TW201035671A - Lens fine-tuning mechanism of probe type test device - Google Patents

Lens fine-tuning mechanism of probe type test device Download PDF

Info

Publication number
TW201035671A
TW201035671A TW98109779A TW98109779A TW201035671A TW 201035671 A TW201035671 A TW 201035671A TW 98109779 A TW98109779 A TW 98109779A TW 98109779 A TW98109779 A TW 98109779A TW 201035671 A TW201035671 A TW 201035671A
Authority
TW
Taiwan
Prior art keywords
lens
fine
test device
type test
mirror
Prior art date
Application number
TW98109779A
Other languages
Chinese (zh)
Other versions
TWI390335B (en
Inventor
Evan Huang
Darren Cheng
Original Assignee
Pleader Yamaichi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pleader Yamaichi Co Ltd filed Critical Pleader Yamaichi Co Ltd
Priority to TW98109779A priority Critical patent/TWI390335B/en
Publication of TW201035671A publication Critical patent/TW201035671A/en
Application granted granted Critical
Publication of TWI390335B publication Critical patent/TWI390335B/en

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Lens Barrels (AREA)
  • Microscoopes, Condenser (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

A lens fine-tuning mechanism of probe type test device includes a circuit board, a lens base, a support unit, and a plurality of probes. The support unit is provided to fix the relative position of the circuit board and the probes and also electrically connect the plurality of probes to the circuit board. The fine-tuning mechanism is composed of the lens base and a carrying base of the support unit. At least one lens set is disposed at the lens base. The lens base is installed in the carrying base. By adjusting the position of the lens base, it is able to achieve the purpose of correcting the position for the lens of the probe type test device.

Description

201035671 六、發明說明: 【發明所屬之技術領域】 本發明為-種鏡頭顿調機構,主要是運麟一種影像感測 晶片所使用的探針式測試装置處。 【先前技術】 、,數位相機或數位攝影機的發展曰新月異,所使用的技術包括 光子電機、電子等’在眾多零件之中,影像感測晶片可視為關 鍵零件。影像感測晶片製作過程近似於IC晶片模式,一般IC晶 片製私相胃的繁额耗時’而影像感測晶片更勝於它。為了讓影 像感在生產4’更節省成本、提昇製程速度及產品品質, 有魏商希望能在影像_晶片製程巾的前段測試作針,提早 ,用鏡頭(Lens)來辅助測試,模擬實際使用時的感光狀態,藉此 提早刹除不良品,讓產品製作過程中達到較佳的經濟效益盘 控制。 、 、目’則热像感測晶片的測試裝置,有許多不同的探針接觸 方式,例如採㈣臂式探針(Cantilever prObe)、冑直式探針 (Vertical pr〇be)、彈簧式探針(Spring pr〇be)··.等每種不同 的測式裝置都會制纽鏡頭組關題。當額電路的快速發 展,越來越有多財_測試型態,探針式測試裝置製作時如無 法加入鏡獅錢錢在其上方織_,可能轉致無法於: 3 201035671 像感測=θθ片測試出光學測試區域,或影像感測晶片無法對光源 產生的電性反應。因此本發明人則思考設計—種微調機構, 讓、兄頁整正;g|的安裝於測試介面上,並進行相對位置的校 正調整。 【發明内容】 本七明之主要目的是提供—麵針式職裝置之鏡頭微調機 構,該微調機構主要對鏡頭組的水平方向(如X軸方向、y軸方 向)、二及微量的旋轉角度進行調整,另外鏡頭組也能進行焦距位 料又正藉此滿足測試裝置欲對鏡頭組進行微調的目的。 為達上述之目的’本發明探針式測試置主要包括有電路板、 二頭座、支撐單元、以及複數探針。該支料元用以狀著複數 ^針與前述電路板的相對位置,並使複數探針與電路板相電201035671 VI. Description of the Invention: [Technical Field] The present invention is a lens-adjusting mechanism, which is mainly used as a probe type test device for an image sensing wafer. [Prior Art] The development of digital cameras or digital cameras is changing rapidly. The technologies used include photonic motors, electronics, etc. Among many parts, image sensing wafers can be regarded as critical parts. The image sensing wafer fabrication process is similar to the IC wafer mode, which is generally more time consuming than the IC wafer system. The image sensing wafer is better than it. In order to make the image sense in the production 4' more cost-effective, improve the process speed and product quality, Wei Shang hopes to test the needle in the front part of the image processing wafer, and use the lens (Lens) to assist the test and simulate the actual use. The sensitization state of the time, in order to brake off the defective products early, and achieve better economic efficiency disk control during the production process. , ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Needle (Spring pr〇be)··. Each of the different measuring devices will make a new lens group. As the rapid development of the circuit, there are more and more _ test type, if the probe test device can not be added to the mirror lion money on the woven _, it may not be able to: 3 201035671 like sensing = The θθ sheet tests the optical test area, or the image sensing wafer cannot react electrically to the light source. Therefore, the inventors thought about the design-type fine-tuning mechanism, and let the brother page be corrected; g| is installed on the test interface, and the relative position correction is adjusted. SUMMARY OF THE INVENTION The main purpose of the present invention is to provide a lens fine adjustment mechanism for a face-and-needle type device, which mainly performs a horizontal direction (such as an X-axis direction, a y-axis direction) of the lens group, and a second and a slight rotation angle. Adjustment, and the lens group can also perform the focal length material to meet the purpose of the test device to fine-tune the lens group. For the above purposes, the probe type test set of the present invention mainly includes a circuit board, a two-seat base, a support unit, and a plurality of probes. The material element is used to shape the relative position of the plurality of pins and the circuit board, and the plurality of probes are electrically connected to the circuit board

是由支撐單元之承載座與鏡頭座所構成。該鏡 定件而、用 之鏡頭組。.該鏡頭座垂直方向具有複數個固 而環壁的水平方_具有複數贿調件。該承载座能 ^述鏡頭麵置其上,該鏡·的微解在 ::!Γ'------ 而固定件則能綱於與承载座處,作為微調後的固定之用 圍,將上 兹配合下列圖示、實施例之詳細說明及申請專利範 4 201035671 述及本創作之其他目的與優點詳述於後。 【實施方式】 第圖所不’為本發明探針式測試農置之鏡頭組微調機構 的剖面圖。本㈣之探物瓣置主要包括有-電路板丨、-鏡 =2、—續單元3、⑽魏_。該支撐單元3能固定著 :木針4及電路板丨,並使探針4與該電路板丨上的線路相電性連 ❹ϋ本實施财該探針4為懸臂式探針型式,但並不以此為限, 的柯雜錢料、_式撕,但鱗奴撐單元3 的恕構也會相對改變。 触構主较倾支料元3之承餘31與該鏡 〇 21是由數顧时未細tir輸21 ’該鏡頭組 鏡頭座2處具有八個鏡頭組=同=構。在本實施單-像感測晶片_試。能進行多個影 22 22 5 該鏡頭座2 _开〜w 於接近圓周邊緣處。 水平方向2=:^24,在環壁24的部份區段的 25 24 1 ^ 25_卸—㈣下。該鏡:== 5 201035671 組M的位置處是提供一螺紋孔26與之配合,使得鏡頭組2i能進 行焦距位置(圖令的垂直方向)的調整。 該支擇單元3主要包括承載座3卜支撐板%及固定物抑所 構成。該支撐板32位於電路板!上面,該承載座&與電路板^ f以螺絲細方式狀於支 32下面。該岐物33為黏著劑,It is composed of a bearing base and a lens holder of the supporting unit. This lens is used for the lens assembly. The lens mount has a plurality of solid horizontal walls in the vertical direction - with multiple bribes. The carrier can be mounted on the lens surface, the micro-solution of the mirror is::!Γ'------ and the fixing member can be used as the fixed seat for the fine adjustment. Further details and advantages of the present invention will be described in conjunction with the following drawings, the detailed description of the embodiments, and the patent application 4 201035671. [Embodiment] The figure is not a cross-sectional view of the lens group fine adjustment mechanism of the probe type test farm of the present invention. The probe flap of this (4) mainly includes - circuit board -, - mirror = 2, - continuation unit 3, (10) Wei _. The support unit 3 can fix the wooden needle 4 and the circuit board 丨, and electrically connect the probe 4 to the circuit on the circuit board ❹ϋ. The probe 4 is a cantilever probe type, but Not limited to this, the amount of money, _ style tear, but the size of the slaving unit 3 will also change relatively. The contact structure of the main body of the tilting material element 3 is 31 and the mirror 21 is not thinned by the tir. 21' lens group has two lens groups = the same structure. In this implementation, the single-image sensing wafer is tested. Can perform multiple shadows 22 22 5 The lens mount 2 _ open ~ w is near the edge of the circumference. The horizontal direction 2 =: ^24, under the 25 24 1 ^ 25_ unloading - (d) of the partial section of the annular wall 24. The mirror: == 5 201035671 The position of the group M is provided with a threaded hole 26 to match, so that the lens group 2i can be adjusted in the focal position (the vertical direction of the figure). The selection unit 3 mainly comprises a support base 3 and a support member. The support plate 32 is located on the circuit board! Above, the carrier & and the circuit board are in a screw-like manner under the branch 32. The boot 33 is an adhesive.

G Ο 献振針4固定於該承载座31底部。前述結構主要是依探針4型 式而為相對的設計’例如本實施是使麵式探針。當探針為不 同型式時’該支撐單元3的部份結構也會呈相對的改變。在本發 明之特殊處是該承載座31能使該鏡頭座2放置於此,並進行位置 ^周整。該輸31處形成有—_ 31()。該承_⑽形狀 疋配合該鏡 2的外型,但尺寸較大。⑽底部並未 封閉’當光源於電路板1上方照射時,光線能經鏡頭组21聚_ 射於電路板下方的區域。該承編1另外具有複數螺紋孔311, 位置及數目是對應該固定件22。 如第三、四圖所示,為本發明之俯視圖及調整時之剖 2=為-種微調機構,因此圖中所呈現的間隙並非很大,# 僅4拾_的範圍。本發明微調機構主要對鏡頭座的 (如X軸额、y轴方向及斜向)、以及微量的旋_度α 整:調整後連帶著也會改變鏡頭組21的位置。該鏡頭二是:: ㈣承載座31之容置槽则内,欲進行水平方向的調整時,^旋 6 201035671 轉鏡頭座2上單-方向的微調件25,使單一方向的各微餅25 皆頂掣於承载座31的側壁,即能鏡頭座2產生單向的偏移。如果 要使鏡頭座2產生微量的旋轉肖度0,貞彳將部份微調件旋轉伸 出,部份_,就誠生旋_效果。當微觀成後,再將固定 件22鎖固於承載座31之螺絲孔311處(如第一圖所示),即可固 定該鏡頭座2與承餘31的相對位置。之後該微調件25就可直 接拆卸取下。 〇 &合以上所述’本發明是提供一種探針式測試裝置之鏡頭微 "周機構’滿足楝針式試裝置欲對鏡頭組進行微調的目的。 惟’以上所述者’僅為本創作之列舉實施例而已,當不能以 此限定本創作實施之範圍。即大驗本創作申請專纖圍所作之 均等變化與修飾,皆應仍屬本鑛專利涵蓋之範圍内。 〇 【圖式簡單說明】 第-圖為本發明之剖面圖,但在圖中的鏡頭組並未以剖面方式表 示; 第二圖為本發明之承載额鏡觀之立體圖; 第二圖為本發明之承餘與鏡頭座的俯視圖; 第四圖為本發明進行微調時之剖面示意圖。 7 201035671 【主要元件符號說明】 1電路板 2鏡頭座 21鏡頭組 22固定件 24環壁 25微調件 3支撐單元 ❹ 31承載座 ' 310承載槽 ' 311螺絲孔 32支撐板 33固定物 4探針G 献 The vibrating pin 4 is fixed to the bottom of the carrier 31. The foregoing structure is mainly a relative design according to the probe 4 type. For example, the present embodiment is a surface probe. When the probes are of different types, the partial structure of the support unit 3 will also change relatively. In the special feature of the present invention, the carrier 31 allows the lens holder 2 to be placed there and is placed in position. The input 31 is formed with -_31(). The shape of the bearing _(10) fits the shape of the mirror 2, but the size is large. (10) The bottom is not closed. When the light source is illuminated above the circuit board 1, light can be concentrated through the lens group 21 to the area under the circuit board. The carrier 1 additionally has a plurality of threaded holes 311 in a position and number corresponding to the fasteners 22. As shown in the third and fourth figures, the top view of the present invention and the cross-section of the adjustment 2 = are fine adjustment mechanisms, so the gap presented in the figure is not very large, and the range of #4__ is only _. The fine adjustment mechanism of the present invention mainly changes the position of the lens group 21 for the lens holder (such as the X-axis amount, the y-axis direction and the oblique direction), and the micro-rotation degree α: The second lens is: (4) The receiving groove of the bearing seat 31 is inside, and when the horizontal direction is to be adjusted, the 6-way rotation of the lens holder 2 on the single-direction fine adjustment member 25, so that each micro-cake 25 in a single direction All of them are placed on the side wall of the carrier 31, that is, the lens holder 2 can be unidirectionally offset. If the lens mount 2 is to produce a slight rotation degree of 0, 部份 rotate some of the fine adjustment parts out, and part of _, it will be _ _ effect. After the microscopic formation, the fixing member 22 is locked to the screw hole 311 of the bearing seat 31 (as shown in the first figure), and the relative position of the lens holder 2 and the bearing 31 can be fixed. The fine adjustment member 25 can then be removed and removed directly. The present invention provides a lens micro- "circumference mechanism' for a probe type test device that satisfies the purpose of fine-tuning the lens group. However, 'the above' is only an enumerated example of the present invention, and the scope of the present implementation cannot be limited thereby. That is to say, the equal changes and modifications made by the special application for the creation of the special fiber should still be within the scope covered by the mine patent. 〇 [Simplified description of the drawings] The first figure is a cross-sectional view of the present invention, but the lens group in the figure is not shown in cross section; the second figure is a perspective view of the frontal mirror of the present invention; The top view of the invention and the lens holder; the fourth figure is a schematic cross-sectional view of the invention when fine-tuning. 7 201035671 [Description of main components] 1 circuit board 2 lens holder 21 lens unit 22 fixing parts 24 ring wall 25 fine adjustment parts 3 support unit ❹ 31 carrier '310 bearing groove' 311 screw hole 32 support plate 33 fixing object 4 probe

88

Claims (1)

201035671 七、申請專利範圍: 1. -種探物m裝置之鏡頭__,包含有電職、鏡頭座、 支擇單元、以及複數探針,該切單朗㈣概騎與前述電 路板的位置,並使複數探針與電路板相電性連接,其特微在於: =鏡頭座處具有至少為-之鏡設置其上,該鏡頭座上處具有 複數個固定件,而周圍環壁處則具有複數個微調件;以及 ο 財料元糾财-承健,該承健祕_綱座設置於 此,虽該鏡驢的微調件被調整時能卿於承健_壁,使整 ^頭座驗置偏移,而顧定件則能在微觸作完成後將鏡頭 座鎖固於與承载座處。 2. 構如申^專概_1顧叙探針切辦置线頭微調機 構2中該微調件為螺絲,該微調件為可拆卸式’能在微調動作 元成後及且鏡頭座位置綱後即拆 〇 3. :=_第1項所述之探針式測試裳置之鏡頭微調機 、顧疋件為固定螺絲’而該承載座的相對位置也具有相 目的螺4孔’朗餅能將鏡職細於與承載座處。 4_:=利範圍第1項所述之探針式測試裝置之鏡頭微調機 祕、/魏微辦是採水平方向分佈於該賴各個不同方向 的牆壁處。 糊範目帛1賴狀料力職健域職調機 ”該贿_定件是以垂直方向設置於鏡職處,位置平 ^刀配合於接近圓周邊緣處。 9 201035671 6.如申料利棚第丨_述之__試裝置 構,其令該鏡頭座處具有數螺紋孔,該螺紋孔能提供該鏡2 置於此,並使鏡馳能進行_的_。 " 7.如申請專利範圍第1項 厅4之奴針式測試裝置之鏡頭微調機 成有—承載槽,該承載獅狀是配合該鏡 丄 但尺寸較大,該承載槽底部並未_,當光源於電 反上方_時,光線能經鏡頭組聚焦投射於電路板下方的區 Ο 域0201035671 VII. Patent application scope: 1. - The lens of the probe device __, including the electric position, the lens holder, the selection unit, and the plurality of probes, the position of the cutting board and the position of the aforementioned circuit board And electrically connecting the plurality of probes to the circuit board, the special feature is: = the lens holder has at least a mirror disposed thereon, the lens holder has a plurality of fixing members thereon, and the surrounding ring wall is With a plurality of fine-tuning pieces; and ο 财 元 纠 - 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承The seat is offset, and the fixed piece can be used to lock the lens holder to the carrier after the micro-touch is completed. 2. The structure is as follows: 申 专 _1 顾 顾 探针 探针 探针 切 切 切 顾 顾 顾 置 置 置 置 置 置 置 置 置 置 置 置 置 置 置 置 置 置 置 置 置 置 置 置 置 置 置 置 置 置 置 置 置 置After the disassembly : 3. := _ The probe type test described in the first item of the lens fine-tuning machine, the 疋 疋 is the fixing screw 'and the relative position of the carrier also has a purpose of the screw 4 hole 'Long cake Can be fine-grained with the carrier. 4_:=The lens fine-tuning machine of the probe type test device described in item 1 of the profit range, /Weiwei Office is distributed in the horizontal direction in the wall of the different directions. The paste is the target of the job. The bribe _ set is placed in the vertical position in the mirror position, and the position is flat and the knife is close to the edge of the circumference. 9 201035671 6. The shed _ _ _ _ _ test device structure, which has a number of threaded holes in the lens holder, the threaded hole can provide the mirror 2 placed here, and enable the lens to perform _ _. " 7. The lens fine-tuning machine of the slave-type test device of the first application hall of the first application hall has a bearing groove, and the bearing lion is matched with the mirror but has a large size, and the bottom of the bearing groove is not _, when the light source is powered When the _ is above _, the light can be focused by the lens group and projected on the area below the board. 1010
TW98109779A 2009-03-25 2009-03-25 The lens trimming mechanism of the probe test device TWI390335B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98109779A TWI390335B (en) 2009-03-25 2009-03-25 The lens trimming mechanism of the probe test device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW98109779A TWI390335B (en) 2009-03-25 2009-03-25 The lens trimming mechanism of the probe test device

Publications (2)

Publication Number Publication Date
TW201035671A true TW201035671A (en) 2010-10-01
TWI390335B TWI390335B (en) 2013-03-21

Family

ID=44855942

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98109779A TWI390335B (en) 2009-03-25 2009-03-25 The lens trimming mechanism of the probe test device

Country Status (1)

Country Link
TW (1) TWI390335B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI448805B (en) * 2011-03-29 2014-08-11 Casio Computer Co Ltd Light source device, projector, and method of assembling light source device
CN104101480A (en) * 2013-04-03 2014-10-15 京元电子股份有限公司 Array type optical detection module

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI448805B (en) * 2011-03-29 2014-08-11 Casio Computer Co Ltd Light source device, projector, and method of assembling light source device
US8801198B2 (en) 2011-03-29 2014-08-12 Casio Computer Co., Ltd. Light source device, projector, and method of assembling light source device
CN104101480A (en) * 2013-04-03 2014-10-15 京元电子股份有限公司 Array type optical detection module
CN104101480B (en) * 2013-04-03 2017-03-01 京元电子股份有限公司 Array type optical detection module

Also Published As

Publication number Publication date
TWI390335B (en) 2013-03-21

Similar Documents

Publication Publication Date Title
TWI259266B (en) Appearance inspecting apparatus and appearance inspecting method
US11143598B2 (en) Defect inspection apparatus and defect inspection method
CN106405787B (en) Angle adjusting device for reflector optical element
KR102597427B1 (en) Systems and methods for focusing charged particle beams
EP2177870B1 (en) Optical wave interference measuring apparatus
TWI397669B (en) Three-dimensional shape measuring apparatus
TW200905422A (en) Exposure device, exposure method and production method for a display panel substrate
TW201035671A (en) Lens fine-tuning mechanism of probe type test device
Dunn et al. Metrology for characterization of wafer thickness uniformity during 3DS-IC processing
CN108227113A (en) For the adjustment of mirror optics element angle and the device and method of aberration compensation
JP5973756B2 (en) Focus position changing device and confocal optical device using the same
Vannoni et al. Characterization of a piezo bendable X-ray mirror
US20210382259A1 (en) Positioning system for components of optical systems
JP5646533B2 (en) Substrate support apparatus comprising a Z stage having a dynamically driven stage mirror and chuck assembly
CN219738910U (en) Wafer bonding detection device
JP4435730B2 (en) Board inspection equipment
Walecki et al. Fast in-line surface topography metrology enabling stress calculation for solar cell manufacturing for throughput in excess of 2000 wafers per hour
CN108613691B (en) Backlight imaging method and device for separated reflective element
CN104034284A (en) Polishing rubber disc face shape detection device for large annular polishing machine
JP2012068188A (en) Adjustment method
TW201017179A (en) Probe testing device for use in testing image sensor chip
EP2876450A1 (en) Scanning probe microscope
CN105779267A (en) Optical system used for gene sequencer
Schmidt et al. Latest achievements of the MCAO testbed for the GREGOR Solar Telescope
TWI379369B (en)