TW201039460A - Method of manufacturing solar cell - Google Patents

Method of manufacturing solar cell Download PDF

Info

Publication number
TW201039460A
TW201039460A TW098144619A TW98144619A TW201039460A TW 201039460 A TW201039460 A TW 201039460A TW 098144619 A TW098144619 A TW 098144619A TW 98144619 A TW98144619 A TW 98144619A TW 201039460 A TW201039460 A TW 201039460A
Authority
TW
Taiwan
Prior art keywords
semiconductor layer
laser
transparent conductive
solar cell
layer
Prior art date
Application number
TW098144619A
Other languages
English (en)
Other versions
TWI413271B (zh
Inventor
Jeong-Woo Lee
Seong-Kee Park
Kyung-Jin Shim
Tae-Youn Kim
Won-Seo Park
Original Assignee
Lg Display Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Display Co Ltd filed Critical Lg Display Co Ltd
Publication of TW201039460A publication Critical patent/TW201039460A/zh
Application granted granted Critical
Publication of TWI413271B publication Critical patent/TWI413271B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/20Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
    • H01L31/202Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic System
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0236Special surface textures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0236Special surface textures
    • H01L31/02363Special surface textures of the semiconductor body itself, e.g. textured active layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0392Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
    • H01L31/03921Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate including only elements of Group IV of the Periodic System
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
    • H01L31/075Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PIN type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
    • H01L31/078Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier including different types of potential barriers provided for in two or more of groups H01L31/062 - H01L31/075
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
    • H01L31/182Special manufacturing methods for polycrystalline Si, e.g. Si ribbon, poly Si ingots, thin films of polycrystalline Si
    • H01L31/1824Special manufacturing methods for microcrystalline Si, uc-Si
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1884Manufacture of transparent electrodes, e.g. TCO, ITO
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/545Microcrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/548Amorphous silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Description

201039460 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種太陽能電池,特別是關於一種能夠改善太 · 陽能電池之電光特性並使太陽能電池之效能最大化的太陽能電池 之製造方法。 【先前技術】 太%此電池係為·一種可將太陽能轉化為電能的半導體裝置。 太陽能電池包含透過將P型半導體與n型半導體相互接觸地接合 〇 在一起所形成的接面並且具有二極體之基本結構。 通常,太陽能電池包含一 ρ-η接面半導體層之結構,在此ρ_η 接面半導體層之結構中,- ρ型半導體層與一 η型半導體層係設 置於相對的電極之間。 為了太陽能電池之光電能量轉換,電子係不對稱地存在於ρ_η 接面半導體層之結構中。也就是說,在ρ·η接面半導體層之結構 中’η型半導體層具有高電子密度及低電洞密度,而ρ型半導體層lj 則具有低電子密度及高電洞密度。因此,在熱平衡狀態下,由於 ρ η接面半導體射載流子之密度不同所狀的擴散將導致電荷 不均衡。於此相應地是’將感生出一電場,並且將不存在更多的 載流子之擴散。於此同時’當具有大於帶隙能量之能量的光線照 射到ρ-η接面半導體層上時,接收到能量的電子將從價帶被激發至_ 導帶’亚且價帶中將產生電洞,上述帶雜量係為導帶與價帶之 4 201039460 間的能量差。激發至導帶的電子可以自由地運動。如上所述所產 生的自由電子及電洞可被稱為過剩載流子,並且此過剩載流子可 透過於價帶或導帶中的密度差異而被擴散。這裡,過剩載流子, 即’在p型半導體層中激發的電子及n型半導體層中產生的電洞 係被稱為少數載流子,而在接合之前p型及n型半導體層中的載 流子,即,P型半導體層中的電洞及n型半導體層中的電子係被稱 為多數載流子。多數載流子之流動係由於電場之能量叠而被阻 塞。但p型半導體層中的少數載流子,如電子可移動至η型半導 體層。少數載流子的擴散會導致ρ_η接面半導體層中的電位降。當 ρ-η接面半導體層連接至外部電路時,由於接面半導體層之兩 端會產生電動勢,因此其可作為電池來加以使用。 因此,太陽能電池進一步包含位於ρ_η接面半導體層之外表面 上的透明電極及後部電極。透明電極具有一粗糙表面以使得從外 q 部光源發出的光線能夠有效地提供至ρ-η接面半導體層。 第1Α圖」至「第1F圖」為習知技術之太陽能電池之製造 方法的步驟示意圖。 在「第1Α圖」巾,透明導電層4係透過在攝氏3⑻至_ 度的溫度下使用喷鑛設備(附圖中未示出)沈積一透明導電氧化 物(TCO) ffij得⑽成於透明絕緣的基板!之幾乎整個表面上。 於此同時,透過在高溫下使用喷錄方法沈積透明導電氧化物係伴 有部分結晶過程,並且透明導電層4可隨意地包含微結晶部分以 5 201039460 及介於結晶部分之間的非結晶部分。 在第1B圖」令,凸起及凹陷圖案6係透過將包含有透明導 電曰之基板1次入填充有餘刻劑之姓刻槽(附圖中未示出)中 或者透過於透明導電層4上喷塗_劑而形成於透明導電層4之 表面上,顧_可與透哪電氧化物發生化學反應。這裡,將 透明導電層4曝露於_射的時間可以被献地控制,並使得 透明導電層4不會被完全钱刻。透明導電層4之表面的某歸面 係被_ ’而透明導電層4之表面的其它部分則不會被侧,藉 以於透明導電層4之表面上形成凸起及凹陷圖案6。此外,由於社 晶部部分之_異,凸缺凹_ 6 _更加凸^ 起或者凹陷。 丄/「第1C圖」中,係透過用雷射器(附圖中未示出)將雷射 先束照射至包含有凸起及凹陷圖案6之透明導電層4上藉以對「第 1B圖」之透卿電層4進行_化加工,且進而在每-單元電池 :形成透明電極8。位於一個單元電池中的透明電極8係與下一個 早几電池中的一個透明電極間隔-定距離。 雜質=半m —n型半導體層1G係透過沈積具有η型 整個表軸純料翻紐8之铖1的幾乎 10與p型半導體層15係構成p n接面半導體層邡。 曰 201039460 在「第1E圖」中,p_n接面半導體層2〇係透過使用雷射器(附 圖中未示出)將雷射光束照射至p_n接面半導體層2〇上進而被圖 案化加工。 在第1F圖」中’係透過在㈣接面半導體層之表面上 方沈積金屬材料並對其進行圖案化加工,進而於p_n接面半導體層 20之上形成後部電極3〇。至此,—太陽能電池$㈣加工完成。 然而,在太陽能電池50中,凸起及凹陷圖案6係較小且無規 〇 「第2圖」為習知技術之太陽能電池之放大部分的剖視圖。 在第2圖」中,係透過對結晶部分及非結晶部分使用不同的餘 刻速率雜刻透明導電層4進而形成凸起及凹陷圖案6,結晶部分 及非結晶部分係形成於透明導電材料被沈積之時。這裡,結晶部 分係隨意地設置’並且錢行微結晶化過程。因此,凸起及凹陷 圖案6非常的小’且凸起及凹關案6之侧面斜角相對於基板】 來說是不細的。耻,㈣基板1之表面的讀絲不能被有 效地政射’且太I%·此電池5〇之效能較低。 【發明内容】 因此’鑒於以上的問題,本發明在於提供一種太陽能電池之 裝方法係、I夠從實質上克服由於上述習知技術之局限及缺點 而導致的一個或多個問題。 本發明之-目的在於提供—種太陽能電池之造綠,係能夠 7 201039460 有效地吸收外部光線並使太陽能電池之效能最大化 本發月之其他特徵及優點將在如下的說明書中部分地加以蘭 述,並且本發_這些龍及優點可以透過本發明如下的說明得 以部分地理解或者可以從本發明的實踐中得出。本發明的這些和 其他優點可以透過本發賴記__書與申請翻範圍以及附 圖中所特別指明的結構得以實現和獲得。 為了實現本發日_這些及其它優點且依照本發明之目的,現 對本發明作具體化和概括性地描述,本發明之-種太陽能電池之 製造方法’係包含町㈣:透過在室溫下於基板上沈積透明導 電氧化物祕基板上形成透明導電層;透過使用第—雷射器將雷 射光束照射至透料電層進而使_導電層結晶化;選擇性地姓 刻結晶化之透明導電層藉以於結晶化之透明導電層之表面上形成 凸起及凹職,透過圖案化加工具有祕及凹_案之透明導 電層而於單元電池中形成透㈣極;於透魏極上形成p_n接面半 導體層並贿化加卫此ρ·η接面半導縣·以及透過於圖案化加工 '的Ρ接面半導體層上形成金屬材料層並圖案化加工此金屬材 料層進而糊案化加I後的ρ_η接面半導體層上形紐部電極,此 後部電極係與單元電池相對應。 可以理解的疋,如上職的本發明之概括說明和隨後所述的 本發明之詳細酬均是具有代紐和解雜的·,並且是為了 進一步揭示本發明之申請專利範圍。 201039460 【實施方式】 現在,將結合附圖所示之實例對本發明之一實施例進行詳細 描述。 「第3A圖」至「第3G圖」為本發明一典型實施例之太陽能 電池之製造方法的步驟示意圖。 在「第3A圖」中,透明導電層1〇4係透過在室溫下使用喷鍍 設備(附圖中未示出)沈積透明導電氧化物(TC〇)而形成於透 明絕緣的基板101之幾乎整個表面之上。透明導電層具有一 平滑表面。透明導電氧化物可包含Sn〇:X或Ζη〇:χ ,其中χ係為 -種金屬材料,例如:鐘、鎮、鎳、料。基板⑻可為玻璃基 板或塑料基板。 也就是說,在習知技術中,透明導電層係於攝氏3〇〇至6〇〇 度的高溫下形成,以使得透明導電層具有結晶部分與非結晶部 ◎分,而在本發日种,透明導電層lG4係透過倾方法在室溫下形 成。這蚊為何透明導電層lG4之表面隨後將被結晶化的原因。 在「第3B圖」巾’雷射器190係設置於透明導電層1〇4之上 方,並且雷射光束LB係在室溫下被照射至透明導電層1〇4之表面 上。透明導電層104將從其表面以預定之厚度被熔化並隨後被固 ’化’且透明導電層1〇4將部分地被結晶化。這裡,雷射器19〇優 選為紅外㈤雷射器藉以迅速地炫化透明導電材料。雷射器· 之雷射光束LB具有1〇64奈米之波長,並且具有5w至麗之功 9 201039460 率及40ΚΗζ至60ΚΗζ之頻率。如果雷射器19〇之功率大於1〇w, 那麼雷射光束LB在每單位面積上將具有過強的功率,並且在透明 導電層104之表面被結晶化之前,透明導電層1〇4就會被汽化和 去除。 如此’具備最佳條件的f射光束LB將被騎至透明導電層 104之表面上’並且透明導電層1〇4之表面將被結晶化藉以形成多 個顆粒(賴巾未示出)。這些顆粒可錢料電層1()4之整個表 面上具有均一的尺寸大小。 在「第3C圖」巾’凸起及凹陷圖案1〇6係透過將包含具有結 晶化表面的透明導電層1()4之基板1(H浸入填充有可與透明導電 氧化物發生反應的蝕刻劑之蝕刻槽(附圖中未示出)中,或者透 過在透明導電層H)4之結晶化表面之上錢_劑,進而形成於 透明導電層104之表©上。賴,將翻導電層1()4曝露於姓刻 劑中的時職被適當地加以控制,並且翻導電層1G4係不會被 完全钮刻。透明導電層1〇4之表面的某些部分將被侧,而透明 導電層1G4之表_其它部分將不會被_,藉以在透明導電層 收之表面上形成凸起及凹關案。在顆粒之間邊界部分上二 餘刻速率與顆粒上的侧速率不同。對邊界部分的_要快於對 顆粒的_。侧將_粒0為基礎向著每—難的邊緣逐步 進行,並且凸起及凹關案1G6係幾乎形成於具有均_尺寸的^ 顆粒中。凸起及凹陷圖案106可具有均一的尺寸大小。 201039460 請參考「第4圖」’此圖為本發明之太陽能電池之放大部分的 剖視圖,與「第2圖」所示之凸起及凹陷圖案6相比,「第4圖」 之凸起及凹關案係較大且尺寸均一。此外,凸起及凹陷圖案ι〇」6 之侧面斜角相對於基板1G1是—致的。因此,能夠有效地防止光 線被全反射。進而使光線擴散率增加,且光線吸收率提高。 同時’凸起及凹陷圖案1〇6之高度以及相對於基板⑼的凸 起及凹陷圖案1〇6之侧面斜角能夠透過控制將透明導電層⑽曝 露於侧劑中的時間而加以調節。在習知技術中,由於透明導電 層在高溫下形錢且包含微結晶較鱗結晶部分,透過酬微 結晶部分鱗結晶部分形成的凸歧凹關案具有各種不同的尺 寸。因此,其很難透過控繼刻時間來調整相對於基板的凸起及 凹陷圖案之侧面斜角。然而,在本發明中,由於透過「第犯圖」 之雷射器190被結晶化的顆粒具有均一的尺寸大小因此其能夠 ❹透過控伽刻時間來調整相對於基板1〇1的凸起及凹陷圖案⑽ 之側面斜角。 〃 在「第3D圖」中,「第3C圖」之透明導電層1〇4係透過使 用雷射器(附圖中未示出)將雷射光束照射至包含凸起及凹陷圖 案106之透明導電層1〇4進而被部分地去除並被圖案化加工,並 ’且由此在每-單元電池中形成透明電極108。在-個單元電池中的 透㈣極1G8係與下-個單元電池中的—個透明電極間隔一定距 離。謂,上述雷射器可為紅外雷射器,且在此情形中,該紅外 11 201039460 雷射器可具有12W至20W的功率。當此雷射器之功率小於12w 時,更具體地說,小於10W時,透明導電層104可被熔化並被結 晶化,並且透明導電層1〇4可不被去除。 在「第3E圖」中,η型半導體層110係透過沈積具有11型雜 質之半導體材料而形成於包含透明電極1〇8之基板101的幾乎整 個表面之上。隨後,ρ型半導體層115係透過沈積具有ρ型雜質之 半導體材料而形成於η型半導體層no之上。η型半導體層u〇與 Ρ型半導體層115構成ρ-η接面半導體層12〇。於此同時,一本征 非晶半導體層,例如,一本征非晶矽層可進一步形成於η型半導 體層110與ρ型半導體層U5之間。 在「第3F圖」中,ρ_η接面半導體層12〇係透過使用雷射器 (附圖中未不出)將雷射光束(附圖中未示出)照射至ρ_η接面半 導體層120進而被圖案化加工。經圖案化加工後的接面半導體 層120具有不與透明電極咖之端部相重合的端冑,並且如參考 ‘號123所不,透明電極1〇8係曝露於相鄰的接面半導體層 之間。也就是說,透明電極1〇8之邊界不與ρ_η接面半導體層 之邊界相重疊並且不同於ρ_η接面半導體層12〇之邊界。用於 圖案化加工ρ_η接面半導體層12()之雷射器概於用以圖案化加工 透月導1:層1G4之雷射器,其具有較大的功率。用以圖案化加工 ^接面半導體層12〇之雷射器的雷射光束可具有奈米至猶 不来之波長。用以圖案化加工p_n接面半導體層12〇之雷射器可為 12 201039460 準分子雷射n細s猶硕射器。具有19Q奈米至观奈米之 波長的準分子雷射器或紀紹石梅石雷射器之雷射光束由於透明 ⑽魏具有獨波長的㈣縣,因料會料透明電極 在「第3G圖」中,後部電極13〇係透過在p n接面半導體層 120之整個表面上方沈積金屬材料並對其進行_化加工進而妒 成於P-n接面半導體層⑼之上。此金屬材料可為具有較高反射率 的域者齡金。至此,太陽能電池i5G得以製造完成。 喊’所沈積的金屬材射透過照射#射綠或者透過執行 光刻製程而被圖案化加工,此光刻製程中包含施加光阻劑至一薄 膜’將光剛曝露於光針,將曝光後的光_顯影以及餘刻此 薄膜之步驟。 同時,當後部電S 130被圖案化加工時,p_n接面半導體層12〇 3也被圖案化加工,並且透明· 1〇8將被曝露。後部電極14〇係 如圖中所示觀案化加卫以使得從單元電池巾料部光線所產生 的電動勢被串聯。太陽能電池150包含許多單元電池,並且每一 單元電池中的電動勢非麵低且不_於電子設備。因此,一個 單元電池的後部電極130係與下一個單元電池的透明電極1〇8相 連接。多個單元電池的電動勢被串聯連接,並且能夠使用相對高 的電壓。 在本發明之太陽能電池中,由於透明電極之凸起及凹陷圖案 13 201039460 相比於習知技術具有均一的和較大的尺寸,因此能夠有效防止入 射光線之全反射,進而能夠使入射到p-η接面半導體層上的光線量 敢大化。而且,吸收光線之能力也被最大化,且提高了太陽能電 池之效能。此外,由於透明電極之結晶化表面,因而透明電極具 有改善的透射率及内部和接觸電阻,因此太陽能電池之效能被進 一步提高。 雖然本發明以前述之實施例揭露如上,然其並非用以限定本 發明。任何熟習相像技藝者,在不脫離本發明之精神和範圍内, 所為之更動與潤飾,均屬本發明之專利保護範圍。關於本發明所 界定之保護範圍請參考所附之申請專利範圍。 【圖式簡單說明】 第1A圖至第1F圖為習知技術之太陽能電池之製造方法的步 驟示意圖。 第2圖為習知技術之太陽能電池之放大部分的剖視圖。 第3A圖至第3G圖為本發明一典型實施例之太陽能電池之製 造方法的步驟示意圖。 第4圖為本發明之太陽能電池之放大部分的剖視圖。 【主要元件符號說明】 1 ...........................基板 4 ...........................透明導電層 6 ............................起及凹陷圖案 201039460 8 ...........................透明電極 10...........................η型半導體層 15...........................ρ型半導體層 20...........................ρ-η接面半導體層 30...........................後部電極 50...........................太陽能電池 101..........................基板
104..........................透明導電層 106..........................凸起及凹陷圖案 108..........................透明電極 110..........................η型半導體層 115..........................ρ型半導體層 120..........................ρ-η接面半導體層 130..........................後部電極 150..........................太陽能電池 190..........................雷射器 LB...........................雷射光束 15

Claims (1)

  1. 201039460 七、申請專利範圍: 1. 一種太陽能電池之製造方法,係包含: 透過在室溫n板上沈積—物導電氧化物而於該 基板上形成一透明導電層; 透過使H雷射ϋ將-雷射光束照射至該透明導電 層進而使該透明導電層結晶化; 選擇性地姓刻該結晶化之透明導電層藉以於該結晶化之 透明導電層之表面上形成多個凸起及凹陷圖案; 透過圖案化加工具有該等凸起及凹關案之該結晶化之 透明導電層而於多個單元電池中形成多個透明電極; 於該等透明電極上形成- Ρ_η接面半導體層並圖案化加工 該ρ-η接面半導體層;以及 透過於圖案化加工後的該ρ_η接面半導體層上形成一金屬 材料層並圖案化加卫該金屬材料層進而於圖案化加工後的該 Ρ-η接面轉體層上形成夠後部電極,該等後部電極係與該 專早元電池相對應。 2.如請求項第i項所述之太陽能魏之製造方法,其巾該透明導 電氧化物包含Sn0:X或Zn0:X中的一種,其中χ係為一金屬 材料。 3·如請求鄉丨項所述之太陽能魏之製造方法,其中該第一雷 射器係為—紅外雷射器,該紅外雷射器具有40KHZ至60KHz 16 201039460 之頻率’ 5W至聽之功率並且能夠產生一具有蘭奈米之 波長的雷射光束。 4. 如凊求項第1項所述之太陽能電池之製造方法,其中圖案化加 工該結晶化之透明導電層係包含使用一功率大於12W之第二 雷射器發射一雷射光束。 5. 如請求項第4項所述之太陽能電池之製造方法,其中該第二雷 射器係為一紅外雷射器。 6. 如請求項第4項所述之太陽能電池之製造方法,其中圖案化加 工該P-n接面半導體層係包含使用一功率大於該第二雷射器之 第三雷射器發射一雷射光束。 7. 如請求項第6項所述之太陽能電池之製造方法,其中該第三雷 射器係為準分子雷射器及釔鋁石榴石雷射器中的一種,該第三 雷射器係能夠產生一具有190奈米至308奈米之波長的雷射光 束。 8. 如請求項第1項所述之太陽能電池之製造方法,其中圖案化加 工該P-n接面半導體層係包含曝露出相鄰的經圖案化加工後的 P-n接面半導體層之間的該等透明電極。 9. 如請求項第8項所述之太陽能電池之製造方法,其中圖案化加 工該金屬材料層係包含選擇性地去除經圖案化加工後的p_n接 面半導體層並曝露出介於相鄰後部電極之間的該等透明電極。 如請求項第9項所述之太陽能電池之製造方法,其中位於一個 17 201039460 單元電池中的該透 單元電池中的該後部電極係與位於下一個 明電極相接觸。 11.如請求項第1項所述之太陽能電池之製造方法,其中形成气 接面半導體層係包含於鱗翻t極之上形成—P科導體7 以及於該p型半導體層之上形成一n型半導體層。 日
    12·如請求項第11項所述之太陽能電池之製造方法,其中形成1 P-η接面半導體層係還包含於該p鮮導體層與該η型半導 層之間形成一本征非晶半導體層。 13’如凊求項第1項所述之太陽能電池之製造方法,其中圖案々 工該金屬材料層係包含發射一雷射光束或者執行一光夕 程二該光刻製程中包含施加光阻劑至一薄膜,將該光阻气竭 於光線中,將曝光後的光阻劑顯影以及蝕刻該 4 步驟, 18
TW098144619A 2009-04-17 2009-12-23 太陽能電池之製造方法 TWI413271B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090033806A KR20100115193A (ko) 2009-04-17 2009-04-17 태양전지의 제조방법

Publications (2)

Publication Number Publication Date
TW201039460A true TW201039460A (en) 2010-11-01
TWI413271B TWI413271B (zh) 2013-10-21

Family

ID=42958614

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098144619A TWI413271B (zh) 2009-04-17 2009-12-23 太陽能電池之製造方法

Country Status (5)

Country Link
US (1) US8173483B2 (zh)
JP (1) JP5474525B2 (zh)
KR (1) KR20100115193A (zh)
CN (1) CN101866979B (zh)
TW (1) TWI413271B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8563351B2 (en) * 2010-06-25 2013-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method for manufacturing photovoltaic device
EP2469603A1 (en) * 2010-12-27 2012-06-27 Centre National de la Recherche Scientifique Improved method for manufacturing a photovoltaic device comprising a TCO layer
KR20120085571A (ko) * 2011-01-24 2012-08-01 엘지이노텍 주식회사 태양 전지
KR101283140B1 (ko) * 2011-01-26 2013-07-05 엘지이노텍 주식회사 태양전지 및 이의 제조방법
KR101774278B1 (ko) 2011-07-18 2017-09-04 엘지디스플레이 주식회사 플렉서블 표시장치의 제조방법
KR101517077B1 (ko) * 2014-05-23 2015-05-04 인천대학교 산학협력단 고성능 투명 전극 소자 및 그 제조 방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831611B2 (ja) * 1987-04-15 1996-03-27 三洋電機株式会社 光起電力装置の製造方法
JPH04242931A (ja) * 1990-12-29 1992-08-31 Kyocera Corp 半導体素子の製造方法
JP2974485B2 (ja) * 1992-02-05 1999-11-10 キヤノン株式会社 光起電力素子の製造法
JPH06140650A (ja) * 1992-09-14 1994-05-20 Sanyo Electric Co Ltd 透光性導電酸化膜の改質方法とこれを用いた光起電力装置の製造方法
DE4315959C2 (de) * 1993-05-12 1997-09-11 Max Planck Gesellschaft Verfahren zur Herstellung einer strukturierten Schicht eines Halbleitermaterials sowie einer Dotierungsstruktur in einem Halbleitermaterial unter Einwirkung von Laserstrahlung
JP3819632B2 (ja) * 1999-04-07 2006-09-13 三洋電機株式会社 光電変換素子及びその製造方法
US6509204B2 (en) * 2001-01-29 2003-01-21 Xoptix, Inc. Transparent solar cell and method of fabrication
JP4183394B2 (ja) * 2001-03-13 2008-11-19 三洋電機株式会社 光起電力装置の製造方法
JP4438381B2 (ja) * 2003-11-05 2010-03-24 株式会社ブリヂストン 結晶性ito膜、ito膜の結晶化方法、透明導電性フィルム、タッチパネル及び色素増感型太陽電池
JP5099616B2 (ja) * 2005-10-28 2012-12-19 旭硝子株式会社 回路パターン付き透明基板の製造方法
CN100543943C (zh) * 2005-12-22 2009-09-23 三井金属矿业株式会社 氧化锌系透明导电膜的图案化的方法
JP5068475B2 (ja) * 2006-04-24 2012-11-07 昭和電工株式会社 窒化ガリウム系化合物半導体発光素子の製造方法及び窒化ガリウム系化合物半導体発光素子、並びにランプ
JP4231967B2 (ja) * 2006-10-06 2009-03-04 住友金属鉱山株式会社 酸化物焼結体、その製造方法、透明導電膜、およびそれを用いて得られる太陽電池
US8420978B2 (en) * 2007-01-18 2013-04-16 The Board Of Trustees Of The University Of Illinois High throughput, low cost dual-mode patterning method for large area substrates
FR2923221B1 (fr) * 2007-11-07 2012-06-01 Air Liquide Procede de depot par cvd ou pvd de composes de bore
KR100882140B1 (ko) * 2008-03-19 2009-02-06 한국철강 주식회사 마이크로결정 실리콘 태양전지 및 제조방법
CN101404307A (zh) * 2008-10-29 2009-04-08 中山大学 一种多晶硅太阳电池绒面制作方法

Also Published As

Publication number Publication date
TWI413271B (zh) 2013-10-21
US20100267193A1 (en) 2010-10-21
JP2010251704A (ja) 2010-11-04
US8173483B2 (en) 2012-05-08
CN101866979B (zh) 2012-05-23
JP5474525B2 (ja) 2014-04-16
KR20100115193A (ko) 2010-10-27
CN101866979A (zh) 2010-10-20

Similar Documents

Publication Publication Date Title
AU2001291812B2 (en) Method for producing a semiconductor-metal contact through dielectric layer
JP5469889B2 (ja) 光電変換装置の製造方法
KR100847741B1 (ko) p-n접합 계면에 패시베이션층을 구비하는 점 접촉 이종접합 실리콘 태양전지 및 그의 제조방법
JP2022501837A (ja) 結晶シリコン太陽電池およびその製造方法
JP2019110309A (ja) 差異化されたp型及びn型領域構造を有する太陽電池エミッタ領域の製造
US20110000532A1 (en) Solar Cell Device and Method of Manufacturing Solar Cell Device
TW201039460A (en) Method of manufacturing solar cell
JP2004508719A (ja) ガラス基板に堆積した多結晶質のレーザーで結晶化されたシリコン薄層太陽電池
US20120180860A1 (en) Solar cell and method for manufacturing the same
TW201212255A (en) Photoelectric conversion device and manufacturing method thereof
JP2016122749A (ja) 太陽電池素子および太陽電池モジュール
TWI401810B (zh) 太陽能電池
JP5734447B2 (ja) 光起電力装置の製造方法および光起電力装置
KR20090017760A (ko) 태양전지의 기판 및 그 제조방법
TW201440235A (zh) 具有加強射極層之背接面太陽能電池
JP2024003258A (ja) 太陽電池用整合メタライゼーション
CN116053332A (zh) 一种背接触式硅异质结太阳能电池及其制备方法
TW201101526A (en) Photodiode manufacturing method and photodiode
JPH07106612A (ja) 光電変換装置の製造方法
KR101507767B1 (ko) 태양 전지 제조 방법
TWM542861U (zh) 太陽能電池
RU2444088C2 (ru) Полупроводниковый фотоэлектрический преобразователь и способ его изготовления (варианты)
TW201003957A (en) Thin film photovoltaic cell module and method for manufacturing the same
KR101203007B1 (ko) 태양 전지 및 이의 제조 방법
CN117810310A (zh) 太阳能电池制备方法、太阳能电池及光伏组件

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees