CN102319958A - Pulse laser cutting method for fragile materials - Google Patents
Pulse laser cutting method for fragile materials Download PDFInfo
- Publication number
- CN102319958A CN102319958A CN201110238153A CN201110238153A CN102319958A CN 102319958 A CN102319958 A CN 102319958A CN 201110238153 A CN201110238153 A CN 201110238153A CN 201110238153 A CN201110238153 A CN 201110238153A CN 102319958 A CN102319958 A CN 102319958A
- Authority
- CN
- China
- Prior art keywords
- laser
- cutting
- pulse laser
- pulse
- fragile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses a pulse laser cutting method for fragile materials, which utilizes a device comprising a pulse laser with a pulse width of millisecond level, a computer, an electric horizontal moving platform and the like to cut a fragile plate-like material. By utilizing the characteristics that linearly polarized laser can form long and narrow ablated areas on the surface of the material and that the fragile material can be easily broken, the pulse laser cutting method forms uncrossed long and narrow ablated areas distributed at intervals on the surface of the fragile plate-like material along the scanning direction, then utilizes the stress of both ends of each ablated area to break the material, and connects the neighboring ablated areas together, and thereby cutting is finished. Since the pulse laser cutting method adopts the long and narrow ablated areas formed by the linearly polarized laser, the waste of the material can be reduced, the ablated areas are cut when the material is broken, fracture surfaces are smooth, and the cutting quality is high; the ablated areas are distributed at intervals, and do not need to be crossed by one another, the needed laser energy is little, the cutting speed is high, and the pulse laser cutting method can be widely applied to the cutting of glass, ceramics, semiconductors and other fragile plate-like materials.
Description
Technical field
The present invention relates to a kind of laser cutting method, particularly a kind of method of accomplishing plate shape fragile material fracture cutting according to the thermal stress that causes in the linearly polarized laser irradiation fragile material process.
Background technology
Existing laser cutting technique about fragile material; Adopt continuous laser to scan on fragility flat-form material surface mostly along straight line; The high density energy of utilizing laser beam after lens focus on, to produce; Material is melted at short notice even gasify, with auxiliary the air blowing slag is blown down then, and then form continuous ablated area and accomplish joint-cutting through moving laser beam.More this type laser cutting method uses circularly polarized laser to form continuous ablated area material is fused, and required laser energy is big and have shortcomings such as cutting speed is slow, cut surface is coarse, waste material in the process." Applied Physics A " 1999 68 interim articles that are entitled as " Polarization effects in ultrashort-pulse laser drilling " of delivering by S.Nolte etc. of having reported; The mechanism that wherein material has been formed long and narrow oval ablation hole under the linearly polarized laser effect is analyzed; Think because the influence that the polarised direction of linearly polarized laser produces in the energy deposition situation of material surface laser energy; Under the irradiation of linearly polarized laser, material surface produces the sleeve configuration ablated area along polarised direction." Journal Of Applied Physics " 2002 92 volume 3 is interim has reported the article of being delivered by K.Venkatakrishnan etc. that is entitled as " The effect of polarization on ultrashort pulsed laser ablation of thin metal films ", and paired pulses formula linearly polarized laser is analyzed along the metal material surface scan condition in the literary composition.When laser energy density during, can observe tangible thin-and-long ablated area under the linearly polarized laser irradiation, and when laser energy density during far above material fusion threshold value, ablated area still is circular a little more than material fusion threshold value.Than the circular ablated area of the scanning process of circularly polarized laser; When the polarised direction of laser and scanning direction are consistent in the linearly polarized light scanning process under the situation; The thin-and-long ablated area overlaps easily, thereby is prone to form joint-cutting along laser scanning direction, thereby accomplishes the cutting to material.But above-mentioned article is just analyzed to metal material, and the cutting of accomplishing metal material under the linearly polarized laser scanning situation still needs superlaser to form successional ablated area at material surface.
Summary of the invention
The purpose of this invention is to provide a kind of in cutting process required laser energy little, cutting speed is fast, cut surface is smooth and the fragile material pulse laser cutting method that can effectively save material.
The present invention seeks to realize through following technical scheme; Fragile material pulse laser cutting method; It is in the pulse laser diced system that is made up of pulse laser, motorized precision translation stage, optical module and electronic computer, to accomplish, and its concrete performing step is following:
Step 1: friable plate material to be cut is fixed on above the motorized precision translation stage in the pulse laser diced system;
Step 2: starting impulse laser cutting system; Through pulsewidth, frequency, the pulse output energy of computer control adjustment laser, and make irradiation behind linearly polarized laser bundle that system laser sends speculum and the condenser lens in optical module be cut the edge of an end on the surface of friable plate material;
Step 3: in laser works, start motorized precision translation stage; Making friable plate material by computer control is in the cutting process at pulse laser irradiation; Carry out the one dimension translation with motorized precision translation stage with fixed speed, and polarization direction and laser scanning direction are consistent in the cutting process;
Step 4: in the scanning process,, make laser on friable plate material, form the sleeve configuration ablated area that compartment distributes and do not overlap along the scanning direction by the point-to-point speed and the laser frequency of computer control adjustment motorized precision translation stage;
Step 5: utilize the thermal stress that pulls to of sleeve configuration ablated area two ends generation, fracture automatically can take place along laser scanning direction in fragile material, adjacent ablated area is connected, thereby completion is to the cutting of friable plate material.
Pulsewidth, the single pulse energy of system's output laser are adjustable in the above-mentioned steps 2, and the single pulse energy of laser instrument is adjustable in 0.5J～80J scope, and laser frequency 0～100Hz is adjustable; Distance B in the above-mentioned steps 4 between adjacent two sleeve configuration ablated area can obtain through expression formula D=v/f, and wherein: v is the motorized precision translation stage translational speed, and f is a laser frequency.
The method of the invention; It is to have utilized linearly polarized laser to come the fragility flat-form material is cut in the characteristic that material surface forms sleeve configuration ablated area and fragile material easy fracture; Utilize linearly polarized laser to scan at fragility template material surface; The compartment distribution does not need the sleeve configuration ablated area of overlapping each other along the scanning direction at material surface; And then utilizing the stress at sleeve configuration ablated area two ends, the fracture of atarting material links together adjacent ablated area, finally makes fragile material along laser scanning direction fracture take place and accomplishes cutting.
The present invention compared with prior art its significant advantage is: utilize linearly polarized laser to scan on fragility flat-form material surface in (1) cutting process; Than the circularly polarized light scan pattern, the formed thin-and-long ablated area of material surface makes material separate along cut direction more easily; (2) the ablated area compartment distributes in the scanning process, does not need mutual overlapping, but brings out the connection that ablated area is accomplished in the fracture that produces along the scanning direction by thermal stress, and it is little to cut required laser energy; (3) cutting that utilizes the fragile material fracture to accomplish, than the existing cut surface section smooth of ablating and obtaining, cut quality is high, has not only reduced the waste of material, can also simplify the following process operation; (4) do not need ablated area to overlap owing in the scanning process, thereby cutting speed is fast.The present invention can be widely used in the cutting to fragility flat-form materials such as glass, pottery, semiconductors.
Concrete structure of the present invention is provided by following accompanying drawing and embodiment.
Description of drawings
Fig. 1 is the operation principle sketch map according to fragile material pulse laser cutting method system for use in carrying according to the invention.
Fig. 2 is laser scanning direction and a laser polarization direction sketch map in the cutting brittle material process.
The specific embodiment
Below in conjunction with accompanying drawing, be that 0.5mm brittle ceramic flat-form material is an example with the cutting thickness, cutting step of the present invention is described in detail.
The inventive method is in the pulse laser diced system, to accomplish to the processing of 0.5mm brittle ceramic flat-form material, and referring to Fig. 1, this system is by pulse laser 1, speculum 2, and condenser lens 3, motorized precision translation stage 5 and computer 4 are formed.Its concrete performing step is following:
Step 1: 0.5mm brittle ceramic plate to be cut is fixed on above the motorized precision translation stage in the pulse laser diced system;
Step 2: the starting impulse laser cutting system, utilize computer that single pulse energy and laser frequency are regulated in 0.5J～80J and 0～100Hz scope, this routine laser energy is adjusted to 2J, and laser frequency is 10Hz, and pulsewidth is 1 millisecond; Irradiation is cut the edge center position of an end behind speculum and the condenser lens of this linearly polarized laser bundle in optical module on the surface of friable plate material;
Step 3: start motorized precision translation stage in the time of laser works, the point-to-point speed of motorized precision translation stage is adjusted into 25mm/s by computer control; In the laser irradiation process, material keeps fixed speed to carry out the one dimension translation with motorized precision translation stage, and polarization direction and laser scanning direction are consistent in the cutting process;
Step 4: in the scanning process; Obtain the sleeve configuration ablated area that compartment distributes and do not overlap in scanning direction, ceramic wafer upper edge; Distance B between adjacent two sleeve configuration ablated area can obtain through expression formula D=v/f, and wherein: v is the motorized precision translation stage translational speed, and f is a laser frequency; This example obtains the space D=2.5mm at center, adjacent two laser irradiations zone according to this expression formula;
Step 5: utilize the thermal stress that pulls to of sleeve configuration ablated area two ends generation, fracture automatically can take place along laser scanning direction in fragile material, adjacent ablated area is connected, thereby completion is to the cutting of friable plate material.
Is that laser scanning direction and the laser polarization direction that 0.5mm brittle ceramic flat-form material cuts seen shown in Figure 2 according to the inventive method to thickness.
Claims (3)
1. fragile material pulse laser cutting method, it is in the pulse laser diced system that is made up of pulse laser, motorized precision translation stage, optical module and electronic computer, to accomplish, its concrete performing step is following:
Step 1: friable plate material to be cut is fixed on above the motorized precision translation stage in the pulse laser diced system;
Step 2: starting impulse laser cutting system; Through pulsewidth, frequency, the pulse output energy of computer control adjustment laser, and make irradiation behind linearly polarized laser bundle that system laser sends speculum and the condenser lens in optical module be cut the edge of an end on the surface of friable plate material;
Step 3: in laser works, start motorized precision translation stage; Making friable plate material by computer control is in the cutting process at pulse laser irradiation; Carry out the one dimension translation with motorized precision translation stage with fixed speed, and polarization direction and laser scanning direction are consistent in the cutting process;
Step 4: in the scanning process,, make laser on friable plate material, form the sleeve configuration ablated area that compartment distributes and do not overlap along the scanning direction by the point-to-point speed and the laser frequency of computer control adjustment motorized precision translation stage;
Step 5: utilize the thermal stress that pulls to of sleeve configuration ablated area two ends generation, fracture automatically can take place along laser scanning direction in fragile material, adjacent ablated area is connected, thereby completion is to the cutting of friable plate material.
2. according to the said fragile material pulse laser of claim 1 cutting method; The pulsewidth, the single pulse energy that it is characterized in that system's output laser in the above-mentioned steps 2 are adjustable; The single pulse energy of laser instrument is adjustable in 0.5J～80J scope, and laser frequency 0～100Hz is adjustable.
3. according to the said fragile material pulse laser of claim 1 cutting method, it is characterized in that the distance B between adjacent two sleeve configuration ablated area can obtain through expression formula D=v/f in the above-mentioned steps 4, wherein: v is the motorized precision translation stage translational speed, and f is a laser frequency.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110238153A CN102319958A (en) | 2011-08-19 | 2011-08-19 | Pulse laser cutting method for fragile materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110238153A CN102319958A (en) | 2011-08-19 | 2011-08-19 | Pulse laser cutting method for fragile materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102319958A true CN102319958A (en) | 2012-01-18 |
Family
ID=45447860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110238153A Pending CN102319958A (en) | 2011-08-19 | 2011-08-19 | Pulse laser cutting method for fragile materials |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102319958A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103170751A (en) * | 2013-04-18 | 2013-06-26 | 苏州光韵达光电科技有限公司 | Method for cutting ceramics by optical fiber lasers |
| CN104439714A (en) * | 2014-11-13 | 2015-03-25 | 南京中科神光科技有限公司 | Method for filling and cutting materials through ultrashort pulse lasers |
| WO2016150774A1 (en) * | 2015-03-25 | 2016-09-29 | National University Of Ireland, Galway | Methods and apparatus for cutting a substrate |
| CN106853559A (en) * | 2015-12-09 | 2017-06-16 | 彭翔 | Method and apparatus for going to lose crisp and hard material by means of laser emission |
| CN108406129A (en) * | 2018-02-27 | 2018-08-17 | 苏州图森激光有限公司 | A kind of laser processing of hard brittle material |
| CN108581189A (en) * | 2018-06-01 | 2018-09-28 | 业成科技（成都）有限公司 | Laser cutting method |
| CN110304816A (en) * | 2019-01-25 | 2019-10-08 | 北京理工大学 | A kind of glass lens manufacturing method that array formation is cut one by one |
| CN115781055A (en) * | 2023-01-06 | 2023-03-14 | 山东宇影光学仪器有限公司 | Fresnel lens laser cutting machine with double operation tables |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2962105B2 (en) * | 1993-06-30 | 1999-10-12 | 松下電器産業株式会社 | Laser cutting method for soda glass |
| JP2003154517A (en) * | 2001-11-21 | 2003-05-27 | Seiko Epson Corp | Method and equipment for fracturing fragile material and manufacturing method for electronic component |
| JP2006175487A (en) * | 2004-12-24 | 2006-07-06 | Japan Steel Works Ltd:The | Laser cutting method and apparatus |
| CN101028671A (en) * | 2007-04-09 | 2007-09-05 | 中国科学院西安光学精密机械研究所 | Method and apparatus for ultrashort pulse laser parallel fine machining |
-
2011
- 2011-08-19 CN CN201110238153A patent/CN102319958A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2962105B2 (en) * | 1993-06-30 | 1999-10-12 | 松下電器産業株式会社 | Laser cutting method for soda glass |
| JP2003154517A (en) * | 2001-11-21 | 2003-05-27 | Seiko Epson Corp | Method and equipment for fracturing fragile material and manufacturing method for electronic component |
| JP2006175487A (en) * | 2004-12-24 | 2006-07-06 | Japan Steel Works Ltd:The | Laser cutting method and apparatus |
| CN101028671A (en) * | 2007-04-09 | 2007-09-05 | 中国科学院西安光学精密机械研究所 | Method and apparatus for ultrashort pulse laser parallel fine machining |
Non-Patent Citations (3)
| Title |
|---|
| 刘剑等: "脉冲激光热应力切割Al_2O_3陶瓷板", 《中国激光》 * |
| 戴罡等: "使用长脉冲高能激光对石英玻璃打孔", 《光学精密工程》 * |
| 邓英剑: "激光切割及其在切割陶瓷材料中的应用", 《机械》 * |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103170751A (en) * | 2013-04-18 | 2013-06-26 | 苏州光韵达光电科技有限公司 | Method for cutting ceramics by optical fiber lasers |
| CN104439714A (en) * | 2014-11-13 | 2015-03-25 | 南京中科神光科技有限公司 | Method for filling and cutting materials through ultrashort pulse lasers |
| WO2016150774A1 (en) * | 2015-03-25 | 2016-09-29 | National University Of Ireland, Galway | Methods and apparatus for cutting a substrate |
| CN107787260A (en) * | 2015-03-25 | 2018-03-09 | 爱尔兰戈尔韦国立大学 | The method and device of cutting substrate |
| US10710922B2 (en) | 2015-03-25 | 2020-07-14 | National University Of Ireland, Galway | Methods and apparatus for cutting a substrate |
| CN106853559A (en) * | 2015-12-09 | 2017-06-16 | 彭翔 | Method and apparatus for going to lose crisp and hard material by means of laser emission |
| CN108406129A (en) * | 2018-02-27 | 2018-08-17 | 苏州图森激光有限公司 | A kind of laser processing of hard brittle material |
| CN108406129B (en) * | 2018-02-27 | 2020-02-07 | 苏州图森激光有限公司 | Laser processing method of hard and brittle material |
| CN108581189A (en) * | 2018-06-01 | 2018-09-28 | 业成科技（成都）有限公司 | Laser cutting method |
| CN110304816A (en) * | 2019-01-25 | 2019-10-08 | 北京理工大学 | A kind of glass lens manufacturing method that array formation is cut one by one |
| CN115781055A (en) * | 2023-01-06 | 2023-03-14 | 山东宇影光学仪器有限公司 | Fresnel lens laser cutting machine with double operation tables |
| CN115781055B (en) * | 2023-01-06 | 2024-01-16 | 山东宇影光学仪器有限公司 | Fresnel lens laser cutting machine with double operation tables |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102319958A (en) | Pulse laser cutting method for fragile materials | |
| KR101408491B1 (en) | Laser processing method and laser processing system | |
| CN101218664B (en) | Method for cutting workpiece | |
| TWI592244B (en) | Method and apparatus for performing laser filamentation within transparent materials | |
| CN102489883B (en) | Laser processing and laser processing device | |
| KR101190454B1 (en) | Laser processing apparatus | |
| TWI510322B (en) | Laser processing method | |
| US8247734B2 (en) | Laser beam machining method | |
| KR101455412B1 (en) | Laser processing device | |
| KR101466392B1 (en) | Laser beam machining method and chip | |
| CN101461039B (en) | Laser material processing method | |
| US8685838B2 (en) | Laser beam machining method | |
| US8513567B2 (en) | Laser processing method for forming a modified region for cutting in an object | |
| JP4478184B2 (en) | Laser cleaving method and laser processing apparatus | |
| JP5620669B2 (en) | Laser dicing method and laser dicing apparatus | |
| US20090045179A1 (en) | Method and system for cutting solid materials using short pulsed laser | |
| WO2011071886A1 (en) | Laser machining and scribing systems and methods | |
| JP5314674B2 (en) | Processing method of brittle material substrate | |
| CN103831527B (en) | A kind of laser quick separating optical crystal method and device | |
| JP2011147968A (en) | Laser dicing apparatus | |
| TW200809941A (en) | Laser processing method | |
| KR101181719B1 (en) | Substrate Dicing Method by Nano Void Array Formation using Femtosecond Pulse Lasers | |
| JP4167094B2 (en) | Laser processing method | |
| JP5590642B2 (en) | Scribing apparatus and scribing method | |
| JP4813624B1 (en) | Laser dicing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120118 |