TW201018340A - Method for improving yield of solder bumps - Google Patents

Method for improving yield of solder bumps Download PDF

Info

Publication number
TW201018340A
TW201018340A TW97141752A TW97141752A TW201018340A TW 201018340 A TW201018340 A TW 201018340A TW 97141752 A TW97141752 A TW 97141752A TW 97141752 A TW97141752 A TW 97141752A TW 201018340 A TW201018340 A TW 201018340A
Authority
TW
Taiwan
Prior art keywords
solder ball
yield
solder
tin
electrical contact
Prior art date
Application number
TW97141752A
Other languages
English (en)
Chinese (zh)
Inventor
Shing-Fun Ho
Shih-Tsung Lin
Original Assignee
Nan Ya Printed Circuit Board
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nan Ya Printed Circuit Board filed Critical Nan Ya Printed Circuit Board
Priority to TW97141752A priority Critical patent/TW201018340A/zh
Priority to JP2009162627A priority patent/JP5128552B2/ja
Publication of TW201018340A publication Critical patent/TW201018340A/zh

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Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW97141752A 2008-10-30 2008-10-30 Method for improving yield of solder bumps TW201018340A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW97141752A TW201018340A (en) 2008-10-30 2008-10-30 Method for improving yield of solder bumps
JP2009162627A JP5128552B2 (ja) 2008-10-30 2009-07-09 はんだバンプの歩留まり改善方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97141752A TW201018340A (en) 2008-10-30 2008-10-30 Method for improving yield of solder bumps

Publications (1)

Publication Number Publication Date
TW201018340A true TW201018340A (en) 2010-05-01

Family

ID=42298430

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97141752A TW201018340A (en) 2008-10-30 2008-10-30 Method for improving yield of solder bumps

Country Status (2)

Country Link
JP (1) JP5128552B2 (ja)
TW (1) TW201018340A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112916976A (zh) * 2021-01-21 2021-06-08 杭州海康微影传感科技有限公司 预成型焊料的转移方法以及预成型焊料的转移系统
TWI772011B (zh) * 2021-05-04 2022-07-21 特豪科技股份有限公司 真空式回焊方法及裝置
CN115255538A (zh) * 2021-04-30 2022-11-01 特豪科技股份有限公司 真空式回焊方法及装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60211892A (ja) * 1984-04-05 1985-10-24 関西日本電気株式会社 Ｉｃの固着方法
JPH05191035A (ja) * 1991-12-09 1993-07-30 Hitachi Ltd 半田ブリッジ除去方法とその装置並びに半田除去用櫛状金属板
JP3661444B2 (ja) * 1998-10-28 2005-06-15 株式会社ルネサステクノロジ 半導体装置、半導体ウエハ、半導体モジュールおよび半導体装置の製造方法
JP2001068829A (ja) * 1999-06-21 2001-03-16 Fine Device:Kk プリント配線板の短絡部分の切断方法及び装置
JP2002026500A (ja) * 2000-07-05 2002-01-25 Ngk Spark Plug Co Ltd 配線基板
JP4334128B2 (ja) * 2000-10-27 2009-09-30 パナソニック株式会社 半導体実装方法および半導体実装装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112916976A (zh) * 2021-01-21 2021-06-08 杭州海康微影传感科技有限公司 预成型焊料的转移方法以及预成型焊料的转移系统
CN115255538A (zh) * 2021-04-30 2022-11-01 特豪科技股份有限公司 真空式回焊方法及装置
TWI772011B (zh) * 2021-05-04 2022-07-21 特豪科技股份有限公司 真空式回焊方法及裝置

Also Published As

Publication number Publication date
JP2010109325A (ja) 2010-05-13
JP5128552B2 (ja) 2013-01-23

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