201112460 六、發明說明： 【發明所屬之技術領域】 本發明係一種發光二極體（LED)散熱基板的製作方 法’尤其是一種能夠於導熱金屬基板上以網板印刷的方式 將絕緣膠僅設置於非封裝區域的發光二極體散熱基板，而 令LED與導熱金屬基板之間並無絕緣膠的阻隔，而使led 能夠迅速地將熱移除。 ^ 【先前技術】 隨著發光二極體（LED)產業的發展，為了因應市場需 求’在一封裝體中’ LED的數量已經大幅提升，且led的 七光功率也逐漸在改善，然而，這樣的改變所帶來的卻是 熱量的累積。當熱量無法有效地從LEd封裝體中散逸，所 以LED晶粒溫度過高，則勢必會導致「光衰」現象，即光 在傳輸中的訊號減弱，因此造成LED使用壽命的減損。 因此，在LED封裝體中，位於LED晶片底部皆會結 φ 5有政熱基板，並藉此結合至一散熱模組，使得L E D發 出的熱能夠經由散熱基板而傳遞至散熱模組，避免熱量累 積於LED封裝體中。 既有的散熱基板係在一導熱基板本體上全面塗佈絕緣 膠，再將一銅落層與該導熱基板本體壓合，而在壓合的過 程中，.絕緣膠受壓後會使得鋼落層與導熱基板本體之間形 m緣膠層’因此當LED要放置在製作完成的散氧基板 上時，該LED並非直接與導熱基板本體接觸，而是其之間 勢必會至少有-絕緣膠層的存在，因此阻礙了 led將熱傳 遞至導熱基板本體的途徑，使得散熱基板無法達到良好的 201112460 散熱功效。 再者’當該導熱基板本體係由鋁所製成時，由於鋁报 容易氧化’所以表面通常會形成一氧化鋁層，即使在焊接 之前除去該氧化鋁層’但焊接時產生的高溫仍然會使得紹 表面迅速形成氧化鋁層’因此铭基板無法以焊接的方式與 散熱模組結合。所以既有的散熱基板，可參考本國專利證 書第1 94556號之發明專利案以及本國專利公告第丨228947 號之發明專利案等，皆係於其底部塗佈錫膏，藉由錫膏使 ® 得鋁基板與散熱模組得以接合。然而，錫膏内部仍然含有 樹脂絕緣膠等成分，因此導熱的效果仍然不如直接焊接金 屬錫來的理想。所以既有散熱基板由於不能直接焊錫，因 此導致散熱基板無法有效發揮散熱的效果，故led的使用 壽命仍然無法增加。 而既有欲將鋁與錫焊接的方法通常有兩種，其十一種 是將鋁的焊接面以砂紙磨光，再以烙鐵沾有焊錫，於焊接 面上用力摩擦，以磨去氧化層，使得錫附著於焊接面上， 之後移除鐵，即可進行焊接；然而此種的焊接方式並不能 確保鋁表面完全無氧化層的存在，所以鋁和錫之間無法完 全接合，而有脫落的可能。 另外—種方式是在铭的焊接面上施以石肖酸果溶液，而 形成鋁汞合金，因此錫可焊接在鋁汞合金上，但焊接強度 並不高，尚須經由額外的加卫，而且采的導熱係數並不高^ 因此無法適用於散熱基板的製作。 【發明内容】 本發明人有鑒於既有散熱基板在LED和導熱基板本犖— 201112460 之間尚有絕緣膠的存在，使得熱量無法迅速地由LED傳遞 至散熱基板’因此仍會造成LED的損耗，而減低使用壽命， 因此本發明人藉由其豐富的知識背景以及多年的研究之 後’發明出此發光二極體（LED)散熱基板及其製作方法。 本發明之目的在於提供一種讓LED能夠直接設置於金 屑導熱基板上，而使LED能夠迅速地將熱移除的發光二極 體散熱基板。 為達上述目的’本發明發光二極體（LED)散熱基板的 • 製作方法，其係包括： 提供一導熱金屬基板，該金屬為鋁或銅； 於該導熱金屬基板的頂面依照預先決定的線路圖案形 成複數凹部； 在該導熱金屬基板的表面進行防腐姓處理； 於该導熱金屬基板上形成具有線路和電鍍導線之銅箔 層，且依照該預先決定的線路封裝區域圖案露出該導熱金 屬基板作為封裝區域的頂面，而形成一待處理基板； 籲 將該待處理基板經過電鍍前處理後，沉浸於一化學鎳 鍍液中，以無電解電鍍的方式在該待處理基板暴露於外的 金屬表面形成一化學鎳層’而獲得一無電解電鍍基板； 再於該無電解電鍍基板頂面之化學鎳層上形成金屬 層，該金屬層至少包括一層以喷錫而形成的錫層或以電鐘 而形成的金層或銀層； 去除電鍍導線後施加防焊油墨於需要防焊之金屬層表 面，即獲得該發光二極體（LED)散熱基板。 其中，於該導熱金屬基板上形成具有線路和電鍍導線 201112460 之銅珀層係包括在一塑膠軟板上、下兩面分別壓合一上銅 箔和下銅箔而形成一銅箔軟板’並依照該預先決定的線路 封裝區域圖案於該銅箔軟板形成複數穿孔，又以電鑛方式 連通二銅箔’再姓刻該銅箔軟板以形成具有線路和電锻導 線之銅羯層，再將該具有線路和電鍍導線之銅箔層之底部 施加絕緣膠，並於150〜2001的溫度下與該導熱金屬基板 進行壓合’使其與絕緣膠接合，而露出該導熱金屬基板作 為封裝區域的頂面，形成該待處理基板。 其中，在該銅箔軟板形成複數穿孔後，尚包括初步於 該上、下銅箔以蝕刻方式形成線路和電鍍導線，再將該銅 箔軟板浸在硫酸銅電鍍液中，以於該銅箔軟板表面以及穿 孔之避免形成厚度為10pm〜15α/πί的鍍層。 較佳的是，該具有線路和電鍍導線之鋼箔層係在 1 50〜200°C的溫度下進行壓合約30~50分鐘。 其中’於該導熱金屬基板上形成具有線路和電鍍導線 之銅箔層係包括於該導熱金屬基板的凹部内施以絕緣膠， 以使得封裝區域無絕緣膠存在，再將一銅落片於]5〇~2〇〇 C的/EL度下與6亥導熱金屬基板進行壓合，使得銅箱片與絕 緣膠接合而形成銅箔層，並依照該預先決定的線路圖案在 該銅箔層上將未與絕緣膠接合的部分蝕刻且移除，以形成 線路與電鍍導線，並露出該導熱金屬基板作為封裝區域的 頂面，形成該待處理基板。 較佳的是，該銅片係在150〜20(rc的溫度下與該導 熱金屬基板進行壓合約30〜50分鐘。 較佳的是，該凹部的深度至少為〇_〇5毫米（mm)，而 201112460 絕緣膠之厚度係小於0 · 0 5毫米（m m)。 較佳的是，該防腐蝕處理係以鉻酸鹽（c「3+)皮膜或氟 化鹽皮膜進行皮膜處理’以形成—皮膜層。較佳的是，該 皮膜層的厚度為0.1〜1微米（"m)。 較佳的是’所施加的絕緣膠為環氧酚醛樹脂（pheny丨 novolac epoxy)。該環氧酚醛樹脂屬於低膨脹係數的絕緣 膠。201112460 VI. Description of the Invention: [Technical Field] The present invention relates to a method for fabricating a light-emitting diode (LED) heat-dissipating substrate, in particular, an insulating rubber can be disposed on a heat-conductive metal substrate by screen printing. The light-emitting diode of the non-packaged area dissipates the substrate, so that there is no barrier between the LED and the thermally conductive metal substrate, so that the LED can quickly remove the heat. ^ [Prior Art] With the development of the LED industry, in order to meet the market demand, the number of LEDs in a package has been greatly improved, and the seven-light power of LED is gradually improving. However, this way The change brought about is the accumulation of heat. When the heat cannot be effectively dissipated from the LEd package, the LED die temperature is too high, which will inevitably lead to the "light decay" phenomenon, that is, the signal in the transmission is weakened, thus causing the LED service life to be degraded. Therefore, in the LED package, the bottom of the LED chip is connected with a φ 5 political substrate, and is coupled to a heat dissipation module, so that the heat generated by the LED can be transmitted to the heat dissipation module via the heat dissipation substrate to avoid heat. Accumulated in the LED package. The existing heat dissipating substrate is integrally coated with an insulating glue on a heat conducting substrate body, and then a copper falling layer is pressed against the heat conducting substrate body, and during the pressing process, the insulating rubber is pressed to cause the steel to fall. The m-layer glue layer is formed between the layer and the heat-conducting substrate body. Therefore, when the LED is to be placed on the fabricated oxygen-dissipating plate, the LED is not directly in contact with the heat-conducting substrate body, but at least there is a certain amount of insulating glue between them. The existence of the layer, thus hindering the way that the LED transfers heat to the body of the heat-conducting substrate, so that the heat-dissipating substrate cannot achieve good heat dissipation effect of 201112460. Furthermore, when the thermally conductive substrate is made of aluminum, since the aluminum is easily oxidized, the surface usually forms an aluminum oxide layer, and even if the aluminum oxide layer is removed before soldering, the high temperature generated during soldering will still occur. The surface of the surface is rapidly formed into an aluminum oxide layer. Therefore, the substrate cannot be soldered to the heat dissipation module. Therefore, the existing heat-dissipating substrate can be referred to the invention patent of the national patent certificate No. 1 945 556 and the invention patent of the national patent publication No. 228 947, etc., all of which are coated with a solder paste at the bottom thereof, and the solder paste is used. The aluminum substrate is bonded to the heat dissipation module. However, the inside of the solder paste still contains components such as resin insulating glue, so the heat conduction effect is still not as good as that of direct soldering of metal tin. Therefore, since the heat-dissipating substrate cannot be directly soldered, the heat-dissipating substrate cannot effectively exert the heat-dissipating effect, so the life of the LED cannot be increased. There are usually two methods for welding aluminum and tin. The eleven ones are to polish the welded surface of aluminum with sandpaper, then solder with soldering iron, and rub it on the welding surface to remove the oxide layer. So that the tin adheres to the soldering surface, and then the iron is removed, and the soldering can be performed; however, the soldering method does not ensure that the aluminum surface is completely free of the oxide layer, so that the aluminum and the tin cannot be completely bonded but fall off. Possible. In addition, the way is to apply the scutellaria fruit solution on the welding surface of the Ming, and form aluminum amalgam, so the tin can be welded on the aluminum amalgam, but the welding strength is not high, and additional reinforcement is required. Moreover, the thermal conductivity of the coating is not high enough to be suitable for the fabrication of the heat-dissipating substrate. SUMMARY OF THE INVENTION The present inventors have in view of the existence of an insulating paste between the LED and the heat-conducting substrate 2011-201112460, so that heat cannot be quickly transferred from the LED to the heat-dissipating substrate, so the LED loss is still caused. Therefore, the inventors have invented the light-emitting diode (LED) heat-dissipating substrate and the manufacturing method thereof by virtue of its rich knowledge background and years of research. SUMMARY OF THE INVENTION An object of the present invention is to provide a light-emitting diode heat-dissipating substrate which allows an LED to be directly disposed on a gold foil heat-conductive substrate to enable the LED to quickly remove heat. A method for fabricating a light-emitting diode (LED) heat-dissipating substrate of the present invention, comprising: providing a thermally conductive metal substrate, the metal being aluminum or copper; and a top surface of the thermally conductive metal substrate according to a predetermined Forming a plurality of recesses on the circuit pattern; performing a corrosion protection process on the surface of the heat conductive metal substrate; forming a copper foil layer having a line and a plating wire on the heat conductive metal substrate, and exposing the heat conductive metal substrate according to the predetermined circuit package area pattern As a top surface of the package region, a substrate to be processed is formed; and the substrate to be processed is subjected to pre-plating treatment, immersed in an electroless nickel plating solution, and exposed to the substrate to be processed by electroless plating. Forming a chemical nickel layer on the metal surface to obtain an electroless plated substrate; forming a metal layer on the chemical nickel layer on the top surface of the electroless plated substrate, the metal layer including at least one layer of tin formed by spraying tin or a gold or silver layer formed by an electric clock; after removing the electroplated wire, applying a solder resist ink to the surface of the metal layer requiring soldering prevention The light emitting diode (LED) heat sink substrate is obtained. Wherein, forming a copper layer having a line and a plating wire 201112460 on the heat conductive metal substrate comprises pressing a copper foil and a lower copper foil on a plastic flexible board and a lower surface to form a copper foil soft board. Forming a plurality of perforations in the copper foil soft board according to the predetermined circuit package area pattern, and electrically connecting the two copper foils in an electric ore manner to form the copper foil soft board to form a copper layer having a line and an electric forged wire. Applying an insulating paste to the bottom of the copper foil layer having the line and the electroplated wire, and pressing the thermally conductive metal substrate at a temperature of 150 to 2001 to bond the insulating paste to expose the thermally conductive metal substrate as a package. The top surface of the area forms the substrate to be processed. After the plurality of perforations are formed in the copper foil flexible board, the circuit and the electroplated wire are formed by etching on the upper and lower copper foils, and the copper foil soft board is immersed in the copper sulfate plating solution. The surface of the copper foil soft board and the perforations are prevented from forming a plating layer having a thickness of 10 pm 15 15 Å / π ί. Preferably, the steel foil layer having the wiring and the electroplated wire is subjected to a compression contract at a temperature of 150 to 200 ° C for 30 to 50 minutes. Wherein the formation of a copper foil layer having a line and an electroplated wire on the thermally conductive metal substrate comprises applying an insulating glue in the concave portion of the thermally conductive metal substrate, so that no encapsulation is present in the encapsulation region, and then a piece of copper is dropped on the substrate. 5〇~2〇〇C/EL degree is pressed together with the 6-well thermal conductive metal substrate, so that the copper box piece and the insulating glue are joined to form a copper foil layer, and the copper foil layer is formed according to the predetermined circuit pattern. A portion not bonded to the insulating paste is etched and removed to form a wiring and a plating wire, and the thermally conductive metal substrate is exposed as a top surface of the package region to form the substrate to be processed. Preferably, the copper sheet is bonded to the thermally conductive metal substrate at a temperature of 150 to 20 (rc) for 30 to 50 minutes. Preferably, the recess has a depth of at least 〇_〇 5 mm (mm). The thickness of the insulating coating of 201112460 is less than 0. 05 mm (mm). Preferably, the anti-corrosion treatment is performed by a chromate (c"3+) film or a fluoride film to form a film. —The film layer. Preferably, the film layer has a thickness of 0.1 to 1 μm ("m). Preferably, the applied insulating glue is pheny丨novolac epoxy. Phenolic resins are insulating adhesives with a low coefficient of expansion.
在一態樣中’當該導熱基板為鋁基板時，進行無電解 電鍍的步驟係包括將該待處理基板先以鋅置換處理後，再 "L 於一化學鎳鍍液令，使得該導熱金屬基板於暴露出來 的表面形成一化學鎳層；同時以觸鍍的方式使該銅箔線路 與電鍍導線表面形成一化學鎳層。 \在另一態樣中，當該導熱金屬基板（1〇)為銅基板時， 進仃無電解電鑛的步驟係包括將該銅基板沉浸於—化學錦 錢液中’並直接以_的方式使銅基板和銅落於暴露 的部份形成一化學鎳層。 二乂的是，該金屬層尚包括在形成錫層、金層或銀 二別在該化學鎳層上電鍍-銅層。該金屬層尚包括在形 θ *層或銀層之前’並於電鍍該銅層 形成H再使朗層 '金層或銀層形成於該錄;^ 車交4土 0^1 日 土的疋，施加該防焊油墨係以網板印刷的方式將 '墨網印於該錫層、 絕绦孟層次銀層之表面，以露出無施 夕立置的金屬層以及用於打線之接點的金屬層。 由上,發明尚關於-種發光二極體(led)散熱基板，盆 上述方法所製成者。 201112460 本發明又關於一種發光二極體（LED)散熱基板，其係 包括： 、 一導熱金屬基板，該金屬為鋁或銅，該導熱金屬義板 為頂面形成複數凹部，各凹部的内部具有絕緣膠層； 一銅箔層，其係壓合於該絕緣膠層上，以作為線路； 複數化學鎳層，其係分別形成在該導熱金屬基板之表 面以及該銅箔層非與絕緣膠層接觸之表面；以及 複數金屬層’其係形成在該導熱金屬基板之頂面的化 ♦學錄層之表面’各金屬層至少包括一層錫層、金層或銀層； 以及 一防焊油墨層，其係設置於該金屬層需要防焊之表 面。 其中’該銅箔層係一銅箔軟板，該銅箔軟板包括/塑 膠軟板、分別設置於該塑膠軟板上、下表面的上、下鈉箔 以及貫穿該塑膠軟板和上、下銅箔的複數穿孔，且部分穿 孔的壁面形成導接該上、下銅箔的金屬鍍層，以形成線絡。 •其中該金屬鍍層可為銅層。 其中’該銅箔層係由銅箔片所組成的。 較佳的是，該凹部的深度至少為0.05毫米（mm)，而 絕緣膠層之厚度係小於〇.〇5毫米（mm)。 較佳的疋’各金屬層尚包括一電鍵銅層，其係設爹·於 έ玄化學鎳層與該錫層、金層或銀層之間。 更佳的疋，各金屬層尚包括一電锻鎮層，其係設裏於 該電鍍銅層與該錫層、金層或銀層之間。 較佳的是，該導熱金屬基板與絕熱膠層之間具有〆今 201112460 膜層。更佳的是，該皮膜層係由鉻酸鹽（c「3+)皮膜或氟化 鹽皮膜所組成，該皮膜層的厚度為〇1〜彳微米（"m)。。 較佳的是’該絕緣膠層為具有低膨脹係數特性的環氧 酴路樹脂。 本發明之LED和導熱金屬基板之間僅有化學鎳層和金 屬層’因此沒有非金屬的.絕緣膠阻礙，使得LED能夠順利 且迅速地將熱傳遞至導熱金屬基板，而且本發明之導熱金 屬基板底部能夠直接與散熱模組以焊錫的方式焊接，因此 散熱效果極佳’故能避免led產生光衰，而增加led 壽命。 、 【實施方式】 在此所述的「無電解電鍍」又稱為「化學鍍」，因此 「無電解電鍍鎳」與「化學錄」之用語可以互換使用。其 係在不通電的情況下’利用氧化還原反應於工件上形成； 勾鍍層的方法。其中無電解電鍍包括置換鍍(如離子交換或In one aspect, when the heat conductive substrate is an aluminum substrate, the step of performing electroless plating includes first replacing the substrate to be treated with zinc, and then <L in an electroless nickel plating solution to make the heat conduction The metal substrate forms a chemical nickel layer on the exposed surface; at the same time, the copper foil line and the surface of the plated wire form a chemical nickel layer by means of plating. In another aspect, when the thermally conductive metal substrate (1〇) is a copper substrate, the step of introducing the electroless ore is performed by immersing the copper substrate in the chemical liquid solution and directly The method causes the copper substrate and the copper to fall on the exposed portion to form a layer of chemical nickel. Second, the metal layer is also included in the formation of a tin layer, a gold layer or a silver layer on the electroless nickel layer. The metal layer is further included in the shape of the θ* layer or the silver layer and is formed by electroplating the copper layer to form H and then forming a gold layer or a silver layer of the lan layer in the record; Applying the solder resist ink to the surface of the tin layer and the silver layer of the enamel layer by screen printing to expose the metal layer without the scotch and the metal used for bonding the wire Floor. From the above, the invention relates to a kind of light-emitting diode (LED) heat-dissipating substrate, which is produced by the above method. The invention further relates to a light-emitting diode (LED) heat-dissipating substrate, comprising: a heat-conductive metal substrate, the metal is aluminum or copper, and the heat-conductive metal plate has a plurality of concave portions on the top surface, and the inner portions of each concave portion have An insulating layer; a copper foil layer pressed onto the insulating layer as a line; a plurality of chemical nickel layers respectively formed on a surface of the thermally conductive metal substrate and the copper foil layer and the insulating layer a surface to be contacted; and a plurality of metal layers 'formed on the surface of the top surface of the thermally conductive metal substrate'. Each metal layer includes at least one layer of tin, gold or silver; and a solder resist layer It is disposed on the surface of the metal layer that needs to be solder-proof. Wherein the copper foil layer is a copper foil soft board, and the copper foil soft board comprises/plastic soft board, upper and lower sodium foils respectively disposed on the plastic soft board and the lower surface, and the plastic soft board and the top, The plurality of underlying copper foils are perforated, and the partially perforated wall surface forms a metal plating layer that connects the upper and lower copper foils to form a wire. • Where the metal coating can be a copper layer. Wherein the copper foil layer is composed of a copper foil sheet. Preferably, the recess has a depth of at least 0.05 millimeters (mm) and the thickness of the insulating layer is less than 〇.〇5 mm (mm). Preferably, each of the metal layers further comprises a bond copper layer between the nickel layer and the tin layer, the gold layer or the silver layer. More preferably, each of the metal layers further includes an electrically forged town layer disposed between the electroplated copper layer and the tin, gold or silver layer. Preferably, the thermal conductive metal substrate and the thermal insulating adhesive layer have a film of 201112460. More preferably, the film layer is composed of a chromate (c"3+) film or a fluoride film, and the film layer has a thickness of 〇1 to 彳micrometer ("m). Preferably 'The insulating adhesive layer is an epoxy circuit resin with low expansion coefficient. There is only a chemical nickel layer and a metal layer between the LED and the thermally conductive metal substrate of the present invention. Therefore, there is no non-metallic insulating glue hindering, so that the LED can The heat is smoothly and quickly transferred to the heat conductive metal substrate, and the bottom of the heat conductive metal substrate of the present invention can be directly soldered to the heat dissipation module, so that the heat dissipation effect is excellent, so that the light decay of the LED can be avoided, and the life of the LED is increased. [Embodiment] The "electroless plating" described herein is also called "electroless plating", so the terms "electroless nickel plating" and "chemical recording" can be used interchangeably. It is formed by a redox reaction on a workpiece without being energized; a method of depositing a layer. Where electroless plating includes displacement plating (such as ion exchange or
電荷交換沉積)' 觸錢、實質上的化學鐘，此為所屬技術領 域令具有通常知識者所知悉的技術，㈣前並無使用於改 善鋁基板的焊接特性方面。 在此所述的t鍵前處理」在一般的情況下係指在電 鐘之前所進行的處理，而於本發明中係在無電解電鐘之前 所進行的處理，而虛搜古斗 處里方式相同，包括酸洗以移除工件表 面的皮膜、氧化層或鏽層等以增加鍍層附著力、除油以去 除工件表面的油脂以避免鍍層脫落。 拓二t 圖所示’本發明發光二極體(LED)散熱基 板的1作方法，其係包括以下步驟： 201112460 提供基板步驟（a)，請附加參看第二A和三a圖所示， 其係提供—導熱金屬基板（10); 頂面凹部形成步驟（b)，請附加參看第二b和三b圖 所不，其係於該導熱金屬基板（1〇)的頂面（12)是依照預先 決疋的線路封裝區域圖案藉由蝕刻（etch)、壓鑄（die casting) 各種機械加工方法或模具鑄造（m〇丨leading)形成複數凹部 (11) ’各凹部（1彳）的深度至少為〇 〇5毫米； 防腐飯處理步驟（c) ’請附知參看第二C和三◦圖所 •不，係在該導熱金屬基板（10)的表面以鉻酸鹽（Cr3 + )或氟化 鹽進行防腐蝕處理，即皮膜處理’而在該導熱金屬基板（1 〇) 的表面形成厚度約為〇·1~1微米（"m)的皮膜層（20); 形成具有線路和電鍍導線之銅箔層步驟（d)，請附加參 看第二F和三F圖，其係在該導熱金屬基板（1〇)上形成具 有線路和電鍍導線之銅箔層（4〇)，且依照該預先決定的線 路封裝區域圖案露出該導熱金屬基板（1〇)未有絕緣膠層 (30)覆蓋之區域，即作為封裝區域的頂面（12)，而形成一 •待處理基板（1〇a); 此步驟之第一實施例，係包括提供一塑膠軟板（41)以 及上、下銅箔（42, 43)(第四a圖）；並將該上、下銅箔（42, 43) 分別壓合在一耐高溫工程塑膠軟板（4彳）上、下兩面而形成 一銅羯軟板（40a)(第四b圖），該上、下銅落（42, 43)是作 為二電極；並依照該預先決定的線路封裝區域圖案於該銅 箔軟板（40a)以機械加工的方式形成複數穿孔（44)(第四〇 圖）’或者可依照需要額外進行蝕刻鑽孔，以方便線路的製 作；並於該上、下銅箱（42, 43)進行钱刻以初步形成線路 r r 10 201112460 和電鍍導線；之後再將該銅箔軟板（4〇a)浸在硫酸銅電鍍液 中，以電鍍方式形成厚度為Ί 的鍍層（45)，該 鍍層（45)係形成於該上 '下銅箔（42, 43)表面以及形成於穿 孔（44)内壁（由於在硫酸銅溶液中可加入活化劑故於塑膠 軟板（41)部分外露的部分亦能產生鍍層），以連通該上、下 鋼箔（42，43)(第四D圖，僅顯示穿孔（44)壁面的鐘層）；而 後再進一步蝕刻該銅箔軟板（4〇a)以形成具有線路和電鍍導 線之銅箔層（40)(第四e圖）’故能避免上、下銅箔（42,43) 籲連通而產生正、負極導通之短路的問題，並能夠讓之後LED 的正負極皆於上銅箱（42)打線，但其中一極係能藉由下銅 箱（43)所傳導；請參看第二D圖所示，於該具有線路和電 鍍導線之銅箔層（40)之底部施加絕緣膠，由於環氧酚醛樹 脂（phenyl n0V0|ac epoxy)具有耐高溫和膨脹係數小的優 點，故本發明令較佳的絕緣膠為環氧酚醛樹脂，再請參看 第一 E圖所示，之後，將該具有線路和電鍍導線之銅箔層 (4〇)在150〜200t的溫度下與該導熱金屬基板（10)進行壓 合約30〜50分鐘’使得該具有線路和電鍍導線之銅箱層 的絕緣膠_與該導熱金屬基板（1〇)接合，使得封裝區域 無絕緣料在，該封裝區域係供之後LED W放置的位 置，各絕緣膠層（30)厚度係小於〇 〇5毫米再請參看第二 F圖所示，虔合後’露出該導熱金屬基板（叫作為封裝區 域的頂面（12〉(此時仍覆蓋有皮膜層㈣），㈣成—待處理 基板（1 0 a); 此步驟之第二實施例’請參看第三D圖所示，其係於 該導熱金屬基板（1Q)之凹部⑴）内的皮膜層（2Q)上以網板印 201112460 刷的方式以該預先決定的線路封裝區域圖案施加絕緣膠， 以形成複數絕緣膠層（30)，且使得封裝區域無絕緣膠存在， 該封裝區域係供之後LED晶片放置的位置，各絕緣膠層（3〇) 厚度係小於0_05毫米，由於環氧酚醛樹脂（pheny丨n〇v〇丨扣 epoxy)具有耐高溫和膨脹係數小的優點故本發明中較佳 的絕緣膠為環氧酚醛樹脂，請參看第三E圖所示，其係包 括將一銅箱片（40_)在i 50〜20(rc的溫度下與該導熱金屬基 板（10)進行壓合約30~50分鐘，使得銅箔片（4〇，）與絕緣膠 • (3〇)接合’由於該導熱金屬基板（1〇)之凹部（11)的緣故，使 得該銅箔片（40，）之表面形成凹凸的結構，請附加參看第三 F圖所示，其係依照該預先決定的線路圖案在銅箔片（4〇·) 上蝕刻出線路和電鍍導線，同時將未與絕緣膠層（3〇)接合 的部分也蝕刻移除而形成具有線路和電鍍導線之銅落層 (40)’並露出該導熱金屬基板（1〇)的頂面（12)(此時仍覆蓋 有皮膜層（20))’而形成一待處理基板（i〇a); 無電解電鍍步驟（e)’請附加參看第二◦以及三G圖 •所示，將該待處理基板（1 〇 a)經過電鍍前處理後，去除未被 絕緣膠（30)覆蓋之部分的皮膜層（20);再將其沉浸於一化 學鎳鑛液中’請附加參看第二Η和三Η圖，以無電解電鍵 的方式使該待處理基板（10a)以及線路與電鐘導線上形成 尽度約為3〜5微米（/ym)的化學錄層（50)，而獲得_無電解 電鍍基板（10b); 基板底部貼附耐高溫膠帶步驟（f)，請附加參看第二i 及三丨圖’為了避免該導熱金屬基板（1〇)底部進行後續形 成金屬層之處理，故在該導熱金屬基板（10)底部貼附有耐 12 201112460 向溫膠帶（51); .電鍍銅層步驟（g)，請繼續參看第二丨及三丨圖所示， 其係於該無電解電鍍基板（10b)頂面（12)之化學鎳層⑴上 電鍍一電鍍銅層（60)，該電鍍銅層（60)之厚度約為1〇〜15 微米（/^m); 電鍍錄層步驟（h)’請附加參看第二j及三」圖所示， 其係在該電鍍銅層（60)上係電鍍鎳，而形成一電鍍鎳層 (7〇) ’其厚度約為3〜5微米km); 喷錫、電鍍金或電鍍銀步驟（i)，請附加參看第二κ及 三Κ圖所示，其係再於該電鍍鎳層（7〇)上喷錫或電鍍金或 銀而形成錫層或金層或銀層（8〇)。； 去除電鍍導線步驟（j)，請附加參看第二L及三L圖所 不，其係以蝕刻的方式去除之前在無電解電鍍步驟中所使 用的導線’例如移除銅箔軟板電鍍導線的部分並部分移 除該化學鎳層（50)、電鍍銅層（60)、電鍍錄層（70)以及錫層 或金層或銀層（80)，之後，將該導熱金屬基板 耐高溫膠帶（51)移除； 防焊處理步驟（k)，請附加參看第二Μ及三|^圖所示， 係於4金屬層狀結構表面以網板印刷的方式網印防焊 油墨，而形成一防焊油墨層（90),並露出之後要封裝led 的位置以及之後要用於打線的接點，最後獲得—發光二極 體散熱基板（1 〇 c)。 由於本發明之導熱金屬基板（1〇)可由鋁或銅所製成， 因此本發明人針對無電解電鍍步驟（e)依照不同材質的導熱 金屬基板（10)提供兩種不同的實施方式，然而於所屬技術 13 201112460 領域中具有通常知識者可能還可科用其他設備或者經過稍 微修飾後亦可達成目的的無電解電鍍步驟（e)，皆屬於本發 明之範疇。 當該導熱金屬基板（1〇)為鋁基板時，所進行的無電解 電鍍步驟可使用一裝設有整流器的不繡鋼槽，為了防止鎳 鍍液鍍在不鏽鋼槽的槽壁，因此以一正極接在不鏽鋼鍍槽 上，負極則接在一個和不鏽鋼槽絕緣的極棒上，且該極棒 設置在鎳鍍液中。之後將該鋁基板沉浸於該鎳鍍液中以 鋅置換處理後，該鋁基板上暴露出的鋁金屬部分會形成一 化學鎳層；同時以觸鍍的方式，亦即將鋁基板上暴露出的 銅金屬與極棒接觸約3〜5秒即可在銅金屬表面形成一化學 錦層。 而當该導熱金屬基板（1〇)為銅基板時，進行無電解電 鍍的步驟係包括將該銅基板沉浸於一化學鎳鍍液中，並直 接以觸鍍的方式使銅基板和銅箔於暴露出來的部份形成一 化學鎳層。 第一 M以及三M圖所示’本發明之發光二極體（LED) 散熱基板（10c)，其係包括： 一導熱金屬基板（1〇)，其頂面（12)以預先決定的線路 封裝區域圖案間隔形成複數凹部（11),各凹部（1 1)的深度 >、為0_05毫米（mm),各凹部（彳彳）的表面形成有由鉻酸 (Cr )皮膜或氟化鹽皮膜所組成之皮膜層（2〇)，該皮膜層 (2〇)的厚度約為〇_1〜1微米，而各凹部（11)内部以網印的 方式形成有絕緣膠層（3〇)，該絕緣膠層（3〇)為環氧酚醛樹 月曰’且其厚度小於約為0.05毫米； 14 201112460 一銅箔層（40)，其係壓合於該絕緣膠層（3〇)的頂面， 且具有線路； 複數化學鎳層（50)，其係分別形成在該導熱金屬基板 (10)之表面以及該銅I"自層（40)之表面； 複數金屬層，各金屬層包括形成在該導熱金屬基板（1〇) 頂面之化學鎳層（50)上之一電鍍銅層（60)、形成在該等電 鍍銅層（60)於該化學鎳層（50)對向之表面的電鍍鎳層（7〇)以 及形成在該電鍍鎳層（70)於該電鍍銅層（6〇)對向之表面的 # 錫層、金層或銀層（80); 一防焊油墨層（90)，其係局部塗佈在該金屬層表面以 及在該化學鎳層（50)於該導熱金屬基板（1〇)對向之表面。 。月參看苐四E圖所示，於本發明之一實施例中，該銅 箔層（40)包括一塑膠軟板（41)、分別設置於該塑膠軟板（41) 上、下表面的上、下銅箔（42, 43)以及貫穿該塑膠軟板（4 ” 和上、下銅箔（42，43)的複數穿孔（44)，且部分穿孔（44)的 壁面形成導接該上、下銅箔（42, 43)的銅鍍層（45)，以形成 Φ 線路。 請參看第三E圖所示，於本發明之另一實施例中，該 銅箔層（40)係以一銅箔片（4〇，）所組成。 本發明依照客戶所要求的圖案在該導熱金屬基板（1 〇) 形成凹部（11 )，並將絕緣膠置於該等凹部（1 1)中，而能夠 避免在LED和該導熱金屬基板（1〇)之間仍有絕緣膠的存 在，又能避免在之後的壓合步驟中絕緣膠受熱而會有流動 而相互連接的疑慮，使用時，LED和導熱金屬基板（1〇)之 間雖然有一化學錄層（50)和金屬層，但其亦為金屬’因此 15 201112460 沒有絕緣膠（含有非金屬的樹脂）的阻礙，所以LED勢必能 夠迅速地將熱傳遞至導熱金屬基板（10)，以避免LED產生 光衰，故能增加L E D的壽命。 特別的疋，由於本發明利用無電解電鍍的方式在導熱 金屬基板（10)表面形成化學鎳，因此當導熱金屬基板（1〇) 之底部欲與一散熱模組接合時，能夠直接利用該導熱金屬 基板（10)底部的化學鎳層（50)以焊錫的方式固定在該散熱 模組上，因為化學鎳以及錫.焊料皆為金屬因此散熱效果 •極佳’所以本發明能夠有效率地讓導熱金屬基板（1〇)上的 熱量傳遞至散熱模組，而避免在導熱金屬基板和散熱模組 之間產生一非金屬界面，而且導熱效率能大於既有導熱基 板本體的30%以上，故能達到快速散逸熱量的目的。 【圖式簡單說明】 第一圖係本發明之流程圖。 第二A至Μ圖係本發明一實施例之流程步驟的剖面示 意圖。 弟二Α至Μ圖係本發明另一實施例之流程步驟的剖面 示意圖。 第四Α至Ε圖係本發明一實施例之銅箔軟板的製作流 程步驟的剖面示意圖。 上述剖面圖僅為使所屬技術領域中具有通常知識者能 夠了解本發明之内容所做的示意圖，並未呈現所屬技術領 域中具有通常知識者皆能了解的細節部分，且所示之尺 寸、厚度等皆非依照實際比例繪製，故無意限制本發明的 尺寸和厚度。 16 201112460 【主要元件符號說明】 (a) 提供基板步驟 (b) 頂面凹部形成步驟 (c) 防腐蝕處理步驟 (d) 形成具有線路和電鍵導線之銅箔層步驟 (e) 無電解電鍵步驟 (f) 基板底部貼附耐高溫膠帶步驟Charge exchange deposition) 'touch money, a substantial chemical clock, which is a technique known to those skilled in the art, and (4) has not been used to improve the soldering characteristics of aluminum substrates. The pre-t-key treatment described herein refers to the processing performed before the electric clock in the general case, and in the present invention, the processing performed before the electroless-electric clock, and in the virtual search. The method is the same, including pickling to remove the film, oxide layer or rust layer of the surface of the workpiece to increase the adhesion of the coating and remove the oil to remove the grease on the surface of the workpiece to avoid the peeling of the coating. The method for manufacturing a light-emitting diode (LED) heat-dissipating substrate of the present invention includes the following steps: 201112460 provides a substrate step (a), please refer to the second and third figures a, It is provided with a heat conductive metal substrate (10); a top concave portion forming step (b), please refer to the second and third b drawings, which are attached to the top surface (12) of the heat conductive metal substrate (1) The depth of each of the concave portions (11) is formed by etching, etching, or various casting machining methods according to a predetermined circuit package region pattern. At least 〇〇5 mm; anti-corrosion rice treatment step (c) 'Please refer to the second C and three diagrams. ・No, on the surface of the thermally conductive metal substrate (10) with chromate (Cr3 + ) or The fluoride salt is subjected to an anti-corrosion treatment, that is, a film treatment, and a film layer (20) having a thickness of about 11 to 1 μm ("m) is formed on the surface of the thermally conductive metal substrate (1 ;); Step (d) of the copper foil layer of the electroplated wire, please refer to the second F and F, attached to the guide a copper foil layer having a line and an electroplated wire is formed on the hot metal substrate (1〇), and the thermally conductive metal substrate (1〇) is exposed without an insulating layer (30) according to the predetermined circuit package area pattern. The covered area, that is, the top surface (12) of the package area, forms a substrate to be processed (1〇a); the first embodiment of this step includes providing a plastic flexible board (41) and upper and lower portions. Copper foil (42, 43) (fourth a picture); and the upper and lower copper foils (42, 43) are respectively pressed onto the upper and lower sides of a high temperature resistant engineering plastic soft board (4 inch) to form a copper a soft board (40a) (fourth b), the upper and lower copper drops (42, 43) are used as two electrodes; and mechanically in accordance with the predetermined line package area pattern on the copper foil soft board (40a) The processing method forms a plurality of perforations (44) (fourth map) or may be additionally etched as needed to facilitate the fabrication of the line; and the money is engraved on the upper and lower copper boxes (42, 43). Forming line rr 10 201112460 and plating wire; then immersing the copper foil soft plate (4〇a) in copper sulfate plating solution Forming a plating layer (45) having a thickness of Ί by electroplating, the plating layer (45) being formed on the surface of the upper 'lower copper foil (42, 43) and formed on the inner wall of the perforation (44) (since the copper sulfate solution can be added The activator can also produce a coating on the exposed portion of the plastic flexible board (41) to connect the upper and lower steel foils (42, 43) (fourth D, only the clock layer of the perforated (44) wall surface) Then, the copper foil soft board (4〇a) is further etched to form a copper foil layer (40) having a line and a plating wire (fourth e-picture), so that the upper and lower copper foils (42, 43) can be avoided. The problem of short circuit between the positive and negative conduction is connected, and the positive and negative poles of the LED can be wired in the upper copper box (42), but one of the poles can be conducted by the lower copper box (43); As shown in FIG. 2D, an insulating paste is applied to the bottom of the copper foil layer (40) having the wiring and the plating wire. Since the epoxy phenolic resin (phenyl n0V0|ac epoxy) has the advantages of high temperature resistance and small expansion coefficient, The preferred insulating glue is epoxy phenolic resin, please refer to Figure E, and then A copper foil layer (4 turns) having a line and an electroplated wire is pressed with the thermally conductive metal substrate (10) at a temperature of 150 to 200 t for 30 to 50 minutes to make the insulating layer of the copper box layer having the line and the electroplated wire _ Engaged with the thermally conductive metal substrate (1〇), so that the package area is free of insulating material, the package area is for the position where the LED W is placed later, and the thickness of each insulating layer (30) is less than 〇〇5 mm. As shown in Fig. 2F, after the bonding, the thermally conductive metal substrate is exposed (called the top surface of the package area (12) (the film layer (4) is still covered at this time), and (4) the substrate to be processed (10 a); The second embodiment of the step 'please refer to the third D figure, which is determined by the screen printing 201112460 brush on the film layer (2Q) in the concave portion (1) of the heat conductive metal substrate (1Q). The line package area pattern is coated with an insulating paste to form a plurality of insulating glue layers (30), and the package area is free of insulating glue, and the package area is for the position where the LED chips are placed later, and each insulating layer (3 turns) thickness system Less than 0_05 mm due to epoxy phenolic The grease (pheny丨n〇v〇丨 epoxy) has the advantages of high temperature resistance and small expansion coefficient. Therefore, the preferred insulating glue in the present invention is an epoxy phenolic resin, as shown in the third E diagram, which includes a The copper box piece (40_) is pressed with the heat conductive metal substrate (10) for 30 to 50 minutes at a temperature of rc 50 to make the copper foil piece (4 inch,) and the insulating glue (3 inch) bonded. 'Because of the concave portion (11) of the thermally conductive metal substrate (1), the surface of the copper foil sheet (40) is formed with irregularities. Please refer to the third F diagram, which is determined according to the predetermined The wiring pattern etches the wiring and the plating wire on the copper foil (4 〇 ·), and the portion not bonded to the insulating layer (3 〇) is also etched away to form a copper falling layer having the wiring and the plating wire ( 40) 'and expose the top surface (12) of the thermally conductive metal substrate (1) (which is still covered with the film layer (20)) to form a substrate to be processed (i〇a); electroless plating step (e ) 'Please refer to the second and third G diagrams. Please show the substrate to be processed (1 〇a) before plating. The film layer (20) except for the portion not covered by the insulating glue (30); and then immersed in a chemical nickel ore solution. Please refer to the second and third figures for additional electrolysis. The processing substrate (10a) and the line and the electric clock wire form a chemical recording layer (50) with a fullness of about 3 to 5 micrometers (/ym), thereby obtaining an electroless plating substrate (10b); For the tape step (f), please refer to the second and third figures. In order to avoid the subsequent formation of the metal layer on the bottom of the thermally conductive metal substrate (1), the bottom of the thermally conductive metal substrate (10) is attached with resistance. 12 201112460 Toward temperature tape (51); . Electroplating copper layer step (g), please continue to refer to the second and third figures, which are attached to the chemical nickel of the top surface (12) of the electroless plated substrate (10b) An electroplated copper layer (60) is plated on the layer (1), and the thickness of the electroplated copper layer (60) is about 1 〇 15 15 μm (/^m); the plating layer step (h) 'please refer to the second j and the third As shown in the figure, it is electroplated with nickel on the electroplated copper layer (60) to form an electroplated nickel layer (7〇) having a thickness of about 3 to 5 micrometers. Mm); spray tin, electroplated gold or electroplated silver step (i), please refer to the second κ and Κ Κ diagram, which is then sprayed with tin or gold or silver on the electroplated nickel layer (7 〇) A tin layer or a gold layer or a silver layer (8 Å) is formed. The step of removing the plating wire (j), please refer to the second and third L drawings, which removes the wire previously used in the electroless plating step by etching, for example, removing the copper foil soft plate plating wire. And partially removing the chemical nickel layer (50), the electroplated copper layer (60), the plating layer (70), and the tin layer or the gold layer or the silver layer (80), after which the heat conductive metal substrate is resistant to high temperature tape. (51) Removal; solder-resistance treatment step (k), please refer to the second and third | ^ figure, which is printed on the surface of the 4 metal layer structure by screen printing to prevent the ink from being printed. A solder resist ink layer (90), and after exposing the position where the led is to be packaged and then the contact point to be used for wire bonding, finally obtaining a light-emitting diode heat-dissipating substrate (1 〇 c). Since the thermally conductive metal substrate (1〇) of the present invention can be made of aluminum or copper, the inventors provided two different embodiments for the electroless plating step (e) according to the thermally conductive metal substrate (10) of different materials, however It is within the scope of the invention to have an electroless plating step (e) which has the usual knowledge in the field of the technology 13 201112460 and which may also be used with other equipment or with a slight modification. When the thermally conductive metal substrate (1〇) is an aluminum substrate, the electroless plating step performed may use a stainless steel groove provided with a rectifier, and in order to prevent the nickel plating solution from being plated on the groove wall of the stainless steel groove, The positive electrode is connected to the stainless steel plating tank, and the negative electrode is connected to a rod insulated from the stainless steel tank, and the pole is disposed in the nickel plating solution. After the aluminum substrate is immersed in the nickel plating solution and replaced by zinc, the exposed aluminum metal portion of the aluminum substrate forms a chemical nickel layer; and at the same time, the plating method is exposed to the aluminum substrate. The copper metal is in contact with the pole for about 3 to 5 seconds to form a chemical layer on the copper metal surface. When the thermally conductive metal substrate (1〇) is a copper substrate, the step of performing electroless plating comprises immersing the copper substrate in an electroless nickel plating solution, and directly exposing the copper substrate and the copper foil by means of plating. The resulting portion forms a layer of chemical nickel. The first and third M diagrams show a light-emitting diode (LED) heat-dissipating substrate (10c) of the present invention, which comprises: a thermally conductive metal substrate (1 〇) having a top surface (12) with a predetermined line The package region pattern is formed with a plurality of recesses (11), the depth of each recess (1 1) is 0_05 millimeters (mm), and the surface of each recess is formed of a chromic acid (Cr) film or a fluoride salt. a film layer (2〇) composed of a film, the film layer (2〇) having a thickness of about 〇_1~1 μm, and an inner layer of the recess (11) is formed with an insulating layer (3〇) The insulating adhesive layer (3〇) is an epoxy novolac tree and has a thickness of less than about 0.05 mm; 14 201112460 a copper foil layer (40) which is press-bonded to the insulating layer (3〇) a top surface, and having a line; a plurality of chemical nickel layers (50) respectively formed on a surface of the thermally conductive metal substrate (10) and a surface of the copper I" self layer (40); a plurality of metal layers, each metal layer comprising An electroplated copper layer (60) formed on the chemical nickel layer (50) on the top surface of the thermally conductive metal substrate (1), formed on the electroplated copper layer (60) An electroplated nickel layer (7〇) on the opposite surface of the electroless nickel layer (50) and a #tin layer and a gold layer formed on the surface of the electroplated nickel layer (70) opposite to the electroplated copper layer (6〇) Or a silver layer (80); a solder resist ink layer (90) partially coated on the surface of the metal layer and on the surface of the chemical nickel layer (50) opposite the thermally conductive metal substrate (1). . In one embodiment of the present invention, the copper foil layer (40) includes a plastic flexible board (41) disposed on the upper surface and the lower surface of the plastic flexible board (41). a lower copper foil (42, 43) and a plurality of perforations (44) extending through the plastic flexible board (4" and the upper and lower copper foils (42, 43), and the wall surface of the partial perforation (44) is formed to be connected to the upper surface, The copper plating layer (45) of the copper foil (42, 43) is formed to form a Φ line. Referring to the third E diagram, in another embodiment of the present invention, the copper foil layer (40) is made of a copper. A foil (4 〇,) is formed. The present invention forms a concave portion (11) on the thermally conductive metal substrate (1 〇) according to a pattern required by the customer, and places the insulating rubber in the concave portions (11). Avoid the presence of insulating glue between the LED and the thermally conductive metal substrate (1〇), and avoid the doubt that the insulating glue will be heated and connected to each other during the subsequent pressing step. When used, the LED and the heat conduction Although there is a chemical recording layer (50) and a metal layer between the metal substrates (1〇), it is also a metal 'so 15 201112460 has no insulating glue The hindrance of the non-metallic resin, so the LED is bound to be able to quickly transfer heat to the thermally conductive metal substrate (10) to avoid the LED from emitting light, so that the life of the LED can be increased. In particular, since the present invention utilizes electroless The method of electroplating forms chemical nickel on the surface of the thermally conductive metal substrate (10), so when the bottom of the thermally conductive metal substrate (1〇) is to be bonded to a heat dissipating module, the chemical nickel layer at the bottom of the thermally conductive metal substrate (10) can be directly utilized. (50) Fixing on the heat dissipating module by soldering, since the chemical nickel and the tin are all metal, the heat dissipating effect is excellent. Therefore, the present invention can efficiently heat the heat conducting metal substrate (1 〇) Passing to the heat dissipation module avoids creating a non-metallic interface between the heat conductive metal substrate and the heat dissipation module, and the heat conduction efficiency can be greater than 30% of the existing heat conduction substrate body, so that the purpose of quickly dissipating heat can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a flow chart of the present invention. The second A to the drawing is a schematic cross-sectional view showing the process steps of an embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 4 is a cross-sectional view showing a process flow of a copper foil soft board according to an embodiment of the present invention. The above sectional view is only for the technical field of the present invention. Those skilled in the art can understand the details of the present invention, and do not present the details of those skilled in the art, and the dimensions, thicknesses, etc. are not drawn according to the actual scale, so it is not intended to be limited. Size and thickness of the present invention 16 201112460 [Description of main component symbols] (a) Substrate step (b) Top recess forming step (c) Anti-corrosion treatment step (d) Step of forming a copper foil layer having a line and a key wire (e) Electroless key step (f) Step of attaching high temperature resistant tape to the bottom of the substrate
(g) 電鍵銅層步驟 (h) 電錢鎳層步驟 ⑴噴錫、電鑛金或電鍵銀步驟 ⑴去除電艘導線步驟 (k)防焊處理步驟 (10) 導熱金屬基板 （10a)待處理基板 (1〇b)無電解電鍍基板（10c)發光二極體散熱基板 (11) 凹部 （12)頂面 (20)皮膜層 （30)絕緣膠層 (40)具有線路和電鍍導線之銅箔層（40’）銅箔片 (40a)銅箔軟板 (42)上銅箔 (44)穿孔 (50)化學鎳層 (60)電鐘銅層 (80)錫層或金層 (41)塑膠軟板 (43)下銅箔 (45)鍍層 (51)财高溫膠帶 (70)電鍍鎳層 或銀層 （90)防焊油墨層 17(g) Key copper layer step (h) Electromoney nickel layer step (1) Spray tin, electric gold or silver key step (1) Removal of electric ship wire step (k) Soldering treatment step (10) Thermal conductive metal substrate (10a) to be processed Substrate (1〇b) electroless plated substrate (10c) light-emitting diode heat-dissipating substrate (11) concave portion (12) top surface (20) film layer (30) insulating rubber layer (40) copper foil with wiring and plating wire Layer (40') copper foil (40a) copper foil soft board (42) copper foil (44) perforated (50) chemical nickel layer (60) electric clock copper layer (80) tin layer or gold layer (41) plastic Soft board (43) under copper foil (45) plating (51) high temperature tape (70) electroplated nickel layer or silver layer (90) solder resist ink layer 17