TW201119092A - LED device manufacturing method - Google Patents

LED device manufacturing method Download PDF

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Publication number
TW201119092A
TW201119092A TW99125748A TW99125748A TW201119092A TW 201119092 A TW201119092 A TW 201119092A TW 99125748 A TW99125748 A TW 99125748A TW 99125748 A TW99125748 A TW 99125748A TW 201119092 A TW201119092 A TW 201119092A
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TW
Taiwan
Prior art keywords
light
phosphor
led
wavelength
substrate
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Application number
TW99125748A
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Chinese (zh)
Inventor
Kenji Yoneda
Original Assignee
Ccs Inc
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Publication of TW201119092A publication Critical patent/TW201119092A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/507Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape

Abstract

This invention provides a high yield LED device manufacturing method by which the analysis, classification, and management of wavelength conversion member can be easily performed, and the emission color and illuminance of the LED device can be easily controlled. The LED device includes a base having a recess opened on the upper end face thereof, and a LED element mounted on the bottom surface of the recess. The LED device further includes a translucent sealing member for sealing the LED element, and a wavelength conversion member having fluorescent substance arranged in this order from the bottom side of the recess. The LED device manufacturing method includes a lamination step wherein the wavelength conversion member is laminated on the translucent substrate to form a laminated object, a mounting step wherein the LED element is mounted on the bottom surface of the recess of the substrate, a sealing step wherein translucent resin used as the sealing member is filled into the recess of the substrate in which the LED element is mounted, and a loading step wherein, before the translucent resin is hardened, the opening in the recess of the substrate in which the translucent resin has been filled is covered with the laminated object with the translucent substrate facing the bottom side of the recess.

Description

201119092 六、發明說明: 【發明所屬之技術領域】 本發明係關於LED發光裝詈,办丄 產出革在此基礎上更具有優異的防潮性及散熱性。 门 【先前技術】 以往已開發出一種LED發光裝置,藉由板 導體而發射藍色光或紫外線的LED元件i各種螢光Ϊ而 用led π件的LED發光裳置,具有小型 3 =使 並廣泛運闕為指示用光源紐_光源。 4優』, 元株發歧置而言,已知有—種如下所述:將led 形t的基體之該凹部内’並從LED元件侧起依 轉換構皮長 :於來自led元件的光線提取效率優異,;防ί Si: 埴裝置時’係贿裝構件用之透光性樹脂,充 ,到女裝有LED元件的基體之凹部内並令並硬 了 波長轉換構件狀含#光體樹脂組成物。、 ”、上/主入 5 肸知士礼戒置f後依規疋罝逐次使用,但因為該樹 L曰ED發光Ϊ散狀態隨時間改變,故即使是同規格的 ED U裝置,其發光㈣色調或照度在每—财亦產生若 i: 元件的發光色或照度方面亦有差異,此成為最終 用^^ *絲置的發光色或照度之差異的原因。並且,使 插兰、LED發光裝置作為檢驗裝置帛之光源時,即使猶有此 種差異亦職及檢驗結果的可靠度,_成為問題。 因此Μ往對於农終產品亦gp LED發光裝置進行發光色之色 201119092 调或照度的檢驗,麟除麟料細之物。 增大,兮疋件局功率化導致led元件之發熱量顯著 敎ί元件树產生劣化之問題。又,由於螢光體 巧脆弱’亦顧慮來自LED元件的傳熱導致螢光體埶劣化。 光體中的發熱為!S 乃°,進而確認以往輕忽的螢 (先前技術文獻), (專利文獻) 專利文獻1:日本特開2005—191197號公報 【發明内容】 (發明所欲解決之問題) 光裝ί發題點’主要期望目的在於提供—種_發 ==的為tL:類.管理’輸制 、 方 亦即本發明之LED發光裝置之製造方法,直 轉換構件含錢級,而該製造方法包含 s。"皮長 製作將該好_疊層树紐紐^層體^^’, 201119092 將LED元件安裝在該基體的凹部之底面;封裝步驟,將封裝構件 用之透光性樹脂充填到安裂有該LED元件的該基體之凹部而封裝 該LED元件’裝配步驟’在令該透光性樹脂硬化之前,利用該疊 層體,以該透光性基板面向該凹部之底面侧的方式,覆蓋該透光 性樹脂所充填的該基體之凹部的開口部。 如前所述,波長轉換構件用之含螢光體樹脂組成物,係一次 性調配多㈣LED發歧置份量,侧為錢光體齡組成物中 之螢光體的分散狀態隨時間改變,故即使為相同規格的匕^^發光 裝置,其發光色的色調或照度在每一批中亦產生若干差異。又, LED元件的發^^或照度亦有差異,此成為最終產;丨即發 光裝置的發光色或照度之差異的原因。 ^對於此,本發明巾,因為將該波長轉換構件與該透光性基 ίIf層體,與安裝有該LED元件的紐分開製作,而後將該疊 到安裝有該,元件的基體,並使用已預先設定好波長. 對3有差異的該疊層體群依照發光色或照度 選具有期朗發祕或照度等者,· 例如發”紫外線的基準光源來測定該疊層體的發 與適 差異 【能極力抑制最終產⑤亦机轉光敍的聽色或照度等之 的散 劣化導狀LED發鱗置的發觀構料㈣先體熱 透光性脂,但因為4夢由利用、、、氧月曰作為°亥 封裝構件用之 抑制氣體侵人該凹部^ f顧即光性基板覆蓋該封農構件來 等金屬薄膜構成的反射鏡1成由銀 氣化=工,,亦:=基==、 乂,因LEDtg件係點光源,始氣π切礼卜从>刀月b 6 201119092 J而劣”須控制f光體與LED元件之距 佳。但疋,習知將透光性樹脂充填到安裝有LE 為最 部内並令其硬化後於其上注入含瑩光體樹月旨组成物的方^之= 部之側面的狀態或透光性樹脂的黏度等等,套中= 在基體凹部的侧面攸升,使得封裝構件與轉的 在= 下狀態硬化,即使嚴密地控制透光性樹脂的 二=現體(波長轉換_之 ,層體’與安裝有該LED元件的^開1=光= 更化之前,將該細載Ϊ“透 波長轉換構件之厚度者,故能以再現性佳的 ί易ίί 方式塗佈該含螢光體樹脂組成物時1 狀態成物硬化係指令其成為硬於硬化前之該透光i樹脂: 步驟二層f 2一起製作多數個’此時’該疊層步驟宜由以下 ==二1例2^2機等,將波長轉換構件用之含勞 基极上,而取#夕* 由夕數之5亥透光性基板構成為一體的大 成物硬化,上if個該波長轉換構件’並令該含螢光體樹脂組 ==轉固該疊層體製作成為一體;將其上形成有多數 牛的大基板予以切斷,切出多數個該疊層體。 榮光體。\的重豐印刷含有發出紅色光之螢光體(以下稱紅色 耩綠声答朵二勞、光體樹脂組成物、含有發出綠色光之螢光體(以下 光i(以下m的含榮光體樹脂組成物以及含有發出藍色光之螢 先體(以下她色螢光體。)的含榮光體樹脂組成物,尤其,因為依 201119092 物、含騎縣_旨組成 或綠色螢光體所發出^色^ 發出的藍色光 ^ 透峨'_高起,= 透光性樹脂的表:時,因為該 泡不易形成在該透光性樹脂與該疊層、體之接觸面積,故氣 在該裝配㈣之前更具有樹脂附著步驟,令談透# =隆起部======= 先相接的方式,使該疊層體覆蓋該凹部之開口部, ^^地擴大該透光性樹脂與該疊層體之接觸^^ 树脂與該疊層體之間不易形成氣泡。 ^透先性 1由此種製造方法獲得的LED發光裝置亦為本發明之一 =务=之LED發光裂置,其特徵在於包含:基體 端 -及波長= 就本發明之LED發光裝置而言,具體舉例如有:該咖 可見光’且該榮光體係紅色螢先體、綠 就該透光性基板而言並無特別限定,例如使用令紫外 波長之可見光透射並反射較長波長之可見光的短波長透射滤鏡 201119092 時’在藉由該LED元件所發出的紫外線或短波長之可見光而激發 的該榮,體所發出之可見光當中,往安裝有該LED元件的基體^ 進者在该短波長透射濾鏡反射,改變前進方向而射出到裝置 因此,能將螢光體轉換的可見光有效率地提取到裝置外广 該LED元件具體而言適合使用在430^以下具有發射峰部之 物,較佳者為在360〜430nm之近紫外區域具有發射峰部之物。 一該短波長透射濾鏡具體而言適合使用一種介電質多層膜,盆 之反難數與透射缝高低反制邊界纽該咖耕之^ Ϊ峰部波長1(WX上,且具有術喊下之波長區域。介電質ί 電質之中亦具有高透明性的物質構成 異之物=巾獅^ Μ上折射料同者疊層喊且熱料性亦優 红色:從件側起依順序形成有:含有發出 出藍^發麟色光之螢紐的相及含有發 (發明之效果) J類·管理’易發;二 =;SED發光裝置。再者,亦能提升上 【實施方式】 (實施發明之最佳形態) =下參考圖式說明本發明—實施形態。 邮-說明本實施形態之LED發光裝置11。LED發光裝置1如m j基體2,具有在頂端面21開口的凹部22 ’· LE^元件/ 板5,設於封裝構件4之上並覆蓋 ϋ*丨生基 6,設於透紐基板5之上 微開° °卩,波健換構件 、下。羊述各。基體2具有在頂端面21開口且從底面功起 201119092 向開口部擴開成截頭圓錐形狀的凹部22,並由例如氧化鋁或氮化 銘等高熱傳導率的絕緣材料成型而成。 基體2係具有後述的LED元件3安裝在凹部22之底面221,在該 底面221形成有用於電性連接LED元件3之配線導體(未圖示。)。此 配線導體經由形成在基體2内部的配線層(未圖示。)而導出到led 發光裝置1之外表面並連接到外部電路基板,介而令LED元件3與 外部電路基板電性連接。 ,包含基體2之凹部22包含側面222及底面221的内面,藉由施以 銀等金屬電鍍等而形成有高反射係數之金屬薄膜23,作為反射鏡 發揮功能。 LED元件3發出紫外線或短波長之可見光,例如在36〇〜43〇nm 具^射峰部者。此種LED元件3例如係將氮化齡化合物半導體 f監貝石基板或氮化鎵基板之上依順序疊層η型層、發光層及p型 也件3係以氮化録系化合物半導體在下(凹部22之底面221 22)之底雜科塊或金導塊等(未圖示。)喊晶封裝在凹部 而恤Ϊϊί件4充滿凹部22而封裝咖元件3,例如係由透光性及 月之折射率差小的石夕氧樹脂等透光性樹 ^接^。^ 3有此種_構件4時,能提升來自LED元件3之光線 ϋί:能防止波長轉換構件6中的螢光體61之熱劣化。 發揮功能,換構件6之塗膽來 構件4氣密式密閉在凹部22内。因之開口部,將封裝 而抑制氣體侵人凹部22内卩22之㈣部,能藉 r^r氣化等造成的 201119092 轉2: 層膜例如係藉由顧材料瞒到玻璃基板成此種”電貝夕 板化皮上長轉部分散有榮光體61者,並設於透光性基 異且與封裝齡4之折辩差小㈣氧樹脂 光體在本實施賴巾含有紅色縣體、綠色榮 «光體層^ 含綠色螢光體層犯、含藍色201119092 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to an LED light-emitting device, and the production leather has superior moisture resistance and heat dissipation. [Prior Art] In the past, an LED light-emitting device has been developed in which LED elements of blue light or ultraviolet light are emitted by a plate conductor, and various LEDs are emitted, and LEDs of LEDs are led to emit light, which has a small size of 3 = The operation is the light source for the indication source. 4 excellent, in terms of the difference between the two types of fibers, it is known that the following is the case: the inside of the recess of the base of the led-shaped t' and from the side of the LED element is converted to a skin length: light from the led element Excellent extraction efficiency; anti- Si Si: 埴 埴 ' ' 系 系 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿Resin composition. , ", on / the main 5 肸 礼 礼 置 置 置 f f f f 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝 疋罝(4) The color tone or illuminance is also generated in each of the financial assets. If there is a difference in the illuminating color or illuminance of the component, this is the reason for the difference in the illuminating color or illuminance of the final ^^ * silk. When the light-emitting device is used as the light source of the test device, even if there is such a difference, the reliability of the test result and the test result become a problem. Therefore, the color of the illuminating color of the gp LED light-emitting device for the agricultural end product is 201119092. The inspection, the lining of the fine material. Increase, the power of the component is caused by the significant heat generated by the LED component. The component tree is degraded. Also, because the phosphor is delicate and fragile, it also concerns the LED components. The heat transfer causes deterioration of the phosphor 埶. The heat generation in the light body is Δ°, and the fluorescing ray has been confirmed in the past (Patent Document) Patent Document 1: Japanese Patent Laid-Open Publication No. 2005-191197 Content The problem to be solved is: The main purpose of the light-emitting problem is to provide a type of _ hair == for tL: class. Management 'transmission, that is, the manufacturing method of the LED light-emitting device of the present invention, the direct conversion member The manufacturing method includes s. " leather length production will be good _ laminated tree New ^ layer ^ ^ ', 201119092 LED elements mounted on the bottom of the base of the recess; packaging steps, will be packaged The translucent resin for the member is filled in a recessed portion of the substrate in which the LED element is cracked, and the LED element 'assembly step' is packaged, and the laminate is used to cure the translucent resin. The substrate faces the bottom surface side of the concave portion, and covers the opening portion of the concave portion of the substrate filled with the light-transmitting resin. As described above, the phosphor-containing resin composition for the wavelength conversion member is dispensed at one time. (4) The amount of luminosity of the LED is changed, and the dispersion state of the phosphor in the composition of the body of the light is changed with time. Therefore, even if the illuminating device of the same specification is used, the color tone or illuminance of the luminescent color is in each batch. There are also some differences. The LED element has different brightness or illuminance, which is the final product; that is, the reason for the difference in illuminating color or illuminance of the illuminating device. ^ For this reason, the present invention has the wavelength converting member and the light transmissive property. The base layer is made separately from the button on which the LED element is mounted, and then the substrate is mounted to the substrate to which the element is mounted, and the wavelength is set in advance. The laminated body group having a difference of 3 is in accordance with the color of the light. Or the illuminance is selected to have a sensation or illuminance, for example, a "basic light source of ultraviolet light" is used to measure the difference in the hair and the difference between the laminates [to suppress the color or illuminance of the final product 5 The disperse-degraded LED is fluorescing to the surface of the material (4) precursor thermal translucent grease, but because of the 4 dreams, the use of,,,,,,,,,,,,,,,,,,,,,,, f, that is, the optical substrate covers the agricultural sealing member, and the mirror 1 composed of a metal thin film is made of silver gasification = work, and also: = base ==, 乂, because the LEDtg is a point light source, the initial gas π cut卜从>刀月 b 6 201119092 J is inferior" must control f light body and LED element The distance is good. However, it is conventionally known that the light-transmitting resin is filled in a state in which the side of the portion where the LE is the most dense portion and which is hardened, and then the surface of the portion containing the phosphor-containing body composition is injected thereon. The viscosity of the resin, etc., in the sleeve = soaring on the side of the concave portion of the base body, so that the package member and the rotating state are hardened in the lower state, even if the two-transmission of the light-transmitting resin is strictly controlled (wavelength conversion_, layer body) 'Before the surface of the wavelength conversion member is passed, the thickness of the wavelength conversion member is adjusted before the LED 1 is mounted with the LED element. Therefore, the phosphor-containing body can be applied in a reproducible manner. In the case of the resin composition, the state is cured by the state of the material, and the light-transmissive i resin is hardened before hardening: Step 2: f 2 is produced together with a plurality of 'this time'. The lamination step should be as follows == 2 1 case 2 ^2 machine, etc., the wavelength conversion member is used on the base of the labor-receiving element, and the large-sized object which is composed of the 5 ray transparent substrate of the eve is hardened, and the wavelength conversion member is The phosphor-containing resin group ==turning and solidifying the laminate to be integrated; and forming a large substrate on which most cattle are formed Cut and cut out a plurality of the laminates. The glory body. The heavy-duty printing contains a phosphor that emits red light (hereinafter, it is called red, green, green, light, resin, and green). Light-emitting phosphor (the following light i (the following m-containing glory resin composition and a glory-containing resin composition containing a blue light-emitting precursor (here, her color fluorescent body)), especially because of 201119092 The blue light emitted by the object, the composition of the ride, or the green phosphor, is emitted by the color of the green light ^ 高 '_高起, = the table of the light-transmitting resin: when the bubble is not easily formed in the light transmittance The area of contact between the resin and the laminate and the body, so that the gas has a resin attachment step before the assembly (4), so that the laminate is covered by the method of "adjacent" ======= The opening of the concave portion enlarges the contact between the resin of the light-transmitting resin and the laminated body and the laminate, and bubbles are less likely to form. ^Transparency 1 LED light obtained by the manufacturing method The device is also an LED light-emitting device of the present invention, which is characterized in that it comprises: a base end-and a wave For the LED light-emitting device of the present invention, for example, the visible light of the coffee is used, and the red fluorescent precursor and the green color of the glory system are not particularly limited as long as the light-transmitting substrate is used, for example, ultraviolet light having a wavelength of ultraviolet light is used. The short-wavelength transmission filter 201119092 that transmits and reflects visible light of a longer wavelength is used to mount the LED in the visible light emitted by the ultraviolet light emitted by the LED element or the short-wavelength visible light. The substrate of the component is reflected by the short-wavelength transmission filter to change the direction of advancement and is emitted to the device. Therefore, the visible light converted by the phosphor can be efficiently extracted to the outside of the device. The LED component is particularly suitable for use in 430. The following has an emission peak, preferably an emission peak in the near ultraviolet region of 360 to 430 nm. A short-wavelength transmission filter is particularly suitable for using a dielectric multilayer film, and the anti-difficult number of the basin and the high-low contrast boundary of the transmission slit are used for the peak wavelength 1 (WX) The wavelength region underneath. Dielectric material 亦 The substance with high transparency in the electrical material constitutes a different substance = towel lion ^ Μ The refracting material on the same layer is shattered and the hot material is also excellent red: from the side of the piece The sequence is formed by: a phase containing a blue light emitting a blue light, and a containing hair (the effect of the invention) J class management "easy to send; two =; SED light emitting device. Furthermore, it can also be improved" (Best Mode for Carrying Out the Invention) = The present invention is described below with reference to the drawings. The LED light-emitting device 11 of the present embodiment will be described. The LED light-emitting device 1 has a recessed portion at the tip end surface 21, such as the mj base 2. The 22'· LE^ element/board 5 is disposed on the package member 4 and covers the ϋ*丨 raw base 6, and is disposed on the transparent substrate 5 at a slight opening ° °, and the wave is changed to the member and the lower part. The base body 2 has a recess that is open at the top end surface 21 and is expanded from the bottom surface to the opening portion to a frustoconical shape. 22, and is formed of an insulating material having a high thermal conductivity such as alumina or nitriding. The base 2 has an LED element 3 to be described later mounted on the bottom surface 221 of the recess 22, and the bottom surface 221 is formed with an electrical connection LED. a wiring conductor (not shown) of the element 3. The wiring conductor is led out to the outer surface of the LED light-emitting device 1 via a wiring layer (not shown) formed inside the substrate 2, and is connected to an external circuit substrate. The LED element 3 is electrically connected to the external circuit board. The recessed portion 22 including the base 2 includes the inner surface of the side surface 222 and the bottom surface 221, and a metal film 23 having a high reflection coefficient is formed by metal plating such as silver as a mirror. The LED element 3 emits ultraviolet light or short-wavelength visible light, for example, at 36 〇 to 43 〇 nm with a peak. Such an LED element 3 is, for example, a nitriding compound semiconductor f. The n-type layer, the light-emitting layer, and the p-type element 3 are sequentially stacked on the gallium substrate, and the nitride-based compound semiconductor is underneath (the bottom surface 2222 of the recess 22), or the gold guide block (not shown). Show.) Shouting crystal package in concave The Ϊϊ Ϊϊ 件 4 fills the recess 22 and encloses the coffee element 3, for example, a translucent tree such as a light-transmissive and a small refractive index difference of the moon, and the like. The light from the LED element 3 can be increased. The thermal deterioration of the phosphor 61 in the wavelength conversion member 6 can be prevented. The function of the member 6 of the replacement member 6 is hermetically sealed in the concave portion 22. The opening portion is formed by encapsulating the gas to invade the (four) portion of the inner portion 22 of the concave portion 22, and can be caused by vaporization of the liquid, etc. 201119092 to 2: the film is formed by, for example, the material to the glass substrate. There is a glory body 61 on the long-turning part of the shell of the Beixi slab, and it is set in the light-transmitting basis and has a small difference with the package age of 4. (IV) Oxygen resin light body in this implementation contains red county body, green Rong «Light body layer ^ contains green phosphor layer, blue

-山光體6m、綠色螢光體6ig及藍色螢光體6m受到 ίΓΙΛ❾料線或触長之可見光而激發時,各螢光體61所 m光、綠色光及藍色光混合並發出白色光。並且, 出的紫外線或短波長之可見光實際上不易影響到LED Ϊίϊ置^發光色,亦㈣色。因此,例如在1^元件3係發出 τ·°^ΐ且為該藍色光與榮光體61發出的光線混合之構成時,在 二心光裝置1之發光面容易產生光路長度差造成的色調不均 t但因為LED元件3係發出紫外線或短波長之可見光者,故在螢 Γτ^61係紅色營光體61R、綠色榮光體61G及藍色螢光體61B之 卫D發光裝置1中不易產生此種色調不均勻。 並且,如本實施形態中使用發出紫外線或短波長之可見光作 為LED元件3 ’並使用紅色螢光體61R、綠色螢光體61(}及藍色螢光 體61B作為螢光體_LED發光裝置卜其所發出的混合光係在蒲 朗克執跡上移動,故為極近於太陽光的自然白色。 其次參考圖3及圖4說明本實施形態之LED發光裝置1的製造 方法。 人首先’如圖3所示,使用喷墨式列印機等將波長轉換構件6用 之含螢光體樹脂組成物6印刷在大小相當於多數個透光性基板5的 大基板B上,一起製作多數個波長轉換構件6。此時,依照順序分 11 201119092 尤體61B之含藍色螢光體樹脂組成物6B。 東 右技ΐί接fLED兀件3安褒在基體2的凹部22之底面221,並過量 4之凹iff則面222形成有電路圖案時,若透光性樹脂 ^之度較低,所充填的透紐樹脂4容易在凹部22之側面迎爬 於無電路圖案者而言,爬升量增加。如此一來,即使嚴 透光性樹脂4之充填量,實質上的透光性樹脂4充填量亦受 ’且因極難令該爬升量固定,f有可能令透光性樹脂4 ^中央β表面之高度各有不同。為了抑制此觀象並固定地控制 咼^,雖然本實施形態令透光性樹脂4過量並利用疊層體7令其在 覆蓋時必定溢出’但只要使用例如丨00mm2/s以上的高黏度樹脂作 為透光性樹脂4,因為該爬升量從根本上減少,故能將溢出量,亦 即透光性知丨脂4之原始填量抑制為更少,對於在凹部之側面 形成有電路圖案者尤佳。 並且’在令透光性樹脂4硬化之前,以透光性基板5朝向凹部 22之底面221側的方式,利用疊層體7覆蓋透光性樹脂4所充填的凹 部22之開口部(圖4⑻)。 、 如十所述,因為依據凹部22之侧面222的狀態或透光性樹脂4 之黏度專’充填到凹部22内的透光性樹脂4有時在凹部22之側面 222爬升,即使嚴格控制透光性樹脂4往凹部22内的充寧量,亦不 易控制其父界面之尚度。相對於此,本實施形態中因為在凹部22 内大量充填透光性樹脂4,其次,利用疊層體7覆蓋透光性樹脂4所 充填的凹部22之開口部’故可容易地控制波長轉換構件6(螢光體61) 12 201119092 與LED元件3之距離。 又,過量充填透光性樹脂4使得透光性樹脂4之表面 首先隆起部41之頂點為首與疊層體7最先相接,且 樹脂4與疊層體7之翻面積。 她擴大透先性 利用璺層體7完全覆蓋凹部22之開口部時,疊層 間稍有透紐旨4抑,蝴為魏樹 樹 明,故幾乎不影響外觀或功能(_)。另,從 裝置1 之間擠出的透光性樹脂4,亦發揮令疊層體7與^ ,後以加解方式令透光性樹脂4硬倾而可獲得咖發光 態’令由波長難餅6麵在透光性基板 ^層f裝配到安裝細D元件3職體2 # 發3色或照度等,將有所差異的疊層體 ii色°管理,選出具有期望之發光色或照度等 ,=,與適& _ED元件3組合⑽製作具有·性能的哪發光 表置1。 乂 i ’Λ實施形態、中,在令充填到凹部22的透光性樹脂4硬化之 i'體7載置在透光性樹脂4之上使其覆蓋凹部22之開口 以再現性佳的方式控制LED元件3與體61(波長轉換構件 二Μ心,此,能控制LED元件3與螢光體61(波長轉換構件6)之 Ί i、t來自LED元件3的光線之提取效率與螢光體61所受的熱 衫響成為最佳平衡。 姑甘ί ’在本實施形態中’因為將透光性樹脂4過量充填在凹部22 二面隆起’故透光性樹脂4的隆起部41之頂點與疊層體7最先 且緩緩擴大透光性樹脂4與疊層體7之接觸面積,故透光性 树脂4與疊層體7之間不易形成氣泡。 %ΛΛ又,本實施形態所獲得的1^〇發光裝置1,因為具有覆蓋凹部 么、開口部之透光性基板5,故為能保護凹部2内的反射鏡23或 13 201119092 ='=_牛4不受水峨體等外部環境因子影響且耐 構件4之散歸件來發揮魏,魏良舰抑制崎 化造成的照射光之色調改變或功率低落等等。 … 又’本實施職悄為採舰波長透射濾鏡作為透光性基板 5 ’故如圖5所示,在藉由LED元件3所發出的紫外線或短波長之可 ΐΐΥίίί絲61而料可絲V之巾,朝向細2驗者在短 波長透射濾鏡反射而射出到LED發光裝置1外。所以,藉由採用短 波長透射濾鏡作為透光性基板5,可將轉換後的可 提取到LED發光裝置1外。 ’ ^ 又’因為本實施形態在波長轉換構件6中分別含有紅色榮光體 61R、綠色榮光體61G、藍色螢光體6m的層,從LED元件3側起依 順序形成^紅色螢光體層6R、含綠色螢光體層6〇、含藍色螢光體 層6B故藍色螢光體61B戶斤發出的藍色光或綠色螢光體61G所發出 的綠色光未受到其他螢光體61吸收,因此,能提高能 光線之揾取钕座。 另,本發明不限於該實施形態。 例如,將含螢光體樹脂組成物6塗佈到透光性基板5之方法不 限於印刷,亦可為嵌裝或浸潰(dipping)等方法。又,亦可逐個製作 疊層體7,而一起製作多數個。 田又,亦可如圖6所示,藉由嵌裝等方式令透光性樹脂4附著在 層體7的透光性基板5侧之表面而形成隆起部42。如此形成隆起 部42’並以^隆起部42與充填在凹部22内的透光性樹脂4最先相接 的方式,使疊層體7覆蓋凹部22之開口部,而從隆起部42起連續地 擴大透光性樹脂4與疊層體7之接觸面積,因此透光性樹脂4與疊層 體7之間不易形成氣泡。 〃 —LED元件3不限定於發出紫外線或短波長之可見光,亦可發出 藍色光。又,LED元件3亦可不使用覆晶封裝,而使用打線接合來 連接到設於基體2的配線導體。 透光性基板5不限定於短波長透射濾鏡,只要具有透光性及 14 201119092 Ϊ膠ίίΐ用it材1,例如亦可由鑽石、藍f石、水晶、玻璃、 ^ 一八中,透光性基板5由鑽石、藍寶石、水晶等具有在 熱傳導率的材料構成時,因為能經由透光性基板5將 ^所人祕」的熱有效率地散出,故能有效地防止波長轉換構件 6所3的螢光體61之熱變性或熱劣化。 心ΐίίΐ構件6亦可不具有區分每種蝥光體61的層狀構造,而 Ϊ體61R、綠色螢光體61G及藍色發光體_混存於由一 換構件6中。又,波長轉換構件6所含的螢光體61 π二螢光體61R、綠色勞光體61(3及藍色螢光體61B,亦 L二Ϊ ί Ϊ體。藉由組合使用含有黄色$光_波長轉換構件6 色光的LED7C件3,亦能令LED發光裝置1射出白色光。 ㈣:2限定於凹部22從底面221朝向開σ部制成截頭圓錐 一 】口 ’凹部22亦可成圓柱形狀。又,基體2亦可如圖7所 面222形成平台部24,並以透光性基板5側之周 體7。相斜減部%之頂端面的方式配設疊層體7,藉而令疊層 -才對於基體2在光财向絲正交方向均獲得定位。 件轉換構件6内前進的可見光v有時會在波長轉換構 要如圖1斛··又ΐ面全反射而在波長轉換構件6内反向前進,但只 材料二二’日日波長轉換構件6之上設置由藍寶石等高折射率 f及射㈣ί报狀體8 ’並在其從咖發絲幻露出的面施以 二成微小凹凸的粗面化等抗反射處理,即可防止如 上所述的全反射,而能提升光線的提取效率。 射率系發射紫外線時’亦可因應於需要’在上述由高折 ’、的翻板狀體8之頂面或底面設置紫外線濾除層。 換構件成波長轉換構件6時,亦可不將多數個波長轉 規定在體大戶多數個波鋪 、、古具德:f在大基板上。猎由如此空出規定間隔而將多數個 層^變A易成在大基板B上’令切斷大基板时切出多數個疊 1個基體2形成的凹部22不限於H@,亦可如酬所示,在鳩 15 201119092 基體2形成多數凹部22,並在各凹部22内分別安紅EDit 示)’並分別利用疊層體7覆蓋各凹部22的開口部。 又,在1個基體2形成多數凹部22時,亦可如圖u所示,以 別安裝有近紫外激發之LED元件3的多數凹部22^組,並利 比ίί數個波長轉換構件6所形成的單一疊層體 ^藉變供給到LED元件3的電流値,並將來 件^的可見光觀合,能自由地改變色溫。例如在圖11 所不的貫施形態中,藉由令發光裝置〗的其中一單元21發 3000K的白色,並令發光裝£1的另一單元12發出色溫⑼·^ 1色,可構成色溫沿黑體執跡改變的演色性優異之白色光發光裝置 此外,土發明不限於上述各實施形態,只要不脫離本發明之 ;、月神,可將前述各種構成的部分或全部適當組合構 (產業上利用性) Η县日月,能容易進行波長轉換構件之分析•分類•管理, 光j置之發*色或照度’且在高產出率下製造 I先裂置。再者,絲提升led發光裝置的防雛或散熱性。 【圖式簡單說明】 圖。圖1係本發明-實施形態之LED發光裝置的示意性縱剖面 射係魏轉巾贿長透械鏡之舰係數及反 剖面^ (b)係顯7^同—實施轉巾靖前㈣層體之上視圖⑻及縱 示同—實施賴之咖發綠置的製造步驟之圖。 說明Ξ 同—實施賴之led發光裝置的部分光路之光路 示其他實郷態之LED發光裝置的製造步驟之圖。 圖7係其他實施形態之咖發解、示意性縱剖面圖。 16 201119092 圖8係其他實施形態之LED發光裝置的示意性縱剖面圖。 圖9係顯示其他實施形態中切斷前的疊層體之上視圖。 圖10係其他實施形態之LED發光裝置的立體圖。 圖11係其他實施形態之LED發光裝置的立體圖。 【主要元件符號說明】 1—LED發光裝置 2…基體 3…LED元件 4…封裝構件(封裝構件用之透光性樹脂) 5…透光性基板 6…波長轉換構件(波長轉換構件用之含螢光體樹脂組成物) 7…疊層體 8…透明板狀體 6R…含紅色螢光體 6G…含綠色螢光體 6B···含藍色螢光體 11…單元 12…另一單元 21…頂端面 22···凹部 23…金屬薄膜 41···隆起部 61…螢光體 61R…紅色螢光體 61G…綠色螢光體 61B…藍色螢光體 221···底面 222···侧面 B…大基板 17 201119092 u…紫外線 V…可見光- When the mountain light body 6m, the green phosphor 6ig, and the blue phosphor 6m are excited by the visible light or the visible light, the phosphors 61 are mixed with m light, green light, and blue light to emit white light. . Moreover, the ultraviolet light or the short-wavelength visible light does not actually affect the LED Ϊ ϊ ϊ 发光 发光 发光 发光 发光 亦 亦 亦 亦 亦 亦 。 。 。 。 。 。 Therefore, for example, when the element 3 emits τ·°^ and the blue light is mixed with the light emitted from the refractory 61, the light-emitting surface of the two-hearted light device 1 is liable to cause a hue due to the difference in optical path length. However, since the LED element 3 emits ultraviolet light or short-wavelength visible light, it is less likely to be generated in the luminescent light illuminating device 1 of the red luminescent body 61R, the green luminescent body 61G, and the blue fluorescent body 61B. This color tone is not uniform. Further, in the present embodiment, visible light of ultraviolet light or short wavelength is used as the LED element 3', and the red phosphor 61R, the green phosphor 61 (}, and the blue phosphor 61B are used as the phosphor_LED light-emitting device. The mixed light system emitted by Buchi moves on the execution of the Planck, so it is a natural white that is very close to the sunlight. Next, a method of manufacturing the LED light-emitting device 1 of the present embodiment will be described with reference to Figs. 3 and 4 . As shown in FIG. 3, the phosphor-containing resin composition 6 for the wavelength conversion member 6 is printed on a large substrate B having a size corresponding to a plurality of light-transmitting substrates 5, using an ink jet printer or the like, and is produced together. A plurality of wavelength conversion members 6. At this time, in accordance with the order, the blue phosphor resin composition 6B of the 11201119092 singular body 61B is divided into two. The east right technology ΐ is connected to the fLED element 3 and is mounted on the bottom surface 221 of the concave portion 22 of the base body 2 When the surface of the recess 222 is formed with a circuit pattern, if the surface of the recessed resin 22 is low, the filled resin 4 is likely to climb on the side of the recess 22 to the circuitless pattern. The amount of climb increases. This way, even the light transmission The filling amount of the grease 4 is substantially the same as the amount of the light-transmitting resin 4 filled, and it is extremely difficult to fix the amount of climb, and f may cause the height of the central β surface of the light-transmitting resin 4 to be different. In this embodiment, the light-transmitting resin 4 is excessively used and the laminate 7 is used to make it overflow during the covering. However, it is necessary to use a high-viscosity resin such as 丨00 mm 2 /s or more. Since the amount of the climbing resin is fundamentally reduced, the amount of the overflow, that is, the original filling amount of the translucent blush 4 can be suppressed to be less, and it is particularly preferable for the circuit pattern to be formed on the side of the concave portion. In addition, before the light-transmitting resin 4 is cured, the opening portion of the concave portion 22 filled with the light-transmitting resin 4 is covered with the laminate 7 so that the light-transmitting substrate 5 faces the bottom surface 221 side of the concave portion 22 (Fig. 4(8)), as described in the above, the light-transmitting resin 4 which is specifically filled in the concave portion 22 depending on the state of the side surface 222 of the concave portion 22 or the viscosity of the light-transmitting resin 4 sometimes climbs on the side surface 222 of the concave portion 22 even if Strictly controlling the charge of the light transmissive resin 4 into the recess 22 In the present embodiment, the translucent resin 4 is filled in a large amount in the concave portion 22, and the recessed portion in which the translucent resin 4 is filled is covered by the laminate 7. The opening portion of 22 can easily control the distance between the wavelength conversion member 6 (phosphor 61) 12 201119092 and the LED element 3. Further, the translucent resin 4 is excessively filled so that the surface of the translucent resin 4 first swells 41 The apex is the first to be in contact with the laminate 7, and the area of the resin 4 and the laminate 7. The expansion of the transparency is completely covered by the enamel layer 7 when the opening portion of the recess 22 is completely overlapped. The purpose of the 4 is that the butterfly is Wei Shu Shu Ming, so it hardly affects the appearance or function (_). Further, the light-transmitting resin 4 extruded from between the devices 1 also exerts the laminates 7 and ^, and then the light-transmissive resin 4 is hardly tilted in an additive manner to obtain a coffee-emitting state. The surface of the cake 6 is mounted on the light-transmissive substrate layer f to the mounting of the thin D-component 3, the body 2, the hair color, the illuminance, etc., and the laminate ii color is managed differently, and the desired illuminating color or illuminance is selected. In addition, =, in combination with the appropriate & _ED element 3 (10), which luminaire is set to have performance. In the embodiment, the i' body 7 which is cured by the translucent resin 4 filled in the concave portion 22 is placed on the translucent resin 4 so as to cover the opening of the concave portion 22 in such a manner that reproducibility is good. Controlling the LED element 3 and the body 61 (the wavelength conversion member is ambiguous, whereby the LED element 3 and the phosphor 61 (wavelength conversion member 6) can be controlled, and the extraction efficiency and fluorescence of the light from the LED element 3 can be controlled. In the present embodiment, the hot-skinned resin 4 is subjected to the bulging of the translucent resin 4 because the translucent resin 4 is excessively filled in the concave portion 22 on both sides. Since the apex and the laminate 7 are the first and the contact area between the light-transmitting resin 4 and the laminate 7 is gradually increased, bubbles are less likely to form between the light-transmitting resin 4 and the laminate 7. The obtained light-emitting device 1 has a light-transmissive substrate 5 covering the concave portion and the opening portion, so that the mirror 23 or 13 in the concave portion 2 can be protected. 201119092 = '=_牛4 is not affected by the water body The influence of the external environmental factors and the resistance of the components 4 to play the role of Wei, Wei Liang ship to suppress the color of the illumination caused by the sacrificial Change or power is low, etc. ... and 'this implementation is quietly for the ship wavelength transmission filter as a light-transmitting substrate 5', so as shown in Figure 5, the ultraviolet light emitted by the LED element 3 or short wavelength ΐΐΥίίί 丝 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 The converted light-emitting device 1 can be extracted from the outside of the LED light-emitting device 1. In the present embodiment, the wavelength conversion member 6 includes a layer of a red refractory 61R, a green glory 61G, and a blue phosphor 6m, respectively. The red light phosphor layer 6R, the green phosphor layer 6〇, the blue phosphor layer 6B, and the blue light or the green phosphor 61G emitted by the blue phosphor 61B are formed in the order of the element 3 side. The green light is not absorbed by the other phosphors 61, and therefore, the light-receiving sputum can be improved. Further, the present invention is not limited to this embodiment. For example, the phosphor-containing resin composition 6 is applied to the light-transmitting. The method of the substrate 5 is not limited to printing, and may be embedded. Or a method such as dipping. Alternatively, the laminate 7 may be produced one by one, and a plurality of sheets may be produced one by one. The field may be attached to the light-transmitting resin 4 by means of fitting or the like as shown in FIG. The ridge portion 42 is formed on the surface of the layer 7 on the side of the light-transmitting substrate 5. The ridge portion 42' is formed in such a manner that the ridge portion 42 and the light-transmitting resin 4 filled in the concave portion 22 are first joined to each other. When the laminate 7 is covered with the opening of the recess 22 and the contact area between the translucent resin 4 and the laminate 7 is continuously increased from the ridge portion 42, the translucent resin 4 and the laminate 7 are less likely to form. Bubbles 〃 The LED element 3 is not limited to emitting ultraviolet light or short-wavelength visible light, and can emit blue light. Further, the LED element 3 may be connected to the wiring conductor provided on the substrate 2 by wire bonding without using a flip chip package. The light-transmitting substrate 5 is not limited to the short-wavelength transmission filter, and as long as it has light transmissivity and is used, it can be made of diamond, blue f stone, crystal, glass, and the like. When the crystal substrate 5 is made of a material having thermal conductivity such as diamond, sapphire, or crystal, since the heat of the transparent substrate 5 can be efficiently dissipated, the wavelength conversion member 6 can be effectively prevented. The phosphor 61 of the 3 is thermally denatured or thermally deteriorated. The core member ίίΐ member 6 may not have a layered structure for distinguishing each of the phosphor bodies 61, and the body 61R, the green phosphor 61G, and the blue light emitter_ are mixed in the replacement member 6. Further, the phosphor 61 π-two phosphor 61R and the green-light body 61 (3 and the blue phosphor 61B) included in the wavelength conversion member 6 are also composed of a yellow color. The light-wavelength conversion member 6 can also cause the LED light-emitting device 1 to emit white light. (4): 2 is limited to the concave portion 22 to form a truncated cone from the bottom surface 221 toward the opening σ portion. Further, the base body 2 may be formed with a land portion 24 as shown in Fig. 7 and a flat portion 7 of the peripheral body 7 on the side of the light-transmitting substrate 5 and the tip end surface of the phase-reduced portion %. By virtue of the lamination - the substrate 2 is positioned in the orthogonal direction of the optical axis. The visible light v in the piece conversion member 6 is sometimes structured in the wavelength conversion as shown in Fig. 1 Reflecting and advancing backward in the wavelength conversion member 6, but only the material 22's solar wavelength conversion member 6 is provided with a high refractive index f such as sapphire and a (4) gram image 8' and is in the ray The exposed surface is subjected to anti-reflection treatment such as roughening of fine irregularities, thereby preventing total reflection as described above and enhancing light. The extraction efficiency is set. When the emission rate is emitted by ultraviolet rays, an ultraviolet filter layer may be disposed on the top surface or the bottom surface of the above-mentioned high-folded plate-like body 8 in response to the need. When the component is changed into the wavelength conversion member 6, It is also possible not to convert most of the wavelengths into a large number of waves in the large body, and the ancient ones are: f on the large substrate. The hunting is such that a plurality of layers are changed to a large substrate B by a predetermined interval. The recess 22 formed by cutting a plurality of stacked bases 2 when cutting a large substrate is not limited to H@, and as shown in the figure, a plurality of recesses 22 are formed in the base 2 of the 鸠15 201119092, and are respectively disposed in the respective recesses 22. The red EDI is shown as 'and the opening of each recess 22 is covered by the laminate 7 respectively. Further, when a plurality of concave portions 22 are formed in one base 2, as shown in Fig. u, a plurality of concave portions 22 of the near-ultraviolet-excited LED element 3 may be attached, and a plurality of wavelength conversion members 6 may be used. The formed single laminate is used to change the current supplied to the LED element 3, and the visible light of the member can be freely changed. For example, in the embodiment shown in FIG. 11, the color temperature can be formed by causing one of the units 21 of the light-emitting device to emit 3000K white color, and the other unit 12 of the light-emitting device to emit a color temperature (9)·^1 color. In addition, the invention of the invention is not limited to the above-described embodiments, and the invention may be appropriately combined with some or all of the above-described various configurations (industry). It is easy to carry out analysis, classification, and management of wavelength conversion components, and it is easy to perform color conversion or illuminance and manufacture I first crack at high yield. Furthermore, the wire enhances the anti-make or heat dissipation of the led illumination device. [Simple diagram of the diagram] Figure. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic longitudinal cross-section of a LED light-emitting device according to an embodiment of the present invention, and a ship's coefficient and a cross-section of a warp mirror. (b) A system is shown in the same manner. The top view (8) and the vertical view are the same as the manufacturing steps of the implementation of the Lai's coffee. Description Ξ Same as the light path of a part of the optical path of the LED light-emitting device of Lai's implementation. Fig. 7 is a schematic cross-sectional view showing a coffee machine according to another embodiment. 16 201119092 FIG. 8 is a schematic longitudinal cross-sectional view of an LED light-emitting device of another embodiment. Fig. 9 is a top view showing the laminate before cutting in another embodiment. Fig. 10 is a perspective view of an LED light-emitting device of another embodiment. Fig. 11 is a perspective view of an LED light-emitting device of another embodiment. [Description of main component symbols] 1—LED light-emitting device 2...Substrate 3...LED element 4...Package member (translucent resin for package member) 5...Translucent substrate 6...wavelength conversion member (for wavelength conversion member) Phosphor resin composition) 7...Laminate 8...Transparent plate-like body 6R...Red phosphor 6G...Green phosphor 6B···Blue phosphor 11...Unit 12...Other unit 21...top surface 22··recessed part 23...metal thin film 41···lifting part 61...fluorescent body 61R...red phosphor 61G...green phosphor 61B...blue phosphor 221··· bottom surface 222· ··Side B...large substrate 17 201119092 u...UV V... visible light

Claims (1)

201119092 七 申請專利範圍: 體上有ΐΖΐι裝,之製造方法’該LED發光裝置包含:基 底面;並且從該凹及LED元件’安裝在該凹部之 件,該封裝構件序設置祕裝構件與波長轉換構 件含ίίί體而件,該波長轉換構 層體^曰/驟’製作以該波長轉換構件疊層在透光性基板上的疊 ίίίί,元件安裝在該基體的凹部之底面; 絲有獅 透光向之f蓋: 樹脂的該基體之凹部的開口部。⑻万A減於充填有該透先性 專利範圍第1項之led發光裝置之製造方法,其中, ϊϊϋ板Hi轉換構件用之含勞光體樹脂組成物塗佈到該 透先性基令縣縣雜驗麟硬化。 圍第2項之led發光裝置之製造方法,其令, 為S發先體娜組成物係贿裝方式塗佈。 崎光裝置—,其中, 該透:=====脂組成物’印刷在由多數個 错此*八#人=马體的大基板上,而形成多數個該波長轉換 切 成為丄體了Si螢光體樹脂組成物硬化,將多數個該疊層體製作 岀多==多數個該波長轉換構件的大紐 5.如申請專概圍第4項之LED發 分別重疊印刷以下物質:含有發出紅Ϊ光之螢光體:含 备'光體日組成物、含有發出綠色奴螢紐的含螢光體樹脂組 19 201119092 成物、及含有發出藍色光之螢光體的含螢光體樹脂組成物。 6.如申明專利範圍第4項之led發光裝置之製造方法,苴中, Πϋϊ,序重疊印刷以下物質:含有發出紅色光之瑩乂體的 3 ^體娜組成物、含有發出綠色光之紅體的含螢光體樹脂 組成物、及含有發出藍色光之螢光體的含螢光體樹脂組成物。 7·如申請專利範圍第1項之LED發光裝置之製造方法,其中, 於該封裝步驟’係⑽透紐樹脂之表祕起的方式將該^光性 樹脂充填到該基體的凹部。 8·如申請專利範圍第1項之led發光裝置之製造方法,其中, 在該裝配步驟之前更包含樹脂附著步驟,該細旨附著步驟&該透 光性樹脂附著在該叠層體表面之中的該S光性基板側表面。 9.一種LED發光裝置,包含: 基體’具有在頂端面開口的凹部; LED元件,安裝在該凹部之底面; 封裝構件,具有透光性且用以封裝該LED元件; 透光性基板,設置在該封裝構件之上,而將該封裝構件 式密閉在該凹部内;以及 波長轉換構件,含有螢光體,且設置在該透光性基板之上。 10♦如申請專利範圍第9項之LE:D發光裝置,其中, 該LED元件係發出紫外線或短波長之可見光,且 該螢光體係發出紅色光的螢光體、發出綠色光的螢光體以及 發出藍色光的螢光體。 / 11.如申請專利範圍第9項之led發光裝置,其中,該透光性基 板係短波長透射濾鏡,令紫外線及短波長之可見光透射,且反射 較長波長之可見光。 .12.如申請專利範圍第9項之LED發光裝置,其中,該LED元件 在430nm以下具有發射峰部。 13.如申請專利範圍第u項之£ED發光裝置,其中,該短波長 透射濾鏡係介電質多層膜,其光線之反射係數與透射係數高低反 轉的邊界,較該LED元件之發射峰部波長高lOnm以上,並且具有 20 201119092 440nm以下之波長區域。 拖媒请專利範圍第9項之LED發光裝置,其中,該波長轉 件側起依辦形成有:含有發攸色光之營光 光體^層3有發出綠色光的螢光體的層以及含有發出藍色光之營 八、圖式: 21201119092 Seven patent application scope: The manufacturing method of the ΐΖΐι, the LED illuminating device comprises: a base surface; and a member mounted on the concave portion from the concave and LED element, the package member is provided with a secret component and a wavelength The conversion member includes a member, and the wavelength conversion layer body is formed by stacking the wavelength conversion member on the light transmissive substrate, and the component is mounted on the bottom surface of the concave portion of the substrate; Light transmissive cover: The opening of the concave portion of the base of the resin. (8) A method of manufacturing a led light-emitting device filled with the first aspect of the patent of the first aspect, wherein a mortar-containing resin composition for a seesaw Hi conversion member is applied to the transmissive base order county County miscellaneous Lin Lin hardened. The manufacturing method of the LED light-emitting device of the second item is applied to the bribe-packing method of the S-former composition. The smudge device—where, the permeable:=====fat composition' is printed on a large substrate which is made up of a plurality of erroneous*8# people=horse bodies, and a plurality of the wavelength conversions are formed into a corpus callosum. The composition of the Si phosphor resin is hardened, and a plurality of the laminates are made into a large number of === a large number of the wavelength conversion members. 5. If the LEDs of the fourth application are applied, the following substances are overlapped and printed: A phosphor that emits red light: a phosphor-containing resin composition containing a green-colored nucleus, a phosphor-containing resin group 19 201119092, and a phosphor-containing body containing a blue-emitting phosphor Resin composition. 6. The method for manufacturing a LED light-emitting device according to the fourth aspect of the patent scope, in which the 物质, 序, and the overlapping printing of the following materials: a 3 ^ body composition containing a red light emitting body, containing red light emitting green light The phosphor-containing resin composition of the body and the phosphor-containing resin composition containing the phosphor emitting blue light. 7. The method of manufacturing an LED light-emitting device according to the first aspect of the invention, wherein the light-filling resin is filled in the concave portion of the substrate in a manner that the sealing step is a secret of the resin. 8. The method of manufacturing a LED light-emitting device according to claim 1, wherein the step of attaching further comprises a resin attaching step, the adhering step & the light-transmitting resin is attached to the surface of the laminate The S light substrate side surface. An LED light-emitting device comprising: a base body having a recess opened at a top end surface; an LED element mounted on a bottom surface of the recess; a package member having light transmissivity and for encapsulating the LED element; The package member is sealed in the recess on the package member, and the wavelength conversion member includes a phosphor and is disposed on the light-transmissive substrate. 10: The LE:D illuminating device according to claim 9, wherein the LED element emits ultraviolet light or short-wavelength visible light, and the fluorescent system emits red light fluorescent body and green light emitting fluorescent body And a phosphor that emits blue light. 11. The LED lighting device of claim 9, wherein the light transmissive substrate is a short wavelength transmission filter that transmits ultraviolet light and short wavelength visible light and reflects longer wavelength visible light. 12. The LED lighting device of claim 9, wherein the LED element has an emission peak below 430 nm. 13. The EK illuminating device of claim U, wherein the short-wavelength transmission filter is a dielectric multilayer film having a reflection coefficient of light and a boundary of a transmission coefficient which is opposite to the emission of the LED element. The peak wavelength is higher than lOnm and has a wavelength region of 20 201119092 440 nm or less. The LED light-emitting device of the ninth aspect of the patent application, wherein the wavelength-transfer side is formed by: a layer of a phosphor containing a green light and a layer of a phosphor emitting green light and containing Battalion of blue light eight, schema: 21
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