201017179 九、發明說明： 【發明所屬之技術領域】 本發明係與探針卡錢，_是指—麵於職影縣測晶片 之探針測試裝置。 【先前技術】 -般測試半導體晶片之探針卡，衫是作為測試機台與半導 體晶片之_連接物件，由職機台提供龍使铸體晶片產生 相對電性訊號而進行測試。但是若為影像感測晶片（例如CCD或 ⑽)的測試’ _將職光__雜勤彳^之光學感應 ^，晶㈣受规之聰會產生紐變化，並產生紐訊號至所 連接的探針卡及測試機台處。由於與習用一般探針卡的要求不 同’於是就有人設計了專·影像❹i⑸之探針卡。 此類用於影像感·片之探針卡，主要觀之處是在電路板 使㈣部的光魏騎至㈣，並提供制之影 j測晶片所需之光線。目前外部光線賴射方式，是直接提供 、:具有特殊的結構，當光 ==光線是呈似平行光照射，大部份光線除了會經預先設定 路住由電路板之開口處進入，到達電路板下方的測試區，伸乃有201017179 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a probe card, and the _ refers to a probe test device for a wafer of a film in the Shiying County. [Prior Art] A probe card for a semiconductor wafer is generally tested. The shirt is used as a connection object between the test machine and the semiconductor wafer, and the machine provides a test for generating a relative electrical signal from the cast wafer. However, if the image sensing chip (such as CCD or (10)) test ' _ _ _ _ _ _ _ _ _ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ Probe card and test machine. Because of the different requirements from the conventional probe card, the probe card of the special image ❹i(5) was designed. This type of probe card for image sensing and film is mainly used to make the light of (4) part of the board ride to (4), and provide the light required for the film. At present, the external light ray-off method is directly provided: it has a special structure. When the light == the light is illuminated by parallel light, most of the light will enter the opening of the circuit board through the preset path to reach the circuit. In the test area below the board, there is a stretch
It線瓣编絲自__，侧縣正常路徑 的先線’形成干涉縣，影_測試結果。 5 201017179 【發明内容】 _ ίΓ狄主要目的是提供—種具有鏡頭組且能用於測試影像 :傻二t探針測試裝置’主要是將鏡頭組設計的位置採最接近 二'1阳片的方式，使得光線能夠由鏡歡作有效的處理與聚 焦’讓投射於影像感測晶片的光線最符合測試條件，且一次能進 行複數個晶片_試，具有谢級率提昇及職品_定等雙重 功效。 〇 本㈣之轉目狀提供—種具有練_之_則試裝 :置主要疋於電路板的上方另具有-霧面濾鏡，該霧面遽鏡能使 ; 絲猶驗射照騎板下紅麵域，魏頭組的聚 焦投射效果更好，藉此提昇整體測試的品質。 本發明之再-目的是提供—種驗峨影佩測晶片之探針 測試裝置’該探針測試裝置内部所使用之探針可為彈菁式探針 (spring prQbe)或垂直式可撓曲探針(Vertical以地呢pr〇be) ® 等’藉此形成一種創新的垂直式探針卡。 為達成上述目的’本發明主要是由—電路板、至少為—之固 疋杈組、複數探針、以及至少為一之鏡頭組所構成。該固定模組 結合於該電路板的下面位置。該複數探針被該固定模組固定於該 電路板下方，並與電路板相電性連接，每一視窗與其附近的複數 探針構成一獨立的測試區。另外每一個鏡頭組則被該固定模組固 疋於相對應之視窗下方’藉此形成本發明之探針測試裝置。 6 201017179 【實施方式】 兹配合下狀_朗本發明之詳崎構及其連結關係，俾 使熟習該項技術領域者在研讀本說明書後能據以實施。 請參閱第-圖所示’係為本發明之結構剖面示意圖。本發明 探針測試裝置A主要包含有一電路板i、至少為之一固定模組2、 複數探針3、以及至少為一之鏡頭組4(該鏡頭組並未以剖面表 示）。該電路板1上下表面皆具有相關線路，並具有至少為一個的 響視窗11，職窗U並貫穿電路板本身。朗定歡2結合於電路 :板1下面’並將複數探針3及鏡職4固定於該電路板丨下方位 ：置。該複數探針3是分佈於鄰近視窗11周圍的下方區域，頂部是 與電雜1相紐連接，底觀伸至朗定模組2下方。該鏡頭 組4是被m定於該視窗u的正下方位置。當光源由電路板i上方 …、射夺先線路#僅能經由視窗Η、鏡頭組2聚焦後投射下方的 測試區’其餘路徑的光線皆被該固定模組2所阻絶。如此能避免 ❿光朗干涉（擾），使得f彡制晶;i獲得最佳侧試光線，提昇晶 片的測試品質。 »亥探針3的種類則依設計者的需求而定。在本實施例中，該 抓針3為彈簧式探針(spring probe)，並採垂直式方式設置。 並不以此為限’例如該探針也可為垂直式可撓曲探針⑽七⑶上 Bending Probe)或懸臂式探針卿⑹等。 7 201017179 該固定模組2主要目的是將探針3與鏡頭組4固定於 下方的適當位置。該固定模組2可由許多獨 另外隨著所使聰針3義的㈣， ^方絲達成， 之不π 口疋拉組2的結構也會隨 =;呈僅就使用彈菁式探針的固定模組2作說明。該固It line chords from __, the first line of the normal path of the side county formed the interference county, shadow _ test results. 5 201017179 [Summary] _ Γ Γ Γ 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要In this way, the light can be effectively processed and focused by the mirror. 'The light that is projected onto the image sensing chip is the most suitable for the test condition, and the plurality of wafers can be tested at one time, with the improvement of the rate of recognition and the rating of the product. Double effect. 〇本(4) 转目目—The type with training _ _ test installation: set mainly on the top of the circuit board with a - matte filter, the matte Mirror can make; Under the red face, the Weitou group has a better focus projection effect, thereby improving the quality of the overall test. A further object of the present invention is to provide a probe test device for detecting a wafer. The probe used inside the probe test device can be a spring prQbe or a vertical flexible device. The probe (Vertical is pr〇be) ® etc. to form an innovative vertical probe card. To achieve the above object, the present invention is mainly composed of a circuit board, at least a solid group, a plurality of probes, and at least one lens group. The fixed module is coupled to the lower position of the circuit board. The plurality of probes are fixed under the circuit board by the fixing module and electrically connected to the circuit board, and each of the windows forms a separate test area with the plurality of probes in the vicinity thereof. In addition, each lens group is fixed under the corresponding window by the fixing module, thereby forming the probe testing device of the present invention. 6 201017179 [Embodiment] It is understood that the detailed description of the invention and the connection relationship of the invention will be implemented by those skilled in the art after studying this specification. Please refer to the figure in the figure, which is a schematic cross-sectional view of the structure of the present invention. The probe testing device A of the present invention mainly comprises a circuit board i, at least one of the fixed modules 2, the plurality of probes 3, and at least one lens group 4 (the lens group is not shown in cross section). The upper and lower surfaces of the circuit board 1 have associated lines and have at least one ringing window 11, a window U and a circuit board itself. Langdinghua 2 is combined with the circuit: below the board 1 and the plurality of probes 3 and mirrors 4 are fixed to the lower side of the board: The plurality of probes 3 are distributed in a lower area around the window 11, and the top is connected to the electrical hybrid 1 and extends underneath to the Langding module 2. The lens group 4 is positioned at a position directly below the window u. When the light source is above the circuit board i, the first line can only be projected through the window Η and the lens group 2, and the light of the remaining test area is blocked by the fixed module 2. In this way, it is possible to avoid the interference (disturbance) of the light, so that f彡 crystallizes; i obtains the best side test light, and improves the test quality of the wafer. »The type of the Hai probe 3 depends on the designer's needs. In this embodiment, the catching needle 3 is a spring probe and is disposed in a vertical manner. It is not limited thereto. For example, the probe may be a vertical flexible probe (10), a Bending Probe (7), or a cantilever probe (6). 7 201017179 The main purpose of this fixed module 2 is to fix the probe 3 and the lens unit 4 in the appropriate position below. The fixing module 2 can be realized by a plurality of (4), ^ square wires, which are also defined by the Congzheng 3, and the structure of the non-π porting group 2 is also followed by =; The fixed module 2 is explained. The solid
^模、、且2呈-環狀，在本實施例中為似四方形中空的環形。今固 疋模組2則是由—第—固餅2卜—第二狀件以、以及一第二 固疋件23所構成，前述三構件採堆疊方式結合在1，並使 =式卿綱於娜板i的下梅。該探針3頂部是 二 =定件21與電路板1相電性連接，而_底部由第三 物蝴㈣麵。該鏡頭組 微^22處，例如採螺紋螺接或左、右可 微調方式，物概紐射偷嫌2之第二 ^牛22與鏡頭組4並遮_ 11下方的區域，使綱能由 鏡頭組4中心的透鏡通過。 如第二圖所示，為本發明之第二種實施例的剖面示意圖。在 2例中，主要是於電路板丨的上面具有至少為—之霧面親5。 〜務面雜5位置是對應電路板〗上的視窗u所在處目的使光 線更為均勻地向下照射。 在本發_實施例之中，僅於電路板丨處晝出一視窗丨卜如第 201017179 三圖所示’縣剌第三種餘侧。事實上魏雜u上則能 形成數個視窗11，此時配合賴數探針取、須分成預定數目的數 組’每組對應著-個視窗u，而該鏡頭組的數目也必須與該視窗 11數目相同。_定模組則可由大面積的單-組制時固定著複 2探針及複數鏡驰。或是由複數個小__定模組個別固定 著相對數目的探針及一鏡頭組對應於單—視窗u。 籲 請參閱第四圖所示，係為本發明探針測試裝置用於測試影像 :感測晶片之較佳實施姻。該電路板1上方具有-燈具，提供測 ：試時所須之光線，該探針測試褒置A下方則具有-影像感測晶片 6。該探針3底侧與影像制晶片6的線路相接觸1光線由電 路板1上方照射時’规触霧面濾鏡5處理形成均勻光之後 經由電路板1之視窗U進入固定模組2處之鏡頭組4聚焦該鏡 頭組4會使聚焦之光線投射到影像感測晶片6的光學感應區内， ❹該影像感測晶片6因受光線之照射而產生電性變化，提供電性訊 號予探針3、電路板i、最後至測試勤，由測試機台進行相關的 測試及資料處理。 綜合以上所述’本創作之用於測試影像感測晶片之探針測試 裝置，是將鏡頭組設置於電路板的下方位置，以最接近測試區的 方式，讓光線經鏡頭組聚焦後投射於最佳的區域。而該視窗數目 201017179 也能增加如_式分触細軸數目的鏡頭組， 影像感測晶片的測試工作，讓測試效率提昇 進行複數個 如此本發明能提供 最佳的賴光線及健的測試效率，符合專利之_請要件 惟以上所述者，僅縣㈣之錄實施細已，當不能 限定本發明實施之範圍，即大凡依本發明申請專利範圍所作 等變化與修飾，皆應仍屬於本發明專利涵蓋之範_。 ' Φ 【圖式簡單說明】 ^第一圖係為本發明之第一種實施例的結構剖面示意圖； 第二圖係為本發明之第二種實施例的結構剖面示意圖； 第二圖係為本發明之第三種實施例之電路板的俯視圖； 第四圖係為本發明第二實施例用於測試影像感測晶片之較佳實施 例圖。 弟五圖係為本發明之第四種實施例的結構剖面示意圖； 參 【主要元件符號說明】 A 探針測試裝置 1 電路板 1A 電路板 Π 視窗 2 固定模組 21 第一固定件 22 第二固定件 201017179 23 第三固定件 3 探針 4 鏡頭組 5 霧面濾鏡 6 影像感測晶片The mold, and 2 is a ring-shaped, and in this embodiment, is a square-shaped hollow ring. The present solid-state module 2 is composed of a first-solid cake 2 - a second-shaped member and a second solid member 23, and the aforementioned three members are combined in a stacking manner, and Yu Na board i's next plum. The top of the probe 3 is two = the stator 21 is electrically connected to the circuit board 1, and the bottom of the _ is the third object (four) face. The lens group is 22, for example, threaded screw or left and right can be fine-tuned, and the object is sneaked into the second area of the 2nd 22 and the lens group 4 and the area below the _11, so that the outline can be The lens of the center of the lens group 4 passes. As shown in the second figure, it is a schematic cross-sectional view of a second embodiment of the present invention. In 2 cases, mainly on the top of the circuit board, there is at least a matte side. The position of the service face 5 is the purpose of the window u on the corresponding board, so that the light is more uniformly radiated downward. In the present embodiment, only a window is displayed on the board, and the third side of the county is shown in the third figure of 201017179. In fact, Wei Wei can form several windows 11 at this time. In this case, the number of probes must be divided into a predetermined number of arrays. Each group corresponds to a window u, and the number of the lens groups must also be related to the window. 11 is the same number. The _set module can be fixed with a complex 2 probe and a plurality of mirrors in a large area single-group system. Or a plurality of small __ fixed modules are individually fixed with a relative number of probes and a lens group corresponding to a single-window u. Referring to the fourth figure, it is the probe test device of the present invention for testing images: a preferred implementation of the sensing chip. Above the circuit board 1, there is a luminaire, which provides the light required for the test, and the probe test device A has an image sensing wafer 6. The bottom side of the probe 3 is in contact with the line of the image forming wafer 6. When the light is irradiated by the upper surface of the circuit board 1 , the surface of the probe 3 is processed to form uniform light, and then enters the fixed module 2 via the window U of the circuit board 1 . The lens group 4 focuses the lens group 4 to project the focused light into the optical sensing area of the image sensing chip 6, and the image sensing chip 6 is electrically changed by the illumination of the light to provide an electrical signal. Probe 3, circuit board i, and finally to the test, the test machine and related data processing. In combination with the above-mentioned probe test device for testing an image sensing chip, the lens group is disposed at a lower position of the circuit board, and the light is focused by the lens group and projected onto the lower side of the test area. The best area. The number of windows 201017179 can also increase the number of lens groups such as the number of fine-contact axes, and the test work of the image sensing chip, so that the test efficiency can be improved by a plurality of times. The present invention can provide the best light and healthy test efficiency. In accordance with the above-mentioned requirements, only the above-mentioned (4) records have been implemented, and the scope of the invention is not limited, that is, the changes and modifications made by the applicant in accordance with the scope of the patent application of the present invention should still belong to this The invention patent covers the scope of _. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic cross-sectional view of a first embodiment of the present invention; the second figure is a schematic cross-sectional view of a second embodiment of the present invention; A plan view of a circuit board of a third embodiment of the present invention; and a fourth embodiment of the present invention is a second embodiment of the present invention for testing an image sensing chip. The fifth diagram is a schematic cross-sectional view of the structure of the fourth embodiment of the present invention; the reference [main component symbol description] A probe test device 1 circuit board 1A circuit board 视窗 window 2 fixed module 21 first fixing member 22 second Fixings 201017179 23 Third Fixing 3 Probe 4 Lens Set 5 Matte Filter 6 Image Sensing Wafer