurement point, the heat conductive polyoxygenated adhesive rubber is applied to the entire periphery of the thermocouple, and the thermocouple is coated with the polyoxygenated adhesive rubber. The thermocouple is fixed. Further, in the mounting substrate of the LED, when the mounting substrate of the aluminum substrate having a small local temperature is used in the substrate, it is known that the measurement error is small, and the LED mounting substrate 14 of the aluminum substrate is used. By using such a method, the temperature measurement accuracy of the LED element 1 can be improved, and in the following embodiments, the temperature measurement with higher reliability can be performed -71 - 201120377. In the LED lighting device of the present embodiment, the temperature of the LED element 1 after the power is supplied for 30 minutes is 79 ° C (the conversion bonding temperature is about 16 ° C). Moreover, the total luminous flux of the LED illuminator is 95 lumens, and the illuminance below the lm is 82 lux. Next, the light-transmitting cover layer 5 of the LED illuminator is removed, and a light-absorbing black plate (light transmittance: 0%, light absorption rate: 98%) is disposed, and the light emitted to the vertical direction of the LED illuminator is completely cut off. Next, as a result of measuring the amount of the beam, the amount of the beam was about 5 lumens. That is, when the total emitted light beam of the LED illuminator is 100, the ratio of the light beams emitted from the outer peripheral surface of the surrounding frame through or through the surrounding frame is about 5. However, in the LED illuminating device, as shown in FIG. 9 (optical simulation result), most of the light emitted from the LED element 1 is incident on the light guiding diffusion layer 3, and after guiding the light into the layer, the light guiding diffusion layer 3 is guided. The concave portion of the upper reverse conical shape is totally reflected, and is incident on the frame body 4 around the light source on the side surface 3 d, and is reflected by the light reflecting layer of aluminum formed on the inner surface of the frame, and then emitted from the light transmissive cover layer 5 To the light path outside the lighting. In other words, as the illuminating device, the entire surface of the reflecting surface of the surrounding frame 4 is emitted, and the form of the illuminating light is different from the point light source, and the light emitted from the LED element 1 which is strong in straightness can be excellent for the eyes. The surface of the illumination. However, the relative relationship between the shapes and sizes of the respective portions of Fig. 9 is described almost identically to the relative relationship between the actual dimensions. Further, in the LED lighting device of Fig. 1, regarding the directivity (light distribution) of the illumination light, the illuminance distribution illustrated in Fig. 11 can be obtained. That is, the illuminance distribution of Fig. 72-201120377 1 1 is as shown in Fig. 1 ,, although it is shown in the plane in which the LED element is placed in the vertical direction at a distance of 1 000 mm (the illuminance distribution on the light can be regarded as The illumination light is moderately converged, and the area of the limitation is limited. The illumination for the point illumination of the point is suitable for the illumination distribution. However, the vertical axis of the diagram is the position of the horizontal illumination axis L (mm). However, in the present embodiment, the light-irradiating surface is separated from the position directly below the LED, and the illuminance is one-half of the maximum illuminance at a position of about 100 mm. Further, the heat-conducting layer 2, the light-conducting diffusion layer 3, Light transmission 5, electrical insulating layer 1 2, surrounding frame 4 of LED element 1, or resin composition, LED lighting is very lightweight, high impact resistance resin or resin composition, become a machine [Embodiment 2] In the first embodiment, all of the LED lighting fixtures were used except for the thermal conductivity tree of Reference Example 4 and the electrically insulating layer 1 of Reference Example 11. The heat conductivity of the heat conduction layer 2 is the same as that of the heat conduction layer. 〇47 (W/K), the surface area of the heat conducting layer 2 is about . The surface area of the heat conducting layer 2 is about 0. 0 0 1 9 m 2. The lighting test of the LED lighting fixture is carried out in a room adjusted to a temperature of 25 ° C, and the irradiation surface of the soldering material 1 on the cathode side of the LED element 1 is comparatively recognized, and the contrast is the maximum illumination. The pre-existing cover layer is made of resin and the average thickness of the strength or the fat-removing composition is the same. 005m2 force is divided into the junction temperature -73- 201120377, fixed K-type thermocouple, measuring the heat generation result of LED element 1, the temperature of the LED component after power input for 30 minutes is 76 ° C, the junction temperature is about 103 ° C ). Moreover, as the LED lighting fixture, it is 97 lumens, and the illumination below lm is 84 lux. Next, the light-transmitting cover layer 5 of the LED illuminator is provided with light absorptivity (light transmittance 〇%, light absorptivity: 98%), and completely cuts off the light emitted in the vertical direction of the bright device, and performs the beam amount. The measured amount of the beam was about 5 lumens. That is, when the LED illuminator is fully emitted 100, the ratio of the light beams emerging from the surrounding frame through or through the surrounding frame is about 5. [Example 3] In Example 1, the heat conductive layer 2 was made of the thermal resin composition of Reference Example 6, and the electrically insulating layer 12 was made of the polycarbonate of Reference Example 7 so that the two were formed separately, so that A commercially available epoxy-based adhesive (CEMEDINE X, a registered trademark of CEMEDINE) was used, and the adhesive layer was completely stretched and solidified to become a frame of the LED lighting fixture. Then, the other example 1 is exactly the same, and an LED lighting fixture is produced. The thermal conductivity of the heat conducting layer 2 and the average thickness are i W / K), and the surface area of the heat conducting layer 2 is 0. 005m2. The heat transfer surface area is divided by the input power of the LED element 1 to obtain 0. 00 1 1 m2/w ° The lighting test of the LED illuminator is adjusted to the surrounding state (the amount of the converted beam is taken as the result of the black plate LED, and the beam is the surface-emitting oxidized acid tree. Set an exception and reality). 037 (The conduction layer 2 is a chamber having a temperature of -74 to 201120377 at 25 ° C, and a κ-type thermocouple is fixed in the vicinity of the cathode-side solder joint portion of the LED element 1 to measure the heat generation state of the LED element 1 The temperature of the LED element 1 after the power input is 30 minutes is 75 ° C (the conversion junction temperature is about 1 〇 2 ° C). However, the total illumination amount of the LED illuminator is 96 lumens, and the illumination below 1 m is 83 lux. Next, the light-transmitting cover layer 5 of the LED illuminator is removed, and a light-absorptive black plate (light transmittance 〇%, light absorptivity: 98%) is disposed, and the light emitted toward the vertical direction of the LED illuminator is completely cut off. Next, as a result of measuring the amount of the beam, the amount of the beam is about 5 lumens, that is, when the total emitted beam of the LED illuminator is 100, the light beam emitted from the outer peripheral surface of the surrounding frame passes through or through the surrounding frame. The ratio is about 5. [Example 4] In Example 1, except as the heat conductive layer 2, the aluminum/magnesium alloy (JIS alloy, A5056 thermal conductivity 110 W/m.  K' specific gravity is about 2. 6) The cutting process of the base block is the same as that of the first embodiment, and after the heat conduction layer 2 is set in the cavity of the mold, the electrically insulating layer 12 is laminated outside the heat conduction layer 2 via the insert molding method. In the same manner as in Example 1, an LED lighting fixture was assembled and a lighting test was performed. The product of the thermal conductivity and the average thickness of the heat conducting layer 2 is 0. 253 (W/K), the surface area of the heat conducting layer 2 is about 0. 005m2, the surface area of the heat conduction layer 2 is divided by the input power of the LED element 1 to be about 0. 00 1 9m2/W = 'The temperature of the LED component 1 after 30 minutes of power input is 65 °C (-75-201120377 conversion junction temperature is about 9 2 °C). However, this L E D illuminator has a volume of 102 lumens, and the illumination below lm is 88 lux. The light-transmitting cover layer 5 of the LED illuminator is arranged, and the light-absorbing plate (light transmittance 〇%, light absorption rate 98%) is disposed. 'The light beam is emitted under the light emitted from the vertical direction of the illuminator completely. Poor measurement, the amount of beam is about 5 lumens. That is, when the whole body of the L E D illuminator is 100, the ratio of the light beams emitted from the surrounding frame through or through the surrounding frame body is about 5. [Embodiment 5] The LED lighting fixture shown in Fig. 2 was assembled. The heat conductive layer 2 was the heat conductive resin group of Reference Example 4, and the electrical insulating layer 12 and the insole portion 8 were made of the polyresin of Reference Example 9. The outer circumference of the heat-conducting layer 2 is 28 mm in diameter, so that the height is about 2 mm in the side portion and the flat portion is 3. 5mm (heat conduction layer 2 is about 2. 3mm), the average thickness of the electrically insulating layer 12 is . The thermal conductivity of the heat conducting layer 2 and the average thickness are W/K), and the surface area of the heat conducting layer 2 is about 0. 005m2. However, under the molded body in which the heat conducting layer 2 and the electrically insulating layer 12 are separately formed, the adhesive layer is thinly extended by using a commercially available epoxy polyoxyl system (CEMEDINE SUPER). In the state, it is completely fixed and integrated into the frame of the LED lighting fixture. However, in the LED illuminator shown in Fig. 2, in the heat-conducting full-beam, the black-out LED is removed, and the outer peripheral surface of the beam is formed as a material, : carbonate | 2 5 mm is flat. 5mm 0. 043 ( : Forming: Adhesive C), on the outer peripheral side of the layer 2 -76- 201120377, although laminated, the polycarbonate of Reference Example 9 is made into an electrical insulating layer 12, related to this electrical insulation Sexuality, making it another. 3 mm thick heat conduction layer 2, 1 Jmm of the electric insulating layer 12, the electrostatic breakdown voltage in the thickness direction of the flat shaped body laminated with the adhesive is 30 kV or more, and the insulation breakdown voltage is about 1 OkV or more. As the LED element 1, the light source color chip type LED NS9L153MT-H3C manufactured by Nichia Chemical Industry Co., Ltd. has a output of about 3 W, and the junction temperature is 150 ° C. The distance between the centers of the two wafers (the center of gravity of the light-emitting surface) The distance between the two is about 5 mm (the gap between the ends of the two wafers is about 1 mm). As the LED mounting substrate 14, a mounting substrate of an aluminum substrate having a diameter of 22 mm and having aluminum as a base material of about 1 mm was used. The back side of the mounting substrate is based on a thermally conductive polyoxygenated adhesive rubber (the condensed RTV rubber KE3466 manufactured by Shin-Etsu SILICONE, thermal conductivity 1. 9W/m· K) A thermally conductive adhesive layer having a thickness of about 30 #m is fixed to the heat conductive layer 2. Further, a white resin insulating layer was printed on the copper wiring pattern. However, the power input from the power supply circuit to each of the LED elements 1 is about 2. 2W, 2盏 total is about 4. 4W. The surface area of the heat conducting layer 2 is divided by the power input of the LED element 1 to be 0. 001 lm2/W. However, in the frame 4 around the LED element 1, the polycarbonate resin of Reference Example 7 was used to have an average thickness of 2. A 4 mm-shaped hemispherical molded body having a radius of about 25 mm is formed on the inner surface side to form a light-reflecting layer having a thickness of about 5 nm which is vacuum-deposited by aluminum, and serves as a frame-reflecting surface 6a. However, although it is omitted in Fig. 2, the shape of the light-reflecting surface is formed into a convex shape of a small wine swirl-shaped pattern -77-201120377. The light-guiding diffusion layer 3 is formed by injection molding of an acrylic resin on the light-reflecting layer 3 formed by the convex lens shape formed by cutting off one of the spherical surfaces on the upper surface of the concave portion formed by the concave portion. However, the diameter of the light diffusion layer 3 on the approximately concave conical recess is about 12 mm, and the depth of the reverse cone is about 6 mm. Further, the shape under the light guiding diffusion layer 3 is a curved surface formed by a part of a spherical surface having a radius of 6 mm. The Z coordinate (zl) of the vertex position of the lowermost portion of the diffusion layer 3 and the light emitting surface of the LED element 1 is such that the light guiding diffusion layer 3 is the incident lens surface of Fig. 16 is 2. 5 (mm), the radius of curvature of the face (rl) is 6 mm, the taper of the incident lens surface is 〇 (spherical surface), the XY plane of the incident lens surface is projected to a diameter of 10 mm, and the Z coordinate of the apex position of the total reflection surface 3a is 12. 8mm, the Z-axis projection length (ql) of the total reflection surface 3a is the shape control point/rotational axis distance (q2) of the reflection surface 3a, and the XY plane projection diameter (p2) of the total reflection surface 3a is 11. The XY diameter (p3) of the opposite side of the LED element 1 of the 6 mm diffusion layer 3 is 1 2. 6mm. However, in the present embodiment, the light-guiding diffusion layer 3 is such that when the amount of light emitted from the guide 3 to the vertical direction of 45 degrees or more and 135 degrees or less is 100, the light guide diffusion layer is opposed to the light guide diffusion layer: On the opposite side of the surface, for the vertical direction, it is set to 3 a, the conductance of the light-refractive surface is formed (the concave convex lens shape, the light guide is about 2 · 5 mm (light refraction incident lens constant (kl (P 1 ) is (z 2 ) is 6mm, all 2. 9mm > , the angle of the LED that projects the direct light diffusion layer with the light guide surface, and the amount of light emitted from the angle of -78-201120377 or more, less than 45 degrees, is designed to be the latter. Further, the peripheral frame 4 is fixed to the screw fitting portion 4a, and the bottom surface of the frame is fixed to the end surface of the LED mounting substrate 14 by pressing from above. Thereby, the peeling of the mounting substrate can be achieved over time, and the long-term reliability of the LED lighting fixture can be improved. In the light-transmitting cover layer 5, a melamine-based hard coat layer is used to form a thickness of one surface. A polycarbonate sheet of 5 mm (trade name "panlite MR sheet PC8199" by Teijin) was used as a hard surface, and the adhesive was fixed on the upper portion of the frame 4 around the LED element 1. The lighting test of the LED illuminator was carried out in a room adjusted to an ambient temperature of 25 ° C. A K-type thermocouple was fixed in the vicinity of the cathode-side solder joint of the LED element 1, and the heat generation result of the LED element 1 was measured. The temperature of the LED element 1 after 30 minutes of input is 98 ° C and the junction temperature is about 120 ° C). However, this LED illuminator has a total light of 152 lumens, and the illumination below lm is 1 12 lux. Next, the light-transmitting cover layer 5 of the LED illuminator is provided with a light-absorbing plate (light transmittance 〇%, light absorption rate: 98%), and the light beam emitted from the vertical direction of the illuminator is completely cut off to perform light beam. The amount of the beam measured is about 20 lumens. That is, when the total output of the LED illuminator is 100, the ratio of the light beams emitted from the outside of the surrounding frame through or through the surrounding frame is about 13. However, in the present LED lighting fixture, as in the first embodiment, in the case of the LED 71 30, the shape suppression is formed into an emission, and the degree is the same. (The amount of the beam is removed. The majority of the light emitted from the peripheral surface of the beam i-79-201120377 is incident on the light-diffusing layer 3, and after guiding the light into the layer, the upper portion of the light-diffusing layer 3 is guided. The recessed portion of the reverse conical shape is totally reflected, and is incident on the peripheral frame 4 of the light source on the side surface 3 d, and is reflected by the light reflecting layer of aluminum formed on the inner surface of the frame, and then emitted from the light transmissive cover layer 5 to the illumination. In other words, as an illuminating device, it becomes a form of illumination light from the entire reflective surface of the surrounding frame 4, and is different from the light emitted from the LED element 1 which is straight in the direction of a point source. Further, in the LED illuminating device illustrated in Fig. 2, the illuminance distribution exemplified in Fig. 13 can be obtained with respect to the directivity (light distribution) of the illumination light. As shown in Fig. 10, the illuminance distribution of Fig. 13 shows an example of the illuminance distribution in the plane (light irradiation surface) from the position of the LED element 1 to the vertical direction by a distance of 1 000 mm, as shown in Fig. 12. Explain that the LED element 1 is oriented vertically in two parallel directions. (Whether this is the X direction), when the LED elements 1 are oriented in parallel in two parallel directions (this is the Y direction), the illuminance distribution differs somewhat in the X direction and the Y direction, and the illumination light is moderately converged as In order to limit the area of the illuminating device for the illumination of the point-like point, it has an appropriate illuminance distribution. However, the vertical axis of Fig. 13 is the contrast degree, and the horizontal axis is the position L of the light-illuminating surface. (mm). However, in the present embodiment, the light irradiation surface is separated from the position directly under the LED in the X direction by a position of about 320 mm, and the position in the γ direction is separated by about 250 mm, so that the maximum illumination can be obtained. In addition, the heat-conducting layer 2, the light-transmitting diffusion layer 3, the light-transmitting cover layer 5, the electrical insulating layer 12, and the surrounding frame 4 of the LED element 1 are all made of a resin or a resin composition. As a result, LED lighting is very lightweight, and it uses a resin or resin composition with high impact resistance to become an LED illuminator with high mechanical strength or high safety. High light reflectivity In the white layer, the appearance and pattern of the LED lighting fixture can be improved. [Example 6] An LED lighting fixture was produced in the same manner as in Example 5 except that the thermally conductive resin composition of Reference Example 5 was used. The product of the thermal conductivity and the average thickness of the heat conducting layer 2 is 0. 047 (W/K), the surface area of the heat conducting layer 2 is about 0. 005m2. Heat conduction layer 2 surface area

，以LED元件1投入電力加以除得之値爲約0.001 lm2/W 〇 將本LED照明具之點燈試驗，在調整成周圍溫度爲 之室內進行，於LED元件1之陰極側焊錫接合部之 附近，固定K型熱電偶，測定LED元件1之發熱狀態之 結果，電力投入30分後之LED元件1之溫度爲94°C (換 算接合溫度約116 °C)。然而，本LED照明具之全光束量 爲1 5 5流明，1 m正下方照度爲1 14勒克斯。接著，取下 本LED照明具之光透過性覆蓋層5，配置光吸收性之黑色 板（光透過率〇%，光吸收率98%)，完全切斷向LED 照明具之鉛直方向射出之光下，進行光束量之測定的結果 -81 - 201120377 ，光束量爲約20流明。即，令LED照明具之全射出光束 爲100之時，透過或通過周圍框體，從周圍框體之外周面 射出之光束之比率約爲1 3。 [實施例7] 於實施例5中，使用參考例8之電性絕緣層12之外 ，與實施例5完全相同地，作成LED照明具。 將本LED照明具之點燈試驗，在調整成周圍溫度爲 2 5 °C之室內進行，於LED元件1之陰極側焊錫接合部之 附近，固定K型熱電偶，測定LED元件1之發熱狀態之 結果，電力投入30分後之LED元件1之溫度爲95 °C (換 算接合溫度約1 1 7°C )。然而，本LED照明具之全光束量 爲154流明，lm正下方照度爲1 13勒克斯。接著，取下 本LED照明具之光透過性覆蓋層5，配置光吸收性之黑色 板（光透過率〇%，光吸收率98%)，完全切斷向LED 照明具之鉛直方向射出之光下，進行光束量之測定的結果 ’光束量爲約20流明。即，令LED照明具之全射出光束 爲1〇〇之時，透過或通過周圍框體，從周圍框體之外周面 射出之光束之比率約爲13。 [實施例8] 於實施例5中，以圖24所例示之要領，於參考例9 之聚碳酸酯所成電性絕緣層1 2之最表面（相當於L E D照 明具之最外廓側之表面），經由射出成形模具之內面刻印 -82- 201120377 ，於類似於圖8所例示之凸部前端部，施以具有曲面部位 (曲率）之形狀之圖案之表面賦型（唯與圖8不同，於凸 部根源部側，不具有曲率）之外，與實施例5完全相同， 作成LED照明具。 表面賦型之形狀圖案乃凸部高1.2mm、凸部寬0.6mm 、凸部前端曲率半徑〇.3mm、底部寬1.7mm。此表面賦型 所成最外廓層之平坦面對比之表面積增加比率爲約200% 〇 於實施例5同樣，進行LED點燈試驗的結果，電力 投入30分後之LED元件1之溫度乃89°C (換算接合溫度 約1 1 1 °C )。然而，本LED照明具之全光束量爲1 62流明 ，lm正下方照度爲120勒克斯。接著，取下本LED照明 具之光透過性覆蓋層5，配置光吸收性之黑色板（光透過 率〇%，光吸收率98% )，完全切斷向LED照明具之鉛 直方向射出之光下，進行光束量之測定的結果，光束量爲 約2 1流明。即，令LED照明具之全射出光束爲1 00之時 ，透過或通過周圍框體，從周圍框體之外周面射出之光束 之比率約爲1 3。 [實施例9] 組裝圖27所圖示之LED照明具。 熱傳導層2乃使用參考例5之熱傳導性樹脂組成物， 而電性絕緣層12與礙子部8乃使用參考例10之白色聚碳 酸酯樹脂而一體成形。熱傳導層2之外周直徑乃28mm， -83- 201120377 令局度爲25mm，厚度爲側面部2.5mm、平面部3.5mm ( 熱傳導層2總體平均厚度約2.8mm )，接觸於熱傳導層2 之部分之電性絕緣層12之平均厚度爲1.0mm。 本熱傳導層2之熱傳導率與平均厚度之積乃〇.〇57( W/K)，熱傳導層2之表面積爲約〇.〇〇5m2。 又’於參考例10之聚碳酸酯所成電性絕緣層12之最 表面（相當於LED照明具之最外廓側之表面），經由射 出成形模具之內面刻印，於類似於圖8所例示形狀之凸部 前端部’施以具有曲面部位（曲率）之形狀之圖案之表面 賦型（唯與圖8不同，於凸部根源部側，不具有曲率）。 表面賦型之形狀圖案乃凸部高0.6mm、凸部寬0.6mm 、凸部前端曲率半徑0.3mm、底部寬1.2mm。此表面賦型 所成最外廓層之平坦面對比之表面積增加比率爲約150% 〇 然而，在參考例5之熱傳導層2與參考例10之電性 絕緣層1 2各別射出成形而得成形體之下，令兩者界面使 用市售之環氧聚矽氧系黏著劑（CEMEDINE製註冊商標 CEMEDINE SUPER X)，在使黏著層薄薄延伸之狀態下， 完全黏著固定而一體化。 做爲LED元件1，使用2盞日亞化學工業製之燈泡色 晶片型1^0\891^1531\47'-113(規定輸出約3沢，接合溫度 規格150°C )者，使兩晶片之中心間距離成爲5.8mm (兩 晶片端部間之間隙約1 . 8mm )。 做爲LED安裝基板14，使用令厚約1mm之鋁爲基材 -84- 201120377 之直徑22mm之鋁基材之安裝基板。安裝基板之背面乃介 著熱傳導性聚矽氧系黏著橡膠（信越SILICONE製縮合 型RTV橡膠 KE3466，熱傳導率1 . 9 W/m · K )所成厚約 3〇/zm之熱傳導性黏著層，固定於熱傳導層2。又，於銅 配線圖案上，印刷形成白色之樹脂絕緣層。然而，從電源 電路向各LED元件1之投入電力約爲2.2W，2盞合計約 爲 4.4W。 將熱傳導層2表面積，以LED元件1投入電力加以 除得之値爲約0.001 lm2/W。 然而，於LED元件1之周圍框體4中，使用參考例7 之聚碳酸酯樹脂所成平均厚度2.4 mm，半徑約25mm之半 球狀之成型體，於該內面側，形成鋁之真空蒸鍍所成厚度 約5 Onm之光反射層，成爲框體光反射面6a。然而，雖在 圖2 7有所省略，於光反射面之形成面，形成小的酒渦狀 之凸狀形狀圖案。 導光擴散層3乃經由丙烯酸樹脂之射出成形，如圖 28所例示，成爲具有將在於上面爲約略逆圓錐型之凹部 ，一部分成爲曲面狀之全反射面3a、於下面切除拋物面 之一部分所成之凸透鏡形狀二者結合所成具有2個頂點之 光折射面的導光擴散層3。圖45A〜C乃令實施例9之導 光擴散層3，從斜方向觀察時之外觀圖。即本導光擴散層 3乃令圖16之入射透鏡面（光折射面）之頂點位置之Z 座標（zl )爲2.2 ( mm )，入射透鏡面之曲率半徑（rl ) 爲3mm，入射透鏡面之錐形常數（kl)爲1(拋物面）， -85- 201120377 入射透鏡面之XY面投射直徑（pi )爲l〇mm ’全反射面 3a之頂點位置之Z座標（z2)爲12.5mm’全反射面3a 之Z軸投影長度（ql)爲7mm、全反射面3a之形狀控制 點/旋轉軸間距離（q2 )爲2mm，全反射面3a之XY面投 射直徑（p2)爲11.6mm，與導光擴散層3之LED元件1 相對之面相反側面之XY面投射直徑（P3 )爲12.6mm。 又，令光折射面之2個凸透鏡頂點間之距離爲5.8mm ，又使各頂點位於各LED元件1之發光中心位置（發光 面之重心位置）之正上方（鉛直方向），進行對準。 本實施例中，導光擴散層3乃令從導光擴散層3對於 鉛直方向而言，向45度以上135度以下之角度範圍射出 之光量爲100之時，使從與導光擴散層3之LED元件1 相對之面相反側之面，對於鉛直方向而言，向〇度以上， 不足45度之角度範圍射出之光量，設計成爲25前後者。 然而，周圍框體4乃在螺絲嵌合部4a所成固定之時 ，使框體之底面在LED安裝基板14之端面從上方按壓之 形式下被固定。光透過性覆蓋層5中，使用三聚氰胺系之 硬敷層被形成於單面之表面之厚1.5 mm之聚碳酸酯薄片 (帝人化成製商標名 「panlite MR薄片 PC8199」） ，使光射出側成爲硬敷面，於LED元件1之周圍框體4 之上部，以黏著劑加以固定而使用。 將本LED照明具之點燈試驗，在調整成周圍溫度爲 2 5 °C之室內進行，於LED元件1之陰極側焊錫接合部之 附近，固定K型熱電偶，測定LED元件1之發熱狀態。 -86- 201120377 結果，電力投入3 0分後之LED元件1之溫度乃8 5 °C (換 算接合溫度約107 °C )。然而，本LED照明具之全光束量 爲165流明，lm正下方照度爲221勒克斯。接著，取下 本LED照明具之光透過性覆蓋層5，配置光吸收性之黑色 板（光透過率〇%，光吸收率98%)，完全切斷向LED 照明具之鉛直方向射出之光下，進行光束量之測定的結果 ，光束量爲約26流明。即，令LED照明具之全射出光束 爲100之時，透過或通過周圍框體，從周圍框體之外周面 射出之光束之比率約爲1 6。The LED element 1 is charged with electric power and is divided into about 0.001 lm2/W. The lighting test of the LED illuminator is performed in a room where the ambient temperature is adjusted, and the solder joint portion of the cathode side of the LED element 1 is used. In the vicinity, a K-type thermocouple was fixed, and as a result of measuring the heat generation state of the LED element 1, the temperature of the LED element 1 after the power was supplied for 30 minutes was 94 ° C (the conversion bonding temperature was about 116 ° C). However, the total illumination of the LED illuminator is 155 lumens, and the illumination below 1 m is 1 14 lux. Next, the light-transmitting cover layer 5 of the LED illuminator is removed, and a light-absorptive black plate (light transmittance 〇%, light absorptivity: 98%) is disposed, and the light emitted toward the vertical direction of the LED illuminator is completely cut off. Next, the result of measuring the amount of the beam is -81 - 201120377, and the amount of the beam is about 20 lumens. That is, when the total emitted light beam of the LED illuminator is 100, the ratio of the light beams emitted from the outer peripheral surface of the surrounding frame through or through the surrounding frame is about 13 . [Example 7] An LED lighting fixture was produced in the same manner as in Example 5 except that the electrically insulating layer 12 of Reference Example 8 was used. The lighting test of the LED lighting device was carried out in a room where the ambient temperature was adjusted to 25 ° C, and a K-type thermocouple was fixed in the vicinity of the cathode-side solder joint portion of the LED element 1 to measure the heat generation state of the LED element 1. As a result, the temperature of the LED element 1 after the power input for 30 minutes was 95 °C (the conversion junction temperature was about 1 17 ° C). However, the total illumination of the LED illuminator is 154 lumens, and the illumination below lm is 1 13 lux. Next, the light-transmitting cover layer 5 of the LED illuminator is removed, and a light-absorptive black plate (light transmittance 〇%, light absorptivity: 98%) is disposed, and the light emitted toward the vertical direction of the LED illuminator is completely cut off. Next, as a result of measuring the amount of the beam, the amount of the beam was about 20 lumens. That is, when the total emitted light beam of the LED illuminator is 1 ,, the ratio of the light beams emitted from the outer peripheral surface of the surrounding frame through or through the surrounding frame is about 13. [Embodiment 8] In the embodiment 5, the polycarbonate is used as the outermost surface of the electrical insulating layer 12 of the reference example 9 (refer to the outermost side of the LED illuminator). Surface), by the inner surface of the injection molding die, -82-201120377, a surface shape having a shape having a curved portion (curvature) is applied to the front end portion of the convex portion similar to that illustrated in Fig. 8 (only with Fig. 8) The LED illuminator was created in the same manner as in Example 5 except that the root portion side of the convex portion did not have a curvature. The shape pattern of the surface forming has a convex portion height of 1.2 mm, a convex portion width of 0.6 mm, a convex portion front end curvature radius of 〇.3 mm, and a bottom portion width of 1.7 mm. The surface forming of the outermost layer is increased by a ratio of about 200% to the surface area of the outermost layer. As in the case of the fifth embodiment, the temperature of the LED element 1 after the electric power is applied for 30 minutes is the result of the LED lighting test. 89 ° C (converted joint temperature is about 1 1 1 ° C). However, the total illumination of the LED illuminator is 1 62 lumens, and the illumination below lm is 120 lux. Next, the light-transmitting cover layer 5 of the LED illuminator is removed, and a light-absorbing black plate (light transmittance 〇%, light absorptivity: 98%) is disposed, and the light emitted to the vertical direction of the LED illuminator is completely cut off. Next, as a result of measuring the amount of the beam, the amount of the beam is about 21 lumens. That is, when the total emitted light beam of the LED illuminator is 100 Å, the ratio of the light beams emitted from the outer peripheral surface of the surrounding frame through or through the surrounding frame is about 13 . [Embodiment 9] The LED lighting fixture shown in Fig. 27 was assembled. In the heat conduction layer 2, the thermally conductive resin composition of Reference Example 5 was used, and the electrically insulating layer 12 and the insole portion 8 were integrally molded using the white polycarbonate resin of Reference Example 10. The outer diameter of the heat conduction layer 2 is 28 mm, the -83-201120377 is 25 mm, and the thickness is 2.5 mm for the side portion and 3.5 mm for the flat portion (the overall average thickness of the heat conduction layer 2 is about 2.8 mm), which is in contact with the portion of the heat conduction layer 2. The electrical insulating layer 12 has an average thickness of 1.0 mm. The thermal conductivity and the average thickness of the heat conducting layer 2 are 〇.57 (W/K), and the surface area of the heat conducting layer 2 is about 〇.〇〇5 m2. Further, the outermost surface of the electrically insulating layer 12 (corresponding to the outermost side of the LED illuminator) of the polycarbonate of Reference Example 10 was imprinted through the inner surface of the injection molding die, similar to that of FIG. The front end portion of the convex portion of the illustrated shape is subjected to a surface forming of a pattern having a curved portion (curvature) shape (unlike FIG. 8, the curvature is not provided on the root portion side of the convex portion). The shape pattern of the surface forming has a convex portion height of 0.6 mm, a convex portion width of 0.6 mm, a convex portion front end curvature radius of 0.3 mm, and a bottom portion width of 1.2 mm. The surface formation of the outermost layer is increased by a ratio of about 150% to the surface area of the outermost layer. However, the thermally conductive layer 2 of the reference example 5 and the electrically insulating layer 1 of the reference example 10 are separately formed and formed. Under the molded body, a commercially available epoxy-polyoxygen-based adhesive (CEMEDINE SUPER X, CEMEDINE) was used as the interface, and the adhesive layer was completely adhered and integrated. As the LED element 1, two wafers are used in the bulb color chip type 1^0\891^1531\47'-113 (the output is about 3 沢, the bonding temperature specification is 150 ° C) made by Nichia Chemical Industry Co., Ltd. The distance between the centers is 5.8 mm (the gap between the ends of the two wafers is about 1.8 mm). As the LED mounting substrate 14, a mounting substrate of an aluminum substrate having a diameter of about 1 mm and an aluminum substrate of -84 to 201120377 having a diameter of 22 mm was used. The back side of the mounting substrate is a thermally conductive adhesive layer having a thickness of about 3 Å/zm formed by a thermally conductive polyoxygen-based adhesive rubber (a condensed RTV rubber KE3466 manufactured by Shin-Etsu Chemical Co., Ltd., heat transfer rate of 1.9 W/m · K). In the heat conduction layer 2. Further, a white resin insulating layer was formed on the copper wiring pattern. However, the power input from the power supply circuit to each of the LED elements 1 is about 2.2 W, and the total power is about 4.4 W. The surface area of the heat conducting layer 2 was divided by the input power of the LED element 1 to be about 0.001 lm 2 /W. However, in the peripheral frame 4 of the LED element 1, a hemispherical molded body having an average thickness of 2.4 mm and a radius of about 25 mm was formed using the polycarbonate resin of Reference Example 7, and vacuum evaporation of aluminum was formed on the inner surface side. The light reflection layer having a thickness of about 5 Onm is plated to form a frame light reflection surface 6a. However, although it is omitted in Fig. 27, a convex shape pattern of a small wine swirl is formed on the surface on which the light reflecting surface is formed. The light-guiding diffusion layer 3 is formed by injection molding of an acrylic resin, and as shown in FIG. 28, it has a concave portion having an approximately reverse conical shape on the upper surface, and a part of the total reflection surface 3a having a curved surface shape and a portion of the paraboloid surface cut downward. The convex lens shape combines the light-diffusing diffusion layer 3 having a light-refractive surface of two vertices. 45A to 45C are external views of the light-diffusing layer 3 of the ninth embodiment as seen from an oblique direction. That is, the light guiding diffusion layer 3 is such that the Z coordinate (zl) of the vertex position of the incident lens surface (light refraction surface) of FIG. 16 is 2.2 (mm), and the radius of curvature (rl) of the incident lens surface is 3 mm, and the incident lens surface is incident. The cone constant (kl) is 1 (paraboloid), -85- 201120377 The XY plane projection diameter (pi) of the incident lens surface is l〇mm 'The Z coordinate (z2) of the vertex position of the total reflection surface 3a is 12.5 mm' The Z-axis projection length (ql) of the total reflection surface 3a is 7 mm, the shape control point/rotation axis distance (q2) of the total reflection surface 3a is 2 mm, and the XY plane projection diameter (p2) of the total reflection surface 3a is 11.6 mm. The XY plane projection diameter (P3) on the side opposite to the surface opposite to the LED element 1 of the light guiding diffusion layer 3 was 12.6 mm. Further, the distance between the apexes of the two convex lenses of the light-refracting surface was 5.8 mm, and the vertices were placed right above (the vertical direction) of the light-emitting center position (the center of gravity of the light-emitting surface) of each of the LED elements 1 to be aligned. In the present embodiment, the light-guiding diffusion layer 3 is such that when the amount of light emitted from the light-guiding diffusion layer 3 in the angular direction of 45 degrees or more and 135 degrees or less is 100, the light-transmitting diffusion layer 3 is provided. In the vertical direction of the LED element 1 on the opposite side to the surface, the amount of light emitted in an angular range of less than 45 degrees in the vertical direction is designed to be 25 or so. However, when the screw fitting portion 4a is fixed, the peripheral frame 4 is fixed such that the bottom surface of the casing is pressed from the upper end surface of the LED mounting substrate 14. In the light-transmitting cover layer 5, a melamine-based hard coat layer is formed on a surface of a single-sided 1.5 mm thick polycarbonate sheet (trade name "panlite MR sheet PC8199" by Teijin Chemicals Co., Ltd.), so that the light exit side becomes The hard surface is fixed on the upper portion of the frame 4 around the LED element 1 with an adhesive. The lighting test of the LED lighting device was carried out in a room where the ambient temperature was adjusted to 25 ° C, and a K-type thermocouple was fixed in the vicinity of the cathode-side solder joint portion of the LED element 1 to measure the heat generation state of the LED element 1. . -86- 201120377 As a result, the temperature of the LED element 1 after the power input of 30 minutes is 8 5 °C (the exchange temperature is about 107 °C). However, the total illumination of the LED illuminator is 165 lumens, and the illumination below lm is 221 lux. Next, the light-transmitting cover layer 5 of the LED illuminator is removed, and a light-absorptive black plate (light transmittance 〇%, light absorptivity: 98%) is disposed, and the light emitted toward the vertical direction of the LED illuminator is completely cut off. Next, as a result of measuring the amount of the beam, the amount of the beam was about 26 lumens. That is, when the total emitted light beam of the LED illuminator is 100, the ratio of the light beams emitted from the outer peripheral surface of the surrounding frame through or through the surrounding frame is about 16.

又，本LED照明具中，入射於導光擴散層3之LED 射出光乃在層內導光至鈴直方向，於全反射面3a，其多 數被全反射。此等之全反射光乃以導光擴散層3爲主，從 側面射出之後’在光路上，一旦具有收斂點後，在框體上 之反射面，向鉛直方向反射，採取從光透過性覆蓋層5向 照明具外射出之光路。即，做爲照明具，將具有某程度之 面積之周圍框體4之反射面做爲擬似光源，成爲照明光之 射出形式之故’不同於以點光源狀，直行性強之LED元 件1本身之射出光，可成爲對於眼睛優異之面狀之照明光 〇 本L E D照明具中’關於從l E D元件1之位置向鉛直 方向隔著1000mm之距離之平面（光照射面）上之照度分 布（配光分布）’可得圖2 9所例示之照度分布。即，圖 29之照度分布乃令LED元件1垂直朝向2個並列之方向 (令此爲X方向）’ LED元件1平行朝向2個並列之方向 -87- 201120377 (令此爲y方向）時，照度分布多少有差異，皆 制照明光之擴展，做爲將較爲限制之面積範圍以適 於點狀之點照明用之照明具，具有適切之照度分布 而’圖2 9之縱軸乃相對照度、橫軸乃前述光照射 位置L ( m m )。 本實施例中，於前述光照射面中，從LED正 位置向X方向，離開約105mm之位置，在γ方向 約1 2 5 m m之位置，可得前述最大照度之—半之照g 又’令熱傳導層2、導光擴散層3、光透過性 5、電性絕緣層12、LED元件1之周圍框體4，皆 或樹脂組成物作成之故，LED照明具非常輕量，更 耐衝擊性高之樹脂或樹脂組成物之故，成爲機械強 下安全性高之LED照明具。又，於最外層之電性 I2使用光反射率高之白色樹脂，可提升LED照明 觀、式樣。 [實施例1〇] 於實施例9中，於LED元件1之周圍框體4 光反射面之形成面不形成酒渦形狀之外之凸圖案， 凹凸之平緩之球面之外，與實施例9相同，作成 明具。 本LED照明具之全光束量爲167流明，lm正 度爲253勒克斯》接著，取下本LED照明具之光 覆蓋層5，配置光吸收性之黑色板（光透過率〇% 適度抑 於強照 者。然 面上之 下方之 則離開 ：0 覆蓋層 以樹脂 且使用 度或落 絕緣層 具之外 內面之 成爲無 LED照 下方照 透過性 ，光吸 -88 - 201120377 收率98% )，完全切斷向LED照明具之鉛直方向射出 光下，進行光束量之測定的結果，光束量爲約26流明 即，令LED照明具之全射出光束爲100之時，透過或 過周圍框體，從周圍框體之外周面射出之光束之比率約 1 6 〇 本實施例中，從LED元件1之位置向鉛直方向隔 1 000mm之距離之平面上（光照射面），可得圖30所 之照度分布，於從LED正下方之位置向X方向約隔著 85 mm之位置，向Y方向隔著約110mm之位置，可得 述最大照度之一半之照度。即，可較實施例9，可得擴 角度小（指向性強）之點狀之照明光。 [實施例1 1] 如圖39所圖示，於LED元件1之周圍，設置光反 層24之外，與實施例9完全相同，作成LED照明具。 光反射層24乃內徑11mm、外徑14mm、長3.6mm 圓筒形之成型體，經由參考例10之白色聚碳酸酯樹脂 射出成型而作成。光反射層24之反射率爲約95%。光 射層24乃使2個之LED元件1之重心位置成爲圓筒形 中心軸之配置，於LED安裝基板14上，藉由黏著劑加 固定。 本LED照明具之全光束量爲2 02流明，lm正下方 度爲244勒克斯，經由配置光反射層24，較實施例9， 全光束量、lm正下方照度之方面，可觀察到大爲增加 之 〇 通 爲 著 示 約 刖 展 射 之 之 反 之 以 照 在 -89- 201120377 接著’取下本LED照明具之光透過性覆蓋層5，配置光吸 收性之黑色板（光透過率0%，光吸收率98%)，完全切 斷向LED照明具之鉛直方向射出之光下，進行光束量之 測定的結果，光束量爲約10流明。即，令LED照明具之 全射出光束爲〗00之時，透過或通過周圍框體，從周圍框 體之外周面射出之光束之比率約爲4。 [實施例12] 組裝圖40所圖示之LED照明具。 熱傳導層2乃使用參考例5之熱傳導性樹脂組成物， 而電性絕緣層丨2與礙子部8乃使用參考例10之白色聚碳 酸酯樹脂而一體成形。接觸於熱傳導層2之部分之電性絕 緣層12之平均厚度爲1.0mm。 本實施例中，令熱傳導層2爲LED照明具之最外廓 層，熱傳導層2之外周直徑乃28mm，令高度爲25mm， 厚度爲側面部2.5mm、平面部3.5mm (熱傳導層2總體平 均厚度約2.8 mm)。本熱傳導層2之熱傳導率與平均厚度 之積乃0.05 7 ( W/K)，熱傳導層2之表面積爲約0.005 m2 。然而，在此，關於熱傳導層2之平均厚度與表面積，在 不包含伴隨後述之3次元表面形狀賦型之增加分的形式下 加以計算。 又，於熱傳導層2外周側之最表面，經由射出成形模 具之內面刻印，於類似於圖8所例示形狀之凸部前端部， 施以具有曲面部位（曲率）之形狀之圖案之表面賦型（唯 -90- 201120377 與圖8不同，於凸部根源部側，不具有曲率）。然而，此 等表面賦型部位乃將熱傳導層2之外周面（直徑28mm) 做爲基底面，以附加其外側（最表面側）之形式加以形成 。表面賦型之形狀圖案乃凸部高0.5mm、凸部寬0.6mm、 凸部前端曲率半徑0.3mm、底部寬0.9mm。此表面賦型所 成最外廓層之平坦面對比之表面積增加比率爲約150%。 在參考例5之熱傳導層2與參考例10之電性絕緣層 12各別射出成形而得成形體之下，令兩者界面使用市售 之環氧聚矽氧系黏著劑（CEMEDINE製 註冊商標 CEMEDINE SUPER X )，在使黏著層薄薄延伸之狀態下， 完全黏.著固定而一體化。 做爲LED元件1，使用2盞日亞化學工業製之燈泡色 晶片型LEDNS9L153MT-H3(規定輸出約3W，接合溫度 規格1 5 0 °C )者，使兩晶片之中心間距離成爲5 . 8 m m (兩 晶片端部間之間隙約1 . 8 m m )。 做爲LED安裝基板14，使用令厚約lmm之鋁爲基材 之直徑22mm之鋁基材之安裝基板。安裝基板之背面乃介 著熱傳導性聚矽氧系黏著橡膠（信越SILICONE製縮合 型RTV橡膠KE3466’熱傳導率1.9W/m. K)所成厚約 30/zm之熱傳導性黏著層，固定於熱傳導層2。又，於銅 配線圖案上’印刷形成白色之樹脂絕緣層。然而，從電源 電路向各LED元件1之投入電力約爲2.65W，2盞合計約 爲5.3W。將熱傳導層2表面積，以LED元件1投入電力 加以除得之値爲約〇 . 〇 〇 〇 9 m2 / W。 -91 - 201120377 LED元件1之周圍框體4、導光擴散層3乃使用與實 施例9〜1 1相同者。又，於LED元件1之周圍，在圖41 所例示之形狀，配置下，設置光反射層24。即，將射出 成型參考例10之白色聚碳酸酯樹脂所成內徑11mm、外 徑15mm、長3.6mm之圓筒狀，在圓筒之外面，具有呈葉 片狀之複數之壁部之成型體，做爲光反射層24使用，以 2個LED元件1之重心位置成爲圓筒狀之中心軸上之配置 ，於LED安裝基板14上，藉由黏著劑加以固定。然而， 如圖41之圖示所示，於接觸於光反射層24之LED安裝 基板14之部位之一部分，設置空氣孔（符號3 0 )，使 LED元件1之周圍空氣之交換順利地進行。 將LED照明具之點燈試驗，在調整成周圍溫度爲25 °C之室內進行，於LED元件1之陰極側焊錫接合部之附 近，固定K型熱電偶，測定LED元件1之發熱狀態。結 果，電力投入30分後之LED元件1之溫度乃82°C (換算 接合溫度約108 °C )。又，本LED照明具之全光束量爲 238流明，lm正下方照度爲289勒克斯。接著，取下本 LED照明具之光透過性覆蓋層5，配置光吸收性之黒色板 (光透過率〇%，光吸收率98%) ’完全切斷向LED照 明具之鉛直方向射出之光下，進行光束量之測定的結果’ 光束量爲約1 1流明。即，令LED照明具之全射出光束爲 100之時，透過或通過周圍框體，從周圍框體之外周面射 出之光束之比率約爲5。 -92- 201120377 (比較例1 ) 於實施例1中，不設置導光擴散層3 ’組裝LED照明 具，進行點燈試驗的結果’成爲來自L E D之點光源狀之 照明光，難以直視光源’爲非對於眼睛優異者。又’不具 有射出光之指向性、點徑之控制性。 (比較例2 ) 於實施例4中，不設置導光擴散層3，組裝LED照明 具，進行點燈試驗的結果’成爲來自LED之點光源狀之 照明光，難以直視光源’爲非對於眼睛優異者。又’不具 有射出光之指向性、點徑之控制性。 [參考例18] 於實施例1中，代替參考例3之熱傳導樹脂組成物， 使用參考例8之聚碳酸酯樹脂（熱傳導率0· 8W/m. K) ，以與實施例1之熱傳導層2同一之形狀，進行射出成形 ，組裝LED照明具。本層之熱傳導率與平均厚度之積乃 0.002 ( W/K )，熱傳導層2之表面積爲〇.〇〇5m2，將層之 表面積以LED元件1投入電力除得之値爲〇.〇〇i9m2/W。 於實施例1同樣，進行LED點燈試驗的結果，電力 投入後，1分鐘以內，LED之溫度明白超過元件之規定溫 度（1 5 5 °C )之故，中止試驗》 [參考例19] -93- 201120377 於實施例9中，代替參考例5之熱傳導樹脂組成物’ 使用參考例8之聚碳酸酯樹脂（熱傳導率〇 · 8W/m · K ) ，以與實施例9之熱傳導層2同一之形狀’進行射出成形 ，組裝LED照明具。本層之熱傳導率與平均厚度之積乃 0.002 ( W/K)，熱傳導層2之表面積爲0.005m2，將層之 表面積以LED元件1投入電力除得之値爲0.001 m2/W。 於實施例9同樣，進行LED點燈試驗的結果，電力 投入後，1分鐘以內，LED之溫度成爲超過元件之規定溫 度（155 °C)之狀況之故，中止試驗。 [參考例20] 於實施例9中，代替參考例5之熱傳導樹脂組成物， 使用使參考例3之聚碳酸酯樹脂與參考例7之聚碳酸酯樹 脂以重量比1 2 : 8 8之錠片狀態混合者，以與實施例9之 熱傳導層2同一之形狀，進行射出成形，組裝LED照明 具。本層之熱傳導率爲1.7 W/m . K，熱傳導率與平均厚度 之積乃0.005 ( W/K)，熱傳導層2之表面積爲0.005m2, 將層之表面積以 LED元件1投入電力除得之値爲 0.001m2/W。 於實施例9同樣’進行LED點燈試驗的結果，電力 投入後’約3分鐘以內’ LED之溫度成爲超過元件之規定 溫度（1 5 5 °C )之狀況之故，中止試驗。 [產業上之可利用性] -94- 201120377 可做爲輕量性、掉落安全性、形狀自由度、設計性、 散熱性、電性安全性等之優異之可靠性高之LED照明具 ，被廣泛地利用。 【圖式簡單說明】 [圖1 ]本發明之L E D照明具之構造之一例（由正面所 視之剖面圖）。 [圖2]本發明之LED照明具之構造之一例（由正面所 視之剖面圖）。 [圖3]本發明之LED照明具之構造之一例（由正面所 視之剖面圖）。 [圖4]本發明之LED照明具之構造之一例（由正面所 視之剖面圖）。 [圖5]本發明之LED照明具之構造之一例（由正面所 視之剖面圖）。 [圖6]本發明之LED照明具之構造之一例（由正面所 視之剖面圖）。 [圖7]關於本發明之燈最外廓層之表面積放大之賦予 凹凸型圖案之一例（顯示賦予凹凸型之最外廓層之一部分 的上面圖）。 [圖8]關於本發明之燈最外廓層之表面積放大之賦予 凹凸型圖案之一例（顯示賦予凹凸型之最外廓層之一部分 的上面圖）。 [圖9]來自本發明之LED照明具之LED元件之射出 -95- 201120377 光之光路分布的一例（光學模擬之成計算結果例、由正面 所視之剖面圖）。 [圖10]說明關於本發明之LED照明具之照度分布評 估之相對位置圖（由正面所視之剖面圖）。 [圖11]本發明之LED照明具之照度分布之一例（縱 軸乃相對照度、橫軸乃照射面上之位置）。 [圖12]說明關於本發明之LED照明具之照度分布評 估之相對位置圖（上面圖）。 [圖13]本發明之LED照明具之照度分布之一例（縱 軸乃相對照度、橫軸乃照射面上之位置）。 [圖14]本發明之導光擴散層之一例。 [圖15]本發明之導光擴散層之一例。 [圖16]導光擴散層之形狀設計參數之說明圖（由正面 所視之剖面圖）8 [圖17]關於圓錐係數（圓錐面之形狀參數）之說明圖 (由正面所視之剖面圖）。 [圖18]導光擴散層之全反射面之形狀設計參數之說明 圖之一（由正面所視之剖面圖）。 [圖19]導光擴散層之全反射面之形狀設計參數之說明 圖之一（由正面所視之剖面圖）。 [圖20]導光擴散層之全反射面之形狀設計參數之說明 圖之一（由正面所視之剖面圖）。 [圖2 1 ]本發明之LED照明具之構造之一例（由正面 所視之剖面圖）。 -96- 201120377 [圖22]本發明之LED照明具之構造之一例（由正面 所視之剖面圖）。 [圖23]本發明之LED照明具之構造之一例（由正面 所視之剖面圖）。 [圖24]本發明之LED照明具之構造之一例（由正面 所視之剖面圖）。 [圖25]導光擴散層之構成部位之說明圖（由正面所視 之剖面圖）。 [圖26]導光擴散層之構成部位之說明圖（由正面所視 之剖面圖）。 [圖27]本發明之LED照明具之構造之一例（由正面 所視之剖面圖）。 [圖28]本發明之導光擴散層之一例。 [圖29]本發明之LED照明具之照度分布之一例（縱 軸乃相對照度、橫軸乃照射面上之位置）。 [圖30]本發明之LED照明具之照度分布之一例（縱 軸乃相對照度、橫軸乃照射面上之位置）。 [圖3 1]本發明之LED照明具之一例。 [圖32]說明從本發明之導光擴散層之光射出角度之適 切範圍之圖。。 [圖33]顯示光反射層之適切配置之一例模式圖（由正 面所視之剖面圖及上面圖）。 [圖34]顯示光反射層之適切配置之一例模式圖（由正 面所視之剖面圖及上面圖）。 -97- 201120377 [圖3 5]顯示光反射層之適切配置之一例模式圖（由正 面所視之剖面圖及上面圖）。 [圖36]顯示光反射層之適切配置之一例模式圖（由正 面所視之剖面圖及上面圖）。 [圖37]透過周圍框體，向外部空間射出之LED射出 光之光路之一例（由正面所視之剖面圖）° [圖38]透過周圍框體，向外部空間射出之LED射出 光之光路之一例（由正面所視之剖面圖）。 [圖3 9]本發明之LED照明具之構造之一例（由正面 所視之剖面圖）。 [圖40]本發明之LED照明具之構造之一例（由正面 所視之剖面圖）。 [圖4 1]圖40所例示之LED照明具之光反射層之形狀 、配置之模式圖（由正面所視之剖面圖及上面圖）。 [圖42]本發明之LED照明具之外觀圖。 [圖43]本發明之LED照明具之外觀圖。 [圖44]本發明之導光擴散層之外觀圖。 .Further, in the LED illuminating device, the LED emitted light incident on the light guiding diffusion layer 3 is guided in the layer to the straight line direction, and most of the total reflection surface 3a is totally reflected. The total reflected light is mainly guided by the light-diffusing layer 3, and is emitted from the side surface. After the convergence point, the reflection surface on the frame is reflected in the vertical direction, and the light-transmitting cover is taken. The light path of layer 5 to the outside of the illuminator. In other words, as the illuminating device, the reflecting surface of the surrounding frame 4 having a certain area is used as a pseudo-light source, which is a form of illumination light emission, which is different from the point-light source type, and the straight-through LED element 1 itself. The illuminance distribution on the plane (light illuminating surface) of the distance from the position of the ED element 1 to the vertical direction by a distance of 1000 mm (in the light illuminating surface) Light distribution] 'The illuminance distribution illustrated in Figure 29. That is, the illuminance distribution of FIG. 29 is such that the LED element 1 is oriented vertically in two parallel directions (this is the X direction). When the LED elements 1 are parallel to two parallel directions -87-201120377 (this is the y direction), The illuminance distribution is somewhat different, and the expansion of the illumination light is used as the illuminating device for the point-limited illumination of the area, which has a suitable illuminance distribution, and the vertical axis of Fig. 29. The illuminance and the horizontal axis are the aforementioned light irradiation positions L (mm). In the present embodiment, in the light-irradiating surface, a position of about 105 mm from the positive position of the LED in the X direction and a position of about 1 25 mm in the γ direction can obtain the maximum illumination of the first half. The heat-conducting layer 2, the light-transmitting diffusion layer 3, the light-transmitting property 5, the electrical insulating layer 12, and the surrounding frame 4 of the LED element 1 are all made of a resin composition, and the LED lighting device is very lightweight and more resistant to impact. The high-resistance resin or resin composition has become a high-security LED lighting fixture with strong mechanical strength. In addition, the white resin with high light reflectivity is used for the electrical property of the outermost layer, and the LED illumination concept and pattern can be improved. [Embodiment 1] In the ninth embodiment, the surface on which the light-reflecting surface of the frame 4 around the LED element 1 is formed does not form a convex pattern other than the shape of the wine vortex, and the spherical surface of the unevenness is the same as that of the ninth embodiment. , made into a clear. The total illumination of the LED illuminator is 167 lumens, and the lm positive is 253 lux. Then, the light cover layer 5 of the LED illuminator is removed, and the light absorbing black plate is arranged (the light transmittance 〇% is moderately strong) Photographer. However, the lower part of the surface is left: 0 The cover layer is made of resin and the degree of use or the inner surface of the insulating layer is made to have no LED illumination. The light absorption is -88 - 201120377 yield 98%) When the total amount of the beam is measured, the amount of the beam is about 26 lumens, and the total amount of the beam emitted by the LED illuminator is 100, passing through or passing through the surrounding frame. The ratio of the light beam emitted from the outer peripheral surface of the surrounding frame is about 16 〇 In this embodiment, from the position of the LED element 1 to the plane of the distance of 1 000 mm in the vertical direction (light-irradiating surface), FIG. 30 can be obtained. The illuminance distribution is about one-half of the maximum illuminance from a position immediately below the LED to a position of about 85 mm in the X direction and a position of about 110 mm in the Y direction. That is, in comparison with Embodiment 9, it is possible to obtain point-shaped illumination light having a small expansion angle (strong directivity). [Embodiment 1 1] As shown in Fig. 39, an LED illuminator was produced in the same manner as in the ninth embodiment except that the light reflection layer 24 was provided around the LED element 1. The light-reflecting layer 24 was a cylindrical molded body having an inner diameter of 11 mm, an outer diameter of 14 mm, and a length of 3.6 mm, and was formed by injection molding of a white polycarbonate resin of Reference Example 10. The reflectance of the light reflecting layer 24 is about 95%. The light-emitting layer 24 is disposed such that the center of gravity of the two LED elements 1 is a cylindrical central axis, and is fixed to the LED mounting substrate 14 by an adhesive. The total illuminance of the LED illuminator is 2 02 lumens, and the lm is 244 lux directly below. By arranging the light reflecting layer 24, compared with the embodiment 9, the total beam amount and the il illuminance directly below the lm can be observed to be greatly increased. The 〇 〇 为 为 示 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - The light absorptivity was 98%), and the amount of the beam was measured to be about 10 lumens as a result of measuring the amount of the beam when the light was emitted in the vertical direction of the LED illuminator. That is, when the total emitted light beam of the LED illuminator is 00, the ratio of the light beams emitted from the outer peripheral surface of the surrounding frame through or through the surrounding frame is about 4. [Embodiment 12] The LED lighting fixture shown in Fig. 40 was assembled. The heat conductive layer 2 was made of the thermally conductive resin composition of Reference Example 5, and the electrically insulating layer 2 and the insole portion 8 were integrally molded using the white polycarbonate resin of Reference Example 10. The electrical insulating layer 12 contacting a portion of the heat conducting layer 2 has an average thickness of 1.0 mm. In this embodiment, the heat conduction layer 2 is the outermost layer of the LED illuminator, and the outer circumference of the heat conduction layer 2 is 28 mm, the height is 25 mm, and the thickness is 2.5 mm on the side surface and 3.5 mm on the plane portion (the overall average of the heat conduction layer 2) The thickness is about 2.8 mm). The thermal conductivity of the heat conducting layer 2 is 0.057 (W/K), and the surface area of the heat conducting layer 2 is about 0.005 m2. Here, however, the average thickness and surface area of the heat conducting layer 2 are calculated without including an increase in the shape of the ternary surface shape described later. Further, on the outermost surface of the outer peripheral side of the heat conduction layer 2, the inner surface of the injection molding die is imprinted, and the front end portion of the convex portion similar to the shape illustrated in Fig. 8 is applied with a surface having a shape of a curved portion (curvature). The type (only -90-201120377 differs from Fig. 8 in that it has no curvature on the root side of the convex portion). However, these surface forming portions are formed by using the outer peripheral surface (diameter 28 mm) of the heat conducting layer 2 as a base surface and adding the outer side (the outermost surface side). The shape pattern of the surface forming has a convex portion height of 0.5 mm, a convex portion width of 0.6 mm, a convex portion front end curvature radius of 0.3 mm, and a bottom portion width of 0.9 mm. The surface profile of the outermost layer is increased by about 150% compared to the surface area. The heat conductive layer 2 of Reference Example 5 and the electrically insulating layer 12 of Reference Example 10 were each molded and formed into a molded body, and a commercially available epoxy polyoxygen adhesive (a registered trademark of CEMEDINE) was used for the interface. CEMEDINE SUPER X ) is completely bonded and integrated while the adhesive layer is stretched thinly. As the LED element 1, a light bulb color chip type LED NS9L153MT-H3 (a predetermined output of about 3 W, a junction temperature specification of 150 ° C) manufactured by Nichia Chemical Industry Co., Ltd. was used, and the distance between the centers of the two wafers was changed to 5.8. Mm (the gap between the ends of the two wafers is about 1.8 mm). As the LED mounting substrate 14, a mounting substrate of an aluminum substrate having a diameter of 22 mm and a thickness of about 1 mm was used as the substrate. The back side of the mounting substrate is a thermally conductive adhesive layer having a thickness of about 30/zm formed by a thermally conductive polyoxygen-based adhesive rubber (heat transfer rate of 1.9 W/m. K of the condensed RTV rubber KE3466 manufactured by Shin-Etsu Chemical Co., Ltd.), and is fixed to the heat conductive layer. 2. Further, a white resin insulating layer was printed on the copper wiring pattern. However, the power input from the power supply circuit to each of the LED elements 1 is about 2.65 W, and the total power is about 5.3 W. The surface area of the heat conducting layer 2 is divided by the input power of the LED element 1 to be about 〇 〇 〇 〇 9 m2 / W. -91 - 201120377 The surrounding frame 4 and the light guiding diffusion layer 3 of the LED element 1 are the same as those of the embodiments 9 to 11. Further, a light reflecting layer 24 is provided around the LED element 1 in the shape illustrated in Fig. 41. In other words, the white polycarbonate resin of the injection molding reference example 10 was formed into a cylindrical shape having an inner diameter of 11 mm, an outer diameter of 15 mm, and a length of 3.6 mm, and formed a wall portion having a plurality of blade shapes on the outer surface of the cylinder. The body is used as the light-reflecting layer 24, and the position of the center of gravity of the two LED elements 1 is placed on the central axis of the cylindrical shape, and is fixed on the LED mounting substrate 14 by an adhesive. However, as shown in the diagram of Fig. 41, an air hole (symbol 30) is provided in a portion of the portion of the LED mounting substrate 14 which is in contact with the light reflecting layer 24, so that the exchange of the surrounding air of the LED element 1 proceeds smoothly. The lighting test of the LED illuminator was carried out in a room where the ambient temperature was adjusted to 25 ° C, and a K-type thermocouple was fixed in the vicinity of the cathode-side solder joint portion of the LED element 1, and the heat generation state of the LED element 1 was measured. As a result, the temperature of the LED element 1 after the electric power was supplied for 30 minutes was 82 ° C (the conversion junction temperature was about 108 ° C). In addition, the total illumination of the LED illuminator is 238 lumens, and the illumination below lm is 289 lux. Next, the light-transmitting cover layer 5 of the LED illuminator is removed, and a light-absorbing enamel plate (light transmittance 〇%, light absorptivity: 98%) is disposed to completely cut off the light that is emitted in the vertical direction of the LED illuminator. Next, as a result of measuring the amount of the beam, the amount of the beam is about 1 1 lumen. That is, when the total emitted light beam of the LED illuminator is 100, the ratio of the light beams emitted from the outer peripheral surface of the surrounding frame through or through the surrounding frame is about 5. -92-201120377 (Comparative Example 1) In the first embodiment, the LED light fixture was assembled without providing the light guide diffusion layer 3', and the result of the lighting test was "light source light from the LED, and it was difficult to look directly at the light source" For those who are not good for the eyes. Moreover, it does not have the directivity of the emitted light and the controllability of the spot diameter. (Comparative Example 2) In the fourth embodiment, the light-guiding diffusion layer 3 was not provided, and the LED lighting device was assembled, and the result of the lighting test was "light source light from the LED, and it was difficult to look directly at the light source". Excellent. Moreover, it does not have the directivity of the emitted light and the controllability of the spot diameter. [Reference Example 18] In Example 1, in place of the heat conductive resin composition of Reference Example 3, the polycarbonate resin of Reference Example 8 (thermal conductivity: 0·8 W/m. K) was used in combination with the heat conductive layer of Example 1. 2 The same shape, injection molding, assembly of LED lighting fixtures. The product of the thermal conductivity and the average thickness of this layer is 0.002 (W/K), and the surface area of the heat conduction layer 2 is 〇.〇〇5m2, and the surface area of the layer is divided by the input power of the LED element 1 as 〇.〇〇i9m2 /W. In the same manner as in the first embodiment, the result of the LED lighting test was performed. After the power was turned on, the temperature of the LED clearly exceeded the predetermined temperature of the device (1 5 5 ° C) within 1 minute after the power was turned on, and the test was aborted [Reference Example 19] - 93-201120377 In the same manner as in Example 9, the heat conductive resin composition of Reference Example 5 was used. The polycarbonate resin of Reference Example 8 (thermal conductivity 〇·8 W/m · K ) was used in the same manner as the heat conductive layer 2 of Example 9. The shape 'is injection molded, and the LED lighting fixture is assembled. The product of the thermal conductivity and the average thickness of this layer was 0.002 (W/K), and the surface area of the heat conducting layer 2 was 0.005 m2, and the surface area of the layer was divided by the input power of the LED element 1 to be 0.001 m2/W. As a result of the LED lighting test in the same manner as in the ninth embodiment, the test was terminated after the power was supplied and the temperature of the LED exceeded the predetermined temperature (155 ° C) of the device within one minute. [Reference Example 20] In Example 9, in place of the heat conductive resin composition of Reference Example 5, the polycarbonate resin of Reference Example 3 and the polycarbonate resin of Reference Example 7 were used in a weight ratio of 1 2 : 8 8 ingots. The sheet state blender was injection molded in the same shape as the heat conductive layer 2 of Example 9, and an LED lighting fixture was assembled. The thermal conductivity of this layer is 1.7 W/m. K, the product of thermal conductivity and average thickness is 0.005 (W/K), and the surface area of the heat conducting layer 2 is 0.005 m2. The surface area of the layer is divided by the LED element 1値 is 0.001m2/W. As a result of the LED lighting test in the same manner as in the ninth embodiment, the test was terminated when the temperature of the LED exceeded the predetermined temperature of the device (1 5 5 °C) after the power was turned on. [Industrial Applicability] -94- 201120377 It can be used as an LED illuminator with high reliability, such as lightweight, drop safety, shape freedom, design, heat dissipation, and electrical safety. It is widely used. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] An example of the structure of an L E D illuminator of the present invention (a cross-sectional view from the front). Fig. 2 is a view showing an example of the structure of the LED lighting device of the present invention (a sectional view as viewed from the front). Fig. 3 is a view showing an example of the structure of an LED lighting fixture of the present invention (a sectional view as viewed from the front). Fig. 4 is a view showing an example of the structure of an LED lighting fixture of the present invention (a sectional view as viewed from the front). Fig. 5 is a view showing an example of the structure of an LED lighting fixture of the present invention (a sectional view as viewed from the front). Fig. 6 is a view showing an example of the structure of an LED lighting fixture of the present invention (a sectional view as viewed from the front). Fig. 7 is a view showing an example of a concave-convex pattern in which the surface area of the outermost layer of the lamp of the present invention is enlarged (the upper view showing a portion of the outermost layer to which the uneven shape is applied). Fig. 8 is a view showing an example of a plan for giving a concave-convex pattern in which the surface area of the outermost layer of the lamp of the present invention is enlarged (the upper view showing a portion of the outermost layer to which the uneven shape is applied). [Fig. 9] An example of the distribution of the light path from the LED element of the LED illuminator of the present invention -95-201120377 (an example of the calculation result of the optical simulation, and a sectional view seen from the front). Fig. 10 is a view showing a relative positional map (a cross-sectional view as viewed from the front) of the illuminance distribution evaluation of the LED lighting device of the present invention. Fig. 11 shows an example of the illuminance distribution of the LED illuminator of the present invention (the vertical axis is the relative illuminance and the horizontal axis is the position on the illuminating surface). Fig. 12 is a view showing the relative positional map (above) of the illuminance distribution evaluation of the LED lighting device of the present invention. [Fig. 13] An example of the illuminance distribution of the LED illuminating device of the present invention (the vertical axis is the relative illuminance and the horizontal axis is the position on the illuminating surface). Fig. 14 shows an example of a light guiding diffusion layer of the present invention. Fig. 15 is a view showing an example of a light guiding diffusion layer of the present invention. [Fig. 16] An explanatory diagram of a shape design parameter of a light guiding diffusion layer (a sectional view viewed from the front) 8 [Fig. 17] An explanatory diagram of a conical coefficient (a shape parameter of a conical surface) (a sectional view viewed from the front side) ). [Fig. 18] Description of the shape design parameters of the total reflection surface of the light guiding diffusion layer (Fig. 18). [Fig. 19] Description of the shape design parameters of the total reflection surface of the light guiding diffusion layer (Fig. 19). [Fig. 20] Description of the shape design parameters of the total reflection surface of the light guiding diffusion layer (Fig. 20). [Fig. 21] An example of the structure of the LED lighting device of the present invention (a cross-sectional view as viewed from the front). -96-201120377 [Fig. 22] An example of the structure of the LED lighting device of the present invention (a cross-sectional view as viewed from the front). Fig. 23 is a view showing an example of the structure of the LED lighting device of the present invention (a sectional view as viewed from the front). Fig. 24 is a view showing an example of the structure of the LED lighting fixture of the present invention (a sectional view as viewed from the front). Fig. 25 is an explanatory view of a constituent portion of a light guiding diffusion layer (a cross-sectional view as viewed from the front). Fig. 26 is an explanatory view of a constituent portion of a light guiding diffusion layer (a cross-sectional view as viewed from the front). Fig. 27 is a view showing an example of the structure of an LED lighting fixture of the present invention (a sectional view as viewed from the front). Fig. 28 is a view showing an example of a light guiding diffusion layer of the present invention. [Fig. 29] An example of the illuminance distribution of the LED illuminator of the present invention (the vertical axis is the relative illuminance and the horizontal axis is the position on the illuminating surface). Fig. 30 shows an example of the illuminance distribution of the LED illuminating device of the present invention (the vertical axis is the relative illuminance and the horizontal axis is the position on the illuminating surface). [Fig. 31] An example of the LED lighting fixture of the present invention. Fig. 32 is a view for explaining a suitable range of light emission angle from the light guiding diffusion layer of the present invention. . Fig. 33 is a schematic view showing an example of a suitable arrangement of the light-reflecting layer (a cross-sectional view taken from the front side and a top view). Fig. 34 is a schematic view showing an example of a suitable arrangement of the light-reflecting layer (a cross-sectional view taken from the front side and a top view). -97- 201120377 [Fig. 3 5] A schematic view showing a suitable arrangement of the light reflecting layer (a cross-sectional view taken from the front side and the above figure). Fig. 36 is a schematic view showing an example of a suitable arrangement of the light-reflecting layer (a cross-sectional view taken from the front side and a top view). [Fig. 37] An example of an optical path for emitting light from an LED that is emitted into an external space through a peripheral frame (a cross-sectional view as viewed from the front). [Fig. 38] An optical path of an LED that emits light to the external space through the surrounding frame One example (a cross-sectional view from the front). [Fig. 39] An example of the structure of the LED lighting fixture of the present invention (a cross-sectional view as viewed from the front). Fig. 40 is a view showing an example of the structure of an LED lighting fixture of the present invention (a sectional view as viewed from the front). [Fig. 4] A schematic view of the shape and arrangement of the light-reflecting layer of the LED illuminator illustrated in Fig. 40 (a cross-sectional view from the front and a top view). Fig. 42 is an external view of an LED lighting fixture of the present invention. Fig. 43 is an external view of an LED lighting fixture of the present invention. Fig. 44 is an external view of a light guiding diffusion layer of the present invention. .

[圖45]本發明之導光擴散層之外觀圖。 【主要元件符號說明】 1 : LED元件 2 :熱傳導層 3 :導光擴散層 3 a :全反射面 -98 - 201120377 3b :深淵部面 3 c :光折射透鏡面（於導光擴散層上形成光折射透鏡 之例） 3 d :側面 4 : LED元件之周圍框體 4a : LED元件周圍框體之螺絲嵌合部 5 =光透過性覆蓋層 6a:框體反射面（光反射層等形成面） 6b :光反射面（光反射層等形成面） 7 : LED元件發光控制用電子電路之配置基材 8 :礙子部（有與符號1 2之電性絕緣層一體成形之情 形） 9a、9b :接點 1 0 :電性絕緣性之薄層 1 1 :配線孔 1 2 :電性絕緣層（兼補強層） 13:低熱阻抗層（熱傳導性黏著層、熱傳導薄片等之 低熱阻抗性黏著層） 14 : LED安裝基板 1 5 :表面保護用電性絕緣性薄膜（附有白色、固定用 之黏著層） 1 6 :黏著薄片 1 7 :黏著層（熱傳導性黏著劑、熱傳導性潤滑劑等） 1 8 :頂板層 -99- 201120377 1 9 : 3次元賦型層形成部位（顯示形成部位之位置， 非顯示賦型形狀者） 20:第1之散熱層（較佳爲金屬所成之成形層） 21:第2之散熱層（較佳爲熱傳導樹脂組成物所成之 成形層） 2 2 :固定締結用零件（螺絲等） 23:光折射透鏡（與導光擴散層分離形成之時） 24 :光反射層 25:導光擴散層之相對位置（非顯示導光擴散層之形 狀） 26 : LED元件之相對位置 27:從導光擴散層之光射出角度之適切範圍 28 :光路之一例 29 :光路之另一例 3 〇 :空氣孔 -100-Fig. 45 is an external view of a light guiding diffusion layer of the present invention. [Explanation of main component symbols] 1 : LED component 2 : Thermal conduction layer 3 : Light guiding diffusion layer 3 a : Total reflection surface - 98 - 201120377 3b : Abyssal surface 3 c : Light refractive lens surface (formed on the light guiding diffusion layer) Example of a light-refracting lens) 3 d : Side surface 4 : Frame 4a around the LED element: Screw fitting part 5 of the frame around the LED element = Light-transmitting cover layer 6a: Frame reflection surface (light reflection layer formation surface etc. 6b: light-reflecting surface (surface formed by light-reflecting layer, etc.) 7 : arrangement of electronic circuit for LED element light-emission control base material 8 : insulator portion (when it is integrally formed with the electrically insulating layer of symbol 1 2) 9a, 9b: Contact 10: Electrically insulating thin layer 1 1 : Wiring hole 1 2 : Electrically insulating layer (and reinforcing layer) 13: Low thermal resistance layer (thermally conductive adhesive layer, heat conductive sheet, etc., low thermal resistance adhesion Layer 14 : LED mounting substrate 1 5 : Electrical insulating film for surface protection (with white, fixing adhesive layer) 1 6 : Adhesive sheet 1 7 : Adhesive layer (thermal conductive adhesive, thermal conductive lubricant, etc.) ) 1 8 : Top layer -99- 201120377 1 9 : 3 dimensional forming layer forming part The position of the display portion is displayed, and the shape is not displayed.) 20: The first heat dissipation layer (preferably a metal formed layer) 21: The second heat dissipation layer (preferably formed of a heat conductive resin composition) Layer 2 2 : Fixed joint parts (screws, etc.) 23: Light-refracting lens (when separated from the light-guiding diffusion layer) 24 : Light-reflecting layer 25: Relative position of the light-transmitting diffusion layer (non-display light-diffusing layer Shape) 26: relative position of the LED element 27: suitable range of light exit angle from the light-diffusing diffusion layer 28: one of the optical paths Example 29: another example of the optical path 3 〇: air hole-100-

Claims (1)

201120377 七、申請專利範圍： 1. 一種LED照明具，具有：LED元件、 具有從相對於前述LED元件之發光面側之面，入射 前述LED元件之射出光的光透過性之層、和設於與相對 於前述光透過性之層之前述LED元件之發光面側的面在 相反側之面，將前述入射之射出光，對於前述LED元件 之發光面之鉛直方向而言，在45度以上且135度以下之 角度範圍，射出較其他之角度範圍強光之全反射面的導光 擴散層、 和入射從前述導光擴散層之射出光的周圍框體。 2. 如申請專利範圍第1項記載之LED照明具，其中 ，前述全反射面乃具有在於前述led元件之發光面側， 頂點對向之約略逆圓錐形狀之凹部。 3. 如申請專利範圍第1項或第2項記載之LED照明 具，其中，於相對於前述導光擴散層之前述LED元件之 面、或挾持於前述導光擴散層與前述LED元件之空間內 ，具備折射來自前述LED元件之射出光，於前述鉛直方 向，收斂前述射出光之進行方向的光折射透鏡。 4. 如申請專利範圍第1項至第3項之任一項記載之 LED照明具，其中，前述周圍框體乃具有光反射性之反射 面，將來自前述導光擴散層之射出光，以該反射面反射， 沿前述鉛直方向射出。 5-如申請專利範圍第1項至第4項之任~項記載之 LED照明具，其中，前述周圍框體乃具有通過沿前述給直 -101 - 201120377 方向射出之射出光之光透過性覆蓋層。 6. 如申請專利範圍第1項至第5項之任一項記載之 LED照明具，其中，令前述LED照明具之全光束爲1〇〇 之時之1〜40之比例之光束，透過或通過前述周圍框體， 從前述周圍框體之外周面射出至外部空間。 7. 如申請專利範圍第1項至第6項之任一項記載之 LED照明具，其中，更具有包圍前述LED元件之發光控 制用電子電路之周圍之電性絕緣層中，體積阻抗爲1〇"Ω • cm以上，厚度方向之IEC 6 1 000基準之靜電破壞電壓爲 5kV以上，絕緣破壞電壓爲〇.5kV以上，平均厚度0.3〜 3 m m電性絕緣層。 8. 如申請專利範圍第7項記載之LED照明具，其中 ，前述電性絕緣層乃V型切口耐衝擊強度爲5kJ/m2以上 者。 9. 如申請專利範圍第1項至第8項記載之任一項之 LED照明具，其中，具有至少一部分接近配置於前述LED 元件，對於至少一方向之熱傳導率爲2 W/m · K以上，平 均厚度爲0.5〜5mm之熱傳導層。 10. 如申請專利範圍第9項記載之LED照明具，其 中，前述熱傳導層之熱傳導率與厚度（單位m)之積爲 0.01 w/κ以上者。 11. 如申請專利範圍第9項或第1 0項記載之LED照 明具，其中，使前述熱傳導層之表面積（m2)除以前述 LED元件之投入電力（W )之値爲0.0005〜0.02m2/W之 -102- 201120377 範圍者。 1 2.如申請專利範圍第9項至第1 1項之任 之LED照明具，其中，於不相對於形成在LED 控制用電子電路之周圍之電性絕緣層之LED元 制用電路側之面的至少一部分，層積形成前述熱 13. 如申請專利範圍第9項至第12項之任 之LED照明具，其中，於前述熱傳導層之至少 層積形成體積阻抗爲1〇ΗΩ · cm以上，平均厚 3mm之電性絕緣層，前述熱傳導層與前述電性 層積體之厚度方向之IEC61000基準之靜電破 5 kV以上，絕緣破壞電壓爲0.5 kV以上。 14. 如申請專利範圍第9項至第1 3項之任 之LED照明具，其中，前述熱傳導層則做爲最 形成，於該最表層側之面之至少一部分，層積形 抗爲. cm以上，平均厚度0.01〜3mm之 絕緣層，前述熱傳導層與前述電性絕緣層之層積 方向之IEC61000基準之靜電破壞電壓爲5kV以 破壞電壓爲0.5kV以上。 1 5.如申請專利範圍第9項至第1 4項之任 之LED照明具，其中，於前述熱傳導層之至少 層積形成V型切口耐衝擊強度爲5kJ/m2以上， 爲0.3〜3mm之補強層。 1 6 ·如申請專利範圍第9項至第1 5項之任 之LED照明具，其中，前述熱傳導層乃成形層 一項記載 元件發光 件發光控 傳導層。 一項記載 一部分， 度 0.0 1〜 絕緣層之 壞電壓爲 —項記載 表層加以 成體積阻 前述電性 體之厚度 上，絕緣 一項記載 一部分， 平均厚度 一項記載 內至少一 -103- 201120377 方向之熱傳導率爲2W/m · K以上之金屬所成。 17.如申請專利範圍第16項記載之LED照明具，其 中，前述金屬爲銅、銀、鋁、鐵、不鏽鋼、辞、欽、矽、 鉻、鎂之任一者或二者以上之合金。 1 8 .如申請專利範圍第9項至第1 5項之任一項記載 之LED照明具，其中，前述熱傳導層乃含有熱傳導性塡 料，成形層內至少一方向之熱傳導率爲2W/m· K以上之 熱傳導性樹脂組成物所成。 1 9.如申請專利範圍第1 8項記載之LED照明具，其 中，前述熱傳導層乃對於1〇〇體積份之基塊樹脂而言，成 形1 0〜1 00體積份之含有熱傳導性塡料之熱傳導性樹脂組 成物所成。 20.如申請專利範圍第18項或第19項項記載之LED 照明具，其中，前述熱傳導性塡料乃具有中間相瀝青爲原 料之瀝青基石墨化短纖維。 2 1 ·如申請專利範圍第1項至第20項之任一項記載 之LED照明具，其中，於最外廓層之至少一部分，進行3 次元形狀之賦型，進行賦型之部分之表面積乃相較平坦面 之情形，爲1.2倍以上者。 2 2.如申請專利範圍第1項至第21項之任一項記載 之LED照明具，其中，前述周圍框體乃成形樹脂或樹脂 組成物而成，成爲周圍框體之樹脂或樹脂組成物之V型 切口耐衝擊強度爲5kJ/m2以上。 23 ·如申請專利範圍第〗項至第22項之任一項記載 -104- 201120377 之LED照明具’其中，前述周圍框體，在該底面部分按 壓LED安裝基板之至少一部分，而加以固定者。 24. 如申請專利範圍第1項至第23項之任一項記載 之LED照明具，其中，前述LED元件之射出光之一部分 乃透過前述周圍框體之光透過性之部位，向前述周圍框體 之外部射出者。 25. 如申請專利範圍第1項至第24項之任一項記載 之LED照明具’其中，於前述周圍框體之一部分，設置 半透過光反射性之部位，透過該半透過光反射性之部位， 前述LED元件之射出光之一部分乃向前述周圍框體之外 部射出者。 2 6 ·如申請專利範圍第1項至第2 5項之任一項記載 之LED照明具，其中，更具有配置於前述LED元件之周 圍，光反射率爲60%以上，反射採取前述LED元件射出 光中不直接入射至前述導光擴散層之光路的光線，入射至 導光擴散層之光反射層。 27.如申請專利範圍第1項至第26項之任一項記載 之LED照明具，其中，全光束量爲90流明以上。 -105-201120377 VII. Patent application scope: 1. An LED lighting device comprising: an LED element; a layer having a light transmissive property that emits light from the LED element from a surface on a light emitting surface side of the LED element; The incident light is incident on the surface opposite to the surface on the light-emitting surface side of the LED element of the light-transmitting layer, and is 45 degrees or more in the vertical direction of the light-emitting surface of the LED element. In the angular range of 135 degrees or less, the light guiding diffusion layer that emits the total reflection surface of the strong light in other angular ranges and the surrounding frame that emits light from the light guiding diffusion layer are incident. 2. The LED lighting device according to claim 1, wherein the total reflection surface has a concave portion on the light-emitting surface side of the LED element, and the vertex is oppositely opposed to the conical shape. 3. The LED lighting device according to the first or second aspect of the invention, wherein the surface of the LED element relative to the light guiding diffusion layer or the space of the light guiding diffusion layer and the LED element is The light refraction lens that refracts the emitted light from the LED element and converges the direction in which the emitted light is emitted in the vertical direction is provided. 4. The LED lighting device according to any one of claims 1 to 3, wherein the peripheral frame body has a light reflecting reflective surface and emits light from the light guiding diffusion layer. The reflecting surface reflects and is emitted in the vertical direction. The LED illuminating device according to any one of claims 1 to 4, wherein the peripheral frame body has a light-transmitting cover by emitting light emitted in the direction of the straight line -101 - 201120377. Floor. 6. The LED lighting device according to any one of claims 1 to 5, wherein the light beam of the ratio of 1 to 40 when the total beam of the LED illuminator is 1 透过 is transmitted or The peripheral frame is emitted from the outer peripheral surface of the peripheral frame to the external space. 7. The LED lighting device according to any one of claims 1 to 6, wherein the electric insulating layer surrounding the light-emitting control electronic circuit surrounding the LED element has a volume impedance of 1 〇"Ω • cm or more, the electrostatic breakdown voltage of the IEC 6 1 000 standard in the thickness direction is 5 kV or more, the dielectric breakdown voltage is 〇.5 kV or more, and the average thickness is 0.3 to 3 mm. 8. The LED lighting device according to claim 7, wherein the electrically insulating layer has a V-notch impact strength of 5 kJ/m2 or more. 9. The LED lighting device according to any one of claims 1 to 8, wherein at least a portion of the LED device is disposed close to the LED element, and the thermal conductivity in at least one direction is 2 W/m·K or more. A heat conducting layer having an average thickness of 0.5 to 5 mm. 10. The LED lighting device according to claim 9, wherein the heat conduction layer has a thermal conductivity and a thickness (unit: m) of 0.01 w/κ or more. 11. The LED lighting device of claim 9 or 10, wherein the surface area (m2) of the heat conducting layer is divided by the input power (W) of the LED element is 0.0005 to 0.02 m2/ W-102- 201120377 range. [2] The LED lighting fixture of any of claims 9 to 11, wherein the LED lighting circuit side is not opposite to the electrical insulating layer formed around the LED control electronic circuit. The LED lighting fixture of any one of the above-mentioned heat-conducting layers, wherein at least a part of the surface is laminated to form a volumetric impedance of 1 〇Η Ω · cm or more. An electric insulating layer having an average thickness of 3 mm, the static electricity of the IEC61000 standard in the thickness direction of the thermal conductive layer and the electrical layered body is broken by 5 kV or more, and the dielectric breakdown voltage is 0.5 kV or more. 14. The LED lighting fixture of claim 9 to claim 13, wherein the heat conducting layer is formed as the most formed portion, and at least a portion of the surface of the outermost layer side has a laminated shape resistance of .cm. As described above, the insulating layer having an average thickness of 0.01 to 3 mm, the electrostatic breakdown voltage of the IEC61000 standard in the stacking direction of the heat conductive layer and the electrically insulating layer is 5 kV, and the breakdown voltage is 0.5 kV or more. 1. The LED lighting fixture of any one of claim 9 to claim 14, wherein at least a V-notch impact strength of the heat conduction layer is formed to be 5 kJ/m 2 or more, and is 0.3 to 3 mm. Reinforcement layer. An LED lighting fixture according to any one of claims 9 to 15, wherein the heat conducting layer is a forming layer, and the light emitting controlling layer of the component light emitting member is described. A part of the description, the degree of 0.01 1~ the bad voltage of the insulating layer is - the thickness of the surface layer is formed to block the thickness of the above-mentioned electrical body, the insulation is a part of the description, and the average thickness is at least one -103-201120377 direction. The thermal conductivity is 2W/m · K or more. The LED lighting device according to claim 16, wherein the metal is an alloy of any one or more of copper, silver, aluminum, iron, stainless steel, rhodium, hexyl, anthracene, chromium, and magnesium. The LED lighting device according to any one of claims 9 to 5, wherein the heat conductive layer contains a thermally conductive material, and the thermal conductivity of at least one direction in the forming layer is 2 W/m. · A composition of a thermally conductive resin of K or more. [1] The LED lighting device of claim 18, wherein the heat conductive layer is formed of a heat conductive layer of 10 to 100 parts by volume for 1 part by volume of the base resin. It is made of a thermally conductive resin composition. The LED lighting fixture of claim 18, wherein the thermally conductive crucible is a pitch-based graphitized short fiber having a mesophase pitch as a raw material. The LED lighting device according to any one of claims 1 to 20, wherein, in at least a part of the outermost layer, the shape of the three-dimensional shape is performed, and the surface area of the shaped portion is performed. In the case of a flat surface, it is 1.2 times or more. The LED lighting device according to any one of the preceding claims, wherein the peripheral frame body is formed by molding a resin or a resin composition, and is a resin or a resin composition of the surrounding frame body. The V-shaped incision has an impact strength of 5 kJ/m 2 or more. The LED lighting device of any one of the above-mentioned claims, wherein the peripheral frame body presses at least a part of the LED mounting substrate on the bottom surface portion and is fixed to the LED lighting device. . The LED lighting device according to any one of the preceding claims, wherein the part of the light emitted from the LED element passes through a portion of the light transmittance of the surrounding frame to the surrounding frame. The external emitter of the body. The LED lighting device according to any one of the preceding claims, wherein a portion of the peripheral frame is provided with a semi-transmissive light reflective portion, and the semi-transmissive light is reflective. At a portion, one of the emitted light of the LED element is emitted to the outside of the peripheral frame. The LED lighting device according to any one of the first to fifth aspect of the invention, wherein the LED lighting device is disposed around the LED element, and the light reflectance is 60% or more, and the LED component is reflected. The light that is not directly incident on the optical path of the light guiding diffusion layer is incident on the light reflecting layer of the light guiding diffusion layer. The LED lighting device according to any one of claims 1 to 26, wherein the total beam amount is 90 lumens or more. -105-
TW099121497A 2009-07-22 2010-06-30 Led illuminator TW201120377A (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2009171164 2009-07-22
JP2009233567 2009-10-07
JP2009262914 2009-11-18
JP2010021243 2010-02-02
JP2010042308 2010-02-26
JP2010070185 2010-03-25

Publications (1)

Publication Number Publication Date
TW201120377A true TW201120377A (en) 2011-06-16

Family

ID=43499011

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099121497A TW201120377A (en) 2009-07-22 2010-06-30 Led illuminator

Country Status (3)

Country Link
JP (1) JPWO2011010535A1 (en)
TW (1) TW201120377A (en)
WO (1) WO2011010535A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI426216B (en) * 2011-08-12 2014-02-11
CN104075241A (en) * 2013-03-28 2014-10-01 Lg伊诺特有限公司 Optical lens, light emitting device, and lighting device
TWI469398B (en) * 2012-07-12 2015-01-11 Lextar Electronics Corp Light emitting device
CN104279510A (en) * 2013-07-05 2015-01-14 Lg伊诺特有限公司 Optical lens, light emitting device, and display
TWI509194B (en) * 2013-08-05 2015-11-21 Polytronics Technology Corp Illumination apparatus
TWI557368B (en) * 2014-02-12 2016-11-11 Long-Jun Zheng Shade structure
TWI570358B (en) * 2014-02-17 2017-02-11 A lighting device that emits light in a diffractive manner
TWI576537B (en) * 2014-12-26 2017-04-01 潘文莘 Led bulb structure

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5656560B2 (en) * 2010-10-28 2015-01-21 江東電気株式会社 LED bulb
US20120194054A1 (en) * 2011-02-02 2012-08-02 3M Innovative Properties Company Solid state light with optical diffuser and integrated thermal guide
JP2012169192A (en) * 2011-02-16 2012-09-06 Hitachi Appliances Inc Lighting device
JP2012174390A (en) * 2011-02-18 2012-09-10 Eiji Shiraishi Illumination loading single led light-emitting element
EP2492582A1 (en) * 2011-02-28 2012-08-29 Bega Gantenbrink-Leuchten KG Lamp and reflector for lamp
JP5418521B2 (en) * 2011-03-03 2014-02-19 岩崎電気株式会社 lamp
TW201307750A (en) * 2011-03-03 2013-02-16 Iwasaki Electric Co Ltd Lamp and light apparatus
JP5010751B1 (en) * 2011-03-11 2012-08-29 株式会社東芝 Lighting device
JP5908673B2 (en) * 2011-03-11 2016-04-26 ローム株式会社 LED bulb
CN102720953A (en) * 2011-03-31 2012-10-10 王强 Three-dimensional LED lamp structure
RU2617030C2 (en) 2011-04-01 2017-04-19 Филипс Лайтинг Холдинг Б.В. Light source, lamp and method of making light source
JP2012230824A (en) * 2011-04-26 2012-11-22 Sharp Corp Lighting system
KR101377965B1 (en) * 2011-05-02 2014-03-25 엘지전자 주식회사 Lighting apparatus
WO2012164506A1 (en) * 2011-05-31 2012-12-06 Sabic Innovative Plastics Ip B.V. Led plastic heat sink and method for making and using the same
JP2012252791A (en) * 2011-05-31 2012-12-20 Toshiba Lighting & Technology Corp Bulb type lamp, and lighting fixture using bulb type lamp
TWM415245U (en) * 2011-06-30 2011-11-01 Chun Kuang Optics Corp Optic element and lighting device comprising the optic element
JP4982618B1 (en) * 2011-07-25 2012-07-25 株式会社エス・ケー・ジー Lighting device
WO2013084407A1 (en) * 2011-12-06 2013-06-13 パナソニック株式会社 Lamp and illuminating apparatus
JP6126785B2 (en) * 2012-01-18 2017-05-10 株式会社Roki LED bulb
WO2013124926A1 (en) * 2012-02-23 2013-08-29 パナソニック株式会社 Lamp
JP2015111497A (en) * 2012-03-30 2015-06-18 パナソニック株式会社 Lamp
US9054019B2 (en) 2012-04-02 2015-06-09 Cree, Inc. Low profile lighting module with side emitting LEDs
DE102012106624A1 (en) * 2012-04-04 2013-10-10 Siteco Beleuchtungstechnik Gmbh Lens element, in particular for emergency lighting module
JP5291223B2 (en) * 2012-04-23 2013-09-18 株式会社エス・ケー・ジー Lighting device
CN102818216B (en) * 2012-06-05 2014-08-06 佛山市国星光电股份有限公司 Large-angle lens and large-angle light-emergent LED (Light Emitting Diode) light source module
KR101946267B1 (en) * 2012-07-05 2019-02-11 엘지이노텍 주식회사 Lighting device
JP6049353B2 (en) * 2012-08-27 2016-12-21 三菱電機照明株式会社 lighting equipment
JP5977636B2 (en) * 2012-09-28 2016-08-24 株式会社エンプラス Luminous flux control member, light emitting device, and illumination device
JP5964714B2 (en) * 2012-10-05 2016-08-03 株式会社エンプラス Luminous flux control member, light emitting device, and illumination device
JP2014082000A (en) * 2012-10-12 2014-05-08 Minebea Co Ltd Reflection plate for fresnel lens, and lighting device
CN103791255B (en) * 2012-10-31 2016-06-08 展晶科技(深圳)有限公司 Light emitting diode bulb
JP2014103062A (en) * 2012-11-22 2014-06-05 Enplas Corp Lighting fixture
DE102012223679A1 (en) * 2012-12-19 2014-06-26 BSH Bosch und Siemens Hausgeräte GmbH Lighting device for a cooking appliance and cooking appliance
KR102070417B1 (en) * 2013-02-04 2020-01-28 엘지이노텍 주식회사 Light emitting diode lamp
KR102062085B1 (en) * 2013-02-28 2020-01-03 엘지이노텍 주식회사 Lighting device
KR102062087B1 (en) * 2013-02-28 2020-01-03 엘지이노텍 주식회사 Lighting device
KR102066101B1 (en) * 2013-04-04 2020-01-14 엘지이노텍 주식회사 Lighting device
KR102062086B1 (en) * 2013-02-28 2020-01-03 엘지이노텍 주식회사 Lighting device
KR102066102B1 (en) * 2013-06-13 2020-01-14 엘지이노텍 주식회사 Lighting device
KR102033765B1 (en) * 2013-06-13 2019-10-17 엘지이노텍 주식회사 Lighting device
US9528693B2 (en) 2013-02-28 2016-12-27 Lg Innotek Co., Ltd. Lighting device
KR102050354B1 (en) * 2013-04-04 2019-11-29 엘지이노텍 주식회사 Lighting device
KR102082687B1 (en) * 2013-05-16 2020-02-28 엘지이노텍 주식회사 Lighting device
KR101448379B1 (en) 2013-03-20 2014-10-07 호서대학교 산학협력단 Light emitting module having carbon layer for light device and Light device having the same
KR102079971B1 (en) * 2013-04-04 2020-02-21 엘지이노텍 주식회사 Lighting device
ES2685842T3 (en) 2013-04-19 2018-10-11 Covestro Llc Encapsulation of electronic printed circuit board in mold and assembly
KR102075125B1 (en) * 2013-05-30 2020-02-10 엘지이노텍 주식회사 Lighting device
CN104235748B (en) 2013-06-19 2018-08-31 欧司朗有限公司 Lamp housing and its manufacturing method and lighting device including the lamp housing
JP6205187B2 (en) * 2013-06-26 2017-09-27 三菱電機株式会社 LIGHTING LAMP AND LIGHTING DEVICE HAVING THE SAME
KR102131141B1 (en) * 2013-09-30 2020-07-07 엘지이노텍 주식회사 Lighting device
JP2014032972A (en) * 2013-11-08 2014-02-20 Iwasaki Electric Co Ltd Lamp
WO2016108138A1 (en) * 2014-12-30 2016-07-07 Sabic Global Technologies B.V. A polymeric heat dissipation device, methods of making and of using the same
DE202015103683U1 (en) * 2015-07-14 2015-07-24 Civilight Gmbh LED directional spotlights
KR101736667B1 (en) 2016-05-16 2017-05-17 주식회사 소룩스 Lighting apparatus having heat dissipation plastic plate for insulation
KR101736672B1 (en) 2016-07-15 2017-05-17 주식회사 소룩스 Lighting apparatus having heat dissipation plastic plate for insulation
FR3056700B1 (en) * 2016-09-29 2021-04-30 Valeo Vision OPTICAL LIGHTING MODULE, ESPECIALLY FOR A MOTOR VEHICLE
CN107477382A (en) * 2017-09-22 2017-12-15 德清县新城照明器材有限公司 A kind of LED reflection light fixture with end socket
CN113932168A (en) * 2021-11-18 2022-01-14 欧普照明股份有限公司 Optical system, optical system design method and lamp

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002075011A (en) * 2000-08-30 2002-03-15 Matsushita Electric Ind Co Ltd Tube lamp
JP2007317431A (en) * 2006-05-24 2007-12-06 Ushio Inc Lighting system
JP4569683B2 (en) * 2007-10-16 2010-10-27 東芝ライテック株式会社 Light emitting element lamp and lighting apparatus

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI426216B (en) * 2011-08-12 2014-02-11
TWI469398B (en) * 2012-07-12 2015-01-11 Lextar Electronics Corp Light emitting device
CN104075241A (en) * 2013-03-28 2014-10-01 Lg伊诺特有限公司 Optical lens, light emitting device, and lighting device
US9995461B2 (en) 2013-03-28 2018-06-12 Lg Innotek Co., Ltd. Optical lens, light emitting device, and lighting device
CN104075241B (en) * 2013-03-28 2020-10-02 Lg伊诺特有限公司 Optical lens, light-emitting device, and lighting device
CN104279510A (en) * 2013-07-05 2015-01-14 Lg伊诺特有限公司 Optical lens, light emitting device, and display
CN104279510B (en) * 2013-07-05 2019-12-13 Lg伊诺特有限公司 Optical lens, light-emitting device, and display
TWI509194B (en) * 2013-08-05 2015-11-21 Polytronics Technology Corp Illumination apparatus
US9291311B2 (en) 2013-08-05 2016-03-22 Polytronics Technology Corp. Illumination apparatus
TWI557368B (en) * 2014-02-12 2016-11-11 Long-Jun Zheng Shade structure
TWI570358B (en) * 2014-02-17 2017-02-11 A lighting device that emits light in a diffractive manner
TWI576537B (en) * 2014-12-26 2017-04-01 潘文莘 Led bulb structure

Also Published As

Publication number Publication date
JPWO2011010535A1 (en) 2012-12-27
WO2011010535A1 (en) 2011-01-27

Similar Documents

Publication Publication Date Title
TW201120377A (en) Led illuminator
JP4386782B2 (en) Lighting apparatus having a reflector
US10670951B2 (en) Wavelength conversion device, light-emitting device and projection system
TWI320838B (en)
JP2011126262A (en) Thermal conductive resin composite molded product and led illuminator
EP3097348B1 (en) Lighting device and luminaire
JP4799341B2 (en) Lighting device
KR101326518B1 (en) Lighting device
US20190128483A1 (en) Led tube lamp
US9557010B2 (en) Lighting device
TWI357476B (en)
US8948564B1 (en) Spline lamp with opposing light source orientation
KR20160037185A (en) Solid state light with features for controlling light distribution and air cooling channels
TW200825331A (en) Illumination device of flexible lighting angle
TW201237323A (en) Lens and lighting device
TW201235707A (en) LED lens and light emitting device using the same
CN101922638A (en) LED fluorescent lamp
JPWO2015145827A1 (en) Lighting device
TW201043853A (en) LED-based lamps and thermal management systems therefor
CN110412757A (en) For LED illumination System collimation lens, include collimation lens LED illumination System, and/or preparation method
US9010966B2 (en) Optical array for LED bulb with thermal optical diffuser
JP6490753B2 (en) Lighting device
JP2011165699A (en) Heat dissipation structure
RU47136U1 (en) Light emitting diode
TW201024627A (en) Reflection element for light-emitting unit