KR102024703B1

KR102024703B1 - Lighting device

Info

Publication number: KR102024703B1
Application number: KR1020120055593A
Authority: KR
Inventors: 임동녕; 김천주; 최태영; 김도환
Original assignee: 엘지이노텍 주식회사
Priority date: 2012-05-24
Filing date: 2012-05-24
Publication date: 2019-09-24
Also published as: KR20130131777A

Abstract

Embodiments relate to a lighting device.
Illumination apparatus according to the embodiment, the cover having an opening; A heat dissipation member including a base part having a heat dissipation fin, and a member extending from the upper surface of the base part through the opening and having a plurality of side surfaces, and having the base part and a receiving part penetrating the member; A housing made of a material disposed in the housing of the heat sink and having electrical insulation; A plurality of light source modules disposed inside the cover and disposed on a plurality of side surfaces of the member; A power supply unit including a support substrate accommodated in the member and the housing and a plurality of components mounted on the support substrate and providing power to the light source module; A terminal plate electrically connecting the plurality of light source modules; And a reflector including an upper portion disposed on an upper surface of the member, wherein the plurality of light source modules are disposed only on the plurality of side surfaces of the member, and the housing includes a lower housing coupled to a socket to which an external power source is applied. The lower housing includes a lower end of the support substrate of the power supply unit, and an upper end of the support substrate of the power supply unit is surrounded by the member.

Description

Lighting device {LIGHTING DEVICE}

Embodiments relate to a lighting device.

Light emitting diodes (LEDs) are a type of semiconductor device that converts electrical energy into light. Light emitting diodes have the advantages of low power consumption, semi-permanent life, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent and incandescent lamps. Accordingly, many researches are being conducted to replace conventional light sources with light emitting diodes, and the use of light emitting diodes is increasing as a light source for lighting devices such as various lamps, liquid crystal displays, electronic displays, and street lamps that are used indoors and outdoors. .

The embodiment provides a lighting device that can improve heat dissipation performance.

In addition, the embodiment provides a lighting apparatus for performing an optimal omnidirectional performance.

Illumination apparatus according to the embodiment, the cover having an opening; A heat dissipation member including a base part having a heat dissipation fin, and a member extending from the upper surface of the base part through the opening and having a plurality of side surfaces, and having the base part and a receiving part penetrating the member; A housing made of a material disposed in the housing of the heat sink and having electrical insulation; A plurality of light source modules disposed inside the cover and disposed on a plurality of side surfaces of the member; A power supply unit including a support substrate accommodated in the member and the housing and a plurality of components mounted on the support substrate and providing power to the light source module; A terminal plate electrically connecting the plurality of light source modules; And a reflector including an upper portion disposed on an upper surface of the member, wherein the plurality of light source modules are disposed only on the plurality of side surfaces of the member, and the housing includes a lower housing coupled to a socket to which an external power source is applied. The lower housing includes a lower end of the support substrate of the power supply unit, and an upper end of the support substrate of the power supply unit is surrounded by the member.

By using the lighting apparatus according to the embodiment, it is possible to improve heat dissipation performance.

In addition, it is possible to perform the optimal post-directional light distribution (Omni Direction) performance.

1 is a perspective view from above of a lighting device according to an embodiment;
2 is a perspective view from below of the lighting apparatus shown in FIG. 1;
3 is an exploded perspective view of the lighting apparatus shown in FIG.
4 is an exploded perspective view of the lighting apparatus shown in FIG. 2;
5 is a front view when the cover is removed from the lighting apparatus shown in FIG. 1;
6 is a front view when the cover and the reflector are removed from the lighting apparatus shown in FIG. 1;
7 is a cross-sectional view of only the heat sink shown in FIG. 2;
8 is a plan view of the heat sink shown in FIG.
9 is a perspective view of only the housing shown in FIG. 2;

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

In the description of the embodiment according to the present invention, when one element is described as being formed on the "on or under" of another element, (On or under) includes both the two elements are in direct contact with each other (directly) or one or more other elements are formed indirectly formed (indirectly) between the two elements. In addition, when expressed as “on” or “under”, it may include the meaning of the downward direction as well as the upward direction based on one element.

Hereinafter, a lighting apparatus according to an embodiment will be described with reference to the accompanying drawings.

1 is a perspective view from above of a lighting device according to an embodiment, FIG. 2 is a perspective view from below of a lighting device shown in FIG. 1, FIG. 3 is an exploded perspective view of the lighting device shown in FIG. 1, and FIG. 2 is an exploded perspective view of the lighting apparatus shown in FIG. 2, FIG. 5 is a front view when the cover is removed from the lighting apparatus shown in FIG. 1, and FIG. 6 is a front view when the cover and the reflector are removed from the lighting apparatus shown in FIG. 1. to be.

1 to 6, the lighting apparatus according to the embodiment includes a cover 100, a light source module 200, a reflector 300, a radiator 400, a housing 500, a power supply unit 600, and It may include a socket 700. Hereinafter, each configuration will be described in detail.

The cover 100 has a bulb shape, is hollow, and has an opening 130 with a portion opened.

The cover 100 is optically coupled to the light source module 200. For example, the cover 100 may diffuse, scatter, or excite light emitted from the light source module 200.

The cover 100 is coupled to the heat sink 400. To this end, the cover 100 may have a coupling portion (110). The coupling part 110 may be inserted into the coupling groove 490 of the heat sink 400. Coupling portion 110 may have a screw-shaped fastening structure. A screw groove structure corresponding to the screw thread shape may be formed in the coupling groove 490 to facilitate coupling of the cover 100 and the heat sink 400.

The thickness of the cover 100 may have a value within the range of 1 mm or more and 2 mm or less.

The material of the cover 100 may be a light diffusion PC (polycarbonate) to prevent glare of a user by light emitted from the light source module 200. In addition, the cover 100 may be any one of glass, plastic, polypropylene (PP), and polyethylene (PE).

An inner surface of the cover 100 may be corroded, and an outer surface thereof may be applied with a predetermined pattern to scatter light emitted from the light source module 200. Therefore, glare of the user can be prevented.

The cover 100 may be manufactured by blow molding for later light distribution. In blow molding, the diameter of the opening 130 of the cover 100 may be 3 mm or more and 20 mm or less.

The light source module 200 emits predetermined light.

The light source module 200 may be plural in number. In detail, the light source module 200 may include a first light source module 200a, a second light source module 200b, and a third light source module 200c.

Each of the first to third light source modules 200a, 200b, and 200c may include a substrate 210a and a light emitting device 230a disposed on the substrate 210a.

The substrate 210a may be a circuit pattern printed on an insulator, and for example, a general printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or the like may be used. It may include. The surface of the substrate 210a may be a material that efficiently reflects light, or may be coated with a color that efficiently reflects light, for example, white, silver, or the like.

The substrate 210a may have a predetermined hole 215a at its center. The hole 215a may be a reference point for arranging the light emitting devices 230a, and a screw may be inserted to fix the substrate 210a to the heat sink 400.

The plurality of light emitting devices 230a may be disposed on one surface of the substrate 210a. The light emitting device 230a may be a light emitting diode chip emitting red, green, or blue light, or a light emitting diode chip emitting ultraviolet light. Here, the light emitting diode may be a horizontal type or a vertical type, and may emit blue, red, yellow, or green.

A lens may be disposed on the light emitting device 230a. The lens is disposed to cover the light emitting element 230a. Such a lens may adjust a direction or direction of light emitted from the light emitting element 230a. The lens is hemispheric type and may be a translucent resin such as a silicone resin or an epoxy resin with no void space. The light transmissive resin may comprise phosphors which are wholly or partially dispersed.

When the light emitting device 230a is a blue light emitting diode, phosphors included in the translucent resin may include garnet-based (YAG, TAG), silicate-based, nitride-based and oxynitride. It may include at least one or more of the system.

Natural light (white light) may be realized by including only the yellow phosphor in the light-transmissive resin, but may further include a green phosphor or a red phosphor in order to improve the color rendering index and reduce the color temperature.

When various kinds of phosphors are mixed in the light-transmissive resin, the addition ratio according to the color of the phosphor may use more green phosphors than red phosphors and more yellow phosphors than green phosphors. Yellow phosphors include garnet-based YAG, silicate and oxynitrides, green phosphors use silicate and oxynitrides, and red phosphors use nitrides. have. In addition to mixing various kinds of phosphors in the light-transmissive resin, a layer having a red phosphor, a layer having a green phosphor, and a layer having a yellow phosphor may be separately divided.

The light source module 200 may include a terminal plate 250. The first to third light source modules 200a, 200b, and 200c may be electrically connected through the terminal plate 250. For example, the first to third light source modules 200a, 200b, and 200c may be electrically connected in series using two terminal plates 250.

The terminal plate 250 may be a conductive metal material. For example, the terminal plate 250 may be any one of copper, nickel and zinc plating. The terminal plate 250 may be a metal material that can be easily bent for manufacturing the light source module 200. The thickness of the terminal plate 250 may be 0.1 mm or more and 0.5 mm or less.

The light source module 200 is disposed on the heat sink 400. Specifically, the substrates 210a of the first to third light source modules 200a, 200b, and 200c may be disposed on the outer side surface 411 of the member 410 of the heat sink 400.

The reflector 300 is coupled to the heat sink 400. In detail, the reflector 300 may be coupled to the member 410 of the heat sink 400.

The reflector 300 has a shape corresponding to the shape of the member 410 of the heat sink 400. In addition, the reflector 300 may have a shape capable of covering the member 410 of the heat sink 400. In detail, the reflector 300 includes an upper portion 310 disposed on the upper surface of the member 410 of the heat sink 400 and a lower portion 330 disposed on the side surface of the member 410 of the heat sink 400. It can have

The upper portion 310 of the reflector 300 may include a flat surface or may include a curved surface that is convex toward the cover 100. If the upper portion 310 of the reflector 300 includes a curved surface, there is an advantage that can reduce the dark portion that may occur in the uppermost portion of the cover 100.

The minimum length from the upper part 310 of the reflector 300 to the uppermost part of the cover 100 may be 15 mm or more. If the length from the upper portion 310 of the reflector 300 to the inner surface of the cover 100 is less than 15 mm, there is a problem that a dark portion may be generated at the top of the cover 100. When the minimum length from the upper portion 310 of the reflector 300 to the inner surface of the cover 100 is 15 mm or more, the occurrence of the dark portion may be significantly reduced, and the concentration of the dark portion may be further lowered.

The reflector 300 may have an arrangement groove 335. The placement groove 335 may be formed in the lower portion 330 of the reflector 300. The placement groove 335 may be a groove in which the light source module 200 mounted on the member 410 of the heat sink 400 is disposed. Specifically, the substrate 210a of the light source module 200 may be disposed in the placement groove 335. The reflector 300 is disposed on the member 410 of the heat sink 400, but the reflector 300 is not disposed on the light source module 200 by the placement groove 335.

The material of the reflector 300 may be a white PC (polycarbonate) that easily reflects light emitted from the light source module 200 and has heat resistance. The reflector 300 may increase the light extraction efficiency of the lighting apparatus according to the embodiment.

The reflector 300 may be a material having electrical insulation. The reflector 300 may be disposed between the member 410 of the heat sink 400 and the terminal plate 250 of the light source module 200. The reflector 300 may block electrical contact between the terminal plate 250 and the heat sink 400.

The surface of the reflector 300 may be surface treated to scatter light from the light source module 200 to prevent glare of the user.

The light source module 200 is disposed on the heat sink 400. The radiator 400 receives heat from the light source module 200 to radiate heat. In addition, the radiator 400 is coupled to the cover 100 and accommodates the power supply unit 600 and the housing 500.

7 is a cross-sectional view of only the heat sink shown in FIG. 2.

1 to 7, the radiator 400 may include a member 410, a base 430, and a radiator fin 450.

The member 410 may extend upward from the base 430. The member 410 may be integrated with the base portion 430, or may be bonded or bonded to the base portion 430 as a separate configuration from the base portion 430.

The member 410 may have a cylindrical shape. The light source module 200 is disposed on an outer surface of the cylindrical member 410.

The member 410 has a side surface 411 on which the light source module 200 is disposed. The member 410 may have the side surfaces 411 as many as the light source modules 200. For example, the member 410 may have three side surfaces 411 on which the first to third light source modules 200a, 200b, and 200c are disposed. The three side surfaces 411 may be in surface contact with the bottom surfaces of the substrates 210a of the first to third light source modules 200a, 200b, and 200c. To this end, the three sides 411 may be flat surfaces. However, the present invention is not limited thereto, and the three side surfaces 411 may be curved. In this case, the substrates 210a may be flexible substrates.

Side 411 may be substantially parallel to the central axis (X) of the lighting apparatus according to the embodiment, as shown in FIG. Here, the angle between the side surface 411 and the central axis X may be 0.3 degrees or more and 3 degrees or less. If the angle between the side surface 411 and the central axis X is 0 degrees or more and 0.3 degrees or less, there exists a problem of weakening the front light distribution characteristic, and when it is 3 degrees or more, there exists a problem of weakening the rear light distribution characteristic.

As shown in FIG. 6, an area of the side surface 411 is wider than an area of the lower surface of the substrate 210a, and the substrate 210a is disposed at a lower end of the side surface 411 rather than a center portion thereof. Therefore, the substrate 210a is not disposed at the upper end of the side surface 411. If there is a portion where the substrate 210a is not disposed at the upper end of the side surface 411, the heat generated from the light source module 200 is not only in the direction of the base part 430 side of the member 410 but also in the upper end side of the member 410. Since it is also conducted in the direction, it is possible to quickly lower the temperature of the light source module 200. Therefore, it is possible to improve the heat dissipation performance of the lighting apparatus according to the embodiment.

Here, the length a from the top of the side surface 411 to the top of the substrate 210a may be 3 mm or more and 5 mm or less. If a is smaller than 3 mm, a remarkable heat dissipation effect cannot be obtained, and if 5 mm or more, a dark portion generated at the top of the cover 100 becomes thicker.

The thickness of the member 410 may be 2.5 mm or more and 5 mm or less. If the thickness of the member 410 is less than 2.5mm, the heat dissipation performance is not good. If the thickness of the member 410 is greater than 5mm, the material cost of the heat dissipator 400 is increased and the space for accommodating the power supply unit 600 is small. There is a problem.

Member 410 may have an extension 413. The extension part 413 may extend in the direction of the accommodating part 470 from the top of the member 410. By the extension part 413, since the heat generated from the light source module 200 can be conducted more toward the upper end side of the member 410, the temperature of the light source module 200 can be lowered quickly. Therefore, the heat dissipation performance of the lighting apparatus according to the embodiment may be further improved. Here, the length of the extension part 413 may be 10 mm or more and 20 mm or less based on the side surface 411. If it is smaller than 10mm, there is no significant effect on improving heat dissipation performance, and if it is larger than 20mm, the connection between the power supply unit 600 and the light source unit 200 is not easy.

The base portion 430 is disposed below the member 410. The base portion 430 and the member 410 may be formed integrally.

A plurality of heat dissipation fins 450 may be disposed on an outer surface of the base part 430. The plurality of heat dissipation fins 450 may protrude outward from the outer surface of the base part 430. The plurality of heat dissipation fins 450 and the base part 430 may be integrated, or may be coupled to each other as a separate configuration.

When the heat dissipation fin 450 is divided into an upper end and a lower end, the upper end of the heat dissipation fin 450 becomes wider from the upper end of the base part 430 to the lower end. When the width of the upper end portion of the heat dissipation fin 450 becomes wider from the upper end portion of the base portion 430 to the lower end portion, post-light distribution characteristics of the lighting apparatus according to the embodiment may be improved. This is because the light emitted from the light source module 200 is not blocked by the upper end of the heat radiation fin 450. This will be described in more detail with reference to FIG. 6.

Referring to FIG. 6, the upper end of the heat radiation fin 450 may be formed in consideration of light emitted from the light source module 200a. Specifically, the upper end of the heat radiation fin 450 may be formed in consideration of the light distribution area (L) of the light emitted from the light source module 200a. That is, the upper end of the heat radiation fin 450 may be disposed under the light distribution area L of the light source module 200a. Alternatively, the upper end of the heat radiation fin 450 may be formed so as not to overlap the light distribution area L of the light source module 200a.

The orientation angle of the light source module 200b and the upper end of the heat dissipation fin 450 may have the following relationship. Based on the vertical axis G penetrating the center of the light emitting device 230b, the maximum directivity angle Z of the light emitting device 230b passes through the vertical axis G and the center of the light emitting device 230b and radiates the heat radiation fin 450. It may be defined as the angle between the tangent (C) passing through the contact point (P) of the upper end of. When the maximum directivity angle Z of the light emitting device 230b is defined as above, the lighting apparatus according to the embodiment may improve post-light distribution characteristics. Here, the maximum directing angle Z may be 60 degrees or more and 75 degrees or less.

In defining the maximum directivity angle Z of the light emitting device 230b, the vertical axis G may be the center of the substrate 210b, not the center of the light emitting device 230b. That is, the vertical axis G may be an axis penetrating the hole 215b of the substrate 210b.

8 is a plan view of the heat sink 400 shown in FIG.

Referring to FIG. 8, the heat radiating fins 450 may protrude in a direction perpendicular to the outer surface of the base portion 430.

The heat dissipation fin 450 may be thinner from the outer surface of the base portion 430 to the outside. The heat dissipation fin 450 may have a thickness of 0.8 mm or more and 3.0 mm or less.

The plurality of heat sink fins 450 may be spaced apart by a predetermined interval. Here, the outermost gap between the two heat sink fins 450 may be 6 mm or more and 7 mm or less, and the innermost gap may be 4 mm or more and 6 mm or less. If the gap between the outermost and innermost interval of the two heat radiation fins 450 is different, the heat dissipation performance can be improved, the powder coating operation to the innermost of the heat radiation fins 450 can be easily performed.

The heat sink 400 has an accommodating part 470 for accommodating the housing 500 therein. The accommodating part 470 may be a through hole penetrating the member 410 and the base part 430 of the radiator 400.

The radiator 400 may be a metal material or a resin material having excellent heat dissipation efficiency. The heat sink 400 may be made of a material having a high thermal conductivity (generally 150Wm-1K-1 or more, more preferably 200Wm-1K-1 or more). For example, it may be copper (about 400 Wm-1K-1 thermal conductivity), aluminum (about 250 Wm-1K-1 thermal conductivity), anodized aluminum, aluminum alloy, magnesium alloy. In addition, metal loaded plastic materials, such as polymers, for example epoxy or thermally conductive ceramic materials (e.g., aluminum silicon carbide (AlSiC), thermal conductivity of about 170 to 200 Wm-1K-1) May be).

9 is a perspective view of only the housing shown in FIG.

1 to 9, the housing 500 is disposed inside the heat sink 400. In detail, the housing 500 may be disposed in the accommodating part 470 of the heat sink 400.

The housing 500 accommodates the power supply unit 600 therein to protect the power supply unit 600. The housing 500 may prevent the heat emitted from the radiator 400 from being conducted to the power supply 600, thereby preventing a temperature rise of various components 610 of the power supply 600.

The housing 500 may include an upper housing 510 and a lower housing 550. The upper housing 510 and the lower housing 550 may be coupled to accommodate the power supply unit 600 therein.

The upper housing 510 is disposed between the member 410 of the heat sink 400 and the upper end of the power supply 600. Since the upper housing 510 is disposed behind the light source module 200 that generates the most heat in the radiator 400, the temperature rise of the components 610 of the power supply unit 600 may be reduced.

The lower housing 550 is disposed between the base portion 430 of the heat sink 400 and the lower end portion of the power supply 600. Here, silicon molding may be processed in the lower housing 550 to fix the lower end of the power supply unit 600. The lower housing 550 may be coupled to the socket 700 to which external power is applied.

The housing 500 may be made of a material having good electrical insulation and heat resistance. For example, the housing 500 may be a PC (polycarbonate).

Referring to FIG. 2, the power supply unit 600 may include a support substrate 630 and a plurality of components 610 mounted on the support substrate 630. The plurality of components 610 may include, for example, a DC converter for converting AC power provided from an external power source into DC power, a driving chip for controlling driving of the light source module 200, and protecting the light source module 200. An electrostatic discharge (ESD) protection element may be included, but is not limited thereto.

Although the above description has been made with reference to the embodiments, these are only examples and are not intended to limit the present invention, and those of ordinary skill in the art to which the present invention pertains should not be exemplified above without departing from the essential characteristics of the present embodiments. It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

100: cover
200: light source module
300: reflector
400: radiator
500: housing
600: power supply unit
700: socket

Claims

A cover having an opening;
A heat dissipation member including a base part having a heat dissipation fin, and a member extending from the upper surface of the base part through the opening and having a plurality of side surfaces, and having the base part and a receiving part penetrating the member;
A housing made of a material disposed in the housing of the heat sink and having electrical insulation;
A plurality of light source modules disposed inside the cover and disposed on a plurality of side surfaces of the member;
A power supply unit including a support substrate accommodated in the member and the housing and a plurality of components mounted on the support substrate and providing power to the light source module;
A terminal plate electrically connecting the plurality of light source modules; And
It includes; a reflector including an upper portion disposed on the upper surface of the member,
The plurality of light source modules are not disposed on the reflector,
The housing includes a lower housing coupled to the socket to which external power is applied,
The lower housing accommodates the lower end of the support substrate of the power supply,
The upper end of the support substrate of the power supply unit is surrounded by the member,
Lighting device.

A cover having an opening;
A heat dissipation member including a base part having a heat dissipation fin, and a member extending from an upper surface of the base part through the opening and having a plurality of side surfaces, and having a base part and a receiving part penetrating the member;
A housing made of a material disposed in the housing of the heat sink and having electrical insulation;
A plurality of light source modules disposed inside the cover and disposed on a plurality of side surfaces of the member;
A power supply unit including a support substrate accommodated in the member and the housing and a plurality of components mounted on the support substrate and providing power to the light source module;
A terminal plate electrically connecting the plurality of light source modules; And
It includes; a reflector including an upper portion disposed on the upper surface of the member,
The plurality of light source modules are disposed only on the plurality of side surfaces of the member,
The housing includes a lower housing coupled to the socket to which external power is applied,
The lower housing accommodates the lower end of the support substrate of the power supply,
The upper end of the support substrate of the power supply unit is surrounded by the member,
Lighting device.

The method according to claim 1 or 2,
An upper portion of the reflector covers the upper surface of the member.

delete

The method of claim 3, wherein
The reflector includes a lower portion extending in an upper surface direction of the base portion from the upper portion.

delete

The method of claim 5,
The minimum length from the top of the reflector to the top of the cover is at least 15mm.

The method of claim 5,
The angle of the side surface of the said member and the central axis of the said lighting apparatus is 0.3 degree or more and 3 degrees or less.