JPS58140637U - Wafer holding mechanism - Google Patents

Wafer holding mechanism

Info

Publication number
JPS58140637U
JPS58140637U JP3631282U JP3631282U JPS58140637U JP S58140637 U JPS58140637 U JP S58140637U JP 3631282 U JP3631282 U JP 3631282U JP 3631282 U JP3631282 U JP 3631282U JP S58140637 U JPS58140637 U JP S58140637U
Authority
JP
Japan
Prior art keywords
wafer
holding mechanism
wafer holding
wafer support
driven
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3631282U
Other languages
Japanese (ja)
Other versions
JPS6234443Y2 (en
Inventor
克己 登木口
徹 土生
実 内山
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP3631282U priority Critical patent/JPS58140637U/en
Publication of JPS58140637U publication Critical patent/JPS58140637U/en
Application granted granted Critical
Publication of JPS6234443Y2 publication Critical patent/JPS6234443Y2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、重力落下を使った半導体ウェハー保持機構の
従来構成図、第２図は本考案によるウェハー保持機構の
構成図、第３図は本考案に基づく別の実施例の構成図で
ある。 １・・・半導体ウェハー、２・・・光センサ−，３・・
・電源、４・・・ストッパー駆動系、５・・・ストッパ
ー、６・・・ウェハー支持板、７・・・チェーン、８・
・・ワイヤー、８“・・・テフロンコーティング、８′
・・・金属線材、９・・・ウェハー支持部材、１０・・
・イオンビーム、１１・・・歯車。FIG. 1 is a diagram showing a conventional structure of a semiconductor wafer holding mechanism using gravity falling, FIG. 2 is a diagram showing a structure of a wafer holding mechanism according to the present invention, and FIG. 3 is a diagram showing a configuration of another embodiment based on the present invention. . 1... Semiconductor wafer, 2... Optical sensor, 3...
・Power supply, 4... Stopper drive system, 5... Stopper, 6... Wafer support plate, 7... Chain, 8...
...Wire, 8"...Teflon coating, 8'
...Metal wire, 9...Wafer support member, 10...
・Ion beam, 11...gear.

Claims (1)

【実用新案登録請求の範囲】 ■　真空中に置かれ゛たウェハーを重力による落下で目
的とする位置に設けられたウェハー支持体に搬送し装着
するウェハー保持機構において、上記ウェハー支持体と
して直径が２叫を超えない弾力性のある金属ワイヤーを
用い、かつ、上記ワイヤーの表面に弾力性物質からなる
被覆層を設け、以って落下に伴い上記ウェハー支持体と
上記ウェハーとの衝突で発生する上記ウェハーの欠け、
或いは割れを防止するようにしたことを特徴とするウェ
ハー保持機構。 ２　実用新案登録請求の範囲第１項記載のウェハー保持
機構において、上記ウェハー支持体をチェーンに取付け
、上記チェーンで閉じた無限軌道を形成してこれを駆動
せしめ、かつ、上記軌道中に直線移動部分を設け、上記
直線部分で上記ウェハーの落下・移動を行うように構成
したことを特徴とするウェハー保持機構。[Claims for Utility Model Registration] ■ In a wafer holding mechanism in which a wafer placed in a vacuum is transported and attached to a wafer support provided at a target position by falling due to gravity, the wafer support has a diameter A metal wire with an elasticity of not more than 2 mm is used, and a coating layer made of an elastic material is provided on the surface of the wire, so that collisions between the wafer support and the wafer occur when the wafer falls. Chips in the above wafer,
Alternatively, a wafer holding mechanism is characterized in that it prevents cracking. 2. In the wafer holding mechanism according to claim 1 of the utility model registration, the wafer support is attached to a chain, the chain forms a closed endless track, which is driven, and the wafer support body is driven by a closed endless track, and the wafer support body is driven by a closed endless track. A wafer holding mechanism characterized in that the wafer holding mechanism is configured such that the wafer is dropped and moved by the linear portion.
JP3631282U 1982-03-17 1982-03-17 Wafer holding mechanism Granted JPS58140637U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3631282U JPS58140637U (en) 1982-03-17 1982-03-17 Wafer holding mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3631282U JPS58140637U (en) 1982-03-17 1982-03-17 Wafer holding mechanism

Publications (2)

Publication Number Publication Date
JPS58140637U true JPS58140637U (en) 1983-09-21
JPS6234443Y2 JPS6234443Y2 (en) 1987-09-02

Family

ID=30047748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3631282U Granted JPS58140637U (en) 1982-03-17 1982-03-17 Wafer holding mechanism

Country Status (1)

Country Link
JP (1) JPS58140637U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010217803A (en) * 2009-03-19 2010-09-30 Ushio Inc Exposure apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5194733A (en) * 1975-02-19 1976-08-19 Puroguramuni okeru seigyono nagareno kanrihoshiki
JPS5666054A (en) * 1979-11-02 1981-06-04 Nec Kyushu Ltd Holder for semiconductor substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5194733A (en) * 1975-02-19 1976-08-19 Puroguramuni okeru seigyono nagareno kanrihoshiki
JPS5666054A (en) * 1979-11-02 1981-06-04 Nec Kyushu Ltd Holder for semiconductor substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010217803A (en) * 2009-03-19 2010-09-30 Ushio Inc Exposure apparatus

Also Published As

Publication number Publication date
JPS6234443Y2 (en) 1987-09-02

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