CN101028671A - Method and apparatus for ultrashort pulse laser parallel fine machining - Google Patents
Method and apparatus for ultrashort pulse laser parallel fine machining Download PDFInfo
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- CN101028671A CN101028671A CN 200710017654 CN200710017654A CN101028671A CN 101028671 A CN101028671 A CN 101028671A CN 200710017654 CN200710017654 CN 200710017654 CN 200710017654 A CN200710017654 A CN 200710017654A CN 101028671 A CN101028671 A CN 101028671A
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Abstract
A parallel ultra-short pulse laser micromachining technology is characterized by that an ultra-short pulse laser beam passes through a microlense array to become multiple divergent ultra-short pulse laser beams, which are then focused onto a focal plane on a workpiece by a focusing system for micromachining on it. Its apparatus is also disclosed.
Description
Technical field
The present invention relates to a kind of ultra-short pulse laser method for processing and equipment.
Background technology
Laser Processing is a kind of contactless material working angles, removes material in the mode of fusing and gasification, therefore is specially adapted to process hard and crisp material.Conventional laser (nanosecond, microsecond pulse or continuous laser) processing, its efficient height is accepted by industrial quarters as technological means a kind of economy, competitive.But,, produce manufacturing deficiency inevitably, as re cast layer and micro-crack etc. because laser pulse is longer than thermal diffusion time.These defectives not only reduce the mechanical property of workpiece, and also safety being on active service causes a hidden trouble.Although can improve drilling quality, but still need to remove subsequent handlings such as defective and stress relief annealing by improving laser processing technology.
The mid-90 in last century, reliable and stable ultra-short pulse laser system especially femto-second laser enters into the stage of commercially producing in the world, and it has increased new possibility for high-quality materials processing.Femtosecond laser has the characteristic of ultrashort pulse, superelevation peak strength, and free electron is by causing radiation absorption laser against bearing, and electron temperature increases sharply, and energy also has little time to be transferred to lattice, and the effect of laser pulse just is through with.This moment, a large amount of free electrons caused strong electrostatic field, when electric field force surpasses the interaction gravitation of electronic system, COULOMB EXPLOSION just took place, and made energy be taken away rapidly and have little time to spread at material internal.The removal of femtosecond laser material is a gasification, then can ignore in its heat affected area.Compare with conventional laser, femtosecond laser materials processing energy loss is little, the utilization rate height, thus reduced the removal threshold value of material; It is little to the indirect damage on materials processing surface, the machining accuracy height, and surface roughness can reach submicron order.Another potential advantage of femtosecond laser materials processing is to produce disposable finishing, and need not follow-up aided process and special gaseous environment protection.Therefore, have very strong technical advantage, also can carry out the three-dimensional light storage, make photonic devices such as waveguide in clear glass inside with femtosecond laser processing high temperature alloy such as aeronautical materials such as titanium alloy, nickel-base alloy.
When making micro devices, with style of a branch of femtosecond laser processing, the efficient of such processing is very low.Most applications, the mean power that needs is not high, as processed glass and organic material, general tens milliwatts even several milliwatt just can meet the demands, for this reason, the present invention proposes a kind of parallel processing method, can tens of time processing even a hundreds of device, with 2 orders of magnitude of former efficient raising.
Summary of the invention
The object of the invention provides parallel micro-processing method of a kind of ultra-short pulse laser and equipment, and it has solved, and conventional laser processing brings manufacturing deficiency and the low-down technical problems of ultra-short pulse laser working (machining) efficiency such as re cast layer and micro-crack in the background technology.
The technical solution of the inventive method is:
A kind of ultra-short pulse laser micro-processing method that walks abreast, it may further comprise the steps:
1] prepares sample to be processed: sample 8 to be processed is installed on the processing platform;
2] produce the ultra-short pulse laser bundle: by ultra-short pulse laser system 14 outputs one ultra-short pulse lasers;
3] generate the laser that multi beam is dispersed: this ultra-short pulse lasers becomes the ultra-short pulse laser that multi beam is dispersed through microlens array 13;
4] generate a plurality of laser spots: the ultra-short pulse laser that this multi beam is dispersed by focusing system 7 focus on sample 8 correspondences to be processed in the focal plane, form a plurality of focuses and process.
The step of a plurality of laser spots of above-mentioned generation is specially: the multi beam ultra-short pulse laser is reflected by 45 degree laser total reflective mirrors 5, again by focusing system 7 focus on sample 8 correspondences to be processed in the focal plane, go and process into a plurality of focuses.
The parallel micro-processing method of above-mentioned ultra-short pulse laser also comprises processing and the localization step that monitors sample to be processed: lighting source 1 is shone on the sample 8 to be processed, and video camera 3 is transferred to manuscript picture on the focusing system 7 and location situation on the monitor.
The parallel micro-processing method of above-mentioned ultra-short pulse laser also comprises the step that the control processing platform moves when generating a plurality of laser spot.
A kind of ultra-short pulse laser little process equipment that walks abreast, comprise the ultra-short pulse laser system 14 that can produce the ultra-short pulse laser bundle, the processing platform that can fix sample 8 to be processed and surveillance, its special character is: it also comprises microlens array 13 and the focusing system 7 that is successively set on the laser beam transmit direction, and the focus of described focusing system 7 is on the sample to be processed 8 on the processing platform.
The parallel little process equipment of above-mentioned ultra-short pulse laser comprises that also being arranged on 45 on the laser beam transmit direction spends laser total reflective mirror 5, and described focusing system 7 is arranged on the reflection direction of 45 degree laser total reflective mirrors 5.
The lighting source 1 that above-mentioned surveillance comprises video camera 3, monitor, be arranged in parallel with ultra-short pulse laser system 14, be arranged on the lighting source semi-transparent semi-reflecting lens 4 directly over the 45 degree laser total reflective mirrors 5.
The parallel little process equipment of above-mentioned ultra-short pulse laser also comprises metal cylinder 6, described lighting source semi-transparent semi-reflecting lens 4 is arranged on metal cylinder 6 inner and upper, described 45 degree laser total reflective mirrors 5 are arranged on metal cylinder 6 inner belows, be correspondingly provided with the circular hole that can see through laser beam and lighting source respectively on the lateral surface of described metal cylinder 6, described ultra-short pulse laser system 14 and lighting source 1 are set in parallel in the outside of metal cylinder 6, described processing platform is arranged on the bottom of metal cylinder 6, and described video camera 3 is arranged on the upper end of metal cylinder 6.
Above-mentioned processing platform comprises hollow specimen platform 9, three-dimensional mobile platform 10, computer 12 and electric cabinet 11, and described sample 8 to be processed is installed on the hollow specimen platform 9, and described hollow specimen platform 9 is installed on the three-dimensional mobile platform 10.
Above-mentioned ultra-short pulse laser system 14 is a fs-laser system, and described 45 degree laser total reflective mirrors 5 are 800nm45 degree laser total reflective mirror; Described focusing system 7 is F-θ scanning lens or microcobjective; Described lighting source 1 is the general visible source, comprises the LED of White LED, Halogen lamp LED or visible light.
The advantage that the present invention has is:
1, working (machining) efficiency height.Method is closed by the light, electricity, the mechanical integrated system that have realized ultraprecise processing high temperature alloy metal, compares with the ion beam processing technology with electron beam, and working (machining) efficiency improves 3～4 orders of magnitude.
2, precision height.Because the present invention uses ultrashort pulse or picosecond pulse laser, in cutting, punching, surface treatment, littlely add man-hour, the energy of the laser of the Electron absorption in the material almost has little time to be transferred to the lattice of material, and therefore, the temperature of material is almost constant.Fusing or distillation that the Physical Mechanism of processing fuel factor different and ps pulsed laser and ns pulsed laser causes.The present invention compares with traditional nanosecond laser, and the result of ultra-short pulse laser processing is that precision is higher, and no metallurgical imperfection, nothing are splashed down thing, no fuel factor, and be pollution-free.The hollow specimen platform mainly is to prevent to produce sputter and pollute processed sample on the sample platform behind the laser penetration sample.
But the processing situation and the location of 3 real time monitoring processed samples.The present invention obtains the image of sample to be processed by ccd video camera from focusing system, and is presented on the display screen in real time, but the processing situation of real time monitoring processed sample and location situation.
4, to carry out the removal of material be a gasification to femtosecond laser, and can ignore in its heat affected area, the machining energy loss is little, utilization rate is high, thereby reduced the removal threshold value of material; Femtosecond laser is little to the indirect damage on materials processing surface, the machining accuracy height, and surface roughness can reach submicron order.Femtosecond laser materials processing can disposablely be finished, and need not follow-up aided process and special gaseous environment protection.Femtosecond laser can be processed high temperature alloy such as aeronautical materials such as titanium alloy, nickel-base alloy, also can carry out the three-dimensional light storage in clear glass inside, makes photonic devices such as waveguide.
Description of drawings
Fig. 1 is a structural representation of realizing process equipment that the inventive method is used; Wherein: the 1-lighting source; The 2-homogenizer; The 3-video camera; 4-lighting source semi-transparent semi-reflecting lens; 5-45 degree laser total reflective mirror; The 6-metal cylinder; The 7-focusing system; 8-sample to be processed; 9-hollow specimen platform; The three-dimensional mobile platform of 10-; The 11-electric cabinet; The 12-computer; The 13-microlens array; The 14-ultra-short pulse laser system.
The louvre schematic diagram that Fig. 2 femtosecond laser is beaten on CMSX-4 nickel-based monocrystal sheet.
The single femto-second laser pulse of Fig. 3 is with the schematic diagram of the parallel process technology of microlens array at the inner measuring point of inscribing of PMMA, and process velocity is than high several thousand times of single beam processing.
The different femtosecond laser energy of Fig. 4 are at the schematic diagram of the inner different size measuring point of PMMA.
Fig. 5 schematic diagram of femtosecond laser at the letter " H " of the parallel processing in light-sensitive material surface.
The specific embodiment
Realize the employed a kind of process equipment of the inventive method as shown in Figure 1, ultra-short pulse laser system 14 adopts fs-laser system, the femtosecond laser beam of its output becomes the laser that multi beam is dispersed through behind the microlens array 13, multiple laser incides within the metal cylinder 6 that 800nm45 degree laser total reflective mirror 5 is installed, reflection vertically downward, focus on the sample 8 to be processed the corresponding a plurality of focuses of formation on the focal plane by focusing system 7.Focal plane laser distribution situation depends on the distribution of each lenslet of microlens array, and size depends on the optical magnification of the size and the focusing system 7 of single lens in the microlens array.Sample 8 to be processed is installed on the hollow specimen platform 9, and hollow specimen platform 9 mainly is to prevent that femtosecond laser from penetrating sample to be processed 8 backs and producing sputter on processing platform, pollutes sample 8 to be processed.Hollow specimen platform 9 is installed on the three-dimensional mobile platform 10 of computer 12 controls, and electric cabinet 11 provides power supply and driving for three-dimensional mobile platform 10.Video camera 3 adopts ccd video camera, is installed in the top of metal cylinder 6, in order to monitor the processing situation and the location of sample 8 to be processed.Lighting source 1 decays to suitable intensity by homogenizer 2, through lighting source semi-transparent semi-reflecting lens 4 back lightings sample 8 to be processed.The effect of lighting source 1 mainly is to provide illumination for video camera 3.
With single pulse energy 600 μ J, pulse recurrence frequency 1000Hz, pulse width is 120fs, wavelength is that the titanium jewel ultrashort pulse femtosecond laser of 800nm is as follows in the concrete processing method of titanium alloy, nickel-base alloy, aviation pottery, the punching of composite aluminum base alloy and cutting: Fig. 2 is a nickel base single crystal high-temperature alloy material, this material generally is used for the aero-engine hot-end component, as: turbo blade etc., and generally all use Thermal Barrier Coating Technologies simultaneously; Modern aeroengine has comprised the cooling hole up to 100 000, and the processing in cooling hole has expended huge man power and material.Laser pulses irradiate is to (800nm is all-trans, visible light is anti-reflection) 45 ° of laser total reflective mirrors 5, and laser pulse line focus system 7 (about focal length 100mm, perhaps using F-θ scanning lens) makes laser pulse focus on sample to be processed 8 surfaces.Sample 8 to be processed is fixed on three-dimensional mobile platform 10.The three-dimensional mobile platform 10 of computer 12 control with the motion of certain speed, is drawn circle or is taken the air line on X, Y, Z direction, thereby realizes punching or cutting.Lighting source 1 be general visible source (LED of White LED, Halogen lamp LED or visible light) from bottom to top vertical irradiation to sample 8 to be processed, through the photoimagings of sample to be processed 8 surface reflections behind camera lens on (flawless) ccd video camera of (optical tube length is 160mm).Ccd video camera is transferred to image in monitor or the computer 12.In monitor or computer 12, can monitor the processing situation in real time.The parallel process technology of ultra-short pulse laser has improved working (machining) efficiency, does not have manufacturing deficiencies such as the thing of splashing down, re cast layer, micro-crack simultaneously.
Operation principle of the present invention: the principle with ultra-short pulse laser processing high temperature alloy is the electromagnetic radiation time of utilizing ultra-short pulse laser extremely short, and it is very high that the electron temperature of material is risen in a short period of time, directly launches COULOMB EXPLOSION or microexplosion; And the energy that electronics obtains has little time to be transferred to the material grid, so the temperature of grid is very low, almost maintains room temperature, and the fuel factor that can not launch hot melt and so on melts.The result is the processing of material, comprises not fanning the air, cutting producing fuel factor, and material processed does not have metallurgical imperfection, does not have micro-crack yet.
Claims (10)
1, the parallel micro-processing method of a kind of ultra-short pulse laser, it may further comprise the steps:
1] prepares sample to be processed: sample to be processed (8) is installed on the processing platform;
2] produce the ultra-short pulse laser bundle: by ultra-short pulse laser system (14) output one ultra-short pulse lasers;
3] generate the laser that multi beam is dispersed: this ultra-short pulse lasers becomes the ultra-short pulse laser that multi beam is dispersed through microlens array (13);
4] generate a plurality of laser spots: the ultra-short pulse laser that this multi beam is dispersed by focusing system (7) focus on sample to be processed (8) corresponding in the focal plane, form a plurality of focuses and process.
2, the parallel micro-processing method of ultra-short pulse laser according to claim 1 and 2, it is characterized in that: the step of a plurality of laser spots of described generation is specially:
The multi beam ultra-short pulse laser is reflected by 45 degree laser total reflective mirrors (5), again by focusing system (7) focus on sample to be processed (8) correspondence in the focal plane, go and process into a plurality of focuses.
3, the parallel micro-processing method of ultra-short pulse laser according to claim 1 and 2, it is characterized in that: the parallel micro-processing method of described ultra-short pulse laser also comprises processing and the localization step that monitors sample to be processed: lighting source (1) is shone on the sample to be processed (8), and video camera (3) is transferred to manuscript picture on the focusing system (7) and location situation on the monitor.
4, the parallel micro-processing method of ultra-short pulse laser according to claim 3 is characterized in that: the parallel micro-processing method of described ultra-short pulse laser also comprises the step that the control processing platform moves when generating a plurality of laser spot.
5, the parallel little process equipment of a kind of ultra-short pulse laser, comprise the ultra-short pulse laser system (14) that can produce the ultra-short pulse laser bundle, processing platform and the surveillance that can fix sample to be processed (8), it is characterized in that: it also comprises microlens array (13) and the focusing system (7) that is successively set on the laser beam transmit direction, and the focus of described focusing system (7) is on the sample to be processed (8) on the processing platform.
6, the parallel little process equipment of a kind of ultra-short pulse laser according to claim 5, it is characterized in that: it comprises that also being arranged on 45 on the laser beam transmit direction spends laser total reflective mirror (5), and described focusing system (7) is arranged on the reflection direction of 45 degree laser total reflective mirrors (5).
7, the parallel little process equipment of a kind of ultra-short pulse laser according to claim 6 is characterized in that: the lighting source (1) that described surveillance comprises video camera (3), monitor, be arranged in parallel with ultra-short pulse laser system (14), be arranged on the lighting source semi-transparent semi-reflecting lens (4) directly over the 45 degree laser total reflective mirrors (5).
8, a kind of ultra-short pulse laser according to claim 7 little process equipment that walks abreast, it is characterized in that: it also comprises metal cylinder (6), described lighting source semi-transparent semi-reflecting lens (4) is arranged on metal cylinder (6) inner and upper, described 45 degree laser total reflective mirrors (5) are arranged on the inner below of metal cylinder (6), be correspondingly provided with the circular hole that can see through laser beam and lighting source respectively on the lateral surface of described metal cylinder (6), described ultra-short pulse laser system (14) and lighting source (1) are set in parallel in the outside of metal cylinder (6), described processing platform is arranged on the bottom of metal cylinder (6), and described video camera (3) is arranged on the upper end of metal cylinder (6).
9, according to claim 5 or the parallel little process equipment of 6 or 7 or 8 described a kind of ultra-short pulse lasers, it is characterized in that: described processing platform comprises hollow specimen platform (9), three-dimensional mobile platform (10), computer (12) and electric cabinet (11), described sample to be processed (8) is installed on the hollow specimen platform (9), and described hollow specimen platform (9) is installed on the three-dimensional mobile platform (10).
10, the parallel little process equipment of a kind of ultra-short pulse laser according to claim 9, it is characterized in that: described ultra-short pulse laser system (14) is a fs-laser system, described 45 degree laser total reflective mirrors (5) are 800nm45 degree laser total reflective mirror; Described focusing system (7) is F-θ scanning lens or microcobjective; Described lighting source (1) is the general visible source, comprises the LED of White LED, Halogen lamp LED or visible light.
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| CN101890575A (en) * | 2010-07-14 | 2010-11-24 | 中国科学院上海光学精密机械研究所 | Dammann grating-based femtosecond laser parallel micromachining device with real-time monitoring function |
| CN102059451A (en) * | 2010-11-08 | 2011-05-18 | 北京理工大学 | Nano-femtosecond dual-laser composite machining system |
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| CN101890575A (en) * | 2010-07-14 | 2010-11-24 | 中国科学院上海光学精密机械研究所 | Dammann grating-based femtosecond laser parallel micromachining device with real-time monitoring function |
| CN102059451A (en) * | 2010-11-08 | 2011-05-18 | 北京理工大学 | Nano-femtosecond dual-laser composite machining system |
| CN102208530A (en) * | 2011-03-03 | 2011-10-05 | 江苏多维科技有限公司 | Single-chip magnetic sensor, and laser heating-assisted annealing apparatus thereof and laser heating-assisted annealing method thereof |
| CN103857490B (en) * | 2011-06-29 | 2016-01-20 | 通快激光与系统工程有限公司 | For method and the laser processing device of defect during identifying laser processing procedure |
| US9501821B2 (en) | 2011-06-29 | 2016-11-22 | Trumpf Laser-Und Systemtechnik Gmbh | Method for detecting defects during a laser-machining process and laser-machining device |
| CN103857490A (en) * | 2011-06-29 | 2014-06-11 | 通快激光与系统工程有限公司 | Method for detecting defects in a non-linear weld seam or a non-linear cutting gap during a laser-machining process, and corresponding laser-machining device |
| CN102319958A (en) * | 2011-08-19 | 2012-01-18 | 南京理工大学 | Pulse laser cutting method for fragile materials |
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| CN103317228A (en) * | 2013-07-09 | 2013-09-25 | 北京工业大学 | Simultaneous monitoring device for femtosecond laser micromachining |
| CN104439699A (en) * | 2014-10-27 | 2015-03-25 | 中国科学院理化技术研究所 | System and method for preparing micro-nano array structure by means of laser light |
| CN109414790A (en) * | 2016-06-22 | 2019-03-01 | 通快激光与系统工程有限公司 | Method and apparatus for determining the reference focus orientation of the beam of the lathe based on beam by a sequence for executing test cutting on workpiece |
| CN110035864A (en) * | 2016-12-12 | 2019-07-19 | 住友重机械工业株式会社 | Laser pulse cuts out device and laser processing |
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| CN110421263B (en) * | 2019-07-09 | 2021-01-22 | 湖南工业大学 | Fine correction method for face gear |
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