KR102014174B1

KR102014174B1 - Lighting device

Info

Publication number: KR102014174B1
Application number: KR1020130039836A
Authority: KR
Inventors: 임동녕; 주근탁; 이상훈
Original assignee: 엘지이노텍 주식회사
Priority date: 2013-04-11
Filing date: 2013-04-11
Publication date: 2019-08-26
Also published as: KR20140122864A

Abstract

Embodiments relate to a lighting device.
A lighting device according to an embodiment includes a heat sink including an upper surface and an outer circumferential portion surrounding the upper surface; A light source module including a substrate disposed on the upper surface and a portion of the outer circumferential portion and a light emitting element disposed on the substrate; And a hemispherical cover disposed on the light source module, wherein the cover includes a first cover part disposed on the substrate and a second cover part connected to an outer circumference of the first cover part. The light reflectance of the cover part is greater than the light reflectance of the second cover part, and the first cover part and the second cover part include an optical part that reflects at least a part of the light from the light emitting element outside the upper surface of the substrate. In addition, the outer peripheral portion transmits at least a part of the incident light. According to the lighting apparatus according to this embodiment, the optical performance can be improved, specifically, the post-light distribution performance can be improved, and the light distribution angle can be further widened.

Description

Lighting device {LIGHTING DEVICE}

Embodiments relate to a lighting device.

Light emitting diodes (LEDs) are a type of semiconductor device that converts electrical energy into light. Light emitting diodes have the advantages of low power consumption, semi-permanent life, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent and incandescent lamps. Accordingly, many researches are being conducted to replace conventional light sources with light emitting diodes, and the use of light emitting diodes is increasing as a light source for lighting devices such as various lamps, liquid crystal displays, electronic displays, and street lamps that are used indoors and outdoors. .

Embodiments provide an illumination device capable of improving optical performance.

In addition, it provides an illumination device that can improve post-light distribution performance.

In addition, there is provided an illumination device that can further widen the light distribution angle.

An illumination device according to an embodiment includes a light source module including a substrate and a light emitting element disposed on the substrate; And a hemispherical cover disposed on the light source module, wherein the cover includes a first cover part disposed on the substrate and a second cover part connected to an outer circumference of the first cover part. The light reflectance of the cover part is greater than the light reflectance of the second cover part, and the first cover part and the second cover part include an optical part that reflects at least a part of the light from the light emitting element outside the upper surface of the substrate. According to the lighting apparatus according to this embodiment, the optical performance can be improved, specifically, the post-light distribution performance can be improved, and the light distribution angle can be further widened.

A lighting device according to an embodiment includes a heat sink including an upper surface and an outer circumferential portion surrounding the upper surface; A light source module including a substrate disposed on the upper surface and a portion of the outer circumferential portion and a light emitting element disposed on the substrate; And a cover coupled to the outer circumferential portion and disposed on the light source module, wherein the cover includes a lower end coupled to the outer circumferential portion and an upper end portion disposed on the lower end and having a light diffusion rate higher than that of the lower end. Wherein the upper end and the lower end include an optical part that reflects a part of the light from the light emitting element to the outer peripheral part, and the outer peripheral part transmits at least a part of the incident light. According to the lighting apparatus according to this embodiment, the optical performance can be improved, specifically, the post-light distribution performance can be improved, and the light distribution angle can be further widened.

By using the lighting apparatus which concerns on embodiment, optical performance can be improved.

In addition, there is an advantage that can improve post-light distribution performance.

In addition, there is an advantage that can widen the light distribution angle.

1 is a perspective view from above of a lighting device according to an embodiment;
2 is a perspective view from below of the lighting device shown in FIG. 1;
3 is an exploded perspective view of the lighting apparatus shown in FIG.
4 is an exploded perspective view of the lighting apparatus shown in FIG. 2;
FIG. 5 is a sectional perspective view of the lighting apparatus shown in FIG. 1. FIG.
6 and 7 are perspective views illustrating a state in which the light source module 200 and the power supply unit 400 shown in FIG. 3 are coupled to each other.
FIG. 8 is a conceptual diagram illustrating an electrical connection between the substrate 210 and the extension 450 illustrated in FIGS. 3 and 4.
9 is a view for explaining the coupling structure of the connection unit 337 and the power supply unit 400.
10 to 11 are views for explaining the coupling structure of the support substrate 410 and the heat sink 300.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

In the description of the embodiment according to the present invention, when one element is described as being formed on the "on or under" of another element, it is either above or below. (On or under) includes both two elements are directly in contact with each other (directly) or one or more other elements are formed indirectly between the two elements (indirectly). In addition, when expressed as 'on or under', it may include the meaning of the downward direction as well as the upward direction based on one element.

Hereinafter, a lighting apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.

1 is a perspective view from above of a lighting device according to an embodiment, FIG. 2 is a perspective view from below of a lighting device shown in FIG. 1, FIG. 3 is an exploded perspective view of the lighting device shown in FIG. 1, and FIG. 2 is an exploded perspective view of the lighting apparatus illustrated in FIG. 2, and FIG. 5 is a cross-sectional perspective view of the lighting apparatus illustrated in FIG. 1.

1 to 5, the lighting apparatus according to the embodiment may include a cover 100, a light source module 200, a radiator 300, a power supply unit 400, and a socket 500. . Hereinafter, each component will be described in detail.

The cover 100 has a hemispherical shape or a bulb shape, has a hollow, and has an opening 100G having a portion opened. Here, it is to be understood that the hemispherical shape includes not only hemispheres in a geometric sense, but also shapes similar to hemispheres.

The cover 100 is optically coupled to the light source module 200. In detail, the cover 100 may reflect, transmit, and diffuse the light emitted from the light source module 200.

The cover 100 is coupled to the heat sink 300. In detail, the cover 100 may be coupled to the second heat dissipation part 330 of the heat dissipator 300.

The cover 100 may include a first cover part 110 and a second cover part 130. Here, the first cover part 110 may be referred to as an upper end, and the second cover part 130 may be referred to as a lower end. In addition, the cover 100 is not limited to only the first cover part 110 and the second cover part 130. For example, the cover 100 may be composed of three or more cover parts. Thus, the cover 100 may be composed of at least two cover parts.

The first cover part 110 and the second cover part 130 are combined to form a hemispherical shape or a bulb shape cover 100. The coupling of the first cover part 110 and the second cover part 130 may be possible through an adhesive material, and may have a predetermined coupling structure, for example, to the first cover part 110 and the second cover part 130. , Thread / thread groove structure or hook structure.

The first cover part 110 may be disposed on the substrate 210 of the light source module 200, and the second cover part 130 may be disposed on one side of the substrate 210 of the light source module 200.

The second cover part 130 is connected to the outer circumference of the first cover part 110. Specifically, the second cover part 130 is connected to the outer circumference or the bottom of the first cover part 110 forming the opening 100G.

The diameter of the cover 100 may be increased from the upper end of the first cover part 110 toward the lower direction of the second cover part 130.

The first cover part 110 may have an outer surface and an inner surface, and an optical part 115 may be disposed on an inner surface of the first cover part 110. As shown in FIG. 5, the optical unit 115 transmits a part of the light from the light emitting element 230 of the light source module 200, and a part of the outer part 335-1 of the radiator 300. The furnace may be reflected or reflected off the top surface of the substrate 210. The optical unit 115 is an inner surface of the first cover unit 110 and may have a prism shape. In addition, the optical unit 115 may be a prism sheet attached to an inner surface of the first cover unit 110. By the optical unit 115, the post light distribution performance of the lighting apparatus according to the embodiment can be improved. Here, as shown in FIG. 5, the optical unit 115 may be disposed on the entire inner surface of the first cover unit 110, but is not limited thereto. The optical unit 115 may include the first cover unit ( Only a portion of the inner surface of the 110 may be disposed. The arrangement of the optical part 115 on the entire or part of the inner surface of the first cover part 110 may vary depending on the shape of the light source module 200 or the light distribution of the lighting apparatus.

The second cover part 130 is disposed below the first cover part 110 and has an outer surface and an inner surface. The optical part 135 may be disposed on an inner surface of the second cover part 130. As shown in FIG. 5, the optical unit 135 transmits a part of the light from the light source module 200 and reflects the other part to the outer circumferential part 335-1 of the heat sink 300 or the substrate 210. Can be reflected out of the top surface. The optical part 135 is an inner surface of the second cover part 130 itself and may have a prism shape. In addition, the optical part 135 may be a prism sheet attached to an inner surface of the second cover part 130. By the optical unit 135, the post light distribution performance of the lighting apparatus according to the embodiment can be improved. Here, the optical unit 135 may be disposed on a portion of the inner surface of the second cover unit 130 as shown in FIG. 5, but is not limited thereto. The optical unit 135 may include the second cover unit. It may be disposed on the entire inner surface of the 130. The arrangement of the optical part 135 on a part or the whole of the inner surface of the second cover part 130 may vary depending on the shape of the light source module 200 or the light distribution of the lighting device.

The second cover part 130 may be combined with the heat sink 300. In detail, the lower end portion of the second cover portion 130 may be coupled to the outer circumferential portion 335-1 of the second heat dissipation portion 330 of the heat dissipator 300. By combining the second cover part 130 and the heat sink 300, the light source module 200 is disconnected from the outside. Therefore, the light source module 200 may be protected from external foreign matter or moisture.

The material of the cover 100 may include a light diffusing material to prevent glare of a user due to light emitted from the light source module 200.

The light diffusion rate of the first cover part 110 may be greater than the light diffusion rate of the second cover part 130. When the light diffusing rate of the first cover part 110 is greater than the light diffusing rate of the second cover part 130, post-light distribution performance of the lighting apparatus according to the embodiment may be further improved. In detail, when the light diffusion ratio of the first cover part 110 is greater than the light diffusion rate of the second cover part 130, the first cover part 110 is lower than the second cover part 130. It can reflect more light. More specifically, referring to FIG. 5, the first cover part 110 is disposed above the light source module 200, and the second cover part 130 is disposed on one side of the light source module 200. The first cover part 110 receives more light from the light source module 200 than the second cover part 130. Therefore, when the light diffusing rate of the first cover part 110 is greater than the light diffusing rate of the second cover part 130, the amount of light reflected toward the radiator 300 increases, so that the rear light distribution of the lighting apparatus according to the embodiment is performed. Performance can be further improved.

In addition, when the light diffusion rate of the first cover part 110 is greater than the light diffusion rate of the second cover part 130, the glare of the user may be improved. Specifically, when the light emitting device 230 of the light source module 200 is an LED, since the LED is irradiated with strong light in the vertical axis direction, the light source module 200 in the first cover portion 110 disposed on the light source module 200. Stronger light is emitted than the second cover portion 130 disposed at the side of the cover. Therefore, the glare of the user can be reduced by making the light diffusion rate of the first cover part 110 larger than the light diffusion rate of the second cover part 130.

The light reflectance of the first cover part 110 may be greater than the light reflectance of the second cover part 130. When the light reflectance of the first cover part 110 is greater than the light reflectance of the second cover part 130, post-light distribution performance of the lighting apparatus according to the embodiment may be further improved, and glare of the user may be improved.

The cover 100 may be any one of polycarbonate (PC), glass, plastic, polypropylene (PP), and polyethylene (PE).

The cover 100 may be manufactured by blow molding.

The light source module 200 includes the light source module 200 disposed on the heat dissipation member 300 and emitting light to the cover 100. More specifically, the light source module 200 may include a substrate 210 and a light emitting device 230 disposed on the substrate 210.

The substrate 210 may be a circuit pattern printed on an insulator, and for example, a general printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or the like may be used. It may include. In addition, the substrate 210 may be a circuit pattern printed with a transparent or opaque resin. Here, the resin may be a thin insulating sheet having the circuit pattern.

The shape of the substrate 210 may be a circular plate shape. However, the present invention is not limited thereto, and the shape of the substrate 210 may be a polygonal plate shape or an oval plate shape.

The substrate 210 may be disposed on an upper surface of the upper portion 311 of the first heat dissipation part 310 and on an outer circumference 335-1 of the second heat dissipation part 330. Specifically, the central portion of the substrate 210 is disposed on the upper surface of the upper portion 311 of the first heat dissipation portion 310, the remaining edge portion except the center portion 335-1 of the second heat dissipation portion 330 It can be placed on.

The shape of the substrate 210 may correspond to the shape of the upper portion 311 of the first heat dissipation part 310 of the heat dissipator 300. Here, the width of the substrate 210 may be larger than the width of the upper portion 311 of the first heat dissipation portion 310. If the width of the substrate 210 is larger than the width of the upper portion 311, the post light distribution performance of the lighting apparatus according to the embodiment can be improved. Specifically, if the width of the substrate 210 is smaller than the width of the upper portion 311, some of the light incident from the cover 100 may be blocked by the upper portion 311 that does not transmit the light. This may weaken the post light distribution performance of the lighting device. Therefore, the width of the substrate 210 may be larger than the width of the upper portion 311.

The surface of the substrate 210 may be a material that efficiently reflects light, or may be coated with a color that efficiently reflects light, for example, white, silver, or the like.

The substrate 210 may have a first hole H1 for coupling with the power supply unit 400. Specifically, it will be described with reference to FIGS. 6 to 8.

6 and 7 are perspective views illustrating a state in which the light source module 200 and the power supply unit 400 shown in FIG. 3 are coupled, and FIG. 8 shows the substrate 210 and the extension shown in FIGS. 3 and 4. Conceptual diagram illustrating the electrical connection of 450.

3 to 8, the substrate 210 has a first hole H1, and an extension 450 of the power supply unit 400 is inserted into the first hole H1.

Here, as shown in FIG. 8, the height D1 or the extension portion 450 from the top surface of the substrate 210 to the end of the extension portion 450 penetrating through the first hole H1 of the substrate 210. The length D1 of the portion penetrating the first hole H1 of the substrate 210 may be 1.5 mm or more and 2.0 mm or less. If D1 is smaller than 1.5 mm, electrical connection between the substrate 210 and the extension part 450 may be difficult, resulting in poor contact between the substrate 210 and the extension part 450. Specifically, the electrical connection between the substrate 210 and the extension 450 is possible by a soldering process. For this soldering process, the terminal 211 of the substrate 210 and the terminal 451 of the extension 450 are soldered. Must be in contact with the part 700. At this time, when the D1 is smaller than 1.5 mm, it may be difficult for the terminal 451 of the extension part 450 to be in sufficient contact with the soldering part 700. In this case, a poor contact may occur between the substrate 210 and the extension 450. Therefore, it is preferable that D1 is 1.5 mm or more. When the D1 is larger than 2.0 mm, a dark part may be generated when the light source module 200 is driven. Specifically, a female portion may be formed around the extension 450. Such a dark portion may lower the light efficiency of the lighting device and may cause inconvenience to the user. Therefore, it is preferable that D1 is 2.0 mm or less.

The shape of the first hole H1 may correspond to the shape of the extension 450. Here, the diameter of the first hole H1 may be larger than the diameter of the extension 450. That is, the first hole H1 may be large enough to insert the extension 450. Therefore, the extension part 450 inserted into the first hole H1 may not directly contact the substrate 210. In the first hole H1, the distance D2 between the substrate 210 and the extension 450 may be greater than zero and less than or equal to 0.2 mm. When D2 is 0, it is difficult to insert the extension 450 into the first hole H1 of the substrate 210 and an unintended electrical short between the extension 450 and the substrate 210 may occur. On the other hand, if the D2 exceeds 0.2mm, the solder material may flow through the first hole (H1) to the support substrate 410 during soldering, in which case the printed circuit formed on the support substrate 410 is soldered Problems that may cause an electrical short may occur due to the material, and it may be difficult to accurately position the extension 450 where it should be located in the first hole H1. Therefore, the D2 is preferably greater than 0 and less than or equal to 0.2 mm.

Again, referring to FIGS. 3 to 5, the substrate 210 may have a second hole H2 for fixing the substrate 210 to the radiator 300. The fastening means such as a screw is sequentially inserted into the fourth hole H4 and the sixth hole H6 of the heat sink 300 by passing through the second hole H2 of the substrate 210. It may be fixed to the heat sink 300.

The plurality of light emitting devices 230 may be disposed on one surface (or upper surface) of the substrate 210. In detail, the plurality of light emitting devices 230 may be disposed radially on one surface of the substrate 210.

The light emitting device 230 may be a light emitting diode chip that emits red, green, or blue light, or a light emitting diode chip that emits ultraviolet light. Here, the light emitting diode may be a horizontal type or a vertical type.

The light emitting device 230 may be a high-voltage LED package. The HV LED chip in the HV LED package is powered by a DC power supply and turned on at voltages greater than 20 volts (V). In addition, the high-voltage LED package has a high power consumption of approximately 1W. For reference, a conventional general LED chip is turned on at 2 to 3 (V). If the light emitting device 230 is a HV LED package, since it has a high power consumption of about 1W level, it can have the same or similar performance as the existing one in a small quantity, thereby reducing the production cost of the lighting device according to the embodiment. .

A lens (not shown) may be disposed on the light emitting device 230. The lens (not shown) is disposed to cover the light emitting device 230. Such a lens (not shown) may adjust a direction or direction of light emitted from the light emitting element 230. The lens (not shown) is a hemispheric type and may be a light transmissive resin such as a silicone resin or an epoxy resin without empty space. The light transmissive resin may comprise phosphors which are wholly or partially dispersed.

When the light emitting device 230 is a blue light emitting diode, phosphors included in the translucent resin may include garnet-based (YAG, TAG), silicate-based, nitride-based, and oxynitride. It may include at least one or more of the system.

Natural light (white light) may be realized by including only the yellow phosphor in the light-transmissive resin, but may further include a green phosphor or a red phosphor in order to improve the color rendering index and reduce the color temperature.

When various kinds of phosphors are mixed in the light-transmissive resin, the addition ratio according to the color of the phosphor may use more green phosphors than red phosphors and more yellow phosphors than green phosphors. Yellow phosphors include garnet-based YAG, silicate and oxynitrides, green phosphors use silicate and oxynitrides, and red phosphors use nitrides. have. In addition to mixing various kinds of phosphors in the light-transmissive resin, a layer having a red phosphor, a layer having a green phosphor, and a layer having a yellow phosphor may be separately divided.

The radiator 300 receives heat from the light source module 200 to radiate heat. In addition, the radiator 300 may receive heat from the power supply unit 400 to radiate heat.

The radiator 300 may include a first radiator 310 and a second radiator 330.

The material of the first heat dissipation unit 310 may be different from the material of the second heat dissipation unit 330. In detail, the first heat dissipation part 310 may be a material that does not transmit light, that is, no light transmittance, and the second heat dissipation part 330 may be a material having a predetermined light transmittance. If the second heat dissipation unit 330 is a material having a light transmittance, it is possible to transmit a part of the light incident from the cover 100, thereby improving the post-light distribution performance of the lighting apparatus according to the embodiment, according to the embodiment The light distribution angle of the lighting device can be further widened. On the other hand, if the first heat dissipation unit 310 is a material having no light transmittance, the power supply unit 400 disposed inside the first heat dissipation unit 310 may not be visible from the outside.

In addition, the first heat dissipation unit 310 may be a non-insulating material, and the second heat dissipation unit 330 may be an insulating material. When the first heat dissipation unit 310 is a non-insulating material, it is possible to quickly dissipate heat emitted from the light source module 200, and when the second heat dissipation unit 330 is an insulating material, the outer surface of the heat dissipating member 300 becomes an insulator. It is possible to improve the withstand voltage characteristics and protect the user from electrical energy. For example, the material of the first heat dissipation unit 310 may be a metal material such as aluminum, copper, and magnesium, and the second heat dissipation unit 330 may be polycarbonate (PC), ABS (Acrylonitrile (AN), or Butadiene ( BD), Styrene (SM)) and the like. Here, the second heat dissipation part 330 of the resin material may include metal powder. If the second heat dissipation unit 330 is made of a resin, appearance molding is easier than the conventional one in which the entire heat dissipation body is a metal material, and appearance defects due to painting or anodizing of the conventional heat dissipation are not generated. There is this.

In addition, the first thermal conductivity W / (mk) or W / m ° C. of the material constituting the first heat dissipation part 310 may be greater than the second thermal conductivity of the material constituting the second heat dissipation part 330. have. Since the light source module 200 is disposed closer to the first heat dissipation unit 310 than the second heat dissipation unit 330, the thermal conductivity of the first heat dissipation unit 310 is greater than that of the second heat dissipation unit 330. This is because it is advantageous to improve the heat radiation performance. For example, the first heat dissipation unit 310 may be aluminum having high thermal conductivity, and the second heat dissipation unit 330 may be a PC having a thermal conductivity lower than that of the first heat dissipation unit 310. Here, the first heat dissipation unit 310 is not limited to aluminum, and the second heat dissipation unit 330 is not limited to the PC.

The light source module 200 is disposed on the first heat radiating unit 310. In detail, the substrate 210 and the light emitting device 230 of the light source module 200 may be disposed on the upper portion 311 of the first heat radiating part 310.

The first heat dissipation part 310 may have an accommodating part 310R for accommodating the inner part 331 of the second heat dissipation part 330 and the power supply part 400.

The first heat dissipation part 310 may include an upper portion 311 and a lower portion 313.

The upper portion 311 has a flat plate shape, and the substrate 210 and the light emitting element 230 of the light source module 200 are disposed on the upper portion 311 to receive heat directly from the light source module 200. In addition, the upper portion 311 may discharge the received heat from the light source module 200 to the outside or transfer the lower portion 313.

The shape of the upper portion 311 is not limited to the flat plate shape. For example, the shape of the upper portion 311 may be a plate in which the central portion is convex upward or downward, or may be a hemispherical plate. In addition, the shape of the upper portion 311 may be a variety of forms, such as circular or elliptic form.

The shape of the upper portion 311 may correspond to the shape of the substrate 210. In detail, the upper portion 311 and the substrate 210 may be circular. The width of the upper portion 311 may be smaller than the width of the substrate 210. If the width of the upper portion 311 is smaller than the width of the substrate 210, the post light distribution performance of the lighting apparatus according to the embodiment can be improved. Specifically, unlike the second heat dissipation unit 330, the first heat dissipation unit 310 including the upper portion 311 is a material having no light transmittance, and thus, if the width of the upper portion 311 is the width of the substrate 210. If the width is larger than the width, part of the light incident from the cover 100 is blocked by the upper portion 311, and thus it may weaken the post-light distribution performance of the lighting apparatus. Accordingly, the width of the upper portion 311 may be smaller than the width of the substrate 210.

A third hole H3 through which the extension 450 of the power supply unit 400 passes may be formed in the upper portion 311.

A fourth hole H4 may be formed in the upper portion 311 to fix the first heat dissipation part 310 to the second heat dissipation part 330. A fastening means (not shown) such as a screw may pass through the fourth hole H4 and be inserted into the sixth hole H6 of the second heat dissipation part 330.

The upper portion 311 may be disposed on the inner side portion 331 of the second heat dissipation portion 330. In detail, the upper portion 311 may be disposed on an upper surface of the inner side portion 331 of the second heat dissipation portion 330.

Between the top 311 and the substrate 210 of the light source module 200, a heat sink (not shown) or heat dissipation grease (grease) for conducting heat from the light source module 200 to the top 311 can be disposed. have.

The lower portion 313 may be disposed inside the second heat dissipation portion 330. In detail, the lower portion 313 may be disposed in the first accommodating portion 333 of the second heat dissipating portion 330. When the lower portion 313 is disposed in the first accommodating portion 333 of the second heat dissipation portion 330, since the lower portion 313 of the metallic material is not disposed on the exterior of the lighting apparatus according to the embodiment, the power supply portion ( It is possible to protect the user from the electrical energy generated at 400). Since the radiator of the conventional lighting device is entirely made of metal and the appearance of the existing lighting device is also metallic, electrical energy by the internal power supply unit may affect the user. Therefore, when the lower part 313 is disposed in the first accommodating part 333 of the second heat dissipating part 330, there is an advantage that the electric energy by the power supply part does not affect the user.

The lower portion 313 may be disposed between the inner portion 331 and the outer portion 335 of the second heat dissipation portion 330. When the lower portion 313 is disposed between the inner portion 331 and the outer portion 335 of the second heat dissipation portion 330, the lower portion 313 of the metallic material is not disposed in the appearance of the lighting device according to the embodiment. The user may be protected from electrical energy generated by the providing unit 400.

The lower portion 313 may have a hollow barrel shape. Alternatively, the lower portion 313 may have a pipe shape. Specifically, the lower portion 313 may have a cylindrical, elliptic or polygonal shape. The diameter of the lower portion 313 having a cylindrical shape may be constant. In detail, the diameter of the lower portion 313 may be constant from the upper end to the lower end. When the diameter of the lower portion 313 is constant, when manufacturing the lighting apparatus according to the embodiment, the first heat dissipation part 310 is coupled to the second heat dissipation part 330 and the first heat dissipation part 310 is second. Separation from the heat dissipation unit 330 may be easy.

The lower portion 313 may have a predetermined length along the length direction of the second heat dissipation portion 330. The length of the lower portion 313 may extend from the upper end to the lower end of the second heat dissipation part 330, or may extend only from the upper end to the middle part of the second heat dissipation part 330. Thus, the length of the lower portion 313 is not limited to that shown in the figure. As the length of the lower portion 313 is longer, heat dissipation performance may be further improved.

A pin or embossing structure (not shown) may be disposed on at least one of an outer surface or an inner surface of the lower portion 313. When the fin or embossing structure is disposed on the lower portion 313, the surface area of the lower portion 313 itself is widened, and thus, the heat dissipation area is increased. When the heat dissipation area is widened, the heat dissipation performance of the heat dissipator 300 may be improved.

The upper 311 and the lower 313 may be integral. In the present specification, the upper part 311 and the lower part 313 mean that the upper part 311 and the lower part 313 are respectively separate, and the joint part of the upper part 311 and the lower part 313 is welded, gluing, etc. Rather than being connected in a manner, it means that the upper portion 311 and the lower portion 313 are continuous in one without physical breakage. If the upper part 311 and the lower part 313 are integrated, the heat transfer rate from the upper part 311 to the lower part 313 is almost zero since the contact resistance between the upper part 311 and the lower part 313 is close to zero. There is a better advantage than not at all. In addition, if the upper portion 311 and the lower portion 313 are integrated, a process for combining the two with each other, for example, a press process or the like, is unnecessary, and thus there is an advantage of cost reduction in the manufacturing process.

The second heat dissipation unit 330 together with the cover 100 forms an exterior of the lighting apparatus according to the embodiment, and may accommodate the first heat dissipation unit 310 and the power supply unit 400.

The first heat dissipation part 310 is disposed in the second heat dissipation part 330. In detail, the second heat dissipation part 330 may have a first accommodating part 333 accommodating the lower part 313. Here, the first accommodating part 333 may also accommodate the upper portion 311 of the first heat dissipating part 310. The first accommodating part 333 is formed between the inner part 331 and the outer part 335 of the second heat dissipating part 330, and may have a predetermined depth corresponding to the length of the lower part 313.

The second heat dissipation unit 330 may have a second accommodating unit 330R accommodating the power supply unit 400. Here, since the second housing 330R is formed of a non-insulated resin material, unlike the housing of the heat radiator of the conventional lighting device, the power supply unit 400 accommodated in the second housing 330R is provided. Can be used as a non-insulated PSU. Since the non-insulated PSU is lower in cost than the insulated PSU, the manufacturing cost of the lighting apparatus according to the embodiment can be lowered.

The second heat dissipation part 330 may include an inner part 331, an outer part 335, and a connection part 337.

The inner part 331 of the second heat dissipation part 330 is disposed in the accommodating part 310R of the first heat dissipation part 310. The inner part 331 of the second heat dissipation part 330 has a shape corresponding to the shape of the accommodating part 310R of the first heat dissipation part 310 in order to be disposed in the accommodating part 310R of the first heat dissipation part 310. Can have

The substrate 210 of the light source module 200 is disposed on the upper surface of the inner part 331.

The inner part 331 may have a second accommodating part 330R accommodating the power supply part 400.

The inner part 331 may have a fifth hole H5 through which the extension part 450 of the power supply part 400 disposed in the second accommodating part 330R passes. In addition, the substrate 210 and the first heat dissipation unit 310 may have a sixth hole H6 for fixing the second heat dissipation unit 330.

The outer side part 335 of the second heat dissipation part 330 surrounds the first heat dissipation part 310. Here, the outer portion 335 of the second heat dissipation unit 330 may have a shape corresponding to the external shape of the first heat dissipation unit 310. Therefore, the inner part 331 of the second heat dissipation part 330, the first heat dissipation part 310, and the outer part 335 of the second heat dissipation part 330 may have shapes corresponding to each other.

The outer portion 335 may include an outer circumference 335-1. The outer circumference 335-1 may extend outward from an upper end of the outer 335. The outer circumference portion 335-1 may surround the upper surface of the inner portion 331. The edge of the outer circumference 335-1 is coupled to the second cover portion 130 of the cover 100. The substrate 210 may be disposed on a portion of the outer circumference 335-1. The outer circumference 335-1 may transmit at least some of the light from the cover 100, and may reflect the remaining part back to the cover 100. Since the outer circumferential portion 335-1 transmits light, the post light distribution performance of the lighting apparatus according to the embodiment can be improved.

The outer portion 335 may include pins 335-3. Since the fin 335-3 widens the surface area of the outer side portion 335 of the second heat dissipation portion 330, the heat dissipation performance of the heat dissipation member 300 may be improved. However, since the thickness of the outer portion 335 is increased by the fin 335-3, light may not penetrate the fin 335-3, and a dark portion may occur at the fin 335-3. Therefore, the number of pins 335-3 is preferably as small as possible, for example, the number of pins 335-3 may be 2 to 4 or less.

The connection part 337 of the second heat dissipation part 330 may be connected to the lower ends of the inner part 331 and the outer part 335. The connection part 337 couples with the socket 500. The connection part 337 may have a thread structure corresponding to the screw groove formed in the socket 500. The connection part 337 may form the second accommodating part 330R together with the inner part 331.

The connection unit 337 may be coupled to the power supply unit 400 to fix the power supply unit 400 to the inside of the second storage unit 330R. Hereinafter, a description will be given with reference to FIG. 9.

9 is a view for explaining a coupling structure of the connection unit 337 and the power supply unit 400.

9, the connection part 337 has a fastening groove 337h. The fastening groove 337h has a predetermined diameter so that the protrusion 470 of the support substrate 410 can be inserted therein. The fastening groove 337h may be formed in accordance with the number of protrusions 470 of the support substrate 410.

The support substrate 410 of the power supply unit 400 has a protrusion 470 that is coupled to the fastening groove 337h of the connecting portion 337. The protrusion 470 may extend outwardly from both bottom edges of the support substrate 410. The protrusion 470 may have a shape in which the support substrate 410 is easily accommodated in the second housing 330R, and conversely, the support substrate 410 may be difficult to escape from the second housing 330R. For example, the protrusion 470 may have a hook shape.

When the protruding portion 470 of the supporting substrate 410 is coupled to the fastening groove 337h of the connecting portion 337, the supporting substrate 410 is hard to escape from the second accommodating portion 330R, and the supporting substrate 410 is removed. It can be fixed firmly in the 2nd accommodating part 330R. Therefore, no additional work, for example, a molding process of the power supply unit 400 is unnecessary, thereby reducing the manufacturing cost of the lighting apparatus.

1 to 5, the first accommodating part 333 of the second heat dissipating part 330 is formed between the inner part 331 and the outer part 335 of the second heat dissipating part 330. 1 The lower portion 313 of the heat dissipation unit 310 is accommodated. The first accommodating part 333 may have a predetermined depth as long as the length of the lower part 313 of the first heat dissipating part 310. Here, the first accommodating part 333 does not completely separate the inner part 331 and the outer part 335. That is, since the first accommodating part 333 is not formed at the lower end of the inner part 331 and the lower part of the outer part 335, the inner part 331 and the outer part 335 may be connected to each other.

After the first heat dissipation unit 310 and the second heat dissipation unit 330 are manufactured separately, the first heat dissipation unit 310 may be coupled to the second heat dissipation unit 330. Specifically, the lower part 313 of the first heat dissipation part 310 is inserted into the first accommodating part 333 of the second heat dissipation part 330, and the upper part 311 of the first heat dissipation part 310 is the second. After being inserted into the cavity 335a of the heat dissipation unit 330, the first heat dissipation unit 310 and the second heat dissipation unit 330 may be coupled to each other through an adhesive process or a fastening process.

Meanwhile, the first heat dissipation unit 310 and the second heat dissipation unit 330 are integrally formed, and separation of the first heat dissipation unit 310 and the second heat dissipation unit 330 coupled to each other may be limited. Specifically, the first heat dissipation unit 310 and the second heat dissipation unit 330 are fixed to each other as a result of a predetermined process. Therefore, the first heat dissipation unit 310 and the second heat dissipation unit 330 are difficult to separate from each other. 3 to 4 illustrate that the first heat dissipation unit 310 and the second heat dissipation unit 330 are separated from each other for convenience of description. In the present specification, the first heat dissipation part 310 and the second heat dissipation part 330 are integrally formed, or the fact that the separation is limited does not mean that they are not separated from each other by any force, but rather are relative to human forces. It is possible to separate by a large predetermined force, for example, a mechanical force, but if the first heat dissipation unit 310 and the second heat dissipation unit 330 are separated by the predetermined force, It should be understood as meaning that it is difficult to return to a state.

When the first heat dissipation part 310 and the second heat dissipation part 330 are integrally formed or when the first heat dissipation part 310 and the second heat dissipation part 330 are restricted from being separated, the first heat dissipation of a metal material The contact resistance between the part 310 and the second heat dissipation part 330 of the resin material may be lower than that when the first heat dissipation part 310 and the second heat dissipation part 330 are not integrated. Since the contact resistance is lowered, the same or similar heat dissipation performance as that of the conventional heat dissipator (the whole is made of metal) can be ensured. In addition, when the first heat dissipation unit 310 and the second heat dissipation unit 330 are integrated, the second heat dissipation unit due to external impact is more effective than when the first heat dissipation unit 310 and the second heat dissipation unit 330 are not integrated. Damage or damage to the 330 can be further reduced.

In order to integrally form the first heat dissipation unit 310 and the second heat dissipation unit 330, an insert injection molding method may be used. In the insert injection processing method, the first heat dissipation part 310 prepared in advance is put into a mold (frame) for molding the second heat dissipation part 330, and then the material constituting the second heat dissipation part 330 is melted. It is a method of inserting into the mold and injection.

The power supply unit 400 may include a support substrate 410 and a plurality of components 430.

The support substrate 410 may have a printed pattern that mounts the plurality of components 430, receives a power signal provided through the socket 500, and provides a predetermined power signal to the light source module 200.

The support substrate 410 may have a rectangular plate shape. The support substrate 410 is accommodated in the second accommodating part 330R of the second heat dissipating part 330. Specifically, it will be described with reference to FIGS. 10 to 11.

10 to 11 are views for explaining the coupling structure of the support substrate 410 and the heat sink 300.

10 to 11, the first and second guide parts 338a and 338b for guiding one side of the support substrate 410 from both sides are respectively provided in the second accommodating part 330R of the heat sink 300. Can have A guide groove 338g into which one side of the support substrate 410 is inserted may be formed between the first guide part 338a and the second guide part 338b.

The intervals W1 and W2 between the first guide part 338a and the second guide part 338b may become narrower as they enter the second accommodating part 330R. Alternatively, the diameters W1 and W2 of the guide groove 338g may be narrower as they enter the second accommodating part 330R. When the gaps W1 and W2 or the diameters W1 and W2 of the guide grooves 338g between the first guide part 338a and the second guide part 338b become narrower as they enter the second accommodating part 330R. In this case, the process of inserting the support substrate 410 into the second accommodating portion 330R may be facilitated, and the support substrate 410 may be precisely coupled to the inside of the heat sink 300.

At the entrance of the second housing portion 330R, the distance W1 between the first guide portion 338a and the second guide portion 338b is easy to insert the support substrate 410 into the second storage portion 330R. In order to improve the working efficiency of the operator, the thickness of the support substrate 410 may be larger than the value added by 1mm. That is, the distance between one surface of the support substrate 410 and the first guide portion 338a may be 0.5 mm or more.

On the bottom surface of the second receiving portion 330R, the gap W2 between the first guide portion 338a and the second guide portion 338b is used to accurately position the supporting substrate 410 at the designed position. It is better than the thickness of 410 and less than the thickness of the support substrate 410 plus 0.1mm. That is, the distance between one surface of the support substrate 410 and the first guide portion 338a is preferably 0.05 mm or less.

A fastening groove 337h into which the protrusion 470 of the support substrate 410 is inserted is formed between the first guide part 338a and the second guide part 338b. The fastening groove 337h is formed between the first guide part 338a and the second guide part 338b, so that the support substrate 410 can be disposed at a more accurate position, and the separation of the support substrate 410 can be prevented. Can be.

The support substrate 410 may include an extension 450. The extension part 450 extends from the upper end of the support substrate 410 to the outside, passes through the fifth hole H5 of the heat sink 300 and the first hole H1 of the substrate 210, and then solders. The process is electrically connected to the substrate 210. Here, the extension 450 may be referred to as an extension substrate.

The support substrate 410 may include a protrusion 470. The protrusion 470 extends outward from both sides of the lower end of the support substrate 410, and is coupled to the connection part 337 of the heat sink 300.

The plurality of components 430 are mounted on the support substrate 410. The plurality of components 430 may include, for example, a DC converter for converting AC power provided from an external power source into DC power, a driving chip for controlling driving of the light source module 200, and a light source module 200 to protect the light source module 200. An electrostatic discharge (ESD) protection element may be included, but is not limited thereto.

The power supply unit 400 may be a non-insulated PSU since the inner walls defining the second accommodating part 330R of the second heat dissipation part 330 are an insulating material, for example, a resin material. If the power supply unit 400 is a non-insulated PSU, the manufacturing cost of the entire lighting device may be lowered.

The socket 500 is coupled to the connection portion 337 of the heat sink 300 and electrically connected to the power supply unit 400. The socket 500 delivers external AC power to the power supply unit 400.

The socket 500 may be the same size and shape as a socket of a conventional incandescent bulb. Since the socket 500 is the same size and shape as the socket of the conventional incandescent bulb, the lighting device according to the embodiment can replace the conventional incandescent bulb.

Although the above description has been made mainly on the embodiments, these are merely examples and are not intended to limit the present invention, and those of ordinary skill in the art to which the present invention pertains should not be exemplified above unless they depart from the essential characteristics of the present embodiments. It will be appreciated that many variations and applications are possible. For example, each component specifically shown in embodiment can be modified and implemented. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

100: cover
200: light source module
300: radiator
400: power supply unit
500: socket

Claims

A heat sink including an upper surface and an outer circumferential portion surrounding the upper surface;
A light source module including a substrate disposed on the upper surface and a portion of the outer circumferential portion and a light emitting element disposed on the substrate; And
And a hemispherical cover disposed on the light source module.
The cover includes a first cover part disposed on the substrate and a second cover part connected to an outer circumference of the first cover part.
The light reflectance of the first cover part is greater than the light reflectance of the second cover part,
The first cover part includes an optical part that reflects at least a portion of the light from the light emitting element outside the upper surface of the substrate,
The outer periphery is a lighting device that transmits at least a portion of the incident light.

The method of claim 1,
And the second cover portion further comprises an optical portion for reflecting at least a portion of light from the light emitting element out of an upper surface of the substrate.

The method of claim 1,
The light diffusing rate of the first cover part is greater than the light diffusing rate of the second cover part.

A heat sink including an upper surface and an outer circumferential portion surrounding the upper surface;
A light source module including a substrate disposed on the upper surface and a portion of the outer circumferential portion and a light emitting element disposed on the substrate; And
And a cover coupled to the outer circumference and disposed on the light source module.
The cover includes a lower end coupled to the outer circumferential part, and an upper end disposed on the lower end and having a light diffusivity higher than that of the lower end.
At least one or more of the upper end portion and the lower end portion includes an optical portion for reflecting a part of the light from the light emitting element to the outer peripheral portion,
The outer periphery is a lighting device that transmits at least a portion of the incident light.

The method of claim 4, wherein the heat sink,
A first heat dissipation part including an upper part including the upper surface and a lower part connected to the upper part and having an accommodating part; And
And a second heat dissipation part including an inner part disposed in the accommodating part of the first heat dissipation part and an outer part surrounding the first heat dissipation part and having the outer circumferential part.
The second heat dissipation unit has a predetermined light transmittance,
And the first heat dissipation unit and the second heat dissipation unit are integrated.

The method of claim 5,
Further comprising a power supply for providing power to the light source module,
The first heat dissipation part is a non-insulating material, and the second heat dissipation part is an insulating material,
And the second heat dissipation part includes an accommodating part accommodating the power supply part.

The method of claim 6,
The power supply unit includes a support substrate and a plurality of parts disposed on the support substrate,
The support substrate may include an extension part which penetrates the inner part of the second heat dissipation part, the upper part of the first heat dissipation part, and the substrate, and is electrically connected to the substrate.

The method of claim 6,
The power supply unit includes a support substrate and a plurality of parts disposed on the support substrate,
The second heat dissipation part further includes a connection part for coupling with the socket,
The connection portion has at least one hole,
The support substrate has a projection of the hook structure is inserted into the hole of the connecting portion.

The method of claim 6,
The power supply unit includes a support substrate and a plurality of parts disposed on the support substrate,
The accommodating part of the second heat dissipation part includes a first guide part and a second guide part for guiding one side of the support substrate from both sides,
The interval between the first guide portion and the second guide portion is narrowed toward the bottom surface of the accommodating portion of the second heat dissipation portion from the inlet of the accommodating portion of the second heat dissipation portion.

The method according to any one of claims 1 to 9,
And the optical portion is shaped like a prism.