TW201013996A - Light-emitting diode housing comprising fluoropolymer - Google Patents

Light-emitting diode housing comprising fluoropolymer Download PDF

Info

Publication number
TW201013996A
TW201013996A TW098126972A TW98126972A TW201013996A TW 201013996 A TW201013996 A TW 201013996A TW 098126972 A TW098126972 A TW 098126972A TW 98126972 A TW98126972 A TW 98126972A TW 201013996 A TW201013996 A TW 201013996A
Authority
TW
Taiwan
Prior art keywords
light
fluoropolymer
emitting diode
housing
led
Prior art date
Application number
TW098126972A
Other languages
English (en)
Chinese (zh)
Inventor
Jacob Lahijani
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of TW201013996A publication Critical patent/TW201013996A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
TW098126972A 2008-08-11 2009-08-11 Light-emitting diode housing comprising fluoropolymer TW201013996A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US8781508P 2008-08-11 2008-08-11
US16177809P 2009-03-20 2009-03-20

Publications (1)

Publication Number Publication Date
TW201013996A true TW201013996A (en) 2010-04-01

Family

ID=41652066

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098126972A TW201013996A (en) 2008-08-11 2009-08-11 Light-emitting diode housing comprising fluoropolymer

Country Status (7)

Country Link
US (2) US20100032702A1 (cg-RX-API-DMAC10.html)
EP (1) EP2311105A2 (cg-RX-API-DMAC10.html)
JP (1) JP2011530834A (cg-RX-API-DMAC10.html)
KR (1) KR20110044894A (cg-RX-API-DMAC10.html)
CN (1) CN102119452A (cg-RX-API-DMAC10.html)
TW (1) TW201013996A (cg-RX-API-DMAC10.html)
WO (1) WO2010019459A2 (cg-RX-API-DMAC10.html)

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TWI509838B (zh) 2010-04-14 2015-11-21 黃邦明 具氟化聚合物之表面塗層的發光二極體外殼及其發光二極體結構
CN102222751A (zh) * 2010-04-15 2011-10-19 黄邦明 用以承载发光二极管晶片的外壳及其发光二极管结构
US8340941B2 (en) * 2010-06-04 2012-12-25 Tyco Electronics Corporation Temperature measurement system for a light emitting diode (LED) assembly
ITMI20101250A1 (it) * 2010-07-07 2012-01-08 Getters Spa Miglioramenti per fosfori
US8723201B2 (en) * 2010-08-20 2014-05-13 Invenlux Corporation Light-emitting devices with substrate coated with optically denser material
DE102010051959A1 (de) 2010-11-19 2012-05-24 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement
US9807897B2 (en) * 2011-03-07 2017-10-31 Schott Ag Glass system for hermetically joining Cu components, and housing for electronic components
US9453119B2 (en) 2011-04-14 2016-09-27 Ticona Llc Polymer composition for producing articles with light reflective properties
US8480254B2 (en) * 2011-04-14 2013-07-09 Ticona, Llc Molded reflective structures for light-emitting diodes
US9284448B2 (en) 2011-04-14 2016-03-15 Ticona Llc Molded reflectors for light-emitting diode assemblies
JP2012244058A (ja) * 2011-05-23 2012-12-10 Du Pont Mitsui Fluorochem Co Ltd 発光ダイオード用リフレクター及びハウジング
TWI474967B (zh) * 2011-07-14 2015-03-01 Getters Spa 有關磷光體之改良
WO2013025832A1 (en) 2011-08-16 2013-02-21 E. I. Du Pont De Nemours And Company Reflector for light-emitting diode and housing
JP5923183B2 (ja) 2011-12-30 2016-05-24 ティコナ・エルエルシー 発光デバイス用の反射板
EP2620471B1 (en) 2012-01-27 2021-03-10 3M Innovative Properties Company Polytetrafluoroethene compound with microspheres and fibers
WO2014099745A1 (en) 2012-12-18 2014-06-26 Ticona Llc Molded reflectors for light-emitting diode assemblies
US20150009674A1 (en) * 2013-07-03 2015-01-08 GE Lighting Solutions, LLC Structures subjected to thermal energy and thermal management methods therefor
CN104556977A (zh) * 2014-12-16 2015-04-29 广东华辉煌光电科技有限公司 一种led陶瓷封装材料
US10423249B2 (en) * 2014-12-29 2019-09-24 Lenovo (Beijing) Co., Ltd. Information processing method and electronic device
TWM509438U (zh) * 2015-04-24 2015-09-21 Unity Opto Technology Co Ltd 發光二極體支架
JP6033361B2 (ja) * 2015-05-07 2016-11-30 三井・デュポンフロロケミカル株式会社 成形品
US11427662B2 (en) 2016-03-04 2022-08-30 Solvay Specialty Polymers Italy S.P.A. Fluoropolymer composition for components of light emitting apparatuses
CN106768463B (zh) * 2016-12-21 2019-08-09 广东工业大学 一种基于相变材料的发光二极管温度报警器
KR20250036969A (ko) 2017-04-26 2025-03-14 오티아이 루미오닉스 인크. 표면의 코팅을 패턴화하는 방법 및 패턴화된 코팅을 포함하는 장치
CN108231973B (zh) * 2017-12-08 2019-08-27 开发晶照明（厦门）有限公司 封装支架
US20210087381A1 (en) * 2018-03-15 2021-03-25 Solvay Specialty Polymers Italy S.P.A. Fluoropolymer composition for components of light emitting apparatus
WO2020225778A1 (en) 2019-05-08 2020-11-12 Oti Lumionics Inc. Materials for forming a nucleation-inhibiting coating and devices incorporating same
KR20220009994A (ko) * 2019-05-16 2022-01-25 스미또모 가가꾸 가부시키가이샤 전자 부품의 제조 방법 및 전자 부품
US12672476B2 (en) 2020-10-29 2026-06-30 Oti Lumionics Inc. Opto-electronic device with nanoparticle deposited layers
KR20250139404A (ko) 2020-12-07 2025-09-23 오티아이 루미오닉스 인크. 핵 생성 억제 코팅 및 하부 금속 코팅을 사용한 전도성 증착 층의 패턴화
GB2622828A (en) * 2022-09-29 2024-04-03 Fotolec Tech Limited A Diffusion Coating for a Lighting Unit

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI553913B (zh) * 2011-04-14 2016-10-11 堤康那責任有限公司 用於發光二極體組件之含白色顏料的反射器

Also Published As

Publication number Publication date
EP2311105A2 (en) 2011-04-20
JP2011530834A (ja) 2011-12-22
WO2010019459A2 (en) 2010-02-18
KR20110044894A (ko) 2011-05-02
US20130026526A1 (en) 2013-01-31
WO2010019459A3 (en) 2010-04-22
US20100032702A1 (en) 2010-02-11
CN102119452A (zh) 2011-07-06

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