TW201035694A - Exposure device - Google Patents

Exposure device Download PDF

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Publication number
TW201035694A
TW201035694A TW099100701A TW99100701A TW201035694A TW 201035694 A TW201035694 A TW 201035694A TW 099100701 A TW099100701 A TW 099100701A TW 99100701 A TW99100701 A TW 99100701A TW 201035694 A TW201035694 A TW 201035694A
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TW
Taiwan
Prior art keywords
workpiece
cable
stage
robot
mask
Prior art date
Application number
TW099100701A
Other languages
Chinese (zh)
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TWI457717B (en
Inventor
Yuki Koike
Yoshihiko Sato
Tatsuhiro Okano
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Ushio Electric Inc
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Publication of TW201035694A publication Critical patent/TW201035694A/en
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Publication of TWI457717B publication Critical patent/TWI457717B/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825Mounting of individual elements, e.g. mounts, holders or supports
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67379Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped

Abstract

This invention is to provide an exposure device which is capable of preventing damage to workpiece or parts of a working platform even when the workpiece falls off a workpiece conveyer mechanism and which has less operation time when compared with prior arts. The exposure device of this invention allows exposure of patterns formed on a mask on the workpiece when mounting the workpiece conveyed by a robot arm on the working platform and using the mask to irradiate light onto the workpiece mounted on the working platform, wherein a cable is disposed across the working platform within the area the robot arm conveys the workpiece and the space from the conveyance height (conveyance level) of the robot arm conveying the workpiece to the surface height of the absorption platform of the working platform.

Description

201035694 六、發明說明: 【發明所屬之技術領域】 本發明係關於將印刷基板或液晶面板用玻璃基板等進 ί了曝光的曝光裝置。 【先前技術】 在第1 0圖中顯示在印刷基板或液晶面板等(以下亦 〇 稱之爲工件)之製造工程中,配線等圖案形成所使用之習 . 知的曝光裝置的槪略構成及其動作之一例。 如上所示之曝光裝置主要具備有:光照射部1 0 ;形 成有轉印在工件之圖案的遮罩Μ;保持該遮罩的遮罩台 2 〇 ;保持進行曝光處理之印刷基板或液晶面板等工件W 的工件台30;及將形成在遮罩Μ的圖案投影在工件台30 上之工件W的投影透鏡40。其中,亦有未具備有投影透 鏡40而使遮罩Μ與工件W近接或密接來進行曝光的曝光 〇 裝置。 光照射部1 0具備有:作爲放射包含紫外線之光的光 源的燈1 1、及將來自燈1 1的光反射的反射鏡1 2。 此外,該圖的工件台30爲利用平面電動機(Surface Motor)的平面台,工件台30具備有模板(platen) 31與 滑件(移動體)32。 模板31係具有以棋盤格子狀設有磁性體凸極之平面 的構件。在該模板3 1上,滑件32因空氣的作用而上浮。 在該狀態下對滑件32施加磁力,使滑件32與模板3 1之 -5- 201035694 凸極之間的磁場產生變化,藉此使滑件3 2在模板3 1上移 動。以如上所示之工件台之例而言,有專利文獻1中所記 載的平面台裝置。 在滑件32之上安裝有連接真空配管(未圖示)的吸 附平台3 3,將進行曝光處理的工件W作吸附保持。 此外,在滑件3 2安裝有用以測定滑件3 2之位置的雷 射干涉儀34,此外,在模板31安裝有將來自該雷射干涉 儀34的雷射光36反射的反射鏡35。由雷射干涉儀34所 出射的雷射光3 6係藉由該反射鏡3 5予以反射而返回至雷 射干涉儀3 4,來測定滑件3 2的位置(移動距離)。 被吸附在吸附平台3 3的工件W係使滑件3 2 —面藉 由上述雷射干涉儀3 4來檢測位置一面移動,藉此將曝光 領域分割成複數個而逐次予以曝光。 此外’曝光裝置係具備有預對準台50。進行曝光處 理前的工件W被置放在該預對準台50,對工件台30進行 粗略的定位(預對準)。 預對準的方法有將工件抵碰定位銷的方法、或藉由感 測器以複數部位檢測工件的邊緣而使位置對位的方法等。 進行曝光之工件由預對準台50對工件台30的搬入、 或已完成曝光的工件由工件台30的搬出係藉由工件搬送 機構60的機械手(handler ) 61來進行。機械手61係利 用安裝在臂部的複數吸附墊6 2來吸附工件W而懸掛進行 搬送者。 以利用吸附墊吸附如上所示之工件而懸掛進行搬送之 -6- 201035694 機械手之例而言,有專利文獻2所記載之搬送機構。 使用第10圖(a)(b)(c),說明藉由機械手61所爲 件W的搬送(對於工件台30的搬入與搬出)。其中 第10圖(b)(c)中係省略顯示曝光裝置的光照射部10 罩Μ及遮罩台20。 第1 0圖(a)。在工件台3 0的吸附平台3 3上吸附 工件W1而進行曝光處理。接著進行曝光處理的工件 〇 被置放在預對準台50而進行預對準。 • 工件搬送機構60係在一支臂部63的兩側具備有 • 件搬出用的機械手61a、及工件搬入用的機械手61b 各自的機械手61a、61b安裝有複數吸附墊62,藉由 附墊62,將工件W吸附保持而懸掛進行搬送。在臂| 安裝有移動機構(未圖示),工件搬送機構60係以 朝圖示左右與上下方向移動。 第1 0圖(b)。若工件W1的曝光處理與工件W2 〇 對準結束’則工件搬送機構60會下降,由工件搬入 械手61a保持預對準台50的工件W2,此外,由工件 用機械手61b保持吸附平台33上的工件W1。保持兩 的工件搬送機構60上升而朝圖示右方向移動。 第1 0圖(c)。若保持工件W2的工件搬入用機 6 1 a來到吸附平台3 3之上,則工件搬送機構6 0下降 工件W 2置放在吸附平台3 3上。吸附平台3 3係吸附 工件W2。此外,工件搬出用機械手61 b亦將所保持 件W1置放在進行後工程之顯影處理的裝置的工作台 之工 ,在 與遮 保持 W2 :工 。在 該吸 ^ 63 全體 的預 用機 搬出 工件 械手 而將 保持 的工 (未 201035694 圖示)。 工件搬送機構朝圖示左方移動而返回至第10圖(a)的 位置。工件W2的曝光處理開始,藉由其他搬送機構(未 圖示)搬送接下來予以曝光處理的工件在預對準台50。 [先前技術文獻] [專利文獻] [專利文獻1]日本特開2004-138878號公報 [專利文獻2]日本特開2000-340635號公報 【發明內容】 (發明所欲解決之課題) 工件W尤其爲印刷基板時,會有在工件W發生較大 翹曲的情形。其原因之一,考慮到印刷基板係在樹脂製基 板之上黏貼銅箔等金屬所形成者,因此因兩者的熱膨脹率 的差異而發生之故。 被安裝在機械手61之吸附墊62之與工件W相接觸 的部分係柔軟的樹脂(橡膠)製,對於工件W的些微翹 曲’係以變形應對。但是,若翹曲較大時,會有在吸附墊 62與工件W之間發生間隙,用以吸附保持工件w的真空 會漏拽而慢慢失去保持力的情形。 在此,例如,工件搬入用機械手61 a將工件W由預 對準台5 0上舉時,係可吸附保持工件W,但是若在將其 搬送至工件台30的途中失去吸附保持力,工件w亦有如 -8 201035694 第11圖所示般落下,而夾在工件台30之雷射干涉儀用反 射鏡35與滑件32之間的情形。 如上所示,工件W在搬送途中由機械手61落下時, 滑件32發生移動等,尤其會有滑件32接觸工件w而使 工件W損傷的情形。此外,亦有落下的工件W損傷安裝 在工件台3〇的雷射千涉儀34或反射鏡35等精密零件的 情形。 〇 爲防止該情形,考慮當使工件W由預對準台5 0改載 置於工件台30時,先使滑件32靠近預對準台50側。若 事先如此,即使工件W落下,亦不會有工件W載置於工 件台30的吸附平台33上而使工件W或工件台30的精密 零件損傷的情形。 但是因此,如第12圖所示,機械手61a、61b取起預 對準台50的工件W1、及吸附平台33的工件Wl、W2後 ’滑件32會朝預對準台5〇的方向移動(第12圖(3)), 〇 之後’機械手61將工件w置放在吸附平台33之後,滑 件32會移動至投影透鏡40之下的曝光位置(第12圖(b) )° 如此一來,與在上述第10圖中所示之工件w的搬送 順序相比’滑件32朝預對準台50方向移動與朝曝光位置 返回的順序會增加,因此曝光處理的時間(tact )會變長 〇 本發明鑑於上述問題點,目的在提供一種曝光裝置, 其藉由工件搬送機構來搬送工件時,即使工件由工件搬送 -9 - 201035694 機構落下,亦不會有工件本身或工件台的零件損傷的情形 ,並且與習知技術相比,作業時間(tact )不會變長。 (解決課題之手段) 在本發明中係將上述課題如下所示加以解決。 一種曝光裝置,係將藉由機械手所搬送的工件載置在 工件台,對載置在該工件台的工件透過遮罩來照射光,在 上述工件上對形成在上述遮罩的圖案進行曝光的曝光裝置 ’其在機械手搬送工件的領域,且爲由機械手搬送工件的 搬送高度(搬送位級)至工件台的吸附平台表面高度爲止 之間的空間,舖設橫越工件台的纜線。 該纜線係具有當工件由機械手脫落而掉下時,將工件 阻擋在工件台上的作用。 其中’亦考慮到若僅藉由將纜線朝單方向舖設,受到 阻擋的工件會由纜線與纜線之間掉落在下方的情形,因此 亦可由上述纜線’在對該纜線呈正交的方向舖設第2纜線 〇 此外’亦可舖設網狀物來取代纜線。 (發明之效果) 在本發明中,可得以下效果。 即使工件由機械手落下’亦藉由橫切工件台的纜線或 網狀物予以阻擋’而不會有工件掉落在工件台上的情形。 藉此不會有基板或工件台的零件損傷的情形。此外, -10 - 201035694 工件的搬送順序不會改變,亦不會對作業時間造成影響。 此外,當防止工件掉落的手段爲纜線時,在對直線狀 纜線(第1纜線)呈正交的方向舖設第2纜線,藉此可防 止工件由第1纜線與纜線之間掉落在下方。 【實施方式】 第1圖顯示本發明第1實施例之曝光裝置的槪略構成 Ο 圖。其中’關於與第ίο圖相同構成者,係標註相同的元 件符號。 本發明之曝光裝置具備有:光照射部10;形成有轉 印在工件之圖案的遮罩M;保持該遮罩的遮罩台20;保 持進行曝光處理之印刷基板或液晶面板等工件W的工件 台30;及將形成在遮罩μ的圖案投影在工件台30上之工 件W的投影透鏡40。 光照射部10具備有:作爲放射包含紫外線之光的光 Ο 源的燈1 1、及將來自燈1 1的光反射的反射鏡1 2。此外, 工件台30爲利用平面電動機的平面台,具備有模板31與 滑件(移動體)3 2。 模板31係具有以棋盤格子狀設有磁性體凸極之平面 的構件,在模板3 1上’滑件3 2因空氣的作用而上浮。對 滑件3 2施加磁力,使滑件3 2與模板3 1之凸極之間的磁 場產生變化,藉此使滑件3 2在模板3 1上移動。本實施例 中之模板31的一邊長度爲900mm〜1200mm,滑件32的 —邊長度爲約3 00mm。 -11 - 201035694 在滑件32上安裝有連接真空配管(未圖示)的吸附 平台3 3,將進行曝光處理的工件W作吸附保持。本實施 例中之吸附平台33之一邊長度爲500 mm〜600mm。 此外,在滑件3 2安裝有用以測定滑件3 2之位置的雷 射干涉儀34,此外,在模板31安裝有將來自該雷射干涉 儀3 4的雷射光3 6反射的反射鏡3 5。 來自雷射干涉儀34的雷射光36係藉由該反射鏡35 予以反射而返回至雷射干涉儀34,來測定滑件32的位置 (移動距離)。 被吸附在吸附平台3 3的工件W係使滑件3 2 —面藉 由雷射干涉儀34來檢測位置一面移動,藉此將曝光領域 分割成複數個而逐次予以曝光。 此外,在預對準台50中,係進行在進行曝光處理前 之工件W 2之對工件台3 0的粗略定位(預對準)。 工件搬送機構60的機械手61a、61b將曝光前的工件 由預對準台50搬入至吸附平台33,此外,將已完成曝光 的工件由吸附平台33搬出。機械手61係利用安裝在臂部 的複數吸附墊6 2來吸附工件W而以懸掛進行搬送。 在如上所示之曝光裝置中,爲了防止工件W掉落在 工件台30上’在工件台30之上以橫越工件台3〇的方式 舖設纜線(wire) 70。 如第1圖所示,設置纜線7 0之高度方向的範圍係從 由機械手61搬送工件W的搬送高度(搬送位級(level) )L1起至工件台30之吸附平台33表面的高度L2爲止之 -12- 201035694 間。在該範圍的空間舖設橫越工件台3 0的長度的纜線。 在第1圖中,纜線70係被舖設在圖示面前內側,僅 看到纜線70的剖面。纜線70的直徑爲約1 mm。 此外’工件的搬送高度(搬送位級)L 1至吸附平台 的表面高度L2爲止的間隔爲約20mm,在該圖中,爲易 於瞭解,纜線W的直徑、與工件搬送位級l 1至吸附平台 的表面高度L2的間隔均較大放寬顯示。 Ο 此外,以設置纜線70之水平方向的範圍而言,除了 用以將工件W載置在吸附平台3 3的範圍、及照射用以將 工件W曝光的曝光光的範圍以外,爲機械手61懸掛工件 W進行搬送的領域。 在本實施例中係顯示將纜線70設在預對準台50與吸 附平台3 3之間之例。但是’纜線7 0可設在將工件w由 吸附平台33搬出之側’亦可設在吸附平台33的雨側。此 外’爲了確實阻擋工件W ’纜線70係以設置複數列爲宜 〇 。 纜線70的材質可爲金屬’亦可爲樹脂。纜線7〇爲樹 脂,亦如上所述在照射曝光光的範圍由於會形成曝光光的 陰影而未設置,因此不會有因曝光光(紫外線)所造成之 劣化之虞。 第2圖係放大顯7K第1實施例之工件台的斜視圖。 在模板3 1的兩側(在第1圖中爲面前側與內側)設 置用以安裝纜線70的纜線安裝構件A7〗與纜線安裝構件 B72 ’在該2個纜線安裝構件η、72之間搭設纜線7〇。 -13- 201035694 在本實施例中,纜線安裝構件71、72的間隔爲 1 8 00mm,纜線70的直徑爲約1mm。 工件W依序移動而被曝光時,會有已載置工件w 吸附平台3 3的一部分由模板3 1超出的情形。因此,以 吸附平台33不會與纜線安裝構件71、72接觸的方式, 線安裝構件71、72的間隔係比模板3 1的寬幅更長,而 模板3 1的兩邊間隔距離。 纜線70係由纜線安裝構件A71延伸至纜線安裝構 B 7 2,然後折返,而再次返回至纜線安裝構件a 7 1加以 定。亦即’ 1條纜線在纜線安裝構件7 1、72間往返而 成2列纜線線。在第2圖中係藉由2條纜線7 0,形成 4列纜線線。 纜線70之下’爲供曝光處理,安裝有已載置工件 之吸附平台33的滑件32會進行移動。因此,在纜線安 構件7 1、72之間並無法設置如支持纜線70之類的支柱 第3圖係由第2圖的箭號A方向觀看纜線安裝構 A71的圖,第4圖係由第2圖的箭號B方向觀看纜線安 構件B72的圖。使用第3圖與第4圖,就纜線70的舖 方式加以說明。 如第3圖所示,在纜線70的一端安裝有彈簧80, 彈簧80之未安裝有纜線70之側係被固定在纜線安裝構 A71。 透過彈簧80而將一端固定在纜線安裝構件A71的 線7〇係以由纜線安裝構件A7 1橫越工件台3 0之模板 約 的 使 纜 與 件 固 形 有 W 裝 〇 件 裝 設 該 件 纜 3 1 -14- 201035694 上的方式延伸至纜線安裝構件B72。 已到達纜線安裝構件B72的纜線70,如第4圖所示 ,藉由被安裝在纜線安裝構件B 7 2的2個纜線折返構件 81,具有預先設定的寬幅而折返,再次橫越工件台30的 模板3 1上而朝向纜線安裝構件A7 1。 已到達纜線安裝構件A7 1的纜線70係透過防止纜線 7 0位置偏移的壓板82,藉由捲繞螺絲83予以捲繞。若捲 〇 上捲繞螺絲8 3時,彈簧8 0延伸,而對在纜線安裝構件 A71與纜線安裝構件B72間往返的纜線70施加張力( tension) ° 纜線70因經時而發生鬆弛時,係可藉由捲撓該捲繞 螺絲83,再次對纜線70施加張力。 第5圖係顯示1 800mm的纜線的彎曲與施加於纜線的 力(重力)的關係圖。 如上所述,供設置纜線70之用之由工件搬送高度( 〇 搬 送位級)L1至工件台30之吸附平台33之表面高度L2 爲止的間隔爲約20mm,第1與第2纜線安裝構件71、72 的間隔’亦即纜線70之單程的長度爲1 800mm。 若在纜線7〇有較大彎曲時,纜線70會受到在其下移 動的滑件32上的吸附平台33卡住而造成裝置的不良原因 〇 因此,發明人就長度1 8 00mm的纜線(φ 1 mm )的彎 曲ω與施加於纜線的張力(重量)f的關係進行調查。 如第5圖所示,當以纜線的張力F爲10Ν的方式設 -15- 201035694 定桂碼的重量時,纜線的彎曲量ω爲約1 m m。當以張力f 爲20N的方式設定δ去碼的重量時’績線的彎曲量ω爲約 0.5mm。此外,當以張力F爲40Ν的方式設定陆碼的重量 時,纜線的彎曲量ω爲0.5mm以下。 由該結果可知,若事先藉由第3圖所示之彈簧81與 捲繞螺絲83,對纜線70施加20N以上(最好爲40N以上 )的張力,並不會有纜線70與在其下移動的吸附平台33 相接觸的情形。 其中,以阻擋工件由機械手掉落的構件而言,亦可考 慮如屋頂般設置金屬棒或板狀構件而非纜線。 但是,其會發生如以下所示的問題,由成本或製作難 易度、裝置小型化、而且在其構件發生彎曲時的修正作業 的難易度等方面來考慮,以纜線較爲適合。 阻擋工件掉落的構件爲金屬棒或板狀構件時,例如若 爲1 800mm的長度時,無法如上所述在途中設置支柱,因 此棒的粗細較細或板的厚度較薄時,會因本身重量而彎曲 ,其一部分會由可設置工件防落構件之由工件搬送位級 L1至吸附平台表面高度L2爲止的範圍突出,而會有與在 其下移動的吸附平台3 3相接觸的情形。 因此,棒狀構件或板狀構件必須以不會由屬於由工件 搬送位級L1至吸附平台表面高度L2爲止的間隔的20mm 突出的方式,加粗棒的粗細或加厚板的厚度。但是,如此 一來,圓棒或板的重量會增加,價格亦變得較高,工件台 亦大型化。 -16- 201035694 此外,在僅爲約20mm之由工件搬送位級L1至吸附 平台表面高度L2之間,難以安裝重且粗的圓棒或厚的板 狀構件。 此外,雖考慮到如上所示之棒狀構件或板狀構件會因 經時而發生彎曲,但是若一旦彎曲,只能替換成新品,而 會發生零件替換的費用,並且替換作業時間亦變長。 相對於此,纜線細而輕量,價格亦較爲廉價。此外, 〇 即使因經時而發生彎曲,亦可僅藉由捲繞捲繞螺絲而再次 施加張力。 第6圖係顯示本發明第2實施例之曝光裝置之工件台 的斜視圖。 在第5圖所示之第1實施例中,纜線7〇係設有複數 列’但是該等係朝相同方向延伸。因此,當工件W由機 械手6 1落下時’即使暫時利用纜線7 0加以阻擋,亦會有 由纜線與纜線之間掉落在下面的情形。 Ο 以其對策而言,如第6圖所示,在相對上述第1實施 例所示之纜線(第1纜線)7 0呈正交的方向設置第2纜 線73。 第2纜線73係將其中一方設在第!纜線7〇,將另一 方安裝在第2纜線安裝構件74而設。 第7圖係由第6圖的箭號C方向觀看第2纜線安裝構 件74的圖。 桌2纜線73係將其中一方形成爲鈎(h〇〇k)狀或形 成爲圓而與第1纜線70相連,將另一方捲繞在第2纜線 -17- 201035694 安裝構件74的捲繞螺絲8 3。藉此可將第2纜線73設在 相對第1纜線70呈正交的方向。 第1纜線70係被第2纜線73的張力牽拉而彎曲,但 是若可阻擋工件W即可,因此即使稍微彎曲亦不會有問 題。 藉由設置第2纜線73,纜線被舖設成十字,因此工 件由纜線與纜線之間掉落在下方的虞慮會消失。其中,第 2纜線73亦爲了確實阻擋工件W,以設置複數列爲宜。 门 第8圖係顯示橫越工件台而設的纜線的其他舖設方式 之例圖。 在上述第1實施例中,纜線係以在工件台的四角模板 相對向的2邊之間橫斷工件台的方式而設。 但是,如第8圖所示,亦可將纜線7 0在與模板3 1相 鄰的邊之間相對模板3 1的邊斜向而設。即使如上所示設 置纜線,亦可防止工件掉落在工件台。 第9圖係顯示在工件台上設置網狀物來取代直線狀纜 II 線的例圖。 即使使用網狀物,亦可防止工件掉落在工件台。但是 ,在使用網狀物時,爲了不會發生鬆弛,必須設法對網狀 物以縱橫方向施加張力。 因此,如第9圖所示,網狀物90係形成有四角網目 ,以可將其網目之四角的各頂點朝對角線方向拉緊的方式 ,使網狀物9 0的細繩(弦線)9 1朝4方向延伸。 朝4方向延伸的細繩91之中的1方向的細繩係被安 -18 - 201035694 裝在橫越模板31而施加張力而設的纜線70。剩下的3方 向的細繩係安裝在設在模板31之3邊之網狀物安裝構件 9 2的捲繞螺絲8 3。 若藉由各捲繞螺絲83來拉緊各細繩91時,網狀物 90亦被纜線70所拉緊,因此朝四角網目的對角線方向延 伸而對網狀物90全體以縱橫方向施加張力。藉此可無鬆 驰地設置網狀物90。即使因經時而在網狀物90發生鬆弛 〇 ,亦可藉由捲繞捲繞螺絲8 3,輕易地重新施加張力。 其中,設置網狀物90的範圍係與上述設置纜線的範 圍相同。關於高度方向,係由機械手61搬送工件W的搬 送高度(搬送位級)L1至工件台3 0之吸附平台3 3表面 高度L2之間,關於水平方向,係除了用以將工件W載置 在吸附平台3 3的範圍、及照射用以將工件W進行曝光之 曝光光的範圍以外,爲機械手61搬送工件W的領域。 此外,與纜線同樣地,網狀物的材質可爲金屬製,亦 U 可爲樹脂製。 【圖式簡單說明】 第1圖係顯示本發明之第1實施例之曝光裝置的槪略 構成圖。 第2圖係放大顯示第1實施例之工件台的斜視圖。 第3圖係由第2圖的箭號A方向觀看纜線安裝構件a 的圖。 第4圖係由第2圖的箭號B方向觀看纜線安裝構件b -19- 201035694 的圖。 第5圖係顯示纜線的彎曲與施加於纜線之力的關係圖 〇 第6圖係顯示本發明之第2實施例之曝光裝置之工件 台的斜視圖。 第7圖係由第6圖的箭號C方向觀看第2纜線安裝構 件的圖。 第8圖係顯示纜線之其他舖設方式之例圖。 第9圖係顯示在工件台上設置網狀物之例圖。 第10圖係顯示習知之曝光裝置之槪略構成及其動作 之一例圖。 第U圖係顯示工件掉落在工件台之狀態圖。 第12圖係顯示滑件在預對準台50與曝光位置之間移 動的圖。 【主要元件符號說明】 1 〇 :光照射部 1 1 :燈 1 2 :反射鏡 2〇 :遮罩台 3 0 :工件台 3 1 :模板 3 2 ··滑件(移動體) 3 3 :吸附平台 -20- 201035694 34 :雷射干涉儀 3 5 :反射鏡 3 6 :雷射光 4 0 :投影透鏡 50 :預對準台 60 :工件搬送機構 61、 61a、 61b:機械手 〇 62 :吸附墊 63 :臂部 70 :纜線[Technical Field] The present invention relates to an exposure apparatus that exposes a printed substrate or a glass substrate for a liquid crystal panel. [Prior Art] In the manufacturing process of a printed circuit board, a liquid crystal panel, or the like (hereinafter also referred to as a workpiece), a schematic configuration of a known exposure apparatus used for pattern formation such as wiring is shown in FIG. An example of its action. The exposure apparatus as described above mainly includes a light irradiation unit 10, a mask 形成 formed with a pattern transferred to the workpiece, a mask table 2 holding the mask, and a printed circuit board or a liquid crystal panel that is subjected to exposure processing. The workpiece stage 30 of the workpiece W; and the projection lens 40 of the workpiece W on which the pattern of the mask 投影 is projected on the workpiece stage 30. Among them, there is also an exposure apparatus which does not have the projection lens 40 and allows the mask 近 to be in close contact or close contact with the workpiece W for exposure. The light irradiation unit 10 includes a lamp 11 as a light source that emits ultraviolet light, and a mirror 12 that reflects light from the lamp 11. Further, the workpiece stage 30 of the drawing is a plane table using a surface motor, and the workpiece stage 30 is provided with a platen 31 and a slider (moving body) 32. The template 31 has a member in which a plane of a magnetic salient pole is provided in a checkerboard lattice shape. On the template 31, the slider 32 floats due to the action of air. In this state, a magnetic force is applied to the slider 32 to change the magnetic field between the slider 32 and the salient pole of the -3 - 201035694 of the template 3 1 , whereby the slider 3 2 is moved on the template 3 1 . In the example of the workpiece stage as described above, there is a flat table device described in Patent Document 1. An adsorption platform 33 to which a vacuum pipe (not shown) is attached is attached to the slider 32, and the workpiece W subjected to the exposure process is adsorbed and held. Further, a laser interferometer 34 for measuring the position of the slider 3 2 is attached to the slider 32, and a mirror 35 for reflecting the laser light 36 from the laser interferometer 34 is attached to the template 31. The laser light 36 emitted from the laser interferometer 34 is reflected by the mirror 35 and returned to the laser interferometer 34 to measure the position (moving distance) of the slider 32. The workpiece W adsorbed on the adsorption stage 3 is moved so that the slider 3 2 surface is detected by the above-described laser interferometer 34, whereby the exposure area is divided into a plurality of pieces and sequentially exposed. Further, the exposure apparatus is provided with a pre-alignment stage 50. The workpiece W before the exposure processing is placed on the pre-alignment stage 50, and the workpiece stage 30 is roughly positioned (pre-aligned). The pre-alignment method includes a method of colliding the workpiece against the positioning pin, or a method of aligning the position by detecting the edge of the workpiece at a plurality of portions by the sensor. The workpiece to be exposed by the pre-alignment stage 50 is loaded into the workpiece stage 30, or the workpiece that has been exposed is removed from the workpiece stage 30 by the robot 61 of the workpiece transfer mechanism 60. The robot 61 uses a plurality of adsorption pads 6 2 attached to the arm to suck the workpiece W and hang it for transport. In the case of the -6-201035694 robot which hangs and transports the workpiece as described above by the adsorption pad, there is a transfer mechanism described in Patent Document 2. The conveyance of the workpiece W by the robot 61 (the loading and unloading of the workpiece stage 30) will be described with reference to Figs. 10(a), (b) and (c). In Fig. 10 (b) and (c), the light irradiation unit 10 cover and the mask stage 20 of the exposure apparatus are omitted. Figure 10 (a). The workpiece W1 is adsorbed on the adsorption stage 3 3 of the workpiece stage 30 to perform exposure processing. The workpiece 接着 subjected to the exposure processing is placed on the pre-alignment stage 50 to perform pre-alignment. The workpiece transfer mechanism 60 is provided with a robot hand 61a for carrying out the components on both sides of the one arm portion 63 and a robot hand 61b for loading the workpieces. The plurality of suction pads 62 are attached to the robot hands 61a and 61b. The pad 62 attaches and holds the workpiece W and suspends it for transport. A moving mechanism (not shown) is attached to the arm|seat, and the workpiece conveyance mechanism 60 moves to the left and right and the vertical direction in the figure. Figure 10 (b). When the exposure processing of the workpiece W1 and the workpiece W2 are aligned, the workpiece transport mechanism 60 is lowered, the workpiece W2 is held by the workpiece loading robot 61a, and the suction platform 33 is held by the workpiece robot 61b. Workpiece W1 on. The two workpiece transfer mechanisms 60 are moved up and moved in the right direction of the drawing. Figure 10 (c). When the workpiece loading machine 6 1 a holding the workpiece W 2 comes onto the adsorption stage 3 3 , the workpiece conveying mechanism 60 is lowered and the workpiece W 2 is placed on the adsorption stage 3 3 . The adsorption platform 3 3 adsorbs the workpiece W2. Further, the workpiece carrying-out robot 61b also places the holder W1 on the table of the apparatus for performing the development processing of the post-process, and holds the W2: The work will be carried out (the 201035694 is shown) when the pre-extractor of the suction machine is removed from the workpiece. The workpiece transfer mechanism moves to the left in the drawing and returns to the position of Fig. 10(a). The exposure processing of the workpiece W2 is started, and the workpiece to be subjected to the exposure processing is conveyed to the pre-alignment stage 50 by another transfer mechanism (not shown). [PRIOR ART DOCUMENT] [Patent Document 1] JP-A-2004-138878 (Patent Document 2) JP-A-2000-340635 (Summary of the Invention) When the substrate is printed, there is a case where the workpiece W is greatly warped. One of the reasons for this is that the printed circuit board is formed by adhering a metal such as a copper foil to a resin substrate, and therefore it is caused by a difference in thermal expansion rates of the two. The portion of the suction pad 62 attached to the robot 61 that is in contact with the workpiece W is made of a soft resin (rubber), and the slight warp of the workpiece W is treated with deformation. However, if the warpage is large, a gap may occur between the adsorption pad 62 and the workpiece W, and the vacuum for sucking and holding the workpiece w may leak and slowly lose the holding force. Here, for example, when the workpiece loading robot 61 a lifts the workpiece W from the pre-alignment stage 50, the workpiece W can be sucked and held, but if the suction holding force is lost while transporting it to the workpiece stage 30, The workpiece w is also dropped as shown in Fig. 11 of -8 201035694, and is sandwiched between the mirror 35 of the laser interferometer of the workpiece stage 30 and the slider 32. As described above, when the workpiece W is dropped by the robot 61 during transportation, the slider 32 moves, and the like, in particular, the slider 32 contacts the workpiece w to damage the workpiece W. In addition, there is also a case where the dropped workpiece W is attached to a precision component such as a laser gauge 34 or a mirror 35 mounted on the workpiece stage. 〇 To prevent this, it is considered that when the workpiece W is placed on the workpiece stage 30 by the pre-alignment stage 50, the slider 32 is first brought close to the pre-alignment stage 50 side. If this is the case, even if the workpiece W is dropped, there is no possibility that the workpiece W is placed on the suction stage 33 of the workpiece stage 30 to damage the workpiece W or the precision parts of the workpiece stage 30. However, as shown in Fig. 12, after the robots 61a, 61b take up the workpiece W1 of the pre-alignment stage 50 and the workpieces W1, W2 of the adsorption stage 33, the direction of the slider 32 will be toward the pre-alignment stage 5 After moving (Fig. 12 (3)), after the robot 61 places the workpiece w on the adsorption platform 33, the slider 32 moves to the exposure position below the projection lens 40 (Fig. 12(b)). As a result, the order in which the slider 32 moves toward the pre-alignment stage 50 and returns to the exposure position is increased as compared with the conveyance order of the workpiece w shown in the above-described FIG. 10, and thus the exposure processing time (tact) The present invention has been made in view of the above problems, and an object of the present invention is to provide an exposure apparatus which does not have a workpiece itself or a workpiece even if the workpiece is transported by the workpiece transporting mechanism - 9 - 201035694 when the workpiece is transported by the workpiece transport mechanism The condition of the table is damaged, and the working time (tact) does not become longer than the conventional technique. (Means for Solving the Problem) In the present invention, the above problems are solved as follows. An exposure apparatus that mounts a workpiece conveyed by a robot on a workpiece stage, transmits a light to a workpiece placed on the workpiece stage through a mask, and exposes a pattern formed on the mask on the workpiece The exposure device 'is a space between the transfer of the workpiece by the robot and the space between the transfer height (transport level) of the workpiece conveyed by the robot to the surface height of the suction platform of the workpiece stage, and the cable traversing the workpiece stage is laid. . The cable has the function of blocking the workpiece on the workpiece table when the workpiece is dropped by the robot. "It is also considered that if the cable is laid down in a single direction only, the blocked workpiece will fall between the cable and the cable, so that the cable can also be presented to the cable. The second cable is laid in the orthogonal direction. In addition, a mesh may be laid instead of the cable. (Effects of the Invention) In the present invention, the following effects can be obtained. Even if the workpiece is dropped by the robot', it is blocked by the cable or mesh crossing the workpiece table' without the workpiece falling on the workpiece table. Thereby, there is no possibility that the parts of the substrate or the workpiece stage are damaged. In addition, the -10 - 201035694 workpiece transfer order will not change and will not affect the operation time. Further, when the means for preventing the workpiece from falling is a cable, the second cable is laid in a direction orthogonal to the linear cable (the first cable), thereby preventing the workpiece from being connected to the first cable and the cable. Drop between them. [Embodiment] Fig. 1 is a schematic view showing the outline of an exposure apparatus according to a first embodiment of the present invention. Wherein the same components as those of the figure ίο are denoted by the same component symbols. The exposure apparatus of the present invention includes a light irradiation unit 10, a mask M on which a pattern transferred to the workpiece is formed, a mask table 20 holding the mask, and a workpiece W such as a printed circuit board or a liquid crystal panel that is subjected to exposure processing. The workpiece stage 30; and the projection lens 40 that projects the workpiece W formed on the workpiece stage 30 in the pattern of the mask μ. The light-irradiating portion 10 includes a lamp 11 as a source of light that emits ultraviolet light, and a mirror 12 that reflects light from the lamp 11. Further, the workpiece stage 30 is a flat table using a planar motor, and is provided with a die plate 31 and a slider (moving body) 32. The template 31 has a member in which a plane of a magnetic salient pole is provided in a checkerboard lattice shape, and on the template 31, the slider 3 2 floats due to the action of air. A magnetic force is applied to the slider 3 2 to cause a change in the magnetic field between the slider 3 2 and the salient pole of the template 31, whereby the slider 3 2 is moved over the template 31. The length of one side of the template 31 in this embodiment is 900 mm to 1200 mm, and the length of the side of the slider 32 is about 300 mm. -11 - 201035694 An adsorption platform 3 3 to which a vacuum pipe (not shown) is attached is attached to the slider 32, and the workpiece W subjected to the exposure process is adsorbed and held. The length of one side of the adsorption platform 33 in this embodiment is 500 mm to 600 mm. Further, a laser interferometer 34 for measuring the position of the slider 3 2 is mounted on the slider 32, and further, a mirror 3 for reflecting the laser light 36 from the laser interferometer 34 is mounted on the template 31. 5. The laser light 36 from the laser interferometer 34 is reflected by the mirror 35 and returned to the laser interferometer 34 to measure the position (moving distance) of the slider 32. The workpiece W adsorbed on the adsorption stage 33 moves the slider 3 2 surface by the laser interferometer 34 to detect the position, thereby dividing the exposure area into a plurality of pieces and sequentially exposing them. Further, in the pre-alignment stage 50, rough positioning (pre-alignment) of the workpiece stage 30 to the workpiece stage 30 before the exposure processing is performed. The robots 61a and 61b of the workpiece transport mechanism 60 carry the workpiece before the exposure from the pre-alignment stage 50 to the adsorption stage 33, and carry out the exposed workpiece from the adsorption stage 33. The robot 61 picks up the workpiece W by a plurality of adsorption pads 6 2 attached to the arm portion and transports it by suspension. In the exposure apparatus as described above, in order to prevent the workpiece W from falling on the workpiece stage 30, a wire 70 is laid over the workpiece stage 30 so as to traverse the workpiece stage 3''. As shown in Fig. 1, the range in the height direction of the cable 70 is set from the conveyance height (transport level) L1 of the workpiece W conveyed by the robot 61 to the height of the surface of the suction stage 33 of the workpiece stage 30. Between -12 and 201035694 between L2. A cable traversing the length of the workpiece stage 30 is laid in the space of this range. In Fig. 1, the cable 70 is laid on the inside of the front side of the figure, and only the cross section of the cable 70 is seen. The cable 70 has a diameter of about 1 mm. Further, the interval from the conveyance height (transport position) L 1 of the workpiece to the surface height L2 of the suction platform is about 20 mm. In the figure, in order to facilitate understanding, the diameter of the cable W and the workpiece conveyance level l 1 to The interval between the surface heights L2 of the adsorption platforms is relatively large and the display is relaxed. Further, in the range in which the horizontal direction of the cable 70 is provided, in addition to the range in which the workpiece W is placed on the adsorption stage 33 and the range in which the exposure light for exposing the workpiece W is irradiated, the robot is 61 The field in which the workpiece W is suspended for transport. In the present embodiment, an example is shown in which the cable 70 is disposed between the pre-alignment stage 50 and the suction platform 33. However, the 'cable 70 may be provided on the side where the workpiece w is carried out from the adsorption stage 33' or may be provided on the rain side of the adsorption platform 33. Further, in order to surely block the workpiece W' cable 70, it is preferable to set a plurality of columns. The cable 70 may be made of metal or resin. The cable 7 is a resin, and as described above, since the range in which the exposure light is irradiated is not set due to the shadow of the exposure light, there is no possibility of deterioration due to exposure light (ultraviolet rays). Fig. 2 is a perspective view showing the workpiece stage of the first embodiment of the enlarged 7K. On both sides of the template 31 (front side and inner side in FIG. 1), a cable mounting member A7 for mounting the cable 70 and a cable mounting member B72' are disposed on the two cable mounting members η, A cable 7 is placed between the 72s. -13- 201035694 In the present embodiment, the cable mounting members 71, 72 are spaced 1 800 mm apart, and the cable 70 has a diameter of about 1 mm. When the workpiece W is sequentially moved and exposed, there is a case where a part of the workpiece w adsorption platform 3 3 is placed beyond the template 3 1 . Therefore, in such a manner that the suction platform 33 does not come into contact with the cable mounting members 71, 72, the spacing of the wire mounting members 71, 72 is longer than the width of the template 31, and the sides of the template 31 are spaced apart. The cable 70 is extended from the cable mounting member A71 to the cable mounting structure B 7 2, and then folded back, and returned to the cable mounting member a 7 1 again. That is, the 'one cable' reciprocates between the cable attachment members 71 and 72 to form two rows of cable lines. In Fig. 2, four cable lines are formed by two cables 70. Below the cable 70 is for exposure processing, and the slider 32 to which the adsorption stage 33 on which the workpiece has been placed is moved. Therefore, the pillars such as the support cable 70 cannot be provided between the cable anchor members 71 and 72. Fig. 3 is a view of the cable mounting structure A71 viewed from the direction of the arrow A of Fig. 2, Fig. 4 A view of the cable security member B72 is viewed from the direction of the arrow B in Fig. 2 . The drawing of the cable 70 will be described using Figs. 3 and 4. As shown in Fig. 3, a spring 80 is attached to one end of the cable 70, and the side of the spring 80 to which the cable 70 is not attached is fixed to the cable mounting structure A71. The wire 7 of one end of the cable mounting member A71 is fixed by the spring 80 so as to be affixed by the cable mounting member A7 1 across the template of the workpiece table 30. The manner of cable 3 1 -14 - 201035694 extends to the cable mounting member B72. As shown in Fig. 4, the cable 70 that has reached the cable attachment member B72 has a predetermined width and is folded back by the two cable folding members 81 attached to the cable attachment member B 7 2, again. It is traversed on the template 3 1 of the workpiece stage 30 and faces the cable mounting member A7 1 . The cable 70 that has reached the cable attachment member A7 1 is wound by the winding screw 83 through the pressure plate 82 that prevents the position of the cable 70 from shifting. When the screw 8 3 is wound around the coil, the spring 80 extends, and tension is applied to the cable 70 that reciprocates between the cable mounting member A71 and the cable mounting member B72. The cable 70 occurs over time. When slack, the tension can be applied to the cable 70 again by winding the winding screw 83. Fig. 5 is a graph showing the relationship between the bending of a cable of 1 800 mm and the force (gravity) applied to the cable. As described above, the interval from the workpiece transport height (〇 transport level) L1 to the surface height L2 of the suction stage 33 of the workpiece stage 30 for the cable 70 is about 20 mm, and the first and second cables are installed. The spacing of the members 71, 72, that is, the length of the single pass of the cable 70 is 1 800 mm. If there is a large bending of the cable 7〇, the cable 70 may be stuck by the suction platform 33 on the slider 32 moving thereunder, causing a bad cause of the device. Therefore, the inventor has a cable length of 1 800 mm. The relationship between the bending ω of the line (φ 1 mm ) and the tension (weight) f applied to the cable was investigated. As shown in Fig. 5, when the weight of the -15-201035694 fixed code is set such that the tension F of the cable is 10 ,, the bending amount ω of the cable is about 1 m m. When the weight of the δ code is set so that the tension f is 20N, the bending amount ω of the line is about 0.5 mm. Further, when the weight of the land code is set such that the tension F is 40 ,, the bending amount ω of the cable is 0.5 mm or less. From this result, it is understood that if the tension of 20 N or more (preferably 40 N or more) is applied to the cable 70 by the spring 81 and the winding screw 83 shown in Fig. 3, there is no cable 70 and The case where the moving adsorption platform 33 is in contact with each other. Among them, in order to block the workpiece from falling by the robot, it is also possible to provide a metal rod or a plate member instead of a cable as a roof. However, this causes problems such as the following, and is considered to be suitable for the cost, the difficulty of production, the miniaturization of the apparatus, and the ease of correction work when the members are bent. When the member that blocks the falling of the workpiece is a metal bar or a plate member, for example, if it is a length of 1 800 mm, the pillar cannot be provided on the way as described above, so when the thickness of the bar is thin or the thickness of the plate is thin, it is due to itself. The weight is bent, and a part thereof is protruded from the range from the workpiece transfer position L1 to the adsorption table surface height L2 at which the workpiece fall prevention member can be disposed, and there is a case where it is in contact with the adsorption stage 33 moving thereunder. Therefore, the rod-shaped member or the plate-like member must be thickened or thickened by a thickness of 20 mm which does not protrude from the interval from the workpiece conveying position L1 to the suction platform surface height L2. However, as a result, the weight of the round bar or the plate increases, the price becomes higher, and the workpiece table is also enlarged. -16- 201035694 Further, it is difficult to mount a heavy and thick round bar or a thick plate-like member between the workpiece transfer level L1 and the suction platform surface height L2 of only about 20 mm. Further, although it is considered that the rod-shaped member or the plate-like member as described above may be bent over time, if it is bent, it can only be replaced with a new one, and the cost of replacement of parts may occur, and the replacement operation time becomes longer. . In contrast, the cable is thin and lightweight, and the price is relatively inexpensive. Further, even if bending occurs over time, the tension can be applied again by merely winding the winding screw. Fig. 6 is a perspective view showing a workpiece stage of an exposure apparatus according to a second embodiment of the present invention. In the first embodiment shown in Fig. 5, the cable 7 is provided with a plurality of columns 'but the wires extend in the same direction. Therefore, when the workpiece W is dropped by the robot 6 1 ' even if it is temporarily blocked by the cable 70, there is a case where the cable and the cable are dropped below. In the countermeasures, as shown in Fig. 6, the second cable 73 is provided in a direction orthogonal to the cable (first cable) 70 shown in the first embodiment. The second cable 73 is one of the first cables! The cable 7 is attached to the other, and the other is attached to the second cable attachment member 74. Fig. 7 is a view of the second cable mounting member 74 viewed from the direction of the arrow C of Fig. 6. The table 2 cable 73 is formed by forming one of the hooks into a hook shape or forming a circle to be connected to the first cable 70, and winding the other side to the second cable -17-201035694 mounting member 74. Wind the screw 8 3 . Thereby, the second cable 73 can be disposed in a direction orthogonal to the first cable 70. The first cable 70 is bent by the tension of the second cable 73. However, if the workpiece W can be blocked, there is no problem even if it is slightly bent. By providing the second cable 73, the cable is laid into a cross, so that the care of the workpiece falling between the cable and the cable disappears. Among them, in order to surely block the workpiece W, the second cable 73 is preferably provided with a plurality of columns. Door Fig. 8 is a view showing an example of other laying methods of the cable provided across the workpiece stage. In the first embodiment described above, the cable is provided so as to traverse the workpiece stage between the two sides of the four corner stencils of the workpiece stage. However, as shown in Fig. 8, the cable 70 may be disposed obliquely with respect to the side of the template 3 1 between the sides adjacent to the template 3 1 . Even if the cable is set as described above, the workpiece can be prevented from falling on the workpiece stage. Fig. 9 is a view showing an example in which a mesh is placed on the workpiece stage instead of the linear cable II. Even if a mesh is used, the workpiece can be prevented from falling on the workpiece stage. However, when using a mesh, in order to prevent slack, it is necessary to try to apply tension to the mesh in the longitudinal and lateral directions. Therefore, as shown in Fig. 9, the mesh 90 is formed with a square mesh so that the vertices of the four corners of the mesh can be pulled diagonally to make the string of the mesh 90 (chord) Line) 9 1 extends in the direction of 4. One of the strings 91 extending in the four directions is a cable 70 that is attached to the die plate 31 and is tensioned by an -18 - 201035694. The remaining three-direction string is attached to the winding screw 8 3 of the mesh mounting member 9 2 provided on the three sides of the die plate 31. When the respective strings 91 are tightened by the respective winding screws 83, the mesh 90 is also tensioned by the cable 70, so that it extends in the diagonal direction of the four-corner mesh and the vertical and horizontal directions of the mesh 90 as a whole. Apply tension. Thereby, the mesh 90 can be set without looseness. Even if the web 90 is slack due to the passage of time, the tension can be easily reapplied by winding the winding screw 83. Here, the range of the network 90 is set to be the same as that of the above-described setting cable. Regarding the height direction, the conveyance height (transport position) L1 of the workpiece W is transferred by the robot 61 to the surface height L2 of the suction stage 3 3 of the workpiece stage 30, and the workpiece W is placed in the horizontal direction. The field in which the workpiece W is conveyed by the robot 61 is outside the range of the adsorption stage 3 3 and the range in which the exposure light for exposing the workpiece W is irradiated. Further, similarly to the cable, the material of the mesh may be made of metal, and the material of U may be made of resin. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the configuration of an exposure apparatus according to a first embodiment of the present invention. Fig. 2 is an enlarged perspective view showing the workpiece stage of the first embodiment. Fig. 3 is a view of the cable attachment member a viewed from the direction of the arrow A of Fig. 2. Fig. 4 is a view of the cable mounting member b -19- 201035694 viewed from the direction of the arrow B of Fig. 2. Fig. 5 is a view showing the relationship between the bending of the cable and the force applied to the cable. Fig. 6 is a perspective view showing the workpiece stage of the exposure apparatus according to the second embodiment of the present invention. Fig. 7 is a view of the second cable mounting member viewed from the direction of the arrow C in Fig. 6. Figure 8 is a diagram showing an example of other ways of laying cables. Figure 9 is a diagram showing an example of setting a mesh on a workpiece stage. Fig. 10 is a view showing an outline of a configuration of an exposure apparatus of the prior art and an operation thereof. Figure U shows a state diagram of the workpiece falling on the workpiece table. Figure 12 is a diagram showing the movement of the slider between the pre-alignment stage 50 and the exposure position. [Description of main component symbols] 1 〇: Light irradiation unit 1 1 : Lamp 1 2 : Mirror 2 〇: Mask table 3 0 : Work table 3 1 : Template 3 2 ··Slider (moving body) 3 3 : Adsorption Platform-20- 201035694 34: Laser Interferometer 3 5: Mirror 3 6 : Laser Light 40 0: Projection Lens 50: Pre-Alignment Table 60: Workpiece Transfer Mechanism 61, 61a, 61b: Robot Hand 62: Adsorption Pad 63: Arm 70: cable

71 :纜線安裝構件A71: Cable mounting member A

72 :纜線安裝構件B 73 :第2纜線 74 :第2纜線安裝構件 8 0 :彈簧 Ο 8 1 :纜線折返構件 8 2 :壓板 8 3 :捲繞螺絲 9 0 :網狀物 91 :網狀物的細繩(弦線) 92 :網狀物安裝構件 Μ :遮罩 W、W1、W 2 :工件 L 1 :工件的搬送高度(搬送位級) -21 - 201035694 L2 :吸附平台的表面高度 -22-72: cable mounting member B 73: second cable 74: second cable mounting member 80: spring Ο 8 1 : cable folding member 8 2 : pressure plate 8 3 : winding screw 9 0 : mesh 91 : String of mesh (string) 92 : Mesh mounting member Μ : Mask W, W1, W 2 : Work piece L 1 : Transfer height of workpiece (transport level) -21 - 201035694 L2 : Adsorption platform Surface height-22-

Claims (1)

201035694 七、申請專利範圍: 1. 一種曝光裝置,係將藉由機械手所搬送的工件載 置在工件台,對載置在該工件台的工件透過遮罩來照射光 ,在上述工件上對形成在上述遮罩的圖案進行曝光的曝光 裝置,其特徵爲: 在機械手搬送工件的領域,且爲由機械手搬送工件的 搬送高度至工件台表面高度爲止之間的空間,橫越上述工 〇 件台舖設有纜線。 2. 如申請專利範圍第1項之曝光裝置,其中,由上 述纜線在對該纜線呈正交的方向舖設有第2纜線。 3. 一種曝光裝置,係將藉由機械手所搬送的工件載 置在工件台,對載置在該工件台的工件透過遮罩來照射光 ,在上述工件上對形成在上述遮罩的圖案進行曝光的曝光 裝置,其特徵爲: 在機械手搬送工件的領域,且爲由機械手搬送工件的 〇 搬送高度至工件台表面高度爲止之間的空間,橫越上述工 件台舖設有網狀物。 -23-201035694 VII. Patent application scope: 1. An exposure apparatus for placing a workpiece conveyed by a robot on a workpiece stage, and irradiating light to a workpiece placed on the workpiece stage through a mask, on the workpiece An exposure apparatus formed by exposing a pattern of the mask to a surface in which the robot transports the workpiece and the space between the conveyance height of the workpiece conveyed by the robot to the surface height of the workpiece table is traversed Cables are provided in the shop. 2. The exposure apparatus of claim 1, wherein the second cable is laid in a direction orthogonal to the cable by the cable. 3. An exposure apparatus in which a workpiece conveyed by a robot is placed on a workpiece stage, and a workpiece placed on the workpiece stage is irradiated with light through a mask, and a pattern formed on the mask is formed on the workpiece. An exposure apparatus for performing exposure is characterized in that: in a field in which a robot conveys a workpiece, and a space between a crucible conveyance height at which the robot conveys the workpiece to a surface height of the workpiece table, a mesh is laid across the workpiece stage . -twenty three-
TW099100701A 2009-03-19 2010-01-12 Exposure device TWI457717B (en)

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JP5556774B2 (en) 2011-09-16 2014-07-23 ウシオ電機株式会社 Exposure equipment
JP6773435B2 (en) * 2016-03-31 2020-10-21 株式会社オーク製作所 Exposure device
CN110712999A (en) * 2019-07-30 2020-01-21 江苏盟星智能科技有限公司 Automatic feeding device and method for laser exposure machine
CN113419405B (en) * 2021-04-28 2022-06-03 厦门理工学院 Roll-to-roll copper foil precise LDI exposure machine

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JPS58140637U (en) * 1982-03-17 1983-09-21 株式会社日立製作所 Wafer holding mechanism
JP2818074B2 (en) * 1992-05-22 1998-10-30 大日本スクリーン製造株式会社 Pre-alignment equipment for proximity exposure equipment
JPH0786118A (en) * 1993-06-30 1995-03-31 Canon Inc Vertical substrate stage unit and aligner employing the same
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