201103684 六、發明說明： 【發明所屬之技術領域】 本發明係關於以雷射照射割斷玻璃基板或陶瓷基板等 脆性材料基板之方法。 【先前技術】 以往’做為玻璃基板或陶瓷基板等脆性材料基板之割 斷方法，係廣泛使用使刀輪等壓接於脆性材料基板之表面 並同時轉動，形成對脆性材料基板之表面大致垂直方向之 裂痕（以下稱為「垂直裂痕」），之後，對基板施加機械性之 按壓力，使垂直裂痕往基板厚度方向進展以割斷基板之方 法。 然而，通常在使用刀輪形成脆性材料基板之垂直裂痕 之穷s 會產生被稱為玻璃屑（cul let)之小破片，可能因此 玻璃屑而於脆性材料基板之表面產生傷痕。此外，於割斷 後之脆性材料基板之端部容易產生微裂痕（micr〇以扣”，可 能以此微裂痕為起因而產生脆性材料基板之斷裂。因此， 通常係在割斷後研磨、洗淨脆性材料基板之端部以去除微 裂痕或玻璃屑等。 方面近年來，使用二氧化碳雷射以熔融溫度未 滿之/m度加熱脆性材料基板，據此藉由於脆性材料基板產 生之熱應力使拉伸應力局部性產生以形成垂直裂痕之方法 已有各種檢討、開發。由於此使用雷射光束之割斷方法係 非接觸加卫’故可抑制上述之玻璃屑或微裂痕等潛在性缺 201103684 陷之產生。但由於在此使用雷射光束之割斷方法中垂直裂 痕亦未達基板之厚度方向之全體而通常僅止於表面部，故 仍須施加外力使垂直裂痕往基板厚度方向進展。因此，垂 直裂痕之端面被彼此按壓’仍有產生微裂痕或玻璃屑之虞。 針對此問題，例如在專利文獻1有提案藉由於玻璃基 板之側面形成初期龜裂，先以線狀加熱器加熱割斷預定 線，以空氣喷嘴等冷卻機構部分冷卻進展之龜裂之前端周 邊’以使龜裂更加進展之技術。 此外，在專利文獻2有提案對至少2點同時照射雷射 光束形成初期龜裂後，#由使雷射光束沿割斷預定線移動 以使初期4裂於割斷預定線之方向進展之割斷脆性 板之方法 專利文獻1 :曰本特開2000_281375號公報 專利文獻2 :曰本特開平7-328781號公報 【發明内容】 [發明欲解決之課題] 然而’在專利文獻1之提幸 # 杈累技術中，因於玻璃基板之 面形成初期龜裂，故於割斷# 寂& ^ A j斲預疋線之方向（從基板側面觀 外叙併 又（/衣度）之初期龜裂有困難。此 實質上需要在於分離宝丨j斷而夕士丄 姐邮μ 謂面之方向對割斷預定線之終 〜施加力之狀態下固定支捭 位 寺之機構或使檢出進展之龜裂 位置之感測器移動之機構等， P , 故。彳斷作業準備作業繁雜且 屐置會大型化。另外，由於 ' 乂割斷預定線配置之加熱器 4 201103684 線加熱割斷預定線全線，故電力消耗量比部分加熱之場合 多。 此外在專利文獻2之提案技術中，需要複數雷射振 盪器，且以光軸變更手段為必要，有裝置複雜化、大型化 之虞。此外，在以複數之雷射光束照射形成初期龜裂之場 合，雷射輸出或照射位置等之調整十分困冑，有初期龜裂 之形成位置之精度無法提升之虞。 本發明係鑑於此種以往之問題而為，其目的在於提供 不招致裝置之大型化、複雜化便將微裂痕或玻璃屑等之產 生抑制至最小限度同時割斷脆性材料基板之方法。 此外，本發明之目的在於提供割斷被貼合之積層基板 之方之基板且可簡單分離、除去被割斷之基板部分之 法。 ，達成前述目的之第1發明之脆性材料基板之割斷方法 係—種脆性材料基板之割齡 ^ J斷方法，藉由照射雷射光束來割 斷脆性材料基板，其特微太你目士. 、在於八有.於前述基板之一面之 割斷預定線之割斷開始踹 义、刀具形成初期龜裂之步驟；按 聖前述基板之形成有前述初 、+.、 例朋龜裂之面之相反側面之與前 述初期龜裂對向之部分 # 麻+ 使剛述初期龜裂往前述基板之厚 度方向進展而形成到達前述 ^ . _ 迓引述相反側面之初期貫通龜裂之步 鄉，從前述初期貫诵H gj、又‘丄 對蒋蘇*门， 刚述割斷預定線使雷射光束相 對移動並同時照射，以烷 柄L ^ 熔毗，肌度未滿之溫度加熱前述基 板’據此藉由於基板產生 …、應力使初期貫通龜裂沿前述 5 201103684 割斷預定線進展之步驟。 達成前述目的之第2發明之脆性材料基板之割斷方法 係一種脆性材料基板之割斷方法，藉由照射雷射光束來割 斷脆性材料基板’其特徵在於具有：於前述基板之—面之 割斷預定線之割斷開始端以刀具形成初期龜裂之步驟；從 前述初期龜裂沿前述割斷預定線使雷射光束相對移動並同 時照射，以熔融溫度未滿之溫度加熱前述基板，據此藉由 於基板產生之熱應力使初期龜裂沿前述割斷預定線進展以 形成初期進展龜裂之步驟；按壓前述基板之形成有前述初 展龜裂之面之相反側面之與前述初期進展龜裂對向之 部分’使前述初期進展龜裂往前述基板之厚度方向進展而 形成到達前述相反側面之初期貫通龜裂之步驟；從前述初 期進展龜裂沿前述割斷預定線使雷射光束相對移動並同時 =射’以㈣溫度未滿之溫度加熱前述基板，據此藉由於 土板產生之熱應力使初期進展龜裂沿前述割斷預定線進展 /達成前述目的之第3發明之脆性材料基板之割斷方沒 材料基板之割斷方法’將2片脆性材料基㈣ 板中方之脆性材料基板加以割斷，其特徵名 、、.於第1脆性材料基板之割斷預定線 以刀具形成初期龜裂之步_開始知 前述初期龜裂對向之部Γ使=第/:性材料基板之與 料基板之厚度方向進龜録第1脆性材 反側面之、^ 成料第1錄㈣基板之相 期貫通龜裂之步驟；從前述初期貫通龜裂沿前 6 201103684 述割斷預定線使雷射光束相對移動並同時照射，以溶融溫 度未滿之溫度加熱第1脆性材料基板，據此藉由於第丨脆 性材料基板產生之熱應力使初期貫通龜裂沿前述割斷預定 線進展之步驟。 達成前述目的之第4發明之脆性材料基板之割斷方法 係一種脆性材料基板之割斷方法，將2片脆性材料基板貼 合之積層基板中一方之脆性材料基板加以割斷，其特徵在 於具有：於第1脆性材料基板之割斷預定線之割斷開始端 以刀具形成初期龜裂之步驟；從前述初期龜裂沿前述割斷 預定線使雷射光束相對移動並同時照射’以熔融溫度i滿 之溫度加熱第1脆性材料基板，據此藉由於第丨脆性材料 基板產生之熱應力使初期龜裂沿前述割斷預定線進展以形 成初期進展龜裂之步驟；按壓第2脆性材料基板之與前述 初期龜裂對向之部分，使前述初期龜裂往帛i脆性材料基 板之厚度方向進展而形成到達第丨脆性材料基板之相反側 面之初期貫通龜裂之步驟；從前述初期貫通龜裂沿前述割 斷預定線使雷射光束相對移動並同時照射，以熔融溫度未 滿之溫度加熱第！脆性材料基板，據此藉由於帛i脆性材 枓基板產生之錢力使初期貫通“沿前述㈣預定線進 展之步驟。 [發明之效果] 在本發明之脆性材料基板之割斷古、土士 aa . ^ 斲方法中，由於係使初 龜裂為往基板厚度方向貫通之龜穸 M ^ 跑教，使此初期貫通龜裂 稭由雷射光束之照射而沿割斷預定綠.& s 只又線進展，故不招致裝置 201103684 之大型化、複雜化便可將微裂痕或玻璃屑等之產生抑制至 最小限度。 此外，在將2片脆性材料基板貼合之積層基板中一方 之脆性材料基板加以割斷之本發明之方法中，除上述效果 外，還因在形成初期貫通龜裂之際按壓第2脆性材料基板 之與前述初期龜裂對向之部分而第丨脆性材料基板及第2 脆性材料基板·弯曲’初期貫通龜裂之端面間之貼合、第i 脆性材料基板之端部之割斷除去部分與第2脆性材料基板 間之貼合容易消除。 另外’利用使以刀具形成之初期龜裂為小部分以照 射雷射光束使該初期龜裂進展至既定長度之方法，可進= 步抑制微裂痕或玻璃屑等之產生。 【實施方式】 以下雖針對本發明之脆性材料基板之割斷方法更詳細 說明，但本發明並不限於此等實施型態。 ――於圖/顯示顯示本發明之脆性材料基板之割斷方法之 :貫施型態之步驟圖。圖！係以割斷預定線u割斷做為脆 性材料基板之玻璃基板1之場人 嘴α之步驟圖。如同圖（a)所示， 先於玻璃基板1之表面1〇 、 斲開始鈿As以刀輪2形成 初期龜裂3 1。此初期龜裂3 1之4 J# n , re Λ 之長度及冰度雖無特別限定， 但通常初期龜裂31之長度為1〜之範圍較理想，更理 想為數_之範圍。此外，初期龜裂31之深度為基板厚度 之10%以上較理想。 8 201103684 其次’如同圖（b)所示，以折斷滾輪4將玻璃基板1之 背面1 〇b之對向於初期龜裂3 1之部分往表面1 〇a之方向按 壓。藉此’初期龜裂31往玻璃基板1之厚度方向進展，成 為到達背面l〇b之初期貫通龜裂32。 其次’如同圖（c)所示’從玻璃基板1之初期貫通龜裂 32沿割斷預定線Π照射橢圓形狀之雷射光束5 1，並從冷 卻喷嘴60對雷射光束5 1照射區域之後端附近喷霧做為冷 卻媒體之冷卻水61。 藉由對玻璃基板1照射雷射光束51，玻璃基板丨於厚 度方向被以熔融溫度未滿之溫度加熱’玻璃基板1雖欲熱 膨服’但因局部加熱而無法膨脹，產生將照射點往中心壓 縮之應力。之後，藉由在加熱後立即對玻璃基板1之表面 喷霧冷卻水61而被冷卻，此時產生拉伸應力。藉由此拉伸 應力之作用，以初期貫通龜裂32為開始點，涵蓋玻璃基板 1之厚度方向全體之龜裂進展。之後，藉由使雷射光束51 沿割斷預定線11移動，涵蓋玻璃基板1之厚度方向全體之 龜裂33沿雷射光束51之移動方向連續進展，玻璃基板i 被以割斷預定線11割斷。另外，在此實施形態中雖係固定 玻璃基板1並使雷射光束51移動，但使玻璃基板丨移動並 固定雷射光束51或使玻璃基板1及雷射光束51雙方移動 亦無妨。此外，即使不喷霧冷卻水61而以自然空冷雖亦可 使以初期貫通龜裂3 2為起點之龜裂3 3進展，但喷霧冷卻 水61強制冷卻之作法龜裂33迅速且確實進展，故較理想。 在此使用之雷射光束5 1並無特別限定，由玻璃基板j 201103684 之材質或厚度等適當決定即可。脆性材料基板為玻璃基板 之場合，由於在玻璃基板表面之吸收較大故波長9〜n"m 之雷射光束較理想。此種雷射光束可舉出二氧化碳雷射。 雷射光束5 1之對玻璃基板1之照射形狀係於雷射光束之相 對移動方向較長之橢圓形狀較理想，長徑為1〇〜6〇mm之範 圍，短輕為1〜5 mm之範圍較理想。 做為使從冷卻喷嘴60噴出之水，蒸餾水較理想。但在 割斷後之玻璃基板1不會產生不良影響之範圍，於水添加 介面活性劑等添加劑亦無妨。冷卻水量通常為 之範圍。卩水進行之玻璃基板丨之冷卻，從急冷以雷射光 束51加熱之玻璃基板丨之觀點，使水與氣體（通常為空氣） 一起喷射之所謂水注（water jet)方式較理想。以冷卻水冷卻 之區域為直徑1〜5mm程度之圓形狀或橢圓形狀較理想。此 外，冷郃區域為以雷射光束5丨之加熱區域之相對移動方向 後方，形成於加熱區域之後端附近較理想。 雷射光束51之相對移動速度雖由雷射光束輸出值或照 射面積、脆性材料基板5〇之厚度等適當決定即可，但通常 為1〜數百mm/sec之範圍較理想。 本發明之割斷方法可用於玻璃基板或陶瓷基板、單結 晶石夕基板、藍寶石基板等以往公知之脆性材料基板之割 斷，適合使用於例如液晶顯示器等面板製造領域。 在以上說明之割斷方法由於係以於玻璃基板1之端部 少量形成之初期貫通龜裂32為起點藉由照射雷射光束使龜 裂33進展，故可有效抑制玻璃屑或微裂痕等之產生。另外， 10 201103684 在進一步抑制玻璃屑或微裂痕等之產生之場合，建議縮短 以刀輪2形成之龜裂，以照射雷射光束形成做為初期龜裂 必要之剩餘長度。於圖2顯示此種初期龜裂之形成方法。 於圖2(叫中，以刀輪2於玻璃基板i之表面-之割 斷開始端As形成龜裂31a。此龜裂3U只要是藉由雷射照 射龜裂會進展之長度即可，例如可為點裂痕(數十"爪卜藉 此：可將因刀㉟2之使用而產生之微裂痕或破璃屑等抑； 至最小限度。 其次，如同圖（a-2)所示，從龜裂3U沿割斷預定線i i 照射雷射光束51並從冷卻噴嘴6〇對雷射光束5i照射區域 之後端附近喷霧做為冷卻媒體之冷卻水61，使龜裂ha沿 割斷預^線11進展’成為既定長度之初期龜裂3卜由於此 龜裂31a之進展係以與玻璃基板丨非接觸之方式進行故微 裂痕或玻璃屑等不會產生。從於同圖⑻顯示之形成初期貫 通龜裂32之步驟往後之步驟與於圖1顯示之割斷方法相 同’故在此省略說•明。另外，照射雷射光束導致之龜裂3la 之進展機構與前述之以初期貫通龜裂32為起點之龜裂Μ 之進展機構相同。 其人針對將2片脆性材料基板貼合之積層基板中一 方之脆性材料基板加以割斷之方法說明。於圖3顯示將玻 璃基板（第1脆性材料基板）7與玻璃基板（第2脆性材料基 板）8以密封劑s貼合之積層基板ρ之玻璃基板7之一部分 d斷之方法之步驟圖。如同圖⑷所示先於玻璃基板7之 表面端部使刀♦ 2壓接同時轉動以形成初期龜裂3!。此初 201103684 期龜裂31之長疮 其^ 及深度與前述實施型態相同。 北m 。同圖（b)所示，以折斷滾輪4將玻璃基板8之 背面側之對u 、初期龜裂3 1之部分往玻璃基板7之方向按 壓。藉此，積屉其> η ^ . _ 板Ρ彎曲為向上凸，初期龜裂31往玻璃 基板7之厚户大 . ^ 肉王體進展，成為初期貫通龜裂32。同時， 初期貫通龜裂32夕山 <知面間之貼合、玻璃基板7之端部之割BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of cutting a substrate of a brittle material such as a glass substrate or a ceramic substrate by laser irradiation. [Prior Art] Conventionally, as a method of cutting a brittle material substrate such as a glass substrate or a ceramic substrate, a cutter wheel or the like is pressed and bonded to the surface of the brittle material substrate and simultaneously rotated to form a substantially vertical direction on the surface of the brittle material substrate. The crack (hereinafter referred to as "vertical crack"), and then a mechanical pressing force is applied to the substrate to cause the vertical crack to progress in the thickness direction of the substrate to cut the substrate. However, in general, the use of a cutter wheel to form a vertical crack of a brittle material substrate produces a small fragment called a cul let, which may cause scratches on the surface of the brittle material substrate. In addition, microcracks are likely to occur at the end of the brittle material substrate after cutting, which may cause cracking of the brittle material substrate due to the micro cracks. Therefore, it is usually ground and washed after cutting. The end of the material substrate is used to remove micro-cracks or glass swarf, etc. In recent years, a brittle material substrate is heated by a carbon dioxide laser at a melting temperature of less than /m, thereby stretching by a thermal stress generated by a brittle material substrate. Various methods of stress locality to form vertical cracks have been reviewed and developed. Since the laser beam cutting method is non-contact curing, it can suppress the potential shortage of the above-mentioned glass chips or micro-cracks. However, since the vertical crack in the cutting method using the laser beam does not reach the entire thickness direction of the substrate and generally only terminates at the surface portion, an external force must be applied to advance the vertical crack toward the thickness of the substrate. Therefore, the vertical crack The end faces are pressed against each other 'there are still micro-cracks or glass swarf. For this problem, for example, Patent Document 1 has In the proposal, the initial crack is formed on the side surface of the glass substrate, and the predetermined line is heated by the linear heater, and the cooling mechanism is partially cooled by a cooling mechanism such as an air nozzle to further advance the crack. Patent Document 2 proposes a method of cutting a brittle plate by causing at least two points to simultaneously irradiate a laser beam to form an initial crack, and #cutting a brittle plate by moving the laser beam along a planned cutting line to advance the initial stage 4 in a direction in which the predetermined line is cut. Patent Document 1: JP-A-2000-281375 (Patent Document 2) Japanese Patent Application Laid-Open No. Hei No. Hei 7-328781 (Draft of the Invention) [Problems to be Solved by the Invention] However, in the technique of the patent document 1, Since the initial crack is formed on the surface of the glass substrate, it is difficult to cut the direction of the #静静& ^ A j斲 pre-twisting line (the crack in the initial stage of the substrate side view and/or the degree of clothing). The need is to separate the treasure 丨 j and the sorcerer sister 邮 谓 谓 谓 谓 谓 谓 谓 谓 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 The mechanism for moving the machine, etc., P. Therefore, the preparation work for the cutting operation is complicated and the installation is large. In addition, since the heater 4 201103684 line of the cut-off line is configured to heat-cut the entire line, the power consumption ratio is partially In addition, in the technique of the patent document 2, a plurality of laser oscillators are required, and an optical axis changing means is necessary, and the apparatus is complicated and large-sized. In addition, a plurality of laser beams are used. In the case where the initial crack is formed by irradiation, the adjustment of the laser output or the irradiation position is extremely difficult, and the accuracy of the formation position of the initial crack cannot be improved. The present invention is directed to such a conventional problem, and the object thereof is There is provided a method of cutting off a brittle material substrate while minimizing the complexity and complication of the device, thereby suppressing the occurrence of microcracks or glass swarf. Further, an object of the present invention is to provide a method of cutting a substrate on which a laminated substrate to be bonded is cut and which can easily separate and remove a portion of the substrate to be cut. The method for cutting a brittle material substrate according to the first aspect of the present invention is a method for cutting a brittle material substrate, and cutting a brittle material substrate by irradiating a laser beam, which is particularly fascinating to you. In the case of the cutting of the predetermined line of the substrate, the cutting of the predetermined line begins, and the step of forming the initial crack of the tool; according to the formation of the substrate, the opposite side of the surface of the initial, +. The part opposite to the initial crack is #麻+, and the initial crack is progressed in the thickness direction of the substrate, and the step of reaching the crack in the initial direction of the opposite side of the above-mentioned ^. _ , is described. H gj, and '丄 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋 蒋Produce ..., stress to make the initial through cracks along the above-mentioned 5 201103684 cut-off line progress. A method for cutting a brittle material substrate according to a second aspect of the present invention is a method for cutting a brittle material substrate, wherein the brittle material substrate is cut by irradiating a laser beam, characterized in that: the planned cutting line of the substrate is cut off a step of forming an initial crack by a cutter at the cutting start end; the laser beam is relatively moved and simultaneously irradiated from the initial crack along the predetermined cutting line, and the substrate is heated at a temperature at which the melting temperature is not full, thereby being generated by the substrate The thermal stress causes the initial crack to progress along the predetermined cutting line to form an initial progress crack; pressing the opposite side of the substrate on which the surface of the initial crack is formed and the portion of the initial progress crack opposite And causing the initial progress crack to progress in the thickness direction of the substrate to form an initial through crack in the opposite side surface; and the laser beam is relatively moved from the initial progress crack along the predetermined cutting line and simultaneously (4) heating the substrate after the temperature is not full, whereby the thermal stress generated by the soil plate is used Progressive cracking progresses along the predetermined cutting line/cutting method of the cutting material of the brittle material substrate of the third invention which achieves the above-mentioned object, 'cutting the brittle material substrate in the middle of two brittle material-based (four) plates, the characteristic name , the step of forming the initial crack in the cutting line of the first brittle material substrate, and the step of forming the initial crack in the initial cracking direction = the /: material substrate and the thickness direction of the substrate Recording the first side of the first brittle material, the first step (4) of the phase of the substrate through the crack; from the initial through the crack along the front 6 201103684 cutting line to make the laser beam relatively moving and simultaneously irradiated, The first brittle material substrate is heated at a temperature at which the melting temperature is not full, whereby the initial through crack is advanced along the predetermined cutting line by the thermal stress generated by the second brittle material substrate. The method for cutting a brittle material substrate according to the fourth aspect of the present invention is a method for cutting a brittle material substrate, wherein one of the laminated substrates bonded to the two brittle material substrates is cut, and the method is characterized in that: (1) a step of forming an initial crack by a cutter at a cutting start end of the cutting line of the brittle material substrate; and the laser beam is relatively moved from the initial crack along the predetermined cutting line and simultaneously irradiated with a temperature at which the melting temperature i is full. a brittle material substrate, whereby the initial crack propagates along the predetermined cut line to form an initial progress crack due to thermal stress generated by the second brittle material substrate; and the second brittle material substrate is pressed against the initial crack pair In the part, the initial crack is advanced in the thickness direction of the substrate of the brittle material to form an initial through crack in the opposite side surface of the crucible material substrate; and the initial through crack is along the predetermined cut line. The laser beam is relatively moved and simultaneously illuminated, and heated at a temperature below the melting temperature! The brittle material substrate is thus subjected to the step of "progressing along the predetermined line of (4) above) by the force generated by the 帛i brittle material 枓 substrate. [Effects of the Invention] The slab of the brittle material of the present invention is cut off, Tusi aa ^ In the 斲 method, the initial crack is made into the turtle's M ^ running through to the thickness of the substrate, so that the initial through cracked straw is irradiated by the laser beam and the green is cut along the predetermined green. & s only Since the line progresses, the occurrence of micro-cracks or glass swarf can be minimized without increasing the size and complexity of the device 201103684. Further, one of the laminated substrates in which the two brittle material substrates are bonded is one of the brittle material substrates. In addition to the above effects, in the method of the present invention, the second brittle material substrate is pressed against the initial crack, and the second brittle material substrate and the second brittleness are pressed in the initial stage of formation of the crack. The bonding between the end faces of the material substrate and the curved portion and the end portion of the crack, and the bonding between the cut portion of the end portion of the i-th brittle material substrate and the second brittle material substrate are easily eliminated. 'Using the method of irradiating the laser beam with a small portion of the initial crack formed by the cutter to advance the initial crack to a predetermined length, it is possible to suppress the occurrence of microcracks or glass swarf. The method for cutting the brittle material substrate of the present invention is described in more detail, but the present invention is not limited to these embodiments. - The figure shows the cutting method of the brittle material substrate of the present invention: the step of the conformation type Fig. Fig. is a step diagram of cutting the human mouth α of the glass substrate 1 as a substrate of a brittle material by cutting the predetermined line u. As shown in Fig. (a), starting from the surface of the glass substrate 1, 斲, 斲As is formed by the cutter wheel 2 as the initial crack 31. The length of the initial crack 3 1 4 J# n , re Λ is not particularly limited, but the initial crack 31 is usually in the range of 1 to 1. Further, it is more preferably in the range of _. Further, the depth of the initial crack 31 is preferably 10% or more of the thickness of the substrate. 8 201103684 Next, as shown in the figure (b), the back surface of the glass substrate 1 is 以 by the breaking roller 4 b is opposite to the initial crack 3 1 The part is pressed in the direction of the surface 1 〇a. The initial crack 31 progresses in the thickness direction of the glass substrate 1, and the crack 32 is formed at the initial stage of the back surface l〇b. Next, 'as shown in the figure (c) The initial through-crack 32 of the glass substrate 1 illuminates the elliptical laser beam 51 along the predetermined line of cut, and sprays the cooling water 61 as a cooling medium near the end of the region where the laser beam 5 is irradiated from the cooling nozzle 60. By irradiating the glass substrate 1 with the laser beam 51, the glass substrate is heated in a thickness direction at a temperature less than the melting temperature. The glass substrate 1 is intended to be thermally expanded, but cannot be inflated due to local heating, and an irradiation point is generated. The stress is compressed toward the center. Thereafter, the surface of the glass substrate 1 is sprayed with cooling water 61 immediately after heating to be cooled, and tensile stress is generated at this time. By the action of the tensile stress, the initial penetration crack 32 is used as a starting point, and the crack progress of the entire thickness direction of the glass substrate 1 is covered. Thereafter, by moving the laser beam 51 along the planned cutting line 11, the crack 33 covering the entire thickness direction of the glass substrate 1 continuously progresses in the moving direction of the laser beam 51, and the glass substrate i is cut by the planned cutting line 11. Further, in this embodiment, the glass substrate 1 is fixed and the laser beam 51 is moved. However, it is also possible to move the glass substrate 并 to fix the laser beam 51 or to move both the glass substrate 1 and the laser beam 51. In addition, even if the cooling water 61 is not sprayed, the cracks 3 3 starting from the initial penetration crack 3 2 can be progressed by natural air cooling, but the spray cooling water 61 is forced to cool, and the crack 33 is rapidly and surely progresses. Therefore, it is ideal. The laser beam 5 1 used here is not particularly limited, and may be appropriately determined by the material or thickness of the glass substrate j 201103684. When the brittle material substrate is a glass substrate, the laser beam having a wavelength of 9 to n " m is preferable because the absorption on the surface of the glass substrate is large. Such a laser beam can be a carbon dioxide laser. The illumination shape of the laser beam 5 to the glass substrate 1 is preferably an elliptical shape in which the relative movement direction of the laser beam is long, and the long diameter is in the range of 1 〇 6 6 mm, and the short light is 1 to 5 mm. The range is ideal. As the water sprayed from the cooling nozzle 60, distilled water is preferred. However, the glass substrate 1 after the cutting does not have an adverse effect, and an additive such as an surfactant may be added to the water. The amount of cooling water is usually in the range. The cooling of the glass substrate by the hydrophobic water is preferably a so-called water jet method in which water is sprayed together with a gas (usually air) from the viewpoint of quenching the glass substrate heated by the laser beam 51. The area cooled by the cooling water is preferably a circular shape or an elliptical shape having a diameter of about 1 to 5 mm. Further, the cold heading area is rearward in the relative moving direction of the heating region of the laser beam 5, and is preferably formed near the rear end of the heating region. The relative moving speed of the laser beam 51 is appropriately determined by the laser beam output value, the irradiation area, the thickness of the brittle material substrate 5, and the like, but is preferably in the range of 1 to several hundreds of mm/sec. The cutting method of the present invention can be applied to the cutting of a conventionally known brittle material substrate such as a glass substrate, a ceramic substrate, a single-crystallized substrate or a sapphire substrate, and is suitably used in the field of panel manufacturing such as liquid crystal displays. In the cutting method described above, since the cracks 33 are progressed by irradiating the laser beam with the initial through crack 32 formed at a small amount at the end portion of the glass substrate 1, the occurrence of glass swarf, microcracks, and the like can be effectively suppressed. . Further, in the case of further suppressing the occurrence of glass swarf or microcracks or the like, it is recommended to shorten the crack formed by the cutter wheel 2 to irradiate the laser beam to form the remaining length necessary for the initial crack. A method of forming such an initial crack is shown in FIG. In Fig. 2, the crack 31a is formed by the cutting start end As of the surface of the glass substrate i by the cutter wheel 2. The crack 3U may be a length that progresses by laser irradiation, for example, For the point of cracks (tens of " claws by this: can be caused by the use of the knife 352 micro-cracks or broken glass; etc.; to a minimum. Second, as shown in Figure (a-2), from the turtle The split 3U illuminates the laser beam 51 along the cut line ii and sprays the cooling water 61 as a cooling medium from the end of the cooling nozzle 6 照射 to the area irradiated with the laser beam 5i, so that the crack ha progresses along the cut line 11 'Being the initial crack of the predetermined length 3, since the progress of the crack 31a is not in contact with the glass substrate, microcracks, glass swarf, etc. do not occur. From the initial formation of the same figure (8), the turtle is penetrated. The step of splitting 32 is the same as the cutting method shown in Fig. 1. Therefore, the explanation is omitted here. In addition, the progress mechanism of the crack 3La caused by the irradiation of the laser beam and the initial through crack 32 are The starting point of the crack is the same as the progress of the body. A method of cutting one of the brittle material substrates in the laminated substrate to which the material substrate is bonded is described. The glass substrate (first brittle material substrate) 7 and the glass substrate (second brittle material substrate) 8 are attached as a sealant s in FIG. 3 . A step of a method of breaking a portion of the glass substrate 7 of the laminated substrate ρ. As shown in Fig. 4, the blade ♦ 2 is pressed and rotated simultaneously to form an initial crack 3 before the surface end of the glass substrate 7. At the beginning of 201103684, the crack and the depth of the crack 31 are the same as those in the previous embodiment. The north m. As shown in the figure (b), the back side of the glass substrate 8 is reversed by the roller 4, and the initial crack 3 Part 1 is pressed in the direction of the glass substrate 7. Thereby, the drawer is > η ^ . _ The plate is bent upward, and the initial crack 31 is thicker toward the glass substrate 7. ^ The meat king progresses and becomes In the initial stage, the crack 32 is penetrated. At the same time, the initial penetration of the crack 32, the mountain, the bonding between the surfaces, and the cutting of the end portion of the glass substrate 7.
斷除去部分71 I 兴坡璃基板8間之貼合被消除，玻璃基板7 之端部之割斷除去八^ 示专。ρ分7 1之分離可容易進行。 甘-欠 如同圖（c)所示’從玻璃基板7之初期貫通龜裂 3 2沿割斷預定始，， 頂疋線1 1照射橢圓形狀之雷射光束5 1，並從冷 卻喷嘴60對雷& #古ci 由射九束51照射區域之後端附近喷霧做為冷 卻媒體之冷;§卩火Λ,、，、 Ρ水61 ’以初期貫通龜裂32為開始點，使涵蓋 玻璃基板7 $ /1 rft： >- j_ 疋厚度方向全體之龜裂33進展。藉由使雷射光 。'^斷預定線11移動，涵蓋玻璃基板7之厚度方向 王體之龜裂33沿雷射光束51之移動方向連續進展，玻璃 基板被以割斷預定線11割斷。之後’如同圖⑷所示，割 斷除去部分71被從積層基板ρ分離、除去。另外，在此實 包形〜、中雖係固定積層基板p並使雷射光束5 1移動，但使 積層基板P移動並@定雷射光束51或使積層基板ρ及雷射 光束5 1雙方移動亦無妨。此外，即使不喷霧冷卻水6丄而 以自然空冷雖亦可使以初期貫通龜裂32為起點之龜裂33 進展但噴霧冷卻水61強制冷卻之作法龜裂33迅速且確 實進展，故較理想。 此外，與前述實施型態同樣地，從進一步抑制由刀輪2 12 201103684 ，縮短以刀輪2形 期龜裂必要之剩餘 導致之玻璃屑或微裂痕等之產生之觀點 成之龜裂，以照射雷射光束形成做為初 長度亦無妨。 此種積層基板之割斷方法 L A J週用例如在液晶顯示面板 之貼口 2片玻璃基板且於其中_ .. 方之玻璃基板之内側面形 成有端子電極之場合，切斷除. 覆蓋该端子電極之部分使 該端子電極露出之場合。 [產業上之可利用性] 本發明之脆性材料基板之割斷方法由於係使以刀具形 成之初期龜裂成為於基板厚度方向貫通之龜裂，以雷射光 束之照射使此初期貫通龜裂沿割斷預定線進展，故不招致 裝置之大型化、複雜化便可將微裂痕或玻璃屑等之產生抑 制至最小限度，甚為有用。 此外，將2片脆性材料基板貼合之積層基板中一方之 脆性材料基板加以割斷之本發明之方法除上述效果外，還 因在形成初期貫通龜裂之際按㈣2脆性材料基板之與前 述初期龜裂對向之部分而初期貫通龜裂之端面間之貼合、 玻璃基板之端部之割斷除去部分與玻璃基板間之貼合被消 除玻璃基板之割斷除去部分之分離較容易，甚為有用。 【圖式簡單說明】 圖1係顯示本發明之脆性材料基板之割斷方法之一例 之步驟圖。 圖2係顯示初期龜裂之其他形成方法之步驟圖。 13 201103684 圖3係顯示本發明之積層基板之割斷方法之一例之步 驟圖。 【主要元件符號說明】 1 玻璃基板（脆性材料基板） 2 刀輪（刀） 4 折斷滾輪 7 玻璃基板（第1脆性材料基板） 8 玻璃基板（第2脆性材料基板） P 積層基板 11 割斷預定線 3 1 初期龜裂 32 初期貫通龜裂 33 龜裂 51 雷射光束 61 冷卻水 14The bonding of the portion of the glass substrate 7 is eliminated, and the cutting of the end portion of the glass substrate 7 is removed. The separation of ρ 7 1 can be easily performed. As shown in the figure (c), 'from the initial stage of the glass substrate 7, the crack 3 2 is cut along the predetermined cut, and the top turn line 1 1 illuminates the elliptical shaped laser beam 5 1 and the thunder from the cooling nozzle 60 &#古ci The spray near the rear end of the area irradiated by the nine beams 51 is used as a cooling medium for cold; § 卩火Λ,,,, Ρ水61' starts with the crack 32 as the starting point, so that the glass substrate is covered 7 $ /1 rft: >- j_ 龟The crack in the thickness direction is progressing 33. By making the laser light. The predetermined line 11 is moved to cover the thickness direction of the glass substrate 7. The crack 33 of the king body continuously progresses in the moving direction of the laser beam 51, and the glass substrate is cut by the cut predetermined line 11. Thereafter, as shown in Fig. 4, the cut-and-removed portion 71 is separated and removed from the laminated substrate ρ. In addition, although the laminated substrate p is fixed and the laser beam 51 is moved, the laminated substrate P is moved and the laser beam 51 is fixed or both the laminated substrate ρ and the laser beam 5 1 are moved. It doesn't matter if you move. In addition, even if the cooling water is not sprayed by 6 丄, natural cracking can be performed, and the crack 33 which is the starting point of the initial penetration crack 32 can be progressed, but the spray cooling water 61 is forced to cool, and the crack 33 is rapidly and surely progressed. ideal. Further, similarly to the above-described embodiment, it is possible to further suppress the occurrence of cracks caused by the occurrence of glass swarf, micro-cracks, and the like which are caused by the remaining of the cutter wheel 2-shaped crack by the cutter wheel 2 12 201103684, It is also possible to illuminate the laser beam as the initial length. For the method of cutting the laminated substrate, for example, when two terminal glass substrates are attached to the liquid crystal display panel and the terminal electrodes are formed on the inner side surface of the glass substrate, the terminal electrode is cut off. The portion where the terminal electrode is exposed. [Industrial Applicability] The method for cutting a brittle material substrate according to the present invention is such that the initial crack formed by the cutter is a crack that penetrates in the thickness direction of the substrate, and the initial cracking edge is caused by the irradiation of the laser beam. Since the cutting of the predetermined line progresses, it is useful to minimize the occurrence of micro-cracks or glass swarf, without incurring the enlargement and complication of the apparatus. Further, in addition to the above-described effects, the method of the present invention in which one of the laminated substrates to which two brittle material substrates are bonded is cut, and the (four) 2 brittle material substrate and the initial stage are formed at the initial stage of formation of the crack. The bonding between the end faces of the cracks in the initial direction of the crack, the bonding between the cut portions of the end portions of the glass substrate and the glass substrate is facilitated, and the separation of the cut portions of the glass substrate is eliminated, which is very useful. . BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flow chart showing an example of a cutting method of a brittle material substrate of the present invention. Fig. 2 is a view showing the steps of another method of forming the initial crack. 13 201103684 Fig. 3 is a step chart showing an example of a method of cutting a laminated substrate of the present invention. [Description of main component symbols] 1 Glass substrate (brittle material substrate) 2 Cutter wheel (knife) 4 Broken roller 7 Glass substrate (first brittle material substrate) 8 Glass substrate (second brittle material substrate) P Laminated substrate 11 Cut-off line 3 1 initial crack 32 initial through crack 33 crack 51 laser beam 61 cooling water 14