KR102066102B1 - Lighting device - Google Patents

Abstract

Embodiments relate to a lighting device.
An illuminating device according to an embodiment includes: a heat sink including a first heat dissipation unit having a first heat conductivity and a second heat dissipation unit having a second heat conductivity lower than the first heat conductivity; And a light source module including a substrate and a plurality of light emitting elements disposed on the substrate, wherein the second heat dissipation portion includes an inner portion, an outer portion surrounding the inner portion, and a first accommodating portion formed between the inner portion and the outer portion. And a first heat dissipation unit including an upper part disposed on an outer side of the second heat dissipation unit, and a lower part disposed in a first accommodating unit of the second heat dissipation unit, wherein the first heat dissipation unit and the second heat dissipation unit It is integrally formed, and the upper surface of the inner side of the second heat dissipation unit and the upper surface of the outer side have at least one protrusion or groove. The lighting apparatus according to this embodiment has an effect of preventing warpage of the first heat dissipation portion of the heat dissipation body.

Description

Lighting device {LIGHTING DEVICE}

Embodiments relate to a lighting device.

Light emitting diodes (LEDs) are a type of semiconductor device that converts electrical energy into light. Light emitting diodes have the advantages of low power consumption, semi-permanent life, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent and incandescent lamps. Accordingly, many researches are being conducted to replace conventional light sources with light emitting diodes, and the use of light emitting diodes is increasing as a light source for lighting devices such as various lamps, liquid crystal displays, electronic displays, and street lamps that are used indoors and outdoors. .

Embodiment provides a lighting apparatus which can prevent the bending of the 1st heat radiation part of a heat sink.

Moreover, embodiment provides the illuminating device which can prevent generation | occurrence | production of the hole which may generate an electrical problem or a mechanical problem in a heat sink.

In addition, the embodiment provides a lighting device that can prevent the detachment of the conducting wire when the heat sink and the socket are coupled.

Moreover, embodiment provides the illuminating device which can reduce manufacturing cost.

Moreover, embodiment provides the illuminating device which can improve heat dissipation performance.

Moreover, embodiment provides the illuminating device which can improve external appearance quality.

In addition, the embodiment provides a lighting device capable of satisfying the flame retardant rating.

Moreover, embodiment provides the illuminating device which can improve a breakdown voltage characteristic.

Moreover, embodiment provides the illuminating device which can improve intensity | strength.

An illuminating device according to an embodiment includes a heat dissipation body including a first heat dissipation unit having a first heat conductivity and a second heat dissipation unit having a second heat conductivity lower than the first heat conductivity; And a light source module including a substrate and a plurality of light emitting elements disposed on the substrate, wherein the second heat dissipation portion includes an inner portion, an outer portion surrounding the inner portion, and a first accommodating portion formed between the inner portion and the outer portion. And a first heat dissipation unit including an upper part disposed on an outer side of the second heat dissipation unit, and a lower part disposed at a first accommodating unit of the second heat dissipation unit, wherein the first heat dissipation unit and the second heat dissipation unit It is formed integrally, the upper surface of the inner portion of the second heat dissipation portion and the upper surface of the outer portion has at least one or more protrusions or grooves, the inner portion of the second heat dissipation portion is disposed in the first heat dissipation portion, the first heat dissipation portion A portion of the upper portion is disposed in the first accommodating portion of the second heat dissipation portion. The lighting apparatus according to this embodiment has an effect of preventing warpage of the first heat dissipation portion of the heat dissipation body.

An illuminating device according to an embodiment includes a heat dissipation body including a first heat dissipation unit having a first heat conductivity and a second heat dissipation unit having a second heat conductivity lower than the first heat conductivity; And a light source module including a substrate and a plurality of light emitting elements disposed on the substrate, wherein the second heat dissipation portion includes an inner portion, an outer portion surrounding the inner portion, and a first accommodating portion formed between the inner portion and the outer portion. And a first heat dissipation portion including an upper portion disposed on an outer portion of the second heat dissipation portion, and a lower portion disposed on a first accommodating portion of the second heat dissipation portion, wherein the heat dissipation portion is an inner portion of the second heat dissipation portion. And a connection part connected to an outer side of the second heat dissipation part, wherein the first heat dissipation part, the second heat dissipation part, and the connection part are integrally formed, and the end of the connection part has at least one protrusion or groove part. The inner part of the second heat dissipation part is disposed in the first heat dissipation part, and a part of the upper part of the first heat dissipation part is disposed on the first accommodating part of the second heat dissipation part and the upper part of the first heat dissipation part. An upper surface and an upper surface of the inner side of the second heat dissipation unit are disposed on the same plane, and the substrate is disposed on the upper side of the first heat dissipation unit and the inner side of the second heat dissipation unit, and the light emitting devices are disposed on the upper side of the first heat dissipation unit. Is placed on. The lighting apparatus according to this embodiment has an effect of preventing warpage of the first heat dissipation portion of the heat dissipation body.

An illuminating device according to an embodiment includes a heat dissipation body including a first heat dissipation unit having a first heat conductivity and a second heat dissipation unit having a second heat conductivity lower than the first heat conductivity; A light source module including a substrate, and a plurality of light emitting elements disposed on the substrate; And a power supply unit configured to provide power to the light source module, wherein the second heat dissipation unit includes an inner portion, an outer portion surrounding the inner portion, a first accommodating portion formed between the inner portion and the outer portion, and the inner portion. And a second accommodating part accommodating the power supply part, the first heat dissipating part including an upper part disposed on an outer side of the second heat dissipating part, and a lower part disposed in the first accommodating part of the second heat dissipating part, The first heat dissipation unit and the second heat dissipation unit are integrally formed, an upper portion of the first heat dissipation unit has at least one or more holes, the second accommodating part of the second heat dissipation unit has at least one hole therein, and the second An inner part of the heat dissipation part is disposed in the first heat dissipation part, and a part of the upper part of the first heat dissipation part is disposed on the first accommodating part of the second heat dissipation part, and the upper surface and the second surface of the upper part of the first heat dissipation part. Is disposed on the upper surface of the inside part is yeolbu same plane, the substrate is arranged on the first radiation portion and the upper inner side and the second radiation portion, the light-emitting elements are disposed on an upper portion of the first heat-radiating portion. The lighting apparatus according to this embodiment has an effect of preventing the generation of holes that may cause electrical problems or mechanical problems in the radiator.

Using the illuminating device which concerns on embodiment has the advantage that the curvature of the 1st heat radiating part of a heat radiator can be prevented.

In addition, there is an advantage that can prevent the generation of holes that can cause electrical problems or mechanical problems in the heat sink.

In addition, when the radiator and the socket are coupled, there is an advantage that can prevent the departure of the conductor.

In addition, there is an advantage that can reduce the manufacturing cost.

In addition, there is an advantage that can improve the heat dissipation performance.

In addition, there is an advantage that can improve the appearance quality.

In addition, there is an advantage that can improve the withstand voltage characteristics.

In addition, there is an advantage that can improve the strength.

In addition, there is an advantage that can satisfy the flame retardant grade.

1 is a perspective view from above of a lighting apparatus according to a first embodiment;
2 is a perspective view from below of the lighting device shown in FIG. 1;
3 is an exploded perspective view of the lighting apparatus shown in FIG.
4 is an exploded perspective view of the lighting apparatus shown in FIG. 2;
5 is a perspective view illustrating a state in which the light source module 200 and the power supply unit 400 shown in FIG. 3 are coupled to each other.
6 is a perspective view illustrating a state in which the light source module 200 and the power supply unit 400 shown in FIG. 4 are coupled to each other.
7 is a conceptual diagram illustrating the electrical connection between the substrate 210 and the extended substrate 450 shown in FIGS. 3 and 4.
8 is a cross-sectional view of the heat sink shown in FIGS. 1 to 4.
9 to 11 are views for explaining a method of manufacturing the heat sink shown in FIG.
12 to 13 are diagrams for explaining that the bending phenomenon occurs in the first heat dissipation portion when the insert injection.
14 to 15 are diagrams for explaining the insert injection method for preventing the warpage of the first heat dissipation portion.
16 is a view for explaining another insert injection method that can prevent the warpage phenomenon of the first heat dissipation unit.
17 is a view for explaining the traces of the injection holes shown in FIGS.
FIG. 18 is a cross-sectional view illustrating a state in which a cap 390 is installed in the fourth hole H4 and the sixth hole H6 of the heat sink shown in FIG. 8.
19 to 21 are views for explaining another insert injection method for manufacturing the heat sink shown in FIG.
22 is a view for explaining a coupling structure of the connection unit 337 and the power supply unit 400.
23 to 24 are views for explaining the coupling structure of the support substrate 410 and the heat sink 300.
25 is a view for explaining a structure for preventing the detachment of the conductive wires when the socket and the heat sink shown in FIG.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

In the description of the embodiment according to the present invention, when one element is described as being formed on the "on or under" of another element, it is either above or below. (On or under) includes both two elements are directly in contact with each other (directly) or one or more other elements are formed indirectly between the two elements (indirectly). In addition, when expressed as 'on or under', it may include the meaning of the downward direction as well as the upward direction based on one element.

Hereinafter, a lighting apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.

First embodiment

1 is a perspective view from above of a lighting device according to a first embodiment, FIG. 2 is a perspective view from below of a lighting device shown in FIG. 1, FIG. 3 is an exploded perspective view of the lighting device shown in FIG. 1, and FIG. 4 is an exploded perspective view of the lighting apparatus shown in FIG. 2.

1 to 4, the lighting apparatus according to the first embodiment may include a cover 100, a light source module 200, a radiator 300, a power supply unit 400, and a base 500. Can be. Hereinafter, each component will be described in detail.

<Cover 100>

The cover 100 has a bulb shape or hemispherical shape, and has an opening 130 which is hollow and partially open. Here, it is to be understood that the hemispherical shape includes not only hemispheres in a geometric sense, but also shapes similar to hemispheres.

The cover 100 is optically coupled to the light source module 200. For example, the cover 100 may diffuse, scatter, or excite light emitted from the light source module 200.

The cover 100 is coupled to the heat sink 300. In detail, the cover 100 may be coupled to the second heat dissipation part 330 of the heat dissipator 300.

The cover 100 may have a coupling part 110. The coupling part 110 may be coupled to the heat sink 300. In detail, the coupling part 110 protrudes from an end of the cover 100 forming the opening 130, and may be a plurality of coupling parts 110. The plurality of coupling units 110 may be spaced apart from each other without being connected to each other. When the plurality of coupling parts 110 are spaced apart from each other by a predetermined interval, damage due to a force (lateral pressure or tension) generated when the coupling part 110 is fitted to the heat sink 300 may be prevented.

Although not shown in the drawing, the coupling part 110 may have a screw-shaped fastening structure corresponding to the screw groove structure of the heat sink 300. By the thread structure of the heat sink 300 and the screw groove structure of the coupling part 110, the coupling of the cover 100 and the heat sink 300 may be facilitated, and workability may be improved.

The material of the cover 100 may be a light diffusion PC (polycarbonate) to prevent glare of a user due to light emitted from the light source module 200. In addition, the cover 100 may be any one of glass, plastic, polypropylene (PP), and polyethylene (PE).

An inner surface of the cover 100 may be corroded, and an outer surface thereof may be applied with a predetermined pattern to scatter light emitted from the light source module 200. Therefore, glare of the user can be prevented.

The cover 100 may be manufactured by blow molding for later light distribution.

<Light source module 200>

The light source module 200 includes the light source module 200 disposed on the heat dissipation member 300 and emitting light to the cover 100. More specifically, the light source module 200 may include a substrate 210 and a light emitting device 230 disposed on the substrate 210.

The substrate 210 is disposed on the inner portion 331 of the second heat dissipation part 330 and the upper portion 311 of the first heat dissipation part 310. In detail, the center portion of the substrate 210 is disposed on the inner portion 331 of the second heat dissipation portion 330, and the outer portion of the substrate 210 except for the center portion of the substrate 210 is formed of the first heat dissipation portion 310. It is disposed on the top 311.

The substrate 210 may be a circuit pattern printed on an insulator, and for example, a general printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or the like may be used. It may include. In addition, the substrate 210 may be a circuit pattern printed with a transparent or opaque resin. Here, the resin may be a thin insulating sheet having the circuit pattern.

The shape of the substrate 210 may be polygonal, but is not limited thereto. For example, the shape of the substrate 210 may be circular or elliptical.

The surface of the substrate 210 may be a material that efficiently reflects light, or may be coated with a color that efficiently reflects light, for example, white, silver, or the like.

The substrate 210 may have a first hole H1 for coupling with the power supply unit 400. Specifically, it will be described with reference to FIGS. 5 to 7.

5 is a perspective view illustrating a state in which the light source module 200 and the power supply unit 400 shown in FIG. 3 are coupled, and FIG. 6 is a view showing a light source module 200 and the power supply unit 400 shown in FIG. 7 is a perspective view illustrating a coupled state, and FIG. 7 is a conceptual view illustrating an electrical connection between the substrate 210 and the extended substrate 450 illustrated in FIGS. 3 and 4.

3 to 7, the substrate 210 has a first hole H1, and an extension substrate 450 of the power supply unit 400 is inserted into the first hole H1.

Here, as shown in FIG. 7, the height D1 or the extended substrate 450 from the upper surface of the substrate 210 to the end of the extended substrate 450 penetrating through the first hole H1 of the substrate 210. The length D1 of the portion penetrating the first hole H1 of the substrate 210 may be 1.5 mm or more and 2.0 mm or less. When D1 is smaller than 1.5 mm, electrical connection between the substrate 210 and the extended substrate 450 may be difficult, resulting in poor contact between the substrate 210 and the extended substrate 450. Specifically, the electrical connection between the substrate 210 and the extended substrate 450 is possible by a soldering process. For this soldering process, the terminal 211 of the substrate 210 and the terminal 451 of the extended substrate 450 are soldered. Must be in contact with the part 700. At this time, if the D1 is smaller than 1.5mm, it may be difficult for the terminal 451 of the extended substrate 450 to be in sufficient contact with the soldering part 700. In this case, contact failure may occur between the substrate 210 and the extended substrate 450. Therefore, it is preferable that D1 is 1.5 mm or more. When the D1 is larger than 2.0 mm, a dark part may be generated when the light source module 200 is driven. Specifically, an arm portion may be formed around the extension substrate 450. Such a dark portion may lower the light efficiency of the lighting device and may cause inconvenience to the user. Therefore, it is preferable that D1 is 2.0 mm or less.

The shape of the first hole H1 may correspond to the shape of the extended substrate 450. Here, the diameter of the first hole H1 may be larger than the diameter of the extension substrate 450. That is, the first hole H1 may be large enough to allow the extension substrate 450 to be inserted. Therefore, the extended substrate 450 inserted into the first hole H1 may not directly contact the substrate 210. In the first hole H1, the distance D2 between the substrate 210 and the extended substrate 450 may be greater than zero and less than or equal to 0.2 mm. When D2 is 0, it is difficult to insert the extended substrate 450 into the first hole H1 of the substrate 210 and an unintended electrical short circuit between the extended substrate 450 and the substrate 210 may occur. On the other hand, if the D2 exceeds 0.2mm, the solder material may flow through the first hole (H1) to the support substrate 410 during soldering, in which case the printed circuit formed on the support substrate 410 is soldered Problems that may cause electrical shorts may occur due to the material, and it may be difficult to accurately position the extension substrate 450 where it should be located in the first hole H1. Therefore, the D2 is preferably greater than 0 and less than or equal to 0.2 mm.

3 to 4 again, the substrate 210 has a second hole H2 for confirming the correct position of the substrate 210 when the substrate 210 is mounted on the heat sink 300. Can be. The protrusion P1 of the heat sink 300 is inserted into the second hole H2. The protrusion P1 is disposed on the upper surface of the inner side 331 of the heat sink 300, and helps to accurately guide the position of the substrate 210 in the heat sink 300.

The plurality of light emitting devices 230 may be disposed on one surface (or upper surface) of the substrate 210. Here, the light emitting device 230 may be disposed on the upper portion 311 of the heat dissipator 300, in particular, in the substrate 210. When the light emitting device 230 is disposed on the top 311 of the heat sink 300, the heat emitted from the light emitting device 230 is the top 311 of the heat sink 300 disposed directly below the substrate 210. Can move quickly. Therefore, the heat radiation performance of the lighting apparatus which concerns on 1st Embodiment can be improved.

The light emitting device 230 may be a light emitting diode chip that emits red, green, or blue light, or a light emitting diode chip that emits ultraviolet light. Here, the light emitting diode may be a horizontal type or a vertical type.

The light emitting device 230 may be a high-voltage LED package. The HV LED chip in the HV LED package is powered by a DC power supply and turned on at voltages greater than 20 volts (V). In addition, the high-voltage LED package has a high power consumption of approximately 1W. For reference, a conventional general LED chip is turned on at 2 to 3 (V). If the light emitting device 230 is a HV LED package, since it has a high power consumption of approximately 1W level, the light emitting device 230 may have the same or similar performance as the existing one in a small quantity, thereby reducing the production cost of the lighting device according to the first embodiment. Can be.

A lens may be disposed on the light emitting device 230. The lens is disposed to cover the light emitting element 230. Such a lens may adjust a direction or direction of light emitted from the light emitting element 230. The lens is hemispheric type and may be a translucent resin such as a silicone resin or an epoxy resin with no void space. The light transmissive resin may comprise phosphors which are wholly or partially dispersed.

When the light emitting device 230 is a blue light emitting diode, phosphors included in the translucent resin may include garnet-based (YAG, TAG), silicate-based, nitride-based, and oxynitride. It may include at least one or more of the system.

Natural light (white light) may be realized by including only a yellow phosphor in the translucent resin, but may further include a green phosphor or a red phosphor in order to improve the color rendering index and reduce the color temperature.

When various kinds of phosphors are mixed in the light-transmissive resin, the addition ratio according to the color of the phosphor may use more green phosphors than red phosphors and more yellow phosphors than green phosphors. Yellow phosphors include garnet-based YAG, silicate and oxynitrides, green phosphors use silicate and oxynitrides, and red phosphors use nitrides. have. In addition to mixing various kinds of phosphors in the light-transmissive resin, a layer having a red phosphor, a layer having a green phosphor, and a layer having a yellow phosphor may be separately divided.

<Radiator 300>

8 is a cross-sectional view of the heat sink shown in FIGS. 1 to 4.

3, 4, and 8, the radiator 300 receives heat from the light source module 200 to radiate heat. In addition, the radiator 300 may receive heat from the power supply unit 400 to radiate heat.

The radiator 300 may include a first radiator 310 and a second radiator 330.

The material of the first heat dissipation unit 310 may be different from the material of the second heat dissipation unit 330. In detail, the first heat dissipation part 310 may be a non-insulating material, and the second heat dissipation part 330 may be an insulating material. When the first heat dissipation unit 310 is a non-insulating material, it is possible to quickly dissipate heat emitted from the light source module 200, and when the second heat dissipation unit 330 is an insulating material, the outer surface of the heat dissipating member 300 becomes an insulator. It is possible to improve the withstand voltage characteristics and prevent electric shock of the user. For example, the material of the first heat dissipation unit 310 may be a metal material such as aluminum, copper, and magnesium, and the second heat dissipation unit 330 may be made of polycarbonate (PC), acrylonitrile (AN), Butadiene (BD), Styrene (SM)) and the like may be a resin material. Here, the second heat dissipation part 330 of a resin material may include a predetermined metal powder. If the second heat dissipation unit 330 is made of a resin, appearance molding is easier than the conventional one in which the entire heat dissipation body is a metal material, and appearance defects due to painting or anodizing of the conventional heat dissipation are not generated. There is this. In addition, if the first heat dissipation unit 310 is made of metal and the second heat dissipation unit 330 is made of resin, it is possible to significantly reduce the manufacturing cost since it uses less metal than the conventional one.

The first thermal conductivity W / (mk) or W / m ° C. of the material constituting the first heat dissipation part 310 may be greater than the second thermal conductivity of the material constituting the second heat dissipation part 330. Since the light emitting device 230 of the light source module 200 is disposed closer to the first heat dissipation unit 310 than the second heat dissipation unit 330, the thermal conductivity of the first heat dissipation unit 310 is greater than the second heat dissipation unit 330. This is because greater than the thermal conductivity of) is advantageous for improving the heat dissipation performance. For example, the first heat dissipation unit 310 may be aluminum having high thermal conductivity, and the second heat dissipation unit 330 may be a PC having a thermal conductivity lower than that of the first heat dissipation unit 310. Here, the first heat dissipation unit 310 is not limited to aluminum, and the second heat dissipation unit 330 is not limited to the PC, and any material capable of replacing the aluminum and the PC may be used.

The light source module 200 is disposed on the first heat radiating unit 310. In detail, the substrate 210 and the light emitting device 230 of the light source module 200 may be disposed on the upper portion 311 of the first heat radiating part 310.

The first heat dissipation part 310 may include an upper portion 311 and a lower portion 313.

The upper portion 311 is a circular flat plate, and may have a shape in which a central portion thereof is opened.

The substrate 210 and the light emitting device 230 of the light source module 200 are disposed on the top 311 to receive heat directly from the light source module 200. In addition, the upper portion 311 may discharge the received heat from the light source module 200 to the outside or transfer the lower portion 313.

The shape of the upper portion 311 is not limited to the circular flat plate. For example, the shape of the upper portion 311 may be a variety of shapes, such as square, oval or polygon.

The upper portion 311 may extend in a direction substantially perpendicular to the longitudinal direction of the lower portion 313 at the upper end of the lower portion 313. Here, the upper portion 311 and the lower portion 313 may be vertical, may form an acute angle, and may also form an obtuse angle.

The upper portion 311 may have a fourth hole H4. The fourth hole H4, together with the sixth hole H6 of the second heat dissipation unit 330, is a configuration required in the process of manufacturing the heat dissipation unit 300, which will be described below with reference to FIGS. 9 to 11. Do it.

9 to 11 are diagrams for describing a method of manufacturing the heat sink shown in FIG. 8.

The heat sink 300 shown in FIG. 8 may be manufactured by an insert injection method.

Specifically, first, as shown in FIG. 9, the first mold 10a and the second mold 10b are prepared. The first mold 10a and the second mold 10b form a frame for making an appearance of the heat sink 300 shown in FIG. 3 and a second housing portion 331a of the heat sink 300 shown in FIG. 4. to provide.

Here, the fixing pin 11 is inserted into the fourth hole H4 of the upper part 311 of the first heat dissipation unit shown in FIG. 8.

Specifically, the fixing pin 11 includes an upper end portion inserted into the fourth hole H4 of the first heat dissipation part 310 and a lower end portion inserted into the sixth hole H6 of the second heat dissipation part 330. The width of the upper end of the fixing pin 11 is smaller than the width of the lower end of the fixing pin 11. That is, the fixing pin 11 has a predetermined step between the upper end and the lower end. Since the width of the upper end of the fixing fin 11 is smaller than the width of the lower end of the fixing fin 11, when the upper end of the fixing fin 11 is inserted into the fourth hole H4 of the first heat dissipation unit 310, The upper part 311 of the first heat dissipation part 310 is supported on the lower end of the fixing pin 11. Accordingly, as shown in FIG. 10, the upper part 311 and the lower part 313 of the first heat dissipation part 310 may be installed in the first mold 10a. In addition, since the width of the upper end of the fixing fin 11 is smaller than the width of the lower end of the fixing fin 11, as a result, the diameter of the fourth hole H4 of the first heat dissipating unit 310 is the second heat dissipating unit 330. It is smaller than the diameter of the 6th hole H6 of (). As such, the diameter of the fourth hole H4 of the first heat dissipation part 310 is smaller than the diameter of the sixth hole H6 of the second heat dissipation part 330. It may be one method that can confirm that the part 330 is manufactured by the insert injection method.

Next, as shown in FIG. 11, the second mold 10b is moved toward the first mold 10a so that the first mold 10a and the second mold 10b abut each other. Then, although not shown in the drawings, through a plurality of injection holes (or gates, not shown) previously provided in at least one of the first mold 10a or the second mold 10b, FIG. 3. The liquid material constituting the second heat dissipation part 330 shown in FIG. Liquid resin fills the empty space inside the 1st metal mold | die 10a and the 2nd metal mold | die 10b, and when predetermined time passes, liquid resin will harden | cure. The cured resin becomes the second heat dissipation unit 330 illustrated in FIGS. 3, 4, and 8.

Finally, the second heat dissipation part 330 cured together with the first heat dissipation part 310 is separated from the first mold 10a and the second mold 10b. Through this process, the heat dissipation member 300 in which the first heat dissipation portion 310 and the second heat dissipation portion 330 shown in FIG. 8 are integrally formed may be obtained.

Meanwhile, in the first mold 10a or the second mold 10b illustrated in FIG. 11, the first heat dissipation during the manufacture of the second heat dissipation unit 330 according to the number and positions of injection holes (not shown) prepared in advance. A warpage phenomenon may occur in the portion 310. Specifically, it will be described with reference to FIGS. 12 to 13.

12 to 13 are views for explaining the bending phenomenon occurs in the first heat dissipation portion during the injection molding insert. Here, for convenience of description, a plurality of injection holes (G1, G2, G3) are displayed on the completed heat sink 300, but the injection holes (G1, G2, G3) are actually shown in FIG. It is provided in the metal mold | die 10a or the 2nd metal mold | die 10b.

Referring to FIG. 12, when the radiator 300 is manufactured by the insert injection method, the first to third injection holes G1, G2, and G3 into which the liquid resin constituting the second radiator 330 is injected may be formed. It may be positioned on the outer portion of the outer portion 335-1 of the second heat sink 330.

As shown in FIG. 13, the liquid resin injected through the first to third injection holes G1, G2, and G3 sequentially moves in the direction of ① to ⑥. Here, in order to move the liquid resin injected through the second and third injection holes G2 and G3 to ⑤ or ⑥, a large pressure must be applied. In this case, the high pressure liquid resin injected in the direction of ② may damage the appearance of the first heat dissipation unit 310. For example, warpage may occur in the first heat dissipation unit 310.

A method for preventing external appearance damage of the first heat dissipation unit 310 will be described with reference to FIGS. 14 to 15.

14 to 15 are diagrams for explaining the insert injection method for preventing the warpage of the first heat dissipation unit.

In order to prevent the warpage of the first heat dissipation unit, the central injection hole Gc is further formed on the inner side 331 of the second heat dissipation unit 330, as shown in FIG. 14.

When the central injection hole (Gc) is further formed and the liquid resin forming the second heat dissipation part 330 is injected into the first to third injection holes (G1, G2, G3) and the central injection hole (Gc), FIG. As shown in 15, the liquid resin is sequentially moved in the direction of ① to ④. Here, since the liquid resin is injected at a high pressure even in the central injection hole Gc, the first heat dissipation part 310 may face the high pressure liquid resin injected from the second injection hole G2. Therefore, the warpage of the first heat dissipation part 310 can be prevented.

In addition, since the liquid resin is injected at a high pressure even in the center injection hole Gc, the pressure of the liquid resin injected into the second or third injection holes G2 and G3 is adjusted to the second or third injection hole G2 of FIG. 13. , G3) can be lower than the pressure of the liquid resin injected, it is possible to manufacture the heat sink 300 more quickly.

On the other hand, in order to prevent the warping phenomenon of the first heat dissipation portion, there is an insert method other than the insert method shown in FIGS. 14 to 15. This will be described with reference to FIG. 16.

16 is a view for explaining another insert injection method that can prevent the warpage of the first heat dissipation unit.

Another insert injection method shown in FIG. 16 for preventing the warpage of the first heat dissipation part 310 is performed by the fourth and the fourth side on the lower side of the heat dissipation body, that is, on the end of the connection part 337 of the second heat dissipation part 330. The fifth injection holes (G4, G5) are formed to inject a liquid resin. According to this method, the liquid resin moves in the direction of ① to ③. According to this method, even if the liquid resin in the fourth and fifth injection holes (G4, G5) is a high pressure, the liquid resin flowing in the direction of (1) has a narrow contact area that is in contact with the first heat dissipation portion (310) 1, the warpage may hardly occur in the heat dissipation unit 310. And, the liquid resin flowing in the direction of ② is opposed to the first heat dissipation unit 310, but since the pressure of the liquid resin at this time is much lower than the initial state, it is difficult to affect the first heat dissipation unit 310. . Therefore, the warpage phenomenon of the first heat dissipation part 310 may also be prevented through the insert injection method illustrated in FIG. 16.

Meanwhile, traces of the injection holes G1, G2, G3, Gc, G4, and G5 illustrated in FIGS. 14 to 16 may be seen in the completed heat sink. Specifically, this will be described with reference to FIG. 17.

FIG. 17 is a view for explaining traces of the injection holes illustrated in FIGS. 14 to 16, and FIGS. 17A to 17E are cross-sectional views of specific examples.

Referring to FIGS. 17A through 17D, the traces of the injection holes G1, G2, G3, Gc, G4, and G5 illustrated in FIGS. 14 through 16 may have protrusions P1 and P2 or grooves C1. , C2). The shapes of the protrusions P1 and P2 or the grooves C1 and C2 are not limited to those shown in the drawings. This is merely an example for description and is not limited thereto.

In addition, as illustrated in FIG. 17E, the traces of the injection holes G1, G2, G3, Gc, G4, and G5 may be formed in a shape in which the groove C3 and the protrusion P3 exist together. . Shapes of the protrusions P3 and the grooves C3 are not limited to those shown in the drawings. This is merely an example for description and is not limited thereto.

When the first heat dissipation unit 310 and the second heat dissipation unit 330 are integrally formed through various insert injection methods illustrated in FIGS. 11 to 16, the first heat dissipation unit 310 and the second heat dissipation coupled to each other are formed. The unit 330 may be limited in separation. Specifically, the first heat dissipation unit 310 and the second heat dissipation unit 330 are fixed to each other, and the first heat dissipation unit 310 and the second heat dissipation unit 330 may be difficult to separate from each other. 3 to 4 illustrate that the first heat dissipation unit 310 and the second heat dissipation unit 330 are separated from each other for convenience of description. In the present specification, the first heat dissipation part 310 and the second heat dissipation part 330 are integrally formed, or the fact that the separation is limited does not mean that they are not separated from each other by any force, but rather are relative to human forces. It is possible to separate by a large predetermined force, for example, a mechanical force, but if the first heat dissipation unit 310 and the second heat dissipation unit 330 are separated by the predetermined force, It should be understood as meaning that it is difficult to return to a state.

When the first heat dissipation unit 310 and the second heat dissipation unit 330 are integrally formed or when the first heat dissipation unit 310 and the second heat dissipation unit 330 are restricted from being separated, the first heat dissipation of a metal material The contact resistance between the part 310 and the second heat dissipation part 330 may be lower than that when the first heat dissipation part 310 and the second heat dissipation part 330 are not integrally formed. Since the contact resistance is lowered, the same or similar heat dissipation performance as that of the conventional heat dissipator (the whole is made of metal) can be ensured. In addition, when the first heat dissipation unit 310 and the second heat dissipation unit 330 are integrally formed, the first heat dissipation unit 310 and the second heat dissipation unit 330 are not formed integrally with each other. Damage or damage to the heat dissipation unit 310 or the second heat dissipation unit 330 may be further reduced.

FIG. 18 is a cross-sectional view illustrating a state in which a cap 390 is installed in the fourth hole H4 and the sixth hole H6 of the heat radiator illustrated in FIG. 8.

8 and 18, the cap 390 is formed of the fourth hole H4 of the upper portion 311 of the first heat dissipation part 310 and the outer circumference 335-1 of the second heat dissipation part 330. It is arranged in 6 holes H6. Specifically, the cap 390 may be inserted into the fourth hole H4 and the sixth hole H6 and then bonded. As such, when the cap 390 is disposed in the fourth hole H4 and the sixth hole H6, the first heat dissipation of moisture or foreign matter is discharged through the fourth hole H4 and the sixth hole H6 of the heat sink. It may be prevented from flowing between the portion 310 and the second heat dissipation portion 330. Moisture or foreign matter introduced through the fourth hole H4 and the sixth hole H6 of the heat sink causes a gap between the first heat dissipation unit 310 and the second heat dissipation unit 330 to allow the first heat dissipation unit ( It may be separated between the 310 and the second heat dissipation unit 330, may damage or damage the light source module 200 shown in FIG.

The cap 390 may include an upper end disposed in the sixth hole H6 and a lower end disposed in the fourth hole H4. The upper end portion may have a shape corresponding to the shape of the sixth hole H6 and may be a shape capable of blocking the sixth hole H6. The lower end portion may have a shape such that the cap 390 is fixed after being inserted into the fourth hole H4 and the sixth hole H6. For example, the lower end portion may have a hook structure disposed on the upper surface of the upper portion 311 through the fourth hole H4. The lower end may have two hook structures. The two hook structures may have a predetermined elasticity in a direction away from each other.

The cap 390 may be rubber or plastic material.

In order to fix the cap 390 firmly to the fourth hole H4 and the sixth hole H6 of the heat sink, a predetermined adhesive material (not shown) is applied to the fourth hole H4 and the sixth hole H6. After coating, the cap 390 may be inserted into the fourth hole H4 and the sixth hole H6 of the heat sink.

Meanwhile, since the sixth hole H6 illustrated in FIG. 18 needs to use additional components such as the cap 390, inconvenience in assembly and a cost increase by the cap 390 may be a problem, and the cap 390 When not used, since the first heat dissipation part 310 is exposed to the outside through the sixth hole H6, an electrical problem (for example, the power supply unit 400 cannot be used as a non-isolated power supply unit). And mechanical problems (eg, separation between the first heat dissipation unit 310 and the second heat dissipation unit 330 due to foreign matter) may occur. In addition, even if the cap 390 is used, when the cap 390 is not correctly installed in the sixth hole H6, foreign matter or the like may affect the first heat dissipation unit 310 and the second heat dissipation unit 330. Can be. Therefore, hereinafter, a method of manufacturing the heat sink that may not use the cap 390, that is, the sixth hole H6 will be described with reference to FIGS. 19 to 21.

19 to 21 are views for explaining another insert injection method for manufacturing the heat sink shown in FIG.

First, as shown in FIG. 19, a first heat dissipation part 310 including an upper portion 311 and a lower portion 313 is disposed in the first mold 10a '. As shown in FIG. 20, the second mold 10b 'is moved to the first mold 10a' side, and at least one of the first mold 10a 'and the second mold 10b' is moved. The liquid resin constituting the second heat dissipation unit 330 shown in FIG. 3 is injected through the formed injection hole. Finally, the second heat radiation part 330 cured together with the first heat radiation part 310 is separated from the first mold 10a 'and the second mold 10b'. Through this process, the heat dissipation body 300 as shown in FIG. 3 may be obtained in which the first heat dissipation part 310 and the second heat dissipation part 330 are integrally formed.

In FIG. 19, the 1st metal mold | die 10a 'has the 1st frame 10 which forms the external appearance of the heat sink 300 shown in FIGS. 3-4, and the 2nd accommodating part shown in FIG. And a second mold 14 for forming 331a. The second mold 14 may include a slide portion 12 for supporting the lower portion 313 of the first heat dissipation portion. The slide portion 12 may protrude out of the second mold 14, as shown in FIG. 20, or may be inserted into the second mold 14. When the slide part 12 is inserted in the 2nd frame 14, it is time to take out the completed heat sink from the 1st metal mold | die 10a '. Thus, as shown in FIG. 21, a predetermined groove 331a-5 is formed in the completed heat sink in the inner wall 331a-1 of the heat sink that defines the second accommodating part 331a. The presence of the predetermined groove 331a-5 in the second accommodating portion 331a of the completed heat sink is one method of confirming that the heat sink is manufactured by the insert injection method shown in FIGS. 19 to 20. Can be.

The second mold 10b ′ may include a fixing pin 16 for fixing the upper portion 311 of the first heat radiating part 310. The fixing pin 16 is inserted into the fourth hole H4 formed in the upper portion 311 of the first heat dissipation part 310. As the fixing pin 160 is inserted into the fourth hole H4, the first heat dissipation part 310 may be more stably fixed inside the first mold 10a '.

In the insert injection method illustrated in FIGS. 19 to 20, as shown in FIG. 21, a predetermined groove 331a-5 is formed inside the second accommodating part 331a of the heat sink 300, but FIG. 9. Unlike the insert injection method illustrated in FIGS. 11 to 11, the sixth hole H6 illustrated in FIG. 8 is not formed on the outer surface of the second heat dissipation unit 330. Therefore, the heat sink 300 shown in FIG. 21 does not need to use the cap 390 shown in FIG. 18, and there is an advantage that the above-described electrical or mechanical problems do not occur.

3 to 4, the upper portion 311 may be disposed on the outer portion 335 of the second heat dissipation portion 330. In detail, the upper portion 311 may be disposed on an upper surface of the outer circumference portion 335-1 of the outer portion 335 of the second heat dissipation portion 330.

Between the top 311 and the substrate 210 of the light source module 200, a heat sink (not shown) or heat dissipation grease (grease) for conducting heat from the light source module 200 to the top 311 can be disposed. have.

The lower portion 313 may be disposed inside the second heat dissipation portion 330. In detail, the lower portion 313 may be disposed in the first accommodating portion 333 of the second heat dissipating portion 330. When the lower portion 313 is disposed in the first accommodating portion 333 of the second heat dissipation portion 330, since the lower portion 313 of the metallic material is not disposed in the appearance of the lighting apparatus according to the first embodiment, the power supply is made. It can protect the user from the electrical energy generated in the study (400). For reference, since the radiator of the conventional lighting device is entirely made of metal, and the external appearance of the existing lighting device is also metallic, the electric power supply unit may cause an electric shock accident, but the lighting device according to the first embodiment Can prevent such electric shocks in advance.

The lower portion 313 may be disposed between the inner portion 331 and the outer portion 335 of the second heat dissipation portion 330. When the lower portion 313 is disposed between the inner portion 331 and the outer portion 335 of the second heat dissipation portion 330, the lower portion 313 of the metallic material is not disposed on the exterior of the lighting apparatus according to the first embodiment. The user may be protected from electric energy generated by the power supply unit 400.

The lower portion 313 may have a hollow barrel shape. Alternatively, the lower portion 313 may have a pipe shape. Specifically, the lower portion 313 may have a cylindrical, elliptic or polygonal shape. The diameter of the lower portion 313 having a cylindrical shape may be constant. In detail, the diameter of the lower portion 313 may be constant from the upper end to the lower end. When the diameter of the lower portion 313 is constant, when manufacturing the lighting apparatus according to the first embodiment, the first heat dissipation portion 310 is coupled to the second heat dissipation portion 330 and the first heat dissipation portion 310 is formed. Separation from the second heat dissipation unit 330 may be easy.

The lower portion 313 may have a predetermined length along the length direction of the second heat dissipation portion 330. The length of the lower portion 313 may extend from the upper end to the lower end of the second heat dissipation part 330, or may extend only from the upper end to the middle part of the second heat dissipation part 330. Thus, the length of the lower portion 313 is not limited to that shown in the figure. As the length of the lower portion 313 is longer, heat dissipation performance may be further improved.

A pin or embossing structure may be further disposed on at least one of an outer surface or an inner surface of the lower portion 313. When the fin or embossing structure is disposed on the lower portion 313, the surface area of the lower portion 313 itself is widened, and thus, the heat dissipation area is increased. When the heat dissipation area is widened, the heat dissipation performance of the heat dissipator 300 may be improved.

The upper 311 and the lower 313 may be integral. In the present specification, the upper part 311 and the lower part 313 mean that the upper part 311 and the lower part 313 are respectively separate, and the joint part of the upper part 311 and the lower part 313 is welded, gluing, etc. Rather than being connected in a manner, it means that the upper portion 311 and the lower portion 313 are continuous in one without physical breakage. If the upper part 311 and the lower part 313 are integrated, the heat transfer rate from the upper part 311 to the lower part 313 is almost zero since the contact resistance between the upper part 311 and the lower part 313 is close to zero. There is a better advantage than not at all. In addition, if the upper portion 311 and the lower portion 313 are integrated, a process for combining the two with each other, for example, a press process or the like, is unnecessary, and thus there is an advantage of cost reduction in the manufacturing process.

The surface area of the upper portion 311 may be equal to or greater than the surface area of the lower portion 313. In detail, the surface area of the upper portion 311 may be one or more times and two times or less based on the surface area of the lower portion 313. If the surface area of the upper portion 311 is less than one time based on the surface area of the lower portion 313, the surface area of the upper portion 311 which receives heat directly from the light source module 200 is smaller than the surface area of the lower portion 313. Delivery efficiency may be reduced. On the other hand, when the surface area of the upper portion 311 exceeds twice the surface area of the lower portion 313, most of the heat is concentrated in the upper portion 311, the heat dissipation efficiency may deteriorate.

The second heat dissipation unit 330 together with the cover 100 forms an exterior of the lighting apparatus according to the first embodiment, and may accommodate the first heat dissipation unit 310 and the power supply unit 400.

The first heat dissipation part 310 is disposed in the second heat dissipation part 330. In detail, the second heat dissipation part 330 may have a first accommodating part 333 accommodating the lower part 313. The first accommodating part 333 is formed between the inner part 331 and the outer part 335 of the second heat dissipating part 330 and has a predetermined depth as long as the length of the lower part 313 of the first heat dissipating part 310. Can be.

The second heat dissipation part 330 may have a second accommodating part 331a accommodating the power supply part 400. Here, since the second accommodating part 331a may be formed of a non-insulated resin material, unlike the accommodating part of the heat dissipation part of the conventional lighting device, the power supply part accommodated in the second accommodating part 331a ( 400 can be used as a non-insulated PSU. Since the non-insulated PSU is lower in cost than the insulated PSU, the manufacturing cost of the lighting device according to the embodiment can be further lowered.

The second heat dissipation part 330 may include an inner part 331, an outer part 335, and a connection part 337.

The inner part 331 of the second heat dissipation part 330 is surrounded by the first heat dissipation part 310. In detail, the inner part 331 of the second heat dissipation part 330 may be surrounded by the upper part 311 and the lower part 313 of the first heat dissipation part 310. Here, the inner part 331 of the second heat dissipation part 330 may have a shape corresponding to the shape of the lower portion 313 of the first heat dissipation part 310.

The substrate 210 of the light source module 200 is disposed on the inner part 331.

The inner part 331 may be disposed inside the lower part 313 of the first heat dissipation part 310 and may have a second accommodating part 331a for accommodating the power supply part 400.

The inner part 331 may have a fifth hole H5 through which the extension substrate 450 of the power supply part 400 disposed in the second accommodating part 331a passes.

A protrusion P1 inserted into the second hole H2 of the substrate 210 may be formed on an upper surface of the inner part 331. By the protrusion part P1, the board | substrate 210 can be arrange | positioned in the correct position of the heat sink 300. FIG.

The outer side part 335 of the second heat dissipation part 330 surrounds the first heat dissipation part 310. Here, the outer portion 335 of the second heat dissipation unit 330 may have a shape corresponding to the external shape of the first heat dissipation unit 310.

The outer portion 335 may include an outer circumference 335-1. The outer circumference 335-1 may extend outward from an upper end of the outer 335. The outer circumference portion 335-1 may surround the inner portion 331. The edge of the outer circumference portion 335-1 may be coupled to the second cover portion 130 of the cover 100.

The outer portion 335 may have a sixth hole H6. More specifically, the outer circumferential portion 335-1 of the outer portion 335 may have a sixth hole H6. The sixth hole H6 may be formed at a position corresponding to the fourth hole H4 of the first heat radiating part 310. As described above with reference to FIGS. 9 through 11, the sixth hole H6 may be formed in the process of manufacturing the heat sink 300. The cap 390 illustrated in FIG. 18 may be disposed in the sixth hole H6.

An upper surface 311 of the first heat dissipation part 310, the substrate 210 of the light source module 200, and the light emitting device 230 may be sequentially disposed on the upper surface of the outer circumference 335-1.

The outer portion 335 may have pins 335b. Since the fin 335b widens the surface area of the outer side portion 335 of the second heat dissipation portion 330, the heat dissipation performance of the heat dissipation member 300 may be improved. The pin 335b extends outward from the outer surface of the outer portion 335 and may have a structure supporting the outer circumference 335-1.

The connection part 337 of the second heat dissipation part 330 may be connected to the lower ends of the inner part 331 and the outer part 335. The connection part 337 couples with the base 500. The connection part 337 may have a thread structure corresponding to the screw groove formed in the base 500.

The connection part 337 may form the second accommodating part 331a together with the inner part 331.

The connection unit 337 may be coupled to the power supply unit 400 to fix the power supply unit 400 to the inside of the second storage unit 331a. Hereinafter, a description will be given with reference to FIG. 22.

22 is a view for explaining a coupling structure of the connection unit 337 and the power supply unit 400.

Referring to FIG. 22, the connection part 337 has a fastening groove 337h. The fastening groove 337h has a predetermined diameter so that the protrusion 470 of the support substrate 410 can be inserted therein. The fastening groove 337h may be formed in accordance with the number of protrusions 470 of the support substrate 410.

The support substrate 410 of the power supply unit 400 has a protrusion 470 that is coupled to the fastening groove 337h of the connecting portion 337. The protrusion 470 may extend outwardly from both bottom edges of the support substrate 410. The protrusion 470 may have a shape in which the support substrate 410 is easily accommodated in the second accommodating part 331a, and conversely, the support substrate 410 may be difficult to escape from the second accommodating part 331a. For example, the protrusion 470 may have a hook shape.

When the protruding portion 470 of the supporting substrate 410 is coupled to the fastening groove 337h of the connecting portion 337, the supporting substrate 410 is hard to come out of the second accommodating portion 331a and the supporting substrate 410 is removed. The inside of the second accommodating part 331a may be firmly fixed. Therefore, no additional work, for example, a molding process of the power supply unit 400 is unnecessary, thereby reducing the manufacturing cost of the lighting apparatus.

3, 4, and 8, the first accommodating part 333 of the second heat dissipating part 330 is formed between the inner part 331 and the outer part 335 of the second heat dissipating part 330. The lower portion 313 of the first heat dissipation unit 310 is accommodated. The first accommodating part 333 may have a predetermined depth as long as the length of the lower part 313 of the first heat dissipating part 310. Here, the first accommodating part 333 does not completely separate the inner part 331 and the outer part 335. That is, since the first accommodating part 333 is not formed at the lower end of the inner part 331 and the lower part of the outer part 335, the inner part 331 and the outer part 335 may be connected to each other.

On the other hand, the first heat dissipation unit 310 and the second heat dissipation unit 330, in addition to the insert injection method described in Figs. Or may be coupled to 330. Specifically, the lower part 313 of the first heat dissipation part 310 is inserted into the first accommodating part 333 of the second heat dissipation part 330, and then the first heat dissipation part 310 through an adhesive process or a fastening process. ) And the second heat dissipation unit 330 may be coupled to each other.

<Power supply unit 400>

The power supply unit 400 may include a support substrate 410 and a plurality of components 430.

The support substrate 410 may have a printed pattern that mounts the plurality of components 430, receives a power signal provided through the base 500, and provides a predetermined power signal to the light source module 200.

The support substrate 410 may have a rectangular plate shape. The support substrate 410 is accommodated in the second accommodating part 331a of the second heat dissipating part 330. Specifically, this will be described with reference to FIGS. 21 to 22.

23 to 24 are views for explaining a coupling structure of the support substrate 410 and the heat sink 300.

23 to 24, first and second guide parts 338a and 338b for guiding one side of the support substrate 410 from both sides are respectively provided in the second accommodating part 331a of the radiator 300. Can have A guide groove 338g into which one side of the support substrate 410 is inserted may be formed between the first guide part 338a and the second guide part 338b.

The intervals W1 and W2 between the first guide part 338a and the second guide part 338b may become narrower as they enter the second accommodating part 331a. Alternatively, the diameters W1 and W2 of the guide groove 338g may be narrower as they enter the second accommodating part 331a. When the gaps W1 and W2 or the diameters W1 and W2 of the guide grooves 338g between the first guide part 338a and the second guide part 338b become narrower as they enter the second accommodating part 331a. In this case, the process of inserting the support substrate 410 into the second accommodating portion 331a may be facilitated, and the support substrate 410 may be precisely coupled to the inside of the radiator 300.

At the entrance of the second accommodating portion 331a, the distance W1 between the first guide portion 338a and the second guide portion 338b is easy to insert the support substrate 410 into the second accommodating portion 331a. In order to improve the working efficiency of the operator, the thickness of the support substrate 410 may be larger than the value added by 1mm. That is, the distance between one surface of the support substrate 410 and the first guide portion 338a may be 0.5 mm or more.

On the bottom surface of the second accommodating portion 331a, the gap W2 between the first guide portion 338a and the second guide portion 338b is used to accurately position the supporting substrate 410 at the designed position. It is better than the thickness of 410 and less than the thickness of the support substrate 410 plus 0.1mm. That is, the distance between one surface of the support substrate 410 and the first guide portion 338a is preferably 0.05 mm or less.

A connection groove 337h into which the protrusion 470 of the support substrate 410 is inserted is formed between the first guide part 338a and the second guide part 338b. A connection groove 337h is formed between the first guide portion 338a and the second guide portion 338b, so that the support substrate 410 can be disposed at a more accurate position, and the separation of the support substrate 410 can be prevented. Can be.

Again, referring to FIGS. 3 and 4, the support substrate 410 may include an extension 450. The extension part 450 extends from the upper end of the support substrate 410 to the outside, passes through the fifth hole H5 of the heat sink 300 and the first hole H1 of the substrate 210, and then solders. The process is electrically connected to the substrate 210.

The support substrate 410 may include a protrusion 470. As shown in FIG. 22, the protrusion 470 extends outward from both sides of the lower end of the support substrate 410 and is coupled to the connection part 337 of the heat dissipator 300.

The plurality of components 430 are mounted on the support substrate 410. The plurality of components 430 may include, for example, a DC converter for converting AC power provided from an external power source into DC power, a driving chip for controlling driving of the light source module 200, and a light source module 200 to protect the light source module 200. An electrostatic discharge (ESD) protection element may be included, but is not limited thereto.

The power supply unit 400 may be a non-insulated PSU since the inner walls defining the second accommodating part 331a of the second heat dissipation part 330 are an insulating material, for example, a resin material. If the power supply unit 400 is a non-insulated PSU, the manufacturing cost of the entire lighting device may be lowered.

<Base 500>

The base 500 is coupled to the connection portion 337 of the heat sink 300 and electrically connected to the power supply unit 400. The base 500 transmits external AC power to the power supply unit 400.

The base 500 may have a screw groove structure corresponding to the thread structure of the connection portion 337 of the heat sink 300.

Base 500 may be the same size and shape as the base of the conventional incandescent bulb. Since the base 500 is the same size and shape as the base of the existing incandescent bulb, the lighting device according to the first embodiment can replace the existing incandescent bulb.

Although not shown in the drawings, the support substrate 410 of the power supply unit 400 may include one or more wires (not shown) electrically connected to the base 500. Specifically, one end of the conductive line (not shown) may be connected to the support substrate 410, and the other end may be connected to the base 500.

The conductive wire (not shown) may be composed of two conductive wires, one conductive wire may be connected to the ground 510 of the base 500, and the other conductive wire may be connected to the inner surface 530 of the base 500. Here, the conductive wire connected to the inner surface 530 of the base 500 is, when the socket 500 is coupled to the connecting portion 337 of the heat sink 300, that is, the connecting portion 337 in the screw groove of the socket 500. There is a problem that the lead wire is separated from the original position while the thread of the is inserted. A structure for improving this problem will be described with reference to FIG. 25.

FIG. 25 is a view for explaining a structure for preventing the detachment of the conductive wires when the socket and the heat sink are shown in FIG. 3, and the perspective view of the heat sink 300 shown in FIG.

Referring to FIG. 25, the connection part 337 of the heat sink may have a locking groove 337-1 through which the conductor is inserted.

The locking groove 337-1 may be broken in the inner direction of the receiving groove 331 a at the end of the connecting portion 337.

The locking groove 337-1 may include a vertical groove and a horizontal groove.

The diameter of the upper end of the vertical groove may be larger than the diameter of the lower end. If the diameter of the upper end is larger than the diameter of the lower end, there is an advantageous advantage when the longitudinal groove is inserted into the conductor.

The horizontal groove may be formed extending in one direction perpendicular to the vertical groove in the vertical groove. Here, the forming direction of the horizontal groove of the locking groove 337-1 may be the same as the rotation direction of the thread 337-3 disposed on the outer surface of the connecting portion 337. When the horizontal groove of the locking groove 337-1 is formed to extend perpendicular to the vertical groove in the rotational direction of the screw 337-3 in this way, even when the socket 500 is rotationally coupled to the connecting portion 337, the wire is caught. It is hard to be separated from the horizontal groove of the groove 337-1. Therefore, it is possible to prevent the lead wires from being separated, thereby eliminating inconveniences in manufacturing.

Although the above has been described with reference to the embodiments, these are merely examples and are not intended to limit the present invention. Those skilled in the art to which the present invention pertains should not be exemplified above without departing from the essential characteristics of the present embodiments. It will be appreciated that many variations and applications are possible. For example, each component specifically shown in embodiment can be modified and implemented. And differences relating to such modifications and applications will be construed as being included in the scope of the invention defined in the appended claims.

100: cover
200: light source module
300: radiator
400: power supply unit
500: base

Claims (10)

A heat sink comprising a first heat dissipation unit having a first heat conductivity and a second heat dissipation unit having a second heat conductivity lower than the first heat conductivity; And
And a light source module including a substrate, and a plurality of light emitting elements disposed on the substrate.
The second heat dissipation unit has an inner side, an outer side surrounding the inner side, and a first accommodating portion formed between the inner side and the outer side,
The first heat dissipation part includes an upper part disposed on an outer side of the second heat dissipation part, and a lower part disposed on a first accommodating part of the second heat dissipation part.
The first heat dissipation unit and the second heat dissipation unit are integrally formed;
The upper surface of the inner portion of the second heat dissipation portion and the upper surface of the outer portion have at least one protrusion or groove portion,
An inner side of the second heat dissipation unit is disposed in the first heat dissipation unit,
A portion of the upper portion of the first heat dissipation portion is disposed in the first housing portion of the second heat dissipation portion. The method of claim 1,
Further comprising: a power supply for providing power to the light source module,
The radiator further includes a connection part connected to an inner part of the second heat dissipating part, an outer part of the second heat dissipating part, and a second accommodating part which is formed on an inner part of the second heat dissipating part and accommodates the power supply part. A heat sink comprising a first heat dissipation unit having a first heat conductivity and a second heat dissipation unit having a second heat conductivity lower than the first heat conductivity; And
And a light source module including a substrate, and a plurality of light emitting elements disposed on the substrate.
The second heat dissipation unit has an inner side, an outer side surrounding the inner side, and a first accommodating portion formed between the inner side and the outer side,
The first heat dissipation part includes an upper part disposed on an outer side of the second heat dissipation part, and a lower part disposed on a first accommodating part of the second heat dissipation part.
The radiator further includes a connection part connected to an inner part of the second radiator and an outer part of the second radiator,
The first heat dissipation part, the second heat dissipation part, and the connection part are integrally formed,
An end of the connection portion has at least one protrusion or groove portion,
An inner side of the second heat dissipation unit is disposed in the first heat dissipation unit,
A portion of the upper portion of the first heat dissipation part is disposed on the first accommodating part of the second heat dissipation part,
The upper surface of the upper portion of the upper portion of the first heat dissipation portion and the upper surface of the inner portion of the second heat dissipation portion are disposed on the same plane,
The substrate is disposed on an upper portion of the first heat dissipation portion and the inner side of the second heat dissipation portion,
And the light emitting elements are disposed on an upper portion of the first heat dissipation unit. The method of claim 3, wherein
Further comprising: a power supply for providing power to the light source module,
The radiator further includes a second accommodating part formed on an inner side of the second radiating part and accommodating the power supply part. A heat sink comprising a first heat dissipation unit having a first heat conductivity and a second heat dissipation unit having a second heat conductivity lower than the first heat conductivity;
A light source module including a substrate, and a plurality of light emitting elements disposed on the substrate; And
And a power supply unit configured to provide power to the light source module.
The second heat dissipation unit has an inner side, an outer side surrounding the inner side, a first accommodating portion formed between the inner side and the outer side, and a second accommodating portion formed at the inner side and accommodating the power supply unit,
The first heat dissipation part includes an upper part disposed on an outer side of the second heat dissipation part, and a lower part disposed on a first accommodating part of the second heat dissipation part.
The first heat dissipation unit and the second heat dissipation unit are integrally formed;
An upper portion of the first heat dissipation portion has at least one hole, and the second accommodating portion of the second heat dissipation portion has at least one hole therein,
An inner side of the second heat dissipation unit is disposed in the first heat dissipation unit,
A portion of the upper portion of the first heat dissipation part is disposed on the first accommodating part of the second heat dissipation part,
The upper surface of the upper portion of the upper portion of the first heat dissipation portion and the upper surface of the inner portion of the second heat dissipation portion are disposed on the same plane,
The substrate is disposed on an upper portion of the first heat dissipation portion and the inner side of the second heat dissipation portion,
And the light emitting elements are disposed on an upper portion of the first heat dissipation unit. The method of claim 5,
The radiator further includes a connection part connected to an inner part of the second heat radiating part and an outer part of the second radiating part. The method according to any one of claims 2, 4 and 6,
A base coupled to the connection part of the heat sink and electrically connected to the power supply part through a conductive line;
The connecting portion of the radiator has a locking groove that inserts the conductor to prevent the departure of the conductor when coupled with the base. The method of claim 7, wherein
The connection portion of the heat sink has a thread structure,
The base has a screw groove structure corresponding to the thread structure,
The locking groove has a vertical groove and a horizontal groove connected to the vertical groove,
The horizontal groove is formed in the same direction as the direction of rotation of the thread structure in the vertical groove, lighting apparatus. The method according to any one of claims 1 to 6,
The first heat dissipating part is a non-insulating material, and the second heat dissipating part is an insulating material. The method according to any one of claims 1 to 6,
The first heat dissipation unit is a metal material, the second heat dissipation unit is a resin device.

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