KR20110044894A - 플루오로중합체를 포함하는 발광 다이오드 하우징 - Google Patents

플루오로중합체를 포함하는 발광 다이오드 하우징 Download PDF

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Publication number
KR20110044894A
KR20110044894A KR1020117005627A KR20117005627A KR20110044894A KR 20110044894 A KR20110044894 A KR 20110044894A KR 1020117005627 A KR1020117005627 A KR 1020117005627A KR 20117005627 A KR20117005627 A KR 20117005627A KR 20110044894 A KR20110044894 A KR 20110044894A
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KR
South Korea
Prior art keywords
light emitting
emitting diode
fluoropolymer
housing
diode housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020117005627A
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English (en)
Korean (ko)
Inventor
제이콥 라히자니
Original Assignee
이 아이 듀폰 디 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이 아이 듀폰 디 네모아 앤드 캄파니 filed Critical 이 아이 듀폰 디 네모아 앤드 캄파니
Publication of KR20110044894A publication Critical patent/KR20110044894A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
KR1020117005627A 2008-08-11 2009-08-07 플루오로중합체를 포함하는 발광 다이오드 하우징 Withdrawn KR20110044894A (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US8781508P 2008-08-11 2008-08-11
US61/087,815 2008-08-11
US61/120,658 2008-12-08
US16177809P 2009-03-20 2009-03-20
US61/161,778 2009-03-20
PCT/US2009/053089 WO2010019459A2 (en) 2008-08-11 2009-08-07 Light-emitting diode housing comprising fluoropolymer

Publications (1)

Publication Number Publication Date
KR20110044894A true KR20110044894A (ko) 2011-05-02

Family

ID=41652066

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117005627A Withdrawn KR20110044894A (ko) 2008-08-11 2009-08-07 플루오로중합체를 포함하는 발광 다이오드 하우징

Country Status (7)

Country Link
US (2) US20100032702A1 (cg-RX-API-DMAC10.html)
EP (1) EP2311105A2 (cg-RX-API-DMAC10.html)
JP (1) JP2011530834A (cg-RX-API-DMAC10.html)
KR (1) KR20110044894A (cg-RX-API-DMAC10.html)
CN (1) CN102119452A (cg-RX-API-DMAC10.html)
TW (1) TW201013996A (cg-RX-API-DMAC10.html)
WO (1) WO2010019459A2 (cg-RX-API-DMAC10.html)

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TWI509838B (zh) 2010-04-14 2015-11-21 黃邦明 具氟化聚合物之表面塗層的發光二極體外殼及其發光二極體結構
CN102222751A (zh) * 2010-04-15 2011-10-19 黄邦明 用以承载发光二极管晶片的外壳及其发光二极管结构
US8340941B2 (en) * 2010-06-04 2012-12-25 Tyco Electronics Corporation Temperature measurement system for a light emitting diode (LED) assembly
ITMI20101250A1 (it) * 2010-07-07 2012-01-08 Getters Spa Miglioramenti per fosfori
US8723201B2 (en) * 2010-08-20 2014-05-13 Invenlux Corporation Light-emitting devices with substrate coated with optically denser material
DE102010051959A1 (de) 2010-11-19 2012-05-24 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement
US9807897B2 (en) * 2011-03-07 2017-10-31 Schott Ag Glass system for hermetically joining Cu components, and housing for electronic components
US9062198B2 (en) * 2011-04-14 2015-06-23 Ticona Llc Reflectors for light-emitting diode assemblies containing a white pigment
US9453119B2 (en) 2011-04-14 2016-09-27 Ticona Llc Polymer composition for producing articles with light reflective properties
US8480254B2 (en) * 2011-04-14 2013-07-09 Ticona, Llc Molded reflective structures for light-emitting diodes
US9284448B2 (en) 2011-04-14 2016-03-15 Ticona Llc Molded reflectors for light-emitting diode assemblies
JP2012244058A (ja) * 2011-05-23 2012-12-10 Du Pont Mitsui Fluorochem Co Ltd 発光ダイオード用リフレクター及びハウジング
TWI474967B (zh) * 2011-07-14 2015-03-01 Getters Spa 有關磷光體之改良
WO2013025832A1 (en) 2011-08-16 2013-02-21 E. I. Du Pont De Nemours And Company Reflector for light-emitting diode and housing
JP5923183B2 (ja) 2011-12-30 2016-05-24 ティコナ・エルエルシー 発光デバイス用の反射板
EP2620471B1 (en) 2012-01-27 2021-03-10 3M Innovative Properties Company Polytetrafluoroethene compound with microspheres and fibers
WO2014099745A1 (en) 2012-12-18 2014-06-26 Ticona Llc Molded reflectors for light-emitting diode assemblies
US20150009674A1 (en) * 2013-07-03 2015-01-08 GE Lighting Solutions, LLC Structures subjected to thermal energy and thermal management methods therefor
CN104556977A (zh) * 2014-12-16 2015-04-29 广东华辉煌光电科技有限公司 一种led陶瓷封装材料
US10423249B2 (en) * 2014-12-29 2019-09-24 Lenovo (Beijing) Co., Ltd. Information processing method and electronic device
TWM509438U (zh) * 2015-04-24 2015-09-21 Unity Opto Technology Co Ltd 發光二極體支架
JP6033361B2 (ja) * 2015-05-07 2016-11-30 三井・デュポンフロロケミカル株式会社 成形品
US11427662B2 (en) 2016-03-04 2022-08-30 Solvay Specialty Polymers Italy S.P.A. Fluoropolymer composition for components of light emitting apparatuses
CN106768463B (zh) * 2016-12-21 2019-08-09 广东工业大学 一种基于相变材料的发光二极管温度报警器
KR20250036969A (ko) 2017-04-26 2025-03-14 오티아이 루미오닉스 인크. 표면의 코팅을 패턴화하는 방법 및 패턴화된 코팅을 포함하는 장치
CN108231973B (zh) * 2017-12-08 2019-08-27 开发晶照明（厦门）有限公司 封装支架
US20210087381A1 (en) * 2018-03-15 2021-03-25 Solvay Specialty Polymers Italy S.P.A. Fluoropolymer composition for components of light emitting apparatus
WO2020225778A1 (en) 2019-05-08 2020-11-12 Oti Lumionics Inc. Materials for forming a nucleation-inhibiting coating and devices incorporating same
KR20220009994A (ko) * 2019-05-16 2022-01-25 스미또모 가가꾸 가부시키가이샤 전자 부품의 제조 방법 및 전자 부품
US12672476B2 (en) 2020-10-29 2026-06-30 Oti Lumionics Inc. Opto-electronic device with nanoparticle deposited layers
KR20250139404A (ko) 2020-12-07 2025-09-23 오티아이 루미오닉스 인크. 핵 생성 억제 코팅 및 하부 금속 코팅을 사용한 전도성 증착 층의 패턴화
GB2622828A (en) * 2022-09-29 2024-04-03 Fotolec Tech Limited A Diffusion Coating for a Lighting Unit

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JP5065888B2 (ja) * 2005-03-24 2012-11-07 京セラ株式会社 発光装置ならびに照明装置
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TW200821632A (en) * 2006-08-23 2008-05-16 Mitsui Chemicals Inc Light reflector and light source having same
TWI302372B (en) * 2006-08-30 2008-10-21 Polytronics Technology Corp Heat dissipation substrate for electronic device
KR100935869B1 (ko) * 2008-04-17 2010-01-07 삼성전기주식회사 열가소성 수지 기판을 이용한 백라이트 유닛

Also Published As

Publication number Publication date
EP2311105A2 (en) 2011-04-20
JP2011530834A (ja) 2011-12-22
WO2010019459A2 (en) 2010-02-18
US20130026526A1 (en) 2013-01-31
WO2010019459A3 (en) 2010-04-22
US20100032702A1 (en) 2010-02-11
TW201013996A (en) 2010-04-01
CN102119452A (zh) 2011-07-06

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Date Code Title Description
PA0105 International application

Patent event date: 20110310

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid