CN103831527B - A kind of laser quick separating optical crystal method and device - Google Patents
A kind of laser quick separating optical crystal method and device Download PDFInfo
- Publication number
- CN103831527B CN103831527B CN201410071645.4A CN201410071645A CN103831527B CN 103831527 B CN103831527 B CN 103831527B CN 201410071645 A CN201410071645 A CN 201410071645A CN 103831527 B CN103831527 B CN 103831527B
- Authority
- CN
- China
- Prior art keywords
- laser
- micro
- crack
- crystal
- optical crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention discloses a kind of laser quick separating optical crystal method, the method first utilizes ultrafast laser or microdiamond emery wheel to carry out detaching direction setting to optical crystal, forms the prefabricated micro-crack of a direction along path to be separated separating top; Recycling laser focusing carries out scanning heating to prefabricated micro-crack, forms induced with laser microcrack; The quick mobile laser focusing along path to be separated, until laser traverse speed is identical with rate of crack propagation, laser focusing is made to followed by microcrack all the time foremost, and make microcrack two layers of material generation thermal expansion effects, forward direction extruding and side direction tension is produced at microcrack tip, crystalline material is pulled open, finally realizes crystal high-quality and be separated.Device comprises the prefabricated mechanism of micro-crack, single focal argon laser system of processing and two-dimentional work bench.The present invention can improve speed, precision, processing safety and the quality that optical crystal is separated, to realize the lossless separation of optical crystal and accurate polishing level fineness release surface.
Description
Technical field
The invention belongs to laser processing application technical field, relate to a kind of method and relevant apparatus of laser quick separating optical crystal.The present invention can utilize laser fast and be separated processing transparent material in high quality, especially can be separated the optical crystals such as potassium dihydrogen phosphate (KDP) safely, fast with in high quality.
Background technology
KDP type crystal is the important multi-functional crystalline material of a class, and during the Second World War, KDP is used to manufacture the equipment such as PZT (piezoelectric transducer) and sonar and become military supplies.After the sixties in 20th century, laser technology occurred, this kind of crystalline material owing to having higher nonlinear optical coefficients, wide transmission region and excellent electric light, frequency inverted performance is widely used in photoelectron technical field.The particularly prospect on the important technical such as controlled thermonuclear reaction, simulation nuclear blast along with the rise of inertial confinement fusion (ICF) technology and ICF in recent years, makes to enter again new stage to the research of KDP type crystal.Although because various novel nonlinear optical crystal continues to bring out, make a general survey of the performance that it is comprehensive, especially required super, what up to the present can be used for ICF system also only only has KDP type crystal.In view of the strategic importance of this kind of crystal, its large scale of western developed country embargo, high-quality KDP optical crystal material and relevant process technology, cause this material very well sold and in short supply in the international market.KDP crystal needed for acquisition, it is the task of top priority that China develops the work of nuclear power generation unit voluntarily, along with the development of nuclear energy power generation industry, the demand of this kind of crystal, by increasing, developed the KDP crystal pro cessing technology with independent intellectual property right and will be brought huge economic and social benefit.
Current China has technically obtained larger breakthrough at large scale KDP growth technique, but in the processing of KDP crystal base substrate cutting and separating, remains a larger bottleneck problem.Domestic KDP crystal-cut mainly adopts mechanical means---and oil cooling saw blade cuts.Because KDP type crystal requires harsh to growth technique and growing environment, the cycle of growing large-size crystal is very long, yield rate is extremely low, and there is typical macroscopic symmetry, micro fracture mechanism and film symmetry, the physical property of crystal is made to show as significant anisotropy, the coefficient of elasticity of different directions, thermal coefficient of expansion, tensile strength, compression strength and fracture toughness etc. are all inconsistent, and the periodicity of crystals lattice arrangement makes optical crystal mostly show soft, the high fragility of pledge and easy cleavage simultaneously.These factors can cause occurring collapsing limit, micro-crack and cracked phenomenon in traditional machining cutting process, cause the machine cuts success rate of crystal extremely low, say nothing of high-precision separation, and therefore this crystalloid is acknowledged as one of most difficult-to-machine material in the world.In addition, impurity in optical crystal growth course and dislocation can make crystals occur brilliant bag or defect, its internal stress produced and strain very easily make crystal ftracture, cause affecting by mechanical stress, vibrations and thermal stress in crystal pro cessing process very large, process is slow and difficult, and separative efficiency is extremely low.Optical component is very high to the quality requirement of plane of crystal after processing simultaneously, and crystal mostly is solution growth, to the dust in machining and cool piquid-sensitive sense, very easily deliquescence and pollution occurs.
The applicant proposed the application for a patent for invention (patent No. is CN102152003A) of " a kind of separating optical crystal by using two laser beams and device " for 02 month 24 days in 2011.First ultrafast laser bundle of peak power density, low pulse energy is focused into optical crystal inside by the method, the crystalline material at laser spot place produces multiphoton ionization effect owing to being subject to extremely strong light field, make that the crystal at this place undergoes phase transition, local melting and modification, thus significantly improve the absorptivity of focus area and reduce the adhesion in this region.The movement of three-dimensional working platform is utilized to make the first laser action region form the pretreatment face running through whole crystal.Adopt the second laser beam of low peak power, high pulse energy to act on described pretreatment face again, optical crystal is separated.
Although the method achieves the contactless separation of KDP crystal, but must use ultrafast laser in crystal, form a pretreatment face, still there is following problem: it is high to the requirement of intensity control precision and stability that (1) uses ultrafast laser to carry out modification to crystal, mechanism is complicated, apparatus expensive.(2) make a modification face running through separated track and can destroy crystal internal stress stability, also can form quick-fried some when running into material lattice defect, often ftracture in manufacturing process.(3) roughness and material property that are separated sidewall can be destroyed in the pretreatment face running through crystal, cause the crystal sidewall after separation must carry out polishing to pretreatment zone and remove and can use.(4) separation principle of the method is cool the tension produced after laser heating materials expands, and therefore its separating rate is seriously limited by the cooling of material, although more traditional machine cuts is faster, speed still can not practical requirement.
Summary of the invention
A kind of laser quick separating optical crystal method provided by the invention and device thereof, object is to improve further speed, precision, processing safety and the quality that optical crystal is separated, with the crystal separation surface of the lossless separation and accurate polishing level fineness that realize optical crystal; Present invention also offers the device realizing the method.
A kind of laser quick separating optical crystal method provided by the invention, it is characterized in that: first the method utilizes ultrafast laser or adopt mechanical means to carry out detaching direction setting to optical crystal, forms a prefabricated micro-crack distributed along path direction to be separated separating top; Then utilize circle or long strip type laser focusing to carry out scanning heating to prefabricated micro-crack, form an induced with laser microcrack; Finally, the quick mobile laser focusing along path to be separated, until the translational speed of laser is identical with the expansion rate of induced with laser microcrack, laser focusing is made to followed by microcrack all the time foremost, and make microcrack two layers of material generation thermal expansion effects, thus produce forward direction extruding and side direction tension at microcrack tip, crystalline material is pulled open, finally realizes crystal high-quality and be separated.
The device realizing above-mentioned laser quick separating optical crystal method provided by the invention, it is characterized in that, this device comprises the prefabricated mechanism of micro-crack, single focal argon laser system of processing and two-dimentional work bench;
Described two-dimentional work bench is used for fixed crystal, and its corner is provided with the spring that can provide pulling force, and two-dimentional work bench surface is air supporting or disjoint paths hollow out;
The prefabricated mechanism of micro-crack for arranging a detaching direction and producing initial micro-crack on optical crystal to be processed;
Described single focal argon laser system of processing is arranged on above two-dimentional work bench, for providing laser focusing, and scans on initial micro-crack, forms an induced with laser microcrack and finally realize crystal high-quality to be separated.
The present invention utilizes laser to contact with crystalline material interaction mechanical, crystalline material has the transparency to laser and absorbs in body, crystalline material tensile strength difference and crystalline material are to features such as thermal stress sensitivities, use LASER HEATING with the transparent material of initial prefabrication micro-crack, thus make the material generation thermal expansion effects of prefabricated micro-crack both sides, to the sphere of action of generation foremost of micro-crack is minimum, the forward direction of intensity maximum extrudes and side direction tension region, crystalline material is pulled open, complete the separation of optical crystal instantaneously, realize in dissociated optical crystallization process without cracked, separation accuracy is high, can be separated and free of contamination object by any direction.Therefore the present invention has the following advantages:
1, be untouchable because laser beam and optical crystal interact, thus eliminate vibrations and mechanical stress that mechanical means causes optical crystal fragmentation in cutting process;
2, separation by laser optical crystal can be separated than machine cuts and obtain more accurate size of separation;
3, not by the impact of optical crystal self anisotropic, the separation of any direction can be carried out;
4, due in laser beam dissociated optical crystallization process without dust chip, also without the need to oil cooling but, eliminate in dissociated optical crystallization process and the pollution on optical crystal surface destroyed;
5, crystal seldom needs or without the need to ultrafast laser modification, and equipment is simple, stable, security is high; Almost destroy without femtosecond laser in separation process, be separated sidewall highly polished, and keep original physical property;
What 6, adopt due to this separation method is induced with laser crack spike tension foremost, can obtain higher separation by laser speed and be separated sidewall quality.
7, the present invention is specially adapted to the separation of KDP optical crystal.
Accompanying drawing explanation
Fig. 1 is the structural representation of the first detailed description of the invention of laser quick separating optical crystal device provided by the invention;
The structural representation of the second detailed description of the invention of Fig. 2 laser quick separating provided by the invention optical crystal device;
Wherein, 1 is common high power laser, 2 is ultrafast laser, 31 is the first beam expanding lens, 32 is the second beam expanding lens, 41, 42 are respectively first, second speculum, 5 is condenser lens, 6 is laser galvanometer 6, 71, 72 is first, second largest size lens, 8 is microcobjective, 91, 92 is first, second Z axis travel mechanism, 10 is the first initial prefabrication micro-crack, 11 is holder, 12 is spring, 13 is optical crystal to be processed, 14 is induced with laser microcrack, 15 is two-dimentional work bench, 16 is microdiamond emery wheel, 17 is servomotor, 18 is two-dimentional guide rail, 19 is the second initial prefabrication micro-crack.
Detailed description of the invention
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described further.It should be noted that at this, the explanation for these embodiments understands the present invention for helping, but does not form limitation of the invention.In addition, if below in described each embodiment of the present invention involved technical characteristic do not form conflict each other and just can mutually combine.
In the inventive method, prefabricated micro-crack is defined as and is greater than 250 μm along path direction to be separated (X-direction) length, is less than 100 μm along Y-direction width, and the degree of depth (Z-direction) runs through crystalline material micro-crack over half; Definition pulse energy is 20nJ to 2mJ, and pulse width is less than 50 psecs, and peak power is ultrafast laser higher than the laser instrument of 20KW; Definition power output is 10W to 1000W, and pulse width is greater than the pulse laser of 1 nanosecond (ns) or continuous wave laser is common high power laser; Definition edge thickness is less than 100 μm, and the skive that diameter is less than 10cm is microdiamond emery wheel.
Laser quick separating optical crystal method provided by the invention, its principle is the feature utilizing optical crystal tensile strength low, when LASER HEATING microcrack, make microcrack two layers of material generation thermal expansion effects, thus generation sphere of action in microcrack tip is minimum, the forward direction of intensity maximum extrudes and side direction tension, crystalline material is pulled open, finally realizes crystal high-quality and be separated.
First, detaching direction setting is carried out to optical crystal, separate top formed one superfine, along the prefabricated micro-crack of path profile to be separated; Secondly, utilize circle or long strip type laser focusing to carry out scanning heating to prefabricated micro-crack, form an induced with laser microcrack; Finally, along the quick mobile laser focusing of disjoint paths arranged, until the translational speed of laser is identical with induced with laser microcrack expansion rate, laser focusing is made to followed by crack all the time foremost, thus ensure crack high-speed expansion, realize the high speed of crystal, high-quality is separated.
The device realizing described method comprises the prefabricated mechanism of micro-crack of a detaching direction setting, a single focal argon laser system of processing and a two-dimentional work bench 15.
Single focal argon laser system of processing is arranged on above two-dimentional work bench 15, and it comprises common high power laser 1, first beam expanding lens 31, first speculum 41 be positioned in a light path, condenser lens 5 and the first Z axis travel mechanism 91 successively.Wherein the first beam expanding lens 31 can be cylinder beam expanding lens or sphere beam expanding lens.Condenser lens 5 is fixed in the first Z axis travel mechanism 91, by changing the position of condenser lens 5, can change laser spot and stretching into the intracrystalline degree of depth.
Two-dimentional work bench 15 is for fixed crystal, and platform corner is provided with the spring 12 that can provide certain pulling force (< 1Kg) by holder 11.Platform surface is air supporting or disjoint paths hollow out, thus isolation platform absorbing laser heat-dissipating treats the impact of processing optical crystal.
The prefabricated mechanism of micro-crack for arranging a detaching direction and producing initial micro-crack on optical crystal to be processed, and be usually arranged on the side of two-dimentional work bench 15, its specific implementation can be adopted in two ways, i.e. the first to the second prefabricated mechanism of micro-crack.
The principle of the first prefabricated mechanism of micro-crack utilizes optical crystal to have high-peak power, low-energy feature to 0.2 ~ 2.5 mum wavelength scope internal absorption factor lower (less than 10%) and ultrafast laser, by laser beam focus optical crystal inner certain a bit, make this some place laser power density far above the damage threshold of optical crystal, bring out multiphoton ionization and produce a large amount of " electronic gas ", cause the non-linear absorption of strong laser, thus realize cold working to optical crystal, form an extremely narrow prefabricated micro-crack.
As shown in Figure 1, the first prefabricated mechanism of micro-crack utilizes the cold working mechanism of ultrafast femtosecond laser to realize arranging the detaching direction of optical crystal, is particularly suitable in the occasion very high to disintegrate-quality requirement.The prefabricated mechanism of this micro-crack comprises ultrafast laser 2, second speculum 42, second beam expanding lens 32, the laser galvanometer 6 that are positioned at successively in another light path, first, second large scale lens 71,72, micro-focusing objective len 8 and the second Z axis travel mechanism 92.Wherein laser galvanometer 6, first, second large scale lens 71,72 and micro-focusing objective len 8 are arranged in order and are fixed in the second Z axis travel mechanism 92.Ultrafast laser enters micro-focusing objective len 8 through laser galvanometer 6 and first, second large scale lens 71,72, forms the high region of an energy density after focusing at crystals, thus realizes the micro-removal of crystalline material at micron or nanoscale.By the acting in conjunction of laser galvanometer 6 and the second Z axis travel mechanism 92, micron-sized prefabricated micro-crack can be formed in crystal.Meanwhile, the plasma (orifice) gas that produces in process is known from experience and adhere at the sidewall of crackle, the thermal stress distribution of change crystals, thus the initially-separate efficiency significantly improving follow-up single focal argon laser system of processing be separated bearing accuracy.
The specific implementation process of Fig. 1 shown device comprises the following steps:
(1) position of micro-focusing objective len 8 is regulated, ultrafast laser is entered optical crystal inside from the lateral focus of optical crystal, at laser spot place, optical crystal can absorb and ionization by collision absorption because superpower electric field causes multiphoton ionization, forms the ablation of nanometer or micro-meter scale.
Form powder, plasma gas or transformation temperature after the ablation of optical crystal refers to the absorption of crystal laser energy in laser spot region and depart from mother metal.
(2) start laser galvanometer 6, intracrystalline ultrafast laser focus is scanned along Z-direction, and intracrystalline ablation point will be linked to be ablation line.The X-axis mobile optical crystal of recycling two-dimentional work bench 15, makes ablation line form ablation face from inside to outside, finally in crystal, forms a prefabricated micro-crack 10.
Scan rate of vibrating mirror and Z axis translational speed depend on the peak power of ultrafast laser, are usually less than 0.3m/s; Length and the degree of depth of usual miniature carving seam are all greater than 1mm.
(3) regulate the position of condenser lens 5, common high power laser is focused on top or the below of prefabricated micro-crack 10, and carry out particles along micro-crack X-direction, until micro-crack front end defines new crack.
The judgement of new cracking initiation has occurred the new crackle along detaching direction, and usual crack length is less than 1cm (X-direction), the whole crystal of depth penetration.
(4) along the mobile single focal argon laser system of processing of path to be separated speed, within making new crack be positioned at laser spot front certain distance D foremost all the time, until whole crystal separation.The value of D is relevant with the thickness of crystalline material and surface parameter, from 10 microns to 1 centimetre not etc.The translational speed of single focal argon laser system of processing is relevant with the power of common high power laser, is usually greater than 100 μm/s.
Fig. 1 shown device and CN102152003A morphologically have some similar, but are essentially different, and are two kinds of distinct methods, simply illustrate its difference below:
The separation principle of the application and CN102152003A is essentially different.Method in CN102152003A be utilize high-peak power, the first laser beam of low pulse energy forms light injury line and face in crystal, its essence is not removed the material in this region, and is only carry out modification to relevant range.And emphasize in the present invention, ultrafast laser must be utilized to carry out micro-removal to material, form the prefabricated micro-crack that runs through material thickness, so its mode of action is essentially different.Secondly, the effect in the modification face that CN102152003A first laser beam is formed is the absorptivity increasing specific region, reduces its adhesion, thus guides the second laser to be separated.And the effect of ultrafast laser is prefabricated micro-crack in the present invention, thus play the effect of induction incipient crack generation, the two separation principle is essentially different.
Must first adopt the first laser beam to form damage surface in CN102152003A, re-use the second laser beam and be separated along damage surface, thus the zone of action of the first laser beam must cover whole machining locus; And the present invention only needs to use ultrafast laser to process the distance of a bit of (about 1-2mm) along disjoint paths, do not need to cover whole track, and ultrafast laser is only used at the processing initial stage, after induced with laser microcrack is formed, only need use common high power laser, without the need to using double laser beam.
The device difference that device provided by the invention provides in CN102152003A is: the present invention utilizes ultrafast laser to use micro-focusing objective len 8 to be combined with laser galvanometer 6, processes in the mode scanned.And in CN102152003A, using condenser lens to process with the form of point focusing, the latter's process velocity and precision can not show a candle to the former.Secondly, this device need use spring mechanism, ultrafast laser and common laser can not be settled separately on a track, and processing platform is the fuel factor that air supporting or disjoint paths hollow out produce with isolated Laser Processing platform, and the device provided with CN102152003A has obvious difference.
The principle of the second prefabricated mechanism of micro-crack utilizes microdiamond emery wheel 16 to mark an extremely narrow mill seam at crystal sidewall, forms precrack.Because mill seam sidewall mill is rough, the heat distribution of laser absorption rate and the scanning of change post laser can be significantly improved.Common high power laser will form the micro-crack with fixed-direction after adding defibrator process seam.
As shown in Figure 2, the second prefabricated mechanism of micro-crack utilizes microdiamond abrasive cut-off wheel and common high power laser to realize arranging the detaching direction of optical crystal, is suitable for the less demanding occasion of subregion disintegrate-quality.The prefabricated mechanism of this micro-crack comprises two-dimentional guide rail platform 18 (guide rail activity direction is Z-direction and Y-direction), a servomotor 17 and a microdiamond emery wheel 16.Servomotor 17 is fixed on two-dimentional guide rail platform 18, and skive 16 is placed on motor shaft with the direction perpendicular to motor shaft.Servomotor 17 drives skive 16 high-speed rotation, and along with the slightly movement of guide rail Z-direction, and form a small mill seam at crystal sidewall, skive 16 is by rough for the crystal mill of each sidewall of mill seam simultaneously, increases the subregional absorptivity of crystals.Follow-up single focal argon laser can form the micron order prefabricated micro-crack of direction along disjoint paths after adding defibrator process seam, thus the detaching direction completing optical crystal is arranged.
The specific implementation process of Fig. 2 shown device comprises the following steps:
(1) open servomotor, make microdiamond emery wheel High Rotation Speed (rotating speed is greater than 100 turns/min usually), and just contact with optical crystal material to microdiamond emery wheel along two-dimentional guide rail shift servo motor.
(2) move up and down servomotor, ground a finedraw to whole crystal by skive.Translational speed is greater than 100 μm/s usually.
(3) move KDP crystal in X direction, the mobile distance that feeds is less than 1mm usually.
(4) repeat step (2), (3) until crystal is ground with a length is greater than 100 μm (X-directions), micro-mill that the degree of depth (Z-direction) runs through whole crystal stitches.
(5) regulate the position of condenser lens 5, common high power laser is focused on above micro-mill seam place or below, until micro-mill seam leading portion defines the micron order micro-crack 19 along disjoint paths.
The judgement that micro-crack is formed has occurred the crackle along detaching direction, and usual crack length is less than 1cm, and the degree of depth is greater than 5mm.
(6) common high power laser is focused on top or the below of induction micro-crack 19, and carry out particles along micro-crack X-direction, until micro-crack front end defines new crack.
(7) single focal argon laser system of processing is moved fast along path to be separated, within making new crack front be positioned at laser spot front certain distance D all the time, until whole crystal separation.The value of D is relevant with the thickness of crystalline material and surface parameter, from 10 microns to 1 centimetre not etc.The translational speed of single focal argon laser system of processing is relevant with the power of common high power laser, is usually greater than 100 μm/s.
Note: the order that also can change (2), (3) two steps.
Example:
Example 1
The present invention adopts pulse width to be 518fs, wavelength is 1030nm, maximum single pulse energy is that the femto-second laser of 200 μ J is as ultrafast laser, the YLP-50 model C W optical fiber laser of IPG company of Germany is as common high power laser, and its highest output mean power is 50W.The focal beam spot diameter of ultrafast laser is less than 5 μm, and the spot diameter of high-power common laser is about 50 μm, and dissociated optical crystal is KDP crystal, and style length is 100mm, and thickness is 12mm.Experimental technique: adopt the first laser quick separating optical crystal method, the single pulse energy regulating ultrafast laser is 200 μ J, and ultrafast laser sweep speed is 50mm/s, and the power output of common high power laser is 30W, sweep speed is 400 μm/s, and translational speed is 2mm/s.Experimental result: optical crystal is separated along separated track, be separated sidewall smooth, surface roughness (Ra) is less than 0.2 μm, and be as the criterion polishing level, produces in separation process without any micro-crack.
Example 2
The present invention adopts maximum (top) speed to be the servomotor of 4000 turns/min, and motor is 1mm/s along the translational speed of Z axis guide rail, and it is 10 μm that motor feeds distance along the movement of X-axis.The diameter of microdiamond emery wheel is 20mm, and the thickness of emery wheel outmost turns is 100 μm.Adopt the YLR-50 series of pulses optical fiber laser of German IPG company as common high power laser, output wavelength is 1070nm, and most high average output power 50W, maximum single pulse energy is 1mJ.The focused spot size of common high power laser is 30 μm, and dissociated optical crystal is KDP crystal, and specimen length is 200mm, and thickness is 11.8mm.Test method: adopt the second laser quick separating optical crystal method.The rotating speed regulating servomotor is 2500 turns/min, and optical fiber laser power output is 10W, and pulse energy is 1mJ, and sweep speed is 200 μm/s, and translational speed is 1mm/s.Experimental result: optical crystal is separated along separated track, be separated sidewall smooth, surface roughness (Ra) is less than 1 μm, and be as the criterion polishing level, produces in separation process without any micro-crack.
Example 3
The present invention adopts maximum (top) speed to be the servomotor of 1000 turns/min, and motor is 100 μm/s along the translational speed of Z axis guide rail, and it is 30 μm that motor feeds distance along the movement of X-axis.The diameter of microdiamond emery wheel is 10cm, and the thickness of emery wheel outmost turns is 100 μm.Adopt certain domestic 50W green (light) laser as common high power laser.The focused spot size of common high power laser is 20 μm, and dissociated optical crystal is KDP crystal, and specimen length is 400mm, and thickness is 30mm.Test method: adopt the second laser quick separating optical crystal method.The rotating speed regulating servomotor is 500 turns/min, and laser output power is 40W, and pulse energy is 1mJ, and sweep speed is 400 μm/s, and translational speed is 4mm/s.Experimental result: optical crystal is separated along separated track, be separated sidewall smooth, surface roughness (Ra) is less than 0.8 μm, produces in separation process without any micro-crack.
This method may be used for the optical crystal being separated other too, as sour lithium (LiNbO3-LN), potassium dideuterium phosphate (KD2PO4-DKDP), lithium iodate (LiIO3-LI), KTP (KTiOPO4-KTP), barium metaborate (BaB2O4-BBO), three lithium borates (LiB3O5-LBO), potassium niobate (KNbO3-KN), boric acid caesium (CSB3O5-CBO), CLBO (LiCSB6O10-CLBO), potassium fluoborate beryllium (KBe2BO3F2-KBBF) and sulphur silver gallium (AgGaS2-AGS), arsenic cadmium germanium (CdGeAs-CGA), the nonlinear optics optical crystals such as phosphorus germanium zinc (ZnGeP2-ZGP).
The above is preferred embodiment of the present invention, but the present invention should not be confined to the content disclosed in this embodiment and accompanying drawing.The equivalence completed under not departing from spirit disclosed in this invention so every or amendment, all fall into the scope of protection of the invention.
Claims (8)
1. a laser quick separating optical crystal method, it is characterized in that: first the method utilizes ultrafast laser or microdiamond emery wheel to carry out detaching direction setting to optical crystal, form a prefabricated micro-crack distributed along path direction to be separated separating top; Then utilize circle or long strip type laser focusing to carry out scanning heating to prefabricated micro-crack, form an induced with laser microcrack; Finally, the quick mobile laser focusing along path to be separated, until the translational speed of laser is identical with induced with laser microcrack expansion rate, laser focusing is made to followed by microcrack all the time foremost, and make microcrack two layers of material generation thermal expansion effects, thus produce forward direction extruding and side direction tension at microcrack tip, crystalline material is pulled open, pull open in process without dust chip, also without the need to oil cooling but, eliminate in dissociated optical crystallization process and the pollution on optical crystal surface is destroyed, finally realize crystal high-quality and be separated; Described ultrafast laser refers to that pulse energy is 20nJ to 2mJ, and pulse width is less than 50 psecs, and peak power is higher than the laser of 20KW, and described microdiamond emery wheel refers to that edge thickness is less than 100 μm, and diameter is less than the skive of 10cm.
2. laser quick separating optical crystal method according to claim 1, it is characterized in that, the width of described prefabricated micro-crack is less than 100 μm, and length is greater than 250 μm, and depth penetration crystalline material is over half.
3. realize a device for laser quick separating optical crystal method described in claim 1 or 2, it is characterized in that, this device comprises the prefabricated mechanism of micro-crack, single focal argon laser system of processing and two-dimentional work bench;
Described two-dimentional work bench is used for fixed crystal, and its corner is provided with the spring that can provide pulling force, and two-dimentional work bench surface is air supporting or disjoint paths hollow out;
The prefabricated mechanism of micro-crack for arranging a detaching direction and producing initial micro-crack on optical crystal to be processed;
Described single focal argon laser system of processing is arranged on above described two-dimentional work bench, for providing laser focusing, and is separated initial micro-crack being formed a laser microcrack and finally realizing crystal high-quality.
4. the device of laser quick separating optical crystal method according to claim 3, it is characterized in that, the prefabricated mechanism of described micro-crack comprises the ultrafast laser be positioned at successively in a light path, the second speculum, the second beam expanding lens, laser galvanometer, first, second large scale lens, micro-focusing objective len and the second Z axis travel mechanism; Wherein laser galvanometer, first, second large scale lens and micro-focusing objective len are arranged in order and are fixed in the second Z axis travel mechanism; During work, ultrafast laser enters micro-focusing objective len through laser galvanometer and first, second large scale lens, forms the high region of an energy density after focusing at crystals, thus realizes the micro-removal of crystalline material at micron or nanoscale; By the acting in conjunction of laser galvanometer and the second Z axis travel mechanism, in crystal, form micron-sized micro-crack; The plasma gas produced in process adheres at the sidewall of crackle, changes the thermal stress distribution of crystals, realizes high-purity separation.
5. the device of a laser quick separating optical crystal method according to claim 3, it is characterized in that, the prefabricated mechanism of described micro-crack comprises a two-dimentional guide rail platform, a servomotor and microdiamond emery wheel; Servomotor is fixed on two-dimentional guide rail platform, and microdiamond emery wheel is to be placed on motor shaft perpendicular to the direction of motor shaft; Servomotor is for driving microdiamond emery wheel high-speed rotation, and along with the slightly movement of guide rail Z-direction, form a small mill seam at crystal sidewall, microdiamond emery wheel is by rough for the crystal mill of each sidewall of mill seam simultaneously, increases the subregional absorptivity of crystals; Follow-up single focal argon laser can form the micron order micro-crack of direction along disjoint paths after adding defibrator process seam, thus the detaching direction completing optical crystal is arranged.
6. the device of laser quick separating optical crystal method according to claim 3, it is characterized in that, described single focal argon laser system of processing comprises the common high power laser be positioned at successively in a light path, the first beam expanding lens, the first speculum, condenser lens and the first Z axis travel mechanism; Condenser lens is fixed in the first Z axis travel mechanism, by changing the position of condenser lens, can change laser spot and stretch into the intracrystalline degree of depth, described common high power laser refers to that power output is 10W to 1000W, and pulse width is greater than pulse laser or the continuous wave laser of 1 nanosecond.
7. utilize device described in claim 4 to carry out a method for crystal separation, it is characterized in that, the method comprises the following steps:
(a1) position of micro-focusing objective len is regulated, ultrafast laser is entered optical crystal inside from the lateral focus of optical crystal, at laser spot place, optical crystal absorbs and ionization by collision absorption because superpower electric field causes multiphoton ionization, forms the ablation of nanometer or micro-meter scale;
(a2) start laser galvanometer, intracrystalline ultrafast laser focus is scanned along Z-direction, and intracrystalline ablation point will be linked to be ablation line; The X-axis mobile optical crystal of recycling two-dimentional work bench, makes ablation line form ablation face from inside to outside, finally in crystal, forms a prefabricated micro-crack;
(a3) regulate the position of condenser lens, common high power laser is focused on above prefabricated micro-crack or below, and carry out particles along micro-crack X-direction, until micro-crack front end defines new crack;
(a4) single focal argon laser system of processing is moved fast along path to be separated, within making new crack be positioned at laser spot front certain distance foremost all the time, until whole crystal separation.
8. utilize device described in claim 5 to carry out a method for crystal separation, it is characterized in that, the method comprises the following steps:
(b1) open servomotor, make microdiamond emery wheel High Rotation Speed, and just contact with optical crystal material to microdiamond emery wheel along two-dimentional guide rail shift servo motor;
(b2) move up and down servomotor, ground a finedraw to whole crystal by microdiamond emery wheel;
(b3) move crystal in X direction, movement feeds distance and is less than 1mm;
(b4) repetition step (b2), (b3) are greater than 100 μm until crystal is ground with a length, micro-mill seam of the whole crystal of depth penetration;
(b5) regulate the position of condenser lens, common high power laser is focused on above micro-mill seam place or below, until micro-mill seam leading portion defines the prefabricated micro-crack of micron order along disjoint paths;
(b6) common high power laser is focused on above prefabricated micro-crack or below, and carry out particles along micro-crack X-direction, until micro-crack front end defines new crack;
(b7) single focal argon laser system of processing is moved fast along path to be separated, within making new crack front be positioned at laser spot front certain distance all the time, until whole crystal separation;
Wherein, step (b2), (b3) can exchange.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410071645.4A CN103831527B (en) | 2014-02-28 | 2014-02-28 | A kind of laser quick separating optical crystal method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410071645.4A CN103831527B (en) | 2014-02-28 | 2014-02-28 | A kind of laser quick separating optical crystal method and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103831527A CN103831527A (en) | 2014-06-04 |
| CN103831527B true CN103831527B (en) | 2016-01-20 |
Family
ID=50795596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410071645.4A Active CN103831527B (en) | 2014-02-28 | 2014-02-28 | A kind of laser quick separating optical crystal method and device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103831527B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104607809A (en) * | 2015-01-29 | 2015-05-13 | 深圳英诺激光科技有限公司 | Laser drilling equipment capable of improving drilling quality and increasing drilling speed |
| CN105436710B (en) * | 2015-12-30 | 2019-03-05 | 大族激光科技产业集团股份有限公司 | A kind of laser-stripping method of Silicon Wafer |
| CN106799665B (en) * | 2016-11-30 | 2018-08-28 | 田欣利 | Ceramics based on crack propagation effect cut-turn a millstone combined type plane surface processing method |
| CN109300779A (en) * | 2018-08-29 | 2019-02-01 | 晶澳（扬州）太阳能科技有限公司 | A kind of processing method and processing device of silicon wafer |
| CN109396661A (en) * | 2018-11-09 | 2019-03-01 | 上海申和热磁电子有限公司 | One kind being used for CO2The processing method of laser aiming optical fiber processing aluminium oxide ceramics |
| CN109732198B (en) * | 2019-01-31 | 2020-05-19 | 华中科技大学 | Double-beam hot cracking processing device and method for hard and brittle materials |
| CN110900015B (en) * | 2020-01-02 | 2022-02-01 | 北京理工大学重庆创新中心 | Multi-laser composite precision machining method for free-form surface optical lens |
| CN110900016B (en) * | 2020-01-02 | 2022-02-01 | 北京理工大学重庆创新中心 | Complex micro-nano structure processing method based on laser separation |
| CN112658968B (en) * | 2020-12-19 | 2022-04-05 | 华中科技大学 | Wafer grinding device based on laser in-situ assistance |
| CN114871585A (en) * | 2022-05-13 | 2022-08-09 | 南京航空航天大学 | Multi-laser-coupled three-dimensional complex curved surface multi-scale structure manufacturing equipment and method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004035315A (en) * | 2002-07-02 | 2004-02-05 | Mitsuboshi Diamond Industrial Co Ltd | Method and apparatus for dividing brittle material substrates |
| CN101927402A (en) * | 2009-06-17 | 2010-12-29 | 三星钻石工业股份有限公司 | Method for cutting off brittle material substrate |
| CN102152003A (en) * | 2011-02-24 | 2011-08-17 | 华中科技大学 | Method and device for separating optical crystal by using two laser beams |
| CN102194745A (en) * | 2010-02-05 | 2011-09-21 | 株式会社迪思科 | Optical device wafer processing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3063688B2 (en) * | 1997-07-30 | 2000-07-12 | 日本電気株式会社 | Laser processing apparatus, control method therefor, and recording medium storing control program therefor |
-
2014
- 2014-02-28 CN CN201410071645.4A patent/CN103831527B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004035315A (en) * | 2002-07-02 | 2004-02-05 | Mitsuboshi Diamond Industrial Co Ltd | Method and apparatus for dividing brittle material substrates |
| CN101927402A (en) * | 2009-06-17 | 2010-12-29 | 三星钻石工业股份有限公司 | Method for cutting off brittle material substrate |
| CN102194745A (en) * | 2010-02-05 | 2011-09-21 | 株式会社迪思科 | Optical device wafer processing method |
| CN102152003A (en) * | 2011-02-24 | 2011-08-17 | 华中科技大学 | Method and device for separating optical crystal by using two laser beams |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103831527A (en) | 2014-06-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103831527B (en) | A kind of laser quick separating optical crystal method and device | |
| CN101218664B (en) | Method for cutting workpiece | |
| CN102152003B (en) | Method and device for separating optical crystal by using two laser beams | |
| JP5449665B2 (en) | Laser processing method | |
| JP6703482B2 (en) | Laser-cut composite glass article and cutting method | |
| TWI476085B (en) | Processing object cutting method | |
| US9302346B2 (en) | Precision laser scoring | |
| JP5312761B2 (en) | Cutting method | |
| Butkus et al. | Rapid microfabrication of transparent materials using filamented femtosecond laser pulses | |
| KR20080050547A (en) | Laser processing method and laser processing device | |
| CN103030266A (en) | Laser cutting method and device | |
| Zhang et al. | Micromachining of 4H-SiC using femtosecond laser | |
| KR101181719B1 (en) | Substrate Dicing Method by Nano Void Array Formation using Femtosecond Pulse Lasers | |
| Deng et al. | A study on dual laser beam separation technology of KDP crystal | |
| Jia et al. | Multi-scan picosecond laser welding of non-optical contact soda lime glass | |
| CN102319958A (en) | Pulse laser cutting method for fragile materials | |
| US20150158117A1 (en) | System and method for obtaining laminae made of a material having known optical transparency characteristics | |
| JP5117806B2 (en) | Laser processing method and laser processing apparatus | |
| CN203725988U (en) | Laser quick separation device for optical crystals | |
| Park et al. | Damage-free cutting of chemically strengthened glass by creation of sub-surface cracks using femtosecond laser pulses | |
| JP2007261885A (en) | Cleaving method of piled glass | |
| CN203079699U (en) | Device for processing glass inkjet sheet | |
| Kang et al. | Experimental investigation on the CO 2 laser cutting of soda-lime glass | |
| Pan et al. | Laser-assisted waterjet micro-grooving of silicon wafers for minimizing heat affected zone | |
| CN201970019U (en) | Device for separating optical crystal by dual laser beam |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180404 Address after: 436070 Ezhou city Gedian Development Zone No. 1 Industrial Zone entrepreneurship service center in Hubei Patentee after: Wuhan flex Laser Technology Co., Ltd. Address before: 430074 Hubei Province, Wuhan city Hongshan District Luoyu Road No. 1037 Patentee before: Huazhong University of Science and Technology |
|
| TR01 | Transfer of patent right |