201038164 六、發明說明： 【發明所屬之技術領域】 本發明係主張於2009年4月14日所提出之韓國專利申 請第10-2009-0032249號優先權’其標題為「用以製備基板 且其内容均併入 之載板構件及使用其製備基板之方法 本發明以供參酌。[Technical Field] The present invention claims the priority of Korean Patent Application No. 10-2009-0032249, filed on Apr. 14, 2009. The present invention is for the purpose of considering the carrier member incorporating the contents and the method of preparing the substrate using the same.
本發明係關於一種用以製備基板之載板以及使用該載 板製備基板之方法，尤指一種用以製備基板之載板以及使 用該載板製備基板之方法，其可適用於基板增層製程。 【先前技術】 一般而言，印刷線路板之組成方法，係使用任一埶固 性合成樹脂所製備之基板，於其—側或兩側以銅薄膜線路 化，而後再於基板上裝設IC或電子元件，使IC或電子元件 與基板電性連接，最後再❹絕緣㈣將基板及電子元件 封裝而成。The present invention relates to a carrier for preparing a substrate and a method for preparing the substrate using the carrier, and more particularly to a carrier for preparing a substrate and a method for preparing the substrate using the carrier, which is applicable to a substrate build-up process . [Prior Art] In general, a printed circuit board is formed by using a substrate made of any tamping synthetic resin, and is lined with a copper film on its side or both sides, and then an IC is mounted on the substrate. Or an electronic component that electrically connects the IC or the electronic component to the substrate, and finally encapsulates the substrate and the electronic component by insulating (4).
—有赛於近年來電子產業㈣，對於輕巧之多功能電子 元件之需求急遽增加，因而必須製造出高積集度與薄型化 之印刷線路板，以裝設各種電子元件。 特別是，為了減少印刷線路板之厚度，可減少所製得 ，印刷線路板總厚度並縮短訊號處理時間之無核層基板已 又到两度矚目，以取代核心板之需求。 在 於製作無核層基板之製 製作過程中需使用一載板 程中，由於未使用核心板，故 ，以做為一支撐元件。 4 201038164 圖1A至IF係為習知使用載板製作無核層基板之製作 流程剖面示意圖。 如圖ία所示，首先係提供一銅板η，其包括鎳阻障層 13 ’該鎳阻障層13係形成在銅板11之一側。接著，如圖丄β 所示，使用一黏著層20將一對銅板11，31相互連接，使該黏 著層20位於該銅板11, 31間，而形成一載板。 如圖1C所示，使用蝕刻以於一對銅板1]t, 31上形成凸 塊凹槽15。如圖1D所示，於凸塊凹槽15中填充由焊錫材料 及相似材料所組成之凸塊17，而後於該一對銅板丨丨，3丨上形 成防知層1 8及線路層19。 如圖1E所示，於防焊層18及線路層19上形成附加之增 層40’而後透過切除製程將設置有黏著層2〇之層疊結構周 圍區域移除，以將一對印刷電路板分離。 如圖1F所示，將做為載板之銅板u，3丨及鎳阻障層13, 33選擇性移除，如此便提供一無核層印刷線路板。 於一般製程中，載板係用以做為一種於製作印刷線路 〇 板後移除之附加元件，且載板係由做為金屬母元件之銅板 11，31、以及由與銅板11，31具有不同材料之阻障層13, 33 所組成。因此，由於去除銅板丨丨，31及阻障層13, 33之蝕刻 液並不相同’故需使用兩種或以上之蝕刻液，且須進行兩 次或多次之蚀刻製程。 此外，於一般製程中，由於銅板U, 31係為一種在印刷 線路板製作後移除之附加元件，且無法回收重複使用，反 而造成製作成本增加。 5 201038164 【發明内容】 因此，本發明基於上述習知技術問題，而提供一種用 以製備基板之載板，其係使用便宜且可回收的材料。同時， 本發明亦提供使用此載板製備基板之方法。 於本發明之一實施態樣中，係提供一種用以製備基板 之載板，其包括：一母基板，其包括一硬質基板；以及一 脫模層，係設置在母基板之最外層，且該脫模層之第一側 係與母基板連接，而該脫模層之第二側係面向相對該母基 板之另一方向（不面向該母基板）。 母基板可包括一設置於硬質基板上之黏著層。 母基板可包括：一設置於硬質基板上之黏著層、以及 一嵌埋在黏著層之外部之脫離膜。 母基板可包括：一設置於硬質基板上之黏著層、以及 一嵌埋在黏著層之外部之金屬層。 脫模層之第一側可經過處理而具有親水性 (hydrophilicity)。 脫模層可為一泡棉膠帶。 脫離膜之表面面積可小於黏著層之表面面積， 黏著層之外周圍區域。 ^ 金屬層之表面面積可小於黏著層之表面面積以顯露 黏著層之外周圍區域。 ’ 於另-態樣中，本發明係提供一種印刷線路板之製備 方法’其包括步驟：㈧製備-載板，其包括一母基板以 及一脫模層，且脫模層係設置在母基板之最外層丨⑺）於 201038164 從載板上分離印 載板上增層形成—印刷線路板； 刷線路板。 脫模層之—侧可經過處理而具有親水性 脫模層可為一泡棉膠帶。 ηΓ中步驟⑻中增層形成印刷線路板可包括： 膜狀保護層；以及⑼㈣護廣上形成 ’、、曰以及一絕緣層’以增層形成印刷線路板。—In recent years, in the electronics industry (4), the demand for lightweight and versatile electronic components has increased rapidly. Therefore, it is necessary to manufacture printed circuit boards with high integration and thinness to install various electronic components. In particular, in order to reduce the thickness of the printed wiring board, the coreless substrate which can be produced, the total thickness of the printed wiring board and the shortened signal processing time has been twice noticed to replace the demand of the core board. In the manufacturing process of making a coreless substrate, a carrier plate is used, and since the core plate is not used, it is used as a supporting component. 4 201038164 FIG. 1A to FIG. IF are schematic cross-sectional views showing a process for fabricating a coreless substrate using a carrier. As shown in Fig. ία, first, a copper plate η is provided which includes a nickel barrier layer 13' which is formed on one side of the copper plate 11. Next, as shown in Fig. 丄, a pair of copper plates 11, 31 are connected to each other by an adhesive layer 20 so that the adhesive layer 20 is positioned between the copper plates 11, 31 to form a carrier. As shown in Fig. 1C, etching is used to form bump recesses 15 on a pair of copper plates 1]t, 31. As shown in Fig. 1D, the bump recess 15 is filled with a bump 17 composed of a solder material and a similar material, and then the anti-knowledge layer 18 and the wiring layer 19 are formed on the pair of copper plate turns. As shown in FIG. 1E, an additional buildup layer 40' is formed on the solder resist layer 18 and the wiring layer 19, and then the area around the laminated structure provided with the adhesive layer 2 is removed by a cutting process to separate a pair of printed circuit boards. . As shown in Fig. 1F, the copper plates u, 3, and the nickel barrier layers 13, 33 as carrier plates are selectively removed, thus providing a coreless printed circuit board. In the general process, the carrier is used as an additional component for removing the printed circuit board, and the carrier is made of a copper plate 11, 31 as a metal mother component, and has a copper plate 11, 31 The barrier layers 13, 33 of different materials are composed. Therefore, since the etching solution of the copper plate and the barrier layers 13, 33 are not the same, it is necessary to use two or more etching liquids, and two or more etching processes are required. In addition, in the general process, since the copper plate U, 31 is an additional component that is removed after the printed circuit board is manufactured, and cannot be recycled and reused, the manufacturing cost is increased. 5 201038164 SUMMARY OF THE INVENTION Accordingly, the present invention is based on the above-mentioned problems of the prior art, and provides a carrier for preparing a substrate which is inexpensive and recyclable. At the same time, the present invention also provides a method of preparing a substrate using the carrier. In one embodiment of the present invention, there is provided a carrier for preparing a substrate, comprising: a mother substrate including a rigid substrate; and a release layer disposed on an outermost layer of the mother substrate, and The first side of the release layer is connected to the mother substrate, and the second side of the release layer faces in the other direction opposite to the mother substrate (not facing the mother substrate). The mother substrate may include an adhesive layer disposed on the rigid substrate. The mother substrate may include: an adhesive layer disposed on the rigid substrate; and a release film embedded in the exterior of the adhesive layer. The mother substrate may include: an adhesive layer disposed on the rigid substrate; and a metal layer embedded in the exterior of the adhesive layer. The first side of the release layer can be treated to have hydrophilicity. The release layer can be a foam tape. The surface area of the release film may be smaller than the surface area of the adhesive layer, and the surrounding area outside the adhesive layer. ^ The surface area of the metal layer may be smaller than the surface area of the adhesive layer to reveal the surrounding area outside the adhesive layer. In another aspect, the present invention provides a method of preparing a printed wiring board, which comprises the steps of: (8) preparing a carrier plate comprising a mother substrate and a release layer, and the release layer is disposed on the mother substrate The outermost layer (7) of the outer layer of the printed board is separated from the carrier board at 201038164 to form a printed circuit board; The side of the release layer can be treated to have a hydrophilic release layer which can be a foam tape. The step of forming a printed wiring board in the step (8) in the step (8) may include: a film-like protective layer; and (9) (4) forming a ', 曰, and an insulating layer' on the cover to form a printed wiring board.
/方法中步驟（C)中分離印刷線路板可透過循徑 (routing)或加熱製程進行。 此方法可更包括：於步驟（C)之分離印刷線路板後，使 用雷射鑽孔，以於印刷線路板之保護層中形成一開口，以 顯露一連接端。 【實施方式】 本發明之目的、優點及特徵’可由下述實施例並參照 圖式’更加清楚明瞭。 ❹ 纟發明所用名詞及字彙之解釋，並不㈣—般字義或 字典上定義，而應根據發明人所做之適當字義概念定義， 依照本發明技術範圍相關之意義及概念解釋本發明所用之 名詞及字彙，藉此可對實施本發明者做最適當之方法描述。 接下來，本發明之具有球形焊料凸塊之印刷電路板， 將參照所附圖式加以詳細描述。於所附圖式中，係使用相 同圖式;};示號以標註相同或相似元件，並省略多餘之描述。 於下列敘述中，使用「上」、「下」以及相似字彙，以將 7 201038164 特定元件與其他元件區分，但此元件組成並不限定在這些 字彙中。 圖2係本發明實施例1之載板剖面示意圖。如圖中所 不，本實施例之載板係包括：一母基板丨〇()，其包括一硬質 基板110 ;以及一脫模層300，係設置在硬質基板11〇之兩 側，且每一脫膜層300之第一側均與母基板1〇〇連接，而第 二側係面向相對母基板〗〇 〇之另一方向（即不面向母基板）。 硬質基板110可由硬質材料製得，如金屬板或預浸材， 以在增層製程中支撐所增層之印刷線路板。例如，金屬板 可為銅板、鋁板、及相似金屬板，而預浸材可為環氧基預 /又材特別疋，硬質基板110之組成可為，但不限於〔硬質 絕緣材料，如環氧樹脂或修飾環氧樹脂、雙酚A樹脂、環氧 -祕接m、醯胺增強環氧樹脂、玻璃纖維增強環氧樹脂、 或紙纖維增強環氧樹脂。 脫模層300可為本技術領域常使用之薄膜形式之脫模 材料或是泡棉膠帶。薄卿式之脫模材料可為環氧基脫模 材料、或是氟乙稀樹脂脫模材料。在此，脫模層則可具有 一矽塗佈層（圖中未示）。 當脫模層300為-薄膜形式脫模材料，則每一脫模層 揭之第—側可透過表面處理，以增加脫模層扇第-側盘 f間之黏著力。在此，表面處； ^處理，且脫模層第—側可透過處理而具有親水性 例如，脫模層300可為塗佈有81基脫模劑 乙酯塑膠板。 201038164 泡棉膠帶可包括可發泡填充劑，其可在一預定溫度下 發泡而使泡棉膠帶可從母基板1〇〇上移除。例如，泡棉膠帶 可為一含有大量可發泡填充劑之PET(聚對笨二甲酸二乙酯） 膠帶。 圖3係本發明實施例2之載板剖面示意圖。如圖中所 示，本實施例之載板係包括：一母基板1〇〇，其包括一硬質 基板110、以及一設置在硬質基板11〇之兩側之黏著層13〇; 以及一脫模層300，係設置在母基板100兩側，且脫模層3〇〇 〇 之第一側係與母基板1 〇〇連接，而第二側係面向相對該母基 板100之另一方向（即，不面向母基板1〇〇)。本實施例與實施 例1相同之多餘敘述，為簡潔之目的，在此將省略敘述。 因本實施例所使用之硬質基板110與脫模層300大致與 實施例1相同’故在此省略其相關敘述。 於本實施例中，母基板100係包括一設置於硬質基板 110上之黏著層130。黏著層13〇係設於脫模層3〇〇與硬質基 板110間，以使其相互黏結。黏著層13〇可由如包含環氧樹 ◎ 脂之黏著劑所組成。 圖4係本發明實施例3之載板刮面示意圖。如圖中所 示，本實施例之載板係包括：一母基板1〇〇,其包括一硬質 基板110、以及一設置在硬質基板110之兩侧之黏著層130 ; 以及一脫模層300,係設置在母基板1〇〇兩側，且脫模層3〇〇 之第一側係與母基板100連接，而第二侧係面向相對母基板 100之另一方向（即，不面向母基板1〇〇)。本實施例與前述實 施例相同之多餘敘述，為簡潔之目的，在此將省略敘述。 9 201038164 因本實施例所使用之硬質基板110與黏著層13〇大致與 前述實施例相同’故在此省略其相關敘述。 於本實施例中，母基板100係包括一額外之脫離膜 150,其係嵌埋於母基板100外部，以使其底面及側面均嵌 埋在黏著層130中。脫模層300可由本技術領域常用之薄膜 形式脫模材料所組成。於本實施例中，每一脫離膜15〇之表 面積均小於黏著層130之表面積，以顯露黏著層13〇外周圍 區域。據此，於真空下將脫模層300強力壓在脫離膜15〇上， 而後脫模層300之外周圍區域可與黏著層ι3〇黏結。 圖5係本發明實施例4之載板剖面示意圖。如圖中所 示’本實施例之載板係包括：一母基板1〇〇’其包括一硬質 基板110、一設置在硬質基板11〇之兩側之黏著層13〇、以及 嵌埋在黏著層130外部之金屬層170 ;以及一脫模層3〇〇，係 設置在母基板100兩側，且脫模層300之第一側係與母基板 100連接’而第二侧係面向相對母基板1〇〇之另一方向（即， 不面向母基板100)。 因本實施例所使用之硬質基板110、黏著層130、及脫 模層300大致與前述實施例相同，故在此省略其相關敘述。 於本實施例中’母基板100係包括一額外之金屬層 1 70 ’其係嵌埋於母基板1 〇〇外部’以使其底面及側面均嵌 埋在黏著層130中。脫模層300可由如金、銀、銅、鎳及相 似金屬所組成。於本實施例中，每一金屬層17〇之表面積均 小於黏著層130之表面積，以顯露黏著層130外周圍區域。 201038164 據此，於真空下將脫模層300強力壓在金屬層170上，而後 脫模層300之外周圍區域可與黏著層130黏結。 上述用以製備基板之載板係包括：硬質基板11〇,其主 要可用於支撐增層之印刷線路板；以及脫模層300，其可幫 助印刷線路板輕易從載板上移除，因而提升印刷線路板製 程之穩定性，以及有利於薄型化印刷線路板之製作。 圖6至8係本發明實施例3之使用載板製作基板之製作 流程剖面示意圖。 〇 接下來，使用本發明載板製作基板之製程將伴隨圖式 加以描述。即便本發明上述實施例丨、實施例2及實施例4所 述之基板係用於使製程中，載板亦可以與實施例3製程相同 或相似之方式製造，且必要時將會描述各實施例間的差異。 首先，係提供一載板，其由母基板i 〇〇、及設置在母基 板兩側之脫模層300所組成，如圖3所示。在此，母基板1〇〇 係包括硬質基板110、設置在硬質基板n〇上之黏著層13〇、 以及嵌埋在黏著層130外部之脫離膜丨5〇。 Ο 如上所述，脫模層300可由本技術領域常用之薄膜形式 脫模材料或泡棉膠帶所製作，且薄膜形式脫模材料可包括 -石夕塗佈層（圖中未示）’或可在脫模材料之—側進行si塗佈 處理或電漿表面處理。 如圖6所示’係於載板上增層形成印刷線路板。在此， 印刷線路板之增層製程可使用一般形成層疊結構以及形成 線路圖案方式，其中每一印刷線路板係由絕緣層及於載板 11 201038164 上之線路層所組成，因此，在此將不贅述增層5〇〇之形成製 程。 於本實施例中’印刷線路板之增層製程之製作方式如 下.首先係於載板上形成一薄膜形式保護層51〇，而後再於 保護層510上形成線路層級絕緣層。在此，保護層51〇可為 薄膜形式阻焊層。 接著’如圖7所示，進行將印刷線路板從載板上移除之 製程。將印刷線路板從載板上移除之製程可依照脫模層3〇〇 所使用的材料種類，而採用循徑（r〇uting)或加熱製程。 當脫模層300係由薄膜形式脫模材料所組成，則可藉由 切除所貼附之黏著層13〇及脫模層300外周圍區域之的循徑 (routing)製程，藉以釋放其間之真空黏著力。 當脫模層300係由一泡棉膠帶所組成，則分離製程可透 過將泡棉膠帶加熱至一溫度（如20〇ac)，以使包含在泡棉膠 帶中之可發泡填充劑發泡，藉此將印刷線路板與載板相互 分離。此分離製程亦可應用在如圖5所示之實施例4。 在如圖2所示之實施例1之載板或如圖3所示之實施例2 之載版中’由於脫模層300係直接與硬質基板110或黏著層 130接觸’並未有一中間層設於其間，因此，分離製程較佳 係採用泡棉膠帶’而非採用循徑製程，如此，可將載板重 複回收使用。使用泡棉膠帶無須切除載板部分區域，即可 將印刷線路板與載板分離，藉此可非永久性的重複使用載 板。在此，須注意的是’分離製程並不限於使用泡棉膠帶， 12 201038164 因脫模層3〇〇已進行表面處理，故亦可採用循徑製程以將印 刷線路板與脫模層3 〇 〇相互分離。 更特別的是’由於脫模層300其中一側具有表面處理 層，藉此增加硬質基板110或黏著層13〇之黏著力，故形成 在脫模層300另一側之印刷線路板，可透過循徑製程之衝擊 或震動’而將印刷線路板與脫模層3〇〇分離。 而後，顯露連接端之開口 600係形成在從載板上分離之 印刷線路板之保護層510中，而製得各個印刷線路板。在 〇 此’開口 6〇〇可使用（：02雷射鑽孔形成。 综上所述，本發明之用以製備基板之載板，係包括： 一硬質基板，其係主要用於支撐形成在機板上之印刷線路 板；以及一脫模層，其係設置在印刷線路板與載板間，以 輕易將印刷線路板與載板分離，藉此，可提升印刷線路板 製作之穩定性，並提升薄型化印刷線路板之產量。 為了說明之目#，本發明提供較佳實施例，然而，本 發明所屬之技術領域者，在不偏離本發明主張之權利範圍 〇 的範圍及精神下’可進行各種修饰、添加、及取代。因此， 這樣的修飾、添加及取代均併入本發明範圍内。 【圖式簡單說明】 本發明之上述及其他目的、转播 J将徵及優點，均可伴隨圖 式及實施例，而更加清楚了解。 圖1A至1F係習知使用載板製作 _ 衣F…孩層基板之製作流程剖 面示意圖。 13 201038164 圖2係本發明實施例1之載板剖面示意圖。 圖3係本發明實施例2之載板剖面示意圖。 圖4係本發明實施例3之載板剖面示意圖。 圖5係本發明實施例4之載板剖面示意圖。 圖6至8係使用本發明實施例3之載板製作基板之製作流程 剖面示意圖。 【主要元件符號說明】 100 母基板 11 銅板 110 硬質基板 13 鎳阻障層 130 黏著層 15 凸塊凹;If 150 脫離膜 17 凸塊 170 金屬層 18 防焊層 19 線絡層 20 黏著層 300 脫模廣 31 銅板 33 鎳P且障層 40 增層 500 增層 510 保護層 600 開口 14The separation of the printed wiring board in the step (C) of the method can be carried out by a routing or heating process. The method may further include: after separating the printed wiring board in the step (C), using a laser drilling to form an opening in the protective layer of the printed wiring board to expose a connection end. [Embodiment] The objects, advantages and features of the present invention are apparent from the following description of the embodiments.解释 解释 The interpretation of the nouns and vocabulary used in the invention is not defined in the general meaning or dictionary, but should be based on the definition of the appropriate meaning of the concept made by the inventor, and the terms used in the present invention are interpreted in accordance with the meaning and concept of the technical scope of the present invention. And vocabulary, whereby the most appropriate method for describing the present invention can be described. Next, the printed circuit board having the spherical solder bump of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same drawing is used; the; is used to denote the same or similar elements, and the redundant description is omitted. In the following statements, "upper", "lower", and similar vocabulary are used to distinguish 7 201038164 specific components from other components, but the component composition is not limited to these vocabularies. 2 is a schematic cross-sectional view showing a carrier plate according to Embodiment 1 of the present invention. As shown in the figure, the carrier of the embodiment includes: a mother substrate (?) comprising a rigid substrate 110; and a release layer 300 disposed on both sides of the rigid substrate 11 and each The first side of a stripping layer 300 is connected to the mother substrate 1 ,, and the second side is oriented in the other direction opposite to the mother substrate (ie, not facing the mother substrate). The rigid substrate 110 may be made of a hard material such as a metal plate or a prepreg to support the layered printed wiring board in the build-up process. For example, the metal plate may be a copper plate, an aluminum plate, and a similar metal plate, and the prepreg may be an epoxy pre-/material, and the composition of the hard substrate 110 may be, but not limited to, a rigid insulating material such as epoxy. Resin or modified epoxy resin, bisphenol A resin, epoxy-mylon m, guanamine reinforced epoxy resin, glass fiber reinforced epoxy resin, or paper fiber reinforced epoxy resin. The release layer 300 may be a release material or a foam tape in the form of a film which is commonly used in the art. The thin-type release material may be an epoxy-based release material or a fluoroethylene resin release material. Here, the release layer may have a coating layer (not shown). When the release layer 300 is a release material in the form of a film, the first side of each release layer is permeable to the surface treatment to increase the adhesion between the first and side disks f of the release layer. Here, the surface is treated as ^, and the first side of the release layer is permeable to hydrophilicity. For example, the release layer 300 may be coated with an 81-base release agent ethyl ester plastic plate. 201038164 The foam tape may comprise a foamable filler which is foamable at a predetermined temperature to allow the foam tape to be removed from the mother substrate. For example, the foam tape can be a PET (poly(p-polybenzoate)) tape containing a large amount of foamable filler. Fig. 3 is a schematic cross-sectional view showing a carrier plate according to a second embodiment of the present invention. As shown in the figure, the carrier board of the embodiment includes: a mother substrate 1 〇〇 including a rigid substrate 110, and an adhesive layer 13 设置 disposed on both sides of the rigid substrate 11 〇; and a demolding The layer 300 is disposed on both sides of the mother substrate 100, and the first side of the release layer 3 is connected to the mother substrate 1 , and the second side is oriented in the opposite direction to the mother substrate 100 (ie, , not facing the mother substrate 1〇〇). The redundant description of the present embodiment as in the first embodiment is for the sake of brevity, and the description will be omitted herein. Since the hard substrate 110 and the release layer 300 used in the present embodiment are substantially the same as those in the first embodiment, the description thereof will be omitted. In the embodiment, the mother substrate 100 includes an adhesive layer 130 disposed on the rigid substrate 110. The adhesive layer 13 is provided between the release layer 3 and the rigid substrate 110 to bond them to each other. The adhesive layer 13 can be composed of an adhesive such as an epoxy resin. 4 is a schematic view showing a scraping surface of a carrier sheet according to Embodiment 3 of the present invention. As shown in the figure, the carrier of the embodiment includes: a mother substrate 1 〇〇 comprising a rigid substrate 110, and an adhesive layer 130 disposed on two sides of the rigid substrate 110; and a release layer 300 The first side of the release layer 3 is connected to the mother substrate 100, and the second side is oriented to the other side of the mother substrate 100 (ie, not facing the mother). Substrate 1)). The redundant description of the present embodiment which is the same as the above embodiment is for the sake of brevity, and the description will be omitted herein. 9 201038164 The hard substrate 110 and the adhesive layer 13 使用 used in the present embodiment are substantially the same as those in the above embodiment, and thus the related description is omitted here. In the present embodiment, the mother substrate 100 includes an additional release film 150 embedded in the exterior of the mother substrate 100 such that the bottom surface and the side surfaces thereof are embedded in the adhesive layer 130. The release layer 300 may be composed of a release material in the form of a film commonly used in the art. In the present embodiment, the surface area of each of the release films 15 is smaller than the surface area of the adhesive layer 130 to expose the outer peripheral region of the adhesive layer 13. According to this, the release layer 300 is strongly pressed against the release film 15〇 under vacuum, and the peripheral region outside the release layer 300 can be bonded to the adhesive layer ι3〇. Figure 5 is a cross-sectional view showing a carrier plate of Embodiment 4 of the present invention. As shown in the figure, the carrier plate of the present embodiment includes: a mother substrate 1'' including a rigid substrate 110, an adhesive layer 13 disposed on both sides of the rigid substrate 11〇, and embedded in the adhesive layer. a metal layer 170 outside the layer 130; and a release layer 3〇〇 disposed on both sides of the mother substrate 100, and the first side of the release layer 300 is connected to the mother substrate 100 and the second side is facing the opposite mother The other direction of the substrate 1 (ie, not facing the mother substrate 100). Since the hard substrate 110, the adhesive layer 130, and the release layer 300 used in the present embodiment are substantially the same as those of the above-described embodiment, the description thereof will be omitted. In the present embodiment, the mother substrate 100 includes an additional metal layer 1 70 ′ which is embedded in the outer surface of the mother substrate 1 so that the bottom surface and the side surfaces thereof are embedded in the adhesive layer 130. The release layer 300 may be composed of, for example, gold, silver, copper, nickel, and the like. In this embodiment, the surface area of each of the metal layers 17 is smaller than the surface area of the adhesive layer 130 to expose the outer peripheral area of the adhesive layer 130. According to this, the release layer 300 is strongly pressed against the metal layer 170 under vacuum, and the peripheral region outside the release layer 300 can be bonded to the adhesive layer 130. The carrier board for preparing the substrate includes: a rigid substrate 11 〇 which is mainly used to support the layered printed wiring board; and a release layer 300 which can help the printed circuit board to be easily removed from the carrier board, thereby improving The stability of the printed circuit board process and the fabrication of thin printed circuit boards. 6 to 8 are schematic cross-sectional views showing a process of fabricating a substrate using a carrier according to a third embodiment of the present invention. 〇 Next, the process of fabricating a substrate using the carrier of the present invention will be described with reference to the drawings. Even if the substrate described in the above embodiments, the embodiment 2 and the embodiment 4 of the present invention is used to make the carrier, the carrier can be manufactured in the same or similar manner as the process of the third embodiment, and the implementation will be described as necessary. Differences between cases. First, a carrier is provided which is composed of a mother substrate i 〇〇 and a release layer 300 disposed on both sides of the mother substrate, as shown in FIG. Here, the mother substrate 1 includes a hard substrate 110, an adhesive layer 13A provided on the hard substrate n, and a release film 丨5〇 embedded in the outside of the adhesive layer 130. Ο As described above, the release layer 300 may be made of a film-form release material or a foam tape commonly used in the art, and the film-form release material may include a coating layer (not shown) or may be The Si coating treatment or the plasma surface treatment is performed on the side of the release material. As shown in Fig. 6, the printed circuit board is formed by layering on the carrier. Here, the layering process of the printed wiring board can be generally formed into a laminated structure and formed into a circuit pattern, wherein each printed wiring board is composed of an insulating layer and a circuit layer on the carrier board 11 201038164, and therefore, The process of forming the layer 5 is not described. In the present embodiment, the build-up process of the printed wiring board is as follows. First, a film-type protective layer 51 is formed on the carrier, and then a circuit-level insulating layer is formed on the protective layer 510. Here, the protective layer 51A may be a solder resist layer in the form of a film. Next, as shown in Fig. 7, a process of removing the printed wiring board from the carrier is performed. The process of removing the printed wiring board from the carrier can be carried out according to the type of material used for the release layer 3, or by a heating or heating process. When the release layer 300 is composed of a release material in the form of a film, the vacuum can be released by cutting the attached adhesive layer 13 and the routing process outside the release layer 300. Adhesion. When the release layer 300 is composed of a foam tape, the separation process can be performed by heating the foam tape to a temperature (for example, 20 〇 ac) to foam the foamable filler contained in the foam tape. Thereby, the printed wiring board and the carrier board are separated from each other. This separation process can also be applied to Embodiment 4 as shown in FIG. In the carrier of the embodiment 1 shown in FIG. 2 or the carrier of the embodiment 2 shown in FIG. 3, "the release layer 300 is in direct contact with the rigid substrate 110 or the adhesive layer 130" does not have an intermediate layer. In the meantime, the separation process is preferably made of foam tape instead of a diametering process, so that the carrier can be recycled. The use of foam tape allows the printed circuit board to be separated from the carrier without the need to remove portions of the carrier, thereby allowing the carrier to be reused non-permanently. Here, it should be noted that the 'separation process is not limited to the use of foam tape, 12 201038164 Since the release layer 3〇〇 has been surface treated, a routing process can also be used to laminate the printed wiring board and the release layer 3 〇 separate from each other. More specifically, 'because the release layer 300 has a surface treatment layer on one side thereof, thereby increasing the adhesion of the hard substrate 110 or the adhesive layer 13, the printed wiring board formed on the other side of the release layer 300 is permeable. The printed circuit board is separated from the release layer 3 by the impact or vibration of the routing process. Then, the opening 600 exposing the connection end is formed in the protective layer 510 of the printed wiring board separated from the carrier, and each of the printed wiring boards is produced. In this case, the opening 6 can be used (: 02 laser drilling. In summary, the carrier for preparing the substrate of the present invention includes: a rigid substrate, which is mainly used for supporting formation a printed circuit board on the board; and a release layer disposed between the printed circuit board and the carrier board to easily separate the printed circuit board from the carrier board, thereby improving the stability of the printed circuit board fabrication. And the production of the thinned printed circuit board is improved. The present invention provides a preferred embodiment, but the technical scope of the present invention is not limited to the scope and spirit of the scope of the claimed invention. Various modifications, additions, and substitutions are possible. Therefore, such modifications, additions, and substitutions are all within the scope of the present invention. [Simplified Description of the Drawings] The above and other objects of the present invention, the broadcast J will have advantages and advantages, BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1A to 1F are schematic cross-sectional views showing a process of fabricating a substrate using a carrier sheet. 13 201038164 FIG. 2 is an embodiment of the present invention. Figure 3 is a schematic cross-sectional view of a carrier plate according to a second embodiment of the present invention. Figure 4 is a cross-sectional view of a carrier plate according to a third embodiment of the present invention. 6 to 8 is a schematic cross-sectional view showing a process for fabricating a substrate using the carrier of the third embodiment of the present invention. [Main component symbol description] 100 mother substrate 11 copper plate 110 rigid substrate 13 nickel barrier layer 130 adhesive layer 15 bump concave; If 150 Release film 17 bump 170 metal layer 18 solder mask 19 wire layer 20 adhesive layer 300 stripping wide 31 copper plate 33 nickel P and barrier layer 40 layer 500 layer 510 protective layer 600 opening 14