M383696 五、新型說明： 【新型所屬之技術領域】 本創作為一種與散熱裝置有關的構造’特別是指一種可供 LED照明燈散熱的LED照明燈散熱構造。 【先前技術】 LED由於使用較低的電量便可以進行發光，所以，在電 費等能源價格節節高昇的現在社會中，led已經逐漸普及應 用生活中的各式照明燈具中。 然而’雖然LED具有低耗電量的優點，但是，LED在使 用上卻存在著使用溫度過高的缺點’因此，市面上便有業著推 出一款可供LED照明燈散熱的散熱裝置。 如第一圖所示，前述可供LED照明燈散熱的散熱裝置， 係在一中空的固定環70週圍向外延伸複數散熱鰭片80，固定 環70内緣在中央設一承載LED90的隔板71，該隔板71與固 疋環70 —體成型’ LED9〇發光時所產生的熱源經隔板71吸 收後傳導_定環7G ’㈣定環7G㈣目織料到複紐 熱鰭片80，藉複數散熱鰭片8〇與空氣熱交換散熱。 該散熱裴置雖然可以達到協助led照明燈散熱的目的， 仁刖述隔板71與固定環70二者之間的導熱面積僅限於隔板 71週圍的厚度斷面，所以，該散熱裝置其實際使用時的導熱 效率不佳’不易達成快速散熱的目的。 再者，前述隔板71與固定環70 —體成型，所以製造時要 使用壓鑄製造，不僅製作速度較慢，而且複數散熱鰭片8〇形 狀受到脫模時的限制，使其厚度較厚，間距較大，散熱面積減 夕、，因此，對於相關產品的製作廠商而言，改善散熱裝置是一 項亟需馬上解決的問題。 有鑑於此，本創作人乃累積多年相關領域的研究以及實 驗，特創作出一種「LED照明燈散熱構造」，可以改善習知散 熱裳置之導熱效率受到隔板厚度崎面積影響而效率較差的 問題’再者’也可改善習知散熱裝置料製造，以及以禱造方 式製造時，糾雌關轉致鰭#厚度過厚，造成導熱效果 不佳的問題。 【新型内容】 本創作之目的係在提供一種rLED照明燈散熱構造」，不 僅容易製造，且散_片討峨速對缝熱，再者，該構造 也具有快速導熱的功效，可以達顺速散熱的目的。 本創作為-種可供LED _燈散熱的散鱗造，係包括 一散朗0以及-導熱座，其中，雜熱則組係於一中空 的固定環週圍向外延伸複數散熱則，該中空麵定環内緣為 用以容置LED的容置部；該導熱座設置在容置㈣，具有一 =咖㈣收其絲之承餅，獻在承載部邊緣彎折形 成持。P »亥卡持部外緣緊密嵌合於容置部内壁，藉以傳導 led所產生的熱源’並強化導熱座與散之間的導熱效 果’以達到迅速散熱的目的。 以下，針對各元件的實施方式再作進一步的詳細說明，其 中： 前述容置部實施時’為方便容置部與卡持部相互卡欲，可 以在容置部後方設置一嵌合部，該嵌合部的内徑小於或等於卡 持部的外徑，以方便導熱座嵌入容置部時，藉由嵌合部與卡持 部的緊配合相互卡嵌，—方面可·定的較為牢固，另一方面 可以讓二者之間緊密接觸，進而增加導熱效率。 卜為了可以達到4加工製造的目的，因此該散熱韓 片組的材質可以為紹或其他高導熱效率的導熱材料，利用擠製 等製造方法一體成型，並且在成型後利用車床進行車削，將固 定環後端擴徑車削加工成嵌合部。 前述導熱座實施時’為了可以兼具加工方便及容易導熱的 效果，該導熱座的材質可以為銅、紹片或其他高導熱效率的導 熱材料，並且使用沖床將導熱座沖壓成型；除此，前述導孰座 :承載部邊緣彎折形成的卡持部，實施時可以由承载部周圍向 前或向後延伸，使導熱麟面概㈣形或门形。 再者，為釋放導熱座緊配合卡持於容置部時所產生的應 力’並補強導熱座嵌合卡持於容置部的結構強度，該導熱座實 施時’還可以在卡持部上塞設各種雜的釋壓部，藉由釋放導 熱座與容置部的組合應力，關強導熱Μ合切於容置 M383696 部的結構強度；實施時，該釋壓部可以為利用切削加工而設置 在卡持部上的複數凹孔、缺口、以及轴向或徑向的凹槽等。 另外’實施時，為了可以具有較佳的照明效果，前述容置 的則端可以設置一透光鏡，且在嵌合部的後端設有與led 電氣連接之燈頭，則led發光照明時，光線可以透過透光鏡 照出以達到較佳的照明效果。 相較於習知技術，本創作「LED照明燈散熱構造」，不僅 可以改善習知散熱裝置導熱效率較差的問題，並且也可以簡單 的加工製造，具有節省製成時間以及降低製作難度的優點，以 及以鑄造方式製造時’受到脫模限制而導致鰭片厚度過厚，造 成導熱效果不佳的問題。 【實施方式】 以下依據本創作之技術手段，列舉出適於本創作之實施方 式，並配合圖式說明如後： 如第一至第四圖所示，本創作為一種「LED照明燈散熱 構每」’係包括一散熱鰭片組10以及一導熱座20，其中，該 政熱〜片組1G係於—中空的H)定環11週圍向外延伸複數散熱 〜片12，該中空的固定環11内緣為一用以容置LED13的容 置^14’ °亥導熱座20設置在容置部14内，具有-承載LED13 以吸收其熱源之承载部2卜並且在承載部 21週圍彎折設置卡 持部22，該去批如a 下符。卩22外徑與容置部14内徑相適配，並緊密 6 嵌合於容置部14内壁，藉以傳導LED13所產生的熱源，並強 化導熱座20與散熱鰭片12之間的導熱效果，以達到迅速散熱 的目的。 如第四、第五圖所示，以下針對各元件的實施方式再作進 —步的詳細說明，其中： 則述容置部14實施時，為方便容置部14與卡持部22相 互卡嵌，可以在容置部14後方設置一嵌合部15，該嵌合部Μ 内輕必須略小於卡持部22的外徑，絲嵌合部I5的内徑等於 卡持部22的外徑，以方便嵌合部15與卡持部22可以緊配合 的方式相互卡嵌’―方面可以蚊的較為相，另—方面可以 讓二者之間緊密接觸’進而增加導熱效率。 此外為了可以達到容易加工製造的目的，前述散熱鰭片 組1〇貫鱗’其材質可以為練或其他高導熱效率的導熱材 料利用擠製等製造方法一體成型，並且在成型後利用車床進 仃車削加卫，將固定環u及容置部14後端擴徑車削加工成嵌 合部15 ;當然’相定環n不進行車削加卫，如第六圖所示 令導熱座2〇直接嵌合卡持在容置部M _也是可行的實施 則述導熱座20實施時，為了可喊具加4便及容易導 =效^ ’該導熱座2Q的材質可以為銅、糾或其他高導熱 導熱材料，利用沖床將導熱座2()沖壓成型。除此，前 叫”，、座2G的承栽部21邊緣彎折形成的卡持部22，實施時 可以由承載部21周圍向前或向後延伸，使導熱座2〇斷面概呈 『门』形或『U』形。其中，第三到五圖中，導熱座％斷面 概呈『门』形；第六圖中之導熱座2〇斷面則概呈『比形， 並直接嵌合卡持在容置部14内壁。 並且’為釋放導熱座20緊配合卡持於容置部14所產生的 應力，並補強導熱座2〇嵌合卡持於容置部14的結構強度，如 第七圖至第十_示’該導熱座20實施時，還可以在卡持部 22上挖設各種形狀的釋卿23，藉由釋壓部23槪導熱座 20與容置部14的組合應力，並藉以補強導熱座2〇嵌合卡持 於容置部14的結構強度。 實施時，該釋Μ部23可以如第七圖所示，為利用切削加 工而设置在卡持部22上的複數缺口；再者，釋壓部2S也可以 如第八圖所示，為_加卫設置在卡持部22上的軸向凹槽； 另外釋壓„(5 23也可以如第九圖所示，為切削力口工設置在卡 持部22上的徑向凹槽；當然釋壓部幻也可以如第十圖所示， 為切削加工設置在卡持部22上的凹孔。 另外，如第四與第十一圖所示，實施時，為了可以具有較 佳的照明效果’前述容置部14的前端可以設置-透光鏡16， 且在嵌合部15的後端設有與LED13電氣連接之燈頭17，則 LED13發光照㈣，光線可輯過透光鏡16照出，以達到較 佳的照明效果。 上述各名稱係為方便描述本創作之技術内容所定’而非用 M383696 以限制本案之權利範圍；是以，舉凡依據本案之創作精神所作 的等效元件轉換、替代，均應涵蓋在本案之保護範圍内。 M383696 【圖式簡單說明】 第一圖係習知LED照明燈散熱裝置之立體剖面分解圖。 第二圖係本創作之立體外觀圖。 第三圖係本創作之立體分解圖。 第四圖係本創作之立體剖面分解圖。 第五圖係本創作之立體剖面圖用以表示各元件之設置位置示 意圖。 第六圖係本創作散熱鰭片組與導熱座嵌合之另一實施方式示 意圖。 第七圖係導熱座之立體外觀圖用以表示釋壓部之設置位置及 外型之示意圖。 第八圖係導熱座之立體外觀圖用以表示釋壓部的第二種實施 方式之示意圖。 第九圖係導熱座之立體外觀圖用以表示釋壓部的第三種實施 方式之示意圖。 第十圖係導熱座之立體外觀圖用以表示釋壓部的第四種實施 方式之示意圖。 第十一圖係本創作之立體外觀圖分圖解用以表示透光鏡設置 在容置部的前端。 M383696 【主要元件符號說明】 10散熱鰭片組 11固定環 12散熱鰭片 13 LED 14容置部 15嵌合部 16透光鏡 17燈頭 20導熱座 21承載部 22卡持部 23釋壓部M383696 V. New description: [New technical field] This creation is a structure related to the heat sink. In particular, it refers to a heat dissipation structure for LED lighting that can dissipate heat from LED lamps. [Prior Art] LEDs can emit light due to the use of lower power. Therefore, in today's society where energy prices such as electricity are rising, LED has gradually become popular in various types of lighting fixtures in the life of applications. However, although LEDs have the advantage of low power consumption, LEDs have the disadvantage of using too high a temperature. Therefore, there is a heat sink in the market that can be used to dissipate heat from LED lamps. As shown in the first figure, the heat dissipating device for dissipating heat from the LED illumination lamp extends a plurality of heat dissipation fins 80 around a hollow fixing ring 70. The inner edge of the fixing ring 70 is provided with a partition plate for carrying the LED 90 at the center. 71, the partition plate 71 and the solid ring 70 are integrally formed. The heat source generated when the LED 9 〇 emits light is absorbed by the partition plate 71 and then transmitted to the ring 7G '(4) to fix the ring 7G (four) mesh woven material to the complex heat fin 80. By means of a plurality of heat-dissipating fins 8 〇 and heat exchange with the air to dissipate heat. Although the heat dissipating device can achieve the purpose of assisting the heat dissipation of the LED illumination lamp, the heat conduction area between the spacer 71 and the fixing ring 70 is limited to the thickness section around the spacer 71, so the heat dissipating device actually Poor thermal conductivity during use' is not easy to achieve rapid heat dissipation. Furthermore, the spacer 71 and the fixing ring 70 are integrally formed, so that they are manufactured by die casting, which is not only slow in production, but also has a limitation in the shape of the plurality of fins 8 to be released when the mold is released, so that the thickness thereof is thick. The spacing is large, and the heat dissipation area is reduced. Therefore, for manufacturers of related products, improving the heat sink is an urgent problem to be solved immediately. In view of this, the creator has accumulated many years of research and experiments in related fields, and created a "LED lighting heat dissipation structure", which can improve the heat transfer efficiency of the conventional heat sink and the efficiency is poor due to the thickness of the partition. The problem 'further' can also improve the manufacture of conventional heat-dissipating device materials, as well as the problem of poor heat conduction when the thickness of the fins is too thick due to the practice of making a prayer. [New content] The purpose of this creation is to provide a rLED lighting heat dissipation structure, which is not only easy to manufacture, but also has a fast heat conduction effect, which can achieve a fast speed. The purpose of heat dissipation. The creation is a kind of scattered scale which can be used for heat dissipation of LED_lights, and includes a divergent 0 and a heat conducting seat, wherein the heat is arranged to extend outward around a hollow fixing ring, and the hollow heat is hollow. The inner edge of the surface of the ring is a receiving portion for accommodating the LED; the heat conducting seat is disposed in the receiving (4), and has a hopper (four) receiving cake of the wire, which is bent and formed at the edge of the bearing portion. P » The outer edge of the Haika holding part is tightly fitted to the inner wall of the accommodating part, thereby conducting the heat source generated by the led and enhancing the heat conduction effect between the heat conducting seat and the dispersion to achieve rapid heat dissipation. Hereinafter, the embodiment of each component will be further described in detail, wherein: when the receiving portion is implemented, in order to facilitate the mutual accommodation portion and the locking portion, a fitting portion may be disposed behind the receiving portion. The inner diameter of the fitting portion is less than or equal to the outer diameter of the engaging portion, so that when the heat conducting seat is embedded in the receiving portion, the fitting portion and the engaging portion are tightly engaged with each other, and the inner portion can be fixed relatively firmly. On the other hand, the two can be in close contact, thereby increasing the heat transfer efficiency. In order to achieve the purpose of processing and manufacturing, the heat-dissipating Korean film group can be made of a heat-conducting material with high thermal conductivity, and is integrally formed by extrusion and other manufacturing methods, and is turned by a lathe after molding, and will be fixed. The rear end of the ring is turned and turned into a fitting portion. When the heat conducting seat is implemented, in order to have the advantages of convenient processing and easy heat conduction, the material of the heat conducting seat may be copper, a sheet or other heat conductive material with high thermal conductivity, and the heat conducting seat is stamped and formed by using a punching machine; The guiding seat: the engaging portion formed by bending the edge of the bearing portion can be extended forward or backward by the circumference of the carrying portion, so that the heat conducting surface is substantially (four) shaped or gate shaped. Furthermore, in order to release the stress generated when the heat conducting seat is tightly engaged with the accommodating portion, and to strengthen the structural strength of the heat conducting seat to be engaged with the accommodating portion, the heat conducting seat can be implemented on the holding portion. Plugging various miscellaneous pressure-relief parts, by releasing the combined stress of the heat-conducting seat and the accommodating part, the strength of the thermal conductive splicing is cut to accommodate the structural strength of the M383696 part; when implemented, the pressure-relieving part can be set by cutting A plurality of recesses, notches, and axial or radial grooves on the retaining portion. In addition, in the implementation, in order to have a better illumination effect, the above-mentioned accommodating end may be provided with a light-transmitting mirror, and at the rear end of the fitting portion, a lamp cap electrically connected with the led is provided, and when the LED is illuminated by illumination, Light can be illuminated through the light-transmitting mirror for better illumination. Compared with the prior art, the "LED lighting heat dissipation structure" can not only improve the heat conduction efficiency of the conventional heat sink, but also can be simply processed and manufactured, which has the advantages of saving production time and reducing the manufacturing difficulty. And when it is manufactured by casting, the problem of the release of the mold is too thick, resulting in a problem that the heat transfer effect is not good. [Embodiment] Hereinafter, according to the technical means of the present creation, an implementation method suitable for the present creation is listed, and the following description is accompanied by the following description: As shown in the first to fourth figures, the creation is a "LED lighting structure". Each of the "includes" a heat sink fin set 10 and a heat transfer seat 20, wherein the political heat pack 1G is extended around the hollow loop 11 of the fixed ring 11 to form a plurality of heat dissipation sheets 12, the hollow fixed The inner edge of the ring 11 is a accommodating portion for accommodating the LEDs 13. The heat conducting seat 20 is disposed in the accommodating portion 14 and has a bearing 13 for carrying the heat source and absorbing the surrounding portion of the bearing portion 21 The card holding portion 22 is folded, and the lottery is as follows. The outer diameter of the 卩22 is matched with the inner diameter of the accommodating portion 14, and is tightly fitted to the inner wall of the accommodating portion 14, thereby conducting the heat source generated by the LED 13, and enhancing the heat conduction between the heat conducting seat 20 and the heat radiating fin 12. In order to achieve the purpose of rapid heat dissipation. As shown in the fourth and fifth figures, the following is a detailed description of the implementation of each component, wherein: when the accommodating portion 14 is implemented, the accommodating portion 14 and the holding portion 22 are mutually inserted. The fitting portion 15 may be disposed behind the accommodating portion 14. The inner portion of the fitting portion 必须 must be slightly smaller than the outer diameter of the holding portion 22, and the inner diameter of the wire fitting portion I5 is equal to the outer diameter of the holding portion 22. In order to facilitate the fitting of the fitting portion 15 and the holding portion 22 in a tight fit, the aspect of the mosquito can be mutually engaged, and the other aspect can be in close contact with each other to increase the heat conduction efficiency. In addition, in order to achieve the purpose of easy processing and manufacturing, the above-mentioned heat-dissipating fin group 1 can be made of a heat-conducting material or a high-heat-conducting heat-conducting material by a manufacturing method such as extrusion, and can be formed by using a lathe after molding. Turning and aligning, the fixed ring u and the rear end of the accommodating portion 14 are turned into a fitting portion 15; of course, the 'phase ring n is not turned and reinforced, as shown in the sixth figure, the heat conducting seat 2 〇 is directly embedded. It is also feasible to hold the holding part M _. When the heat conducting seat 20 is implemented, the material of the heat conducting seat 2Q can be copper, correction or other high thermal conductivity. The heat conductive material is stamped and formed by using a punch press. In addition, the front portion is called, and the holding portion 22 formed by bending the edge of the bearing portion 21 of the seat 2G can be extended forward or backward by the circumference of the carrying portion 21, so that the heat conducting seat 2 has a cross section. Shape or "U" shape. Among them, in the third to fifth figures, the % section of the heat-conducting seat is "door" shape; the second section of the heat-conducting seat in Figure 6 is "shaped" and directly embedded. The clamp is held in the inner wall of the accommodating portion 14. And the stress generated by the heat-conducting seat 20 is tightly engaged with the accommodating portion 14, and the structural strength of the heat-conducting seat 2 is clamped and held by the accommodating portion 14, When the heat conducting seat 20 is implemented, the retaining portion 23 of various shapes may be dug on the holding portion 22, and the heat releasing seat 20 and the receiving portion 14 are disposed by the pressure releasing portion 23 The stress is combined to reinforce the structural strength of the heat-conducting seat 2 〇 in the accommodating portion 14 . When implemented, the tamper portion 23 can be disposed on the holding portion 22 by cutting as shown in FIG. 7 . In addition, the pressure releasing portion 2S can also be used to fix the axial groove provided on the holding portion 22 as shown in the eighth figure; (5 23 may also be a radial groove provided on the holding portion 22 for the cutting force to be cut as shown in the ninth figure; of course, the pressure releasing portion may also be as shown in the tenth figure, and the card is set for the cutting process. a recessed hole in the holding portion 22. Further, as shown in the fourth and eleventh figures, in order to have a better illumination effect, the front end of the accommodating portion 14 may be provided with a light-transmitting mirror 16, and The rear end of the fitting portion 15 is provided with a lamp cap 17 electrically connected to the LED 13, and the LED 13 is illuminated (4), and the light can be photographed through the translucent mirror 16 to achieve a better illumination effect. The above names are for convenience of description. The technical content of the creation is determined by 'not to use M383696 to limit the scope of the rights of the case; therefore, the equivalent component conversion and substitution according to the creative spirit of the case should be covered in the scope of the case. M383696 Explanation] The first picture is a three-dimensional exploded view of the conventional LED lighting heat sink. The second picture is the three-dimensional appearance of the creation. The third picture is the exploded view of the creation. The fourth picture is the three-dimensional profile of the creation. Exploded view. Fifth picture The three-dimensional cross-sectional view of the creation is used to indicate the position of each component. The sixth figure is a schematic diagram of another embodiment of the heat-dissipating fin assembly and the heat-conducting seat. FIG. 8 is a schematic view showing a second embodiment of the pressure releasing portion. The ninth drawing is a perspective view of the heat conducting seat for representing the second embodiment of the heat conducting seat. A schematic view of a third embodiment of the pressure release portion. The tenth view is a schematic view showing a fourth embodiment of the pressure release portion. The eleventh figure is a perspective view of the three-dimensional appearance of the present invention. It is used to indicate that the light-transmitting mirror is disposed at the front end of the accommodating portion. M383696 [Description of main component symbols] 10 heat-dissipating fin group 11 fixing ring 12 heat-dissipating fin 13 LED 14 accommodating portion 15 fitting portion 16 light-transmitting mirror 17 lamp cap 20 Heat transfer seat 21 bearing portion 22 holding portion 23 pressure releasing portion