TW201104781A - Apparatus for containing packaged chip, test tray including the same, and test handler using the same - Google Patents

Apparatus for containing packaged chip, test tray including the same, and test handler using the same Download PDF

Info

Publication number
TW201104781A
TW201104781A TW099114699A TW99114699A TW201104781A TW 201104781 A TW201104781 A TW 201104781A TW 099114699 A TW099114699 A TW 099114699A TW 99114699 A TW99114699 A TW 99114699A TW 201104781 A TW201104781 A TW 201104781A
Authority
TW
Taiwan
Prior art keywords
wafer
test
accommodating
main body
groove
Prior art date
Application number
TW099114699A
Other languages
English (en)
Chinese (zh)
Inventor
Beom-Ho Shin
Original Assignee
Mirae Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mirae Corp filed Critical Mirae Corp
Publication of TW201104781A publication Critical patent/TW201104781A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Robotics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW099114699A 2009-05-29 2010-05-07 Apparatus for containing packaged chip, test tray including the same, and test handler using the same TW201104781A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090047240A KR101039858B1 (ko) 2009-05-29 2009-05-29 반도체 소자 수납장치, 테스트 트레이, 및 테스트 핸들러

Publications (1)

Publication Number Publication Date
TW201104781A true TW201104781A (en) 2011-02-01

Family

ID=43226449

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099114699A TW201104781A (en) 2009-05-29 2010-05-07 Apparatus for containing packaged chip, test tray including the same, and test handler using the same

Country Status (3)

Country Link
KR (1) KR101039858B1 (ko)
CN (1) CN101900747B (ko)
TW (1) TW201104781A (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101273550B1 (ko) * 2012-01-31 2013-06-17 에스티에스반도체통신 주식회사 전기적 검사를 위한 공용 소켓
KR101397314B1 (ko) * 2013-02-27 2014-05-23 세메스 주식회사 반도체 소자 홀더 유닛 및 이를 포함하는 테스트 장치
KR102254494B1 (ko) * 2015-04-30 2021-05-24 (주)테크윙 반도체소자 테스트용 핸들러
CN106180004B (zh) * 2016-08-08 2022-10-28 深圳市华力宇电子科技有限公司 指纹分选机的控制系统及控制方法
CN107768268A (zh) * 2017-10-23 2018-03-06 南京矽邦半导体有限公司 一种芯片封装容纳装置
TWI679728B (zh) * 2018-12-06 2019-12-11 力成科技股份有限公司 調整移動晶片設備的方法及該移動晶片設備
CN114690024B (zh) * 2022-05-31 2022-08-26 广东东博自动化设备有限公司 一种全自动芯片测试机

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100707241B1 (ko) * 2005-05-23 2007-04-13 (주)티에스이 반도체 패키지 수납용 인서트
KR100704467B1 (ko) 2006-02-28 2007-04-09 (주)티에스이 반도체 패키지 수납용 인서트
KR100855203B1 (ko) * 2007-01-23 2008-09-01 미래산업 주식회사 테스트 트레이 및 그를 이용한 테스트 핸들러 장비
KR100857911B1 (ko) * 2007-02-01 2008-09-10 미래산업 주식회사 반도체 소자 테스트 핸들러용 소팅장치 및 소팅방법
KR100873188B1 (ko) * 2007-05-18 2008-12-10 미래산업 주식회사 테스트 트레이 이송장치, 그를 구비한 테스트 핸들러, 및그를 이용한 반도체 소자 제조방법
KR100865910B1 (ko) * 2007-07-30 2008-11-10 미래산업 주식회사 핸들러 및 그를 이용한 반도체 소자 제조방법

Also Published As

Publication number Publication date
KR101039858B1 (ko) 2011-06-09
CN101900747A (zh) 2010-12-01
CN101900747B (zh) 2014-10-08
KR20100128687A (ko) 2010-12-08

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