TW201108929A - Radiation type heat sink with built-in heat conduction pipe - Google Patents

Radiation type heat sink with built-in heat conduction pipe Download PDF

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Publication number
TW201108929A
TW201108929A TW099138975A TW99138975A TW201108929A TW 201108929 A TW201108929 A TW 201108929A TW 099138975 A TW099138975 A TW 099138975A TW 99138975 A TW99138975 A TW 99138975A TW 201108929 A TW201108929 A TW 201108929A
Authority
TW
Taiwan
Prior art keywords
heat
heat pipe
pipe
built
core
Prior art date
Application number
TW099138975A
Other languages
English (en)
Chinese (zh)
Other versions
TWI484896B (ja
Inventor
chong-xian Huang
Original Assignee
chong-xian Huang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by chong-xian Huang filed Critical chong-xian Huang
Priority to TW099138975A priority Critical patent/TW201108929A/zh
Priority to JP2010274464A priority patent/JP5745264B2/ja
Priority to US12/975,379 priority patent/US20120118536A1/en
Priority to DE202010013223U priority patent/DE202010013223U1/de
Priority to KR2020110000839U priority patent/KR200465687Y1/ko
Publication of TW201108929A publication Critical patent/TW201108929A/zh
Application granted granted Critical
Publication of TWI484896B publication Critical patent/TWI484896B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
TW099138975A 2010-11-12 2010-11-12 Radiation type heat sink with built-in heat conduction pipe TW201108929A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW099138975A TW201108929A (en) 2010-11-12 2010-11-12 Radiation type heat sink with built-in heat conduction pipe
JP2010274464A JP5745264B2 (ja) 2010-11-12 2010-12-09 輻射型排熱器
US12/975,379 US20120118536A1 (en) 2010-11-12 2010-12-22 Radial heat sink with heat pipe set therein
DE202010013223U DE202010013223U1 (de) 2010-11-12 2010-12-28 Polysymmetrischer Kühlkörper mit darin angeordneter Wärmerohrgruppe
KR2020110000839U KR200465687Y1 (ko) 2010-11-12 2011-01-28 복사형 배열장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099138975A TW201108929A (en) 2010-11-12 2010-11-12 Radiation type heat sink with built-in heat conduction pipe

Publications (2)

Publication Number Publication Date
TW201108929A true TW201108929A (en) 2011-03-01
TWI484896B TWI484896B (ja) 2015-05-11

Family

ID=43993234

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099138975A TW201108929A (en) 2010-11-12 2010-11-12 Radiation type heat sink with built-in heat conduction pipe

Country Status (5)

Country Link
US (1) US20120118536A1 (ja)
JP (1) JP5745264B2 (ja)
KR (1) KR200465687Y1 (ja)
DE (1) DE202010013223U1 (ja)
TW (1) TW201108929A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102280568A (zh) * 2011-08-01 2011-12-14 深圳亚锐光电科技有限公司 鳍片式散热器
WO2013016998A1 (zh) * 2011-08-01 2013-02-07 深圳亚锐光电科技有限公司 鳍片式散热器
CN108668509A (zh) * 2018-06-14 2018-10-16 浙江大学山东工业技术研究院 机柜的冷却装置
CN112366269A (zh) * 2020-12-11 2021-02-12 江西众能光电科技有限公司 一种led发光二极管高散热装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI512440B (zh) * 2012-08-01 2015-12-11 Asia Vital Components Co Ltd 散熱裝置及其製造方法
US8988880B2 (en) 2012-09-19 2015-03-24 Ge Intelligent Platforms, Inc. Heat transfer assembly with heat pipe brace and method for assembling a heat transfer assembly
US11022340B2 (en) 2016-08-01 2021-06-01 Johnson Controls Technology Company Enhanced heat transfer surfaces for heat exchangers
JP1588723S (ja) * 2017-02-15 2017-10-23
CN109473537B (zh) * 2018-10-23 2020-04-03 惠州市精鸿精密科技有限公司 一种散热组件及其组装设备

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JPS6133646Y2 (ja) * 1980-06-16 1986-10-01
US5412535A (en) * 1993-08-24 1995-05-02 Convex Computer Corporation Apparatus and method for cooling electronic devices
US6125035A (en) * 1998-10-13 2000-09-26 Dell Usa, L.P. Heat sink assembly with rotating heat pipe
US6253452B1 (en) * 1999-11-23 2001-07-03 Hsin-Yi Chen Method for manufacturing cylindrical radiator
JP3929374B2 (ja) * 2002-08-01 2007-06-13 株式会社フジクラ タワー型ヒートシンク
US20040035558A1 (en) * 2002-06-14 2004-02-26 Todd John J. Heat dissipation tower for circuit devices
JP2005277191A (ja) * 2004-03-25 2005-10-06 Fujikura Ltd ヒートシンク
TWM259940U (en) * 2004-05-31 2005-03-21 Glacialtech Inc Heat dissipating device
US20060011329A1 (en) * 2004-07-16 2006-01-19 Jack Wang Heat pipe heat sink with holeless fin module
KR100766109B1 (ko) * 2004-10-20 2007-10-11 엘지전자 주식회사 방열장치
US7028757B1 (en) * 2004-10-21 2006-04-18 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device with liquid chamber
TWM282235U (en) * 2005-06-24 2005-12-01 Golden Sun News Tech Co Ltd Improved structure of a heat dissipating device using heat pipes
TWM286407U (en) * 2005-10-11 2006-01-21 Augux Co Ltd Heat dissipation module
US20070151711A1 (en) * 2006-01-05 2007-07-05 Kuo-Hsin Chen Heat sink and method for manufacturing the same
US7494248B2 (en) * 2006-07-05 2009-02-24 Jaffe Limited Heat-dissipating structure for LED lamp
US7694718B2 (en) * 2006-10-02 2010-04-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with heat pipes
CN101203117B (zh) * 2006-12-13 2010-08-25 富准精密工业(深圳)有限公司 散热装置
US7802616B2 (en) * 2007-06-01 2010-09-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus with heat pipes
CN101363600B (zh) * 2007-08-10 2011-11-09 富准精密工业(深圳)有限公司 发光二极管灯具
US8132615B2 (en) * 2008-03-20 2012-03-13 Cpumate Inc. Heat sink and heat dissipation device having the same
US8286693B2 (en) * 2008-04-17 2012-10-16 Aavid Thermalloy, Llc Heat sink base plate with heat pipe
CN101600320B (zh) * 2008-06-04 2012-06-13 富准精密工业(深圳)有限公司 散热装置
TWM353311U (en) * 2008-10-07 2009-03-21 Shi-Ming Chen Improved heat dissipator
KR20100102376A (ko) * 2009-03-11 2010-09-24 잘만테크 주식회사 전자부품용 냉각장치 및 그의 제조방법
US20120186798A1 (en) * 2011-01-26 2012-07-26 Celsia Technologies Taiwan, I Cooling module for led lamp

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102280568A (zh) * 2011-08-01 2011-12-14 深圳亚锐光电科技有限公司 鳍片式散热器
WO2013016998A1 (zh) * 2011-08-01 2013-02-07 深圳亚锐光电科技有限公司 鳍片式散热器
CN108668509A (zh) * 2018-06-14 2018-10-16 浙江大学山东工业技术研究院 机柜的冷却装置
CN108668509B (zh) * 2018-06-14 2024-03-26 浙江大学山东工业技术研究院 机柜的冷却装置
CN112366269A (zh) * 2020-12-11 2021-02-12 江西众能光电科技有限公司 一种led发光二极管高散热装置

Also Published As

Publication number Publication date
US20120118536A1 (en) 2012-05-17
KR20120003557U (ko) 2012-05-22
TWI484896B (ja) 2015-05-11
DE202010013223U1 (de) 2011-05-12
JP2012102993A (ja) 2012-05-31
KR200465687Y1 (ko) 2013-03-06
JP5745264B2 (ja) 2015-07-08

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