TW201307750A - Lamp and light apparatus - Google Patents

Lamp and light apparatus Download PDF

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Publication number
TW201307750A
TW201307750A TW101106030A TW101106030A TW201307750A TW 201307750 A TW201307750 A TW 201307750A TW 101106030 A TW101106030 A TW 101106030A TW 101106030 A TW101106030 A TW 101106030A TW 201307750 A TW201307750 A TW 201307750A
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Taiwan
Prior art keywords
light
led
heat absorbing
heat
base member
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TW101106030A
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Chinese (zh)
Inventor
Akira Urushibara
Kouki Ootsuka
Yuuya Nakano
Yasuo Ban
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Iwasaki Electric Co Ltd
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Publication date
Priority claimed from JP2011045903A external-priority patent/JP5418521B2/en
Priority claimed from JP2012002416A external-priority patent/JP5853710B2/en
Application filed by Iwasaki Electric Co Ltd filed Critical Iwasaki Electric Co Ltd
Publication of TW201307750A publication Critical patent/TW201307750A/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/68Details of reflectors forming part of the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/235Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • F21V7/22Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The invention provides a lamp and a lighting apparatus. The lamp is used to prevent the light utilization rate from being reduced and simultaneously suppress the light quantity towards the circumferential direction. A LED lamp (1) is structured as follows: a concave mirror (18) and a LED (10) arranged on a bottom opening (18B) of the concave mirror (18) and capable of emitting the light outside are arranged on the top (2A) of a basal body (2) and a reflection surface (44) for controlling the light distribution of the concave mirror (18) has light transmittance.

Description

燈、及照明器具 Lamps and lighting fixtures

本發明是有關在光源配備LED或有機EL元件等之發光元件的燈及照明器具。 The present invention relates to a lamp and a lighting fixture equipped with a light-emitting element such as an LED or an organic EL element in a light source.

近年來隨著LED的高輸出化、及低成本化,於光源配備LED之燈泡型的LED燈很普及。此種LED燈,具有可安裝在既存設備之燈座的燈頭,作為代替燈泡使用(例如:參照日本專利文獻1、及專利文獻2)。 In recent years, with the high output of LEDs and the reduction in cost, LED bulbs equipped with LEDs in light sources have become popular. Such an LED lamp has a base that can be attached to a socket of an existing device, and is used as a replacement lamp (for example, refer to Japanese Patent Laid-Open Publication No. Hei.

又,鹵素燈泡被廣泛使用作為聚光燈用光源,也提案一種以代替該鹵素燈泡為目的之LED燈。此種LED燈,為了得到近似於鹵素燈泡的配光,提案一種如下的構造。 Further, a halogen bulb is widely used as a light source for a spotlight, and an LED lamp for the purpose of replacing the halogen bulb has also been proposed. In order to obtain a light distribution similar to that of a halogen bulb, such an LED lamp has the following structure.

亦即,提案一種在後端具備燈頭的承座內收容LED,設置供覆蓋形成在該承座之前端的開口的覆蓋構件,在該覆蓋構件,設置從承座之前端朝前方側延伸的側壁部,該側壁部是構成可朝外部透過來自LED之照射光的構造(例如:參照專利文獻3)。藉由該構造的LED燈,通過覆蓋構件的側壁部,LED光朝周方向放射,配光接近鹵素燈泡。 That is, it is proposed to accommodate an LED in a socket having a base at a rear end, and a cover member for covering an opening formed at a front end of the socket, and a side wall portion extending from a front end of the socket toward a front side is provided in the cover member The side wall portion is configured to transmit the light from the LED to the outside (for example, see Patent Document 3). With the LED lamp of this configuration, the LED light is radiated toward the circumferential direction through the side wall portion of the covering member, and the light distribution is close to the halogen bulb.

又,亦提案一種LED燈,具備:具有底部及側面部的碗狀散熱器;設置在散熱器內之底部的LED;和控制該LED之射出光的光控制構件,光控制構件會將LED之射出光的一部分引導至散熱器的側面部,側面部是具有光透 過性的構造(例如:參照專利文獻4)。藉由該構造的LED燈,利用光控制構件一面形成所要的聚光配光、一面使LED之光的一部分引導到側面部使其透過,光也從該側面部放射,故LED燈之全體的配光接近鹵素燈泡。 Also, an LED lamp is proposed, comprising: a bowl-shaped heat sink having a bottom portion and a side portion; an LED disposed at a bottom portion of the heat sink; and a light control member for controlling light emitted from the LED, the light control member will be LED A part of the emitted light is guided to the side portion of the heat sink, and the side portion is light-transmissive The structure is excessive (for example, refer to Patent Document 4). According to the LED lamp of this structure, a desired light collecting and light distribution is formed on the light control member, and a part of the light of the LED is guided to the side surface portion to be transmitted, and light is radiated from the side surface portion, so that the entire LED lamp is The light distribution is close to the halogen bulb.

[先行技術文獻] [Advanced technical literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開第2009-4130號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-4130

[專利文獻2]國際公開第2009/063655號公報 [Patent Document 2] International Publication No. 2009/063655

[專利文獻3]日本實用新型登錄第3164202號公報 [Patent Document 3] Japanese Utility Model Registration No. 3164202

[專利文獻4]日本專利第4745467號公報 [Patent Document 4] Japanese Patent No. 4745467

但在日本專利文獻3的LED燈,若覆蓋構件之側壁部的高度方向之寬度(承座開口端部至蓋的正面端部之寬度)狹小的話,無法充分再現鹵素燈泡等的配光,且得不到均勻的配光。為了解決此問題,一旦加大側壁部之高度方向的寬度,從LED朝周方向放射的光就會原原本本的通過側壁部朝周方向照射,就會產生朝周方向的光量過多,而朝前方的照射光量亦下降的問題。 However, in the LED lamp of Japanese Patent Laid-Open No. 3, if the width of the side wall portion of the covering member in the height direction (the width from the end portion of the socket opening to the front end portion of the lid) is narrow, the light distribution such as a halogen bulb cannot be sufficiently reproduced. No uniform light distribution is obtained. In order to solve this problem, when the width of the side wall portion in the height direction is increased, the light radiated from the LED in the circumferential direction is originally irradiated to the circumferential direction through the side wall portion, and the amount of light in the circumferential direction is excessively increased, and the front side is excessively directed. The problem that the amount of illumination light also decreases.

因此,例如為了抑制朝周方向的照射光量,一旦使側壁部的光透過率下降,該部分就會產生被側壁部遮蔽而成為無益的光量增加,光的利用效率下降的問題。 Therefore, for example, in order to suppress the amount of light to be irradiated in the circumferential direction, when the light transmittance of the side wall portion is lowered, the portion is shielded by the side wall portion, and the amount of light which is unhelpful is increased, and the light use efficiency is lowered.

一方面,專利文獻4的LED燈,收納LED的散熱器之側面部會通光,與專利文獻3的LED燈相比,光可照射到周方向的寬廣範圍。但是,由於朝側面部之光的照射是藉由光控制構件控制,一旦LED之光藉由該光控制構件被照射到側面部的寬度範圍,結局就與上記專利文獻3的LED燈相同,光只會從側面部之限制的範圍被照射。 除此之外,專利文獻4的LED燈,為了一面控制LED之射出光,而且一面將該射出光的一部分分配到側面部,周方向的照射也要控制,因此需要光控制構件,藉由製作LED燈的配光,同時實現該配光的控制與對側面部之光的分配的光控制構件之設計並不容易。 On the other hand, in the LED lamp of Patent Document 4, the side surface portion of the heat sink in which the LED is housed is light-transmitted, and the light can be irradiated to a wide range in the circumferential direction as compared with the LED lamp of Patent Document 3. However, since the irradiation of the light toward the side surface portion is controlled by the light control member, once the light of the LED is irradiated to the width range of the side surface portion by the light control member, the result is the same as that of the LED lamp of Patent Document 3 above. It will only be illuminated from the limits of the side sections. In addition, in the LED lamp of Patent Document 4, in order to control the light emitted from the LED and distribute a part of the emitted light to the side surface portion, the irradiation in the circumferential direction is also controlled. Therefore, the light control member is required to be produced. It is not easy to design the light control member for the light distribution of the LED lamp while realizing the control of the light distribution and the distribution of the light to the side portion.

本發明是有鑑於上述之事情而完成的發明,其目的為提供一種可一面防止光之利用效率下降、一面抑制對周方向之光量的燈及照明器具。 The present invention has been made in view of the above-described circumstances, and an object of the invention is to provide a lamp and a lighting fixture capable of suppressing the amount of light in the circumferential direction while preventing a decrease in light use efficiency.

為達成上記目的,本發明提供一種燈,其特徵為:將凹面反射鏡與配置在該凹面反射鏡之底部用來放射光的發光元件設置在基體的一端部,使控制前記凹面反射鏡之配光的反射面具有光透過性。 In order to achieve the above object, the present invention provides a lamp characterized in that a concave mirror and a light-emitting element disposed at a bottom of the concave mirror for emitting light are disposed at one end of the base body, so as to control the concave mirror of the front surface. The reflecting surface of the light has light transparency.

又本發明,於上記燈中,其特徵為:以透明的基材形成前記凹面反射鏡,在該基材的內周面設置分光(dichroic)膜,形成前記反射面。 According to still another aspect of the invention, in the above-mentioned lamp, a front surface concave mirror is formed on a transparent base material, and a dichroic film is provided on an inner circumferential surface of the base material to form a front reflection surface.

又本發明,於上記燈中,其特徵為:在前記凹面反射 鏡的底部,設置圍繞前記發光元件之周圍,且使前記發光元件之光射入的非反射面之頸部。 According to the present invention, in the above lamp, the feature is: concave reflection in the front At the bottom of the mirror, a neck portion surrounding the periphery of the light-emitting element and having the non-reflecting surface on which the light of the light-emitting element is incident is placed.

又本發明,於上記燈中,其特徵為:前記基材的外周面具有光擴散性。 Further, in the above-described lamp, the outer peripheral surface of the base material has light diffusibility.

又本發明,於上記燈中,其特徵為:具備閉塞前記凹面反射鏡之先端開口的透鏡。 According to still another aspect of the invention, in the above lamp, the lens includes a lens that closes a front end opening of the concave mirror.

又本發明,於上記燈中,其特徵為:設有前記發光元件、以及前記凹面反射鏡,將由熱傳導性材製成的基底構件配備在前記基體的一端部,在該基底構件設置吸熱(heat mass)部。 According to still another aspect of the invention, in the above-mentioned lamp, a front light-emitting element and a front surface concave mirror are provided, and a base member made of a heat conductive material is provided at one end portion of the front substrate, and heat is provided in the base member. Mass) department.

又本發明,於上記燈中,其特徵為:前記基底構件具備突出於前記基體之周方向的緣部,在該突出的緣部,一體設置朝著與前記周方向略直交的方向延伸的前記吸熱部;設置覆蓋前記吸熱部之露出部分的吸熱蓋,前記吸熱蓋具有電性絕緣性,而且具有比前記吸熱部還低的熱傳導率。 According to still another aspect of the invention, in the above-described lamp, the base member includes an edge portion that protrudes in a circumferential direction of the front substrate, and the edge portion of the protrusion is integrally provided with a front portion that extends in a direction slightly orthogonal to the front circumferential direction. a heat absorbing portion; a heat absorbing cover covering an exposed portion of the heat absorbing portion of the front surface, wherein the heat absorbing cover has electrical insulation properties and has a lower thermal conductivity than the heat absorbing portion.

又為達成上記目的提供一種照明器具,其特徵為:將設有控制配光的反射面且使該反射面具有透過射入光之一部分的光透過性之凹面反射鏡,與配置在該凹面反射鏡之底部來放射光的發光元件,設置在具備對器具設置處之安裝部的殼體,在前記殼體設置對前記發光元件供給點燈電力的電源電路。 Further, in order to achieve the above object, a lighting fixture is provided, characterized in that a reflecting surface for controlling light distribution is provided, and the reflecting surface has a light-transmitting concave mirror that transmits a part of the incident light, and is disposed on the concave reflecting surface. A light-emitting element that emits light at the bottom of the mirror is provided in a casing having a mounting portion for mounting the device, and a power supply circuit for supplying lighting power to the front light-emitting device is provided in the front casing.

又本發明,於上記照明器具中,其特徵為:具備由安裝著前記發光元件之熱傳導性材製成的基底構件,在前記 基底構件的背側,設置與前記殼體熱性結合的散熱片。 According to still another aspect of the invention, in the lighting device of the present invention, the base member is provided with a heat conductive material to which the light-emitting element is mounted, On the back side of the base member, a heat sink that is thermally coupled to the front housing is provided.

又本發明,於上記照明器具中,其特徵為:具備由安裝著前記發光元件之熱傳導性材製成的基底構件,前記基底構件具備吸熱部。 Further, according to the present invention, in the above lighting fixture, the base member is provided with a heat conductive material to which the light-emitting element is mounted, and the base member includes a heat absorbing portion.

又本發明,於上記照明器具中,其特徵為:在前記凹面反射鏡的底部,設置圍繞前記發光元件之周圍,且使前記發光元件之光射入的非反射面之頸部。 According to still another aspect of the invention, in the lighting device of the present invention, the neck portion of the non-reflecting surface that surrounds the light-emitting element and the light of the light-emitting element is incident on the bottom of the front-surface concave mirror.

又本發明,於上記照明器具中,其特徵為:前記殼體形成筒狀,利用前記基底構件閉塞前記殼體之端部的開口。 According to still another aspect of the invention, in the above lighting device, the front housing is formed in a tubular shape, and the opening of the end portion of the front housing is closed by the front base member.

再者,該明細書中,包含2011年3月3日申請的日本國專利申請,特願第2011-45903號、及2011年1月10日申請的日本國專利申請,特願第2011-24160的所有內容。 In addition, this detailed list includes the Japanese patent application filed on March 3, 2011, Japanese Patent Application No. 2011-45903, and January 10, 2011, and Japanese Patent Application No. 2011-24160 All content.

根據本發明,使凹面反射鏡的反射面具有光透過性,故透過反射面之光會朝周方向放射,可實現接近鹵素燈泡的配光。特別是使得控制配光之反射面具有光透過性,故不使用其它構件,就能使發光元件的光射入到反射面,在周方向寬廣的範圍放射光。除此之外,發光元件的放射光中,未透過反射面的光,會略全部應用到主要之照射方向的光軸方向之照射,故可抑制照明效率下降。 According to the present invention, since the reflecting surface of the concave reflecting mirror has light transmittance, light transmitted through the reflecting surface is radiated in the circumferential direction, and light distribution close to the halogen bulb can be realized. In particular, since the reflecting surface for controlling the light distribution has light transmittance, the light of the light emitting element can be incident on the reflecting surface without using other members, and the light can be radiated in a wide range in the circumferential direction. In addition, in the emitted light of the light-emitting element, light that has not passed through the reflecting surface is slightly applied to the direction of the optical axis in the main irradiation direction, so that the deterioration of the illumination efficiency can be suppressed.

以下參照圖面,針對本發明之實施形態做說明。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

在以下的實施形態中,構成光源之發光元件的一例,雖是以LED為例示之,但本發明並不限於此,例如亦可為有機EL等之其它發光元件。 In the following embodiments, an example of the light-emitting element constituting the light source is exemplified by an LED. However, the present invention is not limited thereto, and may be another light-emitting element such as an organic EL.

[第1實施形態] [First Embodiment]

第1圖是有關本實施形態的LED燈1之全體立體圖,第1圖(A)是上面立體圖、第1圖(B)是下面立體圖。又,第2圖是表示LED燈1之外觀構成的圖,第2圖(A)是平面圖,第2圖(B)是側面圖、第2圖(C)是底面圖。第3圖是表示LED燈1之內部構成的剖面圖。 Fig. 1 is a perspective view of the entire LED lamp 1 according to the present embodiment. Fig. 1(A) is a top perspective view, and Fig. 1(B) is a bottom perspective view. 2 is a plan view showing an external configuration of the LED lamp 1. FIG. 2(A) is a plan view, FIG. 2(B) is a side view, and FIG. 2(C) is a bottom view. Fig. 3 is a cross-sectional view showing the internal structure of the LED lamp 1.

LED燈1是構成形狀及光學特性與既存的鹵素燈泡或白熾燈泡略相同,可作為替代既存的燈泡使用。 The LED lamp 1 has the same shape and optical characteristics as the existing halogen bulb or incandescent bulb, and can be used as an alternative to the existing bulb.

亦即,LED燈1,是如第1圖所示,具有略圓筒狀的基體2,在為該基體2之一端部的先端部2A(第3圖)設置發光部4,在為另一端部之終端部2B設有燈頭6。基體2是由陶瓷或樹脂等之具有絕緣性的材料形成。燈頭6,具備:切開螺合在燈座(圖未表示)之螺紋脊部的筒狀套管6A;和介設著絕緣部6B設置在該套管6A之端部的頂部的接觸片(eyelet)6C,該些套管6A及接觸片6C,是構成可安裝在既存之燈座的形狀尺寸。藉此,該LED燈1,可在天花板、壁面安裝於既設的燈座,且可作為替 代既存的鹵素燈泡或白熾燈泡使用。 In other words, the LED lamp 1 has a substantially cylindrical base body 2 as shown in Fig. 1, and the light-emitting portion 4 is provided at the tip end portion 2A (Fig. 3) of one end portion of the base body 2, and is the other end. The base portion 2B of the portion is provided with a base 6. The base 2 is formed of an insulating material such as ceramic or resin. The base 6 includes: a cylindrical sleeve 6A that is cut into a threaded ridge of a socket (not shown); and a contact piece (eyelet) that is disposed at the top of the end of the sleeve 6A with an insulating portion 6B 6C, the sleeve 6A and the contact piece 6C are formed in a shape size that can be mounted on an existing lamp holder. Thereby, the LED lamp 1 can be mounted on the ceiling and the wall surface in the existing lamp holder, and can be used as an alternative Use on behalf of existing halogen or incandescent bulbs.

發光部4,是在光源配備LED10,如第3圖所示,搭載LED10之點燈所需的驅動電路或電源電路等之電路的電路基板12,是收容在基體2的內部。電路基板12的電源電路與燈頭6的套管6A、及接觸片6C,是各自電性連接,將燈頭6安裝在燈座,通過燈頭6的套管6A、及接觸片6C,從燈座將電力供給到電路基板12的電源電路。 The light-emitting unit 4 is a circuit board 12 in which a light source is provided with an LED 10, and as shown in FIG. 3, a circuit such as a drive circuit or a power supply circuit required for lighting the LED 10 is housed inside the base 2. The power supply circuit of the circuit board 12 and the sleeve 6A of the base 6 and the contact piece 6C are electrically connected to each other, and the base 6 is mounted on the socket, passes through the sleeve 6A of the base 6, and the contact piece 6C, from which the socket is Power is supplied to the power supply circuit of the circuit substrate 12.

又,若針對發光部4的構成做詳述,即如第3圖所示,發光部4,具備:上記LED10;安裝基底構件16;凹面反射鏡18;和菲涅爾透鏡20。 Further, as for the configuration of the light-emitting portion 4, as shown in Fig. 3, the light-emitting portion 4 includes an upper LED 10, a mounting base member 16, a concave mirror 18, and a Fresnel lens 20.

於LED10使用放射白色光之表面安裝型的LED封裝體。亦即,LED10,雖省略圖示,但具備:LED晶片;和形成有收納LED晶片之收納凹處之平面視略矩形的薄型封裝體,LED晶片是利用矽樹脂等之透明樹脂密封在封裝體的收納凹處。在該透明樹脂之中,分散著作為經由從LED晶片放射的光被激發而放射與LED晶片相異的發光色之光的波長轉換材料之螢光體(螢光顏料、螢光染料等),藉由LED晶片的光與螢光體的光混合,得到白色。 A surface mount type LED package that emits white light is used for the LED 10. In other words, the LED 10 includes an LED chip and a thin package having a rectangular shape in which a housing recess for accommodating the LED chip is formed, and the LED chip is sealed in the package by a transparent resin such as silicone resin. Storage recess. Among the transparent resins, a dispersion (a fluorescent pigment, a fluorescent dye, or the like) of a wavelength conversion material that emits light of a luminescent color different from an LED wafer by excitation of light emitted from an LED wafer is dispersed. The light from the LED chip is mixed with the light of the phosphor to obtain white color.

安裝基底構件16,如第3圖所示,是作為凹面反射鏡18的支撐、向上載置上記LED10之發光面的底座、LED10的散熱片、以及吸熱功能的構件。 As shown in Fig. 3, the base member 16 is a member that serves as a support for the concave mirror 18, a base on which the light-emitting surface of the LED 10 is placed, a heat sink of the LED 10, and a heat absorbing function.

亦即,安裝基底構件16,具備:上面視略圓形之板狀的圓板部30;突出於該圓板部30之略中央上面的切頭狀之底座部32;和在圓板部30之全周而設置的吸熱部34 ,藉由具有高熱傳導性的例如鋁材等之金屬材一體成形。 That is, the base member 16 is mounted, and has a disk portion 30 having a substantially circular plate shape, a base portion 32 projecting from a substantially central portion of the disk portion 30, and a disk portion 30. The heat absorbing portion 34 provided throughout the circumference It is integrally formed by a metal material such as aluminum material having high thermal conductivity.

在圓板部30,於表側的主表面側設有LED10、及凹面反射鏡18,於背側的主表面略垂直的設有基體2。圓板部30,是閉塞基體2的先端部2A,其緣部具有朝周方向突出到基體2之先端部2A之外的直徑,在該突出的緣部,於全周,沿著基體2的外周面朝上下(垂直於周方向的方向)延伸的後述之吸熱部34是設成一體。 In the disc portion 30, the LED 10 and the concave mirror 18 are provided on the main surface side of the front side, and the base 2 is provided on the main surface on the back side. The disc portion 30 is a tip end portion 2A of the occlusion base 2, and has an edge portion having a diameter protruding outward in the circumferential direction to the tip end portion 2A of the base body 2, and at the edge portion of the projection, along the entire circumference, along the base body 2 The heat absorbing portion 34, which will be described later, extends to the upper and lower sides (the direction perpendicular to the circumferential direction) is integrally formed.

底座部32是載置LED10,一體設置在圓板部30之表側的主表面之略中央的上面視略圓形的凸狀部,在其上面設有嵌入上記LED10的嵌入孔32A。LED10是嵌入到嵌入孔32A,LED10的發熱是從LED10之底面及側面的兩方移動到底座部32,達到散熱效率的提升。又,在底座部32,於兩處設有上下貫通的貫通孔32B,從基體2之電路基板12開始延伸的正電位及負電位的各引線是通過各貫通孔32B連接到LED10。 The base portion 32 is a convex portion having a substantially circular shape on the upper surface of the main surface of the front side of the disc portion 30, and an insertion hole 32A in which the LED 10 is embedded. The LED 10 is embedded in the insertion hole 32A, and the heat generated by the LED 10 is moved from the bottom surface and the side surface of the LED 10 to the base portion 32, thereby achieving an improvement in heat dissipation efficiency. Further, in the base portion 32, through holes 32B penetrating vertically are provided at two places, and the leads of the positive potential and the negative potential extending from the circuit board 12 of the base 2 are connected to the LEDs 10 through the respective through holes 32B.

上記吸熱部34,是以圓板部30的緣部,沿著基體2之中心軸K朝上下延伸形成高度寬W的側壁,作為足以供吸收LED10之發熱的吸熱(熱容量)功能。又,吸熱部34的下端部34A,是形成接受基體2之先端部2A的插入開口39。在基體2與安裝基底構件16之間,無間隙的填充著接著用的樹脂劑38而接著、密封。 The heat absorbing portion 34 is a side wall of the disk portion 30 that extends vertically along the central axis K of the base 2 to form a side wall having a height W, and functions as an endothermic (heat capacity) function for absorbing the heat generated by the LED 10. Further, the lower end portion 34A of the heat absorbing portion 34 is an insertion opening 39 that receives the tip end portion 2A of the receiving body 2. Between the base body 2 and the mounting base member 16, the resin agent 38 for subsequent use is filled without a gap, and then sealed.

基體2與安裝基底構件16的吸熱部34的間隙是3mm以下為佳,藉此,可防止手指從該間隙接觸到吸熱部34。 The gap between the base body 2 and the heat absorbing portion 34 of the mounting base member 16 is preferably 3 mm or less, whereby the finger can be prevented from coming into contact with the heat absorbing portion 34 from the gap.

又,吸熱部34的下端部34A是作為形成插入開口39,在該插入開口39插入基體2之先端部2A而固定的構成,故可縮短LED燈1的全長。 Further, the lower end portion 34A of the heat absorbing portion 34 is configured to form the insertion opening 39, and the insertion opening 39 is inserted into the tip end portion 2A of the base body 2, so that the entire length of the LED lamp 1 can be shortened.

在此,吸熱部34的吸熱,是與容積成正比而增大,故增大高度寬W,或厚度T就能提高吸熱性能。此時,厚度T若大到在基體2的周方向(直交於中心軸K的方向),以平面視之,比後述之凹面反射鏡18還突出的那樣,就會招致LED燈1之尺寸的大型化,故希望厚度T限制在以平面視之,吸熱部34收整在凹面反射鏡18之先端開口18A的範圍內之厚度,且希望超過該限度要求吸熱的情形下,增大為高度寬W。但,增大高度寬W時,上端部34B為了不限制後述之凹面反射鏡18的形狀,在與該凹面反射鏡18的頸部42同程度之高度位置,限制到與反射面44之下端44A同程度的高度位置而延伸,吸熱不足部分以下端部34A朝下側延伸而補充為佳。 Here, since the heat absorption of the heat absorbing portion 34 is increased in proportion to the volume, the height width W or the thickness T can be increased to improve the heat absorbing performance. At this time, if the thickness T is so large as to be in the circumferential direction of the base 2 (the direction orthogonal to the central axis K), the size of the LED lamp 1 is caused to be larger than that of the concave mirror 18 to be described later in a plan view. Since the thickness is large, it is desirable that the thickness T is limited to a thickness in a plane view, and the heat absorbing portion 34 is rounded up in the range of the tip end opening 18A of the concave mirror 18, and it is desirable to increase the height to a width exceeding the limit requiring heat absorption. W. However, when the height width W is increased, the upper end portion 34B is restricted to the lower end 44A of the reflecting surface 44 at a height position similar to the neck portion 42 of the concave reflecting mirror 18 so as not to restrict the shape of the concave reflecting mirror 18 to be described later. It is preferable to extend the same height position and to supplement the lower end portion 34A toward the lower side.

再者,LED10的發熱,是被包含吸熱部34的安裝基底構件16吸收,從吸熱部34散熱到外部,但一部分會熱傳導到基體2,也會從該基體2的全體散熱到外部。 Further, the heat generated by the LED 10 is absorbed by the mounting base member 16 including the heat absorbing portion 34, and is radiated from the heat absorbing portion 34 to the outside. However, a part of the heat is radiated to the base 2, and heat is radiated from the entire base 2 to the outside.

在LED燈1,吸熱部34比基體2更突出於周方向,雖為使用者易於接觸之處,但包含該吸熱部34的安裝基底構件16是以具有高熱傳導性的金屬材形成,故導電性高,而且也因吸熱(heat mass)變高溫。因此,為了防止因與該吸熱部34接觸的感電和燙傷,在吸熱部34,設有由:具有高絕緣性,且具有熱傳導率比吸熱部34還低的 接著劑形成,覆蓋露出於吸熱部34之外側的露出部分全體的吸熱蓋46。 In the LED lamp 1, the heat absorbing portion 34 protrudes more than the base body 2 in the circumferential direction, and is easy for the user to contact. However, the mounting base member 16 including the heat absorbing portion 34 is formed of a metal material having high thermal conductivity, so that it is electrically conductive. It is high in nature and also heats up due to heat mass. Therefore, in order to prevent electric shock and burns due to contact with the heat absorbing portion 34, the heat absorbing portion 34 is provided with high insulating properties and lower thermal conductivity than the heat absorbing portion 34. The adhesive is formed to cover the heat absorbing cover 46 exposed to the entire exposed portion on the outer side of the heat absorbing portion 34.

藉此,縱使在提高吸熱部34的吸熱且提高LED10的冷卻性能之情形下,仍可防止因與該吸熱部34接觸的感電和燙傷。 Thereby, even in the case where the heat absorption of the heat absorbing portion 34 is increased and the cooling performance of the LED 10 is improved, the electric sensation and burns due to contact with the heat absorbing portion 34 can be prevented.

吸熱蓋46,是例如藉由插入成型設置在安裝基底構件16的周圍,藉此就能簡單且以吸熱蓋46不會脫落之程度強固的固定強度將吸熱蓋46固定在吸熱部34。 The heat absorbing cover 46 is provided around the mounting base member 16 by, for example, insert molding, whereby the heat absorbing cover 46 can be fixed to the heat absorbing portion 34 with a simple fixing strength that is strong enough that the heat absorbing cover 46 does not fall off.

在本實施形態中,相關的吸熱蓋46的厚度(周方向的肉厚),是以可防止1.2kV之耐電力與接觸時的燙傷之厚度(例如2mm)為下限,且以可安裝在既設之鹵素燈泡用的燈座承座(socket holder)等的周方向尺寸(例如4mm)為上限。 In the present embodiment, the thickness (the thickness of the circumferential direction) of the heat absorbing cover 46 is a lower limit (for example, 2 mm) which can prevent the electric power of 1.2 kV and the scald at the time of contact, and can be installed at the lower limit. The circumferential dimension (for example, 4 mm) of a socket holder or the like for a halogen bulb is an upper limit.

第4圖是放大表示第3圖中之凹面反射鏡18的圖。 Fig. 4 is an enlarged view showing the concave mirror 18 in Fig. 3.

凹面反射鏡18,是具有將LED10放射的光朝光軸方向反射,並將配光控制成形成光點配光的旋轉橢圓面的反射面44,並且該反射面44的全體具有光透過性構成,光也從該反射面44的全體對光軸朝著周方向放射,該光軸是設在與基體2之中心軸K略為同軸。 The concave reflecting mirror 18 is a reflecting surface 44 having a rotating elliptical surface that reflects the light emitted from the LED 10 in the optical axis direction and controls the light distribution to form a spot light distribution, and the entire reflecting surface 44 has a light transmissive structure. The light is also radiated from the entire surface of the reflecting surface 44 toward the optical axis in the circumferential direction, and the optical axis is provided to be substantially coaxial with the central axis K of the base 2.

具體上,凹面反射鏡18,是在底部中心具有底部開口18B,從該底部開口18B至先端開口18A的範圍D的內側面的略全面是作為形成反射面14。而在底部開口18B,一體設有朝後端側延伸的圓筒狀之頸部42。頸部42是配設在藉由安裝基底構件16的底座部32與外側的吸熱部 34形成的溝槽部50,且藉由填充在與吸熱部34之間的間隙的透明接著劑52接著。像這樣,在溝槽部50插入固定凹面反射鏡18,故可縮短LED燈10的全長。此時,溝槽部50的寬度,是以凹面反射鏡18與吸熱部34的間隙3mm以下的大小為佳,藉此,可防止手指從該間隙接觸到吸熱部34。 Specifically, the concave mirror 18 has a bottom opening 18B at the center of the bottom, and a slightly comprehensive inner surface of the range D from the bottom opening 18B to the front end opening 18A serves as the reflecting surface 14. On the other hand, the bottom opening 18B is integrally provided with a cylindrical neck portion 42 extending toward the rear end side. The neck portion 42 is disposed at a heat absorbing portion provided by the base portion 32 and the outer side of the base member 16 The groove portion 50 formed by 34 is followed by a transparent adhesive 52 filled in a gap with the heat absorbing portion 34. In this manner, since the concave mirror 18 is inserted and fixed in the groove portion 50, the entire length of the LED lamp 10 can be shortened. At this time, the width of the groove portion 50 is preferably a size of 3 mm or less of the gap between the concave mirror 18 and the heat absorbing portion 34, whereby the finger can be prevented from coming into contact with the heat absorbing portion 34 from the gap.

又,頸部42的長度L,是比自安裝基底構件16之底座部32的圓板部30起的高度更長,藉此頸部42會圍繞設置在底座部32之上面的LED10的周圍,在比該LED10之發光面10A更高的位置配置反射面44。更正確是,LED10的發光面,是周圍以頸部42圍繞的位置,而且由發光面放射的光是配置在射入到頸部42與反射面44之兩方的高度位置。 Moreover, the length L of the neck portion 42 is longer than the height from the disc portion 30 of the base portion 32 of the mounting base member 16, whereby the neck portion 42 surrounds the LED 10 disposed above the base portion 32. The reflecting surface 44 is disposed at a position higher than the light emitting surface 10A of the LED 10. More specifically, the light-emitting surface of the LED 10 is a position surrounded by the neck portion 42, and the light emitted from the light-emitting surface is disposed at a height position of both the neck portion 42 and the reflection surface 44.

凹面反射鏡18,具有電性絕緣性,與安裝基底構件16之間的熱電阻高(比安裝基底構件16低的熱傳導率),並且具備以對LED10之光呈透明的材料的透明樹脂或透明玻璃等形成的基材60,在該基材60,藉由對上記範圍D之內側面的全面具有光透過性的反射膜,形成反射面44而構成。藉由相關的基材60來構成凹面反射鏡18,露出於外部的凹面反射鏡18帶電,且可防止變高溫。 The concave mirror 18 is electrically insulating, has a high thermal resistance with the mounting base member 16 (lower thermal conductivity than the mounting base member 16), and is provided with a transparent resin or a transparent material which is transparent to the light of the LED 10. The base material 60 formed of glass or the like is formed by forming a reflecting surface 44 on the base material 60 by a reflection film having a light transmissive property on the inner surface of the upper surface of the range D. The concave mirror 18 is configured by the related substrate 60, and the concave mirror 18 exposed to the outside is charged, and high temperature can be prevented.

如第4圖所示,從LED10放射而射入到反射面44的光M1,是以該反射面44反射而成為反射光M2,通過先端開口18A放射到外部(朝中心軸K方向),而一部分會透過反射面44成為透過光M3朝周方向放射。 As shown in FIG. 4, the light M1 emitted from the LED 10 and incident on the reflecting surface 44 is reflected by the reflecting surface 44 and becomes reflected light M2, and is radiated to the outside through the tip end opening 18A (toward the central axis K direction). Some of them are radiated toward the circumferential direction by the transmitted light M3 through the reflecting surface 44.

藉此,透過光M3會從反射面44的略全面朝周方向放射,故可實現接近鹵素燈泡和白熾燈泡的配光。 Thereby, the transmitted light M3 is radiated from the slightly full surface of the reflecting surface 44 in the circumferential direction, so that light distribution close to the halogen bulb and the incandescent bulb can be achieved.

又,反射面44具有光透過性,故未透過反射面44的光會成為反射光M2,作為有益於中心軸K方向的主要照射光使用,故光的利用效率良好。 Further, since the reflecting surface 44 has light transparency, the light that has not passed through the reflecting surface 44 becomes the reflected light M2, and is used as the main irradiation light for the center axis K direction, so that the light utilization efficiency is good.

在凹面反射鏡18的頸部42,並未形成上記反射面44,依舊為無垢的透明材料。因而,從LED10射入到頸部42的光M4,是讓光透過頸部42而在吸熱部34之間的間隙,藉此補充在反射面44之下端(底部開口18B)部分朝周方向的光強度。進而,射入到頸部42的光M4的一部分,成為在凹面反射鏡18之基材60的內部傳播的傳播光M5,使基材60全體發光,有助於對周方向之放射光量的增加。 In the neck portion 42 of the concave mirror 18, the upper reflective surface 44 is not formed, and is still a non-scale transparent material. Therefore, the light M4 incident from the LED 10 to the neck portion 42 is a gap between the heat absorbing portions 34 that allows light to pass through the neck portion 42, thereby supplementing the portion of the lower end (bottom opening 18B) of the reflecting surface 44 toward the circumferential direction. brightness. Further, a part of the light M4 incident on the neck portion 42 becomes the propagating light M5 propagating inside the base material 60 of the concave reflecting mirror 18, and causes the entire base material 60 to emit light, contributing to an increase in the amount of emitted light in the circumferential direction. .

在凹面反射鏡18的先端開口18A設有上記菲涅爾透鏡20。菲涅爾透鏡20,是在樹脂製的圓板狀構件的表裏之任一,設有同心圓狀且所有角度不同的溝槽。在本實施形態中,以設有溝槽的主表面20A向著內側(LED10側),另一方的主表面20B向著外側的姿勢,將菲涅爾透鏡20設在凹面反射鏡18的先端開口18A。 A Fresnel lens 20 is provided on the tip end opening 18A of the concave mirror 18. The Fresnel lens 20 is one of the front and back of a resin-made disk-shaped member, and is provided with grooves that are concentric and have different angles. In the present embodiment, the Fresnel lens 20 is provided in the tip end opening 18A of the concave reflecting mirror 18 with the main surface 20A in which the groove is provided facing the inner side (the LED 10 side) and the other main surface 20B facing the outer side.

具體上,在凹面反射鏡18的先端部18A,形成嵌入菲涅爾透鏡20的段差部19,在該段差部19嵌入菲涅爾透鏡20且利用樹脂劑接著,菲涅爾透鏡20是以閉塞凹面反射鏡18的先端開口18A的狀態固定。 Specifically, at the tip end portion 18A of the concave reflecting mirror 18, a step portion 19 in which the Fresnel lens 20 is embedded is formed, and the Fresnel lens 20 is embedded in the step portion 19 and the resin agent is used, and the Fresnel lens 20 is occluded. The state of the tip end opening 18A of the concave mirror 18 is fixed.

相關的菲涅爾透鏡20是閉塞先端開口18A而設置, 射入到菲涅爾透鏡20的光M6中,射入到形成有溝槽的面20A的光M6的一部分,會向著反射面44反射,該反射的光M7會透過反射面44朝周方向放射,朝周方向的放射光量增加,光的利用效率提高。 The associated Fresnel lens 20 is provided to occlude the tip opening 18A, In the light M6 incident on the Fresnel lens 20, a part of the light M6 incident on the grooved surface 20A is reflected toward the reflection surface 44, and the reflected light M7 is radiated toward the circumferential direction through the reflection surface 44. The amount of radiation in the circumferential direction increases, and the utilization efficiency of light increases.

藉此,如第5圖所示,縱使是LED燈1,仍可實現接近鹵素燈泡之配光的配光。 Thereby, as shown in Fig. 5, even if it is the LED lamp 1, the light distribution close to the light distribution of the halogen bulb can be realized.

在此,在本實施形態中,形成凹面反射鏡18之反射面44的反射膜,是使用由介電多層膜製成的分光(dichroic)膜,使反射面44具有透過之光的波長選擇性。 Here, in the present embodiment, the reflection film forming the reflection surface 44 of the concave mirror 18 is a wavelength selective of the light transmitted through the reflection surface 44 by using a dichroic film made of a dielectric multilayer film. .

第6圖是表示反射膜之光學特性之一例的圖,第6圖(A)是表示反射膜之分光透過率,第6圖(B)是表示反射膜之分光反射率。 Fig. 6 is a view showing an example of the optical characteristics of the reflective film. Fig. 6(A) shows the spectral transmittance of the reflective film, and Fig. 6(B) shows the spectral reflectance of the reflective film.

反射面44的反射膜,是反射(略非透過)LED10之發光波長400nm~800nm的光,並且在波長400nm~800nm中,具有透過一部分之光的光學特性。可將適於藉由透過該反射膜之一部分的光照射的間接光之光朝周方向放射,並以來自反射面44的反射光為主要的照射光,從先端開口18A放射,故如第7圖所示,可維持與既存之LED燈同等的演色性。 The reflection film of the reflection surface 44 is light that reflects (slightly transmits) the LED 10 having an emission wavelength of 400 nm to 800 nm, and has optical characteristics of transmitting a part of the light at a wavelength of 400 nm to 800 nm. The light of the indirect light that is suitable for being irradiated by the light that is transmitted through one of the reflection films is radiated in the circumferential direction, and the reflected light from the reflection surface 44 is mainly used as the main illumination light, and is radiated from the tip end opening 18A. As shown in the figure, the same color rendering as the existing LED lamps can be maintained.

以形成反射面44的反射膜作為由介面多層膜製成的分光膜,即可具有透過光之波長選擇,雖然可配合照明設計等要求透過自由的波長,但介面多層膜,在透過光的進行方向產生波長依存性,故周方向的放射光例如照射到壁面等之際,產生色彩不均或照度不均。 The reflective film formed on the reflecting surface 44 can be selected as a light-splitting film made of an interlayer multilayer film, and can have a wavelength of transmitted light. Although it is required to transmit a free wavelength in accordance with an illumination design or the like, the interface multilayer film is subjected to light transmission. Since the wavelength dependence is generated in the direction, when the radiation in the circumferential direction is applied to the wall surface, for example, color unevenness or illuminance unevenness occurs.

因此,在凹面反射鏡18的外周面62,於該表面施行為了具有使透過光散射的光散射功能之例如壓花加工,藉此抑制朝周方向放射的光之色彩不均或照度不均。 Therefore, on the outer peripheral surface 62 of the concave reflecting mirror 18, for example, an embossing process having a light scattering function for scattering transmitted light is performed on the surface, thereby suppressing color unevenness or illuminance unevenness of light radiated in the circumferential direction.

如以上說明,藉由本實施形態,將凹面反射鏡18與配置在該凹面反射鏡18之底部開口18B用來放射光的發光元件之LED10設置在基體2的先端部2A,使凹面反射鏡18的反射面44之全面具有光透過性的LED燈1。 As described above, according to the present embodiment, the concave reflecting mirror 18 and the LED 10 of the light-emitting element for emitting light disposed in the bottom opening 18B of the concave reflecting mirror 18 are provided at the tip end portion 2A of the base 2, so that the concave reflecting mirror 18 is provided. The LED light 1 having the light transmissive property of the reflecting surface 44 is integrated.

藉此,透過光會從反射面44的略全面朝LED10的周方向放射,故可實現接近鹵素燈泡和白熾燈泡的配光。尤其,反射面44具有光透過性,未透過反射面44的光則成為反射光而應用於主要照射方向之光軸方向的照射,縱使抑制透過光量仍不會產生浪費,故光的利用效率良好。 Thereby, the transmitted light is radiated from the slightly more comprehensive direction of the reflecting surface 44 toward the circumferential direction of the LED 10, so that light distribution close to the halogen bulb and the incandescent bulb can be achieved. In particular, the reflecting surface 44 has light transmittance, and the light that is not transmitted through the reflecting surface 44 is reflected light and is applied to the optical axis direction of the main irradiation direction. Even if the amount of transmitted light is suppressed, waste is not generated, and the light utilization efficiency is good.

又藉由本實施形態,以透明的基材60形成凹面反射鏡18,在該基材60的內周面設置分光膜形成反射面44,符合來自照明設計的要求等,可簡單且自由的選擇朝周方向透過之光的波長,還可簡單的製作周方向之照射光顏色不同的LED燈1的變化(barishon)。 According to the present embodiment, the concave reflecting mirror 18 is formed on the transparent base material 60, and the spectroscopic film is formed on the inner peripheral surface of the base material 60 to form the reflecting surface 44, which meets the requirements from the lighting design, and can be easily and freely selected. The wavelength of the light transmitted in the circumferential direction can also easily produce a barishon of the LED lamp 1 having different illumination colors in the circumferential direction.

又藉由本實施形態,凹面反射鏡18的基材60的外周面62,藉由壓花加工等具有光擴散性,故縱使利用由介電多層膜製成的分光膜形成反射面44,仍可抑制朝周方向放射的光之色彩不均或照度不均。 According to the present embodiment, the outer peripheral surface 62 of the base material 60 of the concave reflecting mirror 18 has light diffusibility by embossing or the like. Therefore, even if the reflecting surface 44 is formed by the spectral film made of the dielectric multilayer film, the reflecting surface 44 can be formed. It suppresses uneven color or illuminance unevenness of light emitted in the circumferential direction.

又藉由本實施形態,成為具備閉塞凹面反射鏡18的先端開口18A的菲涅爾透鏡20的構成,故可將在菲涅爾透鏡20之背面反射的光成為朝周方向的照射光就可效率 良好的利用。 According to the present embodiment, the Fresnel lens 20 having the tip end opening 18A of the concave mirror 18 is closed. Therefore, the light reflected on the back surface of the Fresnel lens 20 can be made to be irradiated in the circumferential direction. Good use.

又藉由本實施形態,成為在板狀基底構件之圓板部30的表側之主表面設置LED10及凹面反射鏡18,在圓板部30的背側設置筒狀基體2,使圓板部30的緣部突出於基板2的周方向(與中心軸直交的方向),在該突出之緣部的全周設置沿著基體2的外周面延伸的吸熱部34,且設置覆蓋該吸熱部34之露出部分的吸熱蓋46的LED燈1。 According to the present embodiment, the LED 10 and the concave mirror 18 are provided on the main surface of the front side of the disc portion 30 of the plate-like base member, and the cylindrical base 2 is provided on the back side of the disc portion 30, so that the disc portion 30 is provided. The edge portion protrudes in the circumferential direction of the substrate 2 (the direction orthogonal to the central axis), and the heat absorbing portion 34 extending along the outer circumferential surface of the base 2 is provided on the entire circumference of the protruding edge portion, and the exposure covering the heat absorbing portion 34 is provided. Part of the LED lamp 1 of the heat absorbing cover 46.

藉由該構成,可將LED10的發熱通過圓板部30傳導到吸熱部34且效率良好的進行處理,並且確保接觸到吸熱部34時的安全性。 With this configuration, heat generation of the LEDs 10 can be conducted to the heat absorbing portion 34 through the disk portion 30, and the processing can be performed efficiently, and the safety when contacting the heat absorbing portion 34 can be ensured.

尤其,吸熱蓋46,具有電性絕緣性、以及熱傳導率比吸熱部34更低,可防止接觸時的感電及燙傷。 In particular, the heat absorbing cover 46 has electrical insulation properties and a lower thermal conductivity than the heat absorbing portion 34, and can prevent electric shock and burns during contact.

再者,有關該第1實施形態,在不脫離本發明之主旨的範圍當然可任意的變形及應用。 Furthermore, it is a matter of course that the first embodiment can be arbitrarily modified and applied without departing from the scope of the invention.

[第2實施形態] [Second Embodiment]

第1實施形態說明的LED燈1,在作為設有燈頭6的燈本體之基體2之中,收納著搭載LED10之電源電路等之電路的電路基板12。因此,因基體2之空間(space)的限制,電源電路的動力能量(power capacity)增大很不容易,成為LED燈1之光量的高輸出化之弊害。 In the LED lamp 1 described in the first embodiment, a circuit board 12 on which a circuit such as a power supply circuit of the LED 10 is mounted is housed in the base 2 of the lamp body in which the base 6 is provided. Therefore, due to the limitation of the space of the substrate 2, the power capacity of the power supply circuit is greatly increased, which is a disadvantage of the high output of the amount of light of the LED lamp 1.

於是在本實施形態中,針對電源電路的動力能量之增大容易的照明器具做說明。再者,在本實施形態參照的各 圖面中,在與第1實施形態說明的構件相同的構件附上相同的符號,省略說明。 Therefore, in the present embodiment, a lighting fixture that is easy to increase the power energy of the power supply circuit will be described. Furthermore, each of the referenced in this embodiment In the drawings, the same members as those described in the first embodiment are denoted by the same reference numerals, and their description is omitted.

第8圖是表示有關本實施形態的LED照明器具100之平面、底面、正面、及側面的圖,第8圖(A)是平面圖、第8圖(B)是底面圖、第8圖(C)是正面圖、以及第8圖(D)是側面圖。又第9圖是表示LED照明器具100之內部構成的剖面圖。 Fig. 8 is a view showing a plane, a bottom surface, a front surface, and a side surface of the LED lighting apparatus 100 according to the embodiment. Fig. 8(A) is a plan view, and Fig. 8(B) is a bottom view and a eighth view (C). ) is a front view, and Fig. 8 (D) is a side view. FIG. 9 is a cross-sectional view showing the internal structure of the LED lighting apparatus 100.

該LED照明器具100,是與第1實施形態的LED燈1相同,配光與應用於聚光用光源的既存鹵素燈泡略相同的構成,可取代鹵素燈泡利用在聚光照明。 The LED lighting apparatus 100 is the same as the LED light bulb 1 of the first embodiment, and has a configuration similar to that of the existing halogen bulb used for the light source for concentrating, and can be used for concentrating illumination instead of the halogen bulb.

亦即,LED照明器具100,如第8圖所示,具有略圓筒狀的基體102,在為該殼體102的一端部之先端部102A(第9圖)設置光朝該殼體102之中心軸K方向放射的發光部104,在為另一端部之終端部102B設置作為對器具設置處之安裝部的支撐具106所構成。 That is, as shown in FIG. 8, the LED lighting apparatus 100 has a substantially cylindrical base body 102, and is provided with light toward the housing 102 at the tip end portion 102A (Fig. 9) of one end portion of the housing 102. The light-emitting portion 104 radiated in the direction of the center axis K is provided with a support member 106 as a mounting portion for the device installation portion at the end portion 102B of the other end portion.

支撐具106,沿著設置在LED照明器具100的器具設置處之被稱為照明軌道(lighting rail)或配線管路軌導(duct rail)等之軌道(圖未表示)而滑動自如安裝來支撐上記殼體102。亦即,支撐具106,具備:具有卡合在軌道的卡止部108A的燈座108;和從燈座108延伸的中空之支撐棒110,支撐棒110的先端部110A是轉動自如連結在殼體102的終端部102B。對LED照明器具100的電力,是介設著設於燈座108之卡止部108A的電極108B(第8圖(B))而由軌道供給,通過經過支撐棒110之 中的配線(圖未表示)而傳導到殼體102。 The support member 106 is slidably mounted to support the above-mentioned track along a track (not shown) called a lighting rail or a duct rail provided at an appliance installation of the LED lighting fixture 100. Housing 102. That is, the support member 106 includes: a socket 108 having a locking portion 108A that is engaged with the rail; and a hollow support rod 110 extending from the socket 108. The tip end portion 110A of the support rod 110 is rotatably coupled to the housing. The terminal portion 102B of the body 102. The electric power of the LED lighting apparatus 100 is supplied from the rail via the electrode 108B (Fig. 8(B)) provided in the locking portion 108A of the socket 108, and passes through the support rod 110. The wiring (not shown) is conducted to the housing 102.

殼體102,由具有高熱傳導性的例如金屬材形成,於終端部102B設有轉動自如夾入支撐棒110之先端部110A的挾持部112,使殼體102相對於支撐棒110轉動,使發光部104的照射方向向著所要的方向。 The housing 102 is formed of, for example, a metal material having high thermal conductivity, and the end portion 102B is provided with a holding portion 112 that is rotatably inserted into the tip end portion 110A of the support rod 110, and the housing 102 is rotated relative to the support rod 110 to emit light. The direction of illumination of portion 104 is in the desired direction.

該殼體102,是形成與安裝著既存的鹵素燈泡之承座相同尺寸形狀。既存的承座,是形成鹵素燈泡從先端部插入的圓筒狀,且內裝螺合在該鹵素燈泡之燈頭的燈座,上記的軌導滑移自如的安裝來支撐鹵素燈泡。在該既存的承座,安裝附反射鏡的鹵素燈泡時,下側會自鹵素燈泡的反射鏡收納在承座,上側從該反射鏡朝外自先端部露出的構成。縱使本實施形態的LED照明器具100,仍可在構成外形與既存承座相同尺寸形狀的殼體102的先端部12A,以突出的狀態設置具備發光部104之凹面反射鏡18,故不僅配光外觀也與在既存承座安裝鹵素燈泡的照明器具相似。 The housing 102 is formed in the same size as the socket on which the existing halogen bulb is mounted. The existing socket is formed into a cylindrical shape in which a halogen bulb is inserted from the tip end, and a lamp holder screwed into the base of the halogen bulb is mounted, and the above-mentioned rail guide is slidably mounted to support the halogen bulb. When a halogen bulb with a mirror is attached to the existing holder, the lower side is housed in the holder from the mirror of the halogen bulb, and the upper side is exposed from the mirror toward the outside from the leading end portion. In the LED lighting apparatus 100 of the present embodiment, the concave end mirror 18 including the light-emitting portion 104 can be provided in a protruding state in the tip end portion 12A of the casing 102 having the outer shape and the same size as the existing socket. The appearance is similar to that of a lighting fixture in which a halogen bulb is installed in an existing holder.

發光部104與第1實施形態的發光部4相同具備LED10。在殼體102,如第11圖所示,收納著搭載LED10之點燈所需的驅動電路或電源電路等之電路的電路基板115。於電源電路176,連接著通過支撐具106的支撐棒110引入到殼體102的配線,電力通過該配線供給到電源電路176。電源電路176,根據該電力產生LED10的點燈電力,驅動電路控制之下,供給到該LED10。 The light-emitting unit 104 includes the LED 10 in the same manner as the light-emitting unit 4 of the first embodiment. As shown in FIG. 11, the casing 102 houses a circuit board 115 on which a circuit such as a drive circuit or a power supply circuit required for lighting of the LEDs 10 is housed. The power supply circuit 176 is connected to the wiring introduced into the casing 102 through the support bar 110 of the support 106, and electric power is supplied to the power supply circuit 176 through the wiring. The power supply circuit 176 generates the lighting power of the LED 10 based on the power, and supplies it to the LED 10 under the control of the drive circuit.

第10圖是放大表示發光部104的圖。 Fig. 10 is an enlarged view of the light emitting unit 104.

本實施形態的發光部104,具有與聚光光源用的既存鹵素燈泡同等的配光,如第9圖及第11圖所示,與第1實施形態的發光部104相同,具備:LED10;安裝基底構件116;杯狀的凹面反射鏡18;和菲涅爾透鏡20。在LED10,如第10圖所示,上面作為發光面10A而構成,使用光從該發光面10A放射的表面安裝型的LED封裝體。 The light-emitting unit 104 of the present embodiment has the same light distribution as the existing halogen bulb for the concentrating light source, and as shown in FIGS. 9 and 11 , similarly to the light-emitting unit 104 of the first embodiment, the LED 10 is provided; Base member 116; cup-shaped concave mirror 18; and Fresnel lens 20. As shown in FIG. 10, the LED 10 is configured as a light-emitting surface 10A, and a surface mount type LED package in which light is emitted from the light-emitting surface 10A is used.

本實施形態的安裝基底構件116,與第1實施形態相同,具備:上面視略圓形之板狀的圓板部130;突出於該圓板部130之略中央上面的切頭狀之底座部132;和在圓板部130之全周而設置的吸熱部134,藉由具有高熱傳導性的例如鋁材等之金屬材一體成形。又,在安裝基底構件116,設有覆蓋露出於吸熱部134之外側的露出部分全體的吸熱蓋146。 In the same manner as in the first embodiment, the mounting base member 116 of the present embodiment includes a disk-shaped disk portion 130 having a substantially circular shape on the upper surface, and a base portion having a tip-shaped shape projecting from the upper center of the disk portion 130. 132; and the heat absorbing portion 134 provided over the entire circumference of the disk portion 130 is integrally molded by a metal material such as aluminum material having high thermal conductivity. Further, the base member 116 is attached, and a heat absorbing cover 146 that covers the entire exposed portion exposed to the outside of the heat absorbing portion 134 is provided.

圓板部130,是形成吸熱部134位於殼體102之先端部102A之緣部103的大小,使得覆蓋該吸熱部134的吸熱蓋146密著於緣部103,安裝殼體構件116是安裝在該殼體102。殼體102的先端部102A的開口是藉由安裝基底構件116閉塞,防止塵埃等進入。 The disk portion 130 is formed to have a size in which the heat absorbing portion 134 is located at the edge portion 103 of the front end portion 102A of the casing 102 such that the heat absorbing cover 146 covering the heat absorbing portion 134 is adhered to the edge portion 103, and the mounting case member 116 is mounted on The housing 102. The opening of the tip end portion 102A of the casing 102 is closed by the mounting base member 116 to prevent entry of dust or the like.

又,吸熱蓋146,如第10圖所示,也覆蓋吸熱部134的下端部134A,介設在殼體102A與吸熱部134之間,達到兩者之間的電性絕緣。 Further, as shown in Fig. 10, the heat absorbing cover 146 also covers the lower end portion 134A of the heat absorbing portion 134, and is interposed between the casing 102A and the heat absorbing portion 134 to electrically insulate therebetween.

在此,吸熱部134的厚度T,以平面視之,希望吸熱部134限制在收整於凹面反射鏡118之先端開口18A的 範圍內之厚度,超過該限度要求吸熱的情形下,希望加大高度寬W。但,增大高度寬W時,吸熱部134的上端部134B為了不限制後述之凹面反射鏡18的形狀,在與該凹面反射鏡18的頸部42同程度之高度位置,限制到與反射面44之下端44A同程度的高度位置而延伸,吸熱不足部分,以下端部134A朝下側延伸而補充為佳。 Here, the thickness T of the heat absorbing portion 134 is viewed in a plan view, and it is desirable that the heat absorbing portion 134 is restricted to the tip end opening 18A of the concave mirror 118. In the case of the thickness within the range, in the case where the heat absorption is required beyond this limit, it is desirable to increase the height width W. However, when the height width W is increased, the upper end portion 134B of the heat absorbing portion 134 is restricted to the reflecting surface at the same height as the neck portion 42 of the concave reflecting mirror 18 so as not to restrict the shape of the concave reflecting mirror 18 to be described later. The lower end 44A of 44 is extended at the same height position, and the heat absorbing portion is insufficient, and the lower end portion 134A is extended toward the lower side to be supplemented.

LED10的發熱,是傳導到包含吸熱部134的安裝基底構件116,蓄積在吸熱部134朝外部散熱,但該LED照明器具100,是構成發熱亦從安裝基底構件116朝殼體102之側積極的傳導。 The heat generated by the LED 10 is transmitted to the mounting base member 116 including the heat absorbing portion 134, and is accumulated in the heat absorbing portion 134 to dissipate heat to the outside. However, the LED lighting device 100 is configured to generate heat from the mounting base member 116 toward the side of the housing 102. Conduction.

亦即,若針對殼體102的內部構造做說明,即如前揭第9圖所示,在殼體102之中,將內部分隔成先端部102A之側與終端部102B之側的分隔板115A是一體設置。在以分隔板115A分隔的終端部102B之側,設有上記挾持部112,先端部102A之側作為收納電路基板115的基板收納容器172而構成。分隔板115構成基板收納容器172的底面,在該分隔板115A以立設狀態收納電路基板115,且填充著填充劑171。填充劑171具有高電性絕緣性、以及熱傳導性,電路基板115的發熱是通過填充劑171傳熱到殼體102,從殼體102的表面散熱。 That is, if the internal structure of the casing 102 is described, that is, as shown in the above-mentioned ninth aspect, in the casing 102, the inside is partitioned into a partitioning plate on the side of the leading end portion 102A and the side of the terminal portion 102B. The 115A is an integrated setting. On the side of the end portion 102B partitioned by the partition plate 115A, the above-described grip portion 112 is provided, and the side of the tip end portion 102A is configured as a substrate storage container 172 that houses the circuit board 115. The partition plate 115 constitutes the bottom surface of the substrate storage container 172, and the circuit board 115 is housed in the vertical state in the partition plate 115A, and the filler 171 is filled. The filler 171 has high electrical insulating properties and thermal conductivity, and heat generated by the circuit board 115 is transferred to the casing 102 by the filler 171 to dissipate heat from the surface of the casing 102.

一方面,在上記安裝基底構件116之圓板部130的背面密著設置著散熱片170,該散熱片170是從殼體102的先端部102A押入到填充劑171之中,介設著填充劑171熱性結合在殼體102。散熱片170,是包含該底座部132 呈面接觸在圓板部130的底座部132之正下方。藉此,LED10的發熱,會從底座部132效率良好的傳熱到殼體102側的散熱片170,通過填充劑171傳熱到殼體102,從殼體102的表面散熱。 On the other hand, a heat sink 170 is attached to the back surface of the circular plate portion 130 on which the base member 116 is mounted, and the heat sink 170 is pushed into the filler 171 from the tip end portion 102A of the casing 102, and a filler is interposed therebetween. 171 is thermally bonded to the housing 102. The heat sink 170 includes the base portion 132 The surface contact is directly under the base portion 132 of the circular plate portion 130. Thereby, heat generated by the LED 10 is efficiently transferred from the base portion 132 to the heat sink 170 on the casing 102 side, and is transferred to the casing 102 by the filler 171 to dissipate heat from the surface of the casing 102.

像這樣,在LED照明器具100,安裝基底構件116具有蓄積LED10之發熱的吸熱部134,除此之外,具備傳熱到殼體102之側而散熱的散熱片170,將LED10的發熱效率良好的散熱,得到高冷卻性能。藉此,LED10的高輸出化變容易,高輸出的LED照明器具100就很容易實現。 As described above, in the LED lighting apparatus 100, the mounting base member 116 has the heat absorbing portion 134 that accumulates heat generated by the LEDs 10, and further includes the heat sink 170 that transfers heat to the side of the casing 102 to dissipate heat, and the LED 10 is efficiently heated. The heat dissipation gives high cooling performance. Thereby, the high output of the LED 10 is facilitated, and the high-output LED lighting apparatus 100 can be easily realized.

又,一面在外形與內裝安裝著既存鹵素燈泡之燈頭的燈座之承座相同尺寸形狀的殼體102,設置凹面反射鏡18、一面在該殼體102內裝LED10的電源電路176,故與在模仿鹵素燈泡的LED燈內裝電源電路176的情形相比,可擴大收納電源電路176的空間。藉此,一面模仿鹵素燈泡的LED燈安裝在既存承座之狀態的外觀形狀、一面構成內裝大電容的電源電路176而高輸出的LED照明器具100。 Further, the housing 102 having the same size and shape as the socket of the socket in which the base of the halogen bulb is mounted is provided with the concave mirror 18 and the power supply circuit 176 of the LED 10 mounted in the housing 102. The space in which the power supply circuit 176 is housed can be enlarged as compared with the case where the power supply circuit 176 is incorporated in the LED lamp that mimics the halogen bulb. In this way, the LED lighting device 100 which is mounted on the existing socket in the state in which the LED lamp of the halogen bulb is mounted is mounted on the power supply circuit 176 in which the large capacitor is housed.

本實施形態的凹面反射鏡18,是構造及光學特性略相同的構成,反射面44的光軸與殼體102之中心軸K略同軸地設置在該殼體102的先端部102A。 The concave reflecting mirror 18 of the present embodiment has a configuration in which the optical characteristics are slightly the same, and the optical axis of the reflecting surface 44 is provided coaxially with the central axis K of the casing 102 at the tip end portion 102A of the casing 102.

而且,相關的構成下,在LED照明器具100,構成具有與第1實施形態的LED燈1相同配光(第5圖)、及相同演色性(第6圖)。 Further, in the related configuration, the LED lighting apparatus 100 has the same light distribution (Fig. 5) and the same color rendering (Fig. 6) as the LED lamp 1 of the first embodiment.

如以上說明,藉由本實施形態,在具備對器具設置處 (本實施形態為軌道)之安裝部的燈座108之殼體102,設置對LED10供給點燈電力的電源電路176,故收納電源電路176的空間比習知的LED燈更大,電源電路176的動力能量之增大變容易,且高輸化變容易。 As described above, according to the present embodiment, the device is provided at the place where the appliance is provided. The casing 102 of the socket 108 of the mounting portion (the track of the present embodiment) is provided with the power supply circuit 176 for supplying the lighting power to the LED 10, so that the space for accommodating the power supply circuit 176 is larger than that of the conventional LED lamp, and the power supply circuit 176 The increase in the power energy becomes easy, and the high power transfer becomes easy.

又,藉由本實施形態,在由安裝著LED10之熱傳導性材製成的安裝基底構件116的背側,設置與殼體102熱性結合的散熱片170,故可將LED10的發熱從安裝基底構件116傳遞到殼體102,提高散熱性能。 Moreover, according to the present embodiment, the heat sink 170 thermally coupled to the casing 102 is provided on the back side of the mounting base member 116 made of the heat conductive material on which the LED 10 is mounted, so that heat generation of the LED 10 can be performed from the mounting base member 116. Transfer to the housing 102 to improve heat dissipation performance.

特別是藉由本實施形態,安裝基底構件116具備吸熱部134,故縱使在使用高輸出型之LED10的情形下,仍可在安裝基底構件116、及散熱片170的雙方充分的處理該LED10的發熱。 In particular, according to the present embodiment, since the mounting base member 116 is provided with the heat absorbing portion 134, even when the high-output type LED 10 is used, the heat of the LED 10 can be sufficiently processed in both the mounting base member 116 and the heat sink 170. .

又藉由本實施形態,成為在凹面反射鏡18的底部,設置圍繞LED10之周圍,且使LED10之光射入的非反射面之頸部42的構成。藉由該構成,凹面反射鏡18與殼體102的連接部分會經由射入到頸部42的光M4而發光,並且產生傳播到凹面反射鏡18之基材60的內部之傳播光M5而使基材60全體發光,故有助於對周方向之放射光量的増加,接近既存之鹵素燈泡的配光。 Further, according to the present embodiment, the neck portion 42 of the non-reflecting surface that surrounds the periphery of the LED 10 and that causes the light of the LED 10 to enter is provided at the bottom of the concave reflecting mirror 18. With this configuration, the connection portion of the concave mirror 18 and the casing 102 emits light via the light M4 incident on the neck portion 42, and the propagation light M5 which propagates to the inside of the substrate 60 of the concave mirror 18 is generated. Since the entire substrate 60 emits light, it contributes to the increase in the amount of radiation in the circumferential direction and is close to the light distribution of the existing halogen bulb.

又藉由本實施形態,成為利用安裝基底構件116閉塞殼體102之先端部102A的開口的構成,故不必另外設置閉塞該開口的構件,組裝變容易。 According to the present embodiment, since the opening of the tip end portion 102A of the casing 102 is closed by the attachment base member 116, it is not necessary to separately provide a member for closing the opening, and assembly becomes easy.

進而,成為藉由設置在安裝基底構件116之上面的電性絕緣性之凹面反射鏡18與沿著周緣而設的吸熱部134 ,防止手指侵入到該安裝基底構件116的上面,並且利用吸熱蓋146覆蓋露出於吸熱部134之外部的面的構成,故縱使安裝基底構件116是設置在殼體102之外,仍可阻止手指對安裝基底構件116的直接性接觸。 Further, the electrically insulating concave mirror 18 provided on the upper surface of the mounting base member 116 and the heat absorbing portion 134 provided along the peripheral edge are provided. The finger is prevented from intruding into the upper surface of the mounting base member 116, and the surface of the surface exposed to the outside of the heat absorbing portion 134 is covered by the heat absorbing cover 146. Therefore, even if the mounting base member 116 is disposed outside the housing 102, the finger can be blocked. Direct contact to the mounting base member 116.

又藉由本實施形態,以透明的基材60形成凹面反射鏡18,在該基材60的內周面設置由介面多層膜製成的分光膜形成反射面44,故符合來自照明設計的要求等,可簡單且自由的選擇透過周方向之光的波長,還可簡單的製作周方向之照射光顏色不同的LED照明器具100的變化(barishon)。 According to the present embodiment, the concave reflecting mirror 18 is formed on the transparent base material 60, and the reflecting surface 44 made of the interlayer multilayer film is formed on the inner peripheral surface of the base material 60 to form the reflecting surface 44, so that it meets the requirements from the lighting design. It is possible to easily and freely select the wavelength of the light passing through the circumferential direction, and it is also possible to easily produce a barishon of the LED lighting apparatus 100 having different illumination light colors in the circumferential direction.

又藉由本實施形態,凹面反射鏡18的基材60的外周面62,藉由壓花加工等具有光擴散性,故縱使利用由介電多層膜製成的分光膜形成反射面44,仍可抑制朝周方向放射的光之色彩不均或照度不均。 According to the present embodiment, the outer peripheral surface 62 of the base material 60 of the concave reflecting mirror 18 has light diffusibility by embossing or the like. Therefore, even if the reflecting surface 44 is formed by the spectral film made of the dielectric multilayer film, the reflecting surface 44 can be formed. It suppresses uneven color or illuminance unevenness of light emitted in the circumferential direction.

又藉由本實施形態,成為具備閉塞凹面反射鏡18的先端開口18A的菲涅爾透鏡20的構成,故可將在菲涅爾透鏡20之背面反射的光成為朝周方向的照射光就可效率良好的利用。 According to the present embodiment, the Fresnel lens 20 having the tip end opening 18A of the concave mirror 18 is closed. Therefore, the light reflected on the back surface of the Fresnel lens 20 can be made to be irradiated in the circumferential direction. Good use.

再者,有關該第2實施形態,在不脫離本發明之主旨的範圍可任意的變形及應用。 Further, the second embodiment can be arbitrarily modified and applied without departing from the scope of the invention.

例如在第2實施形態中,以將設置在安裝基底構件116之背面的散熱片170,介設著填充劑171而熱性間接的結合在殼體102的構造為例示之。但是不限於此,也可成為將散熱片170熱性直接結合在殼體120的構成。例如 ,如第11圖所示的LED照明器具200,也可成為將以面密著在殼體102的周面,直接傳熱的側壁270A,一體設在散熱片170的構成。藉此,減低由散熱片170直至殼體102的熱阻,故可更為提高LED10的散熱性能。 For example, in the second embodiment, the heat sink 170 provided on the back surface of the mounting base member 116 is exemplified by a structure in which the filler 171 is interposed and thermally coupled to the casing 102 indirectly. However, the present invention is not limited thereto, and the heat sink 170 may be thermally coupled directly to the casing 120. E.g The LED lighting apparatus 200 shown in FIG. 11 may be configured such that the side wall 270A that directly heats the surface of the casing 102 and is directly heat-conductive is provided on the heat sink 170. Thereby, the thermal resistance from the heat sink 170 to the casing 102 is reduced, so that the heat dissipation performance of the LED 10 can be further improved.

再者,在第11圖的構成中,殼體102是通過散熱片170與安裝基底構件160電性結合,故該殼體120是由電性絕緣性高的材料形成。 Further, in the configuration of Fig. 11, since the casing 102 is electrically coupled to the mounting base member 160 by the fins 170, the casing 120 is formed of a material having high electrical insulating properties.

又散熱片170若為與安裝基底構件116之背面熱性結合的構成,也可為與安裝基底構件116另一體、及一體的任一種。在安裝基底構件116的背面一體設置散熱片170,消除安裝基底構件116與散熱片170之間的熱阻,就能效率良好的對殼體102之側傳達LED10的發熱。 Further, the heat sink 170 may be thermally coupled to the back surface of the mounting base member 116, or may be formed integrally with the base member 116. The heat sink 170 is integrally provided on the back surface of the mounting base member 116, and the thermal resistance between the mounting base member 116 and the heat sink 170 is eliminated, so that the heat of the LED 10 can be efficiently transmitted to the side of the casing 102.

又例如,第2實施形態中,雖以安裝在軌道的LED照明器具100、200為例示之,但不限於此,也可為殼體2具備:直接或間接固定在壁或天花板等之設置面的安裝部,利用該安裝部固定在設置面的構成。 Further, for example, in the second embodiment, the LED lighting fixtures 100 and 200 attached to the rail are exemplified, but the present invention is not limited thereto, and the casing 2 may be directly or indirectly fixed to a mounting surface such as a wall or a ceiling. The mounting portion is fixed to the installation surface by the mounting portion.

1‧‧‧LED燈(燈) 1‧‧‧LED lights (lights)

2‧‧‧基體 2‧‧‧ base

2A、102A‧‧‧先端部(一端部) 2A, 102A‧‧‧ apex (one end)

3、103‧‧‧緣部 3, 103‧‧‧ edge

4、104‧‧‧發光部 4, 104‧‧‧Lighting Department

10‧‧‧LED(發光元件) 10‧‧‧LED (lighting element)

16、116‧‧‧安裝基底構件(基底構件) 16, 116‧‧‧Installation of base member (base member)

18‧‧‧凹面反射鏡 18‧‧‧ concave mirror

18A‧‧‧先端開口 18A‧‧‧ apex opening

18B‧‧‧底部開口(底部) 18B‧‧‧Bottom opening (bottom)

20‧‧‧菲涅爾透鏡(透鏡) 20‧‧‧ Fresnel lens (lens)

30、130‧‧‧圓板部(基底部) 30, 130‧‧‧ round plate (base)

32、132‧‧‧台座部 32, 132‧‧‧Deputy Department

34、134‧‧‧吸熱部 34, 134‧‧ ‧ heat absorption department

42‧‧‧頸部 42‧‧‧ neck

44‧‧‧反射面 44‧‧‧reflecting surface

46、146‧‧‧吸熱蓋 46, 146‧‧ ‧ heat cover

60‧‧‧基材 60‧‧‧Substrate

62‧‧‧外周面 62‧‧‧ outer perimeter

100、200‧‧‧LED照明器具(照明器具) 100, 200‧‧‧LED lighting equipment (lighting equipment)

102‧‧‧殼體 102‧‧‧ housing

106‧‧‧支撐具(安裝部) 106‧‧‧Support (installation department)

170‧‧‧散熱片 170‧‧‧ Heat sink

176‧‧‧電源電路 176‧‧‧Power circuit

K‧‧‧中心軸 K‧‧‧ central axis

第1圖是表示有關本發明之第1實施形態的LED燈之全體立體圖,(A)是上面立體圖、(B)是下面立體圖。 Fig. 1 is a perspective view showing an entire LED lamp according to a first embodiment of the present invention, wherein (A) is a top perspective view and (B) is a lower perspective view.

第2圖是表示LED燈之外觀構成之圖,(A)是平面圖,(B)是側面圖、(C)是底面圖。 Fig. 2 is a view showing the appearance of an LED lamp, wherein (A) is a plan view, (B) is a side view, and (C) is a bottom view.

第3圖是第2圖之A-A線的剖面圖。 Fig. 3 is a cross-sectional view taken along line A-A of Fig. 2.

第4圖是放大表示第3圖之凹面反射鏡的圖。 Fig. 4 is a view showing, in an enlarged manner, a concave mirror of Fig. 3.

第5圖是表示LED燈與鹵素燈泡之配光的圖。 Fig. 5 is a view showing the light distribution of the LED lamp and the halogen bulb.

第6圖是表示反射膜之光學特性之一例的圖,(A)是表示反射膜之分光透過率,(B)是表示反射膜之分光反射率。 Fig. 6 is a view showing an example of optical characteristics of a reflective film, wherein (A) shows the spectral transmittance of the reflective film, and (B) shows the spectral reflectance of the reflective film.

第7圖是表示本實施形態之LED燈、既存之LED燈及鹵素燈泡之發光振幅特性的圖。 Fig. 7 is a view showing the light emission amplitude characteristics of the LED lamp, the existing LED lamp, and the halogen bulb of the embodiment.

第8圖是表示有關本發明之第2實施形態的LED照明器具之平面、底面、正面、及側面的圖,(A)是平面圖、(B)是底面圖、(C)是正面圖、以及(D)是側面圖。 Fig. 8 is a plan view showing a plane, a bottom surface, a front surface, and a side surface of an LED lighting apparatus according to a second embodiment of the present invention, wherein (A) is a plan view, (B) is a bottom view, (C) is a front view, and (D) is a side view.

第9圖是表示LED照明器具之內部構成的剖面圖。 Fig. 9 is a cross-sectional view showing the internal structure of an LED lighting device.

第10圖是放大表示發光部的圖。 Fig. 10 is an enlarged view of a light-emitting portion.

第11圖是表示有關第2實施形態之變形例的LED照明器具之內部構成的剖面圖。 Fig. 11 is a cross-sectional view showing the internal structure of an LED lighting device according to a modification of the second embodiment.

1‧‧‧LED燈(燈) 1‧‧‧LED lights (lights)

2‧‧‧基體 2‧‧‧ base

2B‧‧‧終端部 2B‧‧‧End Department

4‧‧‧發光部 4‧‧‧Lighting Department

6‧‧‧燈頭 6‧‧‧ lamp holder

6A‧‧‧套管 6A‧‧‧ casing

18‧‧‧凹面反射鏡 18‧‧‧ concave mirror

18A‧‧‧先端開口 18A‧‧‧ apex opening

20‧‧‧菲涅爾透鏡(透鏡) 20‧‧‧ Fresnel lens (lens)

46‧‧‧吸熱蓋 46‧‧‧Heat cover

62‧‧‧外周面 62‧‧‧ outer perimeter

Claims (9)

一種燈,其特徵為:將凹面反射鏡與配置在該凹面反射鏡之底部用來放射光的發光元件設置在基體的一端部,使控制前記凹面反射鏡之配光的反射面具有光透過性。 A lamp characterized in that a concave reflecting mirror and a light emitting element disposed at a bottom of the concave reflecting mirror for emitting light are disposed at one end portion of the base body, so that a reflecting surface for controlling light distribution of the concave mirror is light transmissive. . 如申請專利範圍第1項所記載的燈,其中,以透明的基材形成前記凹面反射鏡,在該基材的內周面設置分光(dichroic)膜,形成前記反射面。 The lamp according to claim 1, wherein the front surface concave mirror is formed of a transparent base material, and a dichroic film is provided on an inner circumferential surface of the base material to form a front reflective surface. 如申請專利範圍第2項所記載的燈,其中,前記基材之外周面具有光擴散性。 The lamp according to the second aspect of the invention, wherein the outer peripheral surface of the substrate has light diffusibility. 如申請專利範圍第1項或第2項所記載的燈,其中,具備閉塞前記凹面反射鏡之前端開口的透鏡(lens)。 A lamp according to claim 1 or 2, further comprising a lens that closes an opening at a front end of the concave mirror. 如申請專利範圍第1項或第2項所記載的燈,其中,設有前記發光元件、以及前記凹面反射鏡,將由熱傳導性材製成的基底構件配備在前記基體的一端部,在該基底構件設置吸熱(heat mass)部。 A lamp according to claim 1 or 2, wherein a front light-emitting element and a front surface concave mirror are provided, and a base member made of a heat conductive material is provided at one end portion of the front substrate, The member is provided with a heat mass portion. 如申請專利範圍第5項所記載的燈,其中,前記基底構件具備突出於前記基體之周方向的緣部,在該突出的緣部,一體設置朝著與前記周方向略直交的方向延伸的前記吸熱部;設置覆蓋前記吸熱部之露出部分的吸熱蓋,前記吸熱蓋具有電性絕緣性,而且具有比前記吸熱部還低的熱傳導率。 The lamp according to claim 5, wherein the front base member includes an edge portion that protrudes in a circumferential direction of the front substrate, and the protruding edge portion is integrally provided to extend in a direction slightly orthogonal to the front circumferential direction. A heat absorbing portion is provided; a heat absorbing cover covering an exposed portion of the heat absorbing portion is provided, and the heat absorbing cover has electrical insulation properties and has a lower thermal conductivity than the heat absorbing portion. 一種照明器具,其特徵為:將設有控制配光的反 射面且具有使該反射面透過射入光之一部分的光透過性之凹面反射鏡,與配置在該凹面反射鏡之底部來放射光的發光元件,設置在具備對器具設置部位之安裝部的殼體,在前記殼體設置對前記發光元件供給點燈電力的電源電路。 A lighting fixture characterized in that: a counter for controlling light distribution is provided a light-emitting element having a light-transmitting concave reflecting mirror that transmits the reflecting surface to a portion of the incident light, and a light-emitting element that emits light at a bottom portion of the concave reflecting mirror is provided on the mounting portion provided with the device mounting portion. In the casing, a power supply circuit for supplying lighting power to the front light-emitting element is provided in the front casing. 如申請專利範圍第7項所記載的照明器具,其中,具備由安裝著前記發光元件之熱傳導性材製成的基底構件,在前記基底構件的背側,設置與前記殼體熱性結合的散熱片。 The lighting fixture according to claim 7, comprising a base member made of a heat conductive material to which the front light emitting element is attached, and a heat sink that is thermally coupled to the front housing is provided on the back side of the base member. . 如申請專利範圍第7項或第8項所記載的照明器具,其中,具備由安裝著前記發光元件之熱傳導性材製成的基底構件,前記基底構件具備吸熱部。 The lighting fixture according to claim 7 or 8, wherein the lighting fixture includes a base member made of a heat conductive material to which the light-emitting element is mounted, and the base member has a heat absorbing portion.
TW101106030A 2011-03-03 2012-02-23 Lamp and light apparatus TW201307750A (en)

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US5193896A (en) * 1992-01-13 1993-03-16 Seymour Oberlander Lighting device for personal use
CA2350787A1 (en) * 1998-11-18 2000-05-25 Eveready Battery Company, Inc. Portable lighting device
CN201021785Y (en) * 2007-01-26 2008-02-13 深圳市中电照明有限公司 A reflective light source using grid transparent veil
CN101526201A (en) * 2008-09-03 2009-09-09 依利高电器(中山)有限公司 LED lamp and heat radiating device thereof
CN201513837U (en) * 2009-02-26 2010-06-23 薛文艳 High-power LED tunnel lamp
JPWO2011010535A1 (en) * 2009-07-22 2012-12-27 帝人株式会社 LED lighting fixture
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