JPS58140637U - Wafer holding mechanism - Google Patents
Wafer holding mechanismInfo
- Publication number
- JPS58140637U JPS58140637U JP3631282U JP3631282U JPS58140637U JP S58140637 U JPS58140637 U JP S58140637U JP 3631282 U JP3631282 U JP 3631282U JP 3631282 U JP3631282 U JP 3631282U JP S58140637 U JPS58140637 U JP S58140637U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- holding mechanism
- wafer holding
- wafer support
- driven
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は、重力落下を使った半導体ウェハー保持機構の
従来構成図、第2図は本考案によるウェハー保持機構の
構成図、第3図は本考案に基づく別の実施例の構成図で
ある。
1・・・半導体ウェハー、2・・・光センサ−,3・・
・電源、4・・・ストッパー駆動系、5・・・ストッパ
ー、6・・・ウェハー支持板、7・・・チェーン、8・
・・ワイヤー、8“・・・テフロンコーティング、8′
・・・金属線材、9・・・ウェハー支持部材、10・・
・イオンビーム、11・・・歯車。FIG. 1 is a diagram showing a conventional structure of a semiconductor wafer holding mechanism using gravity falling, FIG. 2 is a diagram showing a structure of a wafer holding mechanism according to the present invention, and FIG. 3 is a diagram showing a configuration of another embodiment based on the present invention. . 1... Semiconductor wafer, 2... Optical sensor, 3...
・Power supply, 4... Stopper drive system, 5... Stopper, 6... Wafer support plate, 7... Chain, 8...
...Wire, 8"...Teflon coating, 8'
...Metal wire, 9...Wafer support member, 10...
・Ion beam, 11...gear.
Claims (1)
的とする位置に設けられたウェハー支持体に搬送し装着
するウェハー保持機構において、上記ウェハー支持体と
して直径が2叫を超えない弾力性のある金属ワイヤーを
用い、かつ、上記ワイヤーの表面に弾力性物質からなる
被覆層を設け、以って落下に伴い上記ウェハー支持体と
上記ウェハーとの衝突で発生する上記ウェハーの欠け、
或いは割れを防止するようにしたことを特徴とするウェ
ハー保持機構。 2 実用新案登録請求の範囲第1項記載のウェハー保持
機構において、上記ウェハー支持体をチェーンに取付け
、上記チェーンで閉じた無限軌道を形成してこれを駆動
せしめ、かつ、上記軌道中に直線移動部分を設け、上記
直線部分で上記ウェハーの落下・移動を行うように構成
したことを特徴とするウェハー保持機構。[Claims for Utility Model Registration] ■ In a wafer holding mechanism in which a wafer placed in a vacuum is transported and attached to a wafer support provided at a target position by falling due to gravity, the wafer support has a diameter A metal wire with an elasticity of not more than 2 mm is used, and a coating layer made of an elastic material is provided on the surface of the wire, so that collisions between the wafer support and the wafer occur when the wafer falls. Chips in the above wafer,
Alternatively, a wafer holding mechanism is characterized in that it prevents cracking. 2. In the wafer holding mechanism according to claim 1 of the utility model registration, the wafer support is attached to a chain, the chain forms a closed endless track, which is driven, and the wafer support body is driven by a closed endless track, and the wafer support body is driven by a closed endless track. A wafer holding mechanism characterized in that the wafer holding mechanism is configured such that the wafer is dropped and moved by the linear portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3631282U JPS58140637U (en) | 1982-03-17 | 1982-03-17 | Wafer holding mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3631282U JPS58140637U (en) | 1982-03-17 | 1982-03-17 | Wafer holding mechanism |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58140637U true JPS58140637U (en) | 1983-09-21 |
JPS6234443Y2 JPS6234443Y2 (en) | 1987-09-02 |
Family
ID=30047748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3631282U Granted JPS58140637U (en) | 1982-03-17 | 1982-03-17 | Wafer holding mechanism |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58140637U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010217803A (en) * | 2009-03-19 | 2010-09-30 | Ushio Inc | Exposure apparatus |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5194733A (en) * | 1975-02-19 | 1976-08-19 | Puroguramuni okeru seigyono nagareno kanrihoshiki | |
JPS5666054A (en) * | 1979-11-02 | 1981-06-04 | Nec Kyushu Ltd | Holder for semiconductor substrate |
-
1982
- 1982-03-17 JP JP3631282U patent/JPS58140637U/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5194733A (en) * | 1975-02-19 | 1976-08-19 | Puroguramuni okeru seigyono nagareno kanrihoshiki | |
JPS5666054A (en) * | 1979-11-02 | 1981-06-04 | Nec Kyushu Ltd | Holder for semiconductor substrate |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010217803A (en) * | 2009-03-19 | 2010-09-30 | Ushio Inc | Exposure apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPS6234443Y2 (en) | 1987-09-02 |
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