WO2013124926A1

WO2013124926A1 - Lamp

Info

Publication number: WO2013124926A1
Application number: PCT/JP2012/006827
Authority: WO
Inventors: 吉典覚野; 仕田　智; 松井　伸幸; 田村　哲志
Original assignee: パナソニック株式会社
Priority date: 2012-02-23
Filing date: 2012-10-25
Publication date: 2013-08-29
Also published as: JPWO2013124926A1; JP5276239B1; CN204284970U

Abstract

This lamp (1) is provided with: an LED module (10) having a mounting substrate (11) and an LED (12) mounted thereon; a cylindrical chassis (30) having the LED module (10) disposed at one end thereof; a base (50) disposed at the other end of the chassis (30); and a circuit unit (20) intervening on the power supply path leading from the base (50) to the LED module (10). The chassis (30) has a cylindrical main body part (31) comprising a resin, and a heat conducting member (32) disposed on at least a portion of the inside surface of the main body part on the LED module (10) thereof, and comprising a material more highly heat conductive than the resin constituting the main body part (31). The heat conducting member (32) constitutes a portion of the power supply path between the base (50) to the LED module (10).

Description

lamp

The present invention relates to a lamp using a semiconductor light emitting element such as an LED as a light source, and in particular to an improvement of a configuration for enhancing the withstand voltage.

In recent years, lamps using semiconductor light emitting devices such as LEDs as light sources are becoming widespread. As an example, Patent Document 1 discloses a bulb-shaped lamp using an LED as a light source.

FIG. 21 is a cross-sectional view showing a schematic configuration of the light bulb shaped LED lamp of Patent Document 1. As shown in FIG. As shown in FIG. 21, an LED lamp 1800 (hereinafter referred to as a lamp 1800) includes an LED module 1810 having an LED 1812 mounted thereon, a circuit unit 1820 for lighting the LED module 1810, and a circuit case 1835 covering the circuit unit 1820 A housing 1831 is formed to cover the case 1835, a globe 1840 attached to the housing 1831, and a base 1850 connected to the housing 1831 through the circuit case 1835. The housing 1831 is made of metal, and the circuit case 1835 is made of resin. The LED module 1810 and the housing 1831 are insulated by the insulating portion 1814.

Since the housing 1831 is made of metal having high thermal conductivity, the heat generated in the LED module 1810 is transferred from the housing 1831 to the base 1850, and from the base 1850 via the socket of the lighting device, the lighting device The heat is dissipated to the wall and ceiling. Thus, the heat generated in the LED module 1810 can be retained in the periphery thereof, and damage to a heat-sensitive member such as the circuit unit 1820 can be suppressed.

JP, 2009-037995, A

In general, electrical devices are required to have withstand voltage, and it is not an exception for lamps. The withstand voltage of the lamp is evaluated by a test method of applying a high voltage of alternating current between the outer surface of the housing and the base and measuring the magnitude of the current flowing therebetween. By the way, although a lamp is used at a rated voltage of 100 V in Japan, a lamp may be used at a rated voltage of 220 V to 250 V abroad. Therefore, the high voltage applied in the withstand voltage test is, for example, 1 kV for a product of Japanese specification, and it may be 4 kV for a product of overseas specification, more severe than that of Japanese specification. And, in order to use the lamp abroad, it is necessary to satisfy the insulation withstand voltage test of the overseas specification.

In the above-described conventional lamp, since the housing is made of highly conductive metal, when a high voltage is applied to the outer surface of the housing in the dielectric breakdown voltage test, the entire housing has the same high potential. Therefore, if there is a close position between the housing and the circuit system (consisting of a base, a circuit unit, and a semiconductor light emitting element), the electric field strength there will be high, which may cause dielectric breakdown. On the other hand, it is conceivable to prevent the electric field strength from becoming too high by enlarging the size of the case and securing a distance between the case and the circuit system at a certain level or more. However, since the LED lamp is required to have the same size as the incandescent lamp, there is a limit to increasing the size of the housing.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a lamp capable of improving the withstand voltage performance while radiating the heat generated in the light emitting module.

In order to achieve the above object, a lamp according to the present invention comprises a light emitting module having a mounting substrate and a semiconductor light emitting element mounted thereon, a cylindrical casing in which the light emitting module is disposed at one end, and the casing And a circuit unit inserted from the base into the power supply path of the light emitting module, wherein the casing includes a cylindrical main body made of resin, and light emission from the inner surface of the main body A heat conducting portion disposed on at least a part of the module side and made of a material having a heat conductivity higher than that of the resin constituting the main body portion, the heat conducting portion performing heat conduction between the light emitting module and the base It is characterized in that it constitutes a part of the route.

In the lamp according to the present invention, since the main body portion which is the outer surface of the housing is made of a resin excellent in insulation property, even if a high voltage is applied to the outer surface of the housing, the entire housing is similarly high potential. It is difficult to become. Therefore, even if there is a close place between the housing and the circuit system, the electric field strength there is not necessarily high. Therefore, the occurrence of dielectric breakdown between the housing and the circuit system can be suppressed, and as a result, the dielectric breakdown voltage performance of the lamp can be improved.

Further, the heat conducting part constitutes a part of the heat conducting path between the light emitting module and the base. Therefore, the heat generated in the LED module is transmitted from the heat conducting portion to the main body portion and further from the main body portion to the base, and dissipated from the base to the lighting device, wall, and ceiling via the socket of the lighting device. .

As described above, it is possible to provide a lamp capable of improving the withstand voltage performance while radiating the heat generated in the light emitting module.

It is sectional drawing which shows schematic structure of the LED lamp which concerns on 1st Embodiment. It is an expanded sectional view which shows the part enclosed with the dashed-two dotted line in FIG. It is a disassembled perspective view which shows schematic structure of the LED lamp which concerns on 1st Embodiment. It is sectional drawing which shows schematic structure of the modification of the heat conduction part of the LED lamp which concerns on 1st Embodiment. It is a disassembled perspective view which shows schematic structure of the modification of the heat conduction part of the LED lamp which concerns on 1st Embodiment, Comprising: (a) 2nd modification, (b) 3rd modification, (c It is a figure showing each a 4th modification. It is a sectional view showing a schematic structure of a modification of a light emitting module and a heat conduction part of a LED lamp concerning a 1st embodiment. It is a sectional view showing a schematic structure of a modification of a light emitting module and a heat conduction part of a LED lamp concerning a 1st embodiment. It is sectional drawing which shows schematic structure of the modification of a housing | casing and a heat conduction part of the LED lamp which concerns on 1st Embodiment. It is sectional drawing which shows schematic structure of the LED lamp which concerns on 2nd Embodiment. It is sectional drawing which shows schematic structure of the LED lamp which concerns on 3rd Embodiment. It is sectional drawing which shows schematic structure of the LED lamp which concerns on 4th Embodiment. It is a partial cross section figure which shows schematic structure of the illuminating device which concerns on 5th Embodiment. It is sectional drawing which shows schematic structure of the LED lamp which concerns on 6th Embodiment. It is a figure which shows the positional relationship of the circuit board in the circuit holder of the lamp | ramp which concerns on 6th Embodiment, a groove part, and a guide member, Comprising: (a) is a cutaway perspective view of a circuit holder, (b) is an upper It is a figure which represents typically the positional relationship of the circuit board in a circuit holder in the case of seeing from a circuit holder, a groove part, and a guide member, and (c) is a position of the groove and guide member in a circuit holder in the case seen from the side. FIG. 5 is a cross-sectional view schematically showing a relationship. It is sectional drawing which shows schematic structure of the LED lamp which concerns on 7th Embodiment. It is a figure which shows the positional relationship of the circuit board in the circuit holder of the lamp | ramp which concerns on 8th Embodiment, a groove part, and a guide member, Comprising: (a) is a cutaway perspective view of a circuit holder, (b) is an upper It is a figure which represents typically the positional relationship of the circuit board in a circuit holder in the case of seeing from a circuit holder, a groove part, and a guide member, and (c) is a position of the groove and guide member in a circuit holder in the case seen from the side. FIG. 5 is a cross-sectional view schematically showing a relationship. It is a figure which shows the positional relationship of the circuit board in the circuit holder of the lamp | ramp which concerns on 9th Embodiment, a groove part, and a guide member, Comprising: (a) is a cutaway perspective view of a circuit holder, (b) is an upper side. It is a figure which represents typically the positional relationship of the circuit board in a circuit holder in the case of seeing from a circuit holder, a groove part, and a guide member, and (c) is a position of the groove and guide member in a circuit holder in the case seen from the side. FIG. 5 is a cross-sectional view schematically showing a relationship. It is a figure which shows the positional relationship of the circuit board in the circuit holder of a lamp | ramp which concerns on 10th Embodiment, a groove part, and a guide member, Comprising: (a) is a cutaway perspective view of a circuit holder, (b) is an upper It is a figure which represents typically the positional relationship of the circuit board in a circuit holder in the case of seeing from a circuit holder, a groove part, and a guide member, and (c) is a position of the groove and guide member in a circuit holder in the case seen from the side. FIG. 5 is a cross-sectional view schematically showing a relationship. It is sectional drawing which shows the structure of the LED lamp which concerns on 11th Embodiment. It is a perspective view of the heat conduction member concerning a 12th embodiment. It is sectional drawing which shows schematic structure of the conventional LED lamp.

First Embodiment
A first embodiment of the present invention will be described in detail with reference to the drawings.

The materials and numerical values used in the embodiments of the invention merely exemplify preferable examples, and the present invention is not limited to this embodiment. Moreover, changes can be made as appropriate without departing from the scope of the technical idea of the present invention. Further, combinations with other embodiments are possible as long as no contradiction arises.

Furthermore, although an embodiment in which an LED (Light Emitting Diode) is used as a semiconductor light emitting element is described here, the semiconductor light emitting element may be, for example, an LD (laser diode) or an organic light emitting element. . In all the drawings including FIG. 1 and FIG. 2, the scale among the members is not necessarily the same. Also, the symbol “to” used to indicate a numerical range includes the numerical values at both ends thereof.
1. Configuration FIG. 1 is a cross-sectional view showing the structure of the LED lamp according to the first embodiment. FIG. 2 is an enlarged sectional view showing a portion surrounded by a two-dot chain line in FIG. FIG. 3 is an exploded perspective view showing a schematic configuration of the LED lamp shown in FIG. In FIG. 3, the LED module 10, the circuit unit 20 and the like are omitted.

The LED lamp 1 includes an LED module 10, a circuit unit 20 for supplying power to the LED 12, a housing 30 for housing the circuit unit 20 therein, and a globe 40 attached to the housing 30 via silicon 80. A base 50 electrically connected to the circuit unit 20 is provided. Furthermore, the lamp 1 has a module plate 60 mounted on the housing 30 with the LED module 10 mounted on the top surface thereof. The housing 30 is composed of a cylindrical main body 31 made of resin and a heat conducting member 32 made of metal provided inside the main body 31.

The dashed-dotted line drawn in FIG. 1 indicates the cylindrical axis J of the housing 30. The cylinder axis J coincides with the lamp axis of the lamp 1 and the rotation axis of the base 50.
(1) LED Module The LED module 10 has a mounting substrate 11 which is a metal base substrate consisting of a resin plate and a metal plate, and a plurality of LEDs 12 mounted thereon.

The shape of the mounting substrate 11 is, for example, a disk shape. The LEDs 12 are annularly mounted on the mounting substrate 11 at equal angular intervals around the disc central axis. The number of LEDs 12 is appropriately determined according to the amount of light required for the LED lamp 1. When the number of LEDs 12 is one, the LEDs 12 are disposed at the center of the mounting substrate 11. The shape of the mounting substrate 11 is not limited to the disk shape, but may be an arbitrary shape such as an elliptical plate shape.

The LED module 10 is provided in the housing 30 with the light emission direction directed to the side opposite to the base 50. The mounting substrate 11 is attached by adhesively fixing to the surface of the module plate 60 on the opposite side of the base 50. The mounting substrate 11 may be attached to the module plate 60 by using other methods such as screwing and engaging structure in addition to using an adhesive. Further, in the mounting substrate 11, the top surface of the mounting substrate 11 is an insulating layer in order to electrically insulate the LED module 10 and the module plate 60. The mounting substrate 11 may be a ceramic substrate or a resin substrate. In this case, the ceramic or resin itself is an insulator.

Moreover, yellow fluorescent substance is provided in the upper surface of LED12 which is a blue LED chip. Thereby, the blue light generated by the LED 12 is converted to white light. The LED 12 may be mounted on the upper surface of the mounting substrate 11 using COB (Chip on Board) technology, or may be mounted using an SMD (Surface Mount Device) type. The LEDs 12 are electrically connected in series by the wiring pattern of the mounting substrate 11.
(2) Circuit Unit The circuit unit 20 is composed of the circuit board 21 and the various

electronic components

22 and 23 mounted on the circuit board 21, and is housed in the housing 30. The circuit board 21 is attached to the module plate 60 by engaging the outer peripheral portion of the circuit board 21 with the circuit holder 62 made of resin. As a method of attaching the circuit board 21 to the module plate 60, an adhesive or the like may be used in addition to using the engagement. In addition, it may be fixed to the main body 31 with a nail or the like. In addition, although the electronic component uses only two codes | symbols of "22" and "23" for convenience, the electronic component is also in addition to "22" and "23", and the circuit by these electronic components 22 and 23 A unit 20 is configured.

The circuit unit 20 is inserted from the base 50 into the feed path of the LED module 10. Specifically, the circuit unit 20 and the base 50 are electrically connected by the

wires

71 and 72, and the circuit unit 20 receives power from the base 50 and causes the LED module 10 to emit light. The

wires

71 and 72 are, for example, lead wires covered with an insulating member such as resin.
(3) Housing As described above, the housing 30 is composed of the main body 31 made of resin and the heat conducting member 32 made of metal. The housing 30 has a base 50 at one end, the LED module 10 at the other end, and the circuit unit 20 housed inside.
(3-1) Main body portion The main body portion 31 has a tapered cylindrical shape in which the inner diameter of the opening 31a which is one end of the LED module 10 is larger than the inner diameter of the opening 31b which is the other end of the base 50. It is. The module plate 60 and the globe 40 are attached to the opening 31a, and the base 50 is attached to the opening 31b.

On the side of the opening 31a of the main body 31, a groove 31c is formed continuously along the outer periphery thereof. The groove 31 c is provided at a position between the opening 31 a and the opening 31 b. The base 50 side end portion of the heat conducting member 32 is embedded in the groove 31 c.

Further, on the side of the opening 31a of the main body 31, an inner cylindrical portion 31d is further formed. The inner cylindrical portion 31 d made of resin is provided between the circuit unit 20 to which a voltage is applied and the heat conducting member 32 made of metal. By providing the inner cylindrical portion 31 d in this manner, the insulation between the circuit unit 20 and the heat conducting member 32 can be strengthened. In addition, since the inner cylindrical portion 31 d can be formed simultaneously with the other portions of the main body portion 31, the number of manufacturing steps can be reduced compared to providing a separate member between the circuit unit 20 and the heat conducting member 32. .

The main body 31 is made of, for example, a resin such as PBT, PET, PES, PC, PPS, PA, or silicon. Further, the material of the main body portion 31 is not limited to the resin, and a material that can ensure insulation, for example, ceramic, glass, etc. may be used.
(3-2) Heat Conducting Portion As shown in FIG. 3, the heat conducting member 32 has a shape along the inner surface of the main body portion 31, that is, a tapered cylindrical shape. Further, as shown in FIG. 1, the heat conducting member 32 extends from the end of the disc portion 61 of the module plate 60 on the LED module 10 side to the groove 31 c of the main body 31. Furthermore, the heat conducting member 32 has an edge 32 a on the base 50 side and an edge 32 b on the LED module 10 side. Here, the heat conduction member 32 has a shape along the inner surface of the main body portion 31, and there is no gap between the inner surface of the main body portion 31 and the heat conduction member 32, but the configuration is not limited to this. For example, the heat conducting member 32 may be employed which has a gap between the inner surface of the main body 31 and the heat conducting member 32.

The heat conduction member 32 constitutes a part of the heat conduction path between the LED module 10 and the base 50. Here, “constituting a part of the heat conduction path” means that the heat generated in the LED module 10 is transmitted to the base 50 through the heat conduction member 32. Furthermore, since the heat conducting member 32 is made of a metal having higher thermal conductivity than the resin constituting the main body portion 31, heat can be conducted more quickly than the main body portion 31 made of resin.

In the direction of the cylinder axis J of the housing 30, the distance L1 from the base 50 side end edge 32a of the heat transfer member 32 to the LED module 10 side end edge 50a of the base 50 is 20 mm. If L1 is 40 mm or less, it can be said that the heat conduction member 32 constitutes a part of the heat conduction path between the LED module 10 and the base 50, and the heat conduction effect to dissipate the heat of the LED module 10 is I can expect it. In addition, if the thickness of the heat conduction portion is 0.5 mm or more, heat can be transmitted more quickly, which is desirable.

In order to effectively dissipate the heat generated by the LED module 10 by the heat conducting member 32, the end of the heat conducting member 32 on the LED module 10 side is required to be located near the LED module 10. Specifically, in the direction of the cylinder axis J of the housing 30, the LED module 10 side end edge 32b of the heat conduction member 32 is disposed to protrude from the surface 61b of the module plate 60, and the distance L2 is 0 mm to 10 mm. Just do it. Thus, the heat generated by the LED module 10 can be effectively dissipated by the heat conduction member 32 through the silicon 80 that fixes the open end 41 of the globe 40 to the housing 30 and the module plate 60.

The heat conducting member 32 is made of, for example, a metal such as Al (aluminum), Cu (copper), or Fe (iron). Further, the material of the heat conducting member 32 is not limited to metal, and a material ceramic having a thermal conductivity higher than that of the main body portion 31, for example, Al ₂ O ₃ (aluminum oxide: alumina) may be used. Furthermore, as a material of the heat conductive member 32, a heat conductive resin having a thermal conductivity higher than that of the main body 31, for example, a resin material made of AlN (aluminum nitride), Fe, C (carbon), Al ₂ O ₃ A mixture of fillers having conductivity may be used.

A space is provided between the end edges 32 a and 32 b of the heat conducting member 32 and the main body 31. Thereby, when the heat conduction member 32 is thermally expanded, it is possible to absorb a crack or the like of the resin material due to a thermal expansion difference with aluminum or the like. A space may not be provided between the end edges 32 a and 32 b of the heat conducting member 32 and the main body 31. In this configuration, the LED lamp 1 can be formed more compact.
(4) Glove Glove 40 consists of translucent members, such as glass and resin, for example, is approximately dome shape. The globe 40 is placed on the module plate 60 so as to cover the LED module 10, and the open end 41 thereof is fixed to the housing 30 and the module plate 60 by being fitted into the groove of the module plate 60. Furthermore, silicon 80 is injected into the gap between the open end 41 and the upper surface of the housing 30 and the module plate 60. By injecting the silicon 80 having excellent adhesion to the metal constituting the module plate 60, the fixation to the globe 40, the housing 30, the heat conducting member 32, and the module plate 60 can be firmly adhered.

The light emitted from the LED module 10 passes through the globe 40 from the opening 31 a of the main body portion 31 and exits to the outside. The inner surface, the outer surface, or the inside of the globe 40 may be subjected to a diffusion treatment in which light emitted from the LED module 10 is diffused, for example, a diffusion treatment using silica or a white pigment.
(5) The base 50 is provided at the opening 31 b of the main body 31. There are various types of the base 50, and although not particularly limited, here, a screw type base, for example, E26 is used.

The base 50 includes a shell 51 attached to the main body 31 and an eyelet 52 provided at an end of the base 50 opposite to the main body 31. The shell portion 51 is electrically connected to the circuit unit 20 through the wire 71 and the eyelet portion 52 through the wire 72, respectively. The shell 51 has a screw-like outer peripheral surface and is attached to the housing 30. The wire 72 is soldered to the tip of the eyelet portion 52.
(6) Module plate The module plate 60 is made of, for example, metal such as Al (aluminum), Cu (copper), Fe (iron) or ceramic glass, and the LED module 10 is mounted on the surface on the globe 40 side. , The side surface is in contact with the housing 30. The disc portion 61 has a hole or an outer peripheral portion notch for passing a wire. A circuit holder 62 made of a plurality of resins provided from the disk portion 61 toward the base 50 is attached to the disk portion 61 with an adhesive. The module plate 60 is not limited to the above-described shape, and can have any shape.

The module plate 60 is attached to the housing 30 by locking the side surface of the disc portion 61 to the housing 30. The attachment method may also use, for example, a screw, an adhesive or the like. The circuit holder disk portion 61 and the circuit holder 62 are attached such that the center of the disk portion 61 is positioned on the central axis of the circuit holder 62. Furthermore, although the electrical connection from the module plate 60 to the LED module 10 is not shown,

wires

71 and 72 extending from the base 50 are connected to the LED module 10 through the holes of the disc portion 61.
2. In the heat radiation path and the insulation lamp 1, the heat generated by the LED 12 is transmitted from the module plate 60 to the main body 31 via the heat conduction member 32. Further, the heat is transferred from the main body 31 to the base 50, and is dissipated from the base 50 to the lighting device, wall or ceiling via the socket of the lighting device.

Therefore, for example, the input current to the LED 12 is increased to improve the luminance, and even when the heat generated in the LED 12 at the time of light emission increases, the heat can be dissipated from the base 50 to the lighting device side.

Further, as described above, since the inner cylindrical portion 31d made of insulating resin is formed between the circuit unit 20 and the inner surface of the heat conducting member 32, insulation can be ensured.
3. According to the above configuration, even when a high voltage of alternating current is applied between the outer surface of the main body 31 made of resin and the base 50 in the insulation withstand voltage test, the heat conduction member 32 which is the inner surface of the housing 30 The dielectric breakdown between the inner surface and the LED module 10 is less likely to occur. As described above, the occurrence of dielectric breakdown between the housing 30 and the LED module 10 and the circuit unit 20 can be suppressed, and as a result, the dielectric breakdown voltage performance of the lamp 1 can be improved.

In addition, the heat generated by the LED 12 is transmitted from the module plate 60 to the heat conduction member 32, and is further transferred to the base 50 through the housing 30. Thereafter, the heat is dissipated from the base 50 via the socket of the lighting device to the lighting device, the wall or the ceiling. Thus, the heat generated in the LED module 10 can be dissipated. Therefore, it is difficult for heat to build up in the housing 30, and it is possible to suppress damage to the circuit unit 20 and the like that are weak to heat.
4. Modifications Hereinafter, modifications of the lamp 1 according to the first embodiment will be described.
(1) Modified Example of Heat Conducting Portion The heat conducting portion is not limited to the one shown in the lamp according to the first embodiment, but may have a different structure.
(1-1) First Modification A cross-sectional view of a lamp 100 according to a first modification is shown in FIG. As shown in FIG. 4, the configuration is substantially the same as the lamp 1 except for the first modification of the housing 130. The same reference numerals as in the first embodiment are used for the same components as those described in the first embodiment.

The heat conducting member 132 reaches the vicinity of the base 50 side of the main body portion 131. Specifically, in the cylinder axis J direction of the housing 130, the distance L1 from the base 50 side end edge 132a of the heat transfer member 132 to the LED module 10 side end edge 50a of the base 50 is 6 mm.

In the heat conducting member 132, compared with the heat conducting member 32 in the lamp 1, the distance between the cap 50 side end edge 132 a of the heat conducting member 132 and the cap 50 is smaller. Thereby, the heat generated by the LED module 10 can be quickly transmitted to the base 50 side. Therefore, the heat generated by the LED module 10 can be dissipated more quickly.
(1-2) Second Modified Example A perspective view of a heat conducting member 232 according to a second modified example is shown in FIG. 5 (a). The components other than the heat conducting member 232 have substantially the same configuration as the lamp 1.

The heat conducting member 232 is in the form of a cylinder having a plurality of square openings 232a, and has a concavo-convex shape or a through hole. The heat conducting member 232 has the heat conducting member 132 of the lamp 100 in a concavo-convex shape, so that the heat conductivity can be secured. In addition, the heat dissipation area of the heat conducting member 232 is increased, and the heat conductivity can be further improved. Further, since the volume of the heat conducting member 232 can be reduced, a further lightweight lamp can be provided. Furthermore, when assembling the lamp, the resin can be embedded in the opening 232a of the heat conducting member 232. In this case, the heat conductivity can be secured more than in the configuration where air is present in the opening 232a, and the heat conducting member 232 is fixed. If easy.
(1-3) Third Modified Example A perspective view of a heat conducting member 332 according to a third modified example is shown in FIG. 5 (b). The components other than the heat conducting member 332 have substantially the same configuration as the lamp 1.

The heat conducting member 332 is composed of a plurality of rod-like portions 332 a and two

annular portions

332 b and 332 c. The both ends of the rod-like portion 332a are attached to the

annular portions

332b and 332c, respectively. Therefore, it can be said that the heat conducting member 332 has a slit. At the time of assembling the lamp, resin is embedded in the opening 332 d as in the second modification. Also in this case, as in the second embodiment, a further lightweight lamp can be provided while securing thermal conductivity. Further, since the annular portion 332 b has a shape along the outer periphery of the LED module 10, the heat generated by the LED module 10 can be effectively transmitted to the rod-like portion 332 a. Furthermore, since the annular portion 332 c has a shape along the opening of the base 50, the heat transmitted to the rod-like portion 332 a can be effectively transmitted to the base 50. In addition, since the heat conducting member 332 has a slit, fixing is easy. The slit of the opening 332 d may be one, or only one of 332 b or 332 C may be used. In addition, the number of slits may be one, and resin may not be embedded in the openings 332 d.

In addition, it is comprised only with several rod-shaped parts 432a extended to the nozzle | cap | die 50 side from the LED module 10 side like FIG.5 (c), and resin assembles the opening 432b similarly to a 2nd modification at the time of a lamp | ramp assembly. The heat conduction member 432 may be embedded. Even if the heat conducting member 432 does not have an annular portion, as in the heat conducting member 332, the heat conductivity can be secured. In addition, since the heat conducting member 432 has a slit, like the heat conducting member 332, fixing is easy. Moreover, since it does not have an annular part, the effect that a further lightweight lamp can be provided can be acquired. The heat conducting member 432 b may be one, and the opening 432 b may not be filled with a resin.
(1-4) Fourth Modified Example FIG. 6 shows a cross-sectional view of a lamp 500 according to a fourth modified example. As shown in FIG. 6, the configuration is substantially the same as that of the lamp 100 except for the modification of the light emitting module and the heat conducting member. About the same thing as composition explained by lamp 100, the same numerals as lamp 100 are used.

The light emitting module 510 includes the mounting substrate 511 and the LED 12. The mounting substrate 511 has a disk shape along the main body portion 131. The light emitting module 510 is fixed to the main body 131 and the heat conducting member 132 by locking. In addition, the light emitting module 510 is in contact with the heat conducting member 132.

With this configuration, the heat generated by the light emitting module 510 can be more efficiently transferred from the heat transfer member 132 to the base 50 side.
(1-5) Fifth Modification A cross-sectional view of a lamp 600 according to a fifth modification is shown in FIG. As shown in FIG. 7, the configuration is substantially the same as that of the lamp 100 except for the modification of the light emitting module and the heat conducting member. About the same thing as composition explained by lamp 100, the same numerals as lamp 100 are used.

The heat conducting member 632 is composed of a cylindrical portion 633 along the main body portion 131 and a base portion 634 on which the LED 12 is mounted. Thereby, the heat generated by the LED 12 can be more efficiently transferred from the heat transfer member 632 to the base 50 side.
(1-6) Sixth Modification FIG. 8 shows a cross-sectional view of a lamp 700 according to a sixth modification. As shown in FIG. 8, the configuration is substantially the same as that of the lamp 100 except for the modified example of the main body. About the same thing as composition explained by lamp 100, the same numerals as lamp 100 are used.

The main body portion 731 does not have the inner cylindrical portion 31 d of the lamp 1. In the lamp 700, the distance between the circuit unit 20 and the heat conducting member 132 provides insulation between the circuit unit 20 and the heat conducting member 132. When such a main body portion 731 is adopted, the formation of the housing 730 becomes simple.
(1-7) Other Modified Examples In the above-described modified example, the heat conducting member is in close contact with the main body, but the heat conducting member may not be in close contact with the main body. Specifically, if the module plate is in contact with the heat conducting member and also in contact with the main body, heat can be transferred from the heat conducting member to the main body. Also in this case, the heat generated by the LED module can be transmitted from the heat conduction member to the base.
Second Embodiment
In the second embodiment, a lamp in which an insulating portion made of resin is further provided on the inner surface of a housing will be described. The same reference numerals as in the first embodiment are used for the same components as those described in the first embodiment.
(1) Configuration FIG. 9 is a cross-sectional view showing a structure of the LED lamp 800 according to the second embodiment.

The LED lamp 800 includes an LED module 10, a circuit unit 20, a housing 830, a globe 40, a base 50, and a module plate 60. The housing 830 includes a main body 831 made of resin and a heat conducting member 832 made of metal. An insulating portion 833 is formed on the inner surface of the housing 830, that is, the inner surface of the heat conducting member 832 and between the heat conducting member 832 and the LED module 10. On the inner peripheral surface of the main body portion 831, a portion like the inner cylindrical portion 31d in the first embodiment is not formed.

The insulating portion 833 is different from the inner cylindrical portion 31 d in that the insulating portion 833 covers the entire inner surface of the heat conducting member 832 and is disposed between the module plate 60 and the housing 830.
(2) Effects In this configuration, even if the inner cylindrical portion 31 d in the first embodiment is not formed, the insulating portion 833 made of resin is formed, so that the space between the LED module 10 and the housing 830, and The insulation between the circuit unit 20 and the housing 830 can be improved. Further, since the insulating portion 833 covers the entire inner surface of the heat conducting member 832 and is disposed between the module plate 60 and the housing 830, the LED module is more than the first embodiment provided with the inner cylindrical portion 31d. The insulation between the housing 10 and the housing 830 can be improved. As described above, generation of insulation breakdown between the housing 830 and the LED module 10 and the circuit unit 20 can be suppressed, and as a result, the insulation breakdown voltage performance of the lamp 800 can be improved.
Third Embodiment
In the third embodiment, a lamp provided with a circuit case for insulation between the circuit case and the case will be described. The same reference numerals as in the second embodiment are used for the same components as those described in the second embodiment.
(1) Configuration FIG. 10 is a cross-sectional view showing a structure of a lamp 900 according to the third embodiment.

The lamp 900 includes an LED module 10, a circuit unit 20, a housing 930, a circuit case 980, a globe 40, a base 50, and a module plate 60. The circuit case 980 is made of an insulating resin and formed in a cylindrical shape so as to surround the entire circuit unit 20. The material of the circuit case 980 is not limited to resin, and may be an insulating material, and the shape of the circuit case 980 is not limited to a cylindrical shape, and may be another shape such as a tapered cylindrical shape.
(2) Effects In this configuration, even if the inner cylindrical portion 31 d in Embodiment 1 is not formed, the circuit case 980 covers the circuit unit 20 so that the insulation between the circuit unit 20 and the housing 30 can be improved. . In addition, since the circuit case 980 surrounds the entire circuit unit 20, the insulation between the circuit unit 20 and the housing 30 can be further improved. As described above, the occurrence of dielectric breakdown between the housing 930 and the LED module 10 and the circuit unit 20 can be suppressed, and as a result, the dielectric breakdown voltage performance of the lamp 900 can be improved.
Fourth Embodiment
In the fourth embodiment, a lamp using a vertical circuit unit will be described. The same reference numerals as in the second embodiment are used for the same components as those described in the second embodiment.
(1) Configuration FIG. 11 is a cross-sectional view showing a structure of a lamp 1000 according to the fourth embodiment. Unlike the circuit unit 20 of the horizontal structure, the circuit unit 1020 has a vertical structure. The circuit unit 1020 is fixed by an insertion rail 1062 made of metal.
(2) Effects When the vertical circuit unit 1020 is used, the space in the housing 130 becomes large, and the insulation between the heat conducting member 132 and the circuit unit 1020 can be easily secured.
Fifth Embodiment
In the fifth embodiment, a luminaire equipped with the lamp 100 shown in FIG. 4 will be described. About the same thing as composition explained by lamp 100, the same numerals as lamp 100 are used.

FIG. 12 is a partial cross-sectional view showing the structure of the luminaire according to the fifth embodiment. The lighting fixture 1100 is a so-called downlight lighting fixture. The lighting fixture 1100 is electrically connected to the lamp 100 and holds the lamp, with a bowl-shaped reflection plate 1100 a that reflects light emitted from the lamp 100 in a predetermined direction, a connection portion 1100 b connected to an external power supply, And a socket 1100c. The end 1100d of the socket 1100c is located within L1 of the lamp 100 of FIG. 4, where L1 is 6 mm.

In addition, the structure of the illuminating device shown in FIG. 12 is a mere example, and is not limited to the above-mentioned lighting fixture for downlights.
Sixth Embodiment
In the sixth embodiment, a lamp using the vertical circuit unit 1020 shown in the fourth embodiment will be described. The same reference numerals as those in the fourth embodiment are used for the same components as those described in the fourth embodiment.
(1) Configuration FIG. 13 is a cross-sectional view showing a structure of a lamp 1200 according to the sixth embodiment. The circuit unit 1020 of vertical structure is fixed by a circuit holder 1270.

The circuit holder 1270 includes a large diameter portion 1272 and a small diameter portion 1273 and accommodates the circuit unit 1020 therein. The large diameter portion 1272 and the small diameter portion 1273 have, for example, a substantially cylindrical shape with both sides opened, and they are integrally connected in the axial direction so that the axis of the cylinder and the lamp axis coincide with each other. Most of the circuit unit 1020 is accommodated in the large diameter portion (second case portion) 1272 located on the front side, and a part of the circuit unit 1020 is accommodated in the small diameter portion (first case portion) 1273 located on the rear side ing.

A plate-like guide member 1281 elongated in the direction along the lamp axis is provided upright on the inner circumferential surface of the large diameter portion 1272. When the circuit unit 1020 is inserted into the circuit holder 1070, the guide member 1281 receives the circuit unit 1020 by the sliding contact of the side end of the circuit unit 1021 on one main surface side of the circuit substrate 1021. Guide to the right position.

A groove (second restricting member) 1282 is provided on the inner peripheral surface of the small diameter portion 1273 in the direction along the lamp axis, and the side end of the circuit board 1021 of the circuit unit 1020 is fitted. Movement to both sides in the thickness direction of the circuit board 1021 is restricted. The width (the length in the direction away from the inner circumferential surface of the circuit holder) of the groove portion 1282 is specifically, for example, 2 mm, but is not limited thereto.

The circuit holder 1270 is preferably made of, for example, an insulating material such as a resin.

A lid 1278 is attached to the front end of the circuit holder 1270 on the mounting substrate 1211 of the LED module 1210. The lid member 1278 has, for example, a bottomed cylindrical shape or a cap shape, and is held by the mounting substrate 1211 with the bottom portion facing forward on the front side of the large diameter portion 1272 via the main body portion 1281.
(2) Storing and Holding Mechanism of Circuit Unit in Case FIG. 14 is a view showing the positional relationship between the circuit board 1021, the groove portion 1282 and the guide member 1281 in the circuit holder 1270 of the lamp 1200. FIG. 14 (a) is a cutaway perspective view of the circuit holder. FIG. 14B is a view schematically showing the positional relationship between the circuit board in the circuit holder, the groove, and the guide member when viewed from above. FIG. 14C is a cross-sectional view schematically showing the positional relationship between the groove and the guide member in the circuit holder when viewed from the side. In FIG. 14C, the circuit board 1021 is not shown.

As shown in FIGS. 13 and 14, a pair of groove portions 1282 are provided at opposing positions of the inner peripheral surface of the small diameter portion 1273. In the groove portion 1282, the pair of

plate members

1282a and 1282b are mutually separated by a predetermined distance (a distance substantially equal to the thickness of the circuit board 1021) and parallel to the direction along the lamp axis. It is erected and formed on the circumferential surface.

Further, on the inner peripheral surface of the large diameter portion 1272, plate-like guide members 1281 elongated in the direction along the lamp axis are disposed in opposition to each other. The inner surface of the plate member 1282a and one of the main surfaces of the guide member 1281 are located on the same plane parallel to the lamp axis J1, and the plate member 1282a and the guide member 1281 are relative to the plane Located on the same side. Thus, when the circuit unit 1020 is inserted, the plate-like member 1282a and the guide member 1281 are in contact with the same main surface of the circuit board 1021. Therefore, when the circuit unit 1020 is inserted into the circuit holder 1270 from the upper end opening thereof, the circuit board 1021 is moved by sliding the side edge of the circuit board 1021 along the guide member 1281. It is guided to be fitted into the groove portion 1282. At this time, the downward movement of the circuit unit 1020 in the insertion direction (the insertion direction of the circuit board 1021) is restricted by the stopper 1283, and the movement of the circuit board 1021 in the width direction is restricted by the groove portion 1282. The unit 1020 is fixedly accommodated in the circuit holder 1270.

As described above, by providing the guide member 1281 above the groove portion 1282, an operation of fitting the circuit board 1021 to the groove portion 1282 can be easily performed.

In FIGS. 14B and 14C, the circuit board 1021 is shown in a central position passing through the cylinder axis of the circuit holder 1270 in order to make the illustration easy to understand. However, in practice, as shown in FIG. 13, the circuit holder 1270 is disposed at a position offset in the radial direction from the cylinder axis of the circuit holder 1270 (hereinafter, the same applies to each of FIG. 14 and subsequent figures). Further, the guide member 1281 is disposed in contact with the main surface of the circuit board 1021 which is farther from the cylinder axis. Thus, by arranging the circuit board at a position offset from the cylinder axis, the main surface side of the circuit board 1021 not in contact with the guide member 1281 in the circuit holder 1270 is in contact with the guide member 1281 It becomes a space wider than the one main surface side. As a result, taller electronic components can be arranged on the main surface side which is not in contact with the guide member 1281.
(3) Effects When the circuit holder 1270 is used, the insulation between the heat conducting member 132 and the circuit unit 1020 can be easily secured.
Seventh Embodiment
In the seventh embodiment, a lamp using a modification of the circuit holder 1270 shown in the sixth embodiment will be described. The same reference numerals as in the sixth embodiment are used for the same components as those described in the sixth embodiment.
(1) Configuration FIG. 15 is a cross-sectional view showing a structure of a lamp 1300 according to the sixth embodiment. The vertical type circuit unit 1020 is fixed by a circuit holder 1370. The circuit holder 1370 has a bottomed cylindrical shape and does not have a lid. A part of the main body portion 131 is a circuit holder 1370, whereby electrical insulation between the main body portion 131 and the base 50 is secured.
(2) Effects When the circuit holder 1370 is used, the insulation between the heat conducting member 132 and the circuit unit 1020 can be easily secured.
Eighth Embodiment
In the eighth embodiment, a lamp using a modification of the circuit holder 1270 shown in the sixth embodiment will be described. The same reference numerals as in the sixth embodiment are used for the same components as those described in the sixth embodiment.
(1) Configuration FIG. 16 is a view showing the positional relationship between the circuit board 1021, the groove portion 1382 and the guide member 1381 in the circuit holder 1380 in the eighth embodiment. FIG. 16A is a cut-away perspective view of the circuit holder 1370. FIG. FIG. 16B is a view schematically showing the positional relationship between the circuit board 1021 in the circuit holder 1370, the groove portion 1382, and the guide member 1281 when viewed from above. FIG. 16C is a cross-sectional view schematically showing the positional relationship between the groove portion 1382 and the guide member 1381 in the circuit holder 1370 when viewed from the side. In FIG. 16C, the circuit board 1021 is not shown.

As shown in FIGS. 16A to 16C, grooves 1382 are formed on both sides of the inner peripheral surface of the small diameter portion 253 of the circuit holder 1370, but a guide is formed on the inner peripheral surface of the large diameter portion 1372. The member 1381 is formed only on one side.
(2) Effects In this configuration, a guide member 1381 is provided on one side, which serves as a guide for inserting the circuit unit 1020 into the circuit holder 1370. Thus, when the circuit unit 1020 is inserted, it is not necessary to pay much attention to position control at the side edge of the side edge in the width direction of the circuit board 1021 where the guide member 1381 is provided. . Therefore, the operation is easy as compared with the case where no guide member is provided.
The Ninth Embodiment
In the ninth embodiment, a lamp using a modification of the circuit holder 1270 shown in the sixth embodiment will be described. The same reference numerals as in the sixth embodiment are used for the same components as those described in the sixth embodiment.
(1) Configuration FIG. 17 is a view showing the positional relationship between the circuit board 1021, the groove portion 1482 and the guide member 1481 in the circuit holder 1470 in the ninth embodiment. FIG. 17A is a cutaway perspective view of the circuit holder 1470. FIG. FIG. 17B is a view schematically showing the positional relationship between the circuit board 1021 in the circuit holder 1470, the groove portion 1482 and the guide member 1481 when viewed from above. FIG. 17C is a cross-sectional view schematically showing the positional relationship between the groove portion 1482 and the guide member 1481 in the circuit holder 1470 when viewed from the side. In FIG. 17C, the circuit board 1021 is not shown.

As shown in FIGS. 17A to 17C, guide members 1481 are formed on both sides of the inner peripheral surface of the large diameter portion 452 of the circuit holder 1470, but a groove is formed on the inner peripheral surface of the small diameter portion 1483. 1482 is formed only on one side.
(2) Effects In this case as well, the operation of inserting the circuit unit is easy because the guide members that serve as a guide for inserting the circuit unit into the circuit holder are provided on both sides. Further, although the groove portion 1482 is provided only on one side, at the side edge portion of the circuit board on the side where the groove portion 1482 is not provided, the guide member 1481 out of the movement in the thickness direction of the circuit board by the guide member 1481 Movement in the direction towards is restricted. Thus, the movement of the circuit board in the thickness direction is restricted to some extent, and the circuit unit 1020 is accommodated relatively stably in the circuit holder 1470.
Tenth Embodiment
In the tenth embodiment, a lamp using a modification of the circuit holder 1270 shown in the sixth embodiment will be described. The same reference numerals as in the sixth embodiment are used for the same components as those described in the sixth embodiment.
(1) Configuration FIG. 18 is a diagram showing the positional relationship between the circuit board 1021, the groove 1582 and the guide member 1581 in the circuit holder 1570 in the tenth embodiment. FIG. 18A is a cutaway perspective view of the circuit holder 1570. FIG. FIG. 18B is a view schematically showing the positional relationship between the circuit board 1021 in the circuit holder 1570, the groove 1582, and the guide member 1581 when viewed from above. FIG. 18C is a cross-sectional view schematically showing the positional relationship between the groove 1582 and the guide member 1581 in the circuit holder 1570 when viewed from the side. In FIG. 18C, the circuit board 1021 is not shown.

As shown in FIGS. 18A to 18C, a guide member 1581 is formed only on one side on the inner peripheral surface of the large diameter portion 1572 of the circuit holder 1570, and a groove portion is formed on the inner peripheral surface of the small diameter portion 1573. 1582 is formed only on one side.
(2) Effects In this case as well, a guide member is provided on one side, which serves as a guide for inserting the circuit unit into the circuit holder. Thus, when the circuit unit 1020 is inserted, among the side edges in the width direction of the circuit board 1021, at the side edge where the guide member 1581 is provided, it is not necessary to pay much attention to the control of the position. Therefore, the operation is easy as compared with the case where the guide member 1581 is not provided at all. Although the groove 1582 is provided only on one side, the groove 1582 restricts the movement of the side edge of the circuit board 1021 on the side where the groove 1582 is provided to the circuit board 1021 in the thickness direction of the circuit board 1021. It is done. Thus, the movement of the circuit board in the thickness direction is restricted to some extent, and the circuit unit 1020 is accommodated relatively stably in the circuit holder 1570.
Eleventh Embodiment
In an eleventh embodiment, a lamp using a heat conducting member whose overall thickness is not uniform will be described. The same reference numerals as in the first embodiment are used for the same components as those described in the first embodiment.
(1) Configuration FIG. 19 is a cross-sectional view showing a structure of the LED lamp 1600 according to the eleventh embodiment.

The LED lamp 1600 includes an LED module 10, a circuit unit 20, a housing 830, a globe 40, a base 50, and a module plate 60. The housing 1630 is composed of a main body portion 1631 made of resin and a heat conducting member 1632 made of metal. This embodiment differs from the first embodiment in that the thickness of the heat conducting member 1632 is the thickest on the side in contact with the LED module 10 and the thinner as it approaches the base 50 side.
(2) Effects In this configuration, the heat generated by the LED module 10 can be effectively transmitted to the base 50.
The Twelfth Embodiment
In the twelfth embodiment, a lamp is described in which the aperture ratio of the through hole or the slit of the heat conducting member is the lowest at the side in contact with the light emitting module and becomes higher toward the base. The same reference numerals as in the first embodiment are used for the same components as those described in the first embodiment.
(1) Configuration FIG. 20 is a perspective view of a heat conducting member 1732 according to the twelfth embodiment. Except for the heat conducting member 1732, the configuration is substantially the same as that of the lamp 1.

The heat conducting member 1732 has a cylindrical shape having a plurality of through holes 1732a which are square openings. The opening ratio of the through hole 1732a of the heat conducting member 1732 is lowest at the side in contact with the LED module 10, and becomes higher as it approaches the base 50 side. In place of the through holes, a heat conducting member having a slit may be used which has the lowest opening ratio on the side in contact with the light emitting module and the higher it gets closer to the base 50 side.
(2) Effects In this configuration, the heat generated by the LED module 10 can be effectively transmitted to the base 50. In addition, the volume of the heat conducting member 1732 can be reduced to provide a lighter lamp.
<Other Modifications>
1. LED Module (1) Mounting Substrate The mounting substrate is not limited to the metal base substrate consisting of a resin plate and a metal plate shown in the embodiment and the like, and an existing mounting substrate such as a resin substrate or a ceramic substrate can be used. . When the mounting substrate and the module plate on which the mounting substrate is mounted are made of a conductive material, an insulating member such as an insulating sheet is provided between the mounting substrate and the module plate which enhances the electrical insulation between the LED module and the module plate. It may be provided.
(2) LED
Although white light is output from the LED module (LED lamp) using one type of LED in the embodiment and the like, the present invention is not limited thereto. For example, using three types of LEDs of blue light emission, red light emission, and green light emission, these light emission colors may be mixed to be white light. In this case, a phosphor for wavelength conversion is unnecessary.
2. In the embodiment and the like, the opening of the case is a circle, but not limited to a circle, the opening of the case may have another shape. Other shapes include an elliptical shape and a polygonal shape.
3. Ensuring insulation withstand voltage between the circuit unit and the heat conducting portion In the embodiment etc., the insulating portion made of resin is formed inside the heat conducting member, or the circuit case is provided, whereby the circuit unit and the heat conducting portion Although insulation withstand voltage was secured, it is not limited to this. For example, the space between the housing and the circuit unit may be filled with resin.
4. Heat Conducting Portion In a modified example, for a heat conducting member in the form of a mesh or rod, the distance L1 from the base end edge of the heat conducting portion to the LED module side end edge of the base in the cylinder axis J direction of the housing is Although it is 6 mm, it may be 40 mm to 5 mm. If it is this grade, desired heat dissipation can be obtained, making a heat conduction part light.
5. Module Plate In the embodiment and the like, the module plate is made of metal, but not limited to this, it may be made of a high thermal conductivity resin that can also be used as a material of the heat conduction portion. When the module plate is made of high thermal conductivity resin, the heat generated by the LED module can be dissipated quickly to the housing, and the insulation between the LED module and the housing can be further improved. The thermal conductivity of the high thermal conductivity resin can be adjusted by the shape and amount of the filler, and as the filler, glass, beryllium oxide, magnesium oxide, zinc oxide, zinc nitride, boron nitride, silicon nitride, titanium nitride, diamond Graphite, silicon carbide, titanium carbide, zirconium boride, phosphorus boride, molybdenum silicide, beryllium sulfide and the like can be used.

The LED lamp of the present invention can be used as a light source of various lighting devices.

10 LED module 11 mounting substrate 11a top surface 12 mounting substrate
Reference Signs List 20 circuit unit 30 case 31 main body 31a opening 31b opening 32

heat conducting part

32a, 132a base side edge 32b of heat conducting part light emitting module side edge 50 of heat conducting part 50 base 50a light emitting module side end of

base

1, 100, 500, 600

Lamps

332a, 432a

Rods

332c,

332d Annular members

232a, 332d, 432b Openings 533 Insulating part 680

Circuit case

1270, 1370, 1470, 1570 Circuit holder L1, L2 Distance J Housing cylinder axis

Claims

A light emitting module having a mounting substrate and a semiconductor light emitting device mounted thereon;
A cylindrical casing in which the light emitting module is disposed at one end;
A cap disposed at the other end of the housing;
And a circuit unit interposed from the base to the feeding path of the light emitting module.
The casing is disposed on a cylindrical main body made of resin, and at least a part of the inner surface of the main body on the light emitting module side, and a material having higher thermal conductivity than the resin constituting the main body. And a heat conducting portion comprising
The lamp, wherein the heat conduction member constitutes a part of a heat conduction path between the light emitting module and the base.
The lamp according to claim 1, wherein the heat conductive member is made of resin in which metal particles or ceramic is dispersed, metal, or ceramic.
The lamp according to claim 1, wherein the heat conduction member has an unevenness.
The lamp according to claim 1, wherein the heat conducting member has a through hole or a slit.
The lamp according to claim 1, wherein the heat conducting member comprises a plurality of bar members extending from the light emitting module side toward the base.
The lamp according to any one of claims 1 to 5, further comprising an insulating portion made of resin and disposed on an inner surface of the heat conducting member and between the heat conducting member and the light emitting module.
The lamp according to any one of claims 1 to 6, further comprising a cylindrical circuit case made of an insulating material and surrounding the entire circuit unit.
The lamp according to any one of claims 1 to 7, wherein the mounting substrate and the light emitting module plate are integrated, and the semiconductor light emitting element is mounted thereon.
The lamp according to any one of claims 1 to 8, wherein a thickness of the heat conducting member is the thickest on the side in contact with the light emitting module, and becomes thinner toward the base.
The lamp according to any one of claims 1 to 9, wherein the opening ratio of the through hole or the slit of the heat conducting member is lowest at the side in contact with the light emitting module and becomes higher toward the base side.