CN204284970U - Lamp - Google Patents

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Publication number
CN204284970U
CN204284970U CN201290000991.8U CN201290000991U CN204284970U CN 204284970 U CN204284970 U CN 204284970U CN 201290000991 U CN201290000991 U CN 201290000991U CN 204284970 U CN204284970 U CN 204284970U
Authority
CN
China
Prior art keywords
lamp
heat conduction
conduction component
framework
lamp holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201290000991.8U
Other languages
Chinese (zh)
Inventor
觉野吉典
仕田智
松井伸幸
田村哲志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
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Publication of CN204284970U publication Critical patent/CN204284970U/en
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

Lamp of the present utility model (1) possesses: LED module (10), has installation base plate (11) and is installed on the LED (12) of installation base plate (11); The framework (30) of tubular, is at one end configured with LED module (10); Lamp holder (50), is configured at the other end of framework (30); And circuit unit (20), be inserted into from lamp holder (50) to the feed path of LED module (10).Framework (30) has: the main part (31) of the tubular be made up of resin; And heat conduction component (32), be configured at LED module (10) side of the inner surface of this main part at least partially, and be made up of the material higher than heat conductivity with the resin-phase forming this main part (31).In addition, heat conduction component (32) forms a part for the heat conduction path of LED module (10) and lamp holder (500).

Description

Lamp
Technical field
The utility model relates to the lamp of the semiconductor light-emitting elements such as LED as light source, particularly relates to the improvement of the withstand voltage structure of heavy insulation.
Background technology
In recent years, the semiconductor light-emitting elements of such as LED is popularized gradually as the lamp of light source.As one example, Patent Document 1 discloses the bulb-shaped lamp of LED as light source.
Figure 21 is the sectional view of the schematic configuration of the bulb-shaped LED representing patent document 1.As shown in figure 21, LED 1800 (hereinafter referred to as lamp 1800) possesses: carried the LED module 1810 of LED1812, for making the circuit unit 1820 of this LED module 1810 lighting, covering the circuit case 1835 of circuit unit 1820, being formed as covering the framework 1831 of circuit case 1835, the enclosed globe shade 1840 being assemblied in framework 1831 and the lamp holder 1850 be connected with framework 1831 via circuit case 1835.Framework 1831 is made up of metal, and circuit case 1835 is made up of resin.LED module 1810 and framework 1831 realize insulation by insulation division 1814.
Framework 1831 is made up of the high material of heat conductivity and metal, and the heat therefore produced by LED module 1810 is delivered to lamp holder 1850 from framework 1831, dispels the heat from the socket of lamp holder 1850 via lighting device to lighting device, wall and ceiling.Thus, the heat retention produced by LED module 1810, in its periphery, can suppress the heat labile component damage as circuit unit 1820.
At first technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2009-037995 publication
The summary of utility model
The problem that utility model will solve
Generally speaking, electrical equipment requires dielectric voltage withstand, and lamp is no exception.The dielectric voltage withstand of lamp is by evaluating with the test method that the high voltage applying between lamp holder to exchange also measures the size of the electric current flowed between which the outer surface of framework.But, use lamp in Japan with rated voltage 100V, but use lamp with rated voltage 220V to 250V time state-owned outside.For this reason, the high voltage applied in dielectric voltage withstand test is such as 1kV when the product of Japanese specification, and when the product of foreign specification, existence is strictly the situation of 4kV than Japanese specification.Further, owing to also using lamp in foreign country, the therefore dielectric voltage withstand test of demand fulfillment foreign country specification.
In above-mentioned lamp in the past, framework is made up of the metal that electric conductivity is high, and after therefore applying high voltage when dielectric voltage withstand is tested to the outer surface of framework, framework entirety all becomes high potential.For this reason, when existing with position close between framework and Circuits System (comprising lamp holder, circuit unit and semiconductor light-emitting elements), the electric-field intensity of there may uprise and produce insulation breakdown.On the other hand, consider to make the size of framework become large and the distance of framework and Circuits System be defined as necessarily, thus suppress electric-field intensity to become too high.But, require that LED is the size with incandescent lamp same degree, so it is also limited for making the size of framework become greatly.
Utility model content
The utility model is made in view of problem as above, its object is to, and provides a kind of heat that can make to be produced by illuminating module dispel the heat and can improve the lamp of dielectric voltage withstand performance.
For solving the means of problem
In order to reach above-mentioned object, the feature of the lamp involved by the utility model is to possess: illuminating module, has installation base plate and the semiconductor light-emitting elements being installed on this installation base plate; The framework of tubular, one end is configured with illuminating module; Lamp holder, is configured at the other end of framework; And circuit unit, by the feed path of getting involved in from lamp holder to illuminating module, framework has: the main part of the tubular be made up of resin; And heat-conduction part, be configured at the illuminating module side of the inner surface of this main part at least partially, and be made up of the material higher than heat conductivity with the resin-phase forming this main part, heat-conduction part forms a part for the heat conduction path of illuminating module and lamp holder.
The effect of utility model
In lamp of the present utility model, the main part as the outer surface of framework is made up of the resin that insulating properties is excellent, even if therefore apply high voltage to the outer surface of framework, framework entirety also not easily all becomes high potential.Therefore, even if there is close position between framework and Circuits System, the electric-field intensity of there also not necessarily uprises.Therefore, it is possible to suppress to produce insulation breakdown between framework and Circuits System, its result, the dielectric voltage withstand performance of lamp can be improved.
In addition, heat-conduction part forms a part for the heat conduction path of illuminating module and lamp holder.Therefore, the heat produced by LED module, from heat-conduction part to main part transmission, and then from main part to lamp holder transmission, and is dispelled the heat from the socket of lamp holder via lighting device to lighting device, wall and ceiling.
As described above, the heat that can make to be produced by illuminating module can be provided to dispel the heat and the lamp of dielectric voltage withstand performance can be improved.
Accompanying drawing explanation
Fig. 1 is the sectional view of the schematic configuration of the LED representing the first embodiment.
Fig. 2 is the amplification sectional view of part surrounded with double dot dash line represented in Fig. 1.
Fig. 3 is the exploded perspective view of the schematic configuration of the LED representing the first embodiment.
Fig. 4 is the sectional view of the schematic configuration of variation that represent the LED of the first embodiment, heat-conduction part.
Fig. 5 (a) ~ Fig. 5 (c) is the exploded perspective view of the schematic configuration of variation that represent the LED of the first embodiment, heat-conduction part, Fig. 5 (a) is the figure representing the second variation, Fig. 5 (b) is the figure representing the 3rd variation, Fig. 5 (c) is the figure representing the 4th variation.
Fig. 6 is the sectional view of the schematic configuration of that represent the LED of the first embodiment, illuminating module and heat-conduction part variation.
Fig. 7 is the sectional view of the schematic configuration of that represent the LED of the first embodiment, illuminating module and heat-conduction part variation.
Fig. 8 is the sectional view of the schematic configuration of that represent the LED of the first embodiment, framework and heat-conduction part variation.
Fig. 9 is the sectional view of the schematic configuration of the LED representing the second embodiment.
Figure 10 is the sectional view of the schematic configuration of the LED representing the 3rd embodiment.
Figure 11 is the sectional view of the schematic configuration of the LED representing the 4th embodiment.
Figure 12 is the partial section of the schematic configuration of the lighting device representing the 5th embodiment.
Figure 13 is the sectional view of the schematic configuration of the LED representing the 6th embodiment.
Figure 14 (a) ~ Figure 14 (c) is the figure of position relationship of circuit substrate in the circuit retainer of the lamp representing the 6th embodiment, groove portion and guiding elements, Figure 14 (a) is the incision stereogram of circuit retainer, to be the figure of the position relationship schematically shown from the circuit substrate in circuit retainer during top view, groove portion and guiding elements, Figure 14 (c) be Figure 14 (b) schematically shows the sectional view of the position relationship from the groove portion in circuit retainer when laterally observing and guiding elements.
Figure 15 is the sectional view of the schematic configuration of the LED representing the 7th embodiment.
Figure 16 (a) ~ Figure 16 (c)
Be the lamp representing the 8th embodiment circuit retainer in circuit substrate, groove portion and guiding elements the figure of position relationship, Figure 16 (a) is the incision stereogram of circuit retainer, to be the figure of the position relationship schematically shown from the circuit substrate in circuit retainer during top view, groove portion and guiding elements, Figure 16 (c) be Figure 16 (b) schematically shows the sectional view of the position relationship from the groove portion in circuit retainer when laterally observing and guiding elements.
Figure 17 (a) ~ Figure 17 (c)
Be the lamp representing the 9th embodiment circuit retainer in circuit substrate, groove portion and guiding elements the figure of position relationship, Figure 17 (a) is the incision stereogram of circuit retainer, Figure 17 (b) is the figure of the position relationship schematically shown from the circuit substrate in circuit retainer during top view, groove portion and guiding elements, Figure 17 (c)
It is the sectional view of the position relationship schematically shown from the groove portion in circuit retainer when laterally observing and guiding elements.
Figure 18 (a) ~ Figure 18 (c) is the figure of position relationship of circuit substrate in the circuit retainer of the lamp representing the tenth embodiment, groove portion and guiding elements, Figure 18 (a) is the incision stereogram of circuit retainer, to be the figure of the position relationship schematically shown from the circuit substrate in circuit retainer during top view, groove portion and guiding elements, Figure 18 (c) be Figure 18 (b) schematically shows the sectional view of the position relationship from the groove portion in circuit retainer when laterally observing and guiding elements.
Figure 19 is the sectional view of the structure of the LED representing the 11 embodiment.
Figure 20 is the stereogram of the heat conduction component of the 12 embodiment.
Figure 21 is the sectional view of the schematic configuration of the LED represented in the past.
Detailed description of the invention
< first embodiment >
Describe in detail for implementing the first embodiment of the present utility model with reference to accompanying drawing.
The material used in the embodiment of utility model, numerical value are only illustrate preferred example, are not limited to which.In addition, can suitably change in the scope not departing from technological thought of the present utility model.In addition, in the scope not producing contradiction can with the combination of other embodiment.
And then, utilize LED (Light Emitting Diode) as the mode of semiconductor light-emitting elements in this explanation, but semiconductor light-emitting elements also can be such as LD (laser diode) or organic illuminating element.In addition, in the whole figure comprising Fig. 1, Fig. 2, the not necessarily unification of the engineer's scale between each component.In addition, the symbol " ~ " used when representing number range comprises the numerical value at its two ends.
1. structure
Fig. 1 is the sectional view of the structure of the LED representing the first embodiment.Fig. 2 is the amplification sectional view of part surrounded with double dot dash line represented in Fig. 1.Fig. 3 is the exploded perspective view of the schematic configuration representing the LED shown in Fig. 1.In figure 3, the omission such as LED module 10, circuit unit 20.
LED 1 possesses: the lamp holder 50 that LED module 10, the circuit unit 20 LED12 being supplied to electric power, the framework 30 circuit unit 20 being contained in inside, the enclosed globe shade 40 being assemblied in framework 30 via silicon 80 are electrically connected with circuit unit 20.And then lamp 1 possesses the module plate 60 be arranged in this framework 30, LED module 10 is mounted in the upper surface of module plate 60.Framework 30 comprises: the main part 31 of the tubular be made up of resin and be arranged at the heat conduction component 32 be made up of metal of inner side of main part 31.
In addition, the single dotted broken line drawn in Fig. 1 represents the cylinder axle J of framework 30.J is consistent with the lamp axle of lamp 1 and the rotating shaft of lamp holder 50 for cylinder axle.
(1) LED module
LED module 10 has: installation base plate 11, is the metallic matrix substrate be made up of resin plate and metallic plate; And be installed on multiple LED12 of this installation base plate 11.
The shape of installation base plate 11 is such as discoideus.On installation base plate 11, LED12 around plectane central shaft and equiangularly interval is mounted to circular.In addition, the number of LED12 corresponds to the light quantity required by LED 1 and suitably determines.When the number of LED12 is one, LED12 is configured at the central authorities of installation base plate 11.The shape of installation base plate 11 is not limited to discoideus, also can get the arbitrary shapes such as such as oval tabular.
LED module 10 is arranged in framework 30 towards the state of the opposition side of lamp holder 50 to make the injection direction of light.The assembling of installation base plate 11, be the opposition side of the lamp holder 50 by being fixedly connected on module plate 60 with bonding agent face on carry out.In addition, installation base plate 11 is assembled to the method on module plate 60, except using except bonding agent, also can use be spirally connected, other the method such as lock structure.In addition, installation base plate 11 is in order to make LED module 10 and module plate 60 electric insulation, and the upper surface of installation base plate 11 becomes insulating barrier.Installation base plate 11 also can be ceramic substrate, resin substrate.In the case, pottery or resin itself become insulant.
In addition, the LED12 as blue LED die is provided with yellow fluorophor in the above.Thus, the blue light that LED12 produces is transformed to white light.LED12 can use COB (Chip on Board) technology to be installed on the upper surface of installation base plate 11, also can use the device of SMD (Surface Mount Device) type and install.In addition, LED12 is in series electrically connected by the wiring pattern of installation base plate 11.
(2) circuit unit
Circuit unit 20 comprises circuit substrate 21 and is installed on the various electronic units 22,23 of circuit substrate 21, and is contained in framework 30.Circuit substrate 21 is to the assembling of module plate 60, and the circuit retainer 62 consisted of with by resin the peripheral part of circuit substrate 21 engages and carries out.In addition, as the method that circuit substrate 21 assembles to module plate 60, except utilizing engaging, also bonding agent etc. can be used.In addition, also main part 31 can be fixed on by pawl etc.In addition, for simplicity, electronic unit only used " 22 ", " 23 " these two symbols, but except " 22 ", " 23 ", also has electronic unit, by these electronic unit 22,23 forming circuit unit 20.
Circuit unit 20 is inserted into the feed path from lamp holder 50 to LED module 10.Specifically, circuit unit 20 and lamp holder 50 are electrically connected by wiring 71,72, and circuit unit 20 accepts electric power from lamp holder 50, make LED module 10 luminous.Wiring 71,72 is such as by lead-in wire that the insulating components such as resin are coated.
(3) framework
As mentioned above, framework 30 comprises the main part 31 be made up of resin and the heat conduction component 32 be made up of metal.In addition, framework 30 is that one end is configured with lamp holder 50, and the other end is configured with LED module 10, and inside accommodates circuit unit 20.
(3-1) main part
Main part 31 is, is configured with one end of LED module 10 and the internal diameter of the opening portion 31a taper tubular larger than the internal diameter of the other end and opening portion 31b that are configured with lamp holder 50.Opening portion 31a is equipped with module plate 60 and enclosed globe shade 40, and opening portion 31b is equipped with lamp holder 50.
In the 31a side, opening portion of main part 31, be formed with groove portion 31c continuously along its periphery.Groove portion 31c is located at the position of the centre of opening portion 31a and opening portion 31b.Lamp holder 50 side end of heat conduction component 32 is imbedded at groove portion 31c.
In addition, in the 31a side, opening portion of main part 31, inboard cylinder portion 31d is also formed with.The inboard cylinder portion 31d be made up of resin is located between the circuit unit 20 being applied in voltage and the heat conduction component 32 be made up of metal.By arranging inboard cylinder portion 31d like this, the insulation between circuit unit 20 and heat conduction component 32 can be strengthened.In addition, inboard cylinder portion 31d can be formed with other parts of main part 31 simultaneously, thus with arrange compared with other components between circuit unit 20 with heat conduction component 32, can manufacturing process be reduced.
Main part 31 is such as made up of resins such as PBT, PET, PES, PC, PPS, PA, silicon.In addition, the material of main part 31 is not limited to resin, also can use material such as pottery, the glass etc. that can guarantee insulating properties.
(3-2) heat-conduction part
As shown in Figure 3, heat conduction component 32 is shape, i.e. taper tubulars of the inner surface along main part 31.In addition, as shown in Figure 1, till heat conduction component 32 extends to the groove portion 31c of main part 31 from the end of LED module 10 side in the plectane portion 61 of module plate 60.Further, heat conduction component 32 has ora terminalis 32a in lamp holder 50 side, has ora terminalis 32b in LED module 10 side.In addition, at this, heat conduction component 32 is shapes of the inner surface along main part 31, very close to each other between the inner surface and heat conduction component 32 of main part 31, but is not limited thereto structure.Such as, the heat conduction component 32 having the shape in gap between the inner surface and heat conduction component 32 of main part 31 can also be adopted.
Heat conduction component 32 forms a part for the heat conduction path of LED module 10 and lamp holder 50.At this said " forming a part for heat conduction path ", refer to that the heat produced by LED module 10 is delivered to lamp holder 50 via heat conduction component 32.Further, heat conduction component 32 is made up of the metal higher than heat conductivity with the resin-phase forming main part 31, compared with the main part 31 therefore formed with by resin, heat can be made to transmit rapidly.
On the cylinder axle J direction of framework 30, the distance L1 from the lamp holder 50 side edge 32a to the LED module 10 side edge 50a of lamp holder 50 of heat conduction component 32 is 20mm.In addition, if L1 is below 40mm, then can be said to heat conduction component 32 and form LED module 10 and a part for the heat conduction path of lamp holder 50, the thermal conduction effect that the heat of LED module 10 is dispelled the heat can be expected.In addition, the thickness of heat-conduction part if more than 0.5mm, then can make heat transmit more quickly, is to wish.
In addition, in order to make the heat produced by LED module 10 effectively be dispelled the heat by heat conduction component 32, require that the end of LED module 10 side of heat conduction component 32 is positioned near LED module 10.Specifically, on the cylinder axle J direction of framework 30, the LED module 10 side edge 32b of heat conduction component 32 gives prominence to from the face 61b of module plate 60 and configures, and this distance L2 is 0mm ~ 10mm.Thereby, it is possible to via the silicon 80 that the open end 41 of enclosed globe shade 40 is fixed with framework 30 and module plate 60, the heat produced by LED module 10 is dispelled the heat effectively by heat conduction component 32.
Heat conduction component 32 is such as made up of metals such as Al (aluminium), Cu (copper), Fe (iron).In addition, the material of heat conduction component 32 is not limited to metal, also can use the material pottery that heat conductivity is high compared with main part 31, such as Al 2o 3(aluminium oxide: alumina).And, as the material of heat conduction component 32, also can use heat conductivity is high compared with main part 31 high thermal conductivity resin, namely be dispersed with the blending resin of metallic or pottery, such as, be mixed with in resin material by AlN (aluminium nitride), Fe, C (carbon), Al 2o 3the material with the filler of heat conductivity formed.
In addition, between ora terminalis 32a, 32b and main part 31 of heat conduction component 32, space is provided with.Thus, when heat conduction component 32 thermal expansion, the be full of cracks etc. of the resin material caused with the thermal expansion difference of aluminium etc. can be absorbed.In addition, also can not installation space between ora terminalis 32a, 32b and main part 31 of heat conduction component 32.This structure can make LED 1 be formed compacter.
(4) enclosed globe shade
Enclosed globe shade 40 is made up of the light-transmitting member such as glass, resin, such as, be general dome shape.Enclosed globe shade 40 covers module plate 60 in the mode covering LED module 10, and its open end 41 is embedded in the groove of module plate 60, is fixed on framework 30 and module plate 60 thus.Further, silicon 80 is injected in the gap between open end 41 and the upper surface of framework 30 and module plate 60.By injecting the silicon 80 good with the close property of the metal forming module plate 60, can make enclosed globe shade 40, framework 30 and heat conduction component 32, module plate 60 fixing more firmly bonding.
From LED module 10 penetrate light after the opening portion 31a transmission enclosed globe shade 40 of main part 31 to external exit.Also to the inner surface of enclosed globe shade 40, outer surface or the inner DIFFUSION TREATMENT implementing the light diffusion making to penetrate from LED module 10, such as, the DIFFUSION TREATMENT of silica, Chinese white etc. can be utilized.
(5) lamp holder
The opening portion 31b of main part 31 is located at by lamp holder 50.Lamp holder 50 has all kinds, is not particularly limited, but uses at this lamp holder screwing in type, such as E26.
Lamp holder 50 comprises: shell portion 51, is installed on main part 31; And electric eye portion 52, be located at the end of the opposition side of the main part 31 of lamp holder 50.Shell portion 51 is electrically connected with circuit unit 20 via wiring 71, and electric eye portion 52 is electrically connected with circuit unit 20 via wiring 72.The outer peripheral face in shell portion 51 in the shape of a spiral, and adheres to framework 30.Wiring 72 is brazed in the front end in electric eye portion 52.
(6) module plate
Module plate 60 is made up of metal or glass-ceramics etc. such as such as Al (aluminium), Cu (copper), Fe (iron), the face of enclosed globe shade 40 side is carried LED module 10, and its side connects with framework 30.Plectane portion 61 has hole for Gong being routed through or peripheral part otch.In plectane portion 61, be equipped with circuit retainer 62 towards lamp holder 50 side by bonding agent, this circuit retainer 62 is provided with multiple from plectane portion 61, and is made up of resin.Module plate 60 is not limited to above-mentioned shape, can get arbitrary shape.
Module plate 60 is undertaken to the assembling of framework 30 by making the side in plectane portion 61 be locked to framework 30.In addition assembly method, also can utilize such as screw, bonding agent etc.Circuit retainer plectane portion 61 and circuit retainer 62 assemble in the mode on the central shaft being centrally located at circuit retainer 62 in plectane portion 61.The wiring 71,72 of further, from module plate 60 to the electrical connection of LED module 10 although not shown, but from lamp holder 50 side stretching out is connected by the Kong Houyu LED module 10 in plectane portion 61.
2. heat dissipation path and insulation
In lamp 1, the heat produced by LED12 is delivered to main part 31 from module plate 60 via heat conduction component 32.And this heat transfers heat to lamp holder 50 from main part 31, from the socket of lamp holder 50 via lighting device, reject heat to lighting device, wall, ceiling.
Therefore, such as when in order to improve brightness improve the turn-on current of LED12 thus luminous time the heat that produces of LED12 increase, this heat also can be made to dispel the heat from lamp holder 50 to lighting device side.
In addition, as mentioned above, between circuit unit 20 and the inner surface of heat conduction component 32, the inboard cylinder portion 31d be made up of the resin of insulating properties is formed with, therefore, it is possible to guarantee insulation.
3. effect
Pass through said structure, when dielectric voltage withstand is tested, even if at outer surface and the high voltage applying between lamp holder 50 to exchange of the main part 31 be made up of resin, also not easily produce insulation breakdown at the inner surface of framework 30 and between the inner surface of heat conduction component 32 and LED module 10 etc.Like this, can suppress to produce insulation breakdown, its result between framework 30 and LED module 10 and circuit unit 20, the dielectric voltage withstand performance of lamp 1 can be improved.
In addition, the heat produced by LED12 is delivered to heat conduction component 32 from module plate 60, and then transfers heat to lamp holder 50 via framework 30.Afterwards, this heat from lamp holder 50 via lighting device socket to lighting device, wall, ceiling heat radiation.Like this, the heat heat radiation produced by LED module 10 can be made.For this reason, heat is not easily stuck in framework 30, can suppress heat labile circuit unit 20 equivalent damage.
4. variation
Below record the variation of the lamp 1 of the first embodiment.
(1) relevant with heat-conduction part variation
Heat-conduction part is not limited to the heat-conduction part shown in the lamp of the first embodiment, also can be different structures.
(1-1) the first variation
The sectional view of the lamp 100 as the first variation is shown in Fig. 4.As shown in Figure 4, except the first variation of framework 130, structure is roughly the same with lamp 1.In addition, about the structure identical with the structure illustrated in the first embodiment, use the symbol identical with the first embodiment.
Till near lamp holder 50 side that heat conduction component 132 arrives main part 131.Specifically, the distance L1 lamp holder 50 side edge 132a to the LED module 10 side edge 50a of lamp holder 50 on the cylinder axle J direction of framework 130, heat conduction component 132 is 6mm.
In heat conduction component 132, compared with the heat conduction component 32 in lamp 1, the lamp holder 50 side edge 132a of heat conduction component 132 and the distance of lamp holder 50 less.Thereby, it is possible to make the heat produced by LED module 10 pass to lamp holder 50 side rapidly.For this reason, the heat produced by LED module 10 can be made to dispel the heat rapidly further.
(1-2) the second variation
Using the three-dimensional icon of the heat conduction component 232 as the second variation in Fig. 5 (a).Except heat conduction component 232, structure is roughly the same with lamp 1.
Heat conduction component 232 is the tubulars of the opening 232a with multiple square shape, becomes concavo-convex or through hole.Heat conduction component 232 heat conduction component 132 in lamp 100 is set to concavo-convex component, so can guarantee heat conductivity.In addition, the area of dissipation of heat conduction component 232 increases, and then can improve heat conductivity.In addition, because the volume of heat conduction component 232 can be reduced, so the lamp of more light weight can be provided.Further, when assembling lamp, can imbed resin in the opening 232a of heat conduction component 232, in the case, compared with there is the structure of air in opening 232a, can guarantee heat conductivity, the fixing of heat conduction component 232 also easily carries out.
(1-3) the 3rd variation
Using the three-dimensional icon of the heat conduction component 332 as the 3rd variation in Fig. 5 (b).Except heat conduction component 332, structure is roughly the same with lamp 1.
Heat conduction component 332 comprises multiple bar-shaped portion 332a and two annulus 332b, 332c.Extend from LED module 10 side direction lamp holder 50 side, the two ends of bar-shaped portion 332a are assemblied in annulus 332b, 332c respectively.Therefore, can say that heat conduction component 332 has gap.In addition, when the assembling of lamp, resin is imbedded at opening portion 332d in the same manner as the second variation.In the case, also can guarantee heat conductivity in the same manner as the second embodiment, and the lamp of more light weight can be provided.In addition, annulus 332b is the shape of the periphery along LED module 10, therefore, it is possible to make the heat produced by LED module 10 effectively be delivered to bar-shaped portion 332a.Further, annulus 332c is the shape of the opening along lamp holder 50, therefore, it is possible to make the heat passing to bar-shaped portion 332a effectively be delivered to lamp holder 50.In addition, heat conduction component 332 has gap, so easily fix.In addition, the gap of opening portion 332d can be one, also can be only the one party in 332b or 332C.In addition, gap portion can be one, also can be do not imbed resin in the 332d of opening portion.
In addition, also can be only being formed with the multiple bar-shaped portion 432a extended from LED module 10 side direction lamp holder 50 side as Fig. 5 (c), and when the assembling of lamp, in the 432b of opening portion, imbed the heat conduction component 432 of resin in the same manner as the second variation.Even do not have the heat conduction component 432 of annulus, also heat conductivity can be guaranteed in the same manner as heat conduction component 332.In addition, in the same manner as heat conduction component 332, heat conduction component 432 has gap, so easily fix.In addition, because not there is annulus, so this effect of lamp that can provide more light weight also can be obtained.In addition, heat conduction component 432b can be one, also can be in addition not imbed resin in the 432b of opening portion.
(1-4) the 4th variation
The sectional view of the lamp 500 as the 4th variation is shown in Fig. 6.As shown in Figure 6, except the variation of illuminating module and heat conduction component, structure is roughly the same with lamp 100.In addition, about the structure identical with the structure illustrated with lamp 100, use the symbol identical with lamp 100.
Illuminating module 510 comprises installation base plate 511 and LED12.Installation base plate 511 is discoideus along main part 131.Illuminating module 510 is fixed on main part 131 and heat conduction component 132 by locking.In addition, illuminating module 510 connects with heat conduction component 132.
By this structure, the heat produced by illuminating module 510 can be made more effectively to pass to lamp holder 50 side from heat conduction component 132.
(1-5) the 5th variation
The sectional view of the lamp 600 as the 5th variation is shown in Fig. 7.As shown in Figure 7, except the variation of illuminating module and heat conduction component, be the structure roughly the same with lamp 100.In addition, about the structure identical with the structure illustrated with lamp 100, use the symbol identical with lamp 100.
Heat conduction component 632 comprises: along main part 131 cylinder portion 633 and carried the platform portion 634 of LED12.Thereby, it is possible to make the heat produced by LED12 more effectively pass to lamp holder 50 side from heat conduction component 632.
(1-6) the 6th variation
The sectional view of the lamp 700 as the 6th variation is shown in Fig. 8.As shown in Figure 8, except the variation of main part, structure is roughly the same with lamp 100.In addition, about the structure identical with the structure illustrated with lamp 100, use the symbol identical with lamp 100.
Main part 731 does not have the inboard cylinder portion 31d in lamp 1.In lamp 700, between circuit unit 20 and heat conduction component 132, there is distance, thus the insulation of realizing circuit unit 20 and heat conduction component 132.Adopt this main part 731, the formation of framework 730 becomes easy.
(1-7) other variation
In above-mentioned variation, heat conduction component and main part touch, but are not limited thereto, and heat conduction component also can not touch with main part.Specifically, if module plate contacts with heat conduction component and also contacts with main part, then heat can be made to pass to main part from heat conduction component.In the case, the heat produced by LED module also can be made to pass to lamp holder side from heat conduction component.
< second embodiment >
In this second embodiment, illustrate that the inner surface in framework is also provided with the lamp of the insulation division be made up of resin.In addition, about the structure identical with the structure illustrated in the first embodiment, use the symbol identical with the first embodiment.
(1) structure
Fig. 9 is the sectional view of the structure of the LED 800 representing the second embodiment.
LED 800 possesses LED module 10, circuit unit 20, framework 830, enclosed globe shade 40, lamp holder 50 and module plate 60.Framework 830 comprises the main part 831 be made up of resin and the heat conduction component 832 be made up of metal.At the inner surface of framework 830 and the inner surface of heat conduction component 832, and be formed with insulation division 833 between heat conduction component 832 and LED module 10.At the inner peripheral surface of main part 831, do not form the part that inboard cylinder portion 31d in embodiment 1 is such.
Insulation division 833 is with the difference of inboard cylinder portion 31d, and the inner surface of cover heating conductive members 832 all and be configured between module plate 60 and framework 830.
(2) effect
In the structure shown here, even if do not form the inboard cylinder portion 31d in embodiment 1, by forming the insulation division 833 be made up of resin, the insulating properties between LED module 10 and framework 830 and between circuit unit 20 and framework 830 also can be improved.In addition, the inner surface of insulation division 833 cover heating conductive members 832 all and be configured between module plate 60 and framework 830, so compared with being provided with the embodiment 1 of inboard cylinder portion 31d, can improve the insulating properties between LED module 10 and framework 830.Like this, can suppress to produce insulation breakdown, its result between framework 830 and LED module 10 and circuit unit 20, the dielectric voltage withstand performance of lamp 800 can be improved.
< the 3rd embodiment >
In the third embodiment, insulation in order to circuit case and framework is described and is provided with the lamp of circuit case.In addition, about the structure identical with the structure illustrated in the second embodiment, use the symbol identical with the second embodiment.
(1) structure
Figure 10 is the sectional view of the structure of the lamp 900 representing the 3rd embodiment.
Lamp 900 possesses LED module 10, circuit unit 20, framework 930, circuit case 980, enclosed globe shade 40, lamp holder 50 and module plate 60.Circuit case 980 is made up of the resin of insulating properties, is formed as the cylindrical shape of surrounding circuit unit 20 entirety.The material of circuit case 980 is not limited to resin, as long as the material of insulating properties, the shape of circuit case 980 is not limited to cylindrical shape, also can adopt other the shape this of taper tubular.
(2) effect
In the structure shown here, even if do not form the inboard cylinder portion 31d in embodiment 1, by covering circuit unit 20 by circuit case 980, the insulating properties of circuit unit 20 and framework 30 can be improved.In addition, it is overall that circuit case 980 surrounds circuit unit 20, so can improve the insulating properties of circuit unit 20 and framework 30 further.Like this, can suppress to produce insulation breakdown, its result between framework 930 and LED module 10 and circuit unit 20, the dielectric voltage withstand performance of lamp 900 can be improved.
< the 4th embodiment >
In the 4th embodiment, the lamp of the circuit unit employing longitudinal type is described.In addition, about the structure identical with the structure illustrated in the second embodiment, use the symbol identical with the second embodiment.
(1) structure
Figure 11 is the sectional view of the structure of the lamp 1000 representing the 4th embodiment.Circuit unit 1020 is different from the circuit unit 20 that horizontal type constructs, and becomes the structure of longitudinal type.Circuit unit 1020 is fixed by the insertion rail 1062 be made up of metal.
(2) effect
When using longitudinal type circuit unit 1020, the space in framework 130 becomes large, easily guarantees the insulating properties between heat conduction component 132 and circuit unit 1020.
< the 5th embodiment >
In the 5th embodiment, the ligthing paraphernalia having installed the lamp 100 shown in Fig. 4 is described.In addition, about the structure identical with the structure illustrated with lamp 100, use the symbol identical with lamp 100.
Figure 12 is the partial section of the structure of the ligthing paraphernalia representing the 5th embodiment.Ligthing paraphernalia 1100 is so-called lower photograph ligthing paraphernalias.Ligthing paraphernalia 1100 possesses: bowl-shape reflecting plate 1100a, and the light sent from lamp 100 is reflected to prescribed direction; Connecting portion 1100b, is connected with the power supply of outside; And socket 1100c, be electrically connected with lamp 100 and keep lamp.The end 1100d of socket 1100c is arranged in the scope of the L1 of the lamp 100 of Fig. 4, is 6mm at this L1.
In addition, the structure of the lighting device shown in Figure 12 is a simple example, is not limited to aforesaid lower photograph ligthing paraphernalia.
< the 6th embodiment >
In the 6th embodiment, the lamp employing the longitudinal type circuit unit 1020 shown in the 4th embodiment is described.In addition, about the structure identical with the structure illustrated in the 4th embodiment, use the symbol identical with the 4th embodiment.
(1) structure
Figure 13 is the sectional view of the structure of the lamp 1200 representing the 6th embodiment.The circuit unit 1020 of the structure of longitudinal type is fixed by circuit retainer 1270.
Circuit retainer 1270 comprises large-diameter portion 1272 and minor diameter part 1273, and circuit unit 1020 is contained in inside.Large-diameter portion 1272 and minor diameter part 1273 are such as the substantially cylindrical shapes of both-side opening, are connected to each other in the axial direction in the mode that the axle of cylinder is consistent with lamp axle and form as one.The large-diameter portion (the 2nd housing department) 1272 being positioned at front side accommodates the more than half of circuit unit 1020, and a part for circuit unit 1020 is contained in the minor diameter part (the 1st housing department) 1273 being positioned at rear side.
At the inner peripheral surface of large-diameter portion 1272, be equipped with the guiding elements 1281 for rectangular tabular on the direction along lamp axle.Guiding elements 1281, when circuit unit 1020 is inserted in circuit retainer 1070, is slidably connected with the side end of the interarea side of a side of the circuit substrate 1021 of circuit unit 1020, thus circuit unit 1020 is directed to its position that should be received.
At the inner peripheral surface of minor diameter part 1273, be axially provided with groove portion (the 2nd limiting member) 1282 along lamp, and the side end of the circuit substrate 1021 of chimeric circuit unit 1020, limiting circuit substrate 1021 moves to both sides in a thickness direction thus.The width (length from the direction that the inner peripheral surface of circuit retainer leaves) in groove portion 1282 is specifically such as 2mm, but is not limited thereto.
In addition, preferably, circuit retainer 1270 is such as formed with Ins. ulative material such as resins.
On the installation base plate 1211 of LED module 1210, cover piece 1278 is assemblied in the front side end of circuit retainer 1270.Cover piece 1278 is such as have bottom tube-like or hat shape, is held in installation base plate 1211 across main part 1281 at the front side of large-diameter portion 1272 with bottom state toward the front.
(2) circuit unit is to shell storage and maintaining body
Figure 14 (a) ~ Figure 14 (c) is the figure of position relationship of circuit substrate 1021 in the circuit retainer 1270 of indication lamp 1200, groove portion 1282 and guiding elements 1281.Figure 14 (a) is the incision stereogram of circuit retainer.Figure 14 (b) is the figure of the position relationship schematically shown from the circuit substrate in circuit retainer during top view, groove portion and guiding elements.Figure 14 (c) is the sectional view of the position relationship schematically shown from the groove portion in circuit retainer when laterally observing and guiding elements.In addition, in Figure 14 (c), omit diagram about circuit substrate 1021.
As shown in Figure 13, Figure 14 (a) ~ Figure 14 (c), a pair groove portion 1282 is located at the opposed position of the inner peripheral surface of minor diameter part 1273 respectively.Pair of plate-shaped component 1282a and 1282b in groove portion 1282 vacates mutually the interval (and the thickness of circuit substrate 1021 roughly equal interval) of regulation, and erects abreast on the inner peripheral surface being formed at minor diameter part 1273 relative to the direction along lamp axle.
In addition, on the inner peripheral surface of large-diameter portion 1272, a pair guiding elements 1281 for rectangular tabular on the direction along lamp axle is equipped with.The face of the inner side of tabular component 1282a and the interarea of a side of guiding elements 1281 are positioned on the same plane parallel with lamp axle J1, and tabular component 1282a and guiding elements 1281 are positioned at phase the same side relative to this plane.Thus, when circuit unit 1020 is inserted into, tabular component 1282a and guiding elements 1281 connect with the same interarea of circuit substrate 1021.Therefore, when circuit unit 1020 is inserted into its inside from the upper end side opening of circuit retainer 1270, make the side edge part of circuit substrate 1021 while slide while mobile along guiding elements 1281, circuit substrate 1021 is directed to groove portion 1282 and is embedded into groove portion 1282 thus.And, now, mobile to direction of insertion (direction of insertion of circuit substrate 1021) i.e. below by block 1283 limiting circuit unit 1020, by the movement of the width of groove portion 1282 limiting circuit substrate 1021, thus, circuit unit 1020 is contained in circuit retainer 1270 inside in a fixed manner.
Like this, by arranging guiding elements 1281 at the upper side in groove portion 1282, the operation making circuit substrate 1021 chimeric with groove portion 1282 easily can be carried out.
In addition, in Figure 14 (b), Figure 14 (c), the state of the center passed through with the cylinder axle that circuit substrate 1021 is configured at circuit retainer 1270 for ease of understanding diagram illustrates.But in fact, as shown in figure 13, circuit substrate 1021 is configured at the position (following, to be also same in each figure that Figure 14 (a) ~ Figure 14 (c) is later) to radial deflection from the cylinder axle of circuit retainer 1270.In addition, guiding elements 1281 configures in the mode connected with the interarea of a side away from the cylinder axle of circuit substrate 1021.By like this at the position configuration circuit substrate from cylinder axle offset, in circuit retainer 1270, what become circuit substrate 1021 to connect than with guiding elements 1281 wide space, the interarea side of a side with the do not connect interarea side of a side of guiding elements 1281.Consequently, not connect the interarea side of a side with guiding elements 1281, can the higher electronic unit of configuration height.
(3) effect
When using circuit retainer 1270, easily guarantee the insulating properties between heat conduction component 132 and circuit unit 1020.
< the 7th embodiment >
In the 7th embodiment, the lamp of the variation employing the circuit retainer 1270 shown in the 6th embodiment is described.In addition, about the structure identical with the structure illustrated in the 6th embodiment, use the symbol identical with the 6th embodiment.
(1) structure
Figure 15 is the sectional view of the structure of the lamp 1300 representing the 6th embodiment.The circuit unit 1020 of the structure of longitudinal type is fixed by circuit retainer 1370.Circuit retainer 1370 has the shape having bottom tube-like, does not have cover piece.A part for main part 131 becomes circuit retainer 1370, thus, guarantees the electric insulation between main part 131 and lamp holder 50.
(2) effect
When using circuit retainer 1370, easily guarantee the insulating properties between heat conduction component 132 and circuit unit 1020.
< the 8th embodiment >
In the 8th embodiment, the lamp of the variation employing the circuit retainer 1270 shown in the 6th embodiment is described.In addition, about the structure identical with the structure described in the 6th embodiment, use the symbol identical with the 6th embodiment.
(1) structure
Figure 16 (a) ~ Figure 16 (c) is the figure of position relationship of the circuit substrate 1021 represented in the circuit retainer 1380 in the 8th embodiment, groove portion 1382 and guiding elements 1381.Figure 16 (a) is the incision stereogram of circuit retainer 1370.Figure 16 (b) is the figure of the position relationship schematically shown from the circuit substrate 1021 in the circuit retainer 1370 during top view, groove portion 1382 and guiding elements 1281.Figure 16 (c) schematically shows the sectional view from the groove portion 1382 in the circuit retainer 1370 when laterally observing with the position relationship of guiding elements 1381.In addition, in Figure 16 (c), omit diagram about circuit substrate 1021.
As shown in Figure 16 (a) ~ Figure 16 (c), at the inner peripheral surface of the minor diameter part 253 of circuit retainer 1370, be formed with groove portion 1382 in both sides, but at the inner peripheral surface of large-diameter portion 1372, be only formed with guiding elements 1381 one-sided.
(2) effect
In the structure shown here, be provided with guiding elements 1381 one-sided, this guiding elements 1381 becomes target when being inserted in circuit retainer 1370 by circuit unit 1020.Thus, when inserting circuit unit 1020, the side edge part being provided with guiding elements 1,381 one side in the edge, both sides on the width of circuit substrate 1021, need not pay special attention to the control of position.Therefore, compared with not being provided with the situation of guiding elements completely, operation is more easy.
< the 9th embodiment >
In the 9th embodiment, the lamp of the variation employing the circuit retainer 1270 shown in the 6th embodiment is described.In addition, about the structure identical with the structure described in the 6th embodiment, use the symbol identical with the 6th embodiment.
(1) structure
Figure 17 (a) ~ Figure 17 (c) is the figure of position relationship of the circuit substrate 1021 represented in the circuit retainer 1470 in the 9th embodiment, groove portion 1482 and guiding elements 1481.Figure 17 (a) is the incision stereogram of circuit retainer 1470.Figure 17 (b) is the figure of the position relationship schematically shown from the circuit substrate 1021 in the circuit retainer 1470 during top view, groove portion 1482 and guiding elements 1481.Figure 17 (c) schematically shows the sectional view from the groove portion 1482 in the circuit retainer 1470 when laterally observing with the position relationship of guiding elements 1481.In addition, in Figure 17 (c), omit diagram about circuit substrate 1021.
As shown in Figure 17 (a) ~ Figure 17 (c), at the inner peripheral surface of the large-diameter portion 452 of circuit retainer 1470, be formed with guiding elements 1481 in both sides, but at the inner peripheral surface of minor diameter part 1483, be only formed with groove portion 1482 one-sided.
(2) effect
In the case, be also provided with guiding elements in both sides, this guiding elements becomes target when being inserted in circuit retainer by circuit unit, and the operation of inserting circuit unit is thus more easy.In addition, be only provided with groove portion 1482 one-sided, but not being provided with the side edge part of circuit substrate of side, groove portion 1482, by guiding elements 1481, in the movement of the thickness direction of circuit substrate, limit towards the movement in the direction of guiding elements 1481.Thus, the movement of the thickness direction of circuit substrate is restricted to a certain extent, holds circuit unit 1020 in circuit retainer 1470 inside more stablely.
< the tenth embodiment >
In the tenth embodiment, the lamp of the variation employing the circuit retainer 1270 shown in the 6th embodiment is described.In addition, about the structure identical with the structure described in the 6th embodiment, use the symbol identical with the 6th embodiment.
(1) structure
Figure 18 (a) ~ Figure 18 (c) is the figure of position relationship of the circuit substrate 1021 represented in the circuit retainer 1570 in the tenth embodiment, groove portion 1582 and guiding elements 1581.Figure 18 (a) is the incision stereogram of circuit retainer 1570.Figure 18 (b) is the figure of the position relationship schematically shown from the circuit substrate 1021 in the circuit retainer 1570 during top view, groove portion 1582 and guiding elements 1581.Figure 18 (c) schematically shows the sectional view from the groove portion 1582 in the circuit retainer 1570 when laterally observing with the position relationship of guiding elements 1581.In addition, in Figure 18 (c), omit diagram about circuit substrate 1021.
As shown in Figure 18 (a) ~ Figure 18 (c), at the inner peripheral surface of the large-diameter portion 1572 of circuit retainer 1570, be only formed with guiding elements 1581 one-sided, at the inner peripheral surface of minor diameter part 1573, be only formed with groove portion 1582 one-sided.
(2) effect
In the case, be also provided with guiding elements one-sided, this guiding elements becomes target when being inserted in circuit retainer by circuit unit.Thus, when inserting circuit unit 1020, in the edge, both sides on the width of circuit substrate 1021, to be provided with guiding elements 1,581 one side side edge part, need not pay special attention to the control of position, therefore, compared with not being provided with the situation of guiding elements 1581 completely, it is more easy to operate.In addition, be only provided with groove portion 1582 one-sided, but be provided with the side edge part of the circuit substrate 1021 of side, groove portion 1582, the movement to the both sides of the thickness direction of circuit substrate 1021 is subject to the restriction in groove portion 1582.Thus, the movement of the thickness direction of circuit substrate is restricted in certain degree, inner at circuit retainer 1570, accommodates circuit unit 1020 more stablely.
< the 11 embodiment >
In the 11 embodiment, the lamp employing overall heat conduction component in uneven thickness is described.In addition, about the structure identical with the structure illustrated in the first embodiment, use the symbol identical with the first embodiment.
(1) structure
Figure 19 is the sectional view of the structure of the LED 1600 representing the 11 embodiment.
LED 1600 possesses LED module 10, circuit unit 20, framework 830, enclosed globe shade 40, lamp holder 50 and module plate 60.Framework 1630 comprises the main part 1631 be made up of resin and the heat conduction component 1632 be made up of metal.Be with the difference of embodiment 1, the thickness of heat conduction component 1632 is the thickest in the side that connects with LED module 10, and becomes thinner the closer to lamp holder 50 side.
(2) effect
In the structure shown here, the heat produced by LED module 10 can be made effectively to be delivered to lamp holder 50.
< the 12 embodiment >
In the 12 embodiment, illustrate that to employ the through hole of heat conduction component or the aperture opening ratio in gap minimum and become the lamp of higher component the closer to lamp holder side in the side that connects with illuminating module.In addition, about the structure identical with the structure illustrated in the first embodiment, use the symbol identical with the first embodiment.
(1) structure
Figure 20 is the stereogram of the heat conduction component 1732 of the 12 embodiment.Except heat conduction component 1732, structure is roughly the same with lamp 1.
Heat conduction component 1732 has the opening of multiple square shape and the tubular of through hole 1732a.The aperture opening ratio of the through hole 1732a of heat conduction component 1732 is minimum in the side that connects with LED module 10, and becomes higher the closer to lamp holder 50 side.In addition, also can replace through hole, use that to have aperture opening ratio minimum and become the heat conduction component in higher gap the closer to lamp holder 50 side in the side that connects with described illuminating module.
(2) effect
In the structure shown here, the heat produced by LED module 10 can be made effectively to be delivered to lamp holder 50.In addition, the smaller volume that makes heat conduction component 1732 can be provided and the lamp of more light weight.
Other variation > of <
1.LED module
(1) installation base plate
Installation base plate is not limited to the metallic matrix substrate comprising resin plate and metallic plate shown in embodiment etc., also can utilize the installation base plate that resin substrate, ceramic substrate etc. are existing.Installation base plate and carry the module plate of installation base plate be made up of conductive material time, also can arrange between installation base plate and module plate the electric insulation between LED module and module plate is strengthened, the insulating component such as insulating trip.
(2)LED
In embodiment etc., use a kind of LED, export white light from LED module (LED), but be not limited thereto.Such as, also can use these three kinds of LED of blue-light-emitting, emitting red light, green emitting, and these illuminant colour colour mixtures are become white light.In the case, the fluorophor not needing wavelength conversion used.
2. the shape of framework
In embodiment etc., the opening of framework is circle, but is not limited to circle, and the opening of framework also can be other shape.As other shape, there are ellipticity, polygonal shape etc.
3. the dielectric voltage withstand of circuit unit and heat-conduction part is guaranteed
In embodiment etc., form the insulation division be made up of resin in the inner side of heat conduction component or circuit case is set, thus ensure that the dielectric voltage withstand of circuit unit and heat-conduction part, but being not limited thereto.Such as, also can space potting resin between framework and circuit unit.
4. heat-conduction part
In variation, about the heat conduction component be made up of mesh-shape or bar-shaped portion, the distance L1 be set on the cylinder axle J direction of framework, from the lamp holder side edge of heat-conduction part to lamp holder LED module side edge is 6mm, but also can is 40mm ~ 5mm.As long as this degree, heat-conduction part just can be made to lighten and desired thermal diffusivity can be obtained.
5. module plate
In embodiment etc., formed module plate with metal, but be not limited thereto, also can by forming as the high thermal conductivity resin of the materials'use of heat-conduction part.When module plate is formed with high thermal conductivity resin, the heat produced by LED module can be made rapidly to framework heat radiation, and the insulating properties between LED module and framework can be improved further.In addition, the pyroconductivity of high thermal conductivity resin can be adjusted by the shape of filler and mixed volume, as this filler, glass, beryllium oxide, magnesia, zinc oxide, boron nitride, silicon nitride, titanium nitride, diamond, graphite, carborundum, titanium carbide, zirconium boride, boronation phosphorus, molybdenum silicide, sulfuration beryllium etc. can be used.
Industrial applicibility
LED of the present utility model, can utilize as the light source of various lighting device.
Symbol description
10 LED modules
11 installation base plates
The upper space of 11a installation base plate
12 LED
20 circuit units
30 frameworks
31 main parts
31a opening portion
31b opening portion
32 heat-conduction parts
The lamp holder side edge of 32a, 132a heat-conduction part
The illuminating module side edge of 32b heat-conduction part
50 lamp holders
The illuminating module side edge of 50a lamp holder
1,100,500,600 lamps
332a, 432a bar member
332c, 332d annular component
232a, 332d, 432b opening portion
533 insulation divisions
680 circuit cases
1270,1370,1470,1570 circuit retainers
L1, L2 distance
J framework cylinder axle

Claims (10)

1. a lamp, is characterized in that, possesses:
Illuminating module, has installation base plate and the semiconductor light-emitting elements being installed on this installation base plate;
The framework of tubular, one end is configured with described illuminating module;
Lamp holder, is configured at the other end of described framework; And
Circuit unit, is inserted into the feed path from described lamp holder to described illuminating module,
Described framework has: outside cylindrical portion, is made up of resin; Inner side cylindrical portion, is made up of resin, is present in the region of the described lamp holder side of the inner side of cylindrical portion outside this; And heat conduction component, be clipped in outside this between cylindrical portion and inner side cylindrical portion, be made up of the material higher than heat conductivity with the resin-phase forming cylindrical portion and inner side cylindrical portion outside this,
The region of the described illuminating module side on the inner surface of described heat conduction component is exposed from described inner side cylindrical portion,
Described heat conduction component forms a part for the heat conduction path of described illuminating module and described lamp holder.
2. lamp as claimed in claim 1, is characterized in that,
Described heat conduction component is made up of blending resin or metal or pottery.
3. lamp as claimed in claim 1, is characterized in that,
Described heat conduction component have concavo-convex.
4. lamp as claimed in claim 1, is characterized in that,
Described heat conduction component there are through hole or gap.
5. lamp as claimed in claim 1, is characterized in that,
Described heat conduction component is made up of the multiple bar members extended from lamp holder side described in described illuminating module side direction.
6. lamp as claimed in claim 1, is characterized in that,
Also possess insulation division, this insulation division is made up of resin, be configured at described heat conduction component inner surface and between described heat conduction component and described illuminating module.
7. lamp as claimed in claim 1, is characterized in that,
Also possess the circuit case of tubular, this circuit case is made up of Ins. ulative material, and it is overall to surround described circuit unit.
8. lamp as claimed in claim 1, is characterized in that,
Described installation base plate and illuminating module plate are one, are provided with described semiconductor light-emitting elements thereon.
9. lamp as claimed in claim 1, is characterized in that,
The thickness of described heat conduction component, the thickest in the side that connects with described illuminating module, and more become thinner close to described lamp holder side.
10. lamp as claimed in claim 1, is characterized in that,
The through hole of described heat conduction component or the aperture opening ratio in gap, minimum in the side that connects with described illuminating module, and more become higher close to described lamp holder side.
CN201290000991.8U 2012-02-23 2012-10-25 Lamp Expired - Lifetime CN204284970U (en)

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JP2012-037570 2012-02-23
PCT/JP2012/006827 WO2013124926A1 (en) 2012-02-23 2012-10-25 Lamp

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WO2016108138A1 (en) * 2014-12-30 2016-07-07 Sabic Global Technologies B.V. A polymeric heat dissipation device, methods of making and of using the same
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