TW201108474A - LED heat-dissipating substrate and its manufacturing method - Google Patents
LED heat-dissipating substrate and its manufacturing method Download PDFInfo
- Publication number
- TW201108474A TW201108474A TW98128176A TW98128176A TW201108474A TW 201108474 A TW201108474 A TW 201108474A TW 98128176 A TW98128176 A TW 98128176A TW 98128176 A TW98128176 A TW 98128176A TW 201108474 A TW201108474 A TW 201108474A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- substrate
- heat
- led
- copper
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 132
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 92
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 46
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 45
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 45
- 229910052751 metal Inorganic materials 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims abstract description 37
- 239000000126 substance Substances 0.000 claims abstract description 32
- 229910000679 solder Inorganic materials 0.000 claims abstract description 16
- 239000011889 copper foil Substances 0.000 claims abstract description 13
- 238000007772 electroless plating Methods 0.000 claims abstract description 13
- 238000007650 screen-printing Methods 0.000 claims abstract description 11
- 238000005260 corrosion Methods 0.000 claims abstract description 7
- 238000009413 insulation Methods 0.000 claims abstract description 6
- 238000005530 etching Methods 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 194
- 229910052802 copper Inorganic materials 0.000 claims description 32
- 239000010949 copper Substances 0.000 claims description 32
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 29
- 229910052718 tin Inorganic materials 0.000 claims description 29
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 23
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 23
- 229910052737 gold Inorganic materials 0.000 claims description 23
- 239000010931 gold Substances 0.000 claims description 23
- 229910052709 silver Inorganic materials 0.000 claims description 23
- 239000004332 silver Substances 0.000 claims description 23
- 238000007747 plating Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 17
- 238000005476 soldering Methods 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 7
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 230000002265 prevention Effects 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 239000006193 liquid solution Substances 0.000 claims 2
- 206010036790 Productive cough Diseases 0.000 claims 1
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 230000002421 anti-septic effect Effects 0.000 claims 1
- 239000011324 bead Substances 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000006185 dispersion Substances 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 238000002203 pretreatment Methods 0.000 claims 1
- 239000004576 sand Substances 0.000 claims 1
- 210000003802 sputum Anatomy 0.000 claims 1
- 208000024794 sputum Diseases 0.000 claims 1
- 238000009713 electroplating Methods 0.000 abstract description 12
- 229920001971 elastomer Polymers 0.000 abstract description 9
- 238000012545 processing Methods 0.000 abstract description 5
- 238000012546 transfer Methods 0.000 abstract description 4
- 238000003825 pressing Methods 0.000 abstract description 3
- 239000011135 tin Substances 0.000 description 20
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000003466 welding Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 229910000761 Aluminium amalgam Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 108010077544 Chromatin Proteins 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 210000003483 chromatin Anatomy 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005363 electrowinning Methods 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 150000004673 fluoride salts Chemical class 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 210000000936 intestine Anatomy 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001987 mercury nitrate Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- DRXYRSRECMWYAV-UHFFFAOYSA-N nitrooxymercury Chemical compound [Hg+].[O-][N+]([O-])=O DRXYRSRECMWYAV-UHFFFAOYSA-N 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98128176A TW201108474A (en) | 2009-08-21 | 2009-08-21 | LED heat-dissipating substrate and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98128176A TW201108474A (en) | 2009-08-21 | 2009-08-21 | LED heat-dissipating substrate and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201108474A true TW201108474A (en) | 2011-03-01 |
| TWI378581B TWI378581B (enrdf_load_stackoverflow) | 2012-12-01 |
Family
ID=44835617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98128176A TW201108474A (en) | 2009-08-21 | 2009-08-21 | LED heat-dissipating substrate and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201108474A (enrdf_load_stackoverflow) |
-
2009
- 2009-08-21 TW TW98128176A patent/TW201108474A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI378581B (enrdf_load_stackoverflow) | 2012-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |